TWI657057B - Apparatus for processing edge of glass substrate and method for processing edge of glass substrate using the same - Google Patents

Apparatus for processing edge of glass substrate and method for processing edge of glass substrate using the same Download PDF

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TWI657057B
TWI657057B TW104115748A TW104115748A TWI657057B TW I657057 B TWI657057 B TW I657057B TW 104115748 A TW104115748 A TW 104115748A TW 104115748 A TW104115748 A TW 104115748A TW I657057 B TWI657057 B TW I657057B
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glass substrate
heating unit
edge
support
heating
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TW104115748A
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Chinese (zh)
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TW201605747A (en
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孫同鎭
金桐煥
金鐘敏
卓光龍
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南韓商東友精細化工有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00Severing by means other than cutting; Apparatus therefor
    • B26F3/06Severing by using heat
    • B26F3/08Severing by using heat with heated members
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/08Severing cooled glass by fusing, i.e. by melting through the glass

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本文揭示用於處理玻璃基板之邊緣的設備與方法。該設備包括:加熱單元;加熱單元支撐件;以及玻璃基板支撐件。加熱單元支撐件及玻璃基板支撐件中之至少一者經提供為可移動式,以使得加熱單元及玻璃基板接觸到彼此。加熱單元及加熱單元支撐件藉由壓縮構件連接至彼此。壓縮構件之第一端部固定至加熱單元之側表面。壓縮構件之第二端部固定至加熱單元支撐件。當壓力施加至處於受熱狀態之加熱單元從而使得該加熱單元緊密接觸到處於冷卻狀態的玻璃基板之邊緣時,壓縮構件作用為一裝置來用於產生壓力以藉由對施加至加熱單元之壓力的反應將加熱單元抬起至其原始位置。 Apparatus and methods for treating the edges of a glass substrate are disclosed herein. The apparatus includes: a heating unit; a heating unit support; and a glass substrate support. At least one of the heating unit support and the glass substrate support is provided to be movable such that the heating unit and the glass substrate are in contact with each other. The heating unit and the heating unit support are connected to each other by a compression member. The first end of the compression member is fixed to a side surface of the heating unit. The second end of the compression member is secured to the heating unit support. When pressure is applied to the heating unit in a heated state such that the heating unit is in intimate contact with the edge of the glass substrate in a cooled state, the compression member acts as a means for generating pressure by the pressure applied to the heating unit. The reaction lifts the heating unit to its original position.

Description

處理玻璃基板之邊緣的設備及使用該設備處理玻璃基板之邊緣的方法 Apparatus for processing the edge of a glass substrate and method for treating the edge of the glass substrate using the same

本發明係關於一種處理玻璃基板之邊緣的設備及一種使用該設備處理玻璃基板之邊緣的方法。 The present invention relates to an apparatus for treating the edges of a glass substrate and a method of treating the edges of the glass substrate using the apparatus.

處理用於平板顯示器或類似物之玻璃基板一般包括:將玻璃基板切割成所需形態;以及研磨及/或拋光切割玻璃基板之邊緣以移除該切割玻璃基板之尖銳部分。 Processing a glass substrate for a flat panel display or the like generally includes: cutting the glass substrate into a desired configuration; and grinding and/or polishing the edge of the cut glass substrate to remove sharp portions of the cut glass substrate.

在上述典型處理方法中,因為在處理玻璃基板之邊緣時所產生的顆粒污染玻璃基板之表面,所以需要清潔及乾燥該玻璃基板之操作。據此,生產玻璃基板之成本增加。此外,在處理時收集在帶材與玻璃基板之間的顆粒及碎片會顯著損壞玻璃基板之表面,據此可能需要中斷一系列處理操作來對此進行處理。 In the above typical treatment method, since the particles generated when the edge of the glass substrate is treated contaminate the surface of the glass substrate, the operation of cleaning and drying the glass substrate is required. Accordingly, the cost of producing a glass substrate increases. In addition, the particles and debris collected between the strip and the glass substrate during processing can significantly damage the surface of the glass substrate, which may require a series of processing operations to be interrupted for processing.

在韓國專利申請案第2001-0085114號中揭示一種方法,包括:使用鑽石磨輪並將玻璃基板去角;使用相鄰於待去角玻璃基板之一部分而得以安裝的噴嘴並吹送空氣以移除功率;以及抽吸包括玻璃微粒之壓縮空氣。 A method is disclosed in Korean Patent Application No. 2001-0085114, which comprises: using a diamond grinding wheel and dehorning a glass substrate; using a nozzle mounted adjacent to a portion of the glass substrate to be cornered and blowing air to remove power And pumping compressed air including glass particles.

然而,在其中將研磨或去角用來處理玻璃基板之邊緣的情況下,不可避免地出現玻璃粉。此外,存在以下問題:在研磨製程期間產生的邊緣裂紋;可歸因於玻璃粉或粉塵之表面劃痕;使作業員曝露於玻璃粉,等等。 However, in the case where grinding or chamfering is used to treat the edge of the glass substrate, glass frit is inevitably present. In addition, there are the following problems: edge cracks generated during the grinding process; surface scratches attributable to glass frit or dust; exposure of the operator to the glass frit, and the like.

在韓國專利申請案第2012-0002573號中揭示一種藉助於將加熱構件110接觸到冷卻玻璃基板200及將加熱構件110沿玻璃基板200之邊緣移動而將玻璃基板之邊緣修整為條帶220形態之方法,如圖1所示。此習知方法可根本上防止玻璃粉出現在處理玻璃基板之邊緣時並可因此有效地用於此領域。 In the Korean Patent Application No. 2012-0002573, a method of trimming an edge of a glass substrate into a strip 220 by contacting the heating member 110 to the cooling glass substrate 200 and moving the heating member 110 along the edge of the glass substrate 200 is disclosed. The method is shown in Figure 1. This conventional method can fundamentally prevent glass frit from appearing at the edge of the treated glass substrate and can thus be effectively used in this field.

然而,如圖2所示,在第2012-0002573號之方法中,若在切割玻璃基板時在玻璃基板之邊緣上出現碎裂(參考圖2之(a)具有由碎裂所導致不均勻邊緣的玻璃基板),則加熱構件110彈離藉由碎裂而形成在玻璃基板200之邊緣上的突出部。因此,難以均勻處理玻璃基板之邊緣。此外,若玻璃基板之切割表面的側面與相鄰另一側面之間的角度不接近於90°,則加熱構件110可能不接觸到玻璃基板200 之邊緣的部分(參考圖2之(b)具有不精確切割邊緣之玻璃基板),因此構成未修整部分,或玻璃基板之邊緣的突出部分與加熱構件接觸所用之力可過度增大,因此致使對玻璃基板造成損壞。 However, as shown in FIG. 2, in the method of No. 2012-0002573, if cracking occurs on the edge of the glass substrate when cutting the glass substrate (refer to FIG. 2(a), there is uneven edge caused by chipping. The heating member 110 is ejected from the protrusion formed on the edge of the glass substrate 200 by chipping. Therefore, it is difficult to uniformly process the edges of the glass substrate. In addition, if the angle between the side surface of the cutting surface of the glass substrate and the adjacent other side surface is not close to 90°, the heating member 110 may not contact the glass substrate 200. a portion of the edge (refer to (b) of FIG. 2 having a glass substrate having an inaccurately cut edge), thereby constituting an untrimmed portion, or a force at which the protruding portion of the edge of the glass substrate is in contact with the heating member may be excessively increased, thereby causing Damage to the glass substrate.

此外,如圖3所示(具有不均勻厚度之玻璃基板),若在玻璃基板200之厚度中存在偏差,則亦可產生未修整部分。 Further, as shown in FIG. 3 (a glass substrate having a non-uniform thickness), if there is a variation in the thickness of the glass substrate 200, an untrimmed portion may be generated.

[先前技術文件] [Previous Technical Document]

[專利文件1] [Patent Document 1]

韓國專利申請案第2012-0002573號 Korean Patent Application No. 2012-0002573

因此,本發明已經牢記先前技術中出現的上述問題,且本發明之一目的在於提供一種處理玻璃基板之邊緣的設備,該設備經組配以使得:即使當玻璃基板之邊緣因在切割玻璃基板時在該邊緣上產生碎裂而不均勻時,仍可均勻修整玻璃基板之邊緣;即使當玻璃基板之切割表面的角度不精確(非90°)時,仍可均勻修整玻璃基板之邊緣;以及即使當在玻璃基板之厚度中存在偏差時,仍有可能在不構成未修整部分之情況下修整玻璃基板之邊緣;以及提供一種 使用該設備處理玻璃基板之邊緣的方法。 Accordingly, the present invention has been made in mind the above problems occurring in the prior art, and it is an object of the present invention to provide an apparatus for processing the edges of a glass substrate which is assembled such that even when the edge of the glass substrate is cut by the glass substrate When the chip is unevenly formed on the edge, the edge of the glass substrate can be uniformly trimmed; even when the angle of the cut surface of the glass substrate is not accurate (not 90°), the edge of the glass substrate can be uniformly trimmed; Even when there is a deviation in the thickness of the glass substrate, it is possible to trim the edge of the glass substrate without forming an untrimmed portion; and provide a A method of treating the edge of a glass substrate using the device.

為了實現上述目的,在一態樣中,本發明提供一種處理玻璃基板之邊緣的設備,該設備包括:加熱單元;加熱單元支撐件;以及玻璃基板支撐件。加熱單元支撐件及玻璃基板支撐件中之至少一者經提供為可移動式,以使得加熱單元及固定至玻璃基板支撐件的玻璃基板之切割部分依序接觸到彼此。加熱單元與加熱單元支撐件藉由壓縮構件連接至彼此,且壓縮構件包括至少兩個壓縮構件,該至少兩個壓縮構件提供在加熱單元之側表面上,其中壓縮構件之第一端部在預定位置處固定至加熱單元之側表面,在該等預定位置處,力之總和基於加熱單元之垂直中心軸而為零,且該等預定位置取決於壓縮構件之數量而變化,且該等壓縮構件之第二端部固定至加熱單元支撐件。當壓力施加至處於受熱狀態之加熱單元從而使得該加熱單元緊密接觸到處於冷卻狀態的玻璃基板之邊緣時,壓縮構件作用為一裝置來用於產生壓力以藉由對施加至加熱單元之壓力的反應將加熱單元抬起至其原始位置。 In order to achieve the above object, in one aspect, the present invention provides an apparatus for processing an edge of a glass substrate, the apparatus comprising: a heating unit; a heating unit support; and a glass substrate support. At least one of the heating unit support and the glass substrate support is provided to be movable such that the heating unit and the cut portion of the glass substrate fixed to the glass substrate support sequentially contact each other. The heating unit and the heating unit support are connected to each other by a compression member, and the compression member includes at least two compression members provided on a side surface of the heating unit, wherein the first end of the compression member is predetermined The position is fixed to a side surface of the heating unit, at which the sum of the forces is zero based on the vertical central axis of the heating unit, and the predetermined positions vary depending on the number of compression members, and the compression members The second end is fixed to the heating unit support. When pressure is applied to the heating unit in a heated state such that the heating unit is in intimate contact with the edge of the glass substrate in a cooled state, the compression member acts as a means for generating pressure by the pressure applied to the heating unit. The reaction lifts the heating unit to its original position.

在另一態樣中,本發明提供一種使用該處理設備處理玻璃基板之邊緣的方法。該方法包括:將加熱單元加熱;將玻璃基板固定在玻璃基板支撐件上;加壓加熱單元,從而使得加熱單元與處於冷卻狀態的玻璃基板之邊緣接觸;以及移動加熱單元支撐件或玻璃基板支撐件,保持加熱單 元與玻璃基板之邊緣之間的接觸,並因此依序修整玻璃基板之邊緣。 In another aspect, the invention provides a method of treating an edge of a glass substrate using the processing device. The method comprises: heating a heating unit; fixing a glass substrate on a glass substrate support; pressurizing the heating unit such that the heating unit is in contact with an edge of the glass substrate in a cooled state; and moving the heating unit support or the glass substrate support Piece, keep heating list The contact between the element and the edge of the glass substrate, and thus the edges of the glass substrate are sequentially trimmed.

100‧‧‧加熱單元 100‧‧‧heating unit

110‧‧‧加熱構件 110‧‧‧heating components

120‧‧‧頭部 120‧‧‧ head

130‧‧‧加熱單元支撐件 130‧‧‧heating unit support

200‧‧‧玻璃基板 200‧‧‧ glass substrate

210‧‧‧玻璃基板支撐件 210‧‧‧ glass substrate support

220‧‧‧條帶 220‧‧‧ strips

300‧‧‧磁體、彈簧或波紋管構件 300‧‧‧ Magnets, springs or bellows members

310‧‧‧壓縮構件(彈簧) 310‧‧‧Compression member (spring)

320‧‧‧壓縮構件(磁體) 320‧‧‧Compressed components (magnets)

330‧‧‧壓縮構件(波紋管構件) 330‧‧‧Compressed components (bellows)

本發明之以上及其他目的、特徵及優點將自以下結合隨附圖式之詳細描述得以更清晰地理解。 The above and other objects, features and advantages of the present invention will become more apparent from

圖1例示出一種根據習知技術的用於修整玻璃基板之邊緣的方法。 Figure 1 illustrates a method for trimming the edges of a glass substrate in accordance with conventional techniques.

圖2及圖3為顯示圖1之習知方法的問題之視圖。 2 and 3 are views showing problems of the conventional method of Fig. 1.

圖4為顯示根據本發明之實施例的用於處理玻璃基板之邊緣的設備之以下各者之間耦接關係之視圖:加熱單元、壓縮構件(圖4之(a)之彈簧、圖4之(b)之磁體及圖4之(c)之波紋管構件)及加熱單元支撐件。 4 is a view showing a coupling relationship between the following components of an apparatus for processing an edge of a glass substrate according to an embodiment of the present invention: a heating unit, a compression member (a spring of FIG. 4(a), FIG. 4 (b) the magnet and the bellows member of (c) of FIG. 4 and the heating unit support.

圖5之(a)例示出使用根據本發明的處理設備修整玻璃基板之不均勻邊緣的實例(具有由碎裂所導致不均勻邊緣的玻璃基板)。 (a) of FIG. 5 illustrates an example of trimming a non-uniform edge of a glass substrate (a glass substrate having uneven edges caused by chipping) using the processing apparatus according to the present invention.

圖5之(b)例示出在玻璃基板之切割表面的角度不精確(90°)時使用根據本發明的處理設備修整玻璃基板之邊緣的實例(具有不精確切割邊緣之玻璃基板)。 (b) of FIG. 5 illustrates an example of trimming the edge of a glass substrate (a glass substrate having an inaccurately cut edge) using the processing apparatus according to the present invention when the angle of the cut surface of the glass substrate is inaccurate (90°).

圖6為顯示使用根據本發明的處理設備處理玻璃基板之邊緣的方法之示意圖,其中符號300可表示磁體、彈簧或波紋管構件。 6 is a schematic diagram showing a method of processing an edge of a glass substrate using a processing apparatus in accordance with the present invention, wherein symbol 300 can represent a magnet, a spring, or a bellows member.

圖7為顯示根據本發明的處理設備之示範性實施例的視圖。 Figure 7 is a diagram showing an exemplary embodiment of a processing device in accordance with the present invention.

下文將參考隨附圖式對本發明進行詳細描述。在以下描述中,將省略可不必要地使得本發明之主旨不清楚的已知功能及元件之冗餘描述及詳細描述。 The invention will be described in detail below with reference to the accompanying drawings. In the following description, redundant descriptions and detailed descriptions of known functions and elements that may unnecessarily obscure the subject matter of the present invention are omitted.

以下描述及圖式例示出本發明之示範性實施例以允許本領域一般技藝人士容易實施將描述之設備及方法。其他實施例可包括其他結構或邏輯修改。除非以其他方式界定,每一部件之組態及功能與一般技藝人士所通常瞭解的相同。處理順序可改變,且若干實施例之部件或特徵可包括在其他實施例中或由其他實施例所替代。 The following description and the drawings illustrate exemplary embodiments of the present invention in order to Other embodiments may include other structural or logical modifications. The configuration and function of each component is the same as commonly understood by those of ordinary skill in the art, unless otherwise defined. The order of processing may vary, and components or features of several embodiments may be included in or substituted for other embodiments.

如圖7所示,根據本發明之示範性實施例的用於處理玻璃基板之邊緣的設備包括加熱單元、加熱單元支撐件130及玻璃基板支撐件210。 As shown in FIG. 7, an apparatus for processing an edge of a glass substrate according to an exemplary embodiment of the present invention includes a heating unit, a heating unit support 130, and a glass substrate support 210.

加熱單元支撐件及玻璃基板支撐件中之至少一者經提供為可移動式,以使得加熱單元及固定至玻璃基板支撐件的玻璃基板之切割部分可依序接觸到彼此。 At least one of the heating unit support and the glass substrate support is provided to be movable such that the heating unit and the cut portion of the glass substrate fixed to the glass substrate support can sequentially contact each other.

加熱單元及加熱單元支撐件藉由壓縮構件連接至彼此。壓縮構件包含提供在加熱單元之側表面上的兩個或更多個壓縮構件。壓縮構件之第一端部在預定位置處固定至加熱單元之側表面,在該等預定位置處,力之總和基於加熱單元之垂直中心軸而為零,且該等預定位置取決於壓縮構件之數量而變化。壓縮構件之第二端部固定至加熱單元支撐件,該加熱單元支撐件圍繞加熱單元之側表面而安置於一位置,該位置對應於穿過加熱單元之中心軸與加熱單元之一部分的線,其中壓縮構件之第一端部固定至該部分。 The heating unit and the heating unit support are connected to each other by a compression member. The compression member includes two or more compression members provided on a side surface of the heating unit. The first end of the compression member is fixed to a side surface of the heating unit at a predetermined position at which the sum of the forces is zero based on the vertical central axis of the heating unit, and the predetermined positions are dependent on the compression member The quantity changes. The second end of the compression member is fixed to the heating unit support, the heating unit support being disposed at a position around a side surface of the heating unit, the position corresponding to a line passing through a central axis of the heating unit and a portion of the heating unit, Wherein the first end of the compression member is secured to the portion.

當壓力施加至處於受熱狀態之加熱單元從而使得該加熱單元緊密接觸到處於冷卻狀態的玻璃基板之邊緣時,壓縮構件作用為一裝置來用於產生壓力以藉由對施加至加熱單元之壓力的反應將加熱單元抬起至其原始位置。 When pressure is applied to the heating unit in a heated state such that the heating unit is in intimate contact with the edge of the glass substrate in a cooled state, the compression member acts as a means for generating pressure by the pressure applied to the heating unit. The reaction lifts the heating unit to its original position.

在處理設備中,當受熱的加熱單元接觸到玻璃基板之邊緣時,以相應方式修整玻璃基板之邊緣,以使得藉由玻璃基板中之溫差由加熱單元與玻璃基板之邊緣之間的接觸部分形成條帶。因此,可均勻處理玻璃基板之邊緣而不產生玻璃粉。 In the processing apparatus, when the heated heating unit contacts the edge of the glass substrate, the edges of the glass substrate are trimmed in a corresponding manner so that the temperature difference in the glass substrate is formed by the contact portion between the heating unit and the edge of the glass substrate. Bands. Therefore, the edge of the glass substrate can be uniformly treated without generating glass frit.

加熱單元可能係指加熱構件自身。替代地,如圖4之(a)至(c)所示,加熱單元100可能指包括加熱構件110及頭部120之單元,該頭部120耦接至加熱構件110之周緣並提供為用於將加熱構件110連接至加熱單元支撐件130之裝置。每一壓縮構件310、320、330可直接耦接至加熱構件110。取決於用於壓縮構件之材料的種類,可能並非較佳的在於,壓縮構件直接耦接至加熱構件,因為加熱構件經受熱至相當高的溫度。在此情況下,如圖4之(a)至(c)所示,較佳在於,壓縮構件藉由頭部連接至加熱構件。 The heating unit may refer to the heating member itself. Alternatively, as shown in (a) to (c) of FIG. 4, the heating unit 100 may refer to a unit including the heating member 110 and the head 120 coupled to the circumference of the heating member 110 and provided for A device that connects the heating member 110 to the heating unit support 130. Each of the compression members 310, 320, 330 can be directly coupled to the heating member 110. Depending on the type of material used to compress the member, it may not be preferred that the compression member is directly coupled to the heating member because the heating member is subjected to heat to a relatively high temperature. In this case, as shown in (a) to (c) of Fig. 4, it is preferable that the compression member is connected to the heating member by the head.

與玻璃基板之邊緣接觸的加熱單元之部分自加熱單元之圓周表面朝向該加熱單元之中心軸而具有錐度。儘管自圓周表面至中心軸之該錐度形狀不限於特定形狀,但該錐度形狀可具有例如圓錐形狀或類似形狀。 A portion of the heating unit in contact with the edge of the glass substrate has a taper from the circumferential surface of the heating unit toward the central axis of the heating unit. Although the taper shape from the circumferential surface to the central axis is not limited to a specific shape, the taper shape may have, for example, a conical shape or the like.

當加熱單元如上述具有錐度時,該加熱單元可有利用於接觸玻璃基板之邊緣及加熱單元之修角(cornering)。 When the heating unit has a taper as described above, the heating unit can be advantageously used to contact the edge of the glass substrate and the cornering of the heating unit.

儘管形成於具有錐度部分之上的加熱單元之部分不限於特定形狀,但該部分可具有例如圓柱形狀。 Although the portion of the heating unit formed over the tapered portion is not limited to a specific shape, the portion may have, for example, a cylindrical shape.

加熱構件可藉由通常用於此技術之裝置而受熱。例如,可使用電阻加熱方法、高頻感應加熱方法等。高頻感 應加熱方法係指其中加熱構件安置於線圈之中心的方法,其中高頻電流藉由因電磁感應所導致之渦流及藉由因高頻電流之一部分的滯後所導致之熱損失而沿該線圈快速受熱。 The heating member can be heated by means commonly used in this technology. For example, a resistance heating method, a high frequency induction heating method, or the like can be used. High frequency The heating method refers to a method in which a heating member is disposed at the center of the coil, wherein the high-frequency current is rapidly along the coil by eddy current caused by electromagnetic induction and by heat loss due to hysteresis of a portion of the high-frequency current Heated.

高頻感應加熱方法可有效將能量通過線圈集中至加熱構件。因此,加熱構件之溫度可快速升高,且對於防止加熱構件因接觸冷卻構件而溫度降低而言特別有利。因此,在此示範性實施例中,較佳在於使用高頻感應加熱方法。 The high frequency induction heating method effectively concentrates energy through the coil to the heating member. Therefore, the temperature of the heating member can be rapidly increased, and it is particularly advantageous for preventing the heating member from being lowered in temperature due to contact with the cooling member. Therefore, in this exemplary embodiment, it is preferred to use a high frequency induction heating method.

在此示範性實施例中,加熱構件受熱所至溫度意味著該加熱構件受熱至玻璃之Tg或更高。取決於玻璃之種類,玻璃之Tg自750℃至1300℃變化。為了令人滿意地修整待處理玻璃基板之切割部分,加熱構件之溫度保持在高於玻璃之Tg 50℃或更高,較佳高出100℃或更高,且更佳地高出約200℃至約500℃。 In this exemplary embodiment, the temperature at which the heating member is heated means that the heating member is heated to a Tg or higher of the glass. The Tg of the glass varies from 750 ° C to 1300 ° C depending on the type of glass. In order to satisfactorily trim the cut portion of the glass substrate to be treated, the temperature of the heating member is maintained at 50 ° C or higher than the Tg of the glass, preferably 100 ° C or higher, and more preferably about 200 ° C. Up to about 500 ° C.

壓縮構件可包含:彈簧;一對磁體,其使用產生在該等磁體之相同磁極之間的斥力;或裝置,諸如波紋管構件,其使用空氣壓縮及自其中產生之反應。 The compression member can comprise: a spring; a pair of magnets that use a repulsive force generated between the same magnetic poles of the magnets; or a device, such as a bellows member, that uses air compression and reactions generated therefrom.

如圖4所示,當提供兩個壓縮構件時,壓縮構件之第一端部在基於加熱單元之垂直中心軸而面向彼此之位置處固定至加熱單元之側表面,且壓縮構件之第二端部固定至 加熱單元支撐件。 As shown in FIG. 4, when two compression members are provided, the first ends of the compression members are fixed to the side surfaces of the heating unit at positions facing each other based on the vertical central axis of the heating unit, and the second end of the compression members Fixed to Heating unit support.

加熱單元支撐件圍繞加熱單元而安置於一位置,該位置對應於穿過加熱單元之中心軸與加熱單元之一部分的線,其中壓縮構件之第一端部固定至該部分。 The heating unit support is disposed around the heating unit in a position corresponding to a line passing through a central axis of the heating unit and a portion of the heating unit to which the first end of the compression member is secured.

只要加熱單元可藉由壓縮構件而固定至加熱單元支撐件,則加熱單元支撐件之形狀不限於特定形狀。例如,加熱單元支撐件可具有熟習此項技術者清楚瞭解之結構。 The shape of the heating unit support is not limited to a specific shape as long as the heating unit can be fixed to the heating unit support by the compressing member. For example, the heating unit support can have a structure that is well understood by those skilled in the art.

玻璃基板支撐件作用為固持玻璃基板。本領域中已知的各種種類的支撐裝置可用作玻璃基板支撐件。特別地,玻璃基板支撐件可包括用於冷卻玻璃基板之裝置。例如,冷卻裝置可經組配以使得在玻璃基板支撐件之底部中提供具有流道之冷卻板,其中低溫製冷劑沿該流道流動。 The glass substrate support functions to hold the glass substrate. Various kinds of support devices known in the art can be used as the glass substrate support. In particular, the glass substrate support may comprise means for cooling the glass substrate. For example, the cooling device may be assembled such that a cooling plate having a flow path is provided in the bottom of the glass substrate support along which the low temperature refrigerant flows.

在根據本發明的處理設備中,因為加熱單元受熱至玻璃之Tg的溫度或更高,所以可以相應方式修整玻璃基板之邊緣,以使得即使當玻璃基板之溫度處於自0℃至50℃之範圍內時,亦藉由玻璃基板中之溫差形成條帶。 In the processing apparatus according to the present invention, since the temperature of the heating unit is heated to the Tg of the glass or higher, the edge of the glass substrate can be trimmed in a corresponding manner so that even when the temperature of the glass substrate is in the range from 0 ° C to 50 ° C In the meantime, the strip is also formed by the temperature difference in the glass substrate.

然而,可進行冷卻玻璃基板以便以相應方式加強修整玻璃基板之邊緣的效果,以使得形成條帶。術語「冷卻」係指將玻璃基板之溫度強制降低至低於該玻璃基板之周圍 環境的溫度。 However, it is possible to cool the glass substrate to enhance the effect of trimming the edges of the glass substrate in a corresponding manner so that a strip is formed. The term "cooling" refers to forcibly lowering the temperature of a glass substrate below the periphery of the glass substrate. The temperature of the environment.

相對於冷卻操作,冷卻玻璃基板之整體是可能的,且選擇性僅冷卻玻璃基板之目標部分亦為可能的。然而,為了確保穩定控制,較佳在於冷卻玻璃基板之整體。 It is possible to cool the entire glass substrate with respect to the cooling operation, and it is also possible to selectively cool only the target portion of the glass substrate. However, in order to ensure stable control, it is preferred to cool the entirety of the glass substrate.

可藉由將玻璃基板在保持在低溫條件下之工作環境中放置一預定時間來實施冷卻玻璃基板。替代地,可藉由將玻璃基板接觸到保持在低溫條件下之冷卻板來實施冷卻玻璃基板。較佳在於,當修整玻璃基板之邊緣的操作進行之同時,玻璃基板固定於保持在預定溫度之冷卻板上,從而使得可在修整操作期間防止玻璃基板之溫度升高。 The cooling of the glass substrate can be carried out by placing the glass substrate in a working environment maintained under a low temperature condition for a predetermined period of time. Alternatively, the cooling of the glass substrate can be carried out by contacting the glass substrate with a cooling plate maintained under low temperature conditions. Preferably, while the operation of trimming the edges of the glass substrate is being performed, the glass substrate is fixed to the cooling plate maintained at a predetermined temperature, so that the temperature rise of the glass substrate can be prevented during the trimming operation.

在本發明中,玻璃基板經冷卻至低於室溫(=25℃)之溫度,更佳地冷卻至低於室溫10℃之溫度,以使得可修整加熱單元與之接觸的玻璃基板而不產生粉塵。在此示範性實施例中,玻璃基板之溫度為較佳低於10℃。更佳地,該玻璃基板之溫度處於自0℃至10℃之範圍內,以便防止用於冷卻的能量之過度消耗。 In the present invention, the glass substrate is cooled to a temperature lower than room temperature (=25 ° C), more preferably cooled to a temperature lower than room temperature 10 ° C, so that the glass substrate to which the heating unit is contacted can be trimmed without Produces dust. In this exemplary embodiment, the temperature of the glass substrate is preferably less than 10 °C. More preferably, the temperature of the glass substrate is in the range of from 0 ° C to 10 ° C in order to prevent excessive consumption of energy for cooling.

在玻璃基板之溫度升高時,自玻璃基板之邊緣移除的玻璃量增加。在此情況下,變得難以精確修整玻璃基板之邊緣。若玻璃基板之溫度過度降低,則能量消耗過度增加,且變得難以控制修整玻璃基板之邊緣的製程。 As the temperature of the glass substrate increases, the amount of glass removed from the edge of the glass substrate increases. In this case, it becomes difficult to precisely trim the edges of the glass substrate. If the temperature of the glass substrate is excessively lowered, the energy consumption excessively increases, and it becomes difficult to control the process of trimming the edges of the glass substrate.

在本發明中,加熱單元及玻璃基板可相對於彼此移動。此即,加熱單元可經組配為可移動式。替代地,玻璃基板可為移動式。作為其他替代形式,加熱單元及玻璃基板皆可經組配為可相對於彼此同時移動。可藉由加熱單元支撐件及玻璃基板支撐件之操作來分別實施加熱單元及玻璃基板之移動。 In the present invention, the heating unit and the glass substrate are movable relative to each other. That is, the heating unit can be assembled to be movable. Alternatively, the glass substrate can be mobile. As a further alternative, both the heating unit and the glass substrate can be configured to move simultaneously relative to one another. The movement of the heating unit and the glass substrate can be separately performed by the operation of the heating unit support and the glass substrate support.

可慮及生產率、玻璃基板之邊緣經修整所至深度、溫差及壓差而調整加熱單元及/或玻璃基板移動之速度。 The speed at which the heating unit and/or the glass substrate can be moved can be adjusted in consideration of the productivity, the edge of the glass substrate, the depth to the depth, the temperature difference, and the pressure difference.

在本發明中,加熱單元支撐件及玻璃基板支撐件可經組配以使得加熱單元支撐件或玻璃基板支撐件固定就位,且該加熱單元支撐件或該玻璃基板支撐件中之另一者經組配以便允許該另一者移動,保持加熱單元與玻璃基板之邊緣之間的接觸。較佳地,玻璃基板支撐件可在加熱單元支撐件固定就位之同時移動。此舉之原因係因為事實上,若加熱單元支撐件移動,則由該加熱單元支撐件之移動誘發對流電流,該對流電流導致加熱單元之溫度變化,因此難以將玻璃基板之邊緣均勻修整成條帶形態。 In the present invention, the heating unit support and the glass substrate support may be assembled such that the heating unit support or the glass substrate support is fixed in place, and the other of the heating unit support or the glass substrate support The assembly is configured to allow the other to move, maintaining contact between the heating unit and the edge of the glass substrate. Preferably, the glass substrate support is movable while the heating unit support is held in place. The reason for this is because, in fact, if the heating unit support moves, the convection current is induced by the movement of the heating unit support, and the convection current causes the temperature of the heating unit to change, so that it is difficult to evenly trim the edges of the glass substrate into strips. Belt shape.

在本發明中,較佳在於,當加熱單元與玻璃基板之邊緣接觸時,施加至加熱單元之壓力處於自約0.1Kgf/cm2至約3.0Kgf/cm2之範圍內,更佳地處於自0.5Kgf/cm2至 1.5Kgf/cm2之範圍內。若施加至加熱單元之壓力過高,則自玻璃基板之邊緣移除的玻璃量可能增加。因此,此舉可能不適於處理薄玻璃基板之邊緣。當施加至加熱單元之壓力過低時,若在玻璃基板之邊緣中形成突出部及凹部,或玻璃基板經切割所至角度不精確,則無法均勻修整玻璃基板之邊緣。在此情況下,不可能均勻修整玻璃基板之邊緣。換言之,在根據本發明的處理設備中,即使玻璃基板之邊緣不均勻,仍可均勻修整該邊緣,因為加熱單元沿邊緣之不均勻線移動,這是由於施加至加熱單元之壓力且由於壓縮構件之處理加熱單元所致變化的性能。 In the present invention, preferably, when the heating unit is in contact with the edge of the glass substrate, the pressure applied to the heating unit is in a range from about 0.1 Kgf/cm 2 to about 3.0 Kgf/cm 2 , more preferably from It is in the range of 0.5 Kgf/cm 2 to 1.5 Kgf/cm 2 . If the pressure applied to the heating unit is too high, the amount of glass removed from the edge of the glass substrate may increase. Therefore, this may not be suitable for processing the edges of thin glass substrates. When the pressure applied to the heating unit is too low, if the protrusion and the recess are formed in the edge of the glass substrate, or the angle at which the glass substrate is cut is not accurate, the edge of the glass substrate cannot be uniformly trimmed. In this case, it is impossible to uniformly trim the edges of the glass substrate. In other words, in the processing apparatus according to the present invention, even if the edge of the glass substrate is uneven, the edge can be uniformly trimmed because the heating unit moves along the uneven line of the edge due to the pressure applied to the heating unit and due to the compression member The performance of the heating unit is changed.

此外,即使當玻璃基板經切割所至角度不精確或玻璃基板之厚度不均勻時,仍可藉由上述機構均勻修整玻璃基板之邊緣。 Further, even when the glass substrate is not precisely angled by cutting or the thickness of the glass substrate is not uniform, the edge of the glass substrate can be uniformly trimmed by the above mechanism.

在本發明中,當處理玻璃基板之邊緣時,基於在玻璃基板之水平表面與垂直表面之間為接面的邊緣,相對於玻璃基板之垂直與水平表面中之每一者而在自50μm至5mm之範圍內修整該玻璃基板之邊緣,不過該範圍不限於特定值。以相應方式修整玻璃基板之邊緣,以使得形成條帶,據此可防止歸因於玻璃粉或玻璃片之二次損壞。 In the present invention, when processing the edge of the glass substrate, the edge based on the junction between the horizontal surface and the vertical surface of the glass substrate is from 50 μm to each of the vertical and horizontal surfaces of the glass substrate. The edge of the glass substrate is trimmed within a range of 5 mm, although the range is not limited to a specific value. The edges of the glass substrate are trimmed in a corresponding manner so that a strip is formed, whereby secondary damage due to the glass frit or the glass sheet can be prevented.

同時,本發明提供一種處理玻璃基板之邊緣的方法。根據本發明之示範性實施例的方法使用用於處理玻璃基板 之邊緣的上述設備,且該方法包括:將加熱單元加熱;將玻璃基板固定在玻璃基板支撐件上;加壓加熱單元,從而使加熱單元與冷卻玻璃基板之邊緣接觸;以及移動加熱單元支撐件或玻璃基板支撐件,保持加熱單元與玻璃基板之邊緣之間的接觸,並因此依序修整玻璃基板之邊緣。 At the same time, the present invention provides a method of treating the edges of a glass substrate. Method according to an exemplary embodiment of the present invention for processing a glass substrate The above apparatus of the edge, and the method comprises: heating the heating unit; fixing the glass substrate on the glass substrate support; pressurizing the heating unit to bring the heating unit into contact with the edge of the cooling glass substrate; and moving the heating unit support Or a glass substrate support that maintains contact between the heating unit and the edge of the glass substrate and thus sequentially trims the edges of the glass substrate.

可將以上所述涉及處理設備的內容之全部應用於處理方法。 All of the content related to the processing device described above can be applied to the processing method.

如上所述,在一種處理玻璃基板之邊緣的設備及一種使用該設備處理玻璃基板之邊緣的方法中,在加熱單元與加熱單元支撐件之間提供壓縮構件,從而使得即使當因在切割玻璃基板時產生在玻璃基板之邊緣上的碎裂而導致玻璃基板之邊緣不均勻時,仍可均勻修整玻璃基板之邊緣。此外,即使當玻璃基板之切割表面的角度不精確(非90°)時,仍可均勻修整玻璃基板之邊緣。此外,即使當在玻璃基板之厚度中存在偏差時,仍有可能在不構成未修整部分之情況下修整玻璃基板之邊緣。 As described above, in an apparatus for processing the edge of a glass substrate and a method of processing the edge of the glass substrate using the apparatus, a compressing member is provided between the heating unit and the heating unit support, thereby enabling even when the glass substrate is cut When the chipping on the edge of the glass substrate causes unevenness of the edge of the glass substrate, the edge of the glass substrate can be uniformly trimmed. Further, even when the angle of the cut surface of the glass substrate is not accurate (not 90°), the edges of the glass substrate can be uniformly trimmed. Further, even when there is a deviation in the thickness of the glass substrate, it is possible to trim the edge of the glass substrate without forming an untrimmed portion.

儘管已出於說明性目的而揭示出本發明之實施例,但熟習此項技術者將理解,在不脫離本發明之如在隨附申請專利範圍中揭示的範疇及精神之情況下,各種修改、添加及替換為可能的。 Although the embodiments of the present invention have been disclosed for illustrative purposes, it will be understood by those skilled in the art that various modifications may be made without departing from the scope and spirit of the invention as disclosed in the appended claims. , add and replace as possible.

Claims (8)

一種處理玻璃基板之邊緣的設備,該設備包含:一加熱單元;一加熱單元支撐件;以及一玻璃基板支撐件,該加熱單元支撐件及該玻璃基板支撐件中之至少一者經提供為可移動式,以使得該加熱單元與固定至該玻璃基板支撐件的該玻璃基板之一切割部分依序接觸到彼此;該加熱單元與該加熱單元支撐件藉由一壓縮構件連接至彼此,且該壓縮構件包含至少兩個壓縮構件,該至少兩個壓縮構件提供在該加熱單元之一側表面上,其中該等壓縮構件之第一端部在預定位置處固定至該加熱單元之該側表面,在該等預定位置處,力之一總和基於該加熱單元之一垂直中心軸而為零,且該等預定位置取決於該等壓縮構件之數量而變化,且該等壓縮構件之第二端部固定至該加熱單元支撐件;當一壓力施加至處於一受熱狀態之該加熱單元從而使得該加熱單元緊密接觸到處於一冷卻狀態的該玻璃基板之該邊緣時,該等壓縮構件作用為一裝置來用於產生壓力以藉由對施加至該加熱單元之該壓力的一反應將該加熱單元抬起至其一原始位置。 An apparatus for processing an edge of a glass substrate, the apparatus comprising: a heating unit; a heating unit support; and a glass substrate support, at least one of the heating unit support and the glass substrate support being provided as Mobile, such that the heating unit and the cut portion of the glass substrate fixed to the glass substrate support are sequentially in contact with each other; the heating unit and the heating unit support are connected to each other by a compression member, and The compression member includes at least two compression members provided on one side surface of the heating unit, wherein the first ends of the compression members are fixed to the side surface of the heating unit at a predetermined position, At the predetermined positions, the sum of the forces is zero based on a vertical central axis of the heating unit, and the predetermined positions vary depending on the number of the compression members, and the second ends of the compression members Fixed to the heating unit support; when a pressure is applied to the heating unit in a heated state such that the heating unit is in close contact with When the edge of the glass substrate is in a cooled state, the compressing members act as a means for generating pressure to lift the heating unit to one by a reaction to the pressure applied to the heating unit. Original location. 如請求項1所記載之處理玻璃基板之邊緣的設備,其中該等壓縮構件中之每一者包含:一彈簧;一對磁體,其使用產生在該等磁體之相同磁極之間的斥力; 及一裝置,其使用空氣壓縮及自其中產生之反應。 The apparatus for processing an edge of a glass substrate as recited in claim 1, wherein each of the compression members comprises: a spring; a pair of magnets that use a repulsive force generated between the same magnetic poles of the magnets; And a device that uses air compression and reactions generated therefrom. 如請求項1所記載之處理玻璃基板之邊緣的設備,其中該至少兩個壓縮構件包含兩個壓縮構件,且該等壓縮構件之該等第一端部在基於該加熱單元之該垂直中心軸而面向彼此的位置處固定至該加熱單元之該側表面。 The apparatus for processing an edge of a glass substrate as recited in claim 1, wherein the at least two compression members comprise two compression members, and the first ends of the compression members are based on the vertical central axis of the heating unit The side surfaces facing the other are fixed to the side surface of the heating unit. 如請求項1所記載之處理玻璃基板之邊緣的設備,其中該加熱單元包含:一加熱構件;以及一頭部,其耦接至該加熱構件之一周邊表面並經提供以將該加熱構件固定至該加熱單元支撐件;該等壓縮構件之該等第一端部固定至該頭部之一側表面。 The apparatus for processing an edge of a glass substrate as recited in claim 1, wherein the heating unit comprises: a heating member; and a head coupled to a peripheral surface of the heating member and provided to fix the heating member To the heating unit support; the first ends of the compression members are fixed to one side surface of the head. 如請求項1所記載之處理玻璃基板之邊緣的設備,其中與該玻璃基板之該邊緣接觸的該加熱單元之一部分自該加熱單元之一圓周表面朝向該加熱單元之中心軸而具有錐度。 An apparatus for processing an edge of a glass substrate as recited in claim 1, wherein a portion of the heating unit in contact with the edge of the glass substrate has a taper from a circumferential surface of the heating unit toward a central axis of the heating unit. 如請求項1所記載之處理玻璃基板之邊緣的設備,其中該加熱單元支撐件或該玻璃基板支撐件得以固定,且該加熱單元支撐件或該玻璃基板支撐件中之該另一者經組配以便允許該另一者移動,保持該加熱單元與該玻璃基板之該邊緣之間的接觸。 The apparatus for processing an edge of a glass substrate as recited in claim 1, wherein the heating unit support or the glass substrate support is fixed, and the other of the heating unit support or the glass substrate support is grouped Equipped to allow the other to move, maintaining contact between the heating unit and the edge of the glass substrate. 如請求項1所記載之處理玻璃基板之邊緣的設備,其中該玻璃基板支撐件包含用於冷卻該玻璃基板之一 裝置。 The apparatus for processing an edge of a glass substrate as recited in claim 1, wherein the glass substrate support comprises one of cooling the glass substrate Device. 一種使用如請求項1所記載之處理玻璃基板之邊緣的設備處理玻璃基板之邊緣的方法,該方法包含以下步驟:將加熱單元加熱;將玻璃基板固定在玻璃基板支撐件上;加壓該加熱單元,從而使得該加熱單元與處於一冷卻狀態的該玻璃基板之邊緣接觸;以及移動加熱單元支撐件或該玻璃基板支撐件,保持該加熱單元與該玻璃基板之該邊緣之間的接觸,並因此依序修整該玻璃基板之該邊緣。 A method for treating an edge of a glass substrate using an apparatus for processing an edge of a glass substrate as recited in claim 1, the method comprising the steps of: heating a heating unit; fixing the glass substrate to the glass substrate support; and pressurizing the heating a unit such that the heating unit is in contact with an edge of the glass substrate in a cooled state; and moving the heating unit support or the glass substrate support to maintain contact between the heating unit and the edge of the glass substrate, and Therefore, the edge of the glass substrate is sequentially trimmed.
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