TW201600291A - Multi-point diamond tool - Google Patents

Multi-point diamond tool Download PDF

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TW201600291A
TW201600291A TW104112551A TW104112551A TW201600291A TW 201600291 A TW201600291 A TW 201600291A TW 104112551 A TW104112551 A TW 104112551A TW 104112551 A TW104112551 A TW 104112551A TW 201600291 A TW201600291 A TW 201600291A
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diamond tool
notches
diamond
notch
tool
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TWI654061B (en
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Hiroshi Soyama
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Mitsuboshi Diamond Ind Co Ltd
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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
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  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
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Abstract

The present invention provides a multi-point diamond tool, which can reduce the number of tool exchange, even if the sharp point is worn out by scribing. The outer periphery of the base 11 of the diamond tool 10 is provided with a plurality of notches 14-19 with each end part of the notch as a sharp point. The diamond tool 10 makes the sharp point contact the substrate for scribing without rolling. In the case that the sharp point is worn out by scribing, the diamond tool 10 is made to rotate to allow the other end part of the notch to become a scribing sharp point. Thereby, for one diamond tool, a plurality of sharp points can be used to reduce the exchange frequency.

Description

多點鑽石工具 Multi-point diamond tool

本發明是關於一種用於藉由鑽石尖點刻劃玻璃基板或矽晶圓等脆性材料基板的多點鑽石工具。 The present invention relates to a multi-point diamond tool for scribing a substrate of a brittle material such as a glass substrate or a tantalum wafer by a diamond tip.

習知為了刻劃玻璃基板或矽晶圓,採用使用有刻劃輪、或單結晶鑽石之鑽石尖點之工具。針對玻璃基板,一直以來主要是採用相對於基板滾動之刻劃輪,但從提高刻劃後之基板強度等優點來看,亦被檢討使用固定刀刃之鑽石尖點。在專利文獻1、2中提及有用於刻劃藍寶石晶圓或氧化鋁晶圓(alumina wafer)等高硬度之基板的尖點刀具。該等專利文獻中,使用有在角錐之稜線上設置有切割用尖點之工具、或前端成為圓錐之工具。此外,在專利文獻3中,為了刻劃玻璃板而提及有一種刻劃裝置,該刻劃裝置係使用具有圓錐形前端之玻璃劃線具。 Conventionally, in order to scribe a glass substrate or a tantalum wafer, a tool using a diamond cusp having a score wheel or a single crystal diamond is used. For the glass substrate, the scriber wheel is generally used for rolling with respect to the substrate. However, from the viewpoint of improving the strength of the substrate after the scribe, the diamond cusp using the fixed blade is also reviewed. Patent Documents 1 and 2 mention a sharp point cutter for marking a high hardness substrate such as a sapphire wafer or an alumina wafer. In these patent documents, a tool having a sharp point for cutting on a ridge line of a pyramid or a tool having a tip end tapered is used. Further, in Patent Document 3, in order to scribe a glass plate, there is mentioned a scribing device which uses a glass scribing tool having a conical front end.

專利文獻1:日本特開2003-183040號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2003-183040

專利文獻2:日本特開2005-079529號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2005-079529

專利文獻3:日本特開2013-043787號公報 Patent Document 3: Japanese Laid-Open Patent Publication No. 2013-043787

由於若以習知的固定刀刃之工具進行刻劃則尖點將產生磨耗(磨損),因此有必要變更尖點。在角錐形或圓錐形之工具中成為可使用之 頂點的尖點為二個部位或最多四個部位。因此存在有如下之問題點:當變更二個部位或四個部位之尖點時必須更換工具,且更換頻度高。此外,在利用工具進行之刻劃中,尖點必須以適切的角度接觸基板。然而,在習知的工具中,在變更尖點的情形時必須使工具繞軸方向旋轉,且不容易精度佳地調整該接觸角度。 Since the sharp points are worn (wearing) if they are scored by a conventional fixed blade tool, it is necessary to change the sharp points. Available in pyramidal or conical tools The apex of the apex is two parts or up to four parts. Therefore, there is a problem that the tool must be replaced when changing the sharp points of two parts or four parts, and the frequency of replacement is high. In addition, in the characterization of the tool, the cusp must contact the substrate at an appropriate angle. However, in the conventional tool, it is necessary to rotate the tool in the axial direction when the cusp is changed, and it is not easy to adjust the contact angle with high precision.

本發明係有鑑於如此般之習知問題點而完成,目的在於提供一種即使在刻劃中所使用之尖點磨耗,亦能夠容易地變更尖點位置並減少交換頻度之鑽石工具。 The present invention has been made in view of such conventional problems, and an object thereof is to provide a diamond tool capable of easily changing a cusp position and reducing an exchange frequency even when sharp point wear is used in scribing.

為解決該課題,本發明之多點鑽石工具,具備:基座,呈旋轉對稱且至少外周之稜線部分以鑽石形成;及多個缺口,形成於該基座之稜線部分。 In order to solve the problem, the multi-point diamond tool of the present invention comprises: a susceptor which is rotationally symmetrical and at least a ridge line portion of the outer circumference is formed of diamonds; and a plurality of notches formed in a ridge line portion of the susceptor.

此處,較佳為:該各缺口,等間隔地形成於該基座之外周上。 Here, it is preferable that the notches are formed at equal intervals on the outer circumference of the susceptor.

此處,較佳為:該基座,在其稜線部分形成有鑽石層。 Here, it is preferable that the susceptor has a diamond layer formed on a ridge line portion thereof.

此處,較佳為:在該各缺口之兩端部分具有更微小缺口。 Here, it is preferable that the both ends of the notches have a smaller notch.

此處,較佳為:該各缺口藉由雷射加工而形成。 Here, it is preferable that each of the notches is formed by laser processing.

此處,較佳為:該各微小缺口藉由機械加工而形成。 Here, it is preferable that each of the minute notches is formed by machining.

根據具有如此般之特徵的本發明,藉由在鑽石工具周圍形成有多數個缺口,而能夠設置多數個尖點。因此能夠獲得如下之效果:即使一個尖點磨耗(磨損),亦能夠藉由使鑽石工具之固定角度改變而使用新的尖點,且能夠減少鑽石工具之交換頻度。進一步地,由於能夠在相對於基板使工具之安裝角度維持一定的狀態下變更尖點,因此能夠容易地調整尖點之接觸角度。 According to the present invention having such a general feature, a plurality of sharp points can be provided by forming a plurality of notches around the diamond tool. Therefore, it is possible to obtain an effect that even if a sharp point is worn (wearing), a new sharp point can be used by changing the fixed angle of the diamond tool, and the frequency of exchange of the diamond tool can be reduced. Further, since the sharp point can be changed while maintaining the mounting angle of the tool with respect to the substrate, the contact angle of the sharp point can be easily adjusted.

10、30、40‧‧‧多點鑽石工具 10, 30, 40‧ ‧ multi-point diamond tools

11、31、41‧‧‧基座 11, 31, 41‧‧‧ Pedestal

12、32、42‧‧‧貫通孔 12, 32, 42‧‧‧through holes

13、33、43‧‧‧研磨面 13, 33, 43‧‧‧ polished surface

14~19、34~37、44~47‧‧‧缺口 14~19, 34~37, 44~47‧‧‧ gap

44a、44b、45a、45b、46a、46b、47a、47b‧‧‧微小缺口 44a, 44b, 45a, 45b, 46a, 46b, 47a, 47b‧‧‧ tiny gaps

圖1,係本發明之第1實施形態之多點鑽石工具的前視圖及側視圖。 Fig. 1 is a front view and a side view of a multi-point diamond tool according to a first embodiment of the present invention.

圖2,係表示本實施形態之鑽石工具之缺口之第一例的放大圖。 Fig. 2 is an enlarged view showing a first example of a notch of the diamond tool of the embodiment.

圖3,係表示本實施形態之鑽石工具之缺口之第二例的放大圖。 Fig. 3 is an enlarged view showing a second example of the notch of the diamond tool of the embodiment.

圖4A,係表示使用了本發明之第1實施形態之鑽石工具之刻劃的前視圖。 Fig. 4A is a front view showing the scribing of the diamond tool according to the first embodiment of the present invention.

圖4B,係表示使用了本發明之第1實施形態之鑽石工具之刻劃的側視圖。 Fig. 4B is a side view showing the scribing of the diamond tool according to the first embodiment of the present invention.

圖5,係表示本發明之第2實施形態之鑽石工具之前視圖、及使用了該鑽石工具之刻劃的圖。 Fig. 5 is a front view showing a diamond tool according to a second embodiment of the present invention, and a view using the diamond tool.

圖6,係表示本發明之第3實施形態之鑽石工具之前視圖、及使用了該鑽石工具之刻劃的圖。 Fig. 6 is a front view showing a diamond tool according to a third embodiment of the present invention, and a view using the diamond tool.

接著,針對本發明之第1實施形態進行說明。圖1係表示本實施形態之多點鑽石工具(以下,簡稱鑽石工具)10之一例的前視圖及側視圖。該鑽石工具10係由單結晶鑽石構成旋轉對稱形之圓板之基座11,且在其中心具有貫通孔12。單結晶鑽石之基座11之直徑,例如為2mm~20mm。如圖1(a)之側視圖所示,從圓周部分之兩側研磨成V字形而成為由稜線13a與傾斜面13b構成之刃前端部13。而且如圖示般在刃前端部13之六個部位,藉由雷射加工而形成缺口14~19。圖2係表示第1例之缺口14A的放大圖。如圖2所示,對由實線與一點鏈線所示之原本的圓周部形成如圖示般 之缺口14A,且以稜線13a與缺口14A相交之部分作為尖點P1。從該尖點P1起例如以將相對於切線之角度α設為35°之方式切至例如約5μm之深度,進一步從該處起相對於原切線例如以3.5°之角度切開,而形成缺口14A。關於其他之五個缺口亦相同,並將稜線13a與缺口15A~19A之交點分別設為尖點P2~P6。 Next, a first embodiment of the present invention will be described. Fig. 1 is a front view and a side view showing an example of a multi-point diamond tool (hereinafter, simply referred to as a diamond tool) 10 of the present embodiment. The diamond tool 10 is a base 11 of a circularly symmetrical circular disk formed of a single crystal diamond and has a through hole 12 at its center. The diameter of the base 11 of the single crystal diamond is, for example, 2 mm to 20 mm. As shown in the side view of Fig. 1(a), the both ends of the circumferential portion are polished into a V shape to form a blade tip end portion 13 composed of a ridge line 13a and an inclined surface 13b. Further, as shown in the figure, the notches 14 to 19 are formed by laser processing at six locations of the blade tip end portion 13. Fig. 2 is an enlarged view showing the notch 14A of the first example. As shown in Fig. 2, the original circumferential portion shown by the solid line and the one-point chain line is formed as shown in the figure. The notch 14A is a portion where the ridge line 13a intersects the notch 14A as the cusp P1. From the cusp point P1, for example, the angle α with respect to the tangential line is set to 35°, for example, to a depth of about 5 μm, and further from this point, for example, at an angle of 3.5° with respect to the original tangent line, the notch 14A is formed. . The other five notches are also the same, and the intersection of the ridge line 13a and the notches 15A to 19A is set as the sharp point P2 to P6, respectively.

圖3係表示缺口14之第2例之缺口14B的放大圖。在該情形,從尖點P1起例如以將相對於切線之角度α設為35°之方式切至深度10μm後,呈階段狀地切開,而構成缺口。關於其他之五個缺口亦相同,並將稜線13a與缺口15B~19B之交點分別設為尖點P2~P6。 FIG. 3 is an enlarged view showing the notch 14B of the second example of the notch 14. In this case, for example, the cusp P1 is cut to a depth of 10 μm so that the angle α with respect to the tangential line is 35°, and then cut in a stepwise manner to form a notch. The other five gaps are also the same, and the intersections of the ridge line 13a and the notches 15B to 19B are respectively pointed as sharp points P2 to P6.

針對使用該實施形態之鑽石工具10進行刻劃的情形,使用圖4A、圖4B進行說明。此外,在圖4A、圖4B中誇張放大表示圓周部之缺口,而圖4A係從正面(前視)觀察下之側視圖,圖4B係從圖4A之右側觀察下之側視圖。在進行刻劃時,如圖4A(a)、圖4B(a)所示般,將鑽石工具10之一個尖點P1對著基板20固定並使基板20往圖示之箭頭A方向移動,以進行刻劃。此時,由於不使鑽石工具10滾動,因此能夠以相同尖點進行刻劃。在與基板相接觸之尖點已因磨耗而劣化的情形時,如圖4A(b)、圖4B(b)所示般,以貫通孔12為中心使鑽石工具10旋轉60°,使相鄰之尖點P2與基板20接觸,並以同樣的方式進行刻劃。若重複進行此動作,則即使尖點因磨耗而劣化,亦能夠依形成在圓板周圍之缺口數量而以新的尖點進行刻劃。此外,即便使鑽石工具10旋轉,由於在鑽石工具10之側視觀察下,刃前端之稜線與基板接觸之角度θ不變,因此可容易地調整尖點相對於基板之接觸角度。 The case where the diamond tool 10 of this embodiment is scribed will be described with reference to FIGS. 4A and 4B. Further, in FIGS. 4A and 4B, the notch of the circumferential portion is exaggeratedly enlarged, and FIG. 4A is a side view from the front (front view), and FIG. 4B is a side view as viewed from the right side of FIG. 4A. When scribing, as shown in FIGS. 4A(a) and 4B(a), one sharp point P1 of the diamond tool 10 is fixed to the substrate 20, and the substrate 20 is moved in the direction of the arrow A shown in the figure. Perform a scribe. At this time, since the diamond tool 10 is not rolled, it is possible to perform scribing with the same sharp point. When the sharp point in contact with the substrate has deteriorated due to abrasion, as shown in FIGS. 4A(b) and 4B(b), the diamond tool 10 is rotated by 60° around the through hole 12 to make the adjacent The sharp point P2 is in contact with the substrate 20 and is scored in the same manner. When this operation is repeated, even if the sharp point is deteriorated by abrasion, it is possible to scribe with a new sharp point depending on the number of notches formed around the circular plate. Further, even if the diamond tool 10 is rotated, since the angle θ at which the ridge line of the tip end of the blade contacts the substrate does not change from the side view of the diamond tool 10, the contact angle of the cusp with respect to the substrate can be easily adjusted.

此外,雖在該實施形態中,在圓板之周圍設置有六個部位之缺口,但較佳為在圓周部盡可能設置多個缺口。缺口數之上限為相鄰之尖點相互不干擾之數量。藉此在各尖點已磨耗時只要使鑽石工具旋轉便能夠更換尖點,且能夠減少鑽石工具10之更換頻度。 Further, in this embodiment, the notch of six portions is provided around the disk, but it is preferable to provide a plurality of notches as much as possible in the circumferential portion. The upper limit of the number of notches is the number of adjacent cusps that do not interfere with each other. Thereby, the cusp can be replaced by rotating the diamond tool when the cusps are worn, and the frequency of replacement of the diamond tool 10 can be reduced.

接著使用圖5針對本發明之第2實施形態進行說明。該實施形態之鑽石工具30亦與第1實施形態同樣地,在單結晶鑽石之圓板型之基座31之中心具有貫通孔32,且具有從其圓周兩側研磨成V字形而成之刃前端33。而且雖在上述之第1實施形態中將缺口之形狀設為非對稱,但在第2實施形態中如圖5(a)所示般,沿鑽石工具30之圓周形成有圓弧狀之缺口34~37。如此般之缺口能夠藉由雷射加工而容易形成。 Next, a second embodiment of the present invention will be described with reference to Fig. 5 . Similarly to the first embodiment, the diamond tool 30 of the embodiment has a through hole 32 in the center of the disk-shaped base 31 of the single crystal diamond, and has a blade which is ground into a V shape from both sides of the circumference. Front end 33. Further, in the first embodiment described above, the shape of the notch is asymmetrical. However, in the second embodiment, as shown in Fig. 5(a), an arc-shaped notch 34 is formed along the circumference of the diamond tool 30. ~37. Such a gap can be easily formed by laser processing.

在該鑽石工具30中,如圖5(b)所示般以一個缺口34之端部作為尖點而對基板20進行刻劃。而且在該尖點已磨耗之情形時,與上述之實施形態同樣地,使鑽石工具30沿插通於貫通孔之省略圖示之軸旋轉90°,以使相鄰之缺口35之端部作為尖點而進行刻劃。藉由重複進行此動作則能夠使用四個部位之尖點。而且一旦四個部位之尖點完全磨耗,則進一步地如圖5(c)所示般,使該鑽石工具30反轉。然後能夠以各缺口34~37之不同頂點作為尖點而同樣地進行刻劃。因此能夠以合計八個部位之尖點進行刻劃。 In the diamond tool 30, as shown in Fig. 5(b), the substrate 20 is scored with the end portion of one notch 34 as a sharp point. Further, when the cusp is worn, the diamond tool 30 is rotated by 90° along the axis (not shown) inserted through the through hole, so that the end of the adjacent notch 35 is used as in the above-described embodiment. Scratch and scribe. By repeating this action, it is possible to use the sharp points of the four parts. Further, once the sharp points of the four portions are completely worn, the diamond tool 30 is further reversed as shown in Fig. 5(c). Then, the different vertices of the notches 34 to 37 can be used as the sharp points to perform the same scribing. Therefore, it is possible to perform scoring in a total of eight points.

接著使用圖6針對本發明之第3實施形態進行說明。該實施形態之鑽石工具40亦與第1實施形態同樣地,在單結晶鑽石之圓板型之基座41之中心具有貫通孔42,且具有從其圓周兩側研磨成V字形而成之刃前端43。而且與上述之第2實施形態同樣地,藉由雷射而於圓周部之四個部 位形成圓弧狀之缺口44~47。進一步地,在缺口44之兩端部分藉由機械加工形成圓弧狀之微小缺口44a、44b。亦針對其他之缺口45、46、47同樣地在兩端位置形成較小之圓弧狀之微小缺口45a、45b、46a、46b、47a、47b。在該情形,圓周上之較小的缺口,能夠藉由以機械加工進行研磨而精密地對缺口部分之形狀進行整形,並且能夠使其表面粗糙度變小。 Next, a third embodiment of the present invention will be described with reference to Fig. 6 . In the same manner as in the first embodiment, the diamond tool 40 of the embodiment has a through hole 42 at the center of the disc-shaped base 41 of the single crystal diamond, and has a blade that is ground into a V shape from both sides of the circumference. Front end 43. Further, in the same manner as in the second embodiment described above, the four portions of the circumference portion are formed by laser irradiation. The positions are formed into arc-shaped notches 44 to 47. Further, the arcuate minute notches 44a, 44b are formed by machining at both end portions of the notch 44. Similarly to the other notches 45, 46, and 47, small arc-shaped micro-notches 45a, 45b, 46a, 46b, 47a, and 47b are formed at both end positions. In this case, the small notch on the circumference can precisely shape the shape of the notch portion by grinding by machining, and the surface roughness can be made small.

在使用該鑽石工具40進行刻劃時如圖6(b)所示般,以稜線與微小缺口之交點作為尖點而進行刻劃。在該位置已磨耗的情形時,使鑽石工具40每次旋轉90°以使用相鄰之缺口之尖點。據此能夠四次改變尖點位置以進行刻劃。而且一旦四個部位之尖點完全磨耗,則如圖6(c)所示般,使鑽石工具40反轉。據此能夠以各缺口44~47之不同之缺口外側作為尖點而同樣地進行刻劃。如此般能夠四次改變尖點位置以進行刻劃,能夠更換合計八次之尖點以進行刻劃。 When the diamond tool 40 is used for scribing, as shown in FIG. 6(b), the intersection of the ridge line and the minute notch is used as a sharp point. In the event that the position is worn, the diamond tool 40 is rotated 90° each time to use the sharp points of adjacent notches. According to this, the position of the cusp can be changed four times for scribing. Further, once the sharp points of the four portions are completely worn, the diamond tool 40 is reversed as shown in Fig. 6(c). Accordingly, the outer side of the notch of each of the notches 44 to 47 can be similarly scored as a sharp point. In this way, the position of the cusp can be changed four times to perform the scribe, and the cusp of the total of eight times can be replaced for characterization.

此外,在上述之第2、第3實施形態中,雖在成為基座之圓板之周圍設置有四個部位之缺口,但當然能夠設置更多個缺口而使尖點數變多。在第2、第3實施形態中雖將缺口設成圓弧狀,但只要在鑽石工具之側視觀察下為左右對稱形狀則亦可切成V字形、U字形等任意之形狀。此外,在第3實施形態中,微小缺口亦可為直線狀。進一步地,關於缺口之形成方法,除了雷射加工外,亦能夠使用研削或放電加工等周知的加工法。 Further, in the second and third embodiments described above, the notch of four portions is provided around the circular plate that serves as the susceptor. However, it is needless to say that more notches can be provided and the number of cusps can be increased. In the second and third embodiments, the notch is formed in an arc shape, but it may be cut into a V shape or a U shape in any shape as long as it is bilaterally symmetrical in the side view of the diamond tool. Further, in the third embodiment, the minute notches may be linear. Further, as for the method of forming the notch, in addition to the laser processing, a well-known processing method such as grinding or electric discharge machining can be used.

在上述之各實施形態中,在圓板之周圍等間隔地設置有缺口。該情形若設成等間隔雖具有如下之效果:能夠使缺口數變多,並且能夠藉由以固定的角度旋轉鑽石工具而變更尖點,且能夠容易使尖點之接觸角度固定,但並不一定要為等間隔。 In each of the above embodiments, the notches are provided at equal intervals around the circular plate. In this case, the equal interval is effective in that the number of notches can be increased, and the sharp point can be changed by rotating the diamond tool at a fixed angle, and the contact angle of the pointed point can be easily fixed, but it is not Must be at equal intervals.

此外,在上述之實施形態中,雖以單結晶鑽石構成圓板整體,但由於只要在表面部分具有鑽石層便足夠,因此亦可在超硬合金或燒結鑽石製之基座之刃前端部分之表面形成多結晶鑽石層並在此形成缺口。此外,亦可使用摻有硼等不純物、擁有導電性之單結晶或多結晶鑽石。藉由使用具有導電性之鑽石,能夠藉由放電加工而容易地形成缺口。 Further, in the above-described embodiment, the single crystal diamond is used to form the entire circular plate. However, since it is sufficient to have a diamond layer on the surface portion, it may be in the front end portion of the pedestal blade of the super hard alloy or the sintered diamond. The surface forms a layer of polycrystalline diamond and forms a gap therein. Further, a single crystal or a polycrystalline diamond having conductivity and containing impurities such as boron may also be used. By using a conductive diamond, it is possible to easily form a notch by electrical discharge machining.

此外,在上述之各實施形態中雖將鑽石工具之基座設成圓板狀,但並不一定要為圓板狀,亦可將基座設成多角形。基座只要相對於貫通孔之中心為旋轉對稱即可。在切割多角形之基座時,亦可將包含頂點之部分切成直線狀,亦可將包含頂點之部分切成V字形、U字形等任意之形狀。此外,可以頂點作為基點呈左右非對稱地切成V字形或U字形等任意形狀的方式設定尖點。在任何的情形,均能夠以稜線與缺口形成成為尖點之交點的方式形成缺口。 Further, in each of the above embodiments, the base of the diamond tool is formed in a disk shape, but it is not necessarily required to have a disk shape, and the base may be formed in a polygonal shape. The base may be rotationally symmetrical with respect to the center of the through hole. When the pedestal of the polygon is cut, the portion including the apex may be cut into a straight line, or the portion including the apex may be cut into a V shape or a U shape. Further, the apex may be set such that the apex is a base point which is asymmetrically cut into a V shape or a U shape. In any case, the notch can be formed in such a manner that the ridge line and the notch form a point of intersection of the sharp points.

本發明之多點鑽石工具能夠使用於刻劃脆性材料基板之刻劃裝置中,尤其是對於使鑽石工具之磨耗變多的高硬度之刻劃對象亦能夠很有效地使用。 The multi-point diamond tool of the present invention can be used in a scoring apparatus for scribing a substrate of a brittle material, and in particular, a scribing object of high hardness which increases the wear of the diamond tool can be used effectively.

10‧‧‧多點鑽石工具 10‧‧‧Multiple diamond tools

11‧‧‧基座 11‧‧‧Base

12‧‧‧貫通孔 12‧‧‧through holes

13‧‧‧研磨面 13‧‧‧Grinding surface

13a‧‧‧稜線 13a‧‧‧ ridgeline

13b‧‧‧傾斜面 13b‧‧‧ sloped surface

14~19‧‧‧缺口 14~19‧‧‧ gap

Claims (6)

一種多點鑽石工具,其特徵在於具備:基座,呈旋轉對稱且至少外周之稜線部分以鑽石形成;及多個缺口,形成於該基座之稜線部分。 A multi-point diamond tool comprising: a susceptor having rotational symmetry and at least a peripheral portion of a ridge line portion formed of diamonds; and a plurality of notches formed at a ridge line portion of the base. 如申請專利範圍第1項之多點鑽石工具,其中,該各缺口,等間隔地形成於該基座之外周上。 The multi-point diamond tool of claim 1, wherein the notches are formed at equal intervals on the outer circumference of the base. 如申請專利範圍第1項之多點鑽石工具,其中,該基座,在其稜線部分形成有鑽石層。 For example, in the multi-point diamond tool of claim 1, wherein the base has a diamond layer formed on a ridgeline portion thereof. 如申請專利範圍第1項之多點鑽石工具,其中,在該各缺口之兩端部分具有更微小缺口。 For example, the multi-point diamond tool of claim 1 has a smaller gap at both ends of the gap. 如申請專利範圍第1項之多點鑽石工具,其中,該各缺口藉由雷射加工而形成。 For example, in the multi-point diamond tool of claim 1, wherein the notches are formed by laser processing. 如申請專利範圍第4項之多點鑽石工具,其中,該各微小缺口藉由機械加工而形成。 For example, in the multi-point diamond tool of claim 4, wherein the micro-nicks are formed by machining.
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