TW201607160A - 連接器系統 - Google Patents

連接器系統 Download PDF

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TW201607160A
TW201607160A TW104110022A TW104110022A TW201607160A TW 201607160 A TW201607160 A TW 201607160A TW 104110022 A TW104110022 A TW 104110022A TW 104110022 A TW104110022 A TW 104110022A TW 201607160 A TW201607160 A TW 201607160A
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Taiwan
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card slot
card
disposed
plug assembly
connector system
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TW104110022A
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TWI584533B (zh
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Kent E Regnier
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Molex Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
    • H01R25/006—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits the coupling part being secured to apparatus or structure, e.g. duplex wall receptacle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/717—Structural association with built-in electrical component with built-in light source
    • H01R13/7172—Conduits for light transmission
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1078—Leads having locally deformed portion, e.g. for retention

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

本申請能提供一種連接器組件。一插座組件包括可以0.6mm(或更大)的間距設置在一卡槽中的多個端子。一施壓元件可設置在所述卡槽中，以接合一對接的板卡。所述插座組件能設置成允許空氣從一前面向一後面流動，空氣通過一中間壁。一插頭組件可設置成包括一導熱本體且設置成產生一些熱量。所述本體可包括具有多個冷卻槽的一表面。所述多個冷卻槽允許空氣流過所述插頭組件，從而所述插頭組件能被直接冷卻。

Description

連接器系統
本申請涉及連接器領域，更具體而言涉及適用於支援密度需求日益增長的連接器。
習知有多種輸入/輸出(I/O)連接器。一些常見類型的連接器包括SFP式連接器、QSFP式連接器以及CXP式連接器。往往使用這些連接器的一種用途是機架安裝式交換機，從而可以給其他設備提供許多連接點且能支援高頻寬的要求。這些連接器儘管是適用的，但是往往構造成將多個端子以一0.8mm或0.75mm的間距設置於一卡槽上。各卡槽能使多個端子設置於該卡槽的兩側。因此，設置多個端子的間距往往限制成排設置的端子的數量且由此限制能由一1U機架系統支援的頻寬。儘管已知有多種具有小間距的I/O連接器，但是在一插頭連接器中使用一板卡的常規的I/O連接器(例如SFP、QSFP、CXP式連接器)採用0.75mm或更大的間距，以適應插入卡槽中的板卡的固有公差(因為板卡典型地採用一PCB結構形成)。板卡是可取的，除了板卡會潛在地有助改善公差累積之外，它能支援 使系統工作的電路，特別是針對主動式銅纜和光纖基的插頭組件。
已確定的是，當試圖提供具有0.65mm或更小間 距的端子的卡槽時，如果採用常規的構造技術，那麼用於形成一板卡的電路板的公差會變成問題。有助解決這個問題的一個方法是在一罩體中使用一施壓元件，該施壓元件有助朝向一埠的一側對插頭連接器施壓。然而，某些人群會賞識一連接器系統的進一步改進。
另外，現有的系統往往難以冷卻，特別是如果 多個系統以一堆疊結構設置。由此，某些人群會賞識會有助解決熱管理問題的一連接器系統。
提供了一種連接器，所述連接器使多個端子以一0.6mm-0.65mm(例如在0.59mm與0.66mm之間)的間距設置於一卡槽內。一施壓元件設置於所述卡槽的一端，以提供充分的公差控制。所述連接器能構造成支援有源線纜組件和光學模組(例如可以產生熱負荷的模組)，且在一實施例中，所述連接器能支持產生2W功率的模組。為了在一堆疊結構中提供冷卻，空氣流被引導穿入所述連接器、流過所述模組並從所述連接器的後面(back)流出，從而當空氣流動通過所述系統時所述模組能被直接冷卻。
10‧‧‧插座組件
11a‧‧‧前面
11b‧‧‧後面
12‧‧‧埠
15‧‧‧插件
16a‧‧‧前開孔
16‧‧‧前壁
21‧‧‧中央支撐件
21a‧‧‧頂壁
21b‧‧‧底壁
23‧‧‧凹槽
26‧‧‧中央通道
29‧‧‧光導管
30‧‧‧罩體
31a‧‧‧頂壁
31b‧‧‧側壁
31c‧‧‧後壁
31d‧‧‧底壁
32‧‧‧前部
32a‧‧‧EMI墊片
34a‧‧‧後開孔
38‧‧‧肩部
40‧‧‧薄片體陣列
41‧‧‧薄片體
42‧‧‧尾部
44‧‧‧接觸部
45‧‧‧差分對
5‧‧‧電路板
50‧‧‧基座
52‧‧‧空氣通道
54‧‧‧後支撐部
60‧‧‧突部
60a‧‧‧前端
62‧‧‧卡槽
65‧‧‧長肋部
67‧‧‧短肋部
68‧‧‧施壓元件
69‧‧‧凹部
70‧‧‧中間壁
72‧‧‧中間陣列
72a、72b、72c‧‧‧開孔
73‧‧‧切缺部
90‧‧‧插頭組件
91‧‧‧扣持件
92‧‧‧本體
92a‧‧‧端
93‧‧‧線纜
94‧‧‧表面
95‧‧‧板卡
95a‧‧‧緣部
96‧‧‧冷卻槽
97‧‧‧墊
本申請通過舉例示出但不受限於附圖，在附圖 中類似的附圖標記表示類似的部件，而且在附圖中：圖1示出一插座組件對接一插頭組件的一實施例的一立體圖；圖2示出圖1中所示的實施例的一立體圖，其中一個插頭組件處於脫離對接的狀態；圖3示出圖1中所示的實施例的另一立體圖，其中一個插頭組件被省略；圖4示出圖3所示的實施例的一部分分解立體圖；圖5示出圖3所示的實施例的一前視圖；圖6示出沿圖2的線6-6剖開的一側視圖；圖7示出圖6所示的實施例的一立體圖；圖8示出圖7所示的實施例的一簡化的立體圖；圖9示出圖9所示的實施例的一部分分解立體圖；圖10示出圖9所示的實施例的另一立體圖；圖11示出圖8所示的實施例的另一立體圖；圖12示出圖2所示的實施例的一放大立體圖；圖13示出沿圖2的線13-13剖開的一立體圖；圖14示出沿圖2的線14-14剖開的一立體圖；圖15示出沿2的線14-14剖開的一立體圖；圖16A示出一插座組件的另一實施例的一立體圖；圖16B示出圖16A所示的實施例的一放大立體圖；圖17A示出沿圖16A的線17-17剖開的一立體圖；圖17B示出圖17A所示的實施例的一前視圖；圖18示出沿圖2的線18-18剖開的一立體圖； 圖19示出圖18所示的實施例的一簡化前視圖；圖20示出一插座組件的一實施例的一部分立體圖；圖21示出圖20所示的實施例的另一立體圖；及圖22示出圖20所示的實施例的另一立體圖。
下面具體的說明描述多個示範性實施例且不意欲限制到明確公開的組合。因此，除非另有說明，本文所公開的各種特徵可以組合在一起而形成出於簡明目的而未示出的多個另外組合。此外，所描述的特徵可以單獨使用，也可以與其他描述的多個特徵的子集組合使用，以提供適於相應應用的功能。因此，除非另有說明，所描述的實施例不意欲是限制。
參照附圖，一插座組件10安裝在一電路板5上。所述插座組件包括一罩體30以及多個埠12，所述多個埠12構造成收容插頭組件90。
如已知的，一插頭組件可包括連接於一本體92的一線纜93且所示出的實施例包括一扣持件91，扣持件91設置成允許一扣持系統可脫離地接合插座組件10。一插頭組件的替代實施例可包括不使一線纜與其連接的一本體(諸如針對能插入插頭組件中的光學連接器提供的實施例)。本體92保護能使多個墊以一0.65mm或0.60mm的間距設置的一板卡95，且板卡95是插頭組件90與插座組件10之間的連接介面的一部分。所示出的本體92包括一表面94，表面94包括多個冷卻槽96，所述多個冷卻槽96 延伸於將插入埠12中的所述本體的大部分長度，且在一實施例中所述多個冷卻槽96沿上表面延伸到超過突部60的前端60a的一端92a。當插頭組件90插入埠12中時，所述多個冷卻槽96允許空氣流動穿過埠12，且與現有設計相比顯著提高了冷卻效率，因為空氣流能直接冷卻插頭組件90。
插座組件10包括一頂壁31a、兩個側壁31b以 及一後壁31c。一底壁31d也能設置成提高屏蔽性能。一基座50設置於所述罩體內並支撐一薄片體陣列40。基座50包括一突部60且一卡槽62設置於突部60。卡槽62包括一施壓元件68，施壓元件68構造成接合板卡95並朝向卡槽62的一側對板卡95施壓。此容許控制讓板卡95與所述卡槽面對面並消除一定範圍內的與板卡95上的多個墊的位置與設置在卡槽62內的多個接觸部的位置關聯的公差。可由絕緣樹脂製成的基座50還包括另外冷卻的空氣通道52，且具有扣持在基座50上並有助將薄片體陣列40固定就位的一後支撐部54。
如已知的，薄片體陣列40包括多個薄片體 41，且各薄片體41支撐多個端子，各端子具有一尾部42以及一接觸部44。所述多個接觸部44設置在卡槽62內且典型地佈置成一些接觸部設置在卡槽62相反的兩側。為了提高性能，短肋部67將形成一差分對45的信號端子隔開，而長肋部設置在信號端子與相應的接地端子之間。因為所述多個接觸部44以一單排按一恒定間距設置，所以短 肋部67提供了信號端子之間的電隔離和保護，而與信號端子相關的介電常數相比，長肋部65增加了信號端子與接地端子之間的介電常數(dielectric constant)，以提供差分對之間的優選的耦合(例如，儘管所述多個端子為一恒定間距，但是與對稱連接相比，差分耦合能夠承載更多的能量)。換言之，肋部65、肋部67形成有助保護接觸部44的溝槽且信號端子與形成在卡槽62中的凹部69對齊，凹部69有助降低信號端子的接觸部附近的介電常數。
所述罩體包括能為罩體30的其他部分提供結構 支撐的一前部32，且前部32可包括從底壁31d延伸的肩部38，能夠支撐設置於所述埠內的EMI墊片32a以助使EMI輻射最小化。光導管29(因為它們通常是透光的，所以它們在圖中示出為透明的)可被設置且典型地將設置為將光從所述支撐電路板朝向前面11a引導，前面11a通常在所述兩個埠之間。
為了有助限定埠12，設置一中央支撐件21。中 央支撐件21由受兩個側壁31b支撐且形成有一頂壁21a和一底壁21b以分別用於限定一埠的底部或一埠的頂部。一中央通道26由中央支撐件21限定。頂壁21a和底壁21b均具有凹槽23，以進一步允許空氣流進入埠12。一插件15可設置於中央支撐件21。插件15包括具有多個前開孔16a的一前壁16，所述多個前開孔16a允許空氣流動穿過前壁16，且插件15進一步允許採用多個光導管來照亮相應的區域的多個指示器。
所述插座組件還包括一中間壁70，中間壁70 具有由多個中間開孔72a形成的中間陣列72，且還包括設置在上部的埠12處的多個開孔72b且包括設置在下部的埠12處的開孔72c。開孔72a、72b、72c允許空氣流過中間壁70，同時依然提供所需的EMI保護。中間壁70具有多個切缺部73，所述多個切缺部73允許所述多個光導管29延伸通過中間壁70。由此，所示出的設計允許採用多個光導管同時依然提供改進的冷卻能力。
多個後開孔34a允許空氣流動通過後壁31c。基 座50設計成在基座50的側面存在有足夠的空間，從而空氣能從中間壁70流動到後壁31c。由此，如能夠認識到的，插座組件10設置成允許大量的空氣從前面11a流動到後面11b(或以相反的方向)。具體地，如果空氣從前面11a流動到後面11b，那麼插件15設置成允許空氣流動通過前壁16，空氣流動通過中央通道26、然後流動通過中間壁70、流動通過基座50以及最後從後壁31c流出。
如能夠認識到的，一卡槽在所示出的實施例中 公開為以0.6mm或0.65mm的間距設置多個端子。為了提供必要的公差，一施壓元件68設置於所述卡槽內，且施壓元件68有助確保所述板卡的一側的位置為已知的(一側被壓靠在所述卡槽的一側上)。這減少了公差累積，從而一0.6mm間距的插座組件對於採用一常規的板卡為基礎的插頭組件而言是可行的。與現有設計相比，這在對整個插頭組件施壓上提供了進一步的改進，因為已確定的是，板卡 95在插頭組件90內的位置的公差累積存在可能性。然而，所描述的實施例消除了公差累積的形成，因為板卡95的緣部95a變成一基準點。如果板卡95的緣部95a與設置於板卡95的多個墊97對準，那麼所述公差能被進一步得到改善。另外，用於形成板卡的標準構造技術會導致公差累積，這會妨礙0.6mm間距的端子以可靠的方式工作。
應注意的是，如果多個端子以更大的間距(諸 如0.7mm或更大)設置，那麼所述施壓元件可以省略。所述插座組件的設計在小型封裝中依然能夠提供所需的冷卻性能，且不管端子間距的大小如何，冷卻用特徵均能結合到插座組件中。
在任何情況下，所述插頭組件無需設置多個冷卻槽。例如，如果插頭組件是一被動部件，那麼它幾乎沒有對冷卻的需求，所以所述多個冷卻槽可以忽略。
本文給出的申請以其優選實施例及示範性實施例說明了各個特徵。本領域技術人員在閱讀本申請後將作出落入隨附申請專利範圍和精神內的許多其他的實施例、修改、以及變形。
10‧‧‧插座組件
30‧‧‧罩體
5‧‧‧電路板
90‧‧‧插頭組件
92‧‧‧本體
93‧‧‧線纜

Claims (14)

  1. 一種插座組件，包括：一罩體，包括一前面、一後面、一第一埠、一第二埠以及位於所述兩個埠之間的一中央通道；及一基座，設置於所述罩體內，所述基座具有與所述第一埠對準的一第一卡槽以及與所述第二埠對準的一第二卡槽；其中，所述罩體和所述基座設置成允許空氣從前面流到後壁，空氣通過所述中央通道。
  2. 如請求項1所述的插座組件，其中，所述第一卡槽包括以約0.6mm和0.65mm之間的一間距設置的多個端子，所述卡槽包括位於一側的一施壓元件。
  3. 如請求項1所述的插座組件，其中，所述基座支撐多個光導管。
  4. 如請求項1所述的插座組件，還包括一中間壁，所述中間壁具有允許空氣流動通過所述中間壁的多個開孔。
  5. 一種插頭組件，包含：一本體，包括一頂表面以及一底表面，所述本體由一導熱材料製成；以及一板卡，設置於所述本體內，所述板卡朝向所述插頭組件的一前端延伸，所述板卡具有以一0.6mm的間距設置的多個接觸墊；其中，所述多個墊與所述板卡的一側對準。
  6. 如請求項3所述的插頭組件，其中，所述頂表面和所述 底表面的其中之一具有沿所述插頭組件的長度延伸的多個凹槽。
  7. 一種連接器系統，包括：一插座組件，具有限定一埠的一罩體以及設置在所述罩體內的一基座，所述罩體具有一後壁，且所述基座具有與所述埠對準的一卡槽，所述卡槽具有使接觸部設置於所述卡槽內的多個端子，所述多個接觸部成排設置且以0.59mm到0.66mm之間的一間距設置，所述卡槽具有設置在所述卡槽的一第一側的一施壓元件；及一插頭組件，設置於所述埠內，所述插頭組件包括一本體以及一板卡，所述板卡具有與所述多個接觸部接合的多個墊，所述板卡具有被壓靠到所述卡槽的一第二側的一緣部，所述第一側與所述第二側相對。
  8. 如請求項7所述的連接器系統，其中，所述插座組件為一堆疊連接器，且所述埠為一第一埠，所述插座組件還包括豎向設置在所述第一埠之上的一第二埠，所述基座還支撐與所述第二埠對準的一第二卡槽，所述第二卡槽具有位於所述卡槽的一第一側的一施壓元件。
  9. 如請求項8所述的連接器系統，其中，所述插座組件包括一前面、一後面以及位於所述前面和所述後面之間的一中間壁，所述中間壁具有允許空氣穿過所述中間壁的多個開孔，所述插座組件還包括一中央通道，所述中央通道設置成允許空氣從所述前面流動到所述中間壁。
  10. 如請求項9所述的連接器系統，其中，所述插座組件包 括一插件，所述插件設置於所述前面處的所述中央通道中，且所述插件包括允許空氣流動穿過所述插件進入到所述中央通道中的多個開孔。
  11. 如請求項10所述的連接器系統，其中，所述基座與所述罩體間隔開，從而空氣能在所述基座與所述罩體之間的一空間中從所述中間壁流動到所述後壁。
  12. 如請求項11所述的連接器系統，其中，所述中間壁包括與所述第一埠及所述第二埠對準的多個開孔，且所述多個開孔設置成允許空氣流動穿過所述兩個埠以流動通過所述多個開孔。
  13. 如請求項7至12任一項所述的連接器系統，其中，所述多個墊與所述板卡的所述緣部對準。
  14. 如請求項7至13任一項所述的連接器系統，其中，所述插頭組件包括在所述本體上的一第一表面，且所述第一表面包括多個冷卻槽，所述多個冷卻槽設置成在所述插頭組件設置在所述埠中時允許空氣流動通過所述埠。
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US10374372B2 (en) 2019-08-06
CN106936034B (zh) 2019-06-07
JP2017510031A (ja) 2017-04-06
EP3123572A4 (en) 2017-12-20
TWI584533B (zh) 2017-05-21
JP6479840B2 (ja) 2019-03-06
TWI675513B (zh) 2019-10-21
US10797451B2 (en) 2020-10-06
CN106134013A (zh) 2016-11-16
WO2015148786A1 (en) 2015-10-01
CN106936034A (zh) 2017-07-07
TW201740626A (zh) 2017-11-16
US9960553B2 (en) 2018-05-01
EP3123572B1 (en) 2022-07-20
CN106134013B (zh) 2019-05-07
EP3123572A1 (en) 2017-02-01
US20170005446A1 (en) 2017-01-05
US20190356093A1 (en) 2019-11-21
US20180248324A1 (en) 2018-08-30

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