TW201606884A - Package substrate manufacturing method and package substrate - Google Patents

Abstract

The present invention provides a package substrate manufacturing method and a package substrate. The package substrate manufacturing method is used for packaging a first substrate and a second substrate. The package substrate manufacturing method comprises steps: coating a first plastic material on the first side of the first substrate; solidifying the first plastic material; coating a second plastic material on the second side of the second substrate and incompletely solidifying the second plastic material; making the first side of the first substrate is faced to the second side of the second substrate, making the first plastic material aligns to the second plastic material, and laminating the first substrate and the second substrate; and solidifying the second plastic material.

Description

Package substrate manufacturing method and package substrate

The invention relates to a method for manufacturing a package substrate and a package substrate.

At present, the glass substrate package using the glue material generally includes the following steps: 1. The glue material 10 is coated on the first substrate 1 (as shown in FIG. 1); 2. The second substrate 2 is aligned with the first substrate 1 (FIG. 2). 3. After the second substrate 2 is pressed against the first substrate 1, the glue 10 is cured between the two (see FIG. 3).

As shown in FIG. 3, the second substrate 2 and the first substrate 1 are only dependent on the top surface A of the adhesive material 10, the bonding area is small, and the surface A is likely to have defects such as unevenness, thereby causing unsatisfactory pressing and packaging. And for a long time, water and oxygen are easily incorporated from the surface A and the first substrate 1, resulting in equipment damage.

Therefore, it is necessary to improve the package structure and process to improve the bonding of the package substrate.

The above information disclosed in the Background section is only for enhancement of understanding of the background of the invention, and thus it may include information that does not constitute the prior art known to those of ordinary skill in the art.

The invention discloses a method for manufacturing a package substrate and a package substrate to improve the bonding property of the package substrate and prevent water, oxygen and the like from being incorporated into the package substrate.

The additional aspects and advantages of the present invention will be set forth in part in the description which follows in

According to an aspect of the invention, a package substrate manufacturing method is used for packaging a first substrate and a second substrate, the method comprising the steps of: coating a first glue on a first side of the first substrate; and making the first glue Curing; coating a second adhesive on the second side of the second substrate to incompletely cure the second adhesive; facing the first side of the first substrate toward the second side of the second substrate, the first adhesive The material is aligned with the second rubber material, and the first substrate and the second substrate are pressed together; and the second rubber material is cured.

According to another aspect of the present invention, a package substrate includes: a first substrate having a first side having a first adhesive material; and a second substrate having a second side having a second adhesive material, the second adhesive material and the second adhesive material The first adhesive material is aligned, the first substrate is pressed against the second substrate, and the second adhesive material covers at least a portion of the first adhesive material.

Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be embodied in a variety of forms and should not be construed as being limited to the embodiments set forth herein. Those skilled in the art. In the figures, the thickness of the regions and layers are exaggerated for clarity. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are set forth However, those skilled in the art will appreciate that the technical solution of the present invention may be practiced without one or more of the specific details, or other methods, components, materials, and the like may be employed. In other instances, well-known structures, materials or operations are not shown or described in detail to avoid obscuring aspects of the invention.

The present invention provides a package substrate manufacturing method 3 for packaging a first substrate 1 and a second substrate 2. Referring to FIGS. 4-6, the method 3 includes the following steps: Step 300: Coating on the first side 11 of the first substrate 1. a first rubber material H1; step 301: curing the first rubber material H1; step 302: coating the second rubber material H2 on the second side 21 of the second substrate 2, so that the second rubber material H2 is not completely cured (see FIG. 5). Step 303: facing the first side 11 of the first substrate 1 toward the second side 21 of the second substrate 2, aligning the first adhesive material H1 with the second adhesive material H2, and pressing the first substrate 1 and the first substrate Two substrates 2; and step 304: curing the second glue H2 (see Fig. 6).

Among them, the first rubber material H1 and the second rubber material H2 are selected from UV glue, and are cured by UV, or Frit glue is used, and heat curing is adopted. Of course, the type and curing method of the rubber material are not limited to this.

Wherein, in the step 302, the second rubber material H2 is semi-cured. Therefore, in the process of pressing the first substrate 1 and the second substrate 2, the second rubber material H2 can coat the first rubber material H1 to a greater extent, increasing the bonding area.

In the step 303, after the first substrate and the second substrate are pressed together, the second adhesive completely covers the first adhesive material, thereby maximizing the bonding area.

In the step 304, in the process of curing the second rubber material, the first rubber material is secondarily cured, so that the strength of the first rubber material is increased, and the stability of the package is improved.

The first glue is located around the first side of the first substrate. The second glue is located around the second side of the second substrate. That is, the first rubber material and the second rubber material tightly bond the first substrate and the first substrate.

The present invention also provides a package substrate formed by the above packaging method, the structure of which is shown in FIG. Since the method of packaging the substrate of the present invention is to align the cured first rubber material H1 with the second rubber material H2 that is not completely cured, the second glue is pressed in the process of pressing the first substrate 1 and the second substrate 2 The material H2 will cover at least a portion of the first rubber material H1, so that the bonding area of the first substrate 1 and the second substrate 2 is increased, and the bonding property is strong, thereby overcoming the small bonding surface of the existing packaging rubber material, and the surface is uneven, and the surface is not easy. This causes problems such as poor packaging, so it can effectively prevent water and oxygen from invading the substrate and improve the life of the panel. Further, by the cooperation of the first rubber material H1 and the second rubber material H2, the stability of the substrate package can be improved. In addition, the cured first rubber material H1 is aligned with the second rubber material H2 which is not completely cured, and the cured first rubber material H1 can also support the substrate to prevent sloshing during the pressing process. The offset and the element between the first and second substrates are prevented from being squeezed, and other supporting members can be omitted, so that the structure and the process can be simplified.

The exemplary embodiments of the present invention have been particularly shown and described above. It is to be understood that the invention is not limited to the disclosed embodiments, and the invention is intended to cover various modifications and equivalent arrangements.

1‧‧‧First substrate
10‧‧‧Stained materials
11‧‧‧ first side
2‧‧‧second substrate
21‧‧‧ second side
H1‧‧‧First glue
H2‧‧‧Second rubber
A‧‧‧ surface
3‧‧‧Package substrate manufacturing method
300‧‧‧Steps
301‧‧‧Steps
302‧‧‧Steps
303‧‧ steps
304‧‧‧Steps

The above and other features and advantages of the present invention will become more apparent from the detailed description of the exemplary embodiments. 1 to 3 show schematic views of a substrate package using an existing packaging method. 4 is a flow chart of a method of manufacturing a package substrate of the present invention. 5 to 6 are schematic views showing the substrate package by the package substrate manufacturing method of the present invention.

H1‧‧‧First glue

H2‧‧‧Second rubber

Claims (10)

A package substrate manufacturing method for packaging a first substrate and a second substrate, the method comprising the steps of: coating a first glue on a first side of the first substrate; curing the first glue; Applying a second adhesive to the second side of the substrate to prevent the second adhesive from being completely cured; facing the first side of the first substrate toward the second side of the second substrate, the first adhesive and the second adhesive Aligning and pressing the first substrate and the second substrate; and curing the second glue. The method of claim 1, wherein the second adhesive is semi-cured in the step of incompletely curing the second adhesive. The method of claim 1, wherein the second adhesive material covers at least a portion of the first adhesive material after the first substrate and the second substrate are pressed together. The method of claim 3, wherein after the first substrate and the second substrate are pressed, the second adhesive completely covers the first adhesive. The method of claim 1, wherein the first adhesive is re-cured during the curing step. A package substrate comprising: a first substrate having a first rubber material on a first side thereof; and a second substrate having a second rubber material on a second side thereof, the second rubber material being aligned with the first rubber material, The first substrate is pressed against the second substrate, wherein the second rubber material covers at least a portion of the first rubber material. The package substrate of claim 6, wherein the second adhesive material covers at least a portion of the first adhesive material. The package substrate of claim 7, wherein the second glue completely covers the first glue. The package substrate of claim 6, wherein the first glue is located around the first side of the first substrate. The package substrate of claim 6, wherein the second glue is located around the second side of the second substrate.