CN114673721A - Manufacturing method of tiled display device and tiled display device - Google Patents
Manufacturing method of tiled display device and tiled display device Download PDFInfo
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- CN114673721A CN114673721A CN202210260086.6A CN202210260086A CN114673721A CN 114673721 A CN114673721 A CN 114673721A CN 202210260086 A CN202210260086 A CN 202210260086A CN 114673721 A CN114673721 A CN 114673721A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 354
- 239000000463 material Substances 0.000 claims abstract description 240
- 238000000034 method Methods 0.000 claims description 62
- 238000003825 pressing Methods 0.000 claims description 48
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 238000010030 laminating Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 8
- 230000002349 favourable effect Effects 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the application discloses a manufacturing method of a splicing display device and the splicing display device, wherein a first glue material column and a second glue material column are formed on a mother board or a daughter board, and the height of the first glue material column is larger than that of the second glue material column; carry out pressfitting to mother board and daughter board for the daughter board bonds on the mother board through first gluey material post and second gluey material post, can keep the thickness homogeneity and the accuracy in the laminating clearance between daughter board and the mother board.
Description
Technical Field
The application relates to the field of display, in particular to a manufacturing method of a splicing display device and the splicing display device.
Background
In recent years, display technology has been developed rapidly, and as the pixel size has been reduced, application scenes have become wide. The indoor and outdoor large-scale long-distance advertising screen gradually develops into an indoor and outdoor short-distance high-definition display screen. At present, the large screen display mainly adopts a splicing display technology, namely, small-sized daughter boards are spliced into large screens with any size.
In the tiled display technology, the daughter board and the mother board are generally connected by a rubber material, and with such a structure and process, when the daughter board is attached to the mother board, the gap between the daughter board and the mother board is difficult to control due to factors such as material warpage and mechanical pressing error, and the uniformity and accuracy of the gap between the daughter board and the mother board are poor, so that the daughter board may be inclined to a certain extent, which causes the following problems:
(1) The seamless splicing of the daughter boards is influenced;
(2) the display effect of the daughter board is influenced;
(3) affecting product reliability.
Therefore, a technical solution capable of solving the above technical problems is needed.
Disclosure of Invention
The embodiment of the application provides a manufacturing method of a tiled display device and the tiled display device, and the technical problem that after a daughter board and a mother board are attached, the uniformity and the accuracy of a gap between the daughter board and the mother board are poor can be solved.
The embodiment of the application provides a manufacturing method of a splicing display device, which comprises the following steps:
step B1, providing a mother board and a daughter board;
step B2, forming a first glue material column and a second glue material column on the mother board or the daughter board, wherein the height of the first glue material column is larger than that of the second glue material column;
and step B3, performing pressing treatment on the mother board and the daughter boards, so that the daughter boards are bonded on the mother board through the first glue material columns and the second glue material columns.
Optionally, in some embodiments of the present application, in step B2, the number of the second glue columns is greater than the number of the first glue columns.
Optionally, in some embodiments of the present application, in step B2, the first glue column has a first height, the second glue column has a second height, and the first height is greater than the second height;
The step B3 includes:
step B31, pre-pressing the mother board and the daughter board, wherein the first glue material column is compressed from the first height to the second height;
and step B32, performing main pressing treatment on the mother board and the daughter board, wherein the first glue material column and the second glue material column are compressed to a third height from the second height, and the third height is smaller than the second height.
Optionally, in some embodiments of the present application, in the step B31, when the first glue material column has the first height, a pressure for performing the pre-pressing process on the motherboard and the daughter board is a first pressure; when the first glue material column and the second glue material column are at a second height, the pressure for performing main pressing treatment on the mother board and the daughter board is a second pressure, and the second pressure is greater than the first pressure;
in step B32, when the first glue column and the second glue column have a third height, the pressure for performing the main pressing process on the motherboard and the daughter board is a third pressure, and the third pressure is greater than the second pressure.
Optionally, in some embodiments of the present application, in step B31, in the process that the first glue material column is compressed from the first height to the second height, the pressure for performing the pre-press process on the motherboard and the daughter board is gradually increased from the first pressure to the second pressure.
Optionally, in some embodiments of the present application, in step B32, in a process that the first glue column and the second glue column are compressed from the second height to the third height, a pressure of the main pressing process performed on the motherboard and the daughter board is gradually increased from the second pressure to the third pressure.
Optionally, in some embodiments of the present application, in step B1, the motherboard is provided with a first conductive portion, and the daughter board is provided with a second conductive portion;
the step B2 further includes: forming a conductive adhesive on the first conductive part of the motherboard or the second conductive part of the daughter board, wherein the height of the conductive adhesive is less than that of the second adhesive material column;
in step B3, after the motherboard and the daughter board are subjected to the press-fitting process, the first conductive portion is electrically connected to the second conductive portion through the conductive adhesive.
The embodiment of the present application further provides a tiled display device, including:
a motherboard;
a daughter board disposed opposite to the mother board;
the first rubber material column is arranged between the mother board and the daughter board, and the mother board and the daughter board are bonded together through the first rubber material column; and
The second rubber material column is arranged between the mother board and the daughter board, and the mother board and the daughter board are bonded together through the second rubber material column;
the bonding strength of the part between the mother board and the daughter board which is bonded through the first glue material column is greater than that of the part between the mother board and the daughter board which is bonded through the second glue material column.
Optionally, in some embodiments of the present application, the number of the second glue columns is greater than the number of the first glue columns.
Optionally, in some embodiments of the present application, a height difference between two of the first glue columns and the second glue columns is less than or equal to 15 micrometers.
Optionally, in some embodiments of the present application, a bonding area of the first glue column is larger than a bonding area of the second glue column.
Optionally, in some embodiments of the present application, the motherboard is provided with a first conductive portion, and the daughter board is provided with a second conductive portion;
the splicing display device further comprises a conductive adhesive arranged between the first conductive part and the second conductive part, and the first conductive part is electrically connected with the second conductive part through the conductive adhesive.
The embodiment of the application adopts a manufacturing method of a splicing display device and the splicing display device, a first glue material column and a second glue material column are formed on a mother board or a daughter board, and the height of the first glue material column is larger than that of the second glue material column; in carrying out the pressfitting processing process to mother board and daughter board, first gluey material post can be compressed earlier, when first gluey material post compression to glue the same height of material post with the second, the material post can play the cushioning effect to the second, avoid partly first gluey material post to take place because the condition of high deviation and being excessively extruded, follow-up carry on pressfitting processing to mother board and daughter board, make the daughter board glue the material post through first gluey material post and second and bond on the mother board, effectively keep the thickness homogeneity and the accuracy in laminating clearance between daughter board and the mother board.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flowchart of a manufacturing method of a tiled display device according to an embodiment of the present application;
fig. 2 is a schematic plan view of a tiled display device provided in an embodiment of the present application;
fig. 3 is a first schematic structural diagram of performing a pre-pressing process on a motherboard and a daughter board according to an embodiment of the present disclosure;
fig. 4 is a second schematic structural diagram of performing pre-press-fit processing on a motherboard and a daughter board according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of main stitching processing performed on a motherboard and a daughter board according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
The embodiment of the application provides a manufacturing method of a splicing display device and the splicing display device. The following are detailed descriptions. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
Referring to fig. 1 and 2, an embodiment of the present application provides a method for manufacturing a tiled display device, in which a plurality of sub-boards 20 are fixed on a mother board 10, so that the plurality of sub-boards 20 are tiled together to implement a large-screen display. In this embodiment, the sub-board 20 may be a display device, and may specifically be a liquid crystal display panel, a light emitting diode display panel, an organic light emitting diode display panel, or another display device, which is not limited herein.
Specifically, the manufacturing method of the tiled display device comprises the following steps:
step B1, as shown in fig. 2 and 3, providing the motherboard 10 and the daughter board 20;
step B2, as shown in fig. 3, forming a first glue material column 30 and a second glue material column 40 on the motherboard 10 or the daughter board 20, wherein the height of the first glue material column 30 is greater than the height of the second glue material column 40; the first glue material column 30 and the second glue material column 40 may be formed by, but not limited to, dispensing or inkjet printing;
Step B3, as shown in fig. 3-5, the mother board 10 and the daughter board 20 are subjected to a pressing process, so that the daughter board 20 is bonded to the mother board 10 through the first glue material columns 30 and the second glue material columns 40.
According to the manufacturing method of the tiled display device in the embodiment of the application, the first glue material column 30 and the second glue material column 40 are formed on the mother board 10 or the daughter board 20, the height of the first glue material column 30 is greater than that of the second glue material column 40, as shown in fig. 3 and 4, in the process of pressing the mother board 10 and the daughter board 20, the first glue material column 30 is firstly compressed, and when the first glue material column 30 is compressed to the same height as the second glue material column 40, the second glue material column 40 can play a role in buffering, so that the situation that part of the first glue material column 30 is excessively extruded due to height deviation is avoided; as shown in fig. 5, the mother board 10 and the daughter board 20 are subsequently pressed continuously, so that the daughter board 20 is bonded on the mother board 10 through the first glue material column 30 and the second glue material column 40, the thickness uniformity and accuracy of the fit gap between the daughter board 20 and the mother board 10 are effectively maintained, the seamless splicing of the daughter board 20 and the daughter board 20 is facilitated, the seamless large-screen display effect is realized, and the reliability of the product is greatly improved.
It is worth mentioning that, in the tiled display device manufactured in the embodiment of the present application, the height of the first glue material column 30 is greater than the height of the second glue material column 40, in the whole pressing process, the first glue material column 30 can be extruded in the whole process, that is, the first glue material column 30 can be sufficiently extruded, the first glue material column 30 can better fill the surface pits of the daughter board 20 and the mother board 10, so that the first glue material column 30 can be better combined with the daughter board 20 and the mother board 10, therefore, the bonding strength of the portion between the daughter board 20 and the mother board 10 bonded by the first glue material column 30 is high, and the daughter board 20 can be stably fixed on the mother board 10. The height of the second glue material column 40 is smaller, in the whole pressing process, when the first glue material column 30 is compressed to the same height as the second glue material column 40, the second glue material column 40 starts to be extruded, so that compared with the first glue material column 30, the extrusion of the second glue material column 40 is insufficient, the bonding strength of the part between the daughter board 20 and the mother board 10 bonded through the second glue material column 40 is slightly lower, and the bonding strength of the part between the daughter board 20 and the mother board 10 bonded through the first glue material column 30 is greater than that of the part between the daughter board 20 and the mother board 10 bonded through the second glue material column 40.
Specifically, as shown in fig. 2, the cross-sectional shapes of the first glue column 30 and the second glue column 40 may be, but not limited to, circular, oval, triangular, rectangular, or other shapes, and the cross-sectional shapes of the first glue column 30 and the second glue column 40 may be modified appropriately according to the selection of the actual situation and the specific requirement, which is not limited herein.
Specifically, the material of the first glue material column 30 and the second glue material column 40 may be a heat-curable glue or a light-curable glue. When the first glue material column 30 and the second glue material column 40 are made of the photo-curing glue, the first glue material column 30 and the second glue material column 40 may be made of acrylic resin or silicone ocr (optical Clear resin) glue; when the material of the first glue material column 30 and the second glue material column 40 is a thermal curing glue, the material of the first glue material column 30 and the second glue material column 40 may be an acrylic resin based ocr (optical Clear resin) glue. Of course, the materials of the first glue column 30 and the second glue column 40 can be modified appropriately according to the selection of the actual situation and the specific requirement, and are not limited herein. In the present embodiment, the first glue material column 30 and the second glue material column 40 are made of the same material.
Specifically, as shown in fig. 2 and 3, in the step B2, the first glue column 30 may be formed on the daughter board 20, and of course, the first glue column 30 may also be formed on the mother board 10 according to the selection of the actual situation and the specific requirement, or the first glue column 30 may be provided in a manner that a part of the first glue column 30 is formed on the daughter board 20 and a part of the first glue column 30 is formed on the mother board 10, which is not limited herein.
Specifically, as shown in fig. 2 and 3, in the step B2, the second glue column 40 may be formed on the daughter board 20, and of course, the second glue column 40 may also be formed on the mother board 10 according to the selection of the actual situation and the specific requirement, or the second glue column 40 may be provided in a manner that a part of the second glue column 40 is formed on the daughter board 20 and a part of the second glue column 40 is formed on the mother board 10, which is not limited herein.
Specifically, as shown in fig. 2 and 3, in the step B2, the number of the first glue material columns 30 is greater than or equal to four, for example, four, five, six or more first glue material columns 30 are disposed between the daughter board 20 and the motherboard 10. With this arrangement, it is possible to secure the first glue material column 30 between the mother board 10 and the daughter board 20 sufficiently, thereby securing the bonding strength between the daughter board 20 and the mother board 10.
Specifically, as shown in fig. 2 and 3, in step B2, the number of the second glue material columns 40 is greater than the number of the first glue material columns 30. Under this setting, can guarantee to have enough second to glue material post 40 in order to play the cushioning effect, can improve buffering effect greatly, effectively avoid partly first gluey material post 30 to be taken place because the condition of height deviation and excessively extruded, be favorable to keeping thickness uniformity and the accuracy in the laminating clearance between daughter board 20 and mother board 10.
Specifically, as shown in fig. 2 and fig. 3, in the step B2, the first glue columns 30 are uniformly distributed on one side surface of the daughter board 20, that is, the distances between two adjacent first glue columns 30 are the same. In the subsequent pressing process of the daughter board 20 and the mother board 10, when the height of the first glue material column 30 is greater than the height of the second glue material column 40, the daughter board 20 and the mother board 10 are mainly supported by the first glue material column 30, and the plurality of first glue material columns 30 are uniformly distributed on one side surface of the daughter board 20, so that the uniformity of the gap between the daughter board 20 and the mother board 10 is ensured in the pressing process, and the situation that part of the first glue material columns 30 are excessively extruded is avoided. In this embodiment, the plurality of first glue material columns 30 may be, but not limited to, distributed in an array.
Specifically, as shown in fig. 2 and 3, in the step B2, at least one second glue column 40 is disposed between two adjacent first glue columns 30. So set up, in the follow-up pressfitting processing process to daughter board 20 and mother board 10, when the height of first gluey material post 30 equals the height of second gluey material post 40, the second gluey material post 40 between two adjacent first gluey material posts 30 can play the cushioning effect, is favorable to guaranteeing the homogeneity in clearance between daughter board 20 and the mother board 10 in the pressfitting process, avoids partly first gluey material post 30 to be taken place by the condition of excessive extrusion.
Specifically, as shown in fig. 2 and 3, in the step B2, the plurality of first glue material columns 30 and the plurality of second glue material columns 40 are distributed in an array, that is, the plurality of first glue material columns 30 and the plurality of second glue material columns 40 are distributed in the same array, and the plurality of first glue material columns 30 and the plurality of second glue material columns 40 are arranged in M rows × N columns, where M, N satisfies the following condition:
M×N≥9。
for example, as shown in fig. 2, the plurality of first glue material columns 30 and the plurality of second glue material columns 40 are arranged in a 3-row × 6-column manner, wherein three first glue material columns 30 and two second glue material columns 40 are arranged in each of the 1 st row and the 3 rd row, the first glue material columns 30 and the second glue material columns 40 are arranged in a staggered manner, and one second glue material column 40 is arranged between two adjacent first glue material columns 30; and 6 glue material columns are arranged on the 2 nd row.
Specifically, as shown in fig. 2 and fig. 3, in step B2, the first glue material column 30 has a first height H1, the second glue material column 40 has a second height H2, and the first height H1 is greater than the second height H2. The step B3 specifically includes:
step B31, as shown in fig. 3 and 4, performing pre-pressing treatment on the motherboard 10 and the daughter board 20, and compressing the first glue material column 30 from the first height H1 to the second height H2;
step B32, as shown in fig. 4 and 5, performing main pressing on the motherboard 10 and the daughter board 20, compressing the first glue material column 30 and the second glue material column 40 from the second height H2 to a third height H3, where the third height H3 is smaller than the second height H2. During the main pressing process of the mother board 10 and the daughter board 20, the second plastic columns 40 just contact with the daughter board 20 and the mother board 10 at the same time, and at this moment, the second plastic columns 40 can play a role in buffering, so that the uniformity of a gap between the daughter board 20 and the mother board 10 can be guaranteed during the pressing process, and the situation that part of the first plastic columns 30 are excessively extruded is avoided.
Specifically, in the step B31, as the height of the first glue column 30 gradually decreases, the resistance to the pre-pressing process performed on the mother board 10 and the daughter board 20 gradually increases, and therefore, the pressure to the pre-pressing process performed on the mother board 10 and the daughter board 20 needs to be greater than the resistance to press the first glue column 30. Similarly, in the step B32, as the height of the first glue column 30 gradually decreases, the resistance to the main pressing process performed on the mother board 10 and the daughter board 20 gradually increases, and therefore, the pressure to perform the main pressing process on the mother board 10 and the daughter board 20 needs to be greater than the resistance to press the first glue column 30 and the second glue column 40.
Specifically, in the step B31, as shown in fig. 3, when the first glue material column 30 has the first height H1, the pressure for performing the pre-pressing process on the motherboard 10 and the daughter board 20 is a first pressure F1; as shown in fig. 4, when the first glue column 30 and the second glue column 40 have the second height H2, the pressure for performing the main pressing process on the motherboard 10 and the daughter board 20 is a second pressure F2. The pre-press process is performed on the mother board 10 and the daughter board 20 in the step B31 to only extrude the first glue column 30, the main press process is performed on the mother board 10 and the daughter board 20 in the step B32 to extrude the first glue column 30 and the second glue column 40, and the deformation resistance of the first glue column 30 and the second glue column 40, which needs to be overcome in the step B32, is relatively large, so the second pressure F2 is greater than the first pressure F1.
Specifically, in the step B32, as shown in fig. 5, when the first glue column 30 and the second glue column 40 have the third height H3, the pressure for performing the main pressing process on the motherboard 10 and the daughter board 20 is the third pressure F3, and as the height of the first glue column 30 gradually decreases, the resistance for performing the main pressing process on the motherboard 10 and the daughter board 20 gradually increases, and therefore, the pressure for performing the main pressing process on the motherboard 10 and the daughter board 20 also gradually increases, and therefore, the third pressure F3 is greater than the second pressure F2. In this embodiment, the pressures of the pre-nip process and the main nip process may be monitored by pressure sensors, and the nip is stopped when the pressure is increased to the third pressure F3.
Specifically, in the step B31, during the process that the first glue column 30 is compressed from the first height H1 to the second height H2, the pressure for performing the pre-pressing process on the mother board 10 and the daughter board 20 is gradually increased from the first pressure F1 to the second pressure F2, so that the first glue column 30 is uniformly compressed in the step B31, so as to control the gap between the daughter board 20 and the mother board 10.
Specifically, in the step B32, during the process that the first glue column 30 and the second glue column 40 are compressed from the second height H2 to the third height H3, the pressure for performing the main pressing process on the mother board 10 and the daughter board 20 is gradually increased from the second pressure F2 to the third pressure F3, so that the first glue column 30 and the second glue column 40 are uniformly compressed in the step B32, so as to control the gap between the daughter board 20 and the mother board 10.
Specifically, because the viscosity of the first glue material column 30 and the viscosity of the second glue material column 40 are higher, after the step B3, the volumes of the first glue material column 30 and the second glue material column 40 become smaller, but the first glue material column 30 is extruded in the whole process, and therefore, the volume change ratio of the first glue material column 30 is greater than the volume change ratio of the second glue material column 40, and finally, the density of the first glue material column 30 is greater than the density of the second glue material column 40. It should be noted that the volume change ratio of the first glue column 30 refers to a ratio of the volume of the first glue column 30 after pressing to the volume of the first glue column before pressing, and the volume change ratio of the second glue column 40 refers to a ratio of the volume of the second glue column 40 after pressing to the volume of the second glue column before pressing.
Specifically, in step B31, as shown in fig. 3, when the first glue material column 30 has the first height H1, the first glue material column 30 has the first bonding area S1, and the second glue material column 40 has the second bonding area S2. In step B32, as shown in fig. 5, when the first glue column 30 and the second glue column 40 have the third height H3, the first glue column 30 has a third bonding area S3, and the second glue column 40 has a fourth bonding area S4, and as the first glue column 30 and the second glue column 40 are compressed, the first glue column 30 and the second glue column 40 gradually spread around, so the bonding area between the first glue column 30 and the second glue column 40 gradually increases, and therefore the first bonding area S1 is smaller than the third bonding area S3, and the second bonding area S2 is smaller than the fourth bonding area S4. The bonding area refers to a contact area between the glue column and the daughter board 30.
Specifically, in the above step B31, as shown in fig. 3, the first bonding area S1 is equal to the second bonding area S2; in both of the above steps B31 and B32, the first glue column 30 is pressed, and the second glue column 40 is pressed only in step B32, so the first glue column 30 is sufficiently pressed, and thus the third bonding area S3 is larger than the fourth bonding area S4 as shown in fig. 5.
Specifically, in the step B31, when the first glue column 30 has the first height H1, a first distance D1 exists between the adjacent first glue columns 30 and second glue columns 40. In the step B32, when the first glue column 30 and the second glue column 40 have the third height H3, a second distance D2 exists between the first glue column 30 and the second glue column 40. In the process of pressing the motherboard 10 and the daughter board 20, the first glue pillars 30 and the second glue pillars 40 gradually spread around, and the distance between the adjacent first glue pillars 30 and second glue pillars 40 gradually decreases, so the first distance D1 is greater than the second distance D2.
Specifically, after the step B3, the motherboard 10 and the daughter board 20 are pressed together, and a height difference between two of the first glue columns 30 and the second glue columns 40 is smaller than or equal to 15 micrometers, that is, a height difference between two of the first glue columns 30 is smaller than or equal to 15 micrometers, a height difference between two of the second glue columns 40 is smaller than or equal to 15 micrometers, and a height difference between the first glue columns 30 and the second glue columns 40 is smaller than or equal to 15 micrometers.
Specifically, the height difference between two of the glue columns 30 and 40 may be 15 micrometers, 13 micrometers, 11 micrometers, 9 micrometers, 7 micrometers, 5 micrometers, 3 micrometers or 0, and the thickness uniformity of the fit gap between the daughter board 20 and the motherboard 10 is high.
Specifically, after the step B3, a height difference between two of the first glue columns 30 and the second glue columns 40 may be less than or equal to 15 micrometers, or less than or equal to 5 micrometers, and a thickness uniformity of the bonding gap between the daughter board 20 and the motherboard 10 is high.
Specifically, as shown in fig. 3 to 5, in step B1, the motherboard 10 is provided with a first conductive portion 11, and the daughter board 20 is provided with a second conductive portion 21; the step B2 further includes: forming a conductive adhesive 50 on the first conductive part 11 of the motherboard 10 or the second conductive part 21 of the daughter board 20, wherein the height of the conductive adhesive 50 is less than the height of the second adhesive pillar 40, the conductive adhesive 50 may be formed by dispensing or inkjet printing, and the material of the conductive adhesive 50 may be, but is not limited to, conductive silver adhesive; in step B3, after the mother board 10 and the daughter board 20 are subjected to the pressing process, the first conductive portion 11 is electrically connected to the second conductive portion 21 through the conductive paste 50. In this embodiment, the motherboard 10 is provided with a driving circuit (not shown), the driving circuit includes a first conductive part 11, and the driving circuit drives the daughter board 20 to display the picture through the first conductive part 11, the conductive adhesive 50 and the second conductive part 21.
Specifically, in step B2, the conductive paste 50 has a fourth height H4, the fourth height H4 is smaller than the second height H2, and the fourth height H4 is larger than the third height H3. Under this configuration, in the step B32, after the main pressing process is performed on the motherboard 10 and the daughter board 20, the conductive paste 50 is compressed from the fourth height H4 to the third height H3, so that the first conductive part 11 is electrically connected to the second conductive part 21 through the conductive paste 50.
Specifically, after the step B3, the height difference between two of the first glue columns 30, the second glue columns 40, and the conductive glue 50 is less than or equal to 15 micrometers, that is, the height difference between two first glue columns 30 is less than or equal to 15 micrometers, the height difference between two second glue columns 40 is less than or equal to 15 micrometers, the height difference between the first glue columns 30 and the conductive glue 50 is less than or equal to 15 micrometers, and the height difference between the second glue columns 40 and the conductive glue 50 is less than or equal to 15 micrometers.
Specifically, after the step B3, the height difference between two of the first glue material columns 30, the second glue material columns 40 and the conductive glues 50 is less than or equal to 15 micrometers, and the thickness uniformity of the bonding gap between the daughter board 20 and the motherboard 10 is high.
Specifically, after the step B3, the gap distance between the motherboard 10 and the daughter board 20 is greater than or equal to 30 microns and less than or equal to 150 microns, that is, the third height H3 is greater than or equal to 30 microns and less than or equal to 150 microns. With this arrangement, the gap between the mother board 10 and the daughter board 20 is small, which is beneficial to the light and thin design of the tiled display device.
Referring to fig. 5, an embodiment of the present application further provides a tiled display device, which is manufactured by using the above manufacturing method. The splicing display device comprises a mother board 10, a daughter board 20, a first rubber material column 30 and a second rubber material column 40, wherein the daughter board 20 is arranged opposite to the mother board 10, the first rubber material column 30 and the second rubber material column 40 are arranged between the mother board 10 and the daughter board 20, and the mother board 10 and the daughter board 20 are bonded together through the first rubber material column 30 and the second rubber material column 40. The bonding strength of the portion between the motherboard 10 and the daughter board 20 bonded by the first glue column 30 is greater than the bonding strength of the portion between the motherboard 10 and the daughter board 20 bonded by the second glue column 40.
The splicing display device is manufactured by the method, the thickness uniformity and the accuracy of the fit clearance between the daughter board 20 and the mother board 10 are high, seamless splicing of the daughter board 20 and the daughter board 20 is facilitated, the seamless large-screen display effect is achieved, and the reliability of products is greatly improved.
Specifically, as shown in fig. 2, the cross-sectional shapes of the first glue column 30 and the second glue column 40 may be, but not limited to, circular, oval, triangular, rectangular, or other shapes, and the cross-sectional shapes of the first glue column 30 and the second glue column 40 may be modified appropriately according to the selection of the actual situation and the specific requirement, which is not limited herein.
Specifically, the material of the first glue material column 30 and the second glue material column 40 may be a heat-curable glue or a light-curable glue. When the first glue material column 30 and the second glue material column 40 are made of the photo-curing glue, the first glue material column 30 and the second glue material column 40 may be made of acrylic resin or silicone ocr (optical Clear resin) glue; when the material of the first glue material column 30 and the second glue material column 40 is a thermal curing glue, the material of the first glue material column 30 and the second glue material column 40 may be an acrylic resin based ocr (optical Clear resin) glue. Of course, the materials of the first glue column 30 and the second glue column 40 can be modified appropriately according to the selection of the actual situation and the specific requirement, and are not limited herein. In the present embodiment, the first glue material column 30 and the second glue material column 40 are made of the same material.
Specifically, as shown in fig. 2 and 5, the number of the first glue columns 30 is greater than or equal to four, for example, four, five, six or more first glue columns 30 are disposed between the daughter board 20 and the motherboard 10. With this arrangement, it is possible to secure the first glue material column 30 between the mother board 10 and the daughter board 20 sufficiently, thereby securing the bonding strength between the daughter board 20 and the mother board 10.
Specifically, as shown in fig. 2 and 5, the number of the second glue columns 40 is greater than the number of the first glue columns 30. Under this setting, can guarantee to have enough second to glue material post 40 in order to play the cushioning effect, can improve buffering effect greatly, effectively avoid partly first gluey material post 30 to be taken place because the condition of height deviation and excessively extruded, be favorable to keeping thickness uniformity and the accuracy in the laminating clearance between daughter board 20 and mother board 10.
Specifically, as shown in fig. 2 and fig. 5, the plurality of first glue material columns 30 are uniformly distributed on one side surface of the sub-board 20, that is, the intervals between two adjacent first glue material columns 30 are the same. In carrying out the pressfitting processing in-process to daughter board 20 and mother board 10, when the height of first gluey material post 30 is greater than the height of second gluey material post 40, mainly support through first gluey material post 30 between daughter board 20 and the mother board 10, through with a plurality of first gluey material posts 30 evenly distributed in a side surface of daughter board 20, be favorable to guaranteeing the homogeneity in clearance between daughter board 20 and the mother board 10 at the pressfitting in-process, avoid partly first gluey material post 30 to be taken place by the condition of excessive extrusion. In this embodiment, the first glue pillars 30 may be, but not limited to, arranged in an array.
Specifically, as shown in fig. 2 and 5, at least one second glue column 40 is disposed between two adjacent first glue columns 30. So set up, in carrying out the pressfitting processing in-process to daughter board 20 and mother board 10, when the height of first gluey material post 30 equals the height of second gluey material post 40, the second of two adjacent first gluey material posts 30 is glued material post 40 and can be played the cushioning effect, is favorable to guaranteeing the homogeneity in clearance between daughter board 20 and the mother board 10 at the pressfitting in-process, avoids partly first gluey material post 30 to be taken place by the condition of excessive extrusion.
Specifically, as shown in fig. 2 and 5, the plurality of first glue material columns 30 and the plurality of second glue material columns 40 are distributed in an array, that is, the plurality of first glue material columns 30 and the plurality of second glue material columns 40 are distributed and disposed according to the same array, and the plurality of first glue material columns 30 and the plurality of second glue material columns 40 are arranged in a manner of M rows × N columns, where M, N satisfies the following condition:
M×N≥9。
for example, as shown in fig. 2, the plurality of first glue material columns 30 and the plurality of second glue material columns 40 are arranged in a 3-row × 6-column manner, wherein three first glue material columns 30 and two second glue material columns 40 are arranged in each of the 1 st row and the 3 rd row, the first glue material columns 30 and the second glue material columns 40 are arranged in a staggered manner, and one second glue material column 40 is arranged between two adjacent first glue material columns 30; line 2 is provided with 6 glue material columns.
Specifically, the height difference between two of the first glue columns 30 and the second glue columns 40 is less than or equal to 15 micrometers, that is, the height difference between the two first glue columns 30 is less than or equal to 15 micrometers, the height difference between the two second glue columns 40 is less than or equal to 15 micrometers, and the height difference between the first glue columns 30 and the second glue columns 40 is less than or equal to 15 micrometers.
Specifically, the height difference between two of the plurality of first glue columns 30 and the plurality of second glue columns 40 may be 15 micrometers, 13 micrometers, 11 micrometers, 9 micrometers, 7 micrometers, 5 micrometers, 3 micrometers or 0, and the thickness uniformity of the fit gap between the daughter board 20 and the motherboard 10 is high.
Specifically, the height difference between two of the plurality of first glue material columns 30 and the plurality of second glue material columns 40 is less than or equal to 15 micrometers, and may be less than or equal to 5 micrometers, and the thickness uniformity of the fit gap between the daughter board 20 and the motherboard 10 is high.
Specifically, as shown in fig. 5, the mother board 10 is provided with a first conductive portion 11, the daughter board 20 is provided with a second conductive portion 21, the tiled display device further includes a conductive adhesive 50 disposed between the first conductive portion 11 and the second conductive portion 21, the material of the conductive adhesive 50 may be, but is not limited to, a conductive silver adhesive, and the first conductive portion 11 is electrically connected to the second conductive portion 21 through the conductive adhesive 50. In this embodiment, the motherboard 10 is provided with a driving circuit (not shown), the driving circuit includes a first conductive part 11, and the driving circuit drives the daughter board 20 to display the picture through the first conductive part 11, the conductive adhesive 50 and the second conductive part 21.
Specifically, the height difference between two of the plurality of first glue material columns 30, the plurality of second glue material columns 40 and the plurality of conductive glues 50 is less than or equal to 15 micrometers, that is, the height difference between two first glue material columns 30 is less than or equal to 15 micrometers, the height difference between two second glue material columns 40 is less than or equal to 15 micrometers, the height difference between the first glue material columns 30 and the conductive glues 50 is less than or equal to 15 micrometers, and the height difference between the second glue material columns 40 and the conductive glues 50 is less than or equal to 15 micrometers.
Specifically, the height difference between two of the plurality of first glue material columns 30, the plurality of second glue material columns 40 and the plurality of conductive glues 50 is less than or equal to 15 micrometers, and the thickness uniformity of the fit gap between the daughter board 20 and the motherboard 10 is high.
Specifically, the gap distance between the motherboard 10 and the daughter board 20 is greater than or equal to 30 micrometers and less than or equal to 150 micrometers, and the gap between the motherboard 10 and the daughter board 20 is small, which is beneficial to the light and thin design of the tiled display device.
Specifically, as shown in fig. 5, the first glue column 30 has a third bonding area S3, and the second glue column 40 has a fourth bonding area S4, because the initial height of the first glue column 30 is greater than the initial height of the second glue column 40, and the initial bonding area of the first glue column 30 is equal to the initial bonding area of the second glue column 40, as the first glue column 30 and the second glue column 40 are compressed, the first glue column 30 and the second glue column 40 gradually diffuse around, and therefore, finally, the third bonding area S3 is greater than the fourth bonding area S4, that is, the bonding area of the first glue column 30 in the tiled display device shown in fig. 5 is greater than the bonding area of the second glue column 40.
Specifically, because the viscosity of the first glue material column 30 and the viscosity of the second glue material column 40 are higher, after the step B3, the volumes of the first glue material column 30 and the second glue material column 40 become smaller, but the first glue material column 30 is extruded in the whole process, and therefore, the volume change ratio of the first glue material column 30 is greater than the volume change ratio of the second glue material column 40, and finally, the density of the first glue material column 30 is greater than the density of the second glue material column 40. It should be noted that the volume change ratio of the first glue column 30 refers to a ratio of the volume of the first glue column 30 after pressing to the volume of the first glue column before pressing, and the volume change ratio of the second glue column 40 refers to a ratio of the volume of the second glue column 40 after pressing to the volume of the second glue column before pressing.
The method for manufacturing the tiled display device and the tiled display device provided by the embodiment of the application are described in detail above, a specific example is applied in the description to explain the principle and the implementation of the application, and the description of the embodiment is only used to help understand the method and the core idea of the application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (12)
1. A manufacturing method of a splicing display device is characterized by comprising the following steps:
step B1, providing a mother board and a daughter board;
step B2, forming a first glue material column and a second glue material column on the mother board or the daughter board, wherein the height of the first glue material column is larger than that of the second glue material column;
and step B3, performing press fit treatment on the mother board and the daughter board, so that the daughter board is bonded on the mother board through the first rubber material column and the second rubber material column.
2. The method for manufacturing a tiled display device according to claim 1, wherein in the step B2, the number of the second glue material columns is greater than the number of the first glue material columns.
3. The method for manufacturing a tiled display device according to claim 1, wherein in the step B2, the first glue column has a first height, the second glue column has a second height, and the first height is greater than the second height;
the step B3 includes:
step B31, pre-pressing the mother board and the daughter board, wherein the first rubber material column is compressed from the first height to the second height;
and step B32, performing main pressing treatment on the mother board and the daughter board, wherein the first glue material column and the second glue material column are compressed from the second height to a third height, and the third height is smaller than the second height.
4. The method for manufacturing a tiled display device according to claim 3, wherein in the step B31, when the first glue column has the first height, the pressure for pre-pressing the mother board and the daughter board is a first pressure; when the first rubber material column and the second rubber material column are at a second height, the pressure for performing main pressing treatment on the mother board and the daughter board is a second pressure, and the second pressure is greater than the first pressure;
in step B32, when the first glue material column and the second glue material column have a third height, a pressure of performing the main pressing process on the motherboard and the daughter board is a third pressure, and the third pressure is greater than the second pressure.
5. The method for manufacturing a tiled display device according to claim 4, wherein in the step B31, during the process of compressing the first glue column from the first height to the second height, the pressure for pre-pressing the mother board and the daughter board is gradually increased from the first pressure to the second pressure.
6. The method for manufacturing a tiled display device according to claim 4, wherein in the step B32, the pressure for the main pressing process on the mother board and the daughter board is gradually increased from the second pressure to the third pressure during the process of compressing the first glue column and the second glue column from the second height to the third height.
7. A method for manufacturing a tiled display according to claim 3, wherein in the step B1, the mother board is provided with a first conductive part, and the daughter board is provided with a second conductive part;
the step B2 further includes: forming a conductive adhesive on the first conductive part of the motherboard or the second conductive part of the daughter board, wherein the height of the conductive adhesive is less than that of the second adhesive material column;
in step B3, after the motherboard and the daughter board are subjected to the press-fitting process, the first conductive portion is electrically connected to the second conductive portion through the conductive adhesive.
8. A tiled display apparatus, comprising:
a motherboard;
a daughter board disposed opposite to the mother board;
the first rubber material column is arranged between the mother board and the daughter board, and the mother board and the daughter board are bonded together through the first rubber material column; and
the second rubber material column is arranged between the mother board and the daughter board, and the mother board and the daughter board are bonded together through the second rubber material column;
the bonding strength of the part between the mother board and the daughter board which is bonded through the first glue material column is greater than that of the part between the mother board and the daughter board which is bonded through the second glue material column.
9. A tiled display arrangement according to claim 8, wherein the number of the second glue columns is greater than the number of the first glue columns.
10. The tiled display apparatus of claim 8, wherein the height difference between two of the first and second glue columns is less than or equal to 15 μm.
11. A tiled display arrangement according to claim 8, wherein the bonding area of the first glue column is larger than the bonding area of the second glue column.
12. The tiled display arrangement according to claim 8, wherein the mother board is provided with a first conductive part and the daughter board is provided with a second conductive part;
the splicing display device further comprises a conductive adhesive arranged between the first conductive part and the second conductive part, and the first conductive part is electrically connected with the second conductive part through the conductive adhesive.
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