CN105328969B - A kind of package substrate manufacture method and package substrate - Google Patents
A kind of package substrate manufacture method and package substrate Download PDFInfo
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- CN105328969B CN105328969B CN201410392728.3A CN201410392728A CN105328969B CN 105328969 B CN105328969 B CN 105328969B CN 201410392728 A CN201410392728 A CN 201410392728A CN 105328969 B CN105328969 B CN 105328969B
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- glue
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Abstract
The disclosure provides a kind of package substrate manufacture method and package substrate, and the method for package substrate is used to encapsulate first substrate and second substrate, and this method comprises the following steps：The first glue material is coated with the first side of the first substrate；Solidify first glue material；The second glue material is coated with the second side of the second substrate, makes second glue material not fully cured；By the first side of the first substrate towards the second side of second substrate, first glue material is set to be aligned with the second glue material, and press the first substrate and second substrate；And solidify second glue material.
Description
Technical field
The disclosure generally relates to a kind of package substrate manufacture method and package substrate.
Background technology
Glass substrate encapsulation, which is carried out, currently with glue material generally includes following steps：1st, glue material 10 is coated on first substrate 1
Upper (such as Fig. 1)；2nd, second substrate 2 and first substrate 1 are aligned into placement (such as Fig. 2)；3rd, second substrate 2 and first substrate 1 are pressed
After conjunction, solidify glue material 10 (such as Fig. 3) therebetween.
Combined as shown in figure 3, second substrate 2 relies only on glue material 10 with first substrate 1 in its top end surface A, bonded area
It is small, and surface A is likely to the defects of out-of-flatness occur, therefore cause pressing packaging effect undesirable, and water oxygen over time
Air exhaustion easily mixes between surface A and first substrate 1, causes device damage.
Therefore, it is necessary to be improved to encapsulating structure and technique, to improve the associativity of package substrate.
Above- mentioned information is only used for strengthening the understanding to the background of the disclosure, therefore it disclosed in the background section
It can include not forming the information to prior art known to persons of ordinary skill in the art.
The content of the invention
A kind of package substrate manufacture method and package substrate are disclosed, to improve the associativity of package substrate, prevents water oxygen
In the incorporation package substrate such as gas.
The additional aspect and advantage of the disclosure will be set forth in part in the description, and partly will be from description
It is apparent from, or can be by the practice of the disclosure and acquistion.
According to an aspect of this disclosure, a kind of method of package substrate is used to encapsulate first substrate and second substrate, should
Method comprises the following steps：The first glue material is coated with the first side of the first substrate；Solidify first glue material；In second base
Second side of plate is coated with the second glue material, makes second glue material not fully cured；By the first side the second base of direction of the first substrate
Second side of plate, first glue material is aligned with the second glue material, and press the first substrate and second substrate；And make second glue
Material solidifies.
According to another aspect of the disclosure, a kind of package substrate, including：First substrate, its first side have the first glue
Material；And second substrate, its second side have the second glue material, second glue material aligns with first glue material, the first substrate and the
Two substrates press, wherein the second glue material at least covered section first glue material.
Brief description of the drawings
Its example embodiment is described in detail by referring to accompanying drawing, the above and other feature and advantage of the disclosure will become
It is more obvious.
Fig. 1 to Fig. 3 shows to carry out the schematic diagram of substrate package using existing method for packing.
Fig. 4 is the flow chart of the method for packing of the present invention.
Fig. 5 to Fig. 6 shows to carry out the schematic diagram of substrate package using the method for packing of the present invention.
Embodiment
Example embodiment is described more fully with referring now to accompanying drawing.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, these embodiments are provided so that the disclosure will
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.In figure, in order to clear
It is clear, exaggerate the thickness of region and layer.Identical reference represents same or similar structure in figure, thus will omit it
Detailed description.
Described feature, structure or characteristic can be incorporated in one or more embodiments in any suitable manner
In.In the following description, there is provided many details fully understand so as to provide to embodiment of the present disclosure.However,
It will be appreciated by persons skilled in the art that the technical scheme of the disclosure can be put into practice without one in the specific detail or more
It is more, or other methods, constituent element, material etc. can be used.In other cases, be not shown in detail or describe known features,
Material is operated to avoid each side of the fuzzy disclosure.
The present invention provides a kind of method of package substrate, for encapsulating first substrate 1 and second substrate 2, reference picture 4-6,
This method comprises the following steps：Step 1：The first glue material H1 is coated with the first side 10 of first substrate 1；Step 2：Make the first glue material
H1 solidifies；Step 3：Second substrate 2 the second side 20 be coated with the second glue material H2, make the second glue material H2 it is not fully cured (referring to
Fig. 5)；Step 4：By the first side 10 of first substrate 1 towards the second side 20 of second substrate 2, make the first glue material H1 and the second glue
Material H2 is aligned, and presses first substrate 1 and second substrate 2；And step 5：Make the second glue material H2 solidifications (referring to Fig. 6).
Wherein, the first glue material H1 and the second glue material H2 selects UV glue, and is solidified using UV, or selects Frit glue, and adopts
Use heat cure.Certainly, the species of glue material and curing mode not limited to this.
Wherein, in the step 3, the second glue material H2 is semi-solid preparation.Therefore, in pressing first substrate 1 and second substrate 2
During, the second glue material H2 can greatly coat the first glue material H1, increase bonded area.
Wherein, in the step 4, press the first substrate and after second substrate, second glue material coats first glue completely
Material, so that bonded area maximizes.
Wherein, in the step 5, during second glue material is cured, first glue material is by secondary solidification so that first
The intensity increase of glue material, improve the steadiness of encapsulation.
Wherein, first glue material is located at the surrounding of the first side of the first substrate.Second glue material is located at the second substrate
The second side surrounding.That is, the first glue material and the second glue material are by the tight combination of first substrate and first substrate.
The present invention also provides a kind of package substrate formed by above-mentioned method for packing, and its structure is as shown in Figure 6.Due to this hair
The method of bright package substrate is to align the first cured glue material H1 and the second glue material H2 not being fully cured, therefore is pressed
During first substrate 1 and second substrate 2, the second glue material H2 will coat at least partly the first glue material H1 so that first substrate 1
Increasing with the bonded area of second substrate 2, associativity is strong, so as to overcome existing packaging adhesive material faying face small, and uneven surface
It is whole, the problems such as encapsulation is bad is easily caused, therefore, can effectively avoid in the invasion substrate such as water oxygen, improve the panel life-span.Also, with
First glue material H1 and the second glue material H2 collective effects, it is possible to increase the steadiness of substrate package.In addition, by the first cured glue
Material H1 and the second glue material H2 not being fully cured are aligned, and the first cured glue material H1 can also play a supporting role, prevent from pressing
During the problems such as rocking cause substrate to offset, and avoid the element between first, second substrate from being squeezed, can omit
Other support members, therefore, structure and processing procedure can be simplified.
The illustrative embodiments of the disclosure are particularly shown and described above.It should be understood that the disclosure is not limited to institute
Disclosed embodiment, on the contrary, the disclosure is intended to cover the various modifications comprising in the spirit and scope of the appended claims
And equivalent arrangements.
Claims (6)
1. a kind of method of package substrate, for encapsulating first substrate and second substrate, this method comprises the following steps：
The first glue material is coated with the first side of the first substrate；
Solidify first glue material；
The second glue material is coated with the second side of the second substrate, makes second glue material not fully cured；
By the first side of the first substrate towards the second side of second substrate, first glue material is set to be aligned with the second glue material, and press
Close the first substrate and second substrate；And
Solidify second glue material；
Wherein, after pressing the first substrate and second substrate, the second glue material at least covered section first glue material, first glue
Material is located at the surrounding of the first side of the first substrate, and second glue material is located at the surrounding of the second side of the second substrate.
2. the method for claim 1, wherein making in the not fully cured step of second glue material, second glue material is
Semi-solid preparation.
3. the method for claim 1, wherein press the first substrate and after second substrate, second glue material is wrapped completely
Cover first glue material.
During 4. the method for claim 1, wherein second glue material is cured step, first glue material is by two
Secondary solidification.
5. a kind of package substrate, including：
First substrate, its first side have the first glue material；And
Second substrate, its second side have the second glue material, and second glue material aligns with first glue material, the first substrate and second
Substrate presses,
Wherein the second glue material at least covered section first glue material；
Wherein, first glue material is located at the surrounding of the first side of the first substrate, and second glue material is located at the second substrate
The surrounding of second side.
6. package substrate as claimed in claim 5, wherein, second glue material coats first glue material completely.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410392728.3A CN105328969B (en) | 2014-08-11 | 2014-08-11 | A kind of package substrate manufacture method and package substrate |
| TW103133458A TWI576926B (en) | 2014-08-11 | 2014-09-26 | Package substrate manufacturing method and package substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410392728.3A CN105328969B (en) | 2014-08-11 | 2014-08-11 | A kind of package substrate manufacture method and package substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105328969A CN105328969A (en) | 2016-02-17 |
| CN105328969B true CN105328969B (en) | 2018-01-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410392728.3A Active CN105328969B (en) | 2014-08-11 | 2014-08-11 | A kind of package substrate manufacture method and package substrate |
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| CN (1) | CN105328969B (en) |
| TW (1) | TWI576926B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114673721B (en) * | 2022-03-16 | 2023-09-26 | 武汉华星光电半导体显示技术有限公司 | Manufacturing method of spliced display device and spliced display device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103715107A (en) * | 2012-10-09 | 2014-04-09 | 矽品精密工业股份有限公司 | Method for manufacturing package stack structure |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1885369A (en) * | 2005-06-24 | 2006-12-27 | 悠景科技股份有限公司 | Glue sealing method and glue sealing structure for preventing moisture infiltration |
| TW200822315A (en) * | 2006-11-03 | 2008-05-16 | Siliconware Precision Industries Co Ltd | Sensor type semiconductor package and fabrication method thereof |
| CN101867024B (en) * | 2010-06-01 | 2011-10-05 | 友达光电股份有限公司 | Packaging method |
| JP5716743B2 (en) * | 2010-06-14 | 2015-05-13 | 旭硝子株式会社 | SEALING PASTE AND ELECTRONIC DEVICE MANUFACTURING METHOD USING THE SAME |
| CN103943657A (en) * | 2014-03-27 | 2014-07-23 | 京东方科技集团股份有限公司 | Display panel, packaging method of display panel and display device |
| CN103904253A (en) * | 2014-04-17 | 2014-07-02 | 上海和辉光电有限公司 | Packaging structure of OLED device and method thereof |
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2014
- 2014-08-11 CN CN201410392728.3A patent/CN105328969B/en active Active
- 2014-09-26 TW TW103133458A patent/TWI576926B/en active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103715107A (en) * | 2012-10-09 | 2014-04-09 | 矽品精密工业股份有限公司 | Method for manufacturing package stack structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI576926B (en) | 2017-04-01 |
| TW201606884A (en) | 2016-02-16 |
| CN105328969A (en) | 2016-02-17 |
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Address after: 201506, No. nine, No. 1568, Jinshan Industrial Zone, Shanghai, Jinshan District Patentee after: Shanghai Hehui optoelectronic Co., Ltd Address before: 201500, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District Patentee before: EverDisplay Optronics (Shanghai) Ltd. |