TW201607685A - Apparatus for processing cut part of glass substrate - Google Patents

Abstract

Disclosed herein is an apparatus for processing a cut part of a glass substrate. The apparatus includes a heating member, a heating-member support, and a glass-substrate support. At least one of the heating-member support and the glass-substrate support is provided so as to be movable such that the heating member and the cut part of the glass substrate that is fixed to the glass-substrate support successively come into contact with each other. The heating member includes a two-way contact part or a three-way contact part that comes into contact with the cut part of the glass substrate. The two-way contact part includes contact surfaces that extend in respective directions and connect to each other such that an internal angle therebetween is greater than 10 DEG and less than 180 DEG. The three-way contact part includes a vertical contact surface coming into contact with a vertical surface of the cut part of the glass substrate, and two edge contact surfaces connected to respective opposite ends of the vertical contact surface such that an internal angle between each of the edge contact surfaces and the vertical contact surface is greater than 90 DEG and less than 180 DEG.

Description

Apparatus for processing a cut portion of a glass substrate

The present invention generally relates to an apparatus for processing a cut portion of a glass substrate.

Processing a glass substrate for a flat panel display or the like generally includes: cutting the glass substrate into a desired configuration; and grinding and/or polishing the edge of the cut glass substrate to remove sharp portions of the cut glass substrate.

In the above typical treatment method, since the particles generated when the edge of the glass substrate is treated contaminate the surface of the glass substrate, the operation of cleaning and drying the glass substrate is required. Accordingly, the cost of producing a glass substrate increases. In addition, the particles and debris collected between the strip and the glass substrate during processing can significantly damage the surface of the glass substrate, which may require a series of processing operations to be interrupted for processing.

A method is disclosed in Korean Patent Application No. 2001-0085114, which comprises: using a diamond grinding wheel and dehorning a glass substrate; A nozzle to be mounted to remove a portion of the glass substrate and to blow air to remove power; and to draw compressed air including glass particles.

However, in the case where grinding or chamfering is used to treat the edge of the glass substrate, glass frit is inevitably present. In addition, there are the following problems: edge cracks generated during the grinding process; surface scratches attributable to glass frit or dust; exposure of the operator to the glass frit, and the like.

A method of trimming an edge of a glass substrate into a strip shape by contacting a heating member to a cooling glass substrate and moving the heating member along an edge of the glass substrate is disclosed in Korean Patent Application No. 2012-0002573, as shown in FIG. Shown. This conventional method fundamentally prevents glass frit from appearing at the edge of the treated glass substrate and can therefore be effectively used in this field.

However, in the method of No. 2012-0002573, as shown in Fig. 2, the number of processes required for processing the cut portion of the glass substrate is considerably large, thus increasing the time taken to process the cut portion. Further, as shown in FIG. 3, the strip separated from the cut portion may contact the heating member or the induction coil provided on the heating member and thus may be caught. As a result, chipping is caused and uneven surface is formed.

[Previous Technical Document]

[Patent Document 1]

Korean Patent Application No. 2012-0002573

Accordingly, the present invention has been made in mind the above-mentioned problems occurring in the prior art, and it is an object of the present invention to provide an apparatus for processing a cut portion of a glass substrate, which apparatus can significantly reduce the number of processes required to process a cut portion of a glass substrate, Therefore, the efficiency of processing the cut portion is greatly enhanced, and the apparatus makes it possible to minimize the movement of the glass substrate required for processing the cut portion, thereby significantly reducing the problem of causing damage to the glass substrate while processing the cut portion.

In order to achieve the above object, the present invention provides an apparatus for processing a cut portion of a glass substrate, the apparatus comprising a heating member, a heating member support member, and a glass substrate support member. At least one of the heating member support and the glass substrate support is provided to be movable such that the heating member and the cut portion of the glass substrate fixed to the glass substrate support sequentially contact each other. The heating member includes a bidirectional contact portion or a three-way contact portion that contacts the cut portion of the glass substrate. The bidirectional contact portion includes contact surfaces that extend in respective directions and are coupled to each other such that an internal angle between the contact surfaces is greater than 10° and less than 180°, and the three-way contact portion includes: a vertical contact surface a contact with a vertical surface of the cut portion of the glass substrate; and two edge contact surfaces connected to respective opposite ends of the vertical contact surface such that the edge contact surface and the vertical contact surface The internal angle between each is greater than 90° and less than 180°.

The above and other objects, features and advantages of the present invention will become more apparent from

Figure 1 illustrates a method for trimming the edges of a glass substrate in accordance with conventional techniques.

2 is a flow chart showing a method for processing a cut portion of a glass substrate according to a conventional technique.

Fig. 3 is a view illustrating a problem caused by a strip which is formed when the edge of a glass substrate is trimmed by a device according to a conventional technique.

4 is a view illustrating a contact relationship between a cut portion of a glass substrate; and a heating member having a bidirectional contact portion of the apparatus for processing a cut portion of the glass substrate according to the present invention.

Fig. 5 is a view illustrating a contact relationship between a cutting portion of a glass substrate; and a heating member having a three-way contact portion of the apparatus for processing a cut portion of the glass substrate according to the present invention.

Figure 6 is a view schematically showing a mode in which a strip The tape is separated from the cut portion of the glass substrate when the cut portion is processed by the processing apparatus according to the present invention.

Figure 7 is a plan view schematically showing a method of processing a cut portion of a glass substrate using the processing apparatus according to the present invention.

Figure 8 is a diagram showing an exemplary embodiment of a processing device in accordance with the present invention.

The invention will be described in detail below with reference to the accompanying drawings. In the following description, redundant descriptions and detailed descriptions of known functions and elements that may unnecessarily obscure the subject matter of the present invention are omitted.

The following description and the drawings illustrate exemplary embodiments of the present invention in order to Other embodiments may include other structural or logical modifications. The configuration and function of each component is the same as commonly understood by those of ordinary skill in the art, unless otherwise defined. The order of processing may vary, and components or features of several embodiments may be included in or substituted for other embodiments.

An apparatus for processing a cut portion of a glass substrate according to an exemplary embodiment of the present invention includes a heating member, a heating member support, and a glass substrate support.

At least one of the heating member support and the glass substrate support is provided to be movable such that the heating member and the cut portion of the glass substrate fixed to the glass substrate support can sequentially contact each other.

As shown in FIGS. 4 to 5, the heating member includes a bidirectional contact portion or a three-way contact portion that contacts the cut portion of the glass substrate.

Referring to FIG. 4, the bidirectional contact portion includes two contact surfaces extending in two directions and connected to each other such that an internal angle between the two contact surfaces is greater than 10° and less than 180°, Preferably, the ground is greater than 30° and less than 150°.

Referring to FIG. 5, the three-way contact portion includes: a vertical contact surface that contacts a vertical surface of the cut portion of the glass substrate; and two edge contact surfaces. The two edge contact surfaces are connected to respective opposite ends of the vertical contact surface such that the internal angle between each edge contact surface and the vertical contact surface is greater than 90° and less than 180°, more preferably greater than 105° and less than 165° .

In the three-way contact portion, the vertical width of the vertical contact surface must be equal to or smaller than the thickness of the cut portion of the glass substrate. When the vertical width of the vertical contact surface is equal to the thickness of the cut portion, the edge of the glass substrate can be trimmed by the thermal energy transferred from the edge contact surface, although the edge of the glass substrate does not directly contact the edge contact surface. However, if the surface is in vertical contact If the vertical width is larger than the thickness of the cut portion, the desired shape cannot be formed because the contact surface of the heating member does not contact the edge of the glass substrate.

In the principle used in the method of processing the cut portion of the glass substrate, when the heated heating member contacts the target portion of the glass substrate, the target portion is treated in the manner described so that the temperature difference is caused by the glass substrate The contact portion between the heated heating member and the target portion forms a strip.

In the processing apparatus of the present invention, the entire vertical surface (cut surface) of the cut portion of the glass substrate is sequentially heated by the heating member, and a strip is formed from the entirety of the vertical surface. In this way, the cut portion of the glass substrate is processed. Therefore, the treatment is simple and the cracks and cracks can be reliably removed, whereby the durability of the glass substrate can be remarkably enhanced.

Specifically, as shown in Fig. 6, the strip is separated from the glass substrate in the horizontal direction (slightly downward by gravity). Therefore, unlike the conventional technique, the present invention can prevent the strip from coming into contact with the heating member (in particular, the induction heating wire of the heating member) and thus jamming, or preventing the strip from interfering with the induction heating wire. In addition, the occurrence of chipping can be prevented for the above reasons, whereby a uniform dressing surface can be obtained.

Further, unlike the conventional technique, after the edge of one side of the glass substrate has been processed, before the edge of the other side of the glass substrate is processed, It is necessary to invert the glass substrate. Therefore, the present invention can significantly reduce the problem of causing damage to the glass substrate which is generated while processing the cut portion.

In the processing apparatus according to the present invention, the bidirectional contact portion may have a shape (a hourglass-shaped heating member), wherein the bidirectional contact portion may simultaneously contact the upper and lower edges (or the left and right edges) of the cut portion of the glass substrate , as shown in Figure 4 (a). Alternatively, the bidirectional contact portion may have a shape in which the bidirectional contact portion may simultaneously contact the entirety of the vertical surface of the cutting portion and one edge of the cut portion, as shown in (b) or (c) of FIG.

As shown in FIG. 4 or FIG. 5, the heating member may have a shape of a cylinder or a polygonal prism, such as a triangle, a rectangle or a pentagonal prism, and the bidirectional contact portion or the three-way contact portion may be formed as a concave in a cylinder or a polygonal prism. Into the shape. Alternatively, the heating member may have a shape of a cylinder, a polygonal prism, or the like, and the bidirectional contact portion or the three-way contact portion may be formed in such a manner that the bidirectional contact portion or the three-way contact portion is sequentially recessed into the cylinder or The peripheral surface of the polygonal prism forms a single annular or annular band shape.

In the processing apparatus according to the present invention, the heating member can be heated by means of a device generally used in the art. For example, a resistance heating method, a high frequency induction heating method, or the like can be used.

As shown in FIG. 3, the high frequency induction heating method refers to the heating element A method of placing a center of a coil in which a high frequency current is rapidly heated along the coil by eddy currents caused by electromagnetic induction and by heat loss due to hysteresis of a portion of the high frequency current.

The high frequency induction heating method effectively concentrates energy through the coil to the heating member. Therefore, the temperature of the heating member can be rapidly increased, and it is particularly advantageous for preventing the heating member from being lowered in temperature due to contact with the cooling member. Therefore, in this exemplary embodiment, it is preferred to use a high frequency induction heating method.

In this exemplary embodiment, heating the heating member to a temperature means that the heating member is heated to a Tg or higher of the glass. The Tg of the glass varies from 750 ° C to 1300 ° C depending on the type of glass. In order to satisfactorily trim the cut portion of the glass substrate to be treated, the temperature of the heating member is maintained at 50 ° C or higher than the Tg of the glass, preferably 100 ° C or higher, and more preferably about 200 ° C. Up to about 500 ° C.

The shape of the heating member support is not limited to a specific shape as long as the heating member can be fixed to the heating member support by the compressing member. For example, the heating member support can have a structure that is well known to those skilled in the art.

The glass substrate support functions to hold the glass substrate. Various kinds of support devices known in the art can be used as the glass substrate support. In particular, the glass substrate support may comprise means for cooling the glass substrate. For example, the cooling device can be assembled such that it is provided in the bottom of the glass substrate support A cooling plate having a flow path along which a low temperature refrigerant flows.

In the processing apparatus according to the present invention, the term "cooling" refers to forcibly lowering the temperature of the glass substrate to a temperature lower than the surrounding environment of the glass substrate.

It is possible to cool the entire glass substrate with respect to the cooling operation, and it is also possible to selectively cool only the target portion of the glass substrate. However, in order to ensure stable control, it is preferred to cool the entirety of the glass substrate.

The cooling of the glass substrate can be carried out by placing the glass substrate in a working environment maintained under a low temperature condition for a predetermined period of time. Alternatively, the cooling of the glass substrate can be carried out by contacting the glass substrate with a cooling plate maintained under low temperature conditions. Preferably, the glass substrate is fixed to the cooling plate maintained at a predetermined temperature while the processing operation is being performed, so that the temperature rise of the glass substrate can be prevented during the processing operation.

In the processing apparatus according to the present invention, since the heating member is heated to a temperature of Tg of the glass or higher, the cut portion of the glass substrate can be trimmed in such a manner that even when the temperature of the glass substrate is from 0 ° C to 50 In the range of °C, the strip can still be formed by the temperature difference in the glass substrate. However, it is possible to perform cooling of the glass substrate in order to enhance the effect of trimming the cut portion of the glass substrate in such a manner that a strip is formed.

In the present invention, the glass substrate is cooled to a temperature lower than room temperature (=25 ° C), more preferably cooled to a temperature lower than room temperature 10 ° C, so that the glass substrate to which the heating unit is contacted can be trimmed without Produces dust. In this exemplary embodiment, the temperature of the glass substrate is preferably less than 10 °C. More preferably, the temperature of the glass substrate is in the range from 0 ° C to 10 ° C in order to prevent excessive consumption of energy for cooling.

When the temperature of the glass substrate rises, the amount of glass removed from the edge of the glass substrate per unit length increases. In this case, it becomes difficult to precisely trim the edge of the glass substrate. If the temperature of the glass substrate is excessively lowered, the energy consumption is excessively increased, and it becomes difficult to control the process of trimming the glass substrate.

In the present invention, the heating member and the glass substrate are movable relative to each other. That is, the heating member can be assembled to be movable. Alternatively, the glass substrate can be moved. As a further alternative, both the heating member and the glass substrate can be configured to move simultaneously relative to each other. The movement of the heating member and the glass substrate can be performed by the operation of the heating member support and the glass substrate support, respectively.

The speed at which the heating member and/or the glass substrate move can be adjusted in consideration of the productivity, the cut portion of the glass substrate, the depth to the depth, the temperature difference, and the pressure difference.

In the present invention, the heating member support and the glass substrate support can be The assembly is such that the heating member support or the glass substrate support is fixed in position, and the other of the heating member support or the glass substrate support can be moved while the heating member contacts the target portion of the cut portion of the glass substrate . Preferably, the glass substrate support is movable while the heating member support is held in place. The reason for this is because, in fact, if the heating member support moves, the convection current is induced by the movement of the heating member support, and the convection current causes the temperature of the heating member to change, so that it is difficult to uniformly trim the cut portion of the glass substrate into Strip form.

In the present invention, preferably, when the heating member contacts the cut portion of the glass substrate, the pressure applied to the heating member is in a range from about 0.1 Kgf/cm ² to about 3.0 Kgf/cm ² , more preferably from It is in the range of 0.5 Kgf/cm ² to 1.5 Kgf/cm ² . If the pressure applied to the heating unit is too high, the amount of glass removed from the edge of the glass substrate per unit length may increase. Therefore, this may not be suitable for processing the edges of thin glass substrates. When the pressure applied to the heating unit is too low, if the protrusion and the recess are formed in the edge of the glass substrate, or the angle at which the glass substrate is cut is not accurate, the edge of the glass substrate cannot be uniformly trimmed.

In the present invention, the glass substrate is trimmed in a range from 30 μm to 5 mm with respect to each of the vertical and horizontal surfaces of the glass substrate based on the edge between the horizontal surface and the vertical surface of the glass substrate. Cut each edge of the section. Further, it is preferable to trim the side of the cut portion of the glass substrate in a range from 50 μm to 5 mm with respect to the vertical surface. edge. However, the range is not limited to a specific value.

Any of the well-known techniques other than those described above may be used for the structure, elements, etc. of the processing apparatus according to the present invention.

As described above, the apparatus for processing a cut portion of a glass substrate according to the present invention includes a heating member having a contact portion that contacts the cut portion of the glass substrate in the manner described so as to be passable through a single process To finish processing the cut portion. Therefore, the number of processes required to process the cut portion of the glass substrate can be remarkably reduced, thereby greatly enhancing the efficiency of processing the cut portion. In addition, the movement of the glass substrate required for processing the cut portion can be minimized, thereby significantly reducing the problem of damage to the glass substrate while processing the cut portion.

Although the preferred embodiment of the present invention has been disclosed for illustrative purposes, it will be understood by those skilled in the art, without departing from the scope and spirit of the invention as disclosed in the appended claims. Various modifications, additions and substitutions are possible.

Claims (4)

An apparatus for processing a cut portion of a glass substrate, the apparatus comprising: a heating member; a heating member support; and a glass substrate support, at least one of the heating member support and the glass substrate support being provided as Movable such that the heating member and the cut portion of the glass substrate fixed to the glass substrate support are sequentially in contact with each other; the heating member includes a bidirectional contact portion or a three-way contact to the cut portion of the glass substrate a contact portion; the bidirectional contact portion including contact surfaces extending in respective directions and connected to each other such that an internal angle between the contact surfaces is greater than 10° and less than 180°, and the three-way contact The portion includes: a vertical contact surface that contacts a vertical surface of the cut portion of the glass substrate; and two edge contact surfaces that are coupled to respective opposite ends of the vertical contact surface such that the edge contact surfaces and An internal angle between each of the vertical contact surfaces is greater than 90° and less than 180°. The apparatus for processing a cut portion of a glass substrate according to claim 1, wherein the bidirectional contact portion has a shape such that the bidirectional contact portion simultaneously contacts an upper edge and a lower edge or a left edge of the cut portion of the glass substrate, and a right edge, or such that the bi-directional contact portion simultaneously contacts an edge of the cutting portion and an integral portion of the vertical surface of the cutting portion. The apparatus for processing a cut portion of a glass substrate according to claim 1, wherein the heating member has a shape of a cylinder or a polygonal prism, and the bidirectional contact portion or the three-way contact portion is formed as the cylinder or the One of the polygonal prisms is concave in shape. The apparatus for processing a cut portion of a glass substrate according to claim 1, wherein the heating member has a shape of a cylinder, and the bidirectional contact portion or the three-way contact portion is formed in a circumferential surface of the cylinder The shape is concave in order to form a single annular strip shape.