TW201531556A - Curable resin composition for sealing organic electroluminescent display element, curable resin sheet for sealing organic electroluminescent display element, and organic electroluminescent display element - Google Patents

Curable resin composition for sealing organic electroluminescent display element, curable resin sheet for sealing organic electroluminescent display element, and organic electroluminescent display element Download PDF

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TW201531556A
TW201531556A TW103142715A TW103142715A TW201531556A TW 201531556 A TW201531556 A TW 201531556A TW 103142715 A TW103142715 A TW 103142715A TW 103142715 A TW103142715 A TW 103142715A TW 201531556 A TW201531556 A TW 201531556A
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display element
curable resin
sealing
resin composition
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Minoru Suezaki
Takashi Shinjo
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Sekisui Chemical Co Ltd
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
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    • H10K50/844Encapsulations

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Abstract

One purpose of this invention is to provide a curable resin composition for sealing an organic electroluminescent display element. Said curable resin composition yields a resin sheet that excels in terms of adhesiveness, transparency, and barrier performance, wherein crack formation due to heating, bending, or the like is prevented. Another purpose of this invention is to provide an organic electroluminescent display element and a curable resin sheet for sealing same obtained using the aforementioned curable resin composition. This invention is a curable resin composition for sealing an organic electroluminescent display element, said curable resin composition containing a polyfunctional cationically polymerizable oligomer, a cationically polymerized polymer having a molecular weight of over 100,000, and a hardener.

Description

有機電致發光顯示元件密封用硬化性樹脂組成物、有機電致發光顯示元件密封用硬化性樹脂片、及有機電致發光顯示元件 Curable resin composition for sealing an organic electroluminescence display element, curable resin sheet for sealing an organic electroluminescence display element, and organic electroluminescence display element

本發明係關於一種有機電致發光顯示元件密封用硬化性樹脂組成物,其可防止因加熱或彎曲等而導致之龜裂之產生,可獲得接著性、透明性、阻隔性優異之樹脂片。又,本發明係關於一種使用該有機電致發光顯示元件密封用硬化性樹脂組成物而成之有機電致發光顯示元件密封用硬化性樹脂片及有機電致發光顯示元件。 The present invention relates to a curable resin composition for sealing an organic electroluminescence display element, which can prevent occurrence of cracks due to heating or bending, and can obtain a resin sheet excellent in adhesion, transparency, and barrier properties. Moreover, the present invention relates to a curable resin sheet for organic electroluminescence display element sealing and an organic electroluminescence display element which are obtained by using the curable resin composition for sealing an organic electroluminescence display element.

有機電致發光(以下亦稱為「有機EL」)顯示元件具有於相互對向之一對電極間夾持有有機發光材料層之積層體構造,藉由對該有機發光材料層自一電極注入電子並且自另一電極注入電洞而於有機發光材料層內使電子與電洞結合而發光。如此,有機EL顯示元件由於進行自發光,故而與需要背光裝置之液晶顯示元件等相比具有視認性良好、可薄型化,並且能夠以直流低電壓驅動之優點。 The organic electroluminescence (hereinafter also referred to as "organic EL") display element has a laminate structure in which an organic light-emitting material layer is sandwiched between a pair of opposite electrodes, and the organic light-emitting material layer is injected from an electrode. Electrons are injected into the holes from the other electrode to cause electrons to combine with the holes to emit light in the organic light-emitting material layer. In this way, since the organic EL display element is self-luminous, it has an advantage that it is excellent in visibility and can be made thinner than a liquid crystal display element requiring a backlight device, and can be driven by a DC low voltage.

構成有機EL顯示元件之有機發光材料層或電極有因水分或氧等而容易使特性劣化之問題。因此,為了獲得實用性之有機EL顯示元件,必須將有機發光材料層或電極與大氣隔斷而謀求長壽命化。作為將 有機發光材料層或電極與大氣隔斷之方法,有使用密封劑將有機EL顯示元件密封(例如專利文獻1)之方法。於利用密封劑將有機EL顯示元件密封之情形時,通常使用如下方法:為了充分地抑制水分或氧等之透過,而於具有有機發光材料層之積層體上設置稱為鈍化膜之無機膜,並利用密封劑於該無機膜上進行密封。 The organic light-emitting material layer or the electrode constituting the organic EL display element has a problem that the characteristics are easily deteriorated by moisture, oxygen, or the like. Therefore, in order to obtain a practical organic EL display element, it is necessary to cut off the organic light-emitting material layer or the electrode from the atmosphere to achieve a long life. As will A method of blocking an organic light-emitting material layer or an electrode from the atmosphere is a method of sealing an organic EL display element using a sealant (for example, Patent Document 1). When the organic EL display element is sealed with a sealant, a method in which an inorganic film called a passivation film is provided on a laminate having an organic light-emitting material layer is generally used in order to sufficiently suppress the permeation of moisture or oxygen. The sealant is used to seal the inorganic film.

另一方面,近年來,作為新穎之顯示器之形態,開發有可變形為曲面狀之可撓性顯示器。此種可撓性顯示器係藉由使用耐熱塑膠製之透明基板或極薄之玻璃基板代替習知之玻璃基板來製作有機EL顯示元件而獲得。認為使用此種可撓性基板亦會對製造製程帶來革新。即,由於可使用更簡易之輥貼合代替習知之剛直之基板之貼合中多使用之真空貼合技術作為製程,故而可期待製造步驟之簡略化或工作時間(tact time)之縮短。 On the other hand, in recent years, as a form of a novel display, a flexible display which can be deformed into a curved shape has been developed. Such a flexible display is obtained by fabricating an organic EL display element by using a transparent substrate made of heat-resistant plastic or an extremely thin glass substrate instead of a conventional glass substrate. It is believed that the use of such a flexible substrate will also revolutionize the manufacturing process. That is, since a simpler roll bonding can be used instead of the vacuum bonding technique which is often used in the bonding of a conventional rigid substrate, the simplification of the manufacturing process or the shortening of the tact time can be expected.

另一方面,對習知所使用之材料亦謀求革新,關於密封劑,若為習知之液狀密封劑,則會產生如下問題,即於輥貼合時,剩餘之密封劑溢出至周邊而污損設備,或者吞入氣泡或難以獲取密封劑層之厚度之均勻性,因此謀求片狀之密封材料。然而,於使習知之密封劑呈片狀而使用之情形時,有於製造步驟中加熱時或因輥貼合或使用時之彎曲而產生龜裂之問題。 On the other hand, the materials used in the prior art are also innovated. As for the sealant, if it is a conventional liquid sealant, there is a problem in that when the roll is attached, the remaining sealant overflows to the periphery and is contaminated. In the case of damage to the device, or the entrapment of air bubbles or the difficulty in obtaining the uniformity of the thickness of the sealant layer, a sheet-like sealing material is sought. However, in the case where the conventional sealant is used in the form of a sheet, there is a problem that cracks occur during heating in the production step or when the roll is bonded or used.

專利文獻1:日本特開2007-115692號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2007-115692

本發明之目的在於提供一種有機電致發光顯示元件密封用 硬化性樹脂組成物,其可防止因加熱或彎曲等而導致之龜裂之產生,可獲得接著性、透明性、阻隔性優異之樹脂片。又,本發明之目的在於提供一種使用該有機電致發光顯示元件密封用硬化性樹脂組成物而成之有機電致發光顯示元件密封用硬化性樹脂片及有機電致發光顯示元件。 It is an object of the present invention to provide an organic electroluminescent display element for sealing The curable resin composition can prevent the occurrence of cracks due to heating or bending, and can obtain a resin sheet excellent in adhesion, transparency, and barrier properties. Moreover, an object of the present invention is to provide a curable resin sheet for organic electroluminescence display element sealing and an organic electroluminescence display element which are obtained by using the curable resin composition for sealing an organic electroluminescence display element.

本發明係一種有機電致發光顯示元件密封用硬化性樹脂組成物,其含有多官能陽離子聚合性低聚物、分子量超過10萬之陽離子聚合性聚合物、及硬化劑。 The present invention relates to a curable resin composition for sealing an organic electroluminescence display element, which comprises a polyfunctional cationically polymerizable oligomer, a cationically polymerizable polymer having a molecular weight of more than 100,000, and a curing agent.

以下,對本發明進行詳細說明。 Hereinafter, the present invention will be described in detail.

本發明者們為了防止因加熱或彎曲等而導致之龜裂之產生,而研究對密封材料使用熱塑性樹脂等柔軟性相對比較優異之樹脂。然而,於使用此種樹脂之情形時,有所獲得之硬化物之阻隔性(防透濕性)變差之問題。 In order to prevent the occurrence of cracks due to heating or bending, the inventors of the present invention have studied a resin which is relatively excellent in flexibility such as a thermoplastic resin for a sealing material. However, in the case of using such a resin, there is a problem that the barrier property (water permeability resistance) of the obtained cured product is deteriorated.

因此,本發明者們進行努力研究,結果發現,藉由將多官能陽離子聚合性低聚物與特定之陽離子聚合性聚合物組合使用,而可獲得一種有機EL顯示元件用硬化性樹脂組成物,其可防止因加熱或彎曲等而導致之龜裂之產生,可獲得接著性、透明性、阻隔性優異之樹脂片,從而完成本發明。 Therefore, the inventors of the present invention have conducted an effort to obtain a curable resin composition for an organic EL display device by using a polyfunctional cationically polymerizable oligomer in combination with a specific cationic polymerizable polymer. This can prevent the occurrence of cracks due to heating or bending, and can obtain a resin sheet excellent in adhesion, transparency, and barrier properties, thereby completing the present invention.

本發明之有機EL顯示元件密封用硬化性樹脂組成物含有多官能陽離子聚合性低聚物。 The curable resin composition for sealing an organic EL display element of the present invention contains a polyfunctional cationically polymerizable oligomer.

上述多官能陽離子聚合性低聚物係於1分子中具有2個以上之陽離子聚合性基之低聚物,對陽離子聚合性聚合物發揮塑化劑之作用,具有呈現出因加熱而產生之流動接著性,並且藉由陽離子聚合進行交聯硬化而賦予 牢固之接著力與阻隔性之作用。上述「低聚物」係指為聚合性單體之單體、及使該單體以低聚合度聚合而成之化合物。 The polyfunctional cationically polymerizable oligomer is an oligomer having two or more cationically polymerizable groups in one molecule, and functions as a plasticizer for the cationically polymerizable polymer, and exhibits a flow due to heating. Subsequent, and imparted by cross-linking hardening by cationic polymerization The effect of firm adhesion and barrier properties. The above "oligomer" means a monomer which is a polymerizable monomer and a compound which polymerizes the monomer at a low degree of polymerization.

作為上述多官能陽離子聚合性低聚物具有之陽離子聚合性基,例如可列舉環氧基、氧雜環丁基(oxetanyl group)等。其中,較佳為環氧基。 The cationically polymerizable group which the polyfunctional cationically polymerizable oligomer has is exemplified by an epoxy group, an oxetanyl group, and the like. Among them, an epoxy group is preferred.

又,上述多官能陽離子聚合性低聚物較佳為於分子內具有1個以上之環狀結構者,作為環狀結構,可列舉芳香族化合物、脂環式化合物。 In addition, the polyfunctional cationically polymerizable oligomer preferably has one or more cyclic structures in the molecule, and examples of the cyclic structure include an aromatic compound and an alicyclic compound.

上述多官能陽離子聚合性低聚物之陽離子聚合性基當量之較佳下限為50g/mol,較佳之上限為400g/mol。若上述多官能陽離子聚合性低聚物之陽離子聚合性基當量未達50g/mol,則有所獲得之有機EL顯示元件密封用硬化性樹脂組成物之硬化物因加熱或變形而產生龜裂之情況。若上述多官能陽離子聚合性低聚物之陽離子聚合性基當量超過400g/mol,則有所獲得之有機EL顯示元件密封用硬化性樹脂組成物之硬化物成為阻隔性較差者之情況。上述多官能陽離子聚合性低聚物之陽離子聚合性基當量之更佳之下限為70g/mol,更佳之上限為300g/mol。 A preferred lower limit of the cationically polymerizable group equivalent of the above polyfunctional cationically polymerizable oligomer is 50 g/mol, and a preferred upper limit is 400 g/mol. When the cationically polymerizable base equivalent of the polyfunctional cationically polymerizable oligomer is less than 50 g/mol, the cured product of the curable resin composition for sealing an organic EL display element obtained is cracked by heating or deformation. Happening. When the cationically polymerizable group equivalent of the polyfunctional cationically polymerizable oligomer is more than 400 g/mol, the cured product of the curable resin composition for sealing an organic EL display element obtained may be inferior in barrier properties. A more preferred lower limit of the cationically polymerizable group equivalent of the above polyfunctional cationically polymerizable oligomer is 70 g/mol, and a more preferred upper limit is 300 g/mol.

再者,上述多官能陽離子聚合性低聚物之陽離子聚合性基當量係多官能陽離子聚合性低聚物之重量(g)除以多官能陽離子聚合性低聚物中所含有之陽離子聚合性基之莫耳數(mol)而求得之值。 Further, the weight (g) of the cationically polymerizable group-based polyfunctional cationically polymerizable oligomer of the above polyfunctional cationically polymerizable oligomer is divided by the cationically polymerizable group contained in the polyfunctional cationically polymerizable oligomer. The value obtained by the molar number (mol).

上述多官能陽離子聚合性低聚物之分子量之較佳之下限為150,較佳之上限為7000。若上述多官能陽離子聚合性低聚物之分子量未達150,則會成為釋氣產生之原因。若上述多官能陽離子聚合性低聚物之分子量超過7000,則有對陽離子聚合性聚合物之塑化劑之作用變得不充 分,因加熱而產生之流動接著性降低之情況。上述多官能陽離子聚合性低聚物之分子量更佳之下限為200,更佳之上限為5000,進而較佳之下限為250,進而較佳之上限為1000,尤佳之上限為600。 A preferred lower limit of the molecular weight of the above polyfunctional cationically polymerizable oligomer is 150, and a preferred upper limit is 7,000. When the molecular weight of the above polyfunctional cationically polymerizable oligomer is less than 150, it is a cause of outgassing. When the molecular weight of the above polyfunctional cationically polymerizable oligomer exceeds 7,000, the effect of the plasticizer for the cationically polymerizable polymer becomes insufficient. The case where the flow continuity due to heating is lowered. The lower limit of the molecular weight of the above polyfunctional cationically polymerizable oligomer is preferably 200, more preferably the upper limit is 5,000, and the lower limit is preferably 250, and further preferably the upper limit is 1000, and the upper limit is preferably 600.

再者,關於上述多官能陽離子聚合性低聚物之分子量,分子結構特定之化合物係根據結構式而求出之分子量,聚合度之分佈較廣之化合物及改質部位不特定之化合物有使用重量平均分子量來表示之情形。本說明書中,上述「重量平均分子量」係利用凝膠滲透層析法(GPC)進行測定,並藉由聚苯乙烯換算而求出之值。作為藉由GPC並利用聚苯乙烯換算而測定重量平均分子量時所使用之管柱,例如可列舉Shodex LF-804(昭和電工公司製造)等。 Further, regarding the molecular weight of the polyfunctional cationically polymerizable oligomer, a compound having a specific molecular structure is a molecular weight determined by a structural formula, and a compound having a wide distribution of polymerization degree and a compound having a modified portion are not particularly useful. The average molecular weight is used to indicate the situation. In the present specification, the above "weight average molecular weight" is measured by gel permeation chromatography (GPC) and is determined by polystyrene conversion. For example, Shodex LF-804 (manufactured by Showa Denko KK) can be used as the column to be used for the measurement of the weight average molecular weight by the GPC.

作為上述多官能陽離子聚合性低聚物,例如可列舉具有雙酚A骨架、雙酚F骨架、氫化雙酚A骨架、氫化雙酚F骨架、酚系酚醛清漆骨架、聯苯骨架、氫化聯苯骨架、二環戊二烯骨架、萘骨架、三骨架等之低聚物。其中,就可降低吸濕或水蒸氣之透過率,可進一步抑制所獲得之有機EL顯示元件之發光之劣化之方面而言,較佳為具有氫化雙酚A骨架、氫化雙酚F骨架、二環戊二烯骨架等脂環骨架之低聚物。又,藉由使用具有脂環骨架之低聚物作為上述多官能陽離子聚合性低聚物,而難以引起因熱或光而導致之硬化性樹脂組成物之著色,並可減小因硬化性樹脂組成物之吸光而導致之EL發光之損失或色調之變化。該等多官能陽離子聚合性低聚物可單獨使用,亦可併用2種以上。 Examples of the polyfunctional cationically polymerizable oligomer include a bisphenol A skeleton, a bisphenol F skeleton, a hydrogenated bisphenol A skeleton, a hydrogenated bisphenol F skeleton, a phenol novolak skeleton, a biphenyl skeleton, and a hydrogenated biphenyl. Skeleton, dicyclopentadiene skeleton, naphthalene skeleton, three An oligomer such as a skeleton. Among them, the moisture absorption rate of moisture absorption or water vapor can be lowered, and the deterioration of the light emission of the obtained organic EL display element can be further suppressed, and it is preferable to have a hydrogenated bisphenol A skeleton, a hydrogenated bisphenol F skeleton, and two An oligomer of an alicyclic skeleton such as a cyclopentadiene skeleton. In addition, by using an oligomer having an alicyclic skeleton as the polyfunctional cationically polymerizable oligomer, it is difficult to cause coloring of the curable resin composition due to heat or light, and the curable resin can be reduced. The loss of EL luminescence or the change in hue caused by the absorption of the composition. These polyfunctional cationically polymerizable oligomers may be used singly or in combination of two or more kinds.

作為具有上述脂環骨架之低聚物,只要為於該結構中具有脂環骨架與2個以上之陽離子聚合性基者,便無特別限定,可為於結構中 或於重複單位內具有僅1個上述脂環骨架之化合物,亦可為於重複單位內具有2個以上之脂環骨架之化合物,但更佳為使用於重複單位內具有2個以上之脂環骨架之化合物。於具有上述脂環骨架之環氧化合物為於重複單位內具有2個以上之脂環骨架之化合物之情形時,本發明之有機EL顯示元件密封用硬化性樹脂組成物成為耐光性、耐濕性等更優異者。 The oligomer having the above alicyclic skeleton is not particularly limited as long as it has an alicyclic skeleton and two or more cationically polymerizable groups in the structure, and may be in the structure. Or a compound having only one of the above alicyclic skeletons in a repeating unit, or a compound having two or more alicyclic skeletons in a repeating unit, but more preferably having two or more alicyclic rings in a repeating unit. a compound of the skeleton. When the epoxy compound having the alicyclic skeleton is a compound having two or more alicyclic skeletons in a repeating unit, the curable resin composition for sealing an organic EL display element of the present invention has light resistance and moisture resistance. More excellent.

作為具有上述脂環骨架之低聚物中之市售者,例如可列舉jER YX8034、jER YL6753(均為三菱化學公司製造)、EPICLON HP7200L(DIC公司製造)、DME-100(新日本理化工業公司製造)、EP-4085(ADEKA公司製造)、CELLOXIDE 3000、EHPE 3150(均為Daicel公司製造)等。 As a commercial product of the oligomer having the above alicyclic skeleton, for example, jER YX8034, jER YL6753 (all manufactured by Mitsubishi Chemical Corporation), EPICLON HP7200L (manufactured by DIC Corporation), and DME-100 (New Japan Physical and Chemical Industry Co., Ltd.) are mentioned. Manufacturing), EP-4085 (manufactured by Adeka), CELLOXIDE 3000, EHPE 3150 (all manufactured by Daicel), and the like.

又,上述多官能陽離子聚合性低聚物較佳為具有環氧基或氧雜環丁基,且不具有除環氧基或氧雜環丁基所含有之醚鍵、及酯鍵以外之醚鍵、及酯鍵的化合物。藉由使用此種化合物,而可抑制釋氣之產生。 Further, the polyfunctional cationically polymerizable oligomer preferably has an epoxy group or an oxetanyl group, and does not have an ether bond other than the epoxy group or the oxetanyl group, and an ether other than the ester bond. A compound of a bond and an ester bond. By using such a compound, the generation of outgas can be suppressed.

作為上述具有環氧基或氧雜環丁基,且不具有除環氧基或氧雜環丁基所含有之醚鍵、及酯鍵以外之醚鍵、及酯鍵的化合物,可列舉下述式(1)所表示之化合物、下述式(2)所表示之化合物等,就可容易地調整所獲得之有機EL顯示元件密封用硬化性樹脂組成物之硬化延遲性或黏度之方面而言,較佳為含有式(1)所表示之化合物及式(2)所表示之化合物。 Examples of the compound having an epoxy group or an oxetanyl group and having no ether bond other than the epoxy group or the oxetanyl group, and an ether bond other than the ester bond, and an ester bond are as follows. The compound represented by the formula (1), the compound represented by the following formula (2), and the like can be easily adjusted in terms of the hardening retardation or the viscosity of the curable resin composition for sealing an organic EL display device obtained. Preferably, the compound represented by the formula (1) and the compound represented by the formula (2) are contained.

式(1)中,R1~R18為氫原子、鹵素原子、或可含有氧原子或鹵素原子之烴基,可分別相同,亦可不同。 In the formula (1), R 1 to R 18 are a hydrogen atom, a halogen atom, or a hydrocarbon group which may contain an oxygen atom or a halogen atom, and may be the same or different.

式(2)中,R19~R21為直鏈狀或支鏈狀之碳數2~10之伸烷基,可分別相同,亦可不同。E1~E3分別獨立表示下述式(3-1)或下述式(3-2)所表示之有機基。 In the formula (2), R 19 to R 21 are a linear or branched alkylene group having 2 to 10 carbon atoms, which may be the same or different. E 1 to E 3 each independently represent an organic group represented by the following formula (3-1) or the following formula (3-2).

式(3-1)中,R22為氫原子或甲基。式(3-1)、(3-2)中,*表示鍵結鍵。 In the formula (3-1), R 22 is a hydrogen atom or a methyl group. In the formulas (3-1) and (3-2), * represents a bonding key.

上述式(1)所表示之化合物就顯示良好之陽離子硬化性之方面而言,較佳為下述式(4)所表示之化合物。 The compound represented by the above formula (1) is preferably a compound represented by the following formula (4) from the viewpoint of exhibiting good cation hardenability.

上述式(2)所表示之化合物就顯示良好之陽離子硬化性,使硬化物顯示較高之玻璃轉移溫度之方面而言,較佳為下述式(5)所表示之化合物。 The compound represented by the above formula (2) exhibits good cationic hardenability, and the compound represented by the following formula (5) is preferred from the viewpoint of exhibiting a high glass transition temperature of the cured product.

本發明之有機EL顯示元件密封用硬化性樹脂組成物含有陽離子聚合性聚合物。 The curable resin composition for sealing an organic EL display element of the present invention contains a cationically polymerizable polymer.

藉由含有上述陽離子聚合性聚合物,而使本發明之有機EL顯示元件密封用硬化性樹脂組成物成為耐彎曲性或阻隔性尤其優異者。 The curable resin composition for sealing an organic EL display device of the present invention is particularly excellent in bending resistance and barrier properties by containing the above-mentioned cationically polymerizable polymer.

作為上述陽離子聚合性聚合物具有之陽離子聚合性基,例 如可列舉環氧基、氧雜環丁基等。其中,較佳為環氧基。 Examples of the cationically polymerizable group which the cationically polymerizable polymer has Examples thereof include an epoxy group and an oxetanyl group. Among them, an epoxy group is preferred.

上述陽離子聚合性聚合物之陽離子聚合性基當量之較佳之上限為3000g/mol。若上述陽離子聚合性聚合物之陽離子聚合性基當量超過3000g/mol,則有使所獲得之有機EL顯示元件密封用硬化性樹脂組成物成為接著性或硬化物之阻隔性較差者之情況。上述陽離子聚合性聚合物之陽離子聚合性基當量之更佳之上限為2000g/mol。 The upper limit of the cationically polymerizable group equivalent of the above cationically polymerizable polymer is preferably 3,000 g/mol. When the cationically polymerizable group equivalent of the above cationically polymerizable polymer is more than 3,000 g/mol, the obtained curable resin composition for sealing an organic EL display device may have poor barrier properties to the adhesive or cured product. The upper limit of the more preferable cationically polymerizable base equivalent of the above cationically polymerizable polymer is 2000 g/mol.

又,上述陽離子聚合性聚合物之陽離子聚合性基當量之較佳之下限為200g/mol。若上述陽離子聚合性聚合物之陽離子聚合性基當量未達200g/mol,則有所獲得之有機EL顯示元件密封用硬化性樹脂組成物之硬化物因加熱或變形而產生龜裂之情況。上述陽離子聚合性聚合物之陽離子聚合性基當量之更佳之下限為300g/mol。 Further, a preferred lower limit of the cationically polymerizable group equivalent of the cationically polymerizable polymer is 200 g/mol. When the cationically polymerizable base equivalent of the above cationically polymerizable polymer is less than 200 g/mol, the cured product of the curable resin composition for sealing an organic EL display element obtained may be cracked by heating or deformation. A more preferred lower limit of the cationically polymerizable group equivalent of the above cationically polymerizable polymer is 300 g/mol.

再者,上述陽離子聚合性聚合物之陽離子聚合性基當量係陽離子聚合性聚合物之重量(g)除以陽離子聚合性聚合物中所含有之陽離子聚合性基之莫耳數(mol)而求得之值。 In addition, the weight (g) of the cationically polymerizable group-based cationically polymerizable polymer of the cationically polymerizable polymer is divided by the number of moles (mol) of the cationically polymerizable group contained in the cationically polymerizable polymer. The value.

上述陽離子聚合性聚合物之分子量超過10萬。若上述陽離子聚合性聚合物之分子量為10萬以下,則所獲得之有機EL顯示元件密封用硬化性樹脂組成物之硬化物因加熱或變形而產生龜裂。 The molecular weight of the above cationically polymerizable polymer exceeds 100,000. When the molecular weight of the above-mentioned cationically polymerizable polymer is 100,000 or less, the cured product of the curable resin composition for sealing an organic EL display element obtained is cracked by heating or deformation.

又,上述陽離子聚合性聚合物之分子量之較佳之上限為50萬。若上述陽離子聚合性聚合物之分子量超過50萬,則有所獲得之有機EL顯示元件密封用硬化性樹脂組成物成為塗佈性較差者之情況。上述陽離子聚合性聚合物之分子量之更佳之上限為30萬。 Further, the upper limit of the molecular weight of the above cationically polymerizable polymer is preferably 500,000. When the molecular weight of the above-mentioned cationically polymerizable polymer is more than 500,000, the curable resin composition for sealing an organic EL display element obtained may be inferior in coatability. The upper limit of the molecular weight of the above cationically polymerizable polymer is preferably 300,000.

再者,上述陽離子聚合性聚合物之分子量係使用重量平均分子量而表 示。 Further, the molecular weight of the above cationically polymerizable polymer is expressed by weight average molecular weight. Show.

作為上述陽離子聚合性聚合物,例如可列舉雙酚A型環氧樹脂、雙酚F型環氧樹脂、其他苯氧樹脂、酚醛清漆型環氧樹脂等環氧樹脂,或(甲基)丙烯酸烷基酯-(甲基)丙烯酸環氧丙酯共聚物、苯乙烯-(甲基)丙烯酸環氧丙酯共聚物等。其中,就使利用所獲得之有機EL顯示元件密封用硬化性樹脂組成物而得之樹脂片成為膜強度優異者之方面而言,較佳為於側鏈具有環氧基者,更佳為(甲基)丙烯酸烷基酯-(甲基)丙烯酸環氧丙酯共聚物、苯乙烯-(甲基)丙烯酸環氧丙酯共聚物。 Examples of the cationically polymerizable polymer include an epoxy resin such as a bisphenol A epoxy resin, a bisphenol F epoxy resin, another phenoxy resin, and a novolac epoxy resin, or an alkyl (meth)acrylate. A base-glycidyl (meth)acrylate copolymer, a styrene-glycidyl (meth)acrylate copolymer, and the like. In the case where the resin sheet obtained by using the curable resin composition for sealing an organic EL display element obtained is excellent in film strength, it is preferable to have an epoxy group in a side chain, and it is more preferable ( Alkyl methacrylate-glycidyl methacrylate copolymer, styrene-glycidyl methacrylate copolymer.

作為上述陽離子聚合性聚合物之市售者,例如可列舉MARPROOF G-1010S、MARPROOF G-2050M(均為日油公司製造)等。 The commercially available ones of the above-mentioned cationically polymerizable polymers include, for example, MARPROOF G-1010S and MARPROOF G-2050M (all manufactured by Nippon Oil Co., Ltd.).

上述陽離子聚合性聚合物之含量相對於上述多官能陽離子聚合性低聚物100重量份而言,較佳之下限為20重量份,較佳之上限為200重量份。若上述陽離子聚合性聚合物之含量未達20重量份,則有於使用所獲得之有機EL顯示元件密封用硬化性樹脂組成物形成樹脂片時,硬化前之表面黏性較大,作業性降低之情況。若上述陽離子聚合性聚合物之含量超過200重量份,則有為了獲得充分之接著性,於製作有機EL顯示元件時,必須於高溫下進行加熱,而使有機發光材料層等劣化之情況。上述陽離子聚合性聚合物之含量之更佳之下限為50重量份,更佳之上限為150重量份,進而較佳之下限為70重量份,進而較佳之上限為120重量份。 The content of the cationically polymerizable polymer is preferably 20 parts by weight, and preferably 200 parts by weight, based on 100 parts by weight of the polyfunctional cationically polymerizable oligomer. When the content of the above-mentioned cationically polymerizable polymer is less than 20 parts by weight, when the resin sheet is formed using the curable resin composition for sealing an organic EL display element obtained, the surface viscosity before curing is large, and workability is lowered. The situation. When the content of the above-mentioned cationically polymerizable polymer is more than 200 parts by weight, in order to obtain sufficient adhesion, it is necessary to heat the organic EL display element at a high temperature to deteriorate the organic light-emitting material layer or the like. A more preferred lower limit of the content of the above cationically polymerizable polymer is 50 parts by weight, more preferably 150 parts by weight, still more preferably 70 parts by weight, and still more preferably 120 parts by weight.

本發明之有機EL顯示元件密封用硬化性樹脂組成物含有硬化劑。作為上述硬化劑,可使用陽離子聚合起始劑及/或熱硬化劑。 The curable resin composition for sealing an organic EL display element of the present invention contains a curing agent. As the above curing agent, a cationic polymerization initiator and/or a thermal curing agent can be used.

作為上述陽離子聚合起始劑,可使用藉由熱而開始硬化反應之熱陽離子聚合起始劑或藉由光而開始硬化反應之光陽離子聚合起始劑。其中,作為上述硬化劑,較佳為含有熱陽離子聚合起始劑。 As the above cationic polymerization initiator, a thermal cationic polymerization initiator which starts a curing reaction by heat or a photocationic polymerization initiator which starts a curing reaction by light can be used. Among them, as the curing agent, a thermal cationic polymerization initiator is preferably contained.

作為上述熱陽離子聚合起始劑,例如可列舉鋶鹽、鏻鹽、四級銨鹽、重氮鎓鹽、錪鹽等。其中,較佳為鋶鹽。 Examples of the thermal cationic polymerization initiator include a phosphonium salt, a phosphonium salt, a quaternary ammonium salt, a diazonium salt, and a phosphonium salt. Among them, a phosphonium salt is preferred.

作為上述熱陽離子聚合起始劑中之抗衡陰離子,例如可列舉AsF6 -、SbF6 -、PF6 -、(BX4)-(其中,X表示經至少2個以上之氟或三氟甲基取代之苯基)等。 Examples of the counter anion in the thermal cationic polymerization initiator include AsF 6 - , SbF 6 - , PF 6 - , (BX 4 ) - (wherein X represents at least 2 or more fluorine or trifluoromethyl groups) Substituted phenyl) and the like.

作為上述鋶鹽,例如可列舉三苯基鋶四氟化硼、三苯基鋶六氟化銻、三苯基鋶六氟化砷、三(4-甲氧基苯基)鋶六氟化砷、二苯基(4-苯硫基苯基)鋶六氟化砷等。 Examples of the onium salt include triphenylsulfonium tetrafluoride, triphenylsulfonium hexafluoride, triphenylsulfonium hexafluoride, and tris(4-methoxyphenyl)phosphonium hexafluoride. Diphenyl (4-phenylthiophenyl) ruthenium hexafluoride or the like.

作為上述鏻鹽,可列舉乙基三苯基鏻六氟化銻、四丁基鏻六氟化銻等。 Examples of the onium salt include ethyltriphenylphosphonium hexafluoride, tetrabutylphosphonium hexafluoride, and the like.

作為上述四級銨鹽,例如可列舉二甲基苯基(4-甲氧基苄基)銨六氟磷酸鹽、二甲基苯基(4-甲氧基苄基)銨六氟銻酸鹽、二甲基苯基(4-甲氧基苄基)銨四(五氟苯基)硼酸鹽、二甲基苯基(4-甲基苄基)銨六氟磷酸鹽、二甲基苯基(4-甲基苄基)銨六氟銻酸鹽、二甲基苯基(4-甲基苄基)銨六氟四(五氟苯基)硼酸鹽、甲基苯基二苄基銨、甲基苯基二苄基銨六氟銻酸鹽六氟磷酸鹽、甲基苯基二苄基銨四(五氟苯基)硼酸鹽、苯基三苄基銨四(五氟苯基)硼酸鹽、二甲基苯基(3,4-二甲基苄基)銨四(五氟苯基)硼酸鹽、N,N-二甲基-N-苄基苯胺鎓六氟化銻、N,N-二乙基-N-苄基苯胺鎓四氟化硼、N,N-二甲基-N-苄基吡啶鎓六氟化銻、N,N-二乙基-N-苄基吡啶鎓三氟甲磺酸鹽、N,N-二 甲基-N-(4-甲氧基苄基)吡啶鎓六氟化銻、N,N-二乙基-N-(4-甲氧基苄基)吡啶鎓六氟化銻、N,N-二乙基-N-(4-甲氧基苄基)甲苯胺鎓六氟化銻、N,N-二甲基-N-(4-甲氧基苄基)甲苯胺鎓六氟化銻等。 Examples of the above quaternary ammonium salt include dimethylphenyl (4-methoxybenzyl) ammonium hexafluorophosphate and dimethylphenyl (4-methoxybenzyl) ammonium hexafluoroantimonate. , dimethylphenyl (4-methoxybenzyl) ammonium tetrakis(pentafluorophenyl) borate, dimethylphenyl (4-methylbenzyl) ammonium hexafluorophosphate, dimethylphenyl (4-methylbenzyl)ammonium hexafluoroantimonate, dimethylphenyl (4-methylbenzyl) ammonium hexafluorotetrakis(pentafluorophenyl)borate, methylphenyl dibenzylammonium, Methylphenyl dibenzylammonium hexafluoroantimonate hexafluorophosphate, methylphenyl dibenzylammonium tetrakis(pentafluorophenyl)borate, phenyltribenzylammonium tetrakis(pentafluorophenyl)borate Salt, dimethylphenyl (3,4-dimethylbenzyl) ammonium tetrakis(pentafluorophenyl)borate, N,N-dimethyl-N-benzylaniline ruthenium hexafluoride, N, N-Diethyl-N-benzylaniline bismuth tetrafluoroborate, N,N-dimethyl-N-benzylpyridinium ruthenium hexafluoride, N,N-diethyl-N-benzylpyridinium Triflate, N, N-di Methyl-N-(4-methoxybenzyl)pyridinium ruthenium hexafluoride, N,N-diethyl-N-(4-methoxybenzyl)pyridinium ruthenium hexafluoride, N,N -Diethyl-N-(4-methoxybenzyl)toluidine antimony hexafluoride, N,N-dimethyl-N-(4-methoxybenzyl)toluidine antimony hexafluoride Wait.

作為上述熱陽離子聚合起始劑中之市售者,例如可列舉ADEKA OPTON CP-66、ADEKA OPTON CP-77(均為ADEKA公司製造);或為不僅具有熱活性,亦具有光活性之熱陽離子聚合起始劑之San-Aid SI-60、San-Aid SI-80、San-Aid SI-100、San-Aid SI-110、San-Aid SI-180、San-Aid SI-B3A、San-Aid SI-B4(均為三新化學工業公司製造);K-PURE CXC-1612、K-PURE CXC-1738、K-PURE CXC-1821(均為King Industries公司製造)等。 As a commercial one of the above-mentioned thermal cationic polymerization initiators, for example, ADEKA OPTON CP-66, ADEKA OPTON CP-77 (all manufactured by ADEKA Co., Ltd.); or a thermal cation having photoactivity not only having thermal activity but also being photoactive Polymerization initiators San-Aid SI-60, San-Aid SI-80, San-Aid SI-100, San-Aid SI-110, San-Aid SI-180, San-Aid SI-B3A, San-Aid SI-B4 (all manufactured by Sanshin Chemical Industry Co., Ltd.); K-PURE CXC-1612, K-PURE CXC-1738, K-PURE CXC-1821 (all manufactured by King Industries), and the like.

作為上述光陽離子聚合起始劑,只要為藉由光照射而產生質子酸或路易斯酸者便無特別限定,可為離子性光酸產生型,亦可為非離子性光酸產生型。 The photocationic polymerization initiator is not particularly limited as long as it is a protonic acid or a Lewis acid by light irradiation, and may be an ionic photoacid generation type or a nonionic photoacid generation type.

其中,就成為對鍍鎳Cu玻璃或無鹼玻璃之接著性尤其優異者之方面而言,所獲得之有機電致發光顯示元件用密封劑較佳為銻錯合物、具有六氟化磷離子之鹽、或下述式(6)所表示之鹽。 Among them, the sealant for an organic electroluminescence display device is preferably a ruthenium complex having a phosphorus hexafluoride ion in terms of particularly excellent adhesion to nickel-plated Cu glass or alkali-free glass. The salt or the salt represented by the following formula (6).

式(6)中,n表示1~12之整數,m表示1~5之整數,Rf表示烷基之全部或一部分之氫被氟取代而得之氟烷基。 In the formula (6), n represents an integer of 1 to 12, m represents an integer of 1 to 5, and Rf represents a fluoroalkyl group in which all or a part of hydrogen of the alkyl group is substituted by fluorine.

上述銻錯合物並無特別限定,較佳為鋶鹽。 The above hydrazine complex is not particularly limited, and is preferably a phosphonium salt.

作為上述銻錯合物之鋶鹽具體而言例如可列舉:四苯基(二苯基硫醚-4,4'-二基)二鋶-二(六氟化銻)、四(4-甲氧基苯基)[二苯基硫醚-4,4'-二基]二鋶-二(六氟化銻)、二苯基(4-苯硫基苯基)鋶-六氟化銻、二(4-甲氧基苯基)[4-苯硫基苯基]鋶-六氟化銻等。 Specific examples of the onium salt of the above-mentioned ruthenium complex include tetraphenyl (diphenyl sulfide-4,4'-diyl)difluorene-bis(ruthenium hexafluoride) and tetrakis(4-methyl). Oxyphenyl)[diphenyl sulfide-4,4'-diyl]diindole-bis(phosphonium hexafluoride), diphenyl(4-phenylthiophenyl)fluorene-ruthenium hexafluoride, Bis(4-methoxyphenyl)[4-phenylthiophenyl]anthracene-ruthenium hexafluoride or the like.

作為上述銻錯合物中之市售者,例如可列舉ADEKA OPTOMER SP170(ADEKA公司製造)等。 For example, ADEKA OPTOMER SP170 (manufactured by Adeka Co., Ltd.) or the like can be mentioned as a commercially available product of the above-mentioned oxime complex.

作為上述具有六氟化磷離子之鹽,例如可列舉二苯基錪六氟磷酸鹽、三苯基鋶六氟磷酸鹽等。作為上述具有六氟化磷離子之鹽中之市售者,例如可列舉WPI-113(和光純藥工業公司製造)、CPI-100P(SAN-APRO公司製造)等。 Examples of the salt having a phosphorus hexafluoride ion include diphenylphosphonium hexafluorophosphate and triphenylsulfonium hexafluorophosphate. The commercially available ones of the above-mentioned salts having a phosphorus hexafluoride ion include, for example, WPI-113 (manufactured by Wako Pure Chemical Industries, Ltd.), CPI-100P (manufactured by SAN-APRO Co., Ltd.), and the like.

作為上述式(6)所表示之鹽中之市售者,例如可列舉CPI-200K、CPI-210S(均為SAN-APRO公司製造)等。 The commercially available ones of the salts represented by the above formula (6) include, for example, CPI-200K and CPI-210S (all manufactured by SAN-APRO Co., Ltd.).

上述陽離子聚合起始劑之含量相對於上述多官能陽離子聚合性低聚物與上述陽離子聚合性聚合物之合計100重量份,較佳之下限為0.1重量份,較佳之上限為10重量份。若上述陽離子聚合起始劑之含量未達0.1重量份,則有所獲得之有機EL顯示元件密封用硬化性樹脂組成物之硬化反應變得無法充分地進行之情況。若上述陽離子聚合起始劑之含量超過10重量份,則有所獲得之有機EL顯示元件密封用硬化性樹脂組成物被著色或成為保存穩定性較差者之情況。上述陽離子聚合起始劑之含量之更 佳之下限為0.5重量份,更佳之上限為5重量份。 The content of the cationic polymerization initiator is preferably 0.1 parts by weight, and preferably 10 parts by weight, based on 100 parts by weight of the total of the polyfunctional cationically polymerizable oligomer and the cationically polymerizable polymer. When the content of the cationic polymerization initiator is less than 0.1 part by weight, the curing reaction of the curable resin composition for sealing an organic EL display element obtained may not be sufficiently performed. When the content of the cationic polymerization initiator is more than 10 parts by weight, the obtained curable resin composition for sealing an organic EL display element may be colored or may have poor storage stability. More of the above cationic polymerization initiator The lower limit is preferably 0.5 parts by weight, and more preferably the upper limit is 5 parts by weight.

又,於使用上述光陽離子聚合起始劑作為上述硬化劑之情形時,較佳為含有由下述式(7)所表示之二苯甲酮衍生物構成之敏化劑。上述敏化劑具有進一步提昇上述光陽離子聚合起始劑之聚合起始效率,適度促進本發明之有機EL顯示元件密封用硬化性樹脂組成物之硬化反應之作用。 In the case where the photocationic polymerization initiator is used as the curing agent, it is preferred to contain a sensitizer comprising a benzophenone derivative represented by the following formula (7). The sensitizer has an effect of further enhancing the polymerization initiation efficiency of the photocationic polymerization initiator and appropriately promoting the curing reaction of the curable resin composition for sealing an organic EL display device of the present invention.

式(7)中,R23及R24表示氫、下述式(8-1)所表示之取代基、或下述式(8-2)所表示之取代基。上述R23及R24彼此可相同亦可不同。 In the formula (7), R 23 and R 24 represent hydrogen, a substituent represented by the following formula (8-1), or a substituent represented by the following formula (8-2). The above R 23 and R 24 may be the same or different from each other.

式(8-1)、(8-2)中,R25表示氫、碳數1~20之直鏈狀或分枝狀之烷基、碳數1~20之烷氧基、鹵素原子、羥基、羧基、或碳數1~20之羧酸烷基酯基。 In the formulae (8-1) and (8-2), R 25 represents hydrogen, a linear or branched alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, a halogen atom, or a hydroxyl group. A carboxyl group or a carboxylate group having 1 to 20 carbon atoms.

作為上述式(7)所表示之二苯甲酮衍生物,具體而言,例 如可列舉二苯甲酮、2,4-二氯二苯甲酮、鄰苯甲醯苯甲酸甲酯、4,4'-雙(二甲胺基)二苯甲酮、4-苯甲醯基-4'-甲基二苯硫醚等。 Specific examples of the benzophenone derivative represented by the above formula (7) Examples thereof include benzophenone, 2,4-dichlorobenzophenone, methyl phthalic acid benzoate, 4,4'-bis(dimethylamino)benzophenone, and 4-benzylformamide. Base-4'-methyldiphenyl sulfide and the like.

上述敏化劑之含量相對於上述多官能陽離子聚合性低聚物與上述陽離子聚合性聚合物之合計100重量份,較佳之下限為0.05重量份,較佳之上限為3重量份。若上述敏化劑之含量未達0.05重量份,則有無法充分獲得敏化效果之情況。若上述敏化劑之含量超過3重量份,則有吸收變得過大,光無法傳達至深部之情況。上述敏化劑之含量之更佳之下限為0.1重量份,更佳之上限為1重量份。 The content of the sensitizer is preferably 0.05 parts by weight, and preferably the upper limit is 3 parts by weight, based on 100 parts by weight of the total of the polyfunctional cationically polymerizable oligomer and the cationically polymerizable polymer. If the content of the sensitizer is less than 0.05 part by weight, the sensitizing effect may not be sufficiently obtained. When the content of the sensitizer exceeds 3 parts by weight, the absorption may become too large, and light may not be transmitted to the deep portion. A more preferred lower limit of the content of the above sensitizer is 0.1 part by weight, and a more preferred upper limit is 1 part by weight.

上述熱硬化劑藉由加熱而使上述多官能陽離子聚合性低聚物及上述陽離子聚合性聚合物開始硬化,並且具有促進硬化之功能。 The thermosetting agent starts to harden the polyfunctional cationically polymerizable oligomer and the cationically polymerizable polymer by heating, and has a function of promoting hardening.

作為上述熱硬化劑,例如可列舉醯肼化合物、咪唑衍生物、二級胺化合物、三級胺化合物、酸酐、雙氰胺、胍衍生物、改質脂肪族聚胺、各種胺與環氧樹脂之加成產物等。 Examples of the above-mentioned thermosetting agent include an anthracene compound, an imidazole derivative, a secondary amine compound, a tertiary amine compound, an acid anhydride, a dicyandiamide, an anthracene derivative, a modified aliphatic polyamine, various amines and an epoxy resin. Addition products, etc.

該等熱硬化劑可單獨使用,亦可併用2種以上。 These thermosetting agents may be used singly or in combination of two or more.

作為上述醯肼化合物,例如可列舉1,3-雙(肼基羰乙基-5-異丙基乙內醯脲)等。 Examples of the ruthenium compound include 1,3-bis(decylcarbonylethyl-5-isopropylhydantoin).

作為上述咪唑衍生物,例如可列舉2-甲基咪唑、2-十一烷基咪唑、2-十七烷基咪唑、1,2-二甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、1-苄基-2-甲基咪唑、1-苄基-2-苯基咪唑、1-氰基乙基-2-甲基咪唑、1-氰基乙基-2-乙基-4-甲基咪唑、2,3-二氫-1H-吡咯并[1,2-a]苯并咪唑等咪唑化合物,或2-甲基咪唑啉、2-苯基咪唑啉等咪唑啉類,或1-氰基乙基-2-十一烷基咪唑鎓偏苯三甲酸鹽、環氧基-咪唑加成物等咪唑衍生物。 Examples of the above imidazole derivative include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, and 2-ethyl-4-methylimidazole. , 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methyl Imidazole compound such as imidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, or 2-A Imidazolines such as imidazoline and 2-phenylimidazoline, or imidazole derivatives such as 1-cyanoethyl-2-undecylimidazolium trimellitate and epoxy-imidazole adduct.

作為上述二級胺化合物,例如可列舉哌啶等。 Examples of the secondary amine compound include piperidine and the like.

作為上述三級胺化合物,例如可列舉N,N-二甲基哌、三乙二胺、苄基二甲胺、2-(二甲胺基甲基)苯酚、2,4,6-三(二甲胺基甲基)苯酚等。 As the above tertiary amine compound, for example, N,N-dimethylperidine can be cited. And triethylenediamine, benzyldimethylamine, 2-(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol, and the like.

作為上述酸酐,例如可列舉四氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、甲基耐地酸酐、甲基六氫鄰苯二甲酸酐、氫化甲基耐地酸酐、乙二醇-雙(脫水偏苯三甲酸酯)等。其中,較佳為不含雙鍵之脂環式酸酐。 Examples of the acid anhydride include tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylic acid anhydride, methylhexahydrophthalic anhydride, hydrogenated methylic acid anhydride, and ethylene. Alcohol-bis (dehydrated trimellitate) and the like. Among them, an alicyclic acid anhydride containing no double bond is preferred.

上述熱硬化劑之分子量之較佳之下限為80,較佳之上限為800。若上述熱硬化劑之分子量未達80,則有揮發性變高,產生釋氣之情況。若上述熱硬化劑之分子量超過800,則有將有機EL顯示元件密封用硬化性樹脂組成物熱壓接於元件時之流動性降低,或組成物中之擴散性降低,無法獲得充分之硬化性之情況。上述熱硬化劑之分子量之更佳之下限為100,更佳之上限為500,進而較佳之下限為120,進而較佳之上限為250。 A preferred lower limit of the molecular weight of the above thermal hardener is 80, and a preferred upper limit is 800. If the molecular weight of the above-mentioned thermosetting agent is less than 80, the volatility becomes high and the outgassing occurs. When the molecular weight of the above-mentioned thermosetting agent is more than 800, the fluidity of the curable resin composition for sealing an organic EL display element is thermally pressure-bonded to the element, or the diffusibility in the composition is lowered, and sufficient hardenability cannot be obtained. The situation. A lower limit of the molecular weight of the above-mentioned thermosetting agent is preferably 100, more preferably 500, and further preferably a lower limit of 120, and further preferably an upper limit of 250.

於使用熱硬化劑作為上述硬化劑之情形時,上述熱硬化劑之含量相對於上述多官能陽離子聚合性低聚物與上述陽離子聚合性聚合物之合計100重量份,較佳之下限為0.1重量份,較佳之上限為10重量份。若上述熱硬化劑之含量未達0.1重量份,則有無法使所獲得之有機EL顯示元件密封用硬化性樹脂組成物充分地熱硬化之情況。若上述熱硬化劑之含量超過10重量份,則有所獲得之有機EL顯示元件密封用硬化性樹脂組成物成為保存穩定性較差者之情況。上述熱硬化劑之含量之更佳之下限為0.5重量份,更佳之上限為5重量份。 In the case where a thermal curing agent is used as the curing agent, the content of the thermal curing agent is preferably 100 parts by weight based on 100 parts by weight of the total of the polyfunctional cationically polymerizable oligomer and the cationically polymerizable polymer. Preferably, the upper limit is 10 parts by weight. When the content of the above-mentioned thermosetting agent is less than 0.1 part by weight, the obtained curable resin composition for sealing an organic EL display element may not be sufficiently thermally cured. When the content of the above-mentioned thermosetting agent is more than 10 parts by weight, the obtained curable resin composition for sealing an organic EL display element may be inferior in storage stability. A more preferred lower limit of the content of the above-mentioned thermosetting agent is 0.5 part by weight, and a more preferred upper limit is 5 parts by weight.

再者,於使用上述酸酐作為上述熱硬化劑之情形時,上述酸酐之摻合 量相對於上述多官能陽離子聚合性低聚物與上述陽離子聚合性聚合物之合計100重量份,較佳之下限為50重量份,較佳之上限為150重量份。 Further, in the case where the above acid anhydride is used as the above-mentioned heat hardener, the above acid anhydride is blended The amount is preferably 50 parts by weight, and preferably 150 parts by weight, based on 100 parts by weight of the total of the above polyfunctional cationically polymerizable oligomer and the above cationically polymerizable polymer.

又,於使用上述酸酐作為上述熱硬化劑之情形時,本發明之有機EL顯示元件密封用硬化性樹脂組成物亦可含有硬化促進劑。 In the case where the above-mentioned acid anhydride is used as the above-mentioned heat curing agent, the curable resin composition for sealing an organic EL display element of the present invention may further contain a curing accelerator.

作為上述硬化促進劑,例如可列舉四級銨鹽、四級鋶鹽、DBU脂肪酸鹽、各種金屬鹽、咪唑、三級胺等。 Examples of the curing accelerator include a quaternary ammonium salt, a quaternary phosphonium salt, a DBU fatty acid salt, various metal salts, imidazole, and a tertiary amine.

作為上述四級銨鹽,例如可列舉溴化四甲基銨、溴化四丁基銨等。 Examples of the quaternary ammonium salt include tetramethylammonium bromide and tetrabutylammonium bromide.

作為上述四級鋶鹽,例如可列舉溴化四苯基鏻、溴化四丁基鏻等。 Examples of the above-mentioned quaternary phosphonium salt include tetraphenylphosphonium bromide and tetrabutylphosphonium bromide.

作為上述DBU脂肪酸鹽,例如可列舉DBU之2-乙基己酸鹽等。 Examples of the DBU fatty acid salt include 2-ethylhexanoic acid salt of DBU.

作為上述金屬鹽,例如可列舉辛酸鋅、辛酸錫等。 Examples of the metal salt include zinc octoate and tin octylate.

作為上述咪唑,例如可列舉1-苄基-2-甲基咪唑、1-苄基-2-苯基咪唑、2-乙基-4-甲基咪唑等。 Examples of the imidazole include 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, and 2-ethyl-4-methylimidazole.

作為上述三級胺,例如可列舉三(二甲胺基甲基)苯酚、苄基二甲胺等。 Examples of the tertiary amine include tris(dimethylaminomethyl)phenol and benzyldimethylamine.

上述硬化促進劑之含量相對於上述多官能陽離子聚合性低聚物與上述陽離子聚合性聚合物之合計100重量份,較佳之上限為10重量份。藉由以含量成為10重量份以下之方式添加硬化促進劑,而可適當調整使用上述酸酐作為上述熱硬化劑之情形時之硬化溫度。 The content of the curing accelerator is preferably 10 parts by weight based on 100 parts by weight of the total of the polyfunctional cationically polymerizable oligomer and the cationically polymerizable polymer. By adding a hardening accelerator so that the content is 10 parts by weight or less, the curing temperature in the case where the above-mentioned acid anhydride is used as the above-mentioned heat curing agent can be appropriately adjusted.

本發明之有機EL顯示元件密封用硬化性樹脂組成物較佳為含有矽烷偶合劑。上述矽烷偶合劑具有提昇本發明之有機EL顯示元件密封用硬化性樹脂組成物與被接著體之接著性之作用。 The curable resin composition for sealing an organic EL display element of the present invention preferably contains a decane coupling agent. The decane coupling agent has an effect of improving the adhesion between the curable resin composition for sealing an organic EL display element of the present invention and the adherend.

上述矽烷偶合劑較佳為具有陽離子聚合性基。 The above decane coupling agent preferably has a cationically polymerizable group.

作為上述矽烷偶合劑所具有之較佳之陽離子聚合性基,例如可列舉環氧基、氧雜環丁基等。 The preferred cationically polymerizable group of the above decane coupling agent may, for example, be an epoxy group or an oxetanyl group.

作為具有上述陽離子聚合性基之矽烷偶合劑,例如可列舉3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二甲氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、3-乙基-((三乙氧基矽基丙氧基)甲基)氧雜環丁烷等。其中,就與上述多官能陽離子聚合性低聚物或上述陽離子聚合性聚合物之相溶性或穩定性之觀點而言,較佳為3-環氧丙氧基丙基三甲氧基矽烷。該等矽烷偶合劑可單獨使用,亦可併用2種以上。 Examples of the decane coupling agent having the above cationically polymerizable group include 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmethyldimethoxydecane, and 2-(3). , 4-epoxycyclohexyl)ethyltrimethoxydecane, 3-ethyl-((triethoxydecylpropoxy)methyl)oxetane, and the like. Among them, 3-glycidoxypropyltrimethoxydecane is preferred from the viewpoint of compatibility or stability with the above polyfunctional cationically polymerizable oligomer or the above cationically polymerizable polymer. These decane coupling agents may be used singly or in combination of two or more.

上述矽烷偶合劑之含量相對於上述多官能陽離子聚合性低聚物與上述陽離子聚合性聚合物之合計100重量份,較佳之下限為0.1重量份,較佳之上限為5重量份。若上述矽烷偶合劑之含量未達0.1重量份,則有無法充分發揮提昇所獲得之有機EL顯示元件封止用硬化性樹脂組成物之接著性之效果之情況。若上述矽烷偶合劑之含量超過5重量份,則所獲得之有機EL顯示元件密封用硬化性樹脂組成物之硬化物因交聯密度之降低而成為阻隔性較差者,或剩餘之矽烷偶合劑滲出。上述矽烷偶合劑之含量之更佳之下限為0.3重量份,更佳之上限為2重量份。 The content of the decane coupling agent is preferably 0.1 parts by weight, and preferably 5 parts by weight, based on 100 parts by weight of the total of the polyfunctional cationically polymerizable oligomer and the cationically polymerizable polymer. When the content of the above-mentioned decane coupling agent is less than 0.1 part by weight, the effect of improving the adhesion of the curable resin composition for sealing an organic EL display element obtained by the above may not be sufficiently exhibited. When the content of the above-mentioned decane coupling agent exceeds 5 parts by weight, the cured product of the curable resin composition for sealing an organic EL display element obtained has a poor barrier property due to a decrease in crosslinking density, or the remaining decane coupling agent bleeds out. . A more preferred lower limit of the content of the above decane coupling agent is 0.3 parts by weight, and a more preferred upper limit is 2 parts by weight.

本發明之有機EL顯示元件密封用硬化性樹脂組成物亦可含有界面活性劑。藉由含有上述界面活性劑,而可進一步提昇下述將本發明之有機EL顯示元件密封用硬化性樹脂組成物成形為片狀時之塗佈後之平坦性。 The curable resin composition for sealing an organic EL display element of the present invention may further contain a surfactant. By including the above-mentioned surfactant, the flatness after application of the curable resin composition for sealing an organic EL display element of the present invention into a sheet shape can be further improved.

作為上述界面活性劑,例如可列舉消泡劑或調平劑等。 Examples of the above surfactant include an antifoaming agent, a leveling agent, and the like.

作為上述界面活性劑,例如可列舉氟系、矽酮系、丙烯酸 系等之界面活性劑。其中,較佳為氟系界面活性劑、矽酮系界面活性劑,更佳為氟系界面活性劑。 Examples of the surfactant include fluorine-based, anthrone-based, and acrylic acid. A surfactant such as a surfactant. Among them, a fluorine-based surfactant and an anthrone-based surfactant are preferable, and a fluorine-based surfactant is more preferable.

作為上述氟系界面活性劑,可較佳地使用於末端、主鏈及側鏈之至少任一部位具有氟烷基或氟伸烷基之化合物,具體而言,例如可列舉1,1,2,2-四氟辛基(1,1,2,2-四氟丙基)醚、1,1,2,2-四氟辛基己醚、八乙二醇二(1,1,2,2-四氟丁基)醚、六乙二醇(1,1,2,2,3,3-六氟戊基)醚、八丙二醇二(1,1,2,2-四氟丁基)醚、六丙二醇二(1,1,2,2,3,3-六氟戊基)醚、全氟十二烷基磺酸鈉、1,1,2,2,8,8,9,9,10,10-十氟十二烷、1,1,2,2,3,3-六氟癸烷、氟烷基苯磺酸鈉、氟烷基膦酸鈉、氟烷基羧酸鈉、氟烷基聚氧乙烯醚、二甘油四(氟烷基聚氧乙烯醚)、碘化氟烷基銨、氟烷基甜菜鹼、氟烷基聚氧乙烯醚、全氟烷基聚氧乙醇、全氟烷基烷氧化物、氟系烷基酯等。 The fluorine-based surfactant can be preferably used as a compound having a fluoroalkyl group or a fluoroalkyl group in at least a part of a terminal, a main chain, and a side chain. Specifically, for example, 1, 1, 2 can be mentioned. , 2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl)ether, 1,1,2,2-tetrafluorooctylhexyl ether, octaethylene glycol di(1,1,2, 2-tetrafluorobutyl)ether, hexaethylene glycol (1,1,2,2,3,3-hexafluoropentyl)ether, octapropylene glycol bis(1,1,2,2-tetrafluorobutyl) Ether, hexapropylene glycol bis(1,1,2,2,3,3-hexafluoropentyl)ether, sodium perfluorododecyl sulfonate, 1,1,2,2,8,8,9,9 , 10,10-decafluorododecane, 1,1,2,2,3,3-hexafluorodecane, sodium fluoroalkylbenzenesulfonate, sodium fluoroalkylphosphonate, sodium fluoroalkylcarboxylate, Fluoroalkyl polyoxyethylene ether, diglycerol tetrakis(fluoroalkyl polyoxyethylene ether), fluoroalkyl ammonium iodide, fluoroalkyl betaine, fluoroalkyl polyoxyethylene ether, perfluoroalkyl polyoxyethylene, Perfluoroalkyl alkoxide, fluoroalkyl ester, and the like.

又,作為上述氟系界面活性劑中之市售者,例如可列舉BM-1000、BM-1100(以上為BM HEMIE公司製造),MEGAFAC F142D、MEGAFAC F172、MEGAFAC F173、MEGAFAC F183、MEGAFAC F178、MEGAFAC F191、MEGAFAC F471、MEGAFAC F476(以上為DIC公司製造),FLUORAD FC170C、FC-171、FC-430、FC-431(以上為Sumitomo 3M公司製造),SURFLON S-112、SURFLON S-113、SURFLON S-131、SURFLON S-141、SURFLON S-145、SURFLON S-382、SURFLON SC-101、SURFLON SC-102、SURFLON SC-103、SURFLON SC-104、SURFLON SC-105、SURFLON SC-106(以上為旭硝子公司製造),EFTOP EF301、EFTOP EF303、EFTOP EF352(以上為Mitsubishi Materials Electronic Chemicals公司製造),FTERGENT FT-100、FTERGENT FT-110、FTERGENT FT-140A、 FTERGENT FT-150、FTERGENT FT-250、FTERGENT FT-251、FTERGENT FTX-251、FTERGENT FTX-218、FTERGENT FT-300、FTERGENT FT-310、FTERGENT FT-400S(以上為Neos公司製造)等。 Further, as a commercially available one of the fluorine-based surfactants, for example, BM-1000, BM-1100 (above, BM HEMIE), MEGAFAC F142D, MEGAFAC F172, MEGAFAC F173, MEGAFAC F183, MEGAFAC F178, MEGAFAC F191, MEGAFAC F471, MEGAFAC F476 (above DIC), FLUORAD FC170C, FC-171, FC-430, FC-431 (above is Sumitomo 3M), SURFLON S-112, SURFLON S-113, SURFLON S -131, SURFLON S-141, SURFLON S-145, SURFLON S-382, SURFLON SC-101, SURFLON SC-102, SURFLON SC-103, SURFLON SC-104, SURFLON SC-105, SURFLON SC-106 (above Manufactured by Asahi Glass Co., Ltd., EFTOP EF301, EFTOP EF303, EFTOP EF352 (above is manufactured by Mitsubishi Materials Electronic Chemicals), FTERGENT FT-100, FTERGENT FT-110, FTERGENT FT-140A, FTERGENT FT-150, FTERGENT FT-250, FTERGENT FT-251, FTERGENT FTX-251, FTERGENT FTX-218, FTERGENT FT-300, FTERGENT FT-310, FTERGENT FT-400S (above manufactured by Neos).

又,作為上述矽酮系界面活性劑,更佳為聚醚改質聚二甲基矽氧烷、聚酯改質聚二甲基矽氧烷,進而較佳為聚醚改質聚二甲基矽氧烷。 Further, as the above-mentioned anthrone-based surfactant, a polyether-modified polydimethylsiloxane or a polyester-modified polydimethyloxane is more preferable, and a polyether-modified polydimethyl group is further preferred. Oxane.

作為上述矽酮系界面活性劑中之市售者,例如可列舉BYK-354、BYK-300、BYK-302、BYK-306、BYK-307、BYK-310、BYK-313、BYK-315、BYK-320、BYK-322、BYK-323、BYK-325、BYK-330、BYK-331、BYK-333、BYK-342、BYK-345、BYK-346、BYK-347、BYK-348、BYK-349、BYK-370、BYK-378、BYK-3455(以上為BYK-Chemie Japan公司製造),SURFLON S-611(AGC SEIMI CHEMICAL公司製造),TORAY SILICONE DC3PA、TORAY SILICONE DC7PA、TORAY SILICONE SH11PA、TORAY SILICONE SH21PA、TORAY SILICONE SH28PA、TORAY SILICONE SH29PA、TORAY SILICONE SH30PA、TORAY SILICONE SH-190、TORAY SILICONE SH-193、TORAY SILICONE SZ-6032、TORAY SILICONE SF-8428、TORAY SILICONE DC-57、TORAY SILICONE DC-190(以上為Dow Corning Toray公司製造),TSF-4440、TSF-4300、TSF-4445、TSF-4446、TSF-4460、TSF-4452(以上為Momentive Performance Materials Japan公司製造)等。 As a commercial one of the above-mentioned anthrone-based surfactants, for example, BYK-354, BYK-300, BYK-302, BYK-306, BYK-307, BYK-310, BYK-313, BYK-315, BYK can be cited. -320, BYK-322, BYK-323, BYK-325, BYK-330, BYK-331, BYK-333, BYK-342, BYK-345, BYK-346, BYK-347, BYK-348, BYK-349 , BYK-370, BYK-378, BYK-3455 (above is BYK-Chemie Japan), SURFLON S-611 (manufactured by AGC SEIMI CHEMICAL), TORAY SILICONE DC3PA, TORAY SILICONE DC7PA, TORAY SILICONE SH11PA, TORAY SILICONE SH21PA , TORAY SILICONE SH28PA, TORAY SILICONE SH29PA, TORAY SILICONE SH30PA, TORAY SILICONE SH-190, TORAY SILICONE SH-193, TORAY SILICONE SZ-6032, TORAY SILICONE SF-8428, TORAY SILICONE DC-57, TORAY SILICONE DC-190 (above) It is manufactured by Dow Corning Toray Co., Ltd., TSF-4440, TSF-4300, TSF-4445, TSF-4446, TSF-4460, TSF-4452 (above, manufactured by Momentive Performance Materials Japan Co., Ltd.) and the like.

又,作為上述界面活性劑,例如亦可使用聚氧乙烯月桂醚、聚氧乙烯硬脂醚、聚氧乙烯油醚等聚氧乙烯烷基醚類,或聚氧乙烯正 辛基苯醚、聚氧乙烯正壬基苯醚等聚氧乙烯芳基醚類,或聚氧乙烯二月桂酸酯、聚氧乙烯二硬脂酸酯等聚氧乙烯二烷基酯類等。 Further, as the surfactant, for example, polyoxyethylene alkyl ether such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether or polyoxyethylene oleyl ether, or polyoxyethylene can be used. A polyoxyethylene aryl ether such as octyl phenyl ether or polyoxyethylene n-decyl phenyl ether; or a polyoxyethylene dialkyl ester such as polyoxyethylene dilaurate or polyoxyethylene distearate.

上述界面活性劑可單獨使用,亦可組合2種以上使用。 These surfactants may be used singly or in combination of two or more.

上述界面活性劑之含量相對於上述多官能陽離子聚合性低聚物與上述陽離子聚合性聚合物之合計100重量份,較佳之下限為0.01重量份,較佳之上限為5重量份。若上述界面活性劑之含量未達0.01重量份,則有無法充分發揮提昇塗佈後之平坦性之效果之情況。若上述界面活性劑之含量超過5重量份,則有塗佈後之平坦性反而受損,或本發明之有機EL顯示元件密封用硬化性樹脂組成物與被接著體之接著性降低之情況。關於上述界面活性劑之含量,若為氟系界面活性劑,則更佳之下限為0.02重量份,更佳之上限為1重量份。又,若為矽酮系界面活性劑,則更佳之下限為0.1重量份,更佳之上限為2重量份。 The content of the surfactant is preferably 0.01 parts by weight, and preferably the upper limit is 5 parts by weight, based on 100 parts by weight of the total of the polyfunctional cationically polymerizable oligomer and the cationically polymerizable polymer. When the content of the surfactant is less than 0.01 part by weight, the effect of improving the flatness after coating may not be sufficiently exhibited. When the content of the surfactant is more than 5 parts by weight, the flatness after coating may be impaired, or the adhesion between the curable resin composition for sealing an organic EL display element of the present invention and the adherend may be lowered. The content of the surfactant is preferably 0.02 parts by weight, more preferably 1 part by weight, based on the fluorine-based surfactant. Further, in the case of an anthrone-based surfactant, a lower limit is preferably 0.1 part by weight, and a more preferred upper limit is 2 parts by weight.

本發明之有機EL顯示元件密封用硬化性樹脂組成物亦可於不損害本發明之目的之範圍內含有填充劑。 The curable resin composition for sealing an organic EL display element of the present invention may contain a filler insofar as the object of the present invention is not impaired.

作為上述填充劑,例如可列舉滑石、石棉、二氧化矽(silica)、矽藻土、膨潤石(smectite)、膨潤土(bentonite)、碳酸鈣、碳酸鎂、氧化鋁、蒙脫石、氧化鎂、氧化鈦、氫氧化鎂、氫氧化鋁、玻璃珠、硫酸鋇、石膏、矽酸鈣、絹雲母、活性白土等無機填充劑,或聚酯微粒子、聚胺酯(polyurethane)微粒子、乙烯聚合物微粒子、丙烯酸聚合物微粒子等有機填充劑等。 Examples of the filler include talc, asbestos, silica, diatomaceous earth, smectite, bentonite, calcium carbonate, magnesium carbonate, aluminum oxide, montmorillonite, and magnesium oxide. Inorganic fillers such as titanium oxide, magnesium hydroxide, aluminum hydroxide, glass beads, barium sulfate, gypsum, calcium silicate, sericite, activated clay, or polyester microparticles, polyurethane microparticles, ethylene polymer microparticles, acrylic acid An organic filler such as polymer microparticles.

本發明之有機EL顯示元件密封用硬化性樹脂組成物亦可於不損害本發明之目的之範圍內,為了提昇元件電極之耐久性而含有與有 機EL顯示元件用硬化性樹脂組成物中所產生之酸會進行反應之化合物或離子交換樹脂。 The curable resin composition for sealing an organic EL display element of the present invention may be contained in order to improve the durability of the element electrode without impairing the object of the present invention. A compound or ion exchange resin in which an acid generated in a curable resin composition for a device EL is reacted.

作為上述與產生之酸會進行反應之化合物,可列舉與酸中和之物質,例如可列舉鹼金屬之碳酸鹽或碳酸氫鹽、或鹼土金屬之碳酸鹽或碳酸氫鹽等。具體而言,例如可使用碳酸鈣、碳酸氫鈣、碳酸鈉、碳酸氫鈉等。 Examples of the compound which reacts with the generated acid include a substance neutralized with an acid, and examples thereof include an alkali metal carbonate or hydrogencarbonate, or an alkaline earth metal carbonate or hydrogencarbonate. Specifically, for example, calcium carbonate, calcium hydrogencarbonate, sodium carbonate, sodium hydrogencarbonate or the like can be used.

本發明之有機EL顯示元件密封用硬化性樹脂組成物較佳為含有硬化延遲劑。上述硬化延遲劑具有提昇保存穩定性之作用、或控制可使用時間及硬化時間之作用。 The curable resin composition for sealing an organic EL display element of the present invention preferably contains a hardening retarder. The above hardening retarder has an effect of improving storage stability or controlling the usable time and hardening time.

作為上述硬化延遲劑,可使用胺化合物、具有醚鍵之化合物等。 As the hardening retarder, an amine compound, a compound having an ether bond, or the like can be used.

作為上述胺化合物,例如可列舉苄基胺、甲基胺、乙基胺、正丁基胺、異丁基胺等一級胺化合物,二乙基胺、二苯基胺等二級胺化合物,三乙基胺、三異丙醇胺等三級胺化合物等。 Examples of the amine compound include a primary amine compound such as benzylamine, methylamine, ethylamine, n-butylamine or isobutylamine; a secondary amine compound such as diethylamine or diphenylamine; A tertiary amine compound such as ethylamine or triisopropanolamine.

作為上述具有醚鍵之化合物,例如可列舉聚乙二醇、聚丙二醇、聚四甲基二醇等鏈狀聚醚,或12-冠4-醚(12-crown 4-ether)、15-冠5-醚、18-冠6-醚、24-冠8-醚、二環己酮-18-冠6-醚、二苯并-18-冠6-醚、2-(羥基甲基)-18-冠6-醚、2-(烯丙氧基甲基)-18-冠6-醚、苯并-18-冠6-醚、4'-乙醯基苯并-18-冠6-醚、N,N'-二苄基-4,13-二氮雜-18-冠6-醚等環狀聚醚。 Examples of the compound having an ether bond include a chain polyether such as polyethylene glycol, polypropylene glycol or polytetramethyl glycol, or a 12-crown 4-ether and a 15-crown. 5-Ether, 18-crown 6-ether, 24-crown 8-ether, dicyclohexanone-18-crown 6-ether, dibenzo-18-crown 6-ether, 2-(hydroxymethyl)-18 - crown 6-ether, 2-(allyloxymethyl)-18-crown 6-ether, benzo-18-crown 6-ether, 4'-acetamidobenzo-18-crown 6-ether, A cyclic polyether such as N,N'-dibenzyl-4,13-diaza-18-crown-6-ether.

其中,較佳為苄基胺。 Among them, a benzylamine is preferred.

上述硬化延遲劑之含量相對於上述多官能陽離子聚合性低聚物與上述陽離子聚合性聚合物之合計100重量份,較佳之下限為0.1重量份,較佳之上限為5重量份。若上述硬化延遲劑之含量未達0.1重量 份,則有無法充分地對所獲得之有機EL顯示元件用密封用硬化性樹脂組成物賦予延遲效果之情況。若上述硬化延遲劑之含量超過5重量份,則有於使所獲得之有機EL顯示元件用密封用硬化性樹脂組成物硬化時產生大量釋氣之情況。上述硬化延遲劑之含量之更佳之下限為0.5重量份,更佳之上限為3重量份。 The content of the hardening retarder is preferably 0.1 parts by weight, and preferably the upper limit is 5 parts by weight, based on 100 parts by weight of the total of the polyfunctional cationically polymerizable oligomer and the cationically polymerizable polymer. If the content of the hardening retarder is less than 0.1 weight In some cases, there is a case where the retardation effect of the curable resin composition for sealing of the organic EL display element obtained is not sufficiently provided. When the content of the hardening retarder is more than 5 parts by weight, a large amount of outgassing may occur when the obtained curable resin composition for sealing an organic EL display element is cured. A more preferred lower limit of the content of the above hardening retarder is 0.5 part by weight, and a more preferred upper limit is 3 parts by weight.

作為上述離子交換樹脂,可使用陽離子交換型、陰離子交換型、兩離子交換型中之任一者,尤佳為可吸附氯離子之陽離子交換型或兩離子交換型。 As the ion exchange resin, any of a cation exchange type, an anion exchange type, and a two ion exchange type can be used, and a cation exchange type or a two ion exchange type which can adsorb chloride ions is particularly preferable.

又,本發明之有機EL顯示元件密封用硬化性樹脂組成物視需要亦可於不損害本發明之目的之範圍內含有保存穩定劑、塑化劑、黏彈性調整劑等公知之各種添加劑。 In addition, the curable resin composition for sealing an organic EL display element of the present invention may contain various known additives such as a storage stabilizer, a plasticizer, and a viscoelasticity adjusting agent, as needed, without impairing the object of the present invention.

作為製造本發明之有機EL顯示元件密封用硬化性樹脂組成物之方法,例如可列舉使用勻相分散機、均質混合機、萬能混合機、行星混合機、捏合機、三輥研磨機等混合機,將多官能陽離子聚合性低聚物、陽離子聚合性聚合物、硬化劑、及視需要而添加之添加劑加以混合之方法等。 As a method of producing the curable resin composition for sealing an organic EL display element of the present invention, for example, a mixer such as a homogeneous phase disperser, a homomixer, a universal mixer, a planetary mixer, a kneader, or a three-roll mill can be used. A method of mixing a polyfunctional cationically polymerizable oligomer, a cationically polymerizable polymer, a curing agent, and an additive to be added as needed.

本發明之有機EL顯示元件密封用硬化性樹脂組成物之於100℃之熔融黏度之較佳之下限為1000Pa.s,較佳之上限為5萬Pa.s。若於100℃之熔融黏度未達1000Pa.s,則有如下情況:於輥貼合時等流動性變大,使硬化性樹脂自貼合之端部溢出而污損輥或有機EL顯示元件,或使塗佈時之厚度變得不均勻。若於100℃之熔融黏度超過5萬Pa.s,則有如下情況:於輥貼合時等對具有有機發光材料層之積層體之凹凸之追隨 性降低,變得容易產生氣泡之夾帶,或使接著力降低。又,有如下情況:為了輔助對具有有機發光材料層之積層體之凹凸之追隨性,必須進行提高輥貼合之壓力等操作,而損傷所獲得之有機EL顯示元件。上述於100℃之熔融黏度之更佳之下限為1500Pa.s,更佳之上限為21100Pa.s。 The preferred lower limit of the melt viscosity of the curable resin composition for sealing an organic EL display element of the present invention at 100 ° C is 1000 Pa. s, the upper limit is preferably 50,000 Pa. s. If the melt viscosity at 100 ° C is less than 1000Pa. s, when the roll is bonded, the fluidity becomes large, and the curable resin overflows from the end portion of the bonding to stain the roll or the organic EL display element, or the thickness at the time of coating becomes uneven. . If the melt viscosity at 100 ° C exceeds 50,000 Pa. s, there is a case where the follow-up of the laminated body having the organic light-emitting material layer is followed by the roll bonding The property is lowered, and it becomes easy to cause entrainment of bubbles or to lower the adhesion force. In addition, in order to assist the followability of the unevenness of the laminated body having the organic light-emitting material layer, it is necessary to perform an operation such as increasing the pressure of the roll bonding to damage the obtained organic EL display element. The lower limit of the above melt viscosity at 100 ° C is 1500 Pa. s, the upper limit is better than 21100Pa. s.

再者,上述於100℃之熔融黏度係作為使用流變儀,於頻率1Hz、升溫速度5℃/分鐘之條件下,一面加熱一面測定黏度時之於100℃之黏度而求出。 Further, the above-mentioned melt viscosity at 100 ° C was determined by using a rheometer at a frequency of 1 Hz and a temperature increase rate of 5 ° C/min, and the viscosity at 100 ° C when the viscosity was measured while heating.

本發明之有機EL顯示元件密封用硬化性樹脂組成物較佳為將厚度20μm之硬化物於120℃放置15分鐘時之μg/cm2單位之釋氣量為200ppm以下。若上述釋氣量超過200ppm,則有所獲得之有機EL顯示元件受到因釋氣而導致之惡劣影響之情況。上述釋氣量之更佳之上限為100ppm。 The curable resin composition for sealing an organic EL display element of the present invention preferably has a gas release amount of μg/cm 2 unit of 200 ppm or less when the cured product having a thickness of 20 μm is allowed to stand at 120 ° C for 15 minutes. When the amount of outgas is more than 200 ppm, the obtained organic EL display element is adversely affected by outgassing. The upper limit of the above gas release amount is preferably 100 ppm.

再者,上述μg/cm2單位之釋氣量可藉由使用雙擊式熱解器(Double-Shot Pyrolyzer)及玻璃層析/質譜儀(GC-MS)之動態空間法(dynamic space method),以甲苯作為標準物質進行定量而測定。又,測定上述釋氣量之硬化物可藉由將有機EL顯示元件密封用硬化性樹脂組成物於烘箱中以80℃乾燥15分鐘而獲得。 Furthermore, the outgas volume of the above μg/cm 2 unit can be obtained by using a double-click pyrolyzer and a glass space chromatography/mass spectrometer (GC-MS) dynamic space method. Toluene was measured as a standard substance and quantified. Further, the cured product having the above-described outgassing amount can be obtained by drying the curable resin composition for sealing an organic EL display element in an oven at 80 ° C for 15 minutes.

本發明之有機EL顯示元件密封用硬化性樹脂組成物較佳為於製成厚度為20μm之硬化物時,波長400~800nm之可見光穿透率為95%以上。若上述可見光穿透率未達95%,則有透明性較差,變得無法應用於頂部發光型有機EL顯示元件之情況。上述可見光穿透率之更佳之下限為97%。再者,上述可見光穿透率可使用分光光度計測定。又,測定上 述可見光穿透率之硬化物可藉由使將有機EL顯示元件密封用硬化性樹脂組成物於烘箱中以80℃乾燥15分鐘而獲得之片材進行輥式層疊而轉印於無鹼玻璃基板後,於烘箱中以100℃加熱1小時進行硬化而獲得。 The curable resin composition for sealing an organic EL display device of the present invention preferably has a visible light transmittance of 95% or more at a wavelength of 400 to 800 nm when a cured product having a thickness of 20 μm is formed. When the visible light transmittance is less than 95%, the transparency is inferior and it cannot be applied to the top emission type organic EL display element. A lower limit of the above-mentioned better visible light transmittance is 97%. Furthermore, the above visible light transmittance can be measured using a spectrophotometer. Again, on the measurement The cured product of the visible light transmittance can be transferred to an alkali-free glass substrate by roll laminating the sheet obtained by drying the curable resin composition for sealing an organic EL display element in an oven at 80 ° C for 15 minutes. Thereafter, it was obtained by heating in an oven at 100 ° C for 1 hour for hardening.

將本發明之有機EL顯示元件密封用硬化性樹脂組成物成形為片狀而得之有機EL顯示元件密封用硬化性樹脂片亦屬於本發明之一。 The curable resin sheet for sealing an organic EL display element obtained by molding the curable resin composition for sealing an organic EL display element of the present invention into a sheet form is also one of the present inventions.

作為將本發明之有機EL顯示元件密封用硬化性樹脂組成物成形為片狀之方法,就可於相對低溫下形成均勻膜厚之片材而言,較佳為溶液塗佈法。具體而言,例如可較佳地使用如下方法:藉由將含有本發明之有機EL顯示元件密封用硬化性樹脂組成物與溶劑之溶液以特定之厚度塗佈於實施過脫模處理之PET(聚對苯二甲酸乙二酯)等之膜(以下,亦稱為「脫模膜」)上並乾燥溶劑而獲得膜。 The method of forming the curable resin composition for sealing an organic EL display element of the present invention into a sheet shape is preferably a solution coating method in which a sheet having a uniform film thickness can be formed at a relatively low temperature. Specifically, for example, a method in which a solution containing a curable resin composition for sealing an organic EL display element of the present invention and a solvent is applied to a PET subjected to release treatment at a specific thickness is used. A film such as polyethylene terephthalate or the like (hereinafter also referred to as "release film") is dried to obtain a film.

作為將含有本發明之有機EL顯示元件密封用硬化性樹脂組成物與溶劑之溶液塗佈於脫模膜上之方法,例如可使用輥式塗佈、狹縫式塗佈、缺角輪塗佈、凹版塗佈、接觸塗佈、模具塗佈、模唇塗佈、刮刀塗佈、棒式塗佈法等公知之方法。 As a method of applying a solution containing the curable resin composition for sealing an organic EL display element of the present invention and a solvent to a release film, for example, roll coating, slit coating, and corner wheel coating can be used. A known method such as gravure coating, contact coating, die coating, lip coating, blade coating, and bar coating.

作為上述溶劑,例如可列舉甲基乙基酮、甲基異丁基酮、甲苯、乙酸乙酯等公知之溶劑。其中,較佳為甲基乙基酮、甲苯。 The solvent is, for example, a known solvent such as methyl ethyl ketone, methyl isobutyl ketone, toluene or ethyl acetate. Among them, methyl ethyl ketone and toluene are preferred.

使用本發明之有機EL顯示元件密封用硬化性樹脂組成物及/或本發明之有機EL顯示元件密封用硬化性樹脂片而製造之有機EL顯示元件亦屬於本發明之一。 The organic EL display element produced by using the curable resin composition for sealing an organic EL display element of the present invention and/or the curable resin sheet for sealing an organic EL display element of the present invention is also one of the present inventions.

作為製造本發明之有機EL顯示元件之方法,例如可列舉如下方法 等:將於脫模膜上形成之本發明之有機EL顯示元件密封用硬化性樹脂片藉由輥貼合而熱層疊於形成有具有有機發光材料層之積層體之基板上,剝離脫模膜後,將極薄玻璃或具有阻氣性之塑膠片介隔本發明之有機EL顯示元件密封用硬化性樹脂片而積層於具有有機發光材料層之積層體上而密封有機EL顯示元件;或將於脫模膜上形成之本發明之有機EL顯示元件密封用硬化性樹脂片藉由輥貼合而熱層疊於玻璃或具有阻氣性之塑膠片上,剝離脫模膜後,進而介隔本發明之有機EL顯示元件密封用硬化性樹脂片而積層於形成有具有有機發光材料層之積層體的基板而密封有機EL顯示元件。 As a method of producing the organic EL display element of the present invention, for example, the following method can be mentioned The curable resin sheet for sealing an organic EL display element of the present invention which is formed on a release film is thermally laminated on a substrate on which a laminate having an organic light-emitting material layer is formed by roll bonding, and the release film is peeled off. After that, the ultra-thin glass or the gas-repellent plastic sheet is laminated on the laminate having the organic light-emitting material layer to seal the organic EL display element by interposing the curable resin sheet for sealing the organic EL display element of the present invention; or The curable resin sheet for sealing an organic EL display element of the present invention formed on a release film is thermally laminated on a glass or a gas-barrier plastic sheet by roll bonding, and after peeling off the release film, the present invention is further interposed. The organic EL display element sealing curable resin sheet is laminated on a substrate on which a laminate having an organic light-emitting material layer is formed to seal the organic EL display element.

就防止有機EL顯示元件之損傷或劣化之觀點而言,本發明之有機EL顯示元件之製造較佳為於50~100℃左右之溫度範圍內進行。因此,本發明之有機EL顯示元件密封用硬化性樹脂片必須於該溫度區域顯現流動性,本發明之有機EL顯示元件密封用硬化性樹脂組成物之熔融黏度較佳為上述範圍。 The organic EL display element of the present invention is preferably produced in a temperature range of about 50 to 100 ° C from the viewpoint of preventing damage or deterioration of the organic EL display element. Therefore, the curable resin sheet for sealing an organic EL display element of the present invention must exhibit fluidity in the temperature region, and the melt viscosity of the curable resin composition for sealing an organic EL display element of the present invention is preferably in the above range.

本發明之有機EL顯示元件密封用硬化性樹脂組成物及本發明之有機EL顯示元件用硬化性樹脂片與不具有反應性之片狀黏著劑或片狀之熱塑性樹脂等習知之密封材料相比,成為耐熱性或阻隔性優異者。 The curable resin composition for sealing an organic EL display element of the present invention and the curable resin sheet for an organic EL display element of the present invention are compared with a conventional sealing material such as a sheet-like adhesive or a sheet-shaped thermoplastic resin which does not have reactivity. It is excellent in heat resistance or barrier properties.

又,本發明之有機EL顯示元件密封用硬化性樹脂片由於無著色且透明性優異,故而可應用於發光之提取效率優異之頂部發光型有機EL顯示元件,除此以外,由於耐彎曲性優異,故而於用在可撓性顯示器之情形時,可獲得難以產生因彎曲而導致之密封層之龜裂且因彎曲而導致之劣化較小之可靠性優異之有機EL顯示元件。 In addition, since the curable resin sheet for sealing an organic EL display element of the present invention is excellent in transparency and is excellent in transparency, it can be applied to a top emission type organic EL display element having excellent light extraction efficiency, and excellent in bending resistance. Therefore, when it is used in a flexible display, an organic EL display element which is less likely to cause cracking of the sealing layer due to bending and which is less deteriorated by bending can be obtained.

進而,本發明之有機EL顯示元件係使用本發明之有機EL顯示元件密封用硬化性樹脂組成物及/或有機EL顯示元件用硬化性樹脂片,將形成有具有有機發光材料層之積層體之玻璃或膜、與對向之玻璃或膜之間隙進行密封,藉此可抑制水分之滲入,抑制暗點之產生或因該暗點之成長而導致之顯示劣化,成為壽命或可靠性優異者。 Further, in the organic EL display device of the present invention, the curable resin composition for sealing an organic EL display device of the present invention and/or the curable resin sheet for an organic EL display device are used, and a laminate having an organic light-emitting material layer is formed. By sealing the gap between the glass or the film and the opposing glass or film, it is possible to suppress the penetration of moisture, suppress the occurrence of dark spots, or deteriorate the display due to the growth of the dark spots, and it is excellent in life or reliability.

藉由本發明,可提供一種有機電致發光顯示元件密封用硬化性樹脂組成物,其可防止因加熱或彎曲等而導致之龜裂之產生,可獲得接著性、透明性、阻隔性優異之樹脂片。又,藉由本發明,可提供一種使用該有機電致發光顯示元件密封用硬化性樹脂組成物而成之有機電致發光顯示元件密封用硬化性樹脂片及有機電致發光顯示元件。 According to the present invention, it is possible to provide a curable resin composition for sealing an organic electroluminescence display element, which can prevent generation of cracks due to heating or bending, and can obtain a resin excellent in adhesion, transparency, and barrier properties. sheet. Moreover, according to the present invention, the curable resin sheet for organic electroluminescence display element sealing and the organic electroluminescence display element which are obtained by using the curable resin composition for sealing an organic electroluminescence display element can be provided.

以下,列舉實施例對本發明進行更詳細之說明,但本發明並不僅限定於該等實施例。 Hereinafter, the present invention will be described in more detail by way of examples, but the invention is not limited to the examples.

(實施例1) (Example 1)

將作為陽離子聚合性聚合物之甲基丙烯酸甲酯-甲基丙烯酸環氧丙酯共聚物(日油公司製造、「MARPROOF G-2050M」、重量平均分子量22萬、陽離子聚合性基當量340g/mol)溶解於甲基乙基酮中,製備含有陽離子聚合性聚合物35重量%之甲基乙基酮溶液。於作為多官能陽離子聚合性低聚 物之雙酚A型環氧低聚物(DIC公司製造、「EPICLON 840-S」、分子量340、陽離子聚合性基當量175g/mol)100重量份、作為熱陽離子聚合起始劑之芳香族鋶鹽(三新化學工業公司製造、「San-Aid SI-60」)6重量份、及作為矽烷偶合劑之3-環氧丙氧基丙基三甲氧基矽烷(信越化學工業公司製造、「KBM-403」)2重量份中以使陽離子聚合性聚合物成為100重量份之方式添加製備成之含有陽離子聚合性聚合物35重量%之甲基乙基酮溶液。以使整體之甲基乙基酮之摻合量成為300重量份之方式進一步添加甲基乙基酮,藉由自轉公轉型攪拌混合機(THINKY公司製造、「THINKY MIXER ARE-310型」),以攪拌速度2000rpm攪拌2分鐘加以混合,而獲得均勻之有機EL顯示元件密封用硬化性樹脂組成物溶液。 Methyl methacrylate-glycidyl methacrylate copolymer as a cationically polymerizable polymer ("MARPROOF G-2050M", manufactured by Nippon Oil Co., Ltd., weight average molecular weight: 220,000, cationically polymerizable group equivalent: 340 g/mol The solution was dissolved in methyl ethyl ketone to prepare a methyl ethyl ketone solution containing 35 wt% of a cationically polymerizable polymer. Polymeric oligomerization as a multifunctional cationic 100 parts by weight of a bisphenol A type epoxy oligomer (manufactured by DIC Corporation, "EPICLON 840-S", molecular weight 340, cationically polymerizable group equivalent: 175 g/mol), and an aromatic hydrazine as a thermal cationic polymerization initiator 6 parts by weight of salt ("San-Aid SI-60" manufactured by Sanshin Chemical Industry Co., Ltd.) and 3-glycidoxypropyltrimethoxydecane as a decane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., "KBM" -40") A methyl ethyl ketone solution containing 35% by weight of a cationically polymerizable polymer prepared by adding a cationically polymerizable polymer to 100 parts by weight of 2 parts by weight. Methyl ethyl ketone was further added in such a manner that the blending amount of the entire methyl ethyl ketone was 300 parts by weight, and the blending mixer ("THINKY MIXER ARE-310" manufactured by THINKY Co., Ltd.) was used. The mixture was stirred at a stirring speed of 2000 rpm for 2 minutes, and mixed to obtain a uniform curable resin composition solution for sealing an organic EL display element.

繼而,使用敷料器將所獲得之有機EL顯示元件密封用硬化性樹脂組成物溶液以乾燥後之厚度成為特定厚度之方式塗佈於實施過脫模處理之PET膜上,於烘箱中以80℃乾燥15分鐘而獲得積層於PET膜上之有機EL顯示元件密封用硬化性樹脂片(厚度20μm及100μm)。 Then, the solution of the curable resin composition for sealing the obtained organic EL display element obtained was applied to the PET film subjected to the release treatment in a thickness of 80 ° C in an oven by using an applicator. After drying for 15 minutes, a curable resin sheet for organic EL display element sealing (thickness: 20 μm and 100 μm) laminated on a PET film was obtained.

(實施例2~11、比較例1~5) (Examples 2 to 11 and Comparative Examples 1 to 5)

將使用之材料及摻合量設為表1~3所示之情況。除此以外,與實施例1同樣地製作有機EL顯示元件用硬化性樹脂組成物。 The materials to be used and the blending amount are as shown in Tables 1 to 3. A curable resin composition for an organic EL display device was produced in the same manner as in Example 1 except the above.

<評價> <evaluation>

對實施例及比較例中獲得之各有機EL顯示元件用硬化性樹脂組成物及各有機EL顯示元件密封用硬化性樹脂片進行以下評價。將結果示於表1~3。 The curable resin composition for each of the organic EL display elements obtained in the examples and the comparative examples and the curable resin sheet for sealing the organic EL display element were evaluated as follows. The results are shown in Tables 1 to 3.

(1)熔融黏度 (1) Melt viscosity

積層16層實施例及比較例中獲得之各有機EL顯示元件密封用硬化性樹脂片(厚度20μm),製作厚度約300μm之試驗片。積層係藉由如下方式進行:將脫模膜上之熱硬化性樹脂片2片以使熱硬化性樹脂片之面彼此重合且不產生氣泡之方式進行輥式層疊,製作兩側被脫模膜夾著之熱硬化性片材之2層積層體,進而將其切斷為2分之1之大小後,剝下單面之脫模膜,再次將熱硬化性樹脂片面彼此重合而進行輥式層疊,按此順序重複4次。 Each of the 16 layers of the curable resin sheet for sealing an organic EL display element (thickness: 20 μm) obtained in the examples and the comparative examples was laminated to prepare a test piece having a thickness of about 300 μm. The laminate is formed by laminating two sheets of the thermosetting resin sheet on the release film so that the surfaces of the thermosetting resin sheet overlap each other without generating bubbles, thereby producing a release film on both sides. After the two-layer laminated body of the thermosetting sheet is sandwiched and cut into a size of one-half, the release film of one side is peeled off, and the thermosetting resin sheet surfaces are again superposed on each other to perform roll type. Stack, repeat 4 times in this order.

自該試驗片沖裁直徑8mm之圓形之樣品,使用流變儀(Reologica公司製造、DAR-100黏彈性測定裝置),於頻率1Hz、升溫速度5℃/分鐘之條件下一面自25℃加熱至150℃一面進行黏度測定,而求出於100℃之熔融黏度。 A circular sample having a diameter of 8 mm was punched out from the test piece, and a rheometer (manufactured by Reologica Co., Ltd., DAR-100 viscoelasticity measuring device) was used to heat from 25 ° C at a frequency of 1 Hz and a temperature increase rate of 5 ° C / min. The viscosity was measured at 150 ° C, and the melt viscosity at 100 ° C was determined.

(2)釋氣量 (2) Air release

秤量實施例及比較例中獲得之各有機EL顯示元件密封用硬化性樹脂片(厚度20μm)約50mg置於試驗容器中,藉由使用雙擊式熱解器及玻璃層析/質譜儀(GC-MS)之動態空間法,測定於120℃加熱15分鐘時產生之釋氣量。產生之釋氣量係以甲苯為標準物質而定量。 Approximately 50 mg of each of the organic EL display element sealing curable resin sheets (thickness 20 μm) obtained in the examples and the comparative examples was placed in a test container by using a double-click pyrolyzer and a glass chromatography/mass spectrometer (GC- The dynamic space method of MS) measures the amount of outgas generated when heated at 120 ° C for 15 minutes. The amount of gas released is quantified using toluene as a standard substance.

(3)接著性 (3) Adhesiveness

使用輥式貼合機將實施例及比較例中獲得之各有機EL顯示元件密封用硬化性樹脂片(厚度20μm)積層於厚度1mm之玻璃基板上。繼而,將縱3mm×橫3mm×厚度0.7mm之玻璃晶片載於積層在玻璃基板上之有機EL顯示元件密封用硬化性樹脂片上,使用簡易熱壓接機(OSAKI ENGINEERING公司製造、「CT-300」),於壓力0.2MPa、溫度90℃之條件 下壓接10秒鐘後,於烘箱中以100℃加熱1小時而硬化,獲得試驗片。使用萬能型黏結強度試驗機(Nordson Advanced Technology公司製造、「Series4000」)對所獲得之試驗片測定晶片剪切接著力。將晶片剪切接著力為150N以上之情形設為「○」,將接著力未達150N且100N以上之情形設為「△」,將接著力未達100N之情形設為「×」而對接著性進行評價。 Each of the organic EL display element sealing curable resin sheets (thickness: 20 μm) obtained in the examples and the comparative examples was laminated on a glass substrate having a thickness of 1 mm using a roll bonding machine. Then, a glass wafer having a length of 3 mm, a width of 3 mm, and a thickness of 0.7 mm was placed on a curable resin sheet for sealing an organic EL display element laminated on a glass substrate, and a simple thermocompression bonding machine (manufactured by OSAKI ENGINEERING, "CT-300" was used. "), at a pressure of 0.2 MPa and a temperature of 90 ° C After pressing for 10 seconds, it was hardened by heating at 100 ° C for 1 hour in an oven to obtain a test piece. The obtained test piece was measured for wafer shear adhesion using a universal bond strength tester (manufactured by Nordson Advanced Technology, "Series 4000"). The case where the wafer shearing force is 150 N or more is set to "○", the case where the bonding force is less than 150 N and 100 N or more is set to "△", and the case where the bonding force is less than 100 N is set to "X", and then Sexual evaluation.

(4)阻隔性 (4) Barrier

將實施例及比較例中獲得之各有機EL顯示元件密封用硬化性樹脂片(厚度100μm)於烘箱中以100℃加熱1小時使其硬化,獲得試驗片。對所獲得之試驗片進行根據JIS Z 0208之透濕度測定。 Each of the organic EL display element sealing curable resin sheets (thickness: 100 μm) obtained in the examples and the comparative examples was heated in an oven at 100 ° C for 1 hour to be cured to obtain a test piece. The obtained test piece was subjected to moisture permeability measurement according to JIS Z 0208.

具體而言,將試驗片設置於60mm護罩,使用恆溫恆濕槽(塔巴依愛斯佩克公司製造、「PL-2KP」),於試驗溫度60℃、試驗濕度90%RH之條件下測定3次每隔24小時之重量變化量並求出平均值。 Specifically, the test piece is set at 60 mm. The shroud was measured for weight change every three hours at a test temperature of 60 ° C and a test humidity of 90% RH using a constant temperature and humidity chamber ("PL-2KP" manufactured by Tabay ESPEC). Amount and find the average.

將透濕度未達50g/m2之情形設為「○」,將50g/m2以上且未達80g/m2之情形設為「△」,將80g/m2以上之情形設為「×」而對硬化物之阻隔性(防透濕性)進行評價。 The case where the moisture permeability is less than 50 g/m 2 is "○", the case of 50 g/m 2 or more and less than 80 g/m 2 is "△", and the case of 80 g/m 2 or more is "X". The barrier property (water permeability resistance) of the cured product was evaluated.

再者,上述透濕度通常係如JIS Z 0208般利用透濕護罩進行測定,但亦可使用AMERICA MOCON公司製造之PERMATRAN W3/33等水蒸氣透過率測定裝置進行測定。 In addition, the moisture permeability is usually measured by a moisture permeable cover as in JIS Z 0208, but it can also be measured using a water vapor transmission rate measuring device such as PERMATRAN W3/33 manufactured by AMERICA MOCON.

(5)可見光穿透率及霧度 (5) Visible light transmittance and haze

將實施例及比較例中獲得之各有機EL顯示元件密封用硬化性樹脂片(厚度20μm)進行輥式層疊而轉印於寬度25mm、長度50mm、厚度0.7mm之無鹼玻璃基板後,於烘箱中以100℃加熱1小時使其硬化,獲得試驗 片。對於該試驗片,以轉印有機EL顯示元件密封用硬化性樹脂片前之玻璃基板為參考,利用分光光度計測定於400~800nm之波長之可見光穿透率。又,使用霧度計對測定過可見光穿透率之上述試驗片進行霧度(霧值)之測定。 Each of the organic EL display element sealing curable resin sheets (thickness: 20 μm) obtained in the examples and the comparative examples was roll-laminated and transferred to an alkali-free glass substrate having a width of 25 mm, a length of 50 mm, and a thickness of 0.7 mm, and then placed in an oven. Heated at 100 ° C for 1 hour to harden it and obtain a test. sheet. In the test piece, the visible light transmittance at a wavelength of 400 to 800 nm was measured by a spectrophotometer with reference to the glass substrate before the transfer of the curable resin sheet for organic EL display element sealing. Further, the test piece in which the visible light transmittance was measured was measured for haze (haze value) using a haze meter.

(6)有機EL顯示元件之發光狀態 (6) Light-emitting state of the organic EL display element

將藉由濺鍍使厚度1000Å之ITO透明電極成膜而成之無鹼玻璃基板作為透明支撐基板,並藉由真空蒸鍍,使N,N'-二(1-萘基)-N,N'-二苯基聯苯胺(α-NPD)以蒸鍍速度15Å/s沈積於基板,使膜厚600Å之電洞傳輸層成膜。繼而,使三(8-羥基喹啉)鋁(Alq3)以15Å/s之蒸鍍速度沈積為膜厚600Å,形成發光層。其後,將該基板移至另一真空蒸鍍裝置,將氟化鋰以0.2Å/s之蒸鍍速度成膜5Å後,將鋁以20Å/s之速度成膜1000Å,而獲得具有有機發光材料層之積層體。 An alkali-free glass substrate formed by depositing a 1000 Å thick ITO transparent electrode by sputtering is used as a transparent supporting substrate, and N,N'-bis(1-naphthyl)-N,N is vacuum-deposited. '-Diphenylbenzidine (α-NPD) was deposited on the substrate at a deposition rate of 15 Å/s to form a film transport layer having a thickness of 600 Å. Then, tris(8-hydroxyquinoline)aluminum (Alq 3 ) was deposited at a deposition rate of 15 Å/s to a film thickness of 600 Å to form a light-emitting layer. Thereafter, the substrate was transferred to another vacuum evaporation apparatus, and lithium fluoride was formed into a film of 5 Å at a vapor deposition rate of 0.2 Å/s, and then aluminum was formed into a film of 1000 Å at a rate of 20 Å/s to obtain organic light emission. A layer of material layers.

將實施例及比較例中獲得之各有機EL顯示元件密封用硬化性樹脂片於80℃進行輥式層疊而轉印於形成有該積層體之基板上。進而,於轉印後之有機EL顯示元件密封用硬化性樹脂片上重疊玻璃基板,使用真空貼合機,於80℃進行加熱壓接。其後,於各烘箱中加熱100℃×1小時,使有機EL顯示元件密封用硬化性樹脂片硬化,獲得有機EL顯示元件。 Each of the organic EL display element sealing curable resin sheets obtained in the examples and the comparative examples was roll-laminated at 80 ° C and transferred onto a substrate on which the layered body was formed. Furthermore, the glass substrate was superimposed on the curable resin sheet for sealing the organic EL display element after the transfer, and the pressure bonding was performed at 80 ° C using a vacuum laminator. Thereafter, the organic EL display element sealing curable resin sheet was cured by heating in an oven at 100 ° C for 1 hour to obtain an organic EL display element.

將所獲得之有機EL顯示元件於溫度60℃、濕度90%之條件下暴露100小時後,施加10V之電壓,以目視觀察元件之發光狀態(發光及暗點之有無)。將無暗點、均勻地發光之情形設為「○」,將發光、但存在暗點之情形設為「△」,將完全不發光之情形設為「×」而進行評價。 The obtained organic EL display device was exposed to a temperature of 60 ° C and a humidity of 90% for 100 hours, and then a voltage of 10 V was applied to visually observe the light-emitting state of the device (the presence or absence of light emission and dark spots). The case where the dark spot is not emitted and the light is uniformly emitted is "○", and the case where the light is emitted but the dark spot is present is "Δ", and the case where the light is not emitted at all is "x".

(7)有機EL顯示元件之耐彎曲性 (7) Flexibility of organic EL display elements

將藉由濺鍍於厚度100μm之PET膜成膜厚度1000Å之ZnSnOx而成之阻氣膜設為透明支撐基板,進而藉由濺鍍而使厚度1000Å之ITO透明電極成膜,根據與上述「(6)有機EL元件之發光狀態」相同之順序,依序使N,N'-二(1-萘基)-N,N'-二苯基聯苯胺(α-NPD)之電洞傳輸層、三(8-羥基喹啉)鋁(Alq3)之發光層、氟化鋰之電子傳輸層、及鋁電極成膜,獲得具有有機發光材料層之積層體。 A gas barrier film formed by depositing ZnSnO x having a thickness of 1000 Å on a PET film having a thickness of 100 μm is used as a transparent supporting substrate, and a ITO transparent electrode having a thickness of 1000 Å is formed by sputtering, according to the above (6) The light-emitting state of the organic EL element is the same order, and the hole transport layer of N,N'-bis(1-naphthyl)-N,N'-diphenylbenzidine (α-NPD) is sequentially formed. A light-emitting layer of tris(8-hydroxyquinoline)aluminum (Alq 3 ), an electron transport layer of lithium fluoride, and an aluminum electrode are formed into a film to obtain a laminate having an organic light-emitting material layer.

另一方面,將實施例及比較例中獲得之各有機EL顯示元件密封用硬化性樹脂片於80℃進行輥式層疊而轉印於藉由濺鍍於厚度100μm之PET膜成膜厚度1000Å之ZnSnOx而成之阻氣膜,並介隔有機EL顯示元件密封用硬化性樹脂片,於80℃輥式層疊而積層於形成有具有有機發光材料層之積層體之膜基板上。其後,於各烘箱中以100℃加熱1小時,使有機EL顯示元件密封用硬化性樹脂片硬化,獲得有機EL顯示元件。 On the other hand, each of the curable resin sheets for sealing an organic EL display element obtained in the examples and the comparative examples was subjected to roll lamination at 80 ° C and transferred to a film thickness of 1000 Å by sputtering on a PET film having a thickness of 100 μm. A gas barrier film made of ZnSnO x and a cured resin sheet for sealing an organic EL display element are laminated on a film substrate on which a laminate having an organic light-emitting material layer is formed by roll lamination at 80 ° C. Thereafter, the organic EL display element sealing curable resin sheet was cured by heating at 100 ° C for 1 hour in each oven to obtain an organic EL display element.

利用根據JIS C5016之彎曲試驗使所獲得之有機EL顯示元件彎曲,以半徑5mm、來回移動距離20mm、來回移動速度10mm/秒彎曲20次後,於溫度60℃、濕度90%之條件下暴露100小時,施加10V之電壓,以目視觀察元件之發光狀態。將於有機EL元件之彎曲部位未因由填埋阻氣膜之間隙之有機EL顯示元件密封用硬化性樹脂片之龜裂所導致之水分滲入而發現發光區域之縮小之情形設為「○」,將發現發光區域之縮小之情形設為「△」,將發光區域大致消失或大幅縮小之情形設為「×」,而對耐彎曲性進行評價。 The obtained organic EL display element was bent by a bending test according to JIS C5016, and bent 20 times with a radius of 5 mm, a back-and-forward moving distance of 20 mm, and a back-and-forth moving speed of 10 mm/sec, and exposed to 100 ° C and a humidity of 90%. In an hour, a voltage of 10 V was applied to visually observe the light-emitting state of the element. When the curved portion of the organic EL element is not leaked by the crack of the curable resin sheet for sealing the organic EL display element sealed by the gap of the gas barrier film, the case where the light-emitting region is reduced is set to "○". The case where the light-emitting area was reduced was set to "Δ", and the case where the light-emitting area was substantially disappeared or greatly reduced was set to "x", and the bending resistance was evaluated.

藉由本發明,可提供一種有機電致發光顯示元件密封用硬化性樹脂組成物,其可防止因加熱或彎曲等而導致之龜裂之產生,可獲得接著性、透明性、阻隔性優異之樹脂片。又,根據本發明,可提供一種使用該有機電致發光顯示元件密封用硬化性樹脂組成物而成之有機電致發光顯示元件密封用硬化性樹脂片及有機電致發光顯示元件。 According to the present invention, it is possible to provide a curable resin composition for sealing an organic electroluminescence display element, which can prevent generation of cracks due to heating or bending, and can obtain a resin excellent in adhesion, transparency, and barrier properties. sheet. Moreover, according to the present invention, a curable resin sheet for organic electroluminescence display element sealing and an organic electroluminescence display element which are obtained by using the curable resin composition for sealing an organic electroluminescence display element can be provided.

Claims (9)

一種有機電致發光顯示元件密封用硬化性樹脂組成物,其含有多官能陽離子聚合性低聚物、分子量超過10萬之陽離子聚合性聚合物、及硬化劑。 A curable resin composition for sealing an organic electroluminescence display element, comprising a polyfunctional cationically polymerizable oligomer, a cationically polymerizable polymer having a molecular weight of more than 100,000, and a curing agent. 如申請專利範圍第1項之有機電致發光顯示元件密封用硬化性樹脂組成物,其中,硬化劑係熱陽離子聚合起始劑。 The curable resin composition for sealing an organic electroluminescence display element according to the first aspect of the invention, wherein the curing agent is a thermal cationic polymerization initiator. 如申請專利範圍第1或2項之有機電致發光顯示元件密封用硬化性樹脂組成物,其中,陽離子聚合性聚合物之陽離子聚合性基當量為3000g/mol以下。 The curable resin composition for sealing an organic electroluminescence display device according to the first or second aspect of the invention, wherein the cationically polymerizable polymer has a cationic polymerizable group equivalent of 3000 g/mol or less. 如申請專利範圍第1、2或3項之有機電致發光顯示元件密封用硬化性樹脂組成物,其含有具有陽離子聚合性基之矽烷偶合劑。 The curable resin composition for sealing an organic electroluminescence display element according to the first, second or third aspect of the invention, which comprises a decane coupling agent having a cationically polymerizable group. 如申請專利範圍第1、2、3或4項之有機電致發光顯示元件密封用硬化性樹脂組成物,其於100℃之熔融黏度為1000~5萬Pa.s。 The curable resin composition for sealing an organic electroluminescence display element according to claim 1, 2, 3 or 4, wherein the melt viscosity at 100 ° C is 1000 to 50,000 Pa. s. 如申請專利範圍第1、2、3、4或5項之有機電致發光顯示元件密封用硬化性樹脂組成物,其中,多官能陽離子聚合性低聚物係具有脂環骨架之低聚物。 The curable resin composition for sealing an organic electroluminescence display element according to the first, second, third, fourth or fifth aspect of the invention, wherein the polyfunctional cationically polymerizable oligomer has an oligomer of an alicyclic skeleton. 如申請專利範圍第1、2、3、4、5或6項之有機電致發光顯示元件密封用硬化性樹脂組成物,其中,多官能陽離子聚合性低聚物係具有環氧基或氧雜環丁基(oxetanyl group)且不具有除環氧基或氧雜環丁基所含有之醚鍵、及酯鍵以外之醚鍵、及酯鍵的化合物。 The curable resin composition for sealing an organic electroluminescence display element according to the first, second, third, fourth, fifth or sixth aspect of the invention, wherein the polyfunctional cationically polymerizable oligomer has an epoxy group or an oxa group. An oxetanyl group does not have a compound other than an ether bond contained in an epoxy group or an oxetanyl group, and an ether bond other than an ester bond, and an ester bond. 一種有機電致發光顯示元件密封用硬化性樹脂片,其係將申請專利範圍第1、2、3、4、5、6或7項之有機電致發光顯示元件密封用硬化性 樹脂組成物成形為片狀而成。 A curable resin sheet for sealing an organic electroluminescence display element, which is a curing property for sealing an organic electroluminescence display element of the first, second, third, fourth, fifth, sixth or seventh aspect of the patent application The resin composition is formed into a sheet shape. 一種有機電致發光顯示元件,其係使用申請專利範圍第1、2、3、4、5、6或7項之有機電致發光顯示元件密封用硬化性樹脂組成物及/或申請專利範圍第8項之有機電致發光顯示元件密封用硬化性樹脂片而製造。 An organic electroluminescence display element using a curable resin composition for sealing an organic electroluminescence display element according to claim 1, 2, 3, 4, 5, 6 or 7 and/or a patent application scope The eighth-order organic electroluminescence display element is produced by sealing a curable resin sheet.
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