TW201544246A - Double-end surface grinding method and double-end surface grinder - Google Patents
Double-end surface grinding method and double-end surface grinder Download PDFInfo
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- TW201544246A TW201544246A TW104105971A TW104105971A TW201544246A TW 201544246 A TW201544246 A TW 201544246A TW 104105971 A TW104105971 A TW 104105971A TW 104105971 A TW104105971 A TW 104105971A TW 201544246 A TW201544246 A TW 201544246A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
本發明涉及一種對工件進行兩頭平面磨削的兩頭平面磨削法及兩頭平面磨床。 The invention relates to a two-face grinding method and a two-face surface grinding machine for performing two-side surface grinding on a workpiece.
在橫型兩頭平面磨床中,在磨削矽晶圓等的薄板狀工件的兩側面時,在用一對靜壓墊從板厚方向的兩側靜壓支撐工件的狀態下,一邊透過載體使該工件旋轉,一邊藉由一對磨削磨石將工件的兩面磨削成規定的厚度。 In the horizontal two-end surface grinding machine, when both sides of the thin plate-shaped workpiece such as a silicon wafer are ground, the workpiece is statically supported by the pair of static pressure pads from both sides in the thickness direction. The workpiece is rotated, and both sides of the workpiece are ground to a predetermined thickness by a pair of grinding stones.
在使用真空吸附式的搬入搬出手段,相對於載體而搬入搬出工件的情況,經過一側的靜壓墊對工件的真空吸附,在搬入搬出手段和一側的靜壓墊之間進行工件的接遞(專利文獻1)。 When a vacuum suction type loading/unloading means is used to carry in and out the workpiece with respect to the carrier, vacuum suction of the workpiece is performed by the static pressure pad on one side, and the workpiece is connected between the loading/unloading means and the static pressure pad on one side. Hand (Patent Document 1).
例如,在將磨削後的工件從載體向機外排出的情況,在停止來自兩個靜壓墊的靜壓水的供給的同時,藉由一側的靜壓墊真空吸附工件,暫且將工件固定於一側的靜壓墊上。接著,向載體和另一側靜壓墊之間插入搬出手段,藉由該搬出手段與一側靜壓墊從兩側夾住載體內的工件,然後,在該狀態下進行工件從靜壓墊到搬出手段的接遞。 For example, in the case where the ground workpiece is discharged from the carrier to the outside of the machine, while the supply of the static pressure water from the two static pressure pads is stopped, the workpiece is vacuum-adsorbed by the static pressure pad on one side, and the workpiece is temporarily held. Fixed on one side of the static pressure pad. Next, a loading and unloading means is inserted between the carrier and the other static pressure pad, and the workpiece in the carrier is sandwiched from both sides by the carrying-out means and the one-side static pressure pad, and then the workpiece is pressed from the static pressure pad in this state. Delivery to the means of moving out.
[專利文獻1]日本特開2013-215813號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-215813
在這樣現有的搬入搬出方法中,將工件真空附著於一側靜壓墊時,由於該吸附力,工件被強力按壓於一側靜壓墊側上,故具有工件的被吸附面側產生凹痕、缺陷的問題。 In the conventional loading/unloading method, when the workpiece is vacuum-attached to one of the static pressure pads, the workpiece is strongly pressed against the one side of the static pressure pad due to the suction force, so that the suction side of the workpiece has a dent. , the problem of defects.
即使工件上產生凹痕、缺陷,如果是在工件向機器內搬入時或搬入之前產生的情況,則可在磨削工程中除去該凹痕、缺陷,但是如果在磨削後的工件搬出時產生凹痕、缺陷,則直接導致工件中出現不合格品。 Even if dents or defects are generated on the workpiece, if it is generated when the workpiece is moved into the machine or before being carried in, the dents and defects can be removed in the grinding process, but if the workpiece is moved out after grinding Dent and defects directly lead to the occurrence of defective products in the workpiece.
另外,在一側的靜壓墊上真空吸附工件的情況,需要包含真空泵的真空管路等的設備,具有提高設備成本的問題。進一步,在工件真空吸附時具有下述危險:真空管線中混入磨削水、靜壓支持用的靜壓水,由於該磨削水、靜壓水導致真空管線的壓力感測器或真空泵損傷或破損等,具有其維護與管理需要花費成本和時間的缺點。 Further, in the case where the workpiece is vacuum-adsorbed on the static pressure pad on one side, a device such as a vacuum line including a vacuum pump is required, which has a problem of increasing the equipment cost. Further, when the workpiece is vacuum-adsorbed, there is a risk that the vacuum line is mixed with the grinding water and the static pressure water for the static pressure support, and the pressure sensor or the vacuum pump of the vacuum line is damaged due to the grinding water or the static pressure water or Damage, etc., have the disadvantage of cost and time for maintenance and management.
作為防止這樣的凹痕、缺陷的方法,可以考慮到透過調節器減弱真空吸附力,以較弱的真空吸附力吸附工件。但是,只要工件直接接觸靜壓墊的保持面,即使減弱真空吸附力也無法完全防止工件的凹痕、缺陷。 As a method of preventing such dents and defects, it is conceivable that the vacuum suction force is weakened by the regulator, and the workpiece is adsorbed with a weak vacuum adsorption force. However, as long as the workpiece directly contacts the holding surface of the static pressure pad, even if the vacuum suction force is weakened, the dents and defects of the workpiece cannot be completely prevented.
另外,作為針對凹痕、缺陷的其它防止方法,可以考慮不使用真空吸附而利用水的表面張力。但是,在工件搬入時,不僅無法使用水的表面張力,也難以確認靜壓墊所致的工件的吸附,為了判斷工件的缺口部與載體的卡合部的嵌合是否成功,需要另外設置真空式的感測器。因此,雖然未採用真空吸附,但是具有無法排除真空管線的問題。 Further, as another method of preventing dents and defects, it is conceivable to utilize the surface tension of water without using vacuum adsorption. However, when the workpiece is carried in, it is difficult to confirm the surface tension of the water, and it is difficult to confirm the suction of the workpiece by the static pressure pad. In order to determine whether the fitting of the notch portion of the workpiece and the engagement portion of the carrier is successful, it is necessary to additionally provide a vacuum. Type of sensor. Therefore, although vacuum adsorption is not employed, there is a problem that the vacuum line cannot be eliminated.
進一步地,由於無法藉由靜壓墊吸附工件,故例如透過預先設定計時器,該計時器設定了吸附工件所需要的作業時間,透過該計時器測定作業時間,從時間上確認工件的吸附結束時間。但是,在該情況有下述問題,工件吸附的確認需要充足的時間,作業效率低下,不僅如此,由於無法直接確認工件吸附結束,缺乏可靠性。 Further, since the workpiece cannot be sucked by the static pressure pad, for example, by setting a timer in advance, the timer sets the working time required for sucking the workpiece, and the working time is measured by the timer, and the end of the suction of the workpiece is confirmed from the time. time. However, in this case, there is a problem in that the confirmation of the workpiece suction requires sufficient time and the work efficiency is lowered, and the reliability is not confirmed because the workpiece adsorption end cannot be directly confirmed.
本發明鑒於現有的問題,其目的在於提供一種兩頭平面磨削法及兩頭平面磨床,可防止工件在接遞時由於靜壓墊導致的工件的損傷,並且可容易地確認在靜壓墊側的工件的保持,而且可降低設備成本、管理和維護成本。 The present invention has been made in view of the existing problems, and an object thereof is to provide a two-face surface grinding method and a two-face surface grinder, which can prevent damage of a workpiece due to a static pressure pad during pick-up, and can be easily confirmed on the static pressure pad side. Workpiece retention while reducing equipment cost, management and maintenance costs.
本發明涉及一種兩頭平面磨削法,在該方法中,一邊透過載體(carrier)旋轉由一對靜壓墊靜壓支持的薄板狀的工件,一邊藉由一對磨削磨石磨削該工件的兩面,其中,在接遞該載體內的該工件時,從一側的該靜壓墊向該工件側噴射流體,藉由此時的伯努利效應(Bernoulli effect)所產生的負壓,在該一側的靜壓墊側以 非接觸的方式吸引保持該工件。 The present invention relates to a two-face surface grinding method in which a thin plate-shaped workpiece supported by a pair of static pressure pads is rotated through a carrier, and the workpiece is ground by a pair of grinding stones. On both sides of the carrier, when the workpiece in the carrier is delivered, the static pressure pad from one side is ejected to the workpiece side, and the negative pressure generated by the Bernoulli effect is On the side of the static pressure pad on the side The non-contact approach attracts the workpiece.
也有下述情況,即,由搬入手段吸附的該工件抵達前進保持位置的該一側的靜壓墊後,從該一側的靜壓墊向該工件側噴射流體,在該一側的靜壓墊側以非接觸的方式吸引保持該工件。另外,也具有下述情況,即,在該一側的靜壓墊側對該工件吸引保持的大致同時或者吸引保持之後馬上解除該搬入手段的真空吸附。 There is also a case where the workpiece sucked by the loading means reaches the static pressure pad on the one side of the forward holding position, and the fluid is ejected from the static pressure pad on the one side to the workpiece side, and the static pressure on the side The pad side is attracted to hold the workpiece in a non-contact manner. Further, there is a case where the vacuum suction of the loading means is released immediately after the suction/holding of the workpiece on the static pressure pad side of the one side or the suction holding.
也可以使另一個該靜壓墊前進至前進保持位置,藉由該兩靜壓墊從兩側夾持該工件,在解除來自該一側的靜壓墊的流體的噴射之後,向該兩靜壓墊供給靜壓流體而靜壓支持該工件。 Alternatively, the other static pressure pad may be advanced to the forward holding position, and the workpiece is clamped from both sides by the two static pressure pads, and after the ejection of the fluid from the static pressure pad of the one side is released, the two statics are The pressure pad supplies a static pressure fluid and static pressure supports the workpiece.
也可以在該工件的磨削後,與停止向該各靜壓墊的靜壓流體的供給的大致同時或者停止供給之後馬上從該一側的靜壓墊噴射流體,在該一側的靜壓墊側以非接觸的方式吸引保持該工件。 After the grinding of the workpiece, the fluid may be ejected from the static pressure pad on the side immediately after the supply of the static pressure fluid to the static pressure pads is stopped or immediately after the supply is stopped, and the static pressure on the side may be The pad side is attracted to hold the workpiece in a non-contact manner.
較佳為,與由該一側的靜壓墊吸引保持該工件的大致同時,或者吸引保持之後馬上從該另一靜壓墊供給靜壓流體,在消除靜壓流體的表面張力的影響的同時,將該工件向一側的該靜壓墊側擠壓。 Preferably, the static pressure fluid is supplied from the other static pressure pad substantially simultaneously with the suction of the workpiece by the static pressure pad on the one side, or immediately after the suction is held, while eliminating the influence of the surface tension of the static pressure fluid. The workpiece is pressed to the side of the static pressure pad on one side.
較佳為,藉由該一側的靜壓墊和搬出手段從兩側夾持磨削後的該工件,與由該搬出手段真空吸附該工件的大致同時或真空吸附之後馬上解除該一側的靜壓墊的吸引保持,從該一側的靜壓墊供給靜壓流體,使該工件離開該一側的靜壓墊。該流體也可為壓縮空氣。 Preferably, the workpiece is clamped from both sides by the static pressure pad and the unloading means on the one side, and the side is released immediately after vacuum suction of the workpiece by the unloading means or vacuum adsorption. The suction of the static pressure pad is maintained, and the static pressure fluid is supplied from the static pressure pad on the one side to move the workpiece away from the static pressure pad on the one side. The fluid can also be compressed air.
本發明還涉及一種兩頭平面磨床,其具有: 載體,該載體使薄板狀的工件旋轉;一對靜壓墊,該一對靜壓墊靜壓支持該載體內的該工件;一對磨削磨石,該一對磨削磨石由該靜壓墊靜壓支持,對旋轉的該工件的兩面進行磨削;以及搬入搬出手段,該搬入搬出手段吸附該工件,並相對於該一對靜壓墊之間進行搬入搬出,一側的該靜壓墊具有噴射孔,該噴射孔用於向該工件側噴出流體,藉由此時的伯努利效應所產生的負壓,在該一側的靜壓墊側以非接觸的方式吸引保持該工件。 The invention also relates to a two-head surface grinder having: a carrier that rotates a thin plate-shaped workpiece; a pair of static pressure pads that statically support the workpiece in the carrier; a pair of grinding stones, the pair of grinding stones The pressure pad is supported by static pressure to grind both sides of the rotating workpiece; and the loading/unloading means sucks the workpiece and carries it in and out with respect to the pair of static pressure pads, and the static movement on one side The pressure pad has an injection hole for discharging the fluid to the workpiece side, and the negative pressure generated by the Bernoulli effect at this time is sucked and held in a non-contact manner on the static pressure pad side of the one side. Workpiece.
該噴射孔也可配置於圓周方向的複數個位置,該圓周方向包括與該工件的缺口部卡合的該載體的卡合部的附近。也可具有感測器,該感測器根據從該噴射孔噴出的流體的流量或壓力的變化,確認該工件的吸引保持。 The injection holes may be disposed at a plurality of positions in the circumferential direction including the vicinity of the engagement portion of the carrier that is engaged with the notch portion of the workpiece. There may also be a sensor that confirms the suction retention of the workpiece based on a change in the flow rate or pressure of the fluid ejected from the injection hole.
該一側的靜壓墊也可具有在外周部上沿圓周方向大致等距配置的複數個該噴射孔。該各靜壓墊也可具有與該磨削磨石對應的缺口部,該一側的靜壓墊具有在該缺口部的周緣部上沿圓周方向大致等距配置的複數個該噴射孔。 The static pressure pad on the one side may have a plurality of the injection holes arranged substantially equidistantly in the circumferential direction on the outer peripheral portion. Each of the static pressure pads may have a notch portion corresponding to the grinding stone, and the static pressure pad on the one side has a plurality of the injection holes arranged substantially equidistantly in the circumferential direction on the peripheral edge portion of the notch portion.
根據本發明,其有如下優點,可防止工件在接遞時由於靜壓墊導致的工件的損傷,並且可容易地確認在靜壓墊側的工件的保持,而且可降低設備成本、管理和維護成本。 According to the present invention, it is advantageous in that the workpiece can be prevented from being damaged by the static pressure pad at the time of delivery, and the holding of the workpiece on the static pressure pad side can be easily confirmed, and the equipment cost, management, and maintenance can be reduced. cost.
1、2‧‧‧靜壓墊 1, 2‧‧‧ static pressure pad
3、4‧‧‧缺口部 3, 4‧‧ ‧ gap
5、6‧‧‧磨削磨石 5, 6‧‧‧ grinding grinding stone
7‧‧‧載體 7‧‧‧ Carrier
8‧‧‧搬入手段 8‧‧‧Relocation means
9‧‧‧搬出手段 9‧‧‧Removal means
10、11‧‧‧靜壓支持面 10, 11‧‧‧ Static pressure support surface
12、13‧‧‧凹部 12.13‧‧‧ recess
14、15‧‧‧凸部 14, 15‧‧ ‧ convex
16、17‧‧‧排出槽 16, 17‧‧ ‧ discharge trough
18‧‧‧噴射孔 18‧‧‧Spray hole
19‧‧‧凹部 19‧‧‧ recess
20‧‧‧卡合部 20‧‧‧Clock Department
21、22‧‧‧開閉控制手段 21, 22‧‧‧ opening and closing control means
23‧‧‧靜壓水供給源 23‧‧‧ Static pressure water supply source
24‧‧‧開閉控制手段 24‧‧‧Opening and closing control means
25‧‧‧流體供給源 25‧‧‧ Fluid supply source
26‧‧‧流量感測器 26‧‧‧Flow sensor
27‧‧‧壓力感測器 27‧‧‧ Pressure Sensor
36‧‧‧可動框 36‧‧‧ movable frame
37、38‧‧‧吸附杯 37, 38‧‧‧ adsorption cup
W‧‧‧工件 W‧‧‧Workpiece
圖1為表示本發明的第1實施方式的橫型兩頭平面磨床的示意性剖視圖;圖2為表示本發明的第1實施方式的橫型兩頭平面磨床的側視圖;圖3為表示本發明的第1實施方式的橫型兩頭平面磨床的靜壓墊的正視圖;圖4為表示本發明的第1實施方式的橫型兩頭平面磨床的表示噴射孔的形狀的剖視圖;圖5為表示本發明的第1實施方式的橫型兩頭平面磨床的流體噴射的伯努利效應的說明圖;圖6為表示本發明的第1實施方式的橫型兩頭平面磨床的動作說明圖;圖7為表示本發明的第1實施方式的橫型兩頭平面磨床的動作說明圖;圖8為表示本發明的第1實施方式的橫型兩頭平面磨床的動作說明圖;圖9為表示本發明的第1實施方式的橫型兩頭平面磨床的動作說明圖;圖10為表示本發明的第1實施方式的橫型兩頭平面磨床的動作說明圖;圖11為表示本發明的第1實施方式的橫型兩頭平面磨床的動作說明圖;圖12為表示本發明的第1實施方式的橫型兩頭平面磨床的動作說明圖;圖13為表示本發明的第1實施方式的橫型兩頭平面 磨床的動作說明圖;圖14為表示本發明的第1實施方式的橫型兩頭平面磨床的動作說明圖;圖15為表示本發明的第1實施方式的橫型兩頭平面磨床的動作說明圖;圖16為表示本發明的第1實施方式的橫型兩頭平面磨床的動作說明圖;圖17為表示本發明的第1實施方式的橫型兩頭平面磨床的動作說明圖;圖18為表示本發明的第1實施方式的橫型兩頭平面磨床的動作說明圖;圖19為表示本發明的第2實施方式的靜壓墊的示意性側視圖;圖20為表示本發明的第3實施方式的靜壓墊的示意性說明圖。 1 is a schematic cross-sectional view showing a horizontal two-end surface grinder according to a first embodiment of the present invention; FIG. 2 is a side view showing a horizontal two-end surface grinder according to a first embodiment of the present invention; and FIG. FIG. 4 is a cross-sectional view showing a shape of an injection hole of a horizontal two-end surface grinder according to a first embodiment of the present invention; FIG. 5 is a view showing the present invention; FIG. 6 is an explanatory view showing the operation of the horizontal double-end surface grinder according to the first embodiment of the present invention; FIG. 7 is a view showing the operation of the transverse-type two-head surface grinder according to the first embodiment of the present invention; FIG. 8 is a view showing the operation of the horizontal double-end surface grinder according to the first embodiment of the present invention, and FIG. 9 is a view showing the operation of the horizontal double-head surface grinder according to the first embodiment of the present invention. FIG. FIG. 10 is an operation explanatory view showing a horizontal two-end surface grinder according to a first embodiment of the present invention; and FIG. 11 is a horizontal cross-head showing a first embodiment of the present invention. Surface grinding operation explanatory view; FIG. 12 is a lateral aspect of the first embodiment of the present invention two surface grinder to explain the operation; FIG. 13 is a lateral aspect of the first embodiment of the present invention, two plane Fig. 14 is an operation explanatory view showing a horizontal two-end surface grinder according to a first embodiment of the present invention; and Fig. 15 is an operation explanatory view showing a horizontal two-end surface grinder according to the first embodiment of the present invention; Fig. 16 is an operation explanatory view showing a horizontal two-end surface grinder according to a first embodiment of the present invention; and Fig. 17 is an operation explanatory view showing a horizontal two-end surface grinder according to a first embodiment of the present invention; FIG. 19 is a schematic side view showing a static pressure pad according to a second embodiment of the present invention; and FIG. 20 is a view showing a third embodiment of the present invention. Schematic illustration of a pressure pad.
下面依據圖示對本發明的實施方式進行詳細說明。圖1、圖2例示了採用本發明的橫型兩頭平面磨床。 Embodiments of the present invention will be described in detail below with reference to the drawings. Figures 1 and 2 illustrate a horizontal two-face surface grinder employing the present invention.
該橫型兩頭平面磨床如圖1、圖2所示,具有:左右一對靜壓墊1、2,該左右一對靜壓墊1、2配置成在左右相互面對,並且靜壓支持矽晶圓等的薄板狀的工件W;左右一對磨削磨石5、6,該左右一對磨削磨石5、6對應於各靜壓墊1、2的下部側的缺口部3、4,按照圍繞左右方向的軸心可自由旋轉的方式配置,並且磨削由靜壓墊1 、2保持的工件W的左右兩側面;載體7,該載體7使由靜壓墊1、2靜壓支持的工件W圍繞中心旋轉;搬入搬出手段8、9,該搬入搬出手段8、9向靜壓墊1、2之間的載體7上搬入搬出工件W。 As shown in FIG. 1 and FIG. 2, the horizontal two-stage surface grinder has a pair of right and left static pressure pads 1, 2, and the pair of right and left static pressure pads 1, 2 are disposed to face each other on the right and left sides, and static pressure support 矽a thin plate-shaped workpiece W such as a wafer; a pair of right and left grinding stones 5 and 6, and the pair of left and right grinding stones 5 and 6 correspond to the notch portions 3 and 4 on the lower side of each of the static pressure pads 1 and 2 , which is configured to be freely rotatable according to the axis around the left and right direction, and is ground by the static pressure pad 1 2, the left and right side faces of the workpiece W held; the carrier 7 which rotates the workpiece W supported by the static pressure pads 1 and 2 around the center; the loading/unloading means 8, 9 and the loading/unloading means 8 and 9 The workpiece W is carried in and out of the carrier 7 between the static pressure pads 1 and 2.
靜壓墊1、2在工件W的附近的前進保持位置X1(磨削位置)與從工件W後退的退後位置X2之間,自由地向左右方向移動。而且,各靜壓墊1、2在前進保持位置X1,藉由與工件W面對的靜壓支持面10、11側所供給的靜壓水等的靜壓流體(以下稱靜壓水)靜壓支持工件W,另外,一側的靜壓墊2向工件W側大致垂直地噴射壓縮空氣等的流體(以下稱作壓縮空氣),利用此時的伯努利效應所產生的負壓,以非接觸的方式吸引保持工件W。 The static pressure pads 1 and 2 are freely moved in the left-right direction between the forward holding position X1 (grinding position) in the vicinity of the workpiece W and the retracted position X2 retreating from the workpiece W. Further, each of the static pressure pads 1 and 2 is statically pressurized (hereinafter referred to as static pressure water) such as static pressure water supplied from the static pressure support surfaces 10 and 11 facing the workpiece W at the forward holding position X1. The workpiece W is supported by the pressure, and the static pressure pad 2 on one side sprays a fluid such as compressed air (hereinafter referred to as compressed air) substantially perpendicularly toward the workpiece W side, and uses the negative pressure generated by the Bernoulli effect at this time. The non-contact manner attracts the workpiece W.
另外,在下面的記載中,為了簡略化,以橫型兩頭平面磨床為前提,將一側的靜壓墊2設為右靜壓墊,另一側的靜壓墊1設為左靜壓墊而進行說明,但是一側和另一側也可以左右調換。 Further, in the following description, for the sake of simplicity, the static pressure pad 2 on one side is set as the right static pressure pad, and the static pressure pad 1 on the other side is set as the left static pressure pad on the premise of the horizontal two-end surface grinder. For the sake of explanation, the one side and the other side can also be swapped left and right.
在靜壓墊1、2的靜壓支持面10、11中,如圖3所示,分散地設置有:供給靜壓水的複數個凹部(pocket)12、13;包圍各凹部12、13的凸部(land)14、15;排出槽16、17,該排出槽16、17將穿過凸部14、15的靜壓水向外側排出。 In the static pressure supporting faces 10, 11 of the static pressure pads 1, 2, as shown in FIG. 3, a plurality of pockets 12, 13 for supplying hydrostatic water are provided in a dispersed manner; and the respective recesses 12, 13 are surrounded. Lands 14, 15; discharge grooves 16, 17 which discharge the static pressure water passing through the projections 14, 15 to the outside.
另外,在圖3中,相對於排出槽16、17,由複數個凹部12、13和凸部14、15所形成的靜壓支持部的面積較大,但是,也可與之相反地,相對於複數個靜壓支持部,排出槽16、17的面積較大。 Further, in Fig. 3, the area of the static pressure supporting portion formed by the plurality of concave portions 12, 13 and the convex portions 14, 15 is large with respect to the discharge grooves 16, 17, but may be reversed The area of the discharge grooves 16, 17 is large in the plurality of static pressure support portions.
在一對靜壓墊1、2的右靜壓墊2中,如圖1~圖3所示,設置有複數個噴射孔18。該噴射孔18具有下述功能,向工件W側大致垂直地噴射規定壓力的壓縮空氣,藉由該壓縮空氣在工件W與右靜壓墊2之間流動時的伯努利效應所產生的負壓,在右靜壓墊2側以非接觸的方式吸引保持工件W。 In the right static pressure pad 2 of the pair of static pressure pads 1, 2, as shown in FIGS. 1 to 3, a plurality of injection holes 18 are provided. The injection hole 18 has a function of injecting a predetermined pressure of compressed air substantially perpendicularly to the workpiece W side, and a negative effect caused by the Bernoulli effect when the compressed air flows between the workpiece W and the right static pressure pad 2 Pressing, the workpiece W is attracted and held in a non-contact manner on the right static pressure pad 2 side.
該噴射孔18按照與作為凸部15的頂面的靜壓支持面11相垂直的方式形成,在右靜壓墊2的外周部分的圓周方向設置有複數個噴射孔18,例如大致等距地配置6個。在6個噴射孔18之中的至少1個噴射孔18a,如圖2、圖3所示,在載體7停止在基準停止位置時,與工件W的切口部19所卡合的載體7的卡合部20的附近相對應地配置。 The injection hole 18 is formed to be perpendicular to the static pressure support surface 11 which is the top surface of the convex portion 15, and a plurality of injection holes 18 are provided in the circumferential direction of the outer peripheral portion of the right static pressure pad 2, for example, substantially equidistantly Configure 6. As shown in FIGS. 2 and 3, at least one of the six injection holes 18a is a card of the carrier 7 engaged with the notch portion 19 of the workpiece W when the carrier 7 is stopped at the reference stop position. The vicinity of the joint portion 20 is disposed correspondingly.
作為該各噴射孔18的形狀、構造,如圖4(a)所示,呈內周直徑大致相同的圓柱狀,如圖4(b)所示,可以想到在開口端側設置緊縮部18c等。 As shown in Fig. 4 (a), the shape and the structure of the respective injection holes 18 are substantially cylindrical in shape, and as shown in Fig. 4 (b), it is conceivable to provide a constricted portion 18c or the like on the opening end side. .
圖4(a)的噴射孔18由於可對工件W大致垂直地噴射壓縮空氣,噴射後的壓縮空氣的流動單純,可有效地產生伯努利效應所致的負壓。但是,根據壓縮空氣的壓力和流量等的不同,可以如圖4(b)所示,也可採用其它的形狀。 The injection hole 18 of Fig. 4(a) can discharge compressed air substantially perpendicularly to the workpiece W, and the flow of the compressed air after the injection is simple, and the negative pressure due to the Bernoulli effect can be effectively generated. However, depending on the pressure and flow rate of the compressed air, other shapes may be employed as shown in Fig. 4(b).
另外,關於工件W的吸引保持所必要的噴射孔18的數量,考慮工件W的大小等而適當決定即可,但是較佳為大致等距配置至少3個的程度。另外噴射孔18相互之間的間隔也可有些許的誤差。噴射孔18的直徑宜 為1~5mm程度,但是只要能以非接觸的狀態吸引保持工件W,直徑也可大於或小於1~5mm。 In addition, the number of the injection holes 18 necessary for the suction and holding of the workpiece W may be appropriately determined in consideration of the size of the workpiece W, etc., but it is preferable to arrange at least three substantially equidistantly. In addition, the spacing between the injection holes 18 may be slightly different. The diameter of the injection hole 18 is preferably It is about 1 to 5 mm, but as long as it can attract and hold the workpiece W in a non-contact state, the diameter can be larger or smaller than 1 to 5 mm.
各靜壓墊1、2的凹部12、13以夾設開閉閥等的開閉控制手段21、22的方式與靜壓水供給源(靜壓流體供給源)23連接。各噴射孔18以夾設開閉閥等的開閉控制手段24的方式與加壓泵等的壓縮空氣供給源(流體供給源)25連接,另外,在噴射孔18和開閉控制手段24之間設置有流量感測器26或壓力感測器27。 The recessed portions 12 and 13 of the static pressure pads 1 and 2 are connected to a static pressure water supply source (static fluid supply source) 23 so as to open and close the opening and closing control means 21 and 22 such as an opening and closing valve. Each of the injection holes 18 is connected to a compressed air supply source (fluid supply source) 25 such as a pressure pump such that an opening/closing control means 24 such as an opening/closing valve is interposed, and between the injection hole 18 and the opening and closing control means 24 is provided. Flow sensor 26 or pressure sensor 27.
磨削磨石5、6為杯型等,設置於左右方向的磨石軸(圖中未示出)的前端,在前進端Y1和後退端Y2之間沿左右方向移動,在Y1側前進時開始磨削工件W。 The grinding stones 5 and 6 are cup-shaped or the like, and are provided at the front end of the grindstone shaft (not shown) in the left-right direction, and move in the left-right direction between the forward end Y1 and the retreating end Y2, and advance on the Y1 side. Start grinding the workpiece W.
如圖2所示那樣,載體7包括:載體板30,該載體板30的內周形成有大致同心狀的載體孔29,並且呈比工件W薄的薄板狀;載體環31,該載體環31保持該載體板30的外周部。藉由在圓周方向上的複數個支持輥28,載體7按照可圍繞工件W的中心自由旋轉的方式被保持。工件W相對於載體孔29可自由裝卸。在載體板30中設置有卡合部20,該卡合部20向載體孔29內突出。 As shown in FIG. 2, the carrier 7 includes a carrier plate 30 having an inner circumference formed with a substantially concentric carrier hole 29 and having a thin plate shape thinner than the workpiece W; a carrier ring 31, the carrier ring 31 The outer peripheral portion of the carrier plate 30 is held. The carrier 7 is held in such a manner as to be freely rotatable around the center of the workpiece W by a plurality of support rollers 28 in the circumferential direction. The workpiece W is detachably attachable to the carrier hole 29. An engaging portion 20 is provided in the carrier plate 30, and the engaging portion 20 protrudes into the carrier hole 29.
載體環31與載體孔29呈大致同心狀,載體環31的內周側嚙合有驅動齒輪32。驅動齒輪32藉由與右靜壓墊2的通孔33所插通的驅動軸34由圖外的驅動源驅動。 The carrier ring 31 is substantially concentric with the carrier hole 29, and the drive gear 32 is engaged with the inner peripheral side of the carrier ring 31. The drive gear 32 is driven by a drive source outside the drawing by a drive shaft 34 that is inserted through the through hole 33 of the right static pressure pad 2.
如圖1所示,搬入搬出手段8、9具有:可動框36,該可動框36被設置成可向左右方向和前後方向自由移動;搬入手段8和搬出手段9,該搬入手段8和搬出手段9在該可動框36上可分別向上下移動,該搬入手段8、搬 出手段9藉由吸附杯37、38吸附工件W,進行工件W相對於載體7的搬入搬出。 As shown in FIG. 1, the loading/unloading means 8 and 9 have a movable frame 36 which is provided to be movable in the left-right direction and the front-rear direction, and the loading means 8 and the carrying-out means 9, the loading means 8 and the carrying-out means 9 can move up and down respectively on the movable frame 36, and the loading means 8 and moving The means 9 sucks the workpiece W by the suction cups 37, 38, and carries in and out the workpiece W with respect to the carrier 7.
搬入手段8在可動框36的上下、前後方向上可浮動地被支承,在接近載體7側時,由輥等的引導手段40引導,被吸附杯37吸附的工件W與載體7的載體孔29大致一致地浮動。 The loading/unloading means 8 is floatably supported in the vertical direction and the front-rear direction of the movable frame 36, and is guided by the guiding means 40 such as a roller when approaching the carrier 7, and the workpiece W adsorbed by the suction cup 37 and the carrier hole 29 of the carrier 7 are provided. Floating roughly in unison.
另外,吸附杯37、38具有適度的彈性俾在真空吸附時不損傷工件W,該等與工件的大致中央部相對應地設置1個或複數個(例如3個程度)。搬入手段8和搬出手段9,係形成為在藉由搬入手段8搬入工件W時,搬出手段9上升;在藉由搬出手段9搬出工件W時,搬入手段8上升等,退避到不妨礙對方作業的退避位置。搬入手段8也可按照相對於可動框36非浮動地升降的方式設置。 Further, the suction cups 37 and 38 have an appropriate degree of elasticity, and do not damage the workpiece W during vacuum suction, and one or a plurality of (for example, three) portions are provided corresponding to the substantially central portion of the workpiece. The carry-in means 8 and the carry-out means 9 are formed so that the carry-out means 9 rises when the workpiece W is carried in by the carry-in means 8, and when the workpiece W is carried out by the carry-out means 9, the carry-in means 8 rises, etc., and the retraction does not hinder the other party's work. Retreat position. The loading means 8 may be provided so as to be lifted and lowered non-floatingly with respect to the movable frame 36.
下面一邊參照圖5的說明圖、圖6~圖17的動作說明圖,一邊對藉由橫向兩頭平面磨床磨削工件W的兩側面的兩頭平面磨削法中的磨削週期(cycle)進行說明,該磨削週期包括:從搬入磨削前的工件W的搬入工序,經過磨削工件W的磨削工序,到搬出磨削後的工件W的搬出工序。 Next, the grinding cycle in the two-plane grinding method in which both side faces of the workpiece W are ground by the lateral two-end surface grinder will be described with reference to the explanatory drawings of FIG. 5 and the operation explanatory views of FIGS. 6 to 17 . The grinding cycle includes a step of loading the workpiece W before the grinding, a grinding step of grinding the workpiece W, and a step of carrying out the workpiece W after the grinding.
向機器內外搬入搬出工件W的接遞時,如果工件W相對於載體7發生傾斜,則工件W具有從載體7鬆動脫落的危險。因此,在接遞工件W時,從右靜壓墊2的各噴射孔18向工件W側噴射壓縮空氣,利用此時的伯努利效應所產生的負壓,以非接觸的方式在右靜壓墊2側吸引保持工件W,藉此防止工件W從載體7脫落。 When the workpiece W is carried in and out of the machine, if the workpiece W is inclined with respect to the carrier 7, the workpiece W may be loosened from the carrier 7. Therefore, when the workpiece W is delivered, compressed air is ejected from the respective injection holes 18 of the right static pressure pad 2 toward the workpiece W side, and the negative pressure generated by the Bernoulli effect at this time is used in a non-contact manner. The pressure pad 2 side sucks and holds the workpiece W, thereby preventing the workpiece W from coming off the carrier 7.
即,如圖5所示,如果從噴射孔18沿箭頭a方向大致垂直地向工件W供給壓縮空氣,則該壓縮空氣經過右靜壓墊2和工件W之間的微小間隙,一邊向外周側的大致全部周向擴散,一邊流向箭頭b方向。 That is, as shown in Fig. 5, if compressed air is supplied from the injection hole 18 substantially perpendicularly to the workpiece W in the direction of the arrow a, the compressed air passes through the minute gap between the right static pressure pad 2 and the workpiece W, while being outwardly side. It flows almost in the circumferential direction and flows in the direction of arrow b.
如果以相對於此時噴射孔18內的壓縮空氣的流速V1,經過右靜壓墊2和工件W之間的間隙而向外側流動的壓縮空氣的流速V2增大的方式,適當地設定噴射孔18的孔徑、右靜壓墊2和工件W之間的間隙、壓縮空氣的壓力(流量),則因藉由右靜壓墊2和工件W之間的壓縮空氣的伯努利效應,在圍繞噴射孔18的虛線區域的負壓發生部c產生負壓,可透過該負壓產生部c的負壓,將工件W吸引到右靜壓墊2側。 If the flow velocity V2 of the compressed air flowing to the outside through the gap between the right static pressure pad 2 and the workpiece W is increased with respect to the flow velocity V1 of the compressed air in the injection hole 18 at this time, the injection hole is appropriately set. The aperture of 18, the gap between the right static pressure pad 2 and the workpiece W, and the pressure (flow) of the compressed air are surrounded by the Bernoulli effect of the compressed air between the right static pressure pad 2 and the workpiece W. The negative pressure generating portion c of the broken line region of the injection hole 18 generates a negative pressure, and the workpiece W can be attracted to the right static pressure pad 2 side by the negative pressure of the negative pressure generating portion c.
另外,在右靜壓墊2和工件W之間,由於有相當於該間隙量之壓縮空氣的流動,故工件W相對於右靜壓墊2為非接觸狀態。 Further, since the flow of the compressed air corresponding to the gap amount is between the right static pressure pad 2 and the workpiece W, the workpiece W is in a non-contact state with respect to the right static pressure pad 2.
因此,藉由非接觸方式吸引保持工件W,可將工件W固定至右靜壓墊2,在防止接遞時工件W發生脫落的同時,能防止吸引保持導致的工件W的凹痕和其他損傷。 Therefore, by holding and holding the workpiece W in a non-contact manner, the workpiece W can be fixed to the right static pressure pad 2, and the workpiece W can be prevented from falling off while preventing the dents and other damage of the workpiece W caused by the suction and holding. .
圖6表示搬入工件W之前的狀態,左右的磨削磨石5、6位於後退端Y2,左靜壓墊1位於後退位置X2,右靜壓墊2位於載體7的附近的前進保持位置X1。 6 shows a state before the workpiece W is carried in. The left and right grinding stones 5 and 6 are located at the retreating end Y2, the left static pressure pad 1 is located at the retracted position X2, and the right static pressure pad 2 is located at the advancing holding position X1 in the vicinity of the carrier 7.
因此,在向機器內搬入磨削前的工件W並安裝在靜壓墊1、2之間的載體7時,首先藉由搬入手段8的吸附杯37真空吸附工件W。接著,使搬入手段8進入載體 7和左靜壓墊1之間,如圖7所示,使工件W面對載體7的載體孔29的軸心上。然後,使搬入手段8向載體7側移動,如圖8所示,向載體7的載體孔29內插入工件W。 Therefore, when the workpiece W before grinding is carried into the machine and the carrier 7 is mounted between the static pressure pads 1 and 2, the workpiece W is first vacuum-adsorbed by the suction cup 37 of the loading device 8. Next, the loading means 8 is entered into the carrier Between 7 and the left static pressure pad 1, as shown in Fig. 7, the workpiece W is placed on the axis of the carrier hole 29 of the carrier 7. Then, the loading means 8 is moved to the side of the carrier 7, and as shown in Fig. 8, the workpiece W is inserted into the carrier hole 29 of the carrier 7.
此時載體7如圖2所示,該卡合部20被定位於其應該位於的基準停止位置,另外,工件W在下述狀態下被吸附,該狀態為,該凹部19對應於載體7的卡合部20而定位。因此,藉由將搬入手段8移向載體7側,如圖2所示,可容易地將工件W的凹部19卡合到載體7的卡合部20。 At this time, as shown in FIG. 2, the engaging portion 20 is positioned at the reference stop position where it should be located, and the workpiece W is adsorbed in a state in which the recess 19 corresponds to the card of the carrier 7. The joint 20 is positioned. Therefore, by moving the loading means 8 to the carrier 7 side, as shown in FIG. 2, the concave portion 19 of the workpiece W can be easily engaged with the engaging portion 20 of the carrier 7.
如果工件W被插入載體孔29,則使該工件W接觸位於前進保持位置X1的右靜壓墊2,如圖8所示,在右靜壓墊2和搬入手段8之間,從兩側夾持位於載體7內的工件W。而且,如圖5所示,然後從右靜壓墊2的各噴射孔18向工件W側噴射壓縮空氣,藉由在工件W和右靜壓墊2之間流動的壓縮空氣的伯努利效應所產生的負壓,在右靜壓墊2側以非接觸的方式吸引保持工件W。 If the workpiece W is inserted into the carrier hole 29, the workpiece W is brought into contact with the right static pressure pad 2 located at the forward holding position X1, as shown in Fig. 8, between the right static pressure pad 2 and the loading means 8, from both sides The workpiece W located in the carrier 7 is held. Further, as shown in Fig. 5, compressed air is then ejected from the respective injection holes 18 of the right static pressure pad 2 toward the workpiece W side, by the Bernoulli effect of the compressed air flowing between the workpiece W and the right static pressure pad 2. The generated negative pressure attracts and holds the workpiece W in a non-contact manner on the right static pressure pad 2 side.
另外,在藉由右靜壓墊2以非接觸的方式吸引保持工件W的情況,右靜壓墊2和工件W的間隙非常小。因此,為了方便製圖,在圖8中以右靜壓墊2和工件W接觸的狀態進行了記載,由於標記了「吸引保持」和「非接觸」,表示工件W在非接觸狀態下的吸引保持狀態。以下也相同。 Further, in the case where the workpiece W is held in a non-contact manner by the right static pressure pad 2, the gap between the right static pressure pad 2 and the workpiece W is extremely small. Therefore, in order to facilitate the drawing, the state in which the right static pressure pad 2 and the workpiece W are in contact with each other is described in FIG. 8, and the "suction holding" and the "non-contact" are marked, indicating that the workpiece W is attracted and held in a non-contact state. status. The same is true below.
如圖3所示,各噴射孔18在右靜壓墊2的外周部分大致等距地設置有複數個,例如有6個,藉由從該各噴射孔18噴射出並且流過工件W和右靜壓墊2之間的間 隙的壓縮空氣的伯努利效應,向右靜壓墊2側吸引工件W的外周部的大致全周,藉此可將工件W的外周側固定在右靜壓墊2上。 As shown in FIG. 3, each of the injection holes 18 is provided at substantially equal intervals in the outer peripheral portion of the right static pressure pad 2, for example, six, by ejecting from the respective injection holes 18 and flowing through the workpiece W and the right. Between the static pressure pads 2 The Bernoulli effect of the compressed air of the gap attracts substantially the entire circumference of the outer peripheral portion of the workpiece W to the right static pressure pad 2 side, whereby the outer peripheral side of the workpiece W can be fixed to the right static pressure pad 2.
另外,如果右靜壓墊2吸引保持工件W,則從噴射孔18噴射的壓縮空氣的壓力上升,流量降低,由此可透過該流量、壓力的變化,利用流量感測器26或壓力感測器27容易地確認工件W的吸引保持狀況。 Further, if the right static pressure pad 2 sucks and holds the workpiece W, the pressure of the compressed air injected from the injection hole 18 rises, and the flow rate decreases, whereby the flow rate and pressure can be transmitted, and the flow rate sensor 26 or the pressure sensing can be utilized. The device 27 easily confirms the suction holding state of the workpiece W.
在將工件W插入載體7時,必須要求吸附於搬入手段8的工件W的凹部19對應於載體7的卡合部20並且嵌入,該凹部19的插入是最困難的,容易發生插入不良。但是,在凹部19的附近,由於存在與流量感測器26或壓力感測器27連接的噴射孔18a,故可直接透過該流量感測器26或壓力感測器27確認凹部19的插入狀況。 When the workpiece W is inserted into the carrier 7, it is necessary to require the concave portion 19 of the workpiece W adsorbed to the loading device 8 to be fitted to the engaging portion 20 of the carrier 7, and the insertion of the concave portion 19 is the most difficult, and insertion failure is likely to occur. However, in the vicinity of the recess 19, since there is an injection hole 18a connected to the flow sensor 26 or the pressure sensor 27, the insertion state of the recess 19 can be confirmed directly through the flow sensor 26 or the pressure sensor 27. .
即,在工件W的凹部19和載體7的卡合部20錯位,工件W接觸卡合部20的上方的情況,在工件W和右靜壓墊2之間產生載體7的厚度寬的間隙,在該部分為呈沒有工件W的狀態。因此,噴射孔18a無阻力地噴射壓縮空氣,透過流量感測器26或壓力感測器27可容易地確認凹部19的嵌合是否成功。 That is, when the concave portion 19 of the workpiece W and the engaging portion 20 of the carrier 7 are displaced, and the workpiece W contacts the upper portion of the engaging portion 20, a gap having a wide thickness of the carrier 7 is generated between the workpiece W and the right static pressure pad 2, In this portion, there is a state in which there is no workpiece W. Therefore, the injection hole 18a injects compressed air without resistance, and it is possible to easily confirm whether or not the fitting of the recess 19 is successful by the flow sensor 26 or the pressure sensor 27.
如果在凹部19接觸卡合部20的狀態下,由於流量感測器26或壓力感測器27無法確認工件W的吸引保持,一邊每次按照一定角度旋轉載體7,一邊繼續插入動作。此時,工件W在搬出手段9側呈被真空吸附的固定狀態,所以如果載體7僅僅旋轉凹部19和卡合部20的錯開量,則凹部19可與卡合部20一致,可將工件W嵌入載體7內。 When the concave portion 19 contacts the engaging portion 20, the flow sensor 24 or the pressure sensor 27 cannot confirm the suction holding of the workpiece W, and the insertion operation is continued every time the carrier 7 is rotated at a constant angle. At this time, since the workpiece W is in a state of being vacuum-adsorbed on the unloading means 9 side, if the carrier 7 only rotates the amount of displacement of the recess 19 and the engaging portion 20, the recess 19 can be aligned with the engaging portion 20, and the workpiece W can be used. Embedded in the carrier 7.
如果工件W嵌合於載體7內,則工件W的整體以非接觸的方式吸引保持於右靜壓墊2,由於流量感測器26和壓力感測器27的輸出發生變化,所以可確認工件W的吸引保持。 If the workpiece W is fitted into the carrier 7, the entire workpiece W is sucked and held by the right static pressure pad 2 in a non-contact manner, and the output of the flow sensor 26 and the pressure sensor 27 is changed, so that the workpiece can be confirmed. The attraction of W remains.
另外,如果即使將載體7旋轉,流量感測器26或壓力感測器27也無法確認工件W的吸引保持,則存在工件W側有損傷等的凹部19和卡合部20錯位以外的原因,所以停止自動週期並向操作者通報發生異常。 In addition, even if the flow sensor 24 or the pressure sensor 27 cannot confirm the suction and holding of the workpiece W even if the carrier 7 is rotated, there is a cause that the concave portion 19 such as the damage on the workpiece W side and the engagement portion 20 are misaligned. Therefore, the automatic cycle is stopped and the operator is notified of the occurrence of an abnormality.
一旦工件W被吸引保持於右靜壓墊2,在確認出該吸引保持的大致同時或確認吸引保持之後上解除搬入手段8對工件W的真空吸附,如圖9所示,使搬入手段8退出到機器外。 When the workpiece W is sucked and held by the right static pressure pad 2, the vacuum suction of the workpiece W by the loading means 8 is released after confirming the suction holding or after the suction holding is confirmed, as shown in Fig. 9, the loading means 8 is withdrawn. Go outside the machine.
像這樣在磨削前搬入工件W時,在藉由搬入手段8的吸附杯37和右靜壓墊2夾持工件W的狀態下,經過右靜壓墊2的非接觸狀態下的吸引保持,藉由從搬入手段8到右靜壓墊2的接遞,不會在載體7內發生工件W傾斜並脫落的情況。另外,即使搬入手段8退出到機器外,工件W也不會從右靜壓墊2上脫落。而且,雖然在右靜壓墊2側吸附並保持工件W,但是可防止右靜壓墊2導致的工件W的損傷。 When the workpiece W is carried in before the grinding, the workpiece W is held by the suction cup 37 and the right static pressure pad 2 of the loading device 8, and the suction is maintained in the non-contact state of the right static pressure pad 2, By the delivery from the loading means 8 to the right static pressure pad 2, the workpiece W does not tilt and fall off in the carrier 7. Further, even if the loading means 8 is withdrawn to the outside of the machine, the workpiece W does not fall off from the right static pressure pad 2. Further, although the workpiece W is adsorbed and held on the right static pressure pad 2 side, damage of the workpiece W due to the right static pressure pad 2 can be prevented.
如圖10所示,一旦搬入手段8向機器外退出,則使左靜壓墊1向前進保持位置X1前進,並且藉由一對靜壓墊1、2從兩側面夾持工件W,然後停止從右靜壓墊2的噴射孔18噴出的壓縮空氣,解除吸引保持。在該狀態下,載體7內的工件W如圖10所示,呈藉由一對靜壓墊1、2 從兩側被夾持的狀態,因此不會有在載體7內發生傾斜、從載體7脫落的情況。 As shown in FIG. 10, once the loading means 8 is withdrawn outside the machine, the left static pressure pad 1 is advanced toward the forward holding position X1, and the workpiece W is held from both sides by a pair of static pressure pads 1, 2, and then stopped. The compressed air ejected from the injection holes 18 of the right static pressure pad 2 releases the suction and holding. In this state, the workpiece W in the carrier 7 is shown by a pair of static pressure pads 1, 2 as shown in FIG. Since the state is clamped from both sides, there is no possibility that the carrier 7 is inclined and falls off from the carrier 7.
如圖11所示,藉由一對靜壓墊1、2夾持工件W之後,從各靜壓墊1、2向工件W側供給靜壓水,藉由靜壓水從兩側靜壓支持工件W。而且,一邊使靜壓支持狀態的工件W與載體7一體地旋轉,如圖12所示,使一對磨削磨石5、6從磨削位置向前進端Y1側依次磨削前進,藉由各磨削磨石5、6磨削工件W的兩側面。 As shown in Fig. 11, after the workpiece W is held by the pair of static pressure pads 1, 2, static pressure water is supplied from the static pressure pads 1 and 2 to the workpiece W side, and static pressure water is supported from both sides by static pressure water. Workpiece W. Further, while the workpiece W in the static pressure supporting state is integrally rotated with the carrier 7, as shown in Fig. 12, the pair of grinding stones 5, 6 are sequentially ground and advanced from the grinding position to the advanced end Y1 side. Each of the grinding stones 5, 6 grinds both sides of the workpiece W.
一旦工件W的磨削完成,如圖13所示,則左右的磨削磨石5、6退後至後退端Y2,接著停止載體7的旋轉。此時載體7停止在基準停止位置。這是為了使接下來的工件W相對於載體7的插入變得容易。而且,一旦載體7停止在基準停止位置,則停止來自兩個靜壓墊1、2的靜壓水供給,解除工件W的靜壓支持。此時,在工件W和兩側的靜壓墊1、2之間存在水,由於該水的表面張力,工件W處於附著於兩側的靜壓墊1、2的狀態。 Once the grinding of the workpiece W is completed, as shown in Fig. 13, the left and right grinding stones 5, 6 are retracted to the retreating end Y2, and then the rotation of the carrier 7 is stopped. At this time, the carrier 7 is stopped at the reference stop position. This is to facilitate the insertion of the next workpiece W with respect to the carrier 7. Further, when the carrier 7 is stopped at the reference stop position, the supply of static pressure water from the two static pressure pads 1 and 2 is stopped, and the static pressure support of the workpiece W is released. At this time, water exists between the workpiece W and the static pressure pads 1 and 2 on both sides, and the workpiece W is in a state of being attached to the static pressure pads 1 and 2 on both sides due to the surface tension of the water.
停止來自各靜壓墊1、2的靜壓水供給的大致同時、或在供給停止之後馬上從右靜壓墊2的噴射孔18向工件W側噴射壓縮空氣,藉由此時的伯努利效應所致的負壓,如圖14所示,在右靜壓墊2側以非接觸的方式吸引保持兩靜壓墊1、2之間的工件W。 At the same time as stopping the supply of the static pressure water from each of the static pressure pads 1, 2 or immediately after the supply is stopped, the compressed air is ejected from the injection holes 18 of the right static pressure pad 2 toward the workpiece W side, by which Bernoulli The negative pressure due to the effect, as shown in Fig. 14, attracts the workpiece W between the two static pressure pads 1, 2 in a non-contact manner on the right static pressure pad 2 side.
因此,由於工件W在右靜壓墊2上為固定狀態,所以即使之後左靜壓墊1向後退位置X2後退,載體7內的磨削後的工件W也不會傾斜和脫落。另外,雖然將工件W固定在右靜壓墊2上,但是藉由壓縮空氣將工件W吸 引保持在右靜壓墊2側,由於工件W在右靜壓墊2上呈非接觸狀態,所以可防止工件W的損傷。 Therefore, since the workpiece W is in a fixed state on the right static pressure pad 2, even after the left static pressure pad 1 is retracted to the retracted position X2, the workpiece W after grinding in the carrier 7 does not tilt and fall off. In addition, although the workpiece W is fixed to the right static pressure pad 2, the workpiece W is sucked by compressed air. The lead is held on the right static pressure pad 2 side, and since the workpiece W is in a non-contact state on the right static pressure pad 2, damage of the workpiece W can be prevented.
工件W一旦被吸引保持於右靜壓墊2側,流量感測器26或壓力感測器27透過壓縮空氣的流量或壓力的變化,可確認右靜壓墊2對工件W的吸引保持。 Once the workpiece W is sucked and held on the right static pressure pad 2 side, the flow rate sensor 26 or the pressure sensor 27 can confirm the suction and holding of the workpiece W by the right static pressure pad 2 by the change in the flow rate or pressure of the compressed air.
另,與向右靜壓墊2側的工件W的吸引保持的大致同時、或在吸引保持之後,馬上如圖14所示,從左靜壓墊1向工件W側供給靜壓水。藉由該靜壓水的供給,在與左靜壓墊1之間靜壓水、磨削水等的水的表面張力不會對工件W產生影響,另外將工件W推向右靜壓墊2側,輔助該吸附支持。 Further, immediately after the suction holding of the workpiece W on the right static pressure pad 2 side or after the suction holding, the static pressure water is supplied from the left static pressure pad 1 to the workpiece W side as shown in FIG. 14 . By the supply of the hydrostatic water, the surface tension of the water such as static pressure water, grinding water or the like between the static pressure pad 1 and the left static pressure pad 1 does not affect the workpiece W, and the workpiece W is pushed to the right static pressure pad 2 Side, assisting the adsorption support.
因此左靜壓墊1的工件W的分離較容易,另外藉由噴射壓縮空氣時的伯努利效應所產生的負壓,可確實地在右靜壓墊2側吸引工件W。因此,可藉由右靜壓墊2迅速地吸引磨削後的工件W,使縮短磨削週期。另外,由於利用了靜壓水,故沒有必要使用解除表面張力用的專用機器。 Therefore, the separation of the workpiece W of the left static pressure pad 1 is easy, and the workpiece W can be surely attracted to the right static pressure pad 2 side by the negative pressure generated by the Bernoulli effect when the compressed air is injected. Therefore, the workpiece W after the grinding can be quickly attracted by the right static pressure pad 2, so that the grinding cycle can be shortened. In addition, since static water is used, it is not necessary to use a dedicated machine for releasing the surface tension.
在藉右靜壓墊2吸引保持工件W後,如圖14的雙點鏈線所示,使左靜壓墊1從前進保持位置X1退後到後退位置X2。即使在該左靜壓墊1後退時,也從左靜壓墊1供給靜壓水,由此透過左靜壓墊1之間的水的表面張力,工件W不會從右靜壓墊2脫離,可確實地維持右靜壓墊2對工件W的吸引保持。此外,在左靜壓墊1後退至可無視表面張力的影響的時候,停止來自左靜壓墊1的靜壓水的供給。 After the workpiece W is sucked and held by the right static pressure pad 2, the left static pressure pad 1 is retracted from the forward holding position X1 to the retracted position X2 as shown by the double-dot chain line of FIG. Even when the left static pressure pad 1 is retracted, static pressure water is supplied from the left static pressure pad 1, whereby the surface tension of the water between the left static pressure pad 1 is transmitted, and the workpiece W is not detached from the right static pressure pad 2. The suction holding of the workpiece W by the right static pressure pad 2 can be surely maintained. Further, when the left static pressure pad 1 is retracted to ignore the influence of the surface tension, the supply of the static pressure water from the left static pressure pad 1 is stopped.
此後,如圖15所示,如果左靜壓墊1向後退位置X2後退,則搬出手段9插入到載體7和左靜壓墊1之間。而且使搬出手段9向工件W側移動,如圖16所示,在右靜壓墊2側以非接觸方式呈吸引保持狀態的工件W與搬出手段9的吸附杯38接觸,在藉由該搬出手段9和右靜壓墊2從兩側夾持工件W之後,進行從右靜壓墊2到搬出手段9的工件W的接遞。 Thereafter, as shown in FIG. 15, if the left static pressure pad 1 is retracted toward the retreat position X2, the unloading means 9 is inserted between the carrier 7 and the left static pressure pad 1. Further, the unloading means 9 is moved to the side of the workpiece W, and as shown in Fig. 16, the workpiece W that is in a suction-holding state on the right static pressure pad 2 side is in contact with the suction cup 38 of the unloading means 9, and is carried out by the suction-out means After the means 9 and the right static pressure pad 2 hold the workpiece W from both sides, the workpiece W from the right static pressure pad 2 to the carry-out means 9 is transferred.
在使搬出手段9的吸附杯38抵接時,相對於右靜壓墊2為非接觸狀態的工件W,在吸附杯38的接觸時的衝擊、壓力等不直接接觸右靜壓墊2的位置,停止搬出手段9的移動進行定位。 When the suction cup 38 of the unloading means 9 is brought into contact with each other, the workpiece W in the non-contact state with respect to the right static pressure pad 2 does not directly contact the right static pressure pad 2 at the time of contact with the suction cup 38 by impact, pressure, or the like. The movement of the unloading means 9 is stopped to perform positioning.
在接遞該工件W時,如圖17所示,停止來自右靜壓墊2的噴射孔18的壓縮空氣,解除工件W的吸引保持。而且,在解除該吸引保持的大致同時或解除該吸引保持之後馬上藉由搬出手段9的吸附杯38對工件W進行真空吸附。由此,可容易並且確實地在右靜壓墊2和搬出手段9之間接遞工件W。 When the workpiece W is delivered, as shown in FIG. 17, the compressed air from the injection hole 18 of the right static pressure pad 2 is stopped, and the suction holding of the workpiece W is released. Then, the workpiece W is vacuum-adsorbed by the suction cup 38 of the unloading means 9 immediately after the suction holding is released or the suction holding is released. Thereby, the workpiece W can be easily and surely transferred between the right static pressure pad 2 and the carry-out means 9.
另外,在解除該右靜壓墊2的吸引保持的大致同時或解除該吸引保持之後,馬上如圖18所示,從右靜壓墊2向工件W供給靜壓水,使搬出手段9向左靜壓墊1側移動,從載體7中取出工件W,向機器外搬出。 Further, immediately after releasing the suction holding of the right static pressure pad 2 or releasing the suction holding, immediately as shown in FIG. 18, static pressure water is supplied from the right static pressure pad 2 to the workpiece W, and the unloading means 9 is leftward. The static pressure pad 1 is moved, and the workpiece W is taken out from the carrier 7, and is carried out outside the machine.
像這樣,一邊從右靜壓墊2向工件W側供給靜壓水,一邊從載體7中取出工件W,因此不會有右靜壓墊2和工件W之間的表面張力的影響,能容易地從右靜壓墊2分離出工件W。因此,即使磨削後的工件W較薄,也可 在確實地防止其損傷的同時,縮短磨削的週期的時間。 In this manner, the static pressure water is supplied from the right static pressure pad 2 to the workpiece W side, and the workpiece W is taken out from the carrier 7, so that the surface tension between the right static pressure pad 2 and the workpiece W is not affected, and the surface can be easily removed. The workpiece W is separated from the right static pressure pad 2. Therefore, even if the workpiece W after grinding is thin, The time of the grinding cycle is shortened while reliably preventing the damage.
另,從右靜壓墊2的靜壓水的供給一直持續到工件W和右靜壓墊2之間的表面張力沒有影響為止,此後停止供給。 Further, the supply of the static pressure water from the right static pressure pad 2 continues until the surface tension between the workpiece W and the right static pressure pad 2 has no effect, and thereafter the supply is stopped.
如果磨削後的工件W的搬出結束,就一邊依次重複同樣的動作,一邊依次磨削各工件W。 When the unloading of the workpiece W after the grinding is completed, the same operation is sequentially repeated, and the workpieces W are sequentially ground.
像這樣,利用從右靜壓墊2的噴射孔18向工件W側噴射壓縮空氣時的伯努利效應所產生的負壓,在和右靜壓墊2之間打開縫隙的非接觸狀態下,在右靜壓墊2側吸引保持工件W,由此可確實地防止工件W的凹痕、吸附痕、缺陷等其他損傷的產生。 In this manner, the negative pressure generated by the Bernoulli effect when the compressed air is ejected from the injection hole 18 of the right static pressure pad 2 toward the workpiece W side is in a non-contact state in which the slit is opened between the right static pressure pad 2, By sucking and holding the workpiece W on the right static pressure pad 2 side, it is possible to reliably prevent generation of other damage such as dents, adsorption marks, and defects of the workpiece W.
另外,由於從右靜壓墊2的噴射孔18噴射壓縮空氣而吸引保持工件W,所以可防止從噴射孔18向流量感測器26、壓力感測器27等混入磨削水、靜壓水,不必擔心上述混入所導致的流量感測器26、壓力感測器27的破損。此外,由於不需要包含真空泵的真空管路,可在削減設備成本的同時減少這些設備機器等的維護等的工夫。 Further, since the compressed air is injected from the injection hole 18 of the right static pressure pad 2 to suck and hold the workpiece W, it is possible to prevent the grinding water and the static pressure water from being mixed into the flow rate sensor 26, the pressure sensor 27, and the like from the injection hole 18. There is no need to worry about the breakage of the flow sensor 26 and the pressure sensor 27 caused by the above mixing. Further, since a vacuum line including a vacuum pump is not required, it is possible to reduce the maintenance cost of the equipment and the like while reducing the equipment cost.
進一步地,從右靜壓墊2的噴射孔18噴射壓縮空氣而吸引保持工件W,透過流量感測器26、壓力感測器27檢測壓縮空氣的流量、壓力的變化,可容易地掌握工件W是否被吸引保持,可確實地進行工件W的接遞。 Further, the compressed air is injected from the injection hole 18 of the right static pressure pad 2 to suck and hold the workpiece W, and the flow rate sensor 26 and the pressure sensor 27 detect the flow rate and pressure change of the compressed air, so that the workpiece W can be easily grasped. Whether or not it is attracted and held, the workpiece W can be reliably delivered.
在將工件W插入載體7時,在工件W的凹部19和載體7的卡合部20干涉而無法將工件W插入到載體7的情況,旋轉載體7,但是此時的工件W的凹部19和載體7 的卡合部20發生接觸並旋轉。但是,在藉由右靜壓墊2以非接觸狀態吸引保持工件W的方式的情況,由於右靜壓墊2和工件W之間存在間隙,與現有的右靜壓墊2對工件W的真空吸附相比較,可減小工件W的凹部19和載體7的卡合部20的接觸力,能減少凹部19的衝擊、摩擦,並能提高凹部19的壽命。 When the workpiece W is inserted into the carrier 7, the concave portion 19 of the workpiece W and the engaging portion 20 of the carrier 7 interfere with each other, and the workpiece W cannot be inserted into the carrier 7, the carrier 7 is rotated, but the concave portion 19 of the workpiece W at this time and Carrier 7 The engaging portion 20 comes into contact and rotates. However, in the case where the right static pressure pad 2 is sucked to hold the workpiece W in a non-contact state, since there is a gap between the right static pressure pad 2 and the workpiece W, the vacuum of the workpiece W with the existing right static pressure pad 2 In comparison with the adsorption phase, the contact force between the concave portion 19 of the workpiece W and the engaging portion 20 of the carrier 7 can be reduced, the impact and friction of the concave portion 19 can be reduced, and the life of the concave portion 19 can be improved.
圖19表示本發明的第2實施方式。在該實施方式中,在右靜壓墊2的用於磨削磨石6的缺口部4的周緣部上,大致等距地配置有複數個噴射孔18,例如3個噴射孔18,在右靜壓墊2的外周部分內的遠離該缺口部4的部分,則沒有配置噴射孔18。 Fig. 19 shows a second embodiment of the present invention. In this embodiment, a plurality of injection holes 18, for example, three injection holes 18, are disposed on the periphery of the notch portion 4 of the right static pressure pad 2 for grinding the grindstone 6, substantially equidistantly. The portion of the outer peripheral portion of the static pressure pad 2 that is away from the notch portion 4 is not provided with the injection hole 18.
也可在該情況,藉由噴射來自噴射孔18的規定壓力的壓縮空氣,在右靜壓墊2側以非接觸狀態吸引保持工件W。因此,噴射孔18的位置不限於右靜壓墊2的外周部分,也可配置於用於磨削磨石6的缺口部4的周緣部等的其他位置。當然,噴射孔18也可同時設置於右靜壓墊2的外周部分和缺口部4的周緣部。 In this case, the workpiece W may be sucked and held in a non-contact state on the right static pressure pad 2 side by jetting compressed air of a predetermined pressure from the injection hole 18. Therefore, the position of the injection hole 18 is not limited to the outer peripheral portion of the right static pressure pad 2, and may be disposed at another position such as the peripheral portion of the notch portion 4 for grinding the grindstone 6. Of course, the injection holes 18 may be simultaneously provided at the outer peripheral portion of the right static pressure pad 2 and the peripheral portion of the notch portion 4.
另外,在該情況也與第1實施方式同樣地在卡合部20的附近設置噴射孔18a為佳。 In this case as well, in the same manner as in the first embodiment, it is preferable to provide the injection hole 18a in the vicinity of the engagement portion 20.
圖20表示本發明的第3實施方式。在該實施方式中,在磨削前的工件W的搬入時,與第1實施方式相同,藉由壓縮空氣的噴射所致的吸引保持將工件W固定於右靜壓墊2上,在磨削後的工件W的搬出時,透過靜壓水、磨削水等的水的表面張力將工件W固定在右靜壓墊2上。 Fig. 20 shows a third embodiment of the present invention. In the embodiment, when the workpiece W before the grinding is carried in, as in the first embodiment, the workpiece W is fixed to the right static pressure pad 2 by the suction holding by the injection of the compressed air, and the grinding is performed. When the subsequent workpiece W is carried out, the workpiece W is fixed to the right static pressure pad 2 by the surface tension of water such as static pressure water or grinding water.
即,在磨削前的工件W的搬入時,與第1實施 方式相同,從右靜壓墊2的噴射孔18向工件W噴射壓縮空氣,藉由此時的伯努利效應所產生的負壓在右靜壓墊2上以非接觸狀態吸引保持工件W。 That is, when the workpiece W before the grinding is carried in, the first embodiment In the same manner, compressed air is ejected from the injection hole 18 of the right static pressure pad 2 toward the workpiece W, and the negative pressure generated by the Bernoulli effect at this time attracts and holds the workpiece W in the non-contact state on the right static pressure pad 2.
在工件W的磨削後,右靜壓墊2和工件W處於被靜壓水、磨削水浸濕的狀態。因此,在搬出工件W時,如果停止靜壓水、磨削水,則如圖19所示,利用以該水的表面張力可將工件W固定在右靜壓墊2上這一點,從而將工件W固定在右靜壓墊2上。而且,在藉由搬出手段9真空吸附工件W之後,與第1實施方式的情況相同,從右靜壓墊2向工件W側供給靜壓水,將工件W從右靜壓墊2分離。另外,在左靜壓墊1後退至後退位置X2的情況,從左靜壓墊1供給靜壓水。 After the grinding of the workpiece W, the right static pressure pad 2 and the workpiece W are in a state of being wetted by the static pressure water and the grinding water. Therefore, when the workpiece W is carried out, if the hydrostatic water or the grinding water is stopped, the workpiece W can be fixed to the right static pressure pad 2 by the surface tension of the water as shown in FIG. W is fixed on the right static pressure pad 2. After the workpiece W is vacuum-adsorbed by the unloading means 9, the static pressure water is supplied from the right static pressure pad 2 to the workpiece W side, and the workpiece W is separated from the right static pressure pad 2, as in the case of the first embodiment. Further, when the left static pressure pad 1 is moved back to the retracted position X2, the static pressure water is supplied from the left static pressure pad 1.
如根據此,壓縮空氣的噴射所致的工件W的吸引保持僅僅在搬入時使用,容易控制。另外,藉由停止靜壓水、磨削水的供給可立刻將工件W固定在右靜壓墊2上,可縮短對工件W的兩側面進行平面磨削的週期時間。 According to this, the suction holding of the workpiece W by the injection of the compressed air is used only when it is carried in, and it is easy to control. Further, by stopping the supply of the hydrostatic water and the grinding water, the workpiece W can be immediately fixed to the right static pressure pad 2, and the cycle time for the surface grinding of both sides of the workpiece W can be shortened.
以上詳細描述了本發明的實施方式,但是本發明並不限於該實施方式,可在不脫離本發明主旨的範圍內進行各種變形。例如在該實施方式中列舉了橫型兩頭平面磨床,但是也可在縱型兩頭平面磨床中進行實施。另外,工件W也可為矽晶圓等以外者。 The embodiments of the present invention have been described in detail above, but the present invention is not limited to the embodiments, and various modifications may be made without departing from the spirit and scope of the invention. For example, a horizontal two-end surface grinder is exemplified in this embodiment, but it can also be implemented in a vertical two-end surface grinder. Further, the workpiece W may be other than a silicon wafer or the like.
另外,在實施方式中示出了在一對的靜壓墊1、2中的右靜壓墊2上設置噴射孔18,在該右靜壓墊2側吸附工件W的情況,但是也可在左靜壓墊1上設置噴射孔18 ,並在該左靜壓墊1側吸附工件W。 Further, in the embodiment, the case where the injection hole 18 is provided in the right static pressure pad 2 of the pair of static pressure pads 1 and 2, and the workpiece W is adsorbed on the right static pressure pad 2 side is shown, but An injection hole 18 is disposed on the left static pressure pad 1 And the workpiece W is adsorbed on the left static pressure pad 1 side.
如果將搬入手段8所吸附的工件W插入至載體7內,藉由搬入手段8和右靜壓墊2夾持之後,則可以在右靜壓墊2吸附工件W的大致同時解除搬入手段8對工件W的吸附,也可以在右靜壓墊2吸附工件W之後馬上解除搬入手段8對工件W的吸附。 When the workpiece W sucked by the loading means 8 is inserted into the carrier 7, after the loading means 8 and the right static pressure pad 2 are nipped, the loading means 8 can be released while the right static pressure pad 2 adsorbs the workpiece W. The adsorption of the workpiece W may release the adsorption of the workpiece W by the loading means 8 immediately after the right static pressure pad 2 adsorbs the workpiece W.
另外,在從左靜壓墊1供給流體,解除左靜壓墊1和工件W的表面張力的情況,在搬出手段9對工件W的真空吸附之後,從右靜壓墊2供給流體,工件W離開右靜壓墊2的情況,如果利用作為該流體的靜壓水等的靜壓墊流體,則沒有必要另外設置流體的供給設備,在結構上可簡化,但是也可供給靜壓水等的靜壓流體以外的專用的流體。 Further, when the fluid is supplied from the left static pressure pad 1 and the surface tension of the left static pressure pad 1 and the workpiece W is released, after the vacuum suction of the workpiece W by the unloading means 9, the fluid is supplied from the right static pressure pad 2, and the workpiece W In the case of leaving the right static pressure pad 2, if a static pressure pad fluid such as static pressure water of the fluid is used, it is not necessary to separately provide a fluid supply device, and the structure can be simplified, but it is also possible to supply static pressure water or the like. A special fluid other than a hydrostatic fluid.
藉由搬出手段9和右靜壓墊2夾持載體7內的工件W之後,可以在搬出手段9對工件W吸附的大致同時解除靜壓墊2對工件W的吸附,從右靜壓墊2供給靜壓水,也可以在搬出手段9對工件W吸附之後馬上解除靜壓墊2對工件W的吸附,從右靜壓墊2供給靜壓水。 After the workpiece W in the carrier 7 is nipped by the unloading means 9 and the right static pressure pad 2, the suction of the workpiece W by the static pressure pad 2 can be released while the loading means 9 adsorbs the workpiece W, from the right static pressure pad 2 When the static pressure water is supplied, the suction of the workpiece W by the static pressure pad 2 may be released immediately after the suction means 9 adsorbs the workpiece W, and the static pressure water may be supplied from the right static pressure pad 2.
在工件W搬出時向右靜壓墊2供給靜壓水的情況,可以利用通常的靜壓支持用的靜壓水的供給系統,經該供給閥進行供給,也可從與靜壓支持用的靜壓水的供給系統不同的供給系統進行供給。此外,可以分別設置搬入手段8和搬出手段9,也可將二者結合為一體而使用。 When the static pressure water is supplied to the right static pressure pad 2 when the workpiece W is carried out, the supply system of the static pressure water for the normal static pressure support can be supplied through the supply valve, and it can be used for the static pressure support. The supply system of the hydrostatic water is supplied by different supply systems. Further, the loading means 8 and the carrying-out means 9 may be separately provided, or the two may be used in combination.
從右靜壓墊2的噴射孔18噴射出的流體為氣 體,例如壓縮空氣較合適,但是也可為壓縮空氣以外的壓縮氣體、也可為水等的液體。另外噴射孔18的數量、流體的流量、壓力可適當地變更。一般來說,如果提高流體的設定壓則流量增大,工件W的吸引保持狀態和非吸引保持狀態下的流體的流量的差增大,透過流量感測器26可容易地把握工件W是否為吸引保持。 The fluid ejected from the injection hole 18 of the right static pressure pad 2 is gas The body, for example, compressed air is suitable, but it may be a compressed gas other than compressed air or a liquid such as water. Further, the number of the injection holes 18, the flow rate of the fluid, and the pressure can be appropriately changed. In general, if the set pressure of the fluid is increased, the flow rate is increased, and the difference between the suction holding state of the workpiece W and the flow rate of the fluid in the non-suction holding state is increased, and the permeation flow sensor 26 can easily grasp whether or not the workpiece W is Attractive to keep.
另外,即使在噴射孔18的孔徑較小的情況,也具有噴射孔18的數量越多其合計流量的變化越大的傾向。因此,在噴射孔18較多的情況下即使降低流體的設定壓,透過其流量變化可容易地把握是否為吸引保持。 In addition, even when the diameter of the injection hole 18 is small, the larger the number of the injection holes 18, the larger the change in the total flow rate tends to be. Therefore, even when the number of the injection holes 18 is large, even if the set pressure of the fluid is lowered, it is possible to easily grasp whether or not the suction is maintained by the change in the flow rate.
對於複數個噴射孔18的流體的供給與停止,可以透過共通的控制部一體地進行控制,也可按每個噴射孔18或者分成複數個組控制複數個噴射孔18。在該情況,可以根據該供給、停止的控制方式一體地或分別地或分組地設置流量感測器26、壓力感測器27等。 The supply and stop of the fluid to the plurality of injection holes 18 may be integrally controlled by the common control unit, or the plurality of injection holes 18 may be controlled for each of the injection holes 18 or divided into a plurality of groups. In this case, the flow rate sensor 26, the pressure sensor 27, and the like may be provided integrally or separately or in groups according to the supply and stop control methods.
1、2‧‧‧靜壓墊 1, 2‧‧‧ static pressure pad
3、4‧‧‧缺口部 3, 4‧‧ ‧ gap
5、6‧‧‧磨削磨石 5, 6‧‧‧ grinding grinding stone
7‧‧‧載體 7‧‧‧ Carrier
8‧‧‧搬入手段 8‧‧‧Relocation means
9‧‧‧搬出手段 9‧‧‧Removal means
10、11‧‧‧靜壓支持面 10, 11‧‧‧ Static pressure support surface
12、13‧‧‧凹部 12.13‧‧‧ recess
14、15‧‧‧凸部 14, 15‧‧ ‧ convex
16、17‧‧‧排出槽 16, 17‧‧ ‧ discharge trough
18‧‧‧噴射孔 18‧‧‧Spray hole
21、22‧‧‧開閉控制手段 21, 22‧‧‧ opening and closing control means
23‧‧‧靜壓水供給源 23‧‧‧ Static pressure water supply source
24‧‧‧開閉控制手段 24‧‧‧Opening and closing control means
25‧‧‧壓縮空氣供給源 25‧‧‧Compressed air supply
26‧‧‧流量感測器 26‧‧‧Flow sensor
27‧‧‧壓力感測器 27‧‧‧ Pressure Sensor
36‧‧‧可動框 36‧‧‧ movable frame
37、38‧‧‧吸附杯 37, 38‧‧‧ adsorption cup
W‧‧‧工件 W‧‧‧Workpiece
X1‧‧‧前進保持位置 X1‧‧‧Progress to maintain position
X2‧‧‧退後位置 X2‧‧‧Retirement position
Y1‧‧‧前進端 Y1‧‧‧ forward end
Y2‧‧‧後退端 Y2‧‧‧ Back end
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JP2014034825A JP6250435B2 (en) | 2014-02-26 | 2014-02-26 | Double-head surface grinding method |
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TW201544246A true TW201544246A (en) | 2015-12-01 |
TWI641449B TWI641449B (en) | 2018-11-21 |
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KR (1) | KR102241071B1 (en) |
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TWI823511B (en) * | 2021-12-24 | 2023-11-21 | 大陸商西安奕斯偉材料科技股份有限公司 | Double-sided grinding device and double-sided grinding method |
CN114770366A (en) * | 2022-05-17 | 2022-07-22 | 西安奕斯伟材料科技有限公司 | Static pressure plate of silicon wafer double-side grinding device and silicon wafer double-side grinding device |
CN114770366B (en) * | 2022-05-17 | 2023-11-17 | 西安奕斯伟材料科技股份有限公司 | Static pressure plate of silicon wafer double-sided grinding device and silicon wafer double-sided grinding device |
TWI842108B (en) * | 2022-06-16 | 2024-05-11 | 大陸商西安奕斯偉材料科技股份有限公司 | Double-sided polishing device and double-sided polishing method |
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CN104858736B (en) | 2019-04-23 |
KR102241071B1 (en) | 2021-04-16 |
TWI641449B (en) | 2018-11-21 |
JP2015160250A (en) | 2015-09-07 |
KR20150101421A (en) | 2015-09-03 |
JP6250435B2 (en) | 2017-12-20 |
CN104858736A (en) | 2015-08-26 |
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