CN114673721B - Manufacturing method of spliced display device and spliced display device - Google Patents
Manufacturing method of spliced display device and spliced display device Download PDFInfo
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- CN114673721B CN114673721B CN202210260086.6A CN202210260086A CN114673721B CN 114673721 B CN114673721 B CN 114673721B CN 202210260086 A CN202210260086 A CN 202210260086A CN 114673721 B CN114673721 B CN 114673721B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 374
- 239000000853 adhesive Substances 0.000 claims abstract description 69
- 230000001070 adhesive effect Effects 0.000 claims abstract description 69
- 238000003825 pressing Methods 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims description 51
- 239000000463 material Substances 0.000 claims description 39
- 238000003475 lamination Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 9
- 238000001125 extrusion Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000000016 photochemical curing Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the application discloses a manufacturing method of a spliced display device and the spliced display device, wherein a first glue column and a second glue column are formed on a mother board or a daughter board, and the height of the first glue column is larger than that of the second glue column; and pressing the mother board and the daughter board, so that the daughter board is adhered to the mother board through the first adhesive column and the second adhesive column, and the thickness uniformity and the accuracy of the lamination gap between the daughter board and the mother board can be kept.
Description
Technical Field
The application relates to the field of display, in particular to a manufacturing method of a spliced display device and the spliced display device.
Background
In recent years, display technology has been rapidly developed, and as the pixel size is continuously reduced, application scenes have become wide. Gradually develop from the original indoor and outdoor large-scale long-distance advertisement screen to the indoor and outdoor short-distance high-definition display screen. Currently, large screen display mainly adopts a splicing display technology, namely, small-size sub-boards are spliced into a large screen with any size.
In the technology of tiled display, the connection between the daughter board and the motherboard is generally realized through glue materials, and when the daughter board is attached to the motherboard, the gap between the daughter board and the motherboard is difficult to control due to factors such as material warpage, mechanical pressing errors and the like, and the uniformity and the accuracy of the gap between the daughter board and the motherboard are poor, so that the daughter board may incline to a certain extent, causing the following problems:
(1) The seamless splicing of the sub-boards is affected;
(2) Influence the display effect of the daughter board;
(3) Affecting product reliability.
Therefore, a solution for solving the above technical problems is needed.
Disclosure of Invention
The embodiment of the application provides a manufacturing method of a spliced display device and the spliced display device, which can solve the technical problems of poor uniformity and accuracy of a gap between a daughter board and a mother board after the daughter board is attached to the mother board.
The embodiment of the application provides a manufacturing method of a spliced display device, which comprises the following steps:
step B1, providing a mother board and a daughter board;
step B2, forming a first glue column and a second glue column on the mother board or the daughter board, wherein the height of the first glue column is larger than that of the second glue column;
and B3, performing lamination treatment on the mother board and the daughter board, so that the daughter board is adhered to the mother board through the first adhesive column and the second adhesive column.
Optionally, in some embodiments of the present application, in the step B2, the number of the second glue strings is greater than the number of the first glue strings.
Optionally, in some embodiments of the present application, in the step B2, the first glue string has a first height, and the second glue string has a second height, and the first height is greater than the second height;
the step B3 comprises the following steps:
step B31, pre-pressing the mother board and the daughter board, wherein the first glue column is compressed from the first height to the second height;
and B32, carrying out main pressing treatment on the mother board and the daughter board, wherein the first glue column and the second glue column are compressed from the second height to the third height, and the third height is smaller than the second height.
Optionally, in some embodiments of the present application, in the step B31, when the first glue column is at the first height, a pressure of performing the pre-pressing treatment on the motherboard and the daughter board is a first pressure; when the first glue column and the second glue column are at a second height, the pressure for carrying out main pressing treatment on the mother board and the daughter board is a second pressure, and the second pressure is larger than the first pressure;
in the step B32, when the first glue column and the second glue column are at the third height, the pressure for performing the main pressing process on the mother board and the daughter board is a third pressure, and the third pressure is greater than the second pressure.
Optionally, in some embodiments of the present application, in the step B31, during the process of compressing the first glue column from the first height to the second height, a pressure of performing the pre-pressing treatment on the motherboard and the daughter board gradually increases from the first pressure to the second pressure.
Optionally, in some embodiments of the present application, in the step B32, during the process of compressing the first glue column and the second glue column from the second height to the third height, the pressure of the main pressing process performed on the motherboard and the daughter board gradually increases from the second pressure to the third pressure.
Optionally, in some embodiments of the present application, in the step B1, the motherboard is provided with a first conductive portion, and the daughter board is provided with a second conductive portion;
the step B2 further includes: forming conductive adhesive on the first conductive part of the motherboard or the second conductive part of the daughter board, wherein the height of the conductive adhesive is smaller than that of the second adhesive column;
in the step B3, after the mother board and the daughter board are pressed, the first conductive portion is electrically connected to the second conductive portion through the conductive adhesive.
The embodiment of the application also provides a spliced display device, which comprises:
a motherboard;
the daughter board is arranged opposite to the mother board;
the first glue column is arranged between the mother board and the daughter board, and the mother board and the daughter board are bonded together through the first glue column; and
the second glue column is arranged between the mother board and the daughter board, and the mother board and the daughter board are bonded together through the second glue column;
the bonding strength of the portion, bonded by the first adhesive column, between the mother board and the daughter board is greater than that of the portion, bonded by the second adhesive column, between the mother board and the daughter board.
Optionally, in some embodiments of the present application, the number of the second glue strings is greater than the number of the first glue strings.
Optionally, in some embodiments of the present application, a difference in height between two of the plurality of first glue strings and the plurality of second glue strings is less than or equal to 15 microns.
Optionally, in some embodiments of the present application, the bonding area of the first glue string is larger than the bonding area of the second glue string.
Optionally, in some embodiments of the present application, the motherboard is provided with a first conductive portion, and the daughter board is provided with a second conductive portion;
the spliced display device further comprises conductive adhesive arranged between the first conductive part and the second conductive part, and the first conductive part is electrically connected with the second conductive part through the conductive adhesive.
The embodiment of the application adopts a manufacturing method of a spliced display device and the spliced display device, and a first glue column and a second glue column are formed on a mother board or a daughter board, wherein the height of the first glue column is larger than that of the second glue column; in the pressing process of the mother board and the daughter board, the first glue column is compressed first, when the first glue column is compressed to be at the same height as the second glue column, the second glue column can play a role in buffering, the situation that part of the first glue column is excessively extruded due to the height deviation is avoided, the mother board and the daughter board are continuously pressed, the daughter board is adhered to the mother board through the first glue column and the second glue column, and the thickness uniformity and the accuracy of an attaching gap between the daughter board and the mother board are effectively maintained.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flow chart of a method for manufacturing a tiled display device according to an embodiment of the present application;
fig. 2 is a schematic plan view of a tiled display device according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a pre-pressing process for a motherboard and a daughter board according to an embodiment of the present application;
fig. 4 is a schematic structural diagram II of pre-pressing the mother board and the daughter board according to the embodiment of the present application;
fig. 5 is a schematic structural diagram of a main pressing process for a motherboard and a daughter board according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and description only, and is not intended to limit the application. In the present application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
The embodiment of the application provides a manufacturing method of a spliced display device and the spliced display device. The following will describe in detail. The following description of the embodiments is not intended to limit the preferred embodiments.
Referring to fig. 1 and 2, an embodiment of the present application provides a method for manufacturing a tiled display device, in which a plurality of sub-boards 20 are fixed on a motherboard 10, so that the plurality of sub-boards 20 are tiled together to realize a large-screen display. In the embodiment of the present application, the sub-board 20 may be a display device, specifically, a liquid crystal display panel, a light emitting diode display panel, an organic light emitting diode display panel, or other display devices, which is not limited herein.
Specifically, the manufacturing method of the spliced display device comprises the following steps:
step B1, as shown in fig. 2 and 3, providing a motherboard 10 and a daughter board 20;
step B2, as shown in fig. 3, forming a first glue column 30 and a second glue column 40 on the motherboard 10 or the daughter board 20, wherein the height of the first glue column 30 is greater than the height of the second glue column 40; wherein the first glue string 30 and the second glue string 40 may be formed by dispensing or ink-jet printing;
step B3, as shown in fig. 3 to 5, the motherboard 10 and the daughter board 20 are subjected to a lamination process, so that the daughter board 20 is adhered to the motherboard 10 through the first adhesive column 30 and the second adhesive column 40.
In the manufacturing method of the tiled display device of the embodiment of the application, by forming the first glue column 30 and the second glue column 40 on the motherboard 10 or the daughter board 20, the height of the first glue column 30 is larger than the height of the second glue column 40, as shown in fig. 3 and fig. 4, in the process of pressing the motherboard 10 and the daughter board 20, the first glue column 30 is compressed first, and when the first glue column 30 is compressed to the same height as the second glue column 40, the second glue column 40 can play a role of buffering, so as to avoid the situation that part of the first glue column 30 is excessively extruded due to the height deviation; as shown in fig. 5, the subsequent pressing process is performed on the motherboard 10 and the daughter board 20, so that the daughter board 20 is adhered to the motherboard 10 through the first adhesive column 30 and the second adhesive column 40, so that the thickness uniformity and accuracy of the lamination gap between the daughter board 20 and the motherboard 10 are effectively maintained, the seamless splicing of the daughter board 20 and the daughter board 20 is facilitated, the seamless large screen display effect is realized, and the reliability of the product is greatly improved.
It should be noted that in the tiled display device manufactured in this embodiment of the present application, the height of the first glue column 30 is greater than the height of the second glue column 40, and the first glue column 30 is extruded in the whole process during the whole lamination process, that is, the first glue column 30 can be fully extruded, and the first glue column 30 can better fill the surface pits of the daughter board 20 and the motherboard 10, so that the first glue column 30 can better combine with the daughter board 20 and the motherboard 10, and therefore, the bonding strength of the portion between the daughter board 20 and the motherboard 10 bonded by the first glue column 30 is high, and the daughter board 20 can be stably fixed on the motherboard 10. The second glue column 40 has a smaller height, and in the whole pressing process, when the first glue column 30 is compressed to the same height as the second glue column 40, the second glue column 40 starts to be extruded, so that the extrusion of the second glue column 40 is insufficient relative to the first glue column 30, and the bonding strength of the portion bonded by the second glue column 40 between the daughter board 20 and the mother board 10 is slightly lower, so that the bonding strength of the portion bonded by the first glue column 30 between the daughter board 20 and the mother board 10 is greater than the bonding strength of the portion bonded by the second glue column 40 between the daughter board 20 and the mother board 10.
Specifically, as shown in fig. 2, the cross-sectional shapes of the first glue string 30 and the second glue string 40 may be, but not limited to, circular, oval, triangular, rectangular or other shapes, and the cross-sectional shapes of the first glue string 30 and the second glue string 40 may be appropriately modified according to the actual situation and the specific requirements, which is not limited herein.
Specifically, the materials of the first glue column 30 and the second glue column 40 may be thermosetting glue or photo-curing glue. When the materials of the first glue column 30 and the second glue column 40 are photo-curing glue, the materials of the first glue column 30 and the second glue column 40 can be acrylic resin or organosilicon OCR (Optical Clear Resin) glue; when the material of the first glue string 30 and the second glue string 40 is thermosetting glue, the material of the first glue string 30 and the second glue string 40 may be acrylic OCR (Optical Clear Resin) glue. Of course, the materials of the first glue string 30 and the second glue string 40 may be modified appropriately according to the actual situation and the specific requirement, which is not limited herein. In the present embodiment, the first glue string 30 and the second glue string 40 are made of the same material.
Specifically, as shown in fig. 2 and 3, in the above step B2, the first glue string 30 may be formed on the daughter board 20, and of course, the first glue string 30 may also be formed on the motherboard 10 according to the actual selection and specific requirements, or the first glue string 30 may be provided in such a way that a part of the first glue string 30 is formed on the daughter board 20 and a part of the first glue string 30 is formed on the motherboard 10, which is not limited herein.
Specifically, as shown in fig. 2 and 3, in the above step B2, the second glue string 40 may be formed on the daughter board 20, and of course, the second glue string 40 may also be formed on the motherboard 10 according to the actual selection and specific requirements, or the second glue string 40 may be provided in a manner that a part of the second glue string 40 is formed on the daughter board 20 and a part of the second glue string 40 is formed on the motherboard 10, which is not limited herein.
Specifically, as shown in fig. 2 and 3, in the above step B2, the number of the first glue strings 30 is greater than or equal to four, for example, four, five, six or more first glue strings 30 are provided between the daughter board 20 and the motherboard 10. With this arrangement, it is possible to secure sufficient first glue pillars 30 between the motherboard 10 and the daughter board 20, thereby securing adhesive strength between the daughter board 20 and the motherboard 10.
Specifically, as shown in fig. 2 and 3, in the above step B2, the number of the second glue strings 40 is greater than the number of the first glue strings 30. Under this setting, can guarantee to have enough second glue material post 40 in order to play the cushioning effect, can improve the cushioning effect greatly, effectively avoid partial first glue material post 30 to be taken place because the condition of high deviation by excessive extrusion is favorable to keeping the thickness homogeneity and the accuracy in laminating clearance between daughter board 20 and mother board 10.
Specifically, as shown in fig. 2 and 3, in the step B2, the plurality of first glue pillars 30 are uniformly distributed on one side surface of the daughter board 20, that is, the spacing between two adjacent first glue pillars 30 is the same. In the subsequent pressing process of the daughter board 20 and the mother board 10, when the height of the first glue column 30 is greater than that of the second glue column 40, the daughter board 20 and the mother board 10 are mainly supported by the first glue column 30, and the plurality of first glue columns 30 are uniformly distributed on one side surface of the daughter board 20, so that the uniformity of a gap between the daughter board 20 and the mother board 10 is guaranteed in the pressing process, and the situation that part of the first glue columns 30 are excessively extruded is avoided. In this embodiment, the plurality of first glue strings 30 may be, but is not limited to be, arranged in an array.
Specifically, as shown in fig. 2 and 3, in the step B2, at least one second glue string 40 is disposed between two adjacent first glue strings 30. So set up, in follow-up to carrying out pressfitting processing in to daughter board 20 and mother board 10, when the height of first glue material post 30 equals the height of second glue material post 40, the second glue material post 40 between two adjacent first glue material posts 30 can play the cushioning effect, is favorable to guaranteeing the homogeneity in the clearance between daughter board 20 and the mother board 10 in pressfitting process, avoids partial first glue material post 30 to be excessively extruded the condition emergence.
Specifically, as shown in fig. 2 and 3, in the step B2, the plurality of first glue strings 30 and the plurality of second glue strings 40 are distributed in an array, that is, the plurality of first glue strings 30 and the plurality of second glue strings 40 are distributed in the same array, and the plurality of first glue strings 30 and the plurality of second glue strings 40 are arranged in a manner of M rows×n columns, wherein M, N satisfies the following conditions:
M×N≥9。
for example, as shown in fig. 2, a plurality of first glue strings 30 and a plurality of second glue strings 40 are arranged in a manner of 3 rows×6 columns, wherein, the 1 st row and the 3 rd row are provided with three first glue strings 30 and two second glue strings 40, the first glue strings 30 and the second glue strings 40 are staggered, and one second glue string 40 is arranged between two adjacent first glue strings 30; and 6 glue columns are arranged on the 2 nd row.
Specifically, as shown in fig. 2 and 3, in the step B2, the first glue string 30 has a first height H1, and the second glue string 40 has a second height H2, and the first height H1 is greater than the second height H2. The step B3 specifically includes:
step B31, as shown in fig. 3 and 4, performing pre-press bonding treatment on the motherboard 10 and the daughter board 20, and compressing the first glue column 30 from the first height H1 to the second height H2;
in step B32, as shown in fig. 4 and 5, the motherboard 10 and the daughter board 20 are subjected to a main lamination process, and the first glue column 30 and the second glue column 40 are compressed from the second height H2 to a third height H3, where the third height H3 is smaller than the second height H2. In the main pressing process of the motherboard 10 and the daughter board 20, the second glue column 40 just contacts with the daughter board 20 and the motherboard 10 at the same time, and at this time, the second glue column 40 can play a role of buffering, which is beneficial to ensuring the uniformity of the gap between the daughter board 20 and the motherboard 10 in the pressing process, and avoiding the occurrence of the situation that part of the first glue column 30 is excessively extruded.
Specifically, in the above step B31, as the height of the first glue string 30 gradually decreases, the resistance to the pre-press-fit process of the motherboard 10 and the daughter board 20 gradually increases, and therefore, the pressure of the pre-press-fit process of the motherboard 10 and the daughter board 20 needs to be greater than the resistance to press the first glue string 30. Also, in the above step B32, as the height of the first glue string 30 is gradually reduced, the resistance to the main pressing process of the motherboard 10 and the daughter board 20 is gradually increased, and thus, the pressure of the main pressing process of the motherboard 10 and the daughter board 20 needs to be greater than the resistance to press the first glue string 30 and the second glue string 40.
Specifically, in the above step B31, as shown in fig. 3, when the first glue column 30 is at the first height H1, the pressure for performing the pre-pressing treatment on the motherboard 10 and the daughter board 20 is the first pressure F1; as shown in fig. 4, when the first glue column 30 and the second glue column 40 are at the second height H2, the pressure for performing the main pressing process on the motherboard 10 and the daughter board 20 is the second pressure F2. The pre-press-fit processing of the mother board 10 and the daughter board 20 in the step B31 is only used for pressing the first glue string 30, the main press-fit processing of the mother board 10 and the daughter board 20 in the step B32 is used for pressing the first glue string 30 and the second glue string 40, and the deformation resistance of the first glue string 30 and the second glue string 40 to be overcome in the step B32 is relatively large, so that the second pressure F2 is larger than the first pressure F1.
Specifically, in the above step B32, as shown in fig. 5, when the first glue string 30 and the second glue string 40 have the third height H3, the pressure for performing the main pressing process on the motherboard 10 and the daughter board 20 is the third pressure F3, and as the height of the first glue string 30 gradually decreases, the resistance for performing the main pressing process on the motherboard 10 and the daughter board 20 gradually increases, and thus, the pressure for performing the main pressing process on the motherboard 10 and the daughter board 20 also gradually increases, and thus, the third pressure F3 is greater than the second pressure F2. In this embodiment, the pressures of the pre-press process and the main press process may be monitored by a pressure sensor, and press-fitting is stopped when the pressure increases to the third pressure F3.
Specifically, in the step B31, during the process of compressing the first glue string 30 from the first height H1 to the second height H2, the pressure of the pre-pressing treatment on the motherboard 10 and the daughter board 20 gradually increases from the first pressure F1 to the second pressure F2, so that the first glue string 30 is uniformly compressed in the step B31, so as to control the gap between the daughter board 20 and the motherboard 10.
Specifically, in the step B32, during the process of compressing the first glue string 30 and the second glue string 40 from the second height H2 to the third height H3, the pressure of the main pressing process on the motherboard 10 and the daughter board 20 gradually increases from the second pressure F2 to the third pressure F3, so that the first glue string 30 and the second glue string 40 are uniformly compressed in the step B32, so as to control the gap between the daughter board 20 and the motherboard 10.
Specifically, since the viscosity of the first glue string 30 and the second glue string 40 is higher, after the step B3, the volumes of the first glue string 30 and the second glue string 40 become smaller, but the first glue string 30 is extruded in the whole course, so that the volume change ratio of the first glue string 30 is greater than that of the second glue string 40, and therefore, the density of the first glue string 30 is greater than that of the second glue string 40. It should be noted that, the volume change ratio of the first glue string 30 refers to the ratio of the volume of the first glue string 30 after being pressed to the volume of the second glue string 40 before being pressed, and the volume change ratio of the second glue string 40 refers to the ratio of the volume of the second glue string 40 after being pressed to the volume of the first glue string before being pressed.
Specifically, in the above step B31, as shown in fig. 3, when the first glue string 30 is at the first height H1, the first glue string 30 has the first bonding area S1, and the second glue string 40 has the second bonding area S2. In the above step B32, as shown in fig. 5, when the first glue string 30 and the second glue string 40 are at the third height H3, the first glue string 30 has the third bonding area S3, the second glue string 40 has the fourth bonding area S4, and as the first glue string 30 and the second glue string 40 are compressed, the first glue string 30 and the second glue string 40 gradually spread around, and therefore, the bonding area of the first glue string 30 and the second glue string 40 gradually increases, and therefore, the first bonding area S1 is smaller than the third bonding area S3, and the second bonding area S2 is smaller than the fourth bonding area S4. The bonding area refers to the contact area between the glue column and the daughter board 30.
Specifically, in the above step B31, as shown in fig. 3, the first bonding area S1 is equal to the second bonding area S2; in both the above steps B31 and B32, the first glue string 30 is extruded, and the second glue string 40 is extruded only in the step B32, so that the extrusion of the first glue string 30 is relatively sufficient, and therefore, as shown in fig. 5, the third bonding area S3 is larger than the fourth bonding area S4.
Specifically, in the above step B31, when the first glue string 30 is at the first height H1, a first distance D1 is provided between the adjacent first glue string 30 and second glue string 40. In the step B32, when the first glue string 30 and the second glue string 40 are at the third height H3, the first glue string 30 and the second glue string 40 have the second distance D2 therebetween. In the process of performing the lamination process on the motherboard 10 and the daughter board 20, the first glue column 30 and the second glue column 40 gradually diffuse towards the periphery, and the distance between the adjacent first glue column 30 and second glue column 40 gradually decreases, so that the first distance D1 is larger than the second distance D2.
Specifically, after the step B3, the motherboard 10 and the daughter board 20 are pressed together, and the height difference between two of the plurality of first adhesive columns 30 and the plurality of second adhesive columns 40 is less than or equal to 15 micrometers, that is, the height difference between two of the first adhesive columns 30 is less than or equal to 15 micrometers, the height difference between two of the second adhesive columns 40 is less than or equal to 15 micrometers, and the height difference between the first adhesive columns 30 and the second adhesive columns 40 is less than or equal to 15 micrometers.
Specifically, the height difference between two of the plurality of first glue pillars 30 and the plurality of second glue pillars 40 may be 15 micrometers, 13 micrometers, 11 micrometers, 9 micrometers, 7 micrometers, 5 micrometers, 3 micrometers or 0, and the thickness uniformity of the bonding gap between the daughter board 20 and the motherboard 10 is high.
Specifically, after the step B3, the difference in height between two of the plurality of first adhesive columns 30 and the plurality of second adhesive columns 40 may be less than or equal to 15 micrometers and may be less than or equal to 5 micrometers, and the thickness uniformity of the bonding gap between the daughter board 20 and the motherboard 10 is high.
Specifically, as shown in fig. 3 to 5, in the above step B1, the motherboard 10 is provided with the first conductive portion 11, and the daughter board 20 is provided with the second conductive portion 21; the step B2 further includes: forming conductive adhesive 50 on the first conductive portion 11 of the motherboard 10 or the second conductive portion 21 of the daughter board 20, wherein the height of the conductive adhesive 50 is smaller than that of the second adhesive column 40, wherein the conductive adhesive 50 can be formed by dispensing or ink-jet printing, and the material of the conductive adhesive 50 can be specifically but not limited to conductive silver adhesive; in step B3, after the motherboard 10 and the daughter board 20 are pressed, the first conductive portion 11 is electrically connected to the second conductive portion 21 through the conductive adhesive 50. In this embodiment, the motherboard 10 is provided with a driving circuit (not shown) including a first conductive portion 11, and the driving circuit drives the daughter board 20 to display a picture through the first conductive portion 11, the conductive paste 50, and the second conductive portion 21.
Specifically, in the above step B2, the conductive adhesive 50 has a fourth height H4, the fourth height H4 is smaller than the second height H2, and the fourth height H4 is larger than the third height H3. Under this arrangement, in the above step B32, after the main pressing process is performed on the motherboard 10 and the daughter board 20, the conductive adhesive 50 is compressed from the fourth height H4 to the third height H3, so that the first conductive portion 11 is electrically connected to the second conductive portion 21 through the conductive adhesive 50.
Specifically, after the above step B3, a height difference between two of the plurality of first adhesive columns 30, the plurality of second adhesive columns 40 and the plurality of conductive adhesives 50 is less than or equal to 15 micrometers, that is, a height difference between two of the first adhesive columns 30 is less than or equal to 15 micrometers, a height difference between two of the second adhesive columns 40 is less than or equal to 15 micrometers, a height difference between the first adhesive columns 30 and the conductive adhesives 50 is less than or equal to 15 micrometers, and a height difference between the second adhesive columns 40 and the conductive adhesives 50 is less than or equal to 15 micrometers.
Specifically, after the above step B3, the difference in height between two of the plurality of first adhesive pillars 30, the plurality of second adhesive pillars 40, and the plurality of conductive adhesives 50 is less than or equal to 15 micrometers, and the thickness uniformity of the bonding gap between the daughter board 20 and the motherboard 10 is high.
Specifically, after the above step B3, the gap distance between the motherboard 10 and the daughter board 20 is greater than or equal to 30 micrometers and less than or equal to 150 micrometers, that is, the third height H3 is greater than or equal to 30 micrometers and less than or equal to 150 micrometers. With this arrangement, the gap between the mother board 10 and the daughter board 20 is small, which is beneficial to the light and thin design of the tiled display device.
Referring to fig. 5, an embodiment of the present application further provides a tiled display device, where the tiled display device is manufactured by using the above manufacturing method. The splice display device comprises a motherboard 10, a daughter board 20, a first glue column 30 and a second glue column 40, wherein the daughter board 20 is opposite to the motherboard 10, the first glue column 30 and the second glue column 40 are arranged between the motherboard 10 and the daughter board 20, and the motherboard 10 and the daughter board 20 are bonded together through the first glue column 30 and the second glue column 40. The bonding strength of the portion between the motherboard 10 and the daughter board 20 bonded by the first adhesive column 30 is greater than the bonding strength of the portion between the motherboard 10 and the daughter board 20 bonded by the second adhesive column 40.
The spliced display device provided by the embodiment of the application is manufactured by adopting the method, and the thickness uniformity and the accuracy of the attaching gap between the daughter board 20 and the mother board 10 are high, so that the seamless splicing of the daughter board 20 and the daughter board 20 is facilitated, the seamless large-screen display effect is realized, and the reliability of the product is greatly improved.
Specifically, as shown in fig. 2, the cross-sectional shapes of the first glue string 30 and the second glue string 40 may be, but not limited to, circular, oval, triangular, rectangular or other shapes, and the cross-sectional shapes of the first glue string 30 and the second glue string 40 may be appropriately modified according to the actual situation and the specific requirements, which is not limited herein.
Specifically, the materials of the first glue column 30 and the second glue column 40 may be thermosetting glue or photo-curing glue. When the materials of the first glue column 30 and the second glue column 40 are photo-curing glue, the materials of the first glue column 30 and the second glue column 40 can be acrylic resin or organosilicon OCR (Optical Clear Resin) glue; when the material of the first glue string 30 and the second glue string 40 is thermosetting glue, the material of the first glue string 30 and the second glue string 40 may be acrylic OCR (Optical Clear Resin) glue. Of course, the materials of the first glue string 30 and the second glue string 40 may be modified appropriately according to the actual situation and the specific requirement, which is not limited herein. In the present embodiment, the first glue string 30 and the second glue string 40 are made of the same material.
Specifically, as shown in fig. 2 and 5, the number of the first glue pillars 30 is greater than or equal to four, for example, four, five, six or more first glue pillars 30 are provided between the daughter board 20 and the motherboard 10. With this arrangement, it is possible to secure sufficient first glue pillars 30 between the motherboard 10 and the daughter board 20, thereby securing adhesive strength between the daughter board 20 and the motherboard 10.
Specifically, as shown in fig. 2 and 5, the number of the second glue strings 40 is greater than the number of the first glue strings 30. Under this setting, can guarantee to have enough second glue material post 40 in order to play the cushioning effect, can improve the cushioning effect greatly, effectively avoid partial first glue material post 30 to be taken place because the condition of high deviation by excessive extrusion is favorable to keeping the thickness homogeneity and the accuracy in laminating clearance between daughter board 20 and mother board 10.
Specifically, as shown in fig. 2 and fig. 5, the plurality of first glue pillars 30 are uniformly distributed on one side surface of the daughter board 20, that is, the spacing between two adjacent first glue pillars 30 is the same. In the pressing process of the daughter board 20 and the motherboard 10, when the height of the first glue column 30 is greater than that of the second glue column 40, the daughter board 20 and the motherboard 10 are mainly supported by the first glue column 30, and the plurality of first glue columns 30 are uniformly distributed on one side surface of the daughter board 20, so that the uniformity of a gap between the daughter board 20 and the motherboard 10 is guaranteed in the pressing process, and the situation that part of the first glue columns 30 are excessively extruded is avoided. In this embodiment, the plurality of first glue strings 30 may be, but is not limited to be, arranged in an array.
Specifically, as shown in fig. 2 and 5, at least one second glue column 40 is disposed between two adjacent first glue columns 30. So set up, in the pressfitting processing procedure is carried out to daughter board 20 and mother board 10, when the height of first glue material post 30 equals the height of second glue material post 40, the second glue material post 40 between two adjacent first glue material posts 30 can play the cushioning effect, is favorable to guaranteeing the homogeneity in the clearance between daughter board 20 and the mother board 10 in the pressfitting process, avoids partial first glue material post 30 to be excessively extruded the condition emergence.
Specifically, as shown in fig. 2 and fig. 5, the plurality of first glue pillars 30 and the plurality of second glue pillars 40 are distributed in an array, that is, the plurality of first glue pillars 30 and the plurality of second glue pillars 40 are distributed in the same array, and the plurality of first glue pillars 30 and the plurality of second glue pillars 40 are arranged in a manner of M rows×n columns, wherein M, N satisfies the following conditions:
M×N≥9。
for example, as shown in fig. 2, a plurality of first glue strings 30 and a plurality of second glue strings 40 are arranged in a manner of 3 rows×6 columns, wherein, the 1 st row and the 3 rd row are provided with three first glue strings 30 and two second glue strings 40, the first glue strings 30 and the second glue strings 40 are staggered, and one second glue string 40 is arranged between two adjacent first glue strings 30; and 6 glue columns are arranged on the 2 nd row.
Specifically, the height difference between two of the plurality of first glue strings 30 and the plurality of second glue strings 40 is less than or equal to 15 micrometers, that is, the height difference between two of the first glue strings 30 is less than or equal to 15 micrometers, the height difference between two of the second glue strings 40 is less than or equal to 15 micrometers, and the height difference between the first glue string 30 and the second glue string 40 is less than or equal to 15 micrometers.
Specifically, the height difference between two of the plurality of first glue pillars 30 and the plurality of second glue pillars 40 may be 15 micrometers, 13 micrometers, 11 micrometers, 9 micrometers, 7 micrometers, 5 micrometers, 3 micrometers or 0, and the thickness uniformity of the bonding gap between the daughter board 20 and the motherboard 10 is high.
Specifically, the difference in height between two of the plurality of first adhesive columns 30 and the plurality of second adhesive columns 40 may be less than or equal to 15 micrometers and may be less than or equal to 5 micrometers, and the thickness uniformity of the bonding gap between the daughter board 20 and the motherboard 10 is high.
Specifically, as shown in fig. 5, the motherboard 10 is provided with a first conductive portion 11, the daughter board 20 is provided with a second conductive portion 21, and the tiled display device further includes a conductive adhesive 50 disposed between the first conductive portion 11 and the second conductive portion 21, where the conductive adhesive 50 may be, but is not limited to, a conductive silver adhesive, and the first conductive portion 11 is electrically connected to the second conductive portion 21 through the conductive adhesive 50. In this embodiment, the motherboard 10 is provided with a driving circuit (not shown) including a first conductive portion 11, and the driving circuit drives the daughter board 20 to display a picture through the first conductive portion 11, the conductive paste 50, and the second conductive portion 21.
Specifically, the height difference of two of the plurality of first glue pillars 30, the plurality of second glue pillars 40, and the plurality of conductive glue 50 is less than or equal to 15 micrometers, that is, the height difference of two first glue pillars 30 is less than or equal to 15 micrometers, the height difference of two second glue pillars 40 is less than or equal to 15 micrometers, the height difference of the first glue pillars 30 and the conductive glue 50 is less than or equal to 15 micrometers, and the height difference of the second glue pillars 40 and the conductive glue 50 is less than or equal to 15 micrometers.
Specifically, the height difference between two of the plurality of first adhesive pillars 30, the plurality of second adhesive pillars 40, and the plurality of conductive adhesives 50 is less than or equal to 15 micrometers, and the thickness uniformity of the bonding gap between the daughter board 20 and the motherboard 10 is high.
Specifically, the gap distance between the motherboard 10 and the daughter board 20 is greater than or equal to 30 micrometers and less than or equal to 150 micrometers, and the gap between the motherboard 10 and the daughter board 20 is small, which is beneficial to the light and thin design of the tiled display device.
Specifically, as shown in fig. 5, the first glue string 30 has a third bonding area S3, the second glue string 40 has a fourth bonding area S4, and since the initial height of the first glue string 30 is greater than the initial height of the second glue string 40 and the initial bonding area of the first glue string 30 is equal to the initial bonding area of the second glue string 40 in the manufacturing process, the first glue string 30 and the second glue string 40 gradually diffuse around as the first glue string 30 and the second glue string 40 are compressed, and therefore, finally, the third bonding area S3 is greater than the fourth bonding area S4, that is, the bonding area of the first glue string 30 is greater than the bonding area of the second glue string 40 in the tiled display device shown in fig. 5.
Specifically, since the viscosity of the first glue string 30 and the second glue string 40 is higher, after the step B3, the volumes of the first glue string 30 and the second glue string 40 become smaller, but the first glue string 30 is extruded in the whole course, so that the volume change ratio of the first glue string 30 is greater than that of the second glue string 40, and therefore, the density of the first glue string 30 is greater than that of the second glue string 40. It should be noted that, the volume change ratio of the first glue string 30 refers to the ratio of the volume of the first glue string 30 after being pressed to the volume of the second glue string 40 before being pressed, and the volume change ratio of the second glue string 40 refers to the ratio of the volume of the second glue string 40 after being pressed to the volume of the first glue string before being pressed.
The above description is provided for the method for manufacturing the tiled display device and the tiled display device provided by the embodiment of the application, and specific examples are applied to describe the principle and implementation of the application, and the description of the above embodiments is only used for helping to understand the method and core idea of the application; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.
Claims (12)
1. The manufacturing method of the spliced display device is characterized by comprising the following steps of:
step B1, providing a mother board and a daughter board;
step B2, forming a first glue column and a second glue column on the mother board or the daughter board, wherein the height of the first glue column is larger than that of the second glue column;
step B3, pressing the mother board and the daughter board so that the daughter board is adhered to the mother board through the first adhesive column and the second adhesive column;
the first glue material columns and the second glue material columns are distributed in an array, and at least one second glue material column is arranged between two adjacent first glue material columns.
2. The method of claim 1, wherein in the step B2, the number of the second glue posts is greater than the number of the first glue posts.
3. The method of manufacturing a tiled display device according to claim 1, wherein in the step B2, the first glue column has a first height, the second glue column has a second height, and the first height is greater than the second height;
the step B3 comprises the following steps:
step B31, pre-pressing the mother board and the daughter board, wherein the first glue column is compressed from the first height to the second height;
and B32, carrying out main pressing treatment on the mother board and the daughter board, wherein the first glue column and the second glue column are compressed from the second height to a third height, and the third height is smaller than the second height.
4. The method of manufacturing a tiled display device according to claim 3, wherein in the step B31, when the first glue column is at the first height, a pressure for performing a pre-press process on the mother board and the daughter board is a first pressure; when the first glue column and the second glue column are at a second height, the pressure for carrying out main pressing treatment on the mother board and the daughter board is a second pressure, and the second pressure is larger than the first pressure;
in the step B32, when the first glue column and the second glue column are at the third height, the pressure for performing the main pressing process on the mother board and the daughter board is a third pressure, and the third pressure is greater than the second pressure.
5. The method of claim 4, wherein in the step B31, the pressure of the pre-pressing the mother board and the daughter board gradually increases from the first pressure to the second pressure during the process of compressing the first glue column from the first height to the second height.
6. The method of manufacturing a tiled display device according to claim 4, wherein in the step B32, in the process of compressing the first glue column and the second glue column from the second height to the third height, the pressure of the main pressing process performed on the mother board and the daughter board gradually increases from the second pressure to the third pressure.
7. The method of manufacturing a tiled display device according to claim 3, wherein in the step B1, the mother board is provided with a first conductive portion, and the daughter board is provided with a second conductive portion;
the step B2 further includes: forming conductive adhesive on the first conductive part of the motherboard or the second conductive part of the daughter board, wherein the height of the conductive adhesive is smaller than that of the second adhesive column;
in the step B3, after the mother board and the daughter board are pressed, the first conductive portion is electrically connected to the second conductive portion through the conductive adhesive.
8. A tiled display device, comprising:
a motherboard;
the daughter board is arranged opposite to the mother board;
the first glue column is arranged between the mother board and the daughter board, and the mother board and the daughter board are bonded together through the first glue column; and
the second glue column is arranged between the mother board and the daughter board, and the mother board and the daughter board are bonded together through the second glue column;
the bonding strength of the part, bonded by the first glue column, between the mother board and the daughter board is greater than that of the part, bonded by the second glue column, between the mother board and the daughter board;
the first glue material columns and the second glue material columns are distributed in an array, and at least one second glue material column is arranged between two adjacent first glue material columns; the height of the first glue column is larger than that of the second glue column.
9. The tiled display device according to claim 8, wherein the number of second glue posts is greater than the number of first glue posts.
10. The tiled display device according to claim 8, wherein a difference in height between two of the plurality of first glue pillars and the plurality of second glue pillars is less than or equal to 15 microns.
11. The tiled display device according to claim 8, wherein the adhesive area of the first glue string is greater than the adhesive area of the second glue string.
12. The tiled display device according to claim 8, wherein the motherboard is provided with a first conductive portion and the daughter board is provided with a second conductive portion;
the spliced display device further comprises conductive adhesive arranged between the first conductive part and the second conductive part, and the first conductive part is electrically connected with the second conductive part through the conductive adhesive.
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