TW202109786A - Sealant for organic EL display element - Google Patents
Sealant for organic EL display element Download PDFInfo
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- TW202109786A TW202109786A TW109123191A TW109123191A TW202109786A TW 202109786 A TW202109786 A TW 202109786A TW 109123191 A TW109123191 A TW 109123191A TW 109123191 A TW109123191 A TW 109123191A TW 202109786 A TW202109786 A TW 202109786A
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- Prior art keywords
- organic
- compound
- weight
- parts
- sealant
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- 239000000565 sealant Substances 0.000 title claims abstract description 66
- 150000001875 compounds Chemical class 0.000 claims abstract description 121
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims abstract description 76
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 48
- 239000004593 Epoxy Substances 0.000 claims abstract description 44
- 125000003566 oxetanyl group Chemical group 0.000 claims abstract description 40
- 235000010290 biphenyl Nutrition 0.000 claims abstract description 38
- 239000004305 biphenyl Substances 0.000 claims abstract description 38
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 34
- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 26
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 24
- 125000002091 cationic group Chemical group 0.000 claims abstract description 16
- -1 (3-ethyloxetan-3-yl)methoxy Chemical group 0.000 claims description 74
- 239000003795 chemical substances by application Substances 0.000 claims description 51
- 238000007789 sealing Methods 0.000 claims description 48
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims description 11
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 8
- LFKLPJRVSHJZPL-UHFFFAOYSA-N 1,2:7,8-diepoxyoctane Chemical compound C1OC1CCCCC1CO1 LFKLPJRVSHJZPL-UHFFFAOYSA-N 0.000 claims description 3
- 150000001450 anions Chemical group 0.000 claims description 3
- USGYMDAUQBQWFU-UHFFFAOYSA-N 1,2,5,6-diepoxycyclooctane Chemical compound C1CC2OC2CCC2OC12 USGYMDAUQBQWFU-UHFFFAOYSA-N 0.000 claims description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 2
- 150000001924 cycloalkanes Chemical class 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 2
- PMPVIKIVABFJJI-UHFFFAOYSA-N Cyclobutane Chemical compound C1CCC1 PMPVIKIVABFJJI-UHFFFAOYSA-N 0.000 claims 1
- 238000010943 off-gassing Methods 0.000 abstract description 20
- 238000000605 extraction Methods 0.000 abstract description 17
- 239000011248 coating agent Substances 0.000 abstract description 15
- 238000000576 coating method Methods 0.000 abstract description 15
- 150000001925 cycloalkenes Chemical class 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 description 39
- 238000010438 heat treatment Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 19
- 229920001187 thermosetting polymer Polymers 0.000 description 14
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 12
- 239000000126 substance Substances 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 10
- 239000006087 Silane Coupling Agent Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000003607 modifier Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- 229910010272 inorganic material Inorganic materials 0.000 description 7
- 239000011147 inorganic material Substances 0.000 description 7
- 238000002161 passivation Methods 0.000 description 7
- 239000003381 stabilizer Substances 0.000 description 7
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 6
- 229910052753 mercury Inorganic materials 0.000 description 6
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 4
- DNVXWIINBUTFEP-UHFFFAOYSA-N 2-[(2-phenylphenoxy)methyl]oxirane Chemical compound C1OC1COC1=CC=CC=C1C1=CC=CC=C1 DNVXWIINBUTFEP-UHFFFAOYSA-N 0.000 description 4
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 4
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- OXQXGKNECHBVMO-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound C1C(C(=O)O)CCC2OC21 OXQXGKNECHBVMO-UHFFFAOYSA-N 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bisphenol F Natural products C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical group [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 125000000129 anionic group Chemical group 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 3
- 239000012954 diazonium Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 150000004702 methyl esters Chemical class 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 3
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 2
- CNOHWNUIQSHFEJ-UHFFFAOYSA-N 1-cyclopenta-2,4-dien-1-yl-2-propan-2-ylbenzene;iron Chemical compound [Fe].CC(C)C1=CC=CC=C1C1C=CC=C1 CNOHWNUIQSHFEJ-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 2
- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- 241000723353 Chrysanthemum Species 0.000 description 2
- 235000007516 Chrysanthemum Nutrition 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910018286 SbF 6 Inorganic materials 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 235000010216 calcium carbonate Nutrition 0.000 description 2
- 238000005341 cation exchange Methods 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- HYVNJCOHGOONJK-UHFFFAOYSA-N dibenzyl-methyl-phenylazanium Chemical compound C=1C=CC=CC=1C[N+](C=1C=CC=CC=1)(C)CC1=CC=CC=C1 HYVNJCOHGOONJK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004817 gas chromatography Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 239000003456 ion exchange resin Substances 0.000 description 2
- 229920003303 ion-exchange polymer Polymers 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 150000004714 phosphonium salts Chemical class 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229960000834 vinyl ether Drugs 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- QLGYTJLZFZUDFL-UHFFFAOYSA-N 1,3-bis[1-(1h-imidazol-2-yl)propyl]urea Chemical compound N=1C=CNC=1C(CC)NC(=O)NC(CC)C1=NC=CN1 QLGYTJLZFZUDFL-UHFFFAOYSA-N 0.000 description 1
- MWZJGRDWJVHRDV-UHFFFAOYSA-N 1,4-bis(ethenoxy)butane Chemical compound C=COCCCCOC=C MWZJGRDWJVHRDV-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- VSHKLLPSERFSRJ-UHFFFAOYSA-N 1-(naphthalen-1-ylmethyl)pyridin-1-ium-2-carbonitrile Chemical compound N#CC1=CC=CC=[N+]1CC1=CC=CC2=CC=CC=C12 VSHKLLPSERFSRJ-UHFFFAOYSA-N 0.000 description 1
- OBSKXJSZGYXFFB-UHFFFAOYSA-N 1-benzylpyridin-1-ium-2-carbonitrile Chemical compound N#CC1=CC=CC=[N+]1CC1=CC=CC=C1 OBSKXJSZGYXFFB-UHFFFAOYSA-N 0.000 description 1
- SAMJGBVVQUEMGC-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOC=C SAMJGBVVQUEMGC-UHFFFAOYSA-N 0.000 description 1
- RQJCIXUNHZZFMB-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxypropoxy)propane Chemical compound C=COCC(C)OCC(C)OC=C RQJCIXUNHZZFMB-UHFFFAOYSA-N 0.000 description 1
- FOWNZLLMQHBVQT-UHFFFAOYSA-N 1-ethenoxy-2-[2-(2-ethenoxypropoxy)propoxy]propane Chemical compound C=COCC(C)OCC(C)OCC(C)OC=C FOWNZLLMQHBVQT-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- VDAIJDKQXDCJSI-UHFFFAOYSA-N 2-(2-methylimidazol-1-yl)ethylurea Chemical compound CC1=NC=CN1CCNC(N)=O VDAIJDKQXDCJSI-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- RQZUWSJHFBOFPI-UHFFFAOYSA-N 2-[1-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C)COCC1CO1 RQZUWSJHFBOFPI-UHFFFAOYSA-N 0.000 description 1
- FVCHRIQAIOHAIC-UHFFFAOYSA-N 2-[1-[1-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propan-2-yloxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C)COC(C)COCC1CO1 FVCHRIQAIOHAIC-UHFFFAOYSA-N 0.000 description 1
- SEFYJVFBMNOLBK-UHFFFAOYSA-N 2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCC1CO1 SEFYJVFBMNOLBK-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- HRSLYNJTMYIRHM-UHFFFAOYSA-N 2-[[4-[3,5-dimethyl-4-(oxiran-2-ylmethoxy)phenyl]-2,6-dimethylphenoxy]methyl]oxirane Chemical group CC1=CC(C=2C=C(C)C(OCC3OC3)=C(C)C=2)=CC(C)=C1OCC1CO1 HRSLYNJTMYIRHM-UHFFFAOYSA-N 0.000 description 1
- OZRVXYJWUUMVOW-UHFFFAOYSA-N 2-[[4-[4-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C1OC1COC(C=C1)=CC=C1C(C=C1)=CC=C1OCC1CO1 OZRVXYJWUUMVOW-UHFFFAOYSA-N 0.000 description 1
- FJNLCHNQVJVCPY-UHFFFAOYSA-N 2-n-methoxy-2-n-methyl-4-n,6-n-dipropyl-1,3,5-triazine-2,4,6-triamine Chemical compound CCCNC1=NC(NCCC)=NC(N(C)OC)=N1 FJNLCHNQVJVCPY-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- VAXWRFJBZKAQFI-UHFFFAOYSA-N 3-[3-(3-hydrazinyl-3-oxopropyl)-2,4-dioxo-5-propan-2-ylimidazolidin-1-yl]propanehydrazide Chemical compound CC(C)C1N(CCC(=O)NN)C(=O)N(CCC(=O)NN)C1=O VAXWRFJBZKAQFI-UHFFFAOYSA-N 0.000 description 1
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 1
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- CXXSQMDHHYTRKY-UHFFFAOYSA-N 4-amino-2,3,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1=C(O)C(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 CXXSQMDHHYTRKY-UHFFFAOYSA-N 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- ZYOUJMRZDQJUMP-UHFFFAOYSA-N CCC(C=1NC=CN1)NCCCCCCN Chemical compound CCC(C=1NC=CN1)NCCCCCCN ZYOUJMRZDQJUMP-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- MOOIXEMFUKBQLJ-UHFFFAOYSA-N [1-(ethenoxymethyl)cyclohexyl]methanol Chemical compound C=COCC1(CO)CCCCC1 MOOIXEMFUKBQLJ-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000005349 anion exchange Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- NKWPZUCBCARRDP-UHFFFAOYSA-L calcium bicarbonate Chemical compound [Ca+2].OC([O-])=O.OC([O-])=O NKWPZUCBCARRDP-UHFFFAOYSA-L 0.000 description 1
- 229910000020 calcium bicarbonate Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical compound C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- OWZDULOODZHVCQ-UHFFFAOYSA-N diphenyl-(4-phenylsulfanylphenyl)sulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC1=CC=CC=C1 OWZDULOODZHVCQ-UHFFFAOYSA-N 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- AZDCYKCDXXPQIK-UHFFFAOYSA-N ethenoxymethylbenzene Chemical compound C=COCC1=CC=CC=C1 AZDCYKCDXXPQIK-UHFFFAOYSA-N 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 229940083094 guanine derivative acting on arteriolar smooth muscle Drugs 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- 229940044652 phenolsulfonate Drugs 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003458 sulfonic acid derivatives Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- HMKGBOLFVMRQRP-UHFFFAOYSA-N tribenzyl(phenyl)azanium Chemical compound C=1C=CC=CC=1C[N+](C=1C=CC=CC=1)(CC=1C=CC=CC=1)CC1=CC=CC=C1 HMKGBOLFVMRQRP-UHFFFAOYSA-N 0.000 description 1
- GAMLUOSQYHLFCT-UHFFFAOYSA-N triethoxy-[3-[(3-ethyloxetan-3-yl)methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1(CC)COC1 GAMLUOSQYHLFCT-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Electroluminescent Light Sources (AREA)
- Epoxy Resins (AREA)
Abstract
Description
本發明係關於一種低釋氣性及塗佈性優異、且可獲得光萃取效率優異之有機EL顯示元件的有機EL顯示元件用密封劑。The present invention relates to a sealing agent for an organic EL display element which is excellent in low outgassing properties and coating properties, and can obtain an organic EL display element with excellent light extraction efficiency.
有機電致發光(以下亦稱為「有機EL」)顯示元件具有於相互對向之一對電極間夾持有機發光材料層而成之積層體構造,對於該有機發光材料層,自一電極注入電子,並且自另一電極注入電洞,藉此電子與電洞於有機發光材料層內結合而發光。如此,有機EL顯示元件進行自發光,因此與需要背光之液晶顯示元件等相比,具有如下優點:視認性較佳,能夠進一步薄型化,且能夠進行直流低電壓驅動。Organic electroluminescence (hereinafter also referred to as "organic EL") display elements have a laminated structure in which an organic light-emitting material layer is sandwiched between a pair of electrodes facing each other. For the organic light-emitting material layer, one electrode Inject electrons and inject holes from the other electrode, whereby the electrons and holes are combined in the organic light-emitting material layer to emit light. In this way, the organic EL display element emits self-luminescence, and therefore has the following advantages compared with liquid crystal display elements that require a backlight, such as better visibility, thinner thickness, and low-voltage direct current driving.
構成有機EL顯示元件之有機發光材料層或電極存在特性容易因水分或氧氣等而劣化之問題。因此,為了獲得實用之有機EL顯示元件,需要將有機發光材料層或電極與大氣隔絕而謀求長壽命化。作為將有機發光材料層或電極與大氣隔絕之方法,使用密封劑來密封有機EL顯示元件(例如專利文獻1)。於利用密封劑來密封有機EL顯示元件之情形時,通常使用如下方法:為了充分地抑制水分或氧氣等之透過,而於具有有機發光材料層之積層體上設置被稱為鈍化膜之無機材料膜,於該無機材料膜上利用密封劑進行密封。The organic light-emitting material layer or electrode constituting the organic EL display element has a problem that its characteristics are easily degraded by moisture, oxygen, or the like. Therefore, in order to obtain a practical organic EL display element, it is necessary to isolate the organic light-emitting material layer or electrode from the atmosphere to achieve a long life. As a method of shielding the organic light-emitting material layer or electrode from the atmosphere, a sealant is used to seal the organic EL display element (for example, Patent Document 1). When using a sealant to seal an organic EL display element, the following method is usually used: In order to sufficiently suppress the permeation of moisture or oxygen, an inorganic material called a passivation film is provided on a laminate with an organic light-emitting material layer The film is sealed with a sealant on the inorganic material film.
近年,代替自形成有發光元件之基板面側萃取由有機發光材料層發出之光之底部發光型有機EL顯示元件,自有機發光層之上表面側萃取光之頂部發光型有機EL顯示元件受到關注。此方式之開口率較高,且進行低電壓驅動,因此具有利於長壽命化之優點。於此種頂部發光型有機EL顯示元件中,由於發光層之上表面側需透明,故於發光元件之上表面側經由透明密封層積層玻璃等透明防濕性基材,藉此進行密封(例如專利文獻2)。然而,頂部發光型有機EL顯示元件存在如下問題:即便於使用透明性充分高者作為透明防濕性基材或密封劑之情形時,亦存在自積層體發出之光之萃取效率因電極或鈍化膜與密封劑之折射率差而較差之情形。又,以往之密封劑存在產生釋氣而使元件劣化,或塗佈性較差之問題。進而,為了減少由加熱所導致之對有機EL顯示元件之損壞,謀求於低溫能夠硬化者作為密封劑。 先前技術文獻 專利文獻In recent years, instead of bottom-emission type organic EL display elements that extract light emitted from an organic light-emitting material layer from the side of the substrate on which light-emitting elements are formed, top-emission type organic EL display elements that extract light from the upper surface of the organic light-emitting layer have attracted attention. . This method has a higher aperture ratio and low-voltage drive, so it has the advantage of prolonging life. In this type of top-emission organic EL display element, since the upper surface of the light-emitting layer needs to be transparent, the upper surface of the light-emitting element is sealed with a transparent moisture-proof substrate such as transparent sealing laminated glass (for example, Patent Document 2). However, the top-emission organic EL display element has the following problem: even when a material with sufficiently high transparency is used as a transparent moisture-proof substrate or sealant, the extraction efficiency of light emitted from the laminate may be caused by electrodes or passivation. A situation where the refractive index of the film and the sealant is poor. In addition, the conventional sealant has the problem of generating outgassing, deteriorating the device, or having poor coating properties. Furthermore, in order to reduce the damage to the organic EL display element caused by heating, a sealant that can be cured at a low temperature is sought. Prior art literature Patent literature
專利文獻1:日本特開2007-115692號公報 專利文獻2:日本特開2009-051980號公報Patent Document 1: Japanese Patent Application Publication No. 2007-115692 Patent Document 2: Japanese Patent Application Publication No. 2009-051980
[發明所欲解決之課題][The problem to be solved by the invention]
本發明之目的在於提供一種低釋氣性及塗佈性優異、且可獲得光萃取效率優異之有機EL顯示元件的有機EL顯示元件用密封劑。 [解決課題之技術手段]The object of the present invention is to provide a sealing agent for an organic EL display element which is excellent in low outgassing properties and coating properties, and can obtain an organic EL display element excellent in light extraction efficiency. [Technical means to solve the problem]
本發明係一種有機EL顯示元件用密封劑,其係含有陽離子聚合性化合物及陽離子聚合起始劑者,且上述陽離子聚合性化合物包含氧化環烯烴(cycloalkane oxide)型脂環式環氧化合物、及具有聯苯骨架與環氧基或氧雜環丁基(oxetanyl)之化合物。 以下對本發明進行詳述。The present invention is a sealant for an organic EL display element, which contains a cationic polymerizable compound and a cationic polymerization initiator, and the cationic polymerizable compound includes a cycloalkane oxide type alicyclic epoxy compound, and Compounds with biphenyl skeleton and epoxy or oxetanyl. The present invention will be described in detail below.
本發明人研究於有機EL顯示元件用密封劑中,使用氧化環烯烴型脂環式環氧化合物作為陽離子聚合性化合物,藉此提高塗佈性,且防止產生釋氣。然而,此種使用氧化環烯烴型脂環式環氧化合物之密封劑雖然防止產生釋氣之效果優異,但是存在因為與電極或鈍化膜之折射率差較大,故光萃取效率因電極或鈍化膜與密封劑之界面之反射而降低的問題。因此,本發明人研究將該氧化環烯烴型脂環式環氧化合物與具有聯苯骨架及環氧基或氧雜環丁基之化合物加以組合而用作陽離子聚合性化合物。結果發現:可獲得低釋氣性及塗佈性優異、且可使所得之有機EL顯示元件之光萃取效率優異的有機EL顯示元件用密封劑,從而完成本發明。 又,於使用熱陽離子聚合起始劑作為陽離子聚合起始劑,使本發明之有機EL顯示元件用密封劑為熱硬化型密封劑之情形時,可容易地於100℃以下之低溫下使之硬化。The present inventors studied the use of an oxidized cycloolefin type alicyclic epoxy compound as a cationic polymerizable compound in a sealant for an organic EL display element, thereby improving coating properties and preventing outgassing. However, although this kind of sealant using cycloalkene oxide type alicyclic epoxy compound is excellent in preventing outgassing, it has a large difference in refractive index with the electrode or passivation film, so the light extraction efficiency is caused by the electrode or passivation. The problem of reduced reflection at the interface between the film and the sealant. Therefore, the present inventors studied the use of this oxidized cycloolefin-type alicyclic epoxy compound in combination with a compound having a biphenyl skeleton and an epoxy group or an oxetanyl group as a cationic polymerizable compound. As a result, it was found that a sealing agent for an organic EL display element which is excellent in low outgassing properties and coatability, and can make the obtained organic EL display element excellent in light extraction efficiency, and completed the present invention. In addition, when a thermal cationic polymerization initiator is used as a cationic polymerization initiator and the sealant for organic EL display elements of the present invention is a thermal curing sealant, it can be easily made at a low temperature of 100°C or less hardening.
本發明之有機EL顯示元件用密封劑含有陽離子聚合性化合物。 上述陽離子聚合性化合物包含氧化環烯烴型脂環式環氧化合物。藉由含有上述氧化環烯烴型脂環式環氧化合物,本發明之有機EL顯示元件用密封劑之低釋氣性及塗佈性優異。The sealing agent for organic EL display elements of the present invention contains a cationic polymerizable compound. The cationically polymerizable compound includes an oxidized cycloolefin type alicyclic epoxy compound. By containing the above-mentioned oxidized cycloolefin type alicyclic epoxy compound, the sealing agent for an organic EL display element of the present invention is excellent in low outgassing properties and coating properties.
作為上述氧化環烯烴型脂環式環氧化合物,例如可列舉:3,4-環氧環己基羧酸3',4'-環氧環己基甲酯、雙(3,4-環氧環己基甲基)醚、己二酸雙(3,4-環氧環己烷-1-基甲基)酯、2,2-雙(羥基甲基)-1-丁醇之1,2-環氧-4-(2-環氧乙烷基)環己烷加成物、甲基丙烯酸[(3,4-環氧環己烷)-1-基]甲酯等。As the above-mentioned oxidized cycloolefin type alicyclic epoxy compound, for example, 3,4-epoxycyclohexyl carboxylic acid 3',4'-epoxycyclohexyl methyl ester, bis(3,4-epoxycyclohexyl) Methyl) ether, bis(3,4-epoxycyclohexane-1-ylmethyl) adipate, 1,2-epoxy of 2,2-bis(hydroxymethyl)-1-butanol -4-(2-oxiranyl)cyclohexane adduct, [(3,4-epoxycyclohexane)-1-yl]methyl methacrylate, etc.
作為上述氧化環烯烴型脂環式環氧化合物中之市售者,可列舉:Celloxide 2021P(Daicel公司製造)、TTA26(Sun Chemical公司製造)、EHPE3150(Daicel公司製造)等。Examples of commercially available oxidized cycloolefin-type alicyclic epoxy compounds include Celloxide 2021P (manufactured by Daicel), TTA26 (manufactured by Sun Chemical), EHPE3150 (manufactured by Daicel), and the like.
上述陽離子聚合性化合物整體100重量份中之上述氧化環烯烴型脂環式環氧化合物之含量之較佳下限為3重量份,較佳上限為45重量份。藉由上述氧化環烯烴型脂環式環氧化合物之含量為3重量份以上,所得之有機EL顯示元件用密封劑之硬化性、低釋氣性及塗佈性更優異。藉由上述氧化環烯烴型脂環式環氧化合物之含量為45重量份以下,所得之有機EL顯示元件之光萃取效率更優異。上述氧化環烯烴型脂環式環氧化合物之含量之更佳下限為5重量份、更佳上限為40重量份,進而較佳上限為38重量份。The lower limit of the content of the oxidized cycloolefin-type alicyclic epoxy compound in 100 parts by weight of the entire cationically polymerizable compound is preferably 3 parts by weight, and the upper limit is preferably 45 parts by weight. When the content of the oxidized cycloalkene-type alicyclic epoxy compound is 3 parts by weight or more, the resulting sealant for organic EL display elements is more excellent in curability, low outgassing properties, and coating properties. When the content of the oxidized cycloolefin type alicyclic epoxy compound is 45 parts by weight or less, the light extraction efficiency of the obtained organic EL display device is more excellent. The lower limit of the content of the oxidized cycloolefin-type alicyclic epoxy compound is more preferably 5 parts by weight, the upper limit is more preferably 40 parts by weight, and the upper limit is still more preferably 38 parts by weight.
上述陽離子聚合性化合物包含具有聯苯骨架與環氧基或氧雜環丁基之化合物。藉由含有上述具有聯苯骨架與環氧基或氧雜環丁基之化合物,本發明之有機EL顯示元件用密封劑與電極或鈍化膜之折射率差變小,結果所得之有機EL顯示元件之光萃取效率優異。又,藉由包含具有聯苯骨架與環氧基或氧雜環丁基之化合物,於使本發明之有機EL顯示元件用密封劑為熱硬化型密封劑之情形時,可容易地於100℃以下之低溫下使之硬化。The above-mentioned cationically polymerizable compound includes a compound having a biphenyl skeleton and an epoxy group or an oxetanyl group. By containing the above-mentioned compound having a biphenyl skeleton and epoxy group or oxetanyl group, the difference in refractive index between the sealing agent for an organic EL display element of the present invention and the electrode or passivation film becomes small, and as a result the obtained organic EL display element The light extraction efficiency is excellent. In addition, by including a compound having a biphenyl skeleton and an epoxy group or an oxetanyl group, when the sealant for an organic EL display element of the present invention is a thermosetting sealant, it can be easily heated at 100°C. Harden it at the following low temperature.
作為上述具有聯苯骨架與環氧基或氧雜環丁基之化合物,只要為具有聯苯骨架之環氧化合物或具有聯苯骨架之氧雜環丁烷化合物即可,就黏度、折射率、光硬化性等觀點而言,能夠適當選擇各種具有聯苯骨架與環氧基或氧雜環丁基之化合物。As the above-mentioned compound having a biphenyl skeleton and an epoxy group or oxetanyl group, as long as it is an epoxy compound having a biphenyl skeleton or an oxetane compound having a biphenyl skeleton, the viscosity, refractive index, From the viewpoint of photocurability and the like, various compounds having a biphenyl skeleton and epoxy groups or oxetanyl groups can be appropriately selected.
作為上述具有聯苯骨架與環氧基或氧雜環丁基之化合物,具體而言,例如可列舉:鄰苯基苯酚環氧丙基醚、下述式(1)所表示之化合物、對苯基苯酚環氧丙基醚、4,4-聯苯二基雙(環氧丙基醚)、4,4'-雙(環氧丙氧基)-1,1'-聯苯、3,3',5,5'-四甲基-4,4'-雙(環氧丙氧基)-1,1'-聯苯等。其中較佳為鄰苯基苯酚環氧丙基醚、下述式(1)所示之化合物。 上述具有聯苯骨架與環氧基或氧雜環丁基之化合物可單獨使用,亦可組合2種以上而使用。Specific examples of the compound having a biphenyl skeleton and an epoxy group or oxetanyl group include o-phenylphenol glycidyl ether, a compound represented by the following formula (1), and p-benzene Phenol glycidyl ether, 4,4-biphenyldiyl bis(glycidyl ether), 4,4'-bis(glycidoxy)-1,1'-biphenyl, 3,3 ',5,5'-Tetramethyl-4,4'-bis(glycidoxy)-1,1'-biphenyl etc. Among them, o-phenylphenol glycidyl ether and the compound represented by the following formula (1) are preferred. The compound having a biphenyl skeleton and an epoxy group or an oxetanyl group may be used alone or in combination of two or more kinds.
式(1)中,n係重複數。 該n較佳為式(1)所表示之化合物滿足下述氧雜環丁基當量之範圍之值。In formula (1), n is the repeat number. This n is preferably a value in which the compound represented by the formula (1) satisfies the range of the following oxetanyl equivalent.
上述具有聯苯骨架與環氧基或氧雜環丁基之化合物之環氧當量或氧雜環丁基當量之較佳下限為110,較佳上限為500。藉由上述具有聯苯骨架與環氧基或氧雜環丁基之化合物之環氧當量或氧雜環丁基當量為該範圍,所得之有機EL顯示元件用密封劑之接著性、低釋氣性、及塗佈性更優異。 再者,於本說明書中,上述具有聯苯骨架與環氧基或氧雜環丁基之化合物之環氧當量或氧雜環丁基當量意指(具有聯苯骨架與環氧基或氧雜環丁基之化合物之分子量)/(具有聯苯骨架與環氧基或氧雜環丁基之化合物1分子中之環氧基或氧雜環丁基之數量)。The preferred lower limit of the epoxy equivalent or oxetanyl equivalent of the compound having a biphenyl skeleton and epoxy or oxetanyl group is 110, and the preferred upper limit is 500. When the epoxy equivalent or oxetanyl equivalent of the compound having a biphenyl skeleton and epoxy group or oxetanyl group is in this range, the adhesiveness and low outgassing of the resulting sealant for organic EL display devices It has more excellent properties and coating properties. Furthermore, in this specification, the epoxy equivalent or oxetanyl equivalent of the compound having a biphenyl skeleton and an epoxy or oxetanyl group means (having a biphenyl skeleton and an epoxy or oxetanyl group) Molecular weight of cyclobutyl compound)/(number of epoxy or oxetanyl groups in 1 molecule of compound with biphenyl skeleton and epoxy or oxetanyl groups).
上述具有聯苯骨架與環氧基或氧雜環丁基之化合物之分子量之較佳下限為200,較佳上限為1000。藉由上述具有聯苯骨架與環氧基或氧雜環丁基之化合物之分子量為該範圍,所得之有機EL顯示元件用密封劑之接著性、低釋氣性及塗佈性更優異。 再者,於本說明書中,關於上述「分子量」,對於分子結構特定之化合物,為根據結構式求出之分子量,而對於聚合度之分佈廣泛之化合物及改質部位不特定之化合物,存在使用重量平均分子量來表示之情形。又,上述「重量平均分子量」係利用凝膠滲透層析法(GPC),使用四氫呋喃作為溶劑而進行測定,藉由聚苯乙烯換算所求出之值。作為利用GPC測定藉由聚苯乙烯換算所得之重量平均分子量時所使用之管柱,例如可列舉Shodex LF-804(昭和電工公司製造)等。The preferred lower limit of the molecular weight of the compound having a biphenyl skeleton and epoxy group or oxetanyl group is 200, and the preferred upper limit is 1,000. When the molecular weight of the compound having a biphenyl skeleton and an epoxy group or an oxetanyl group is in this range, the resulting sealant for an organic EL display device has more excellent adhesiveness, low outgassing properties, and coating properties. Furthermore, in this specification, the above-mentioned "molecular weight" refers to the molecular weight obtained from the structural formula for compounds with a specific molecular structure, while for compounds with a wide distribution of degree of polymerization and compounds with unspecified modified sites, there are some use It is expressed by weight average molecular weight. In addition, the above-mentioned "weight average molecular weight" is a value determined by gel permeation chromatography (GPC) using tetrahydrofuran as a solvent, and calculated in terms of polystyrene. As a column used when measuring the weight average molecular weight obtained by polystyrene conversion by GPC, for example, Shodex LF-804 (manufactured by Showa Denko Corporation) and the like can be cited.
上述具有聯苯骨架與環氧基或氧雜環丁基之化合物較佳為於25℃為液狀。藉由上述具有聯苯骨架與環氧基或氧雜環丁基之化合物之環氧當量或氧雜環丁基當量於25℃為液狀,所得之有機EL顯示元件用密封劑之塗佈性更優異。The compound having a biphenyl skeleton and an epoxy group or oxetanyl group is preferably liquid at 25°C. Coatability of the resulting sealant for organic EL display devices by the epoxy equivalent or oxetanyl equivalent of the compound having a biphenyl skeleton and epoxy or oxetanyl group being liquid at 25°C More excellent.
作為上述具有聯苯骨架與環氧基或氧雜環丁基之化合物中之市售者,例如可列舉:OPP-EP(四日市合成公司製造)、ETERNACOLL OXBP(宇部興產公司製造)等。Examples of commercially available compounds having a biphenyl skeleton and an epoxy group or oxetanyl group include OPP-EP (manufactured by Yokkaichi Gosei Co., Ltd.), ETERNACOLL OXBP (manufactured by Ube Industries Co., Ltd.), and the like.
上述陽離子聚合性化合物整體100重量份中之上述具有聯苯骨架與環氧基或氧雜環丁基之化合物之含量的較佳下限為30重量份,較佳上限為97重量份。藉由上述具有聯苯骨架與環氧基或氧雜環丁基之化合物之含量為30重量份以上,所得之有機EL顯示元件之光萃取效率更優異。藉由上述具有聯苯骨架與環氧基或氧雜環丁基之化合物之含量為97重量份以下,所得之有機EL顯示元件用密封劑之硬化性、低釋氣性、及塗佈性更優異。上述具有聯苯骨架與環氧基或氧雜環丁基之化合物之含量之更佳下限為50重量份,更佳上限為90重量份,進而較佳上限為80重量份。 於將上述氧化環烯烴型脂環式環氧化合物之含量設為1之情形時,上述具有聯苯骨架與環氧基或氧雜環丁基之化合物之含量之比以重量比計,較佳下限為1,較佳上限為20。藉由將上述具有聯苯骨架與環氧基或氧雜環丁基之化合物之含量之比設為1以上,所得之有機EL顯示元件用密封劑之折射率(光萃取效率)更優異,藉由設為20以下,硬化性及折射率更優異。上述具有聯苯骨架與環氧基或氧雜環丁基之化合物之含量之比的更佳下限為1.3,更佳上限為15,進而較佳下限為1.4,進而較佳上限為10。A preferable lower limit of the content of the compound having a biphenyl skeleton and an epoxy group or an oxetanyl group in 100 parts by weight of the entire cationically polymerizable compound is 30 parts by weight, and a preferable upper limit is 97 parts by weight. When the content of the compound having a biphenyl skeleton and an epoxy group or an oxetanyl group is 30 parts by weight or more, the light extraction efficiency of the obtained organic EL display device is more excellent. When the content of the compound having a biphenyl skeleton and an epoxy group or an oxetanyl group is 97 parts by weight or less, the resulting sealant for organic EL display devices has better curability, low outgassing properties, and coating properties. Excellent. The lower limit of the content of the compound having a biphenyl skeleton and an epoxy group or an oxetanyl group is more preferably 50 parts by weight, a more preferable upper limit is 90 parts by weight, and a more preferable upper limit is 80 parts by weight. When the content of the oxidized cycloalkene-type alicyclic epoxy compound is set to 1, the ratio of the content of the compound having a biphenyl skeleton to the epoxy group or oxetanyl group is based on a weight ratio, preferably The lower limit is 1, and the preferred upper limit is 20. By setting the ratio of the content of the compound having a biphenyl skeleton to the epoxy group or oxetanyl group to 1 or more, the obtained sealing agent for organic EL display device has a more excellent refractive index (light extraction efficiency), and By setting it to 20 or less, the curability and refractive index are more excellent. The lower limit of the ratio of the content of the compound having a biphenyl skeleton to the epoxy group or oxetanyl group is more preferably 1.3, the upper limit is more preferably 15, the lower limit is still more preferably 1.4, and the upper limit is still more preferably 10.
上述陽離子聚合性化合物除上述氧化環烯烴型脂環式環氧化合物及上述具有聯苯骨架與環氧基或氧雜環丁基之化合物以外,亦可包含其他陽離子聚合性化合物。 作為上述其他陽離子聚合性化合物,例如可列舉:上述氧化環烯烴型脂環式環氧化合物及上述具有聯苯骨架與環氧基或氧雜環丁基之化合物以外之其他環氧化合物、其他氧雜環丁烷化合物、乙烯醚化合物等。The cationically polymerizable compound may include other cationically polymerizable compounds in addition to the oxidized cycloolefin-type alicyclic epoxy compound and the compound having a biphenyl skeleton and an epoxy group or an oxetanyl group. Examples of the above-mentioned other cationic polymerizable compounds include: the above-mentioned oxidized cycloalkene-type alicyclic epoxy compounds and the above-mentioned compounds having a biphenyl skeleton and epoxy groups or oxetanyl groups, other epoxy compounds, and other oxygen Etidine compounds, vinyl ether compounds, etc.
作為上述其他環氧化合物,例如可列舉:茀型環氧化合物、1,7-辛二烯二環氧化物、新戊二醇二環氧丙基醚、乙二醇二環氧丙基醚、二乙二醇二環氧丙基醚、聚乙二醇二環氧丙基醚、丙二醇二環氧丙基醚、二丙二醇二環氧丙基醚、三丙二醇二環氧丙基醚、聚丙二醇二環氧丙基醚、1,6-己二醇二環氧丙基醚、甘油二環氧丙基醚、三羥甲基丙烷三環氧丙基醚、苯基環氧丙基醚、伸苯基二環氧丙基醚等。Examples of the above-mentioned other epoxy compounds include: sulphur-type epoxy compounds, 1,7-octadiene diepoxide, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, Diethylene Glycol Diglycidyl Ether, Polyethylene Glycol Diglycidyl Ether, Propylene Glycol Diglycidyl Ether, Dipropylene Glycol Diglycidyl Ether, Tripropylene Glycol Diglycidyl Ether, Polypropylene Glycol Diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin diglycidyl ether, trimethylolpropane triglycidyl ether, phenylglycidyl ether, extension Phenyl diglycidyl ether and so on.
作為上述其他氧雜環丁烷化合物,例如可列舉:3-乙基-3-(((3-乙基氧雜環丁烷-3-基)甲氧基)甲基)氧雜環丁烷、3-乙基-3-((2-乙基己氧基)甲基)氧雜環丁烷、3-乙基-3-((3-(三乙氧基矽基)丙氧基)甲基)氧雜環丁烷、苯酚酚醛清漆氧雜環丁烷、1,4-雙(((3-乙基-3-氧雜環丁基)甲氧基)甲基)苯等。Examples of the above-mentioned other oxetane compounds include 3-ethyl-3-(((3-ethyloxetan-3-yl)methoxy)methyl)oxetane , 3-ethyl-3-((2-ethylhexyloxy)methyl)oxetane, 3-ethyl-3-((3-(triethoxysilyl)propoxy) Methyl)oxetane, phenol novolac oxetane, 1,4-bis(((3-ethyl-3-oxetanyl)methoxy)methyl)benzene, etc.
作為上述乙烯醚化合物,例如可列舉:苄基乙烯醚、環己烷二甲醇單乙烯醚、二環戊二烯乙烯醚、1,4-丁二醇二乙烯醚、環己烷二甲醇二乙烯醚、二乙二醇二乙烯醚、三乙二醇二乙烯醚、二丙二醇二乙烯醚、三丙二醇二乙烯醚等。Examples of the vinyl ether compound include benzyl vinyl ether, cyclohexanedimethanol monovinyl ether, dicyclopentadiene vinyl ether, 1,4-butanediol divinyl ether, and cyclohexanedimethanol diethylene. Ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, dipropylene glycol divinyl ether, tripropylene glycol divinyl ether, etc.
其中,作為上述其他陽離子聚合性化合物,較佳為選自由3-乙基-3-(((3-乙基氧雜環丁烷-3-基)甲氧基)甲基)氧雜環丁烷、1,2:7,8-二環氧辛烷及1,2:5,6-二環氧環辛烷所組成之群中之至少1種,更佳為3-乙基-3-(((3-乙基氧雜環丁烷-3-基)甲氧基)甲基)氧雜環丁烷。Among them, the other cationically polymerizable compound is preferably selected from 3-ethyl-3-(((3-ethyloxetan-3-yl)methoxy)methyl)oxetane At least one of the group consisting of alkane, 1, 2:7,8-diepoxyoctane and 1, 2:5,6-diepoxycyclooctane, more preferably 3-ethyl-3- (((3-Ethyloxetan-3-yl)methoxy)methyl)oxetane.
於上述陽離子聚合性化合物包含上述其他陽離子聚合性化合物之情形時,上述陽離子聚合性化合物100重量份中之上述其他陽離子聚合性化合物之含量之較佳下限為1重量份,較佳上限為60重量份。藉由上述其他陽離子聚合性化合物之含量為該範圍,所得之有機EL顯示元件用密封劑之接著性及塗佈性更優異。上述其他陽離子聚合性化合物之含量之更佳下限為10重量份,更佳上限為50重量份,進而較佳下限為15重量份,進而較佳上限為40重量份。 又,於上述陽離子聚合性化合物包含上述其他陽離子聚合性化合物之情形時,上述陽離子聚合性化合物100重量份中之上述氧化環烯烴型脂環式環氧化合物與上述其他陽離子聚合性化合物之合計含量的較佳下限為20重量份。藉由上述氧化環烯烴型脂環式環氧化合物與上述其他陽離子聚合性化合物之合計含量為20重量份以上,所得之有機EL顯示元件用密封劑之塗佈性更優異。上述氧化環烯烴型脂環式環氧化合物與上述其他陽離子聚合性化合物之合計之含量之更佳下限為25重量份。When the above-mentioned cationically polymerizable compound contains the above-mentioned other cationically polymerizable compound, the preferred lower limit of the content of the above-mentioned other cationically polymerizable compound in 100 parts by weight of the above-mentioned cationically polymerizable compound is 1 part by weight, and the preferred upper limit is 60 parts by weight. Copies. When the content of the other cationically polymerizable compound is in this range, the adhesiveness and coatability of the resulting sealant for an organic EL display element are more excellent. The lower limit of the content of the other cationically polymerizable compound is more preferably 10 parts by weight, the upper limit is more preferably 50 parts by weight, the lower limit is still more preferably 15 parts by weight, and the upper limit is still more preferably 40 parts by weight. In addition, when the cationically polymerizable compound contains the other cationically polymerizable compound, the total content of the oxidized cycloolefin-type alicyclic epoxy compound and the other cationically polymerizable compound in 100 parts by weight of the cationically polymerizable compound The preferred lower limit is 20 parts by weight. When the total content of the oxidized cycloolefin-type alicyclic epoxy compound and the other cationically polymerizable compound is 20 parts by weight or more, the resulting sealant for an organic EL display element has more excellent coatability. The lower limit of the total content of the oxidized cycloolefin-type alicyclic epoxy compound and the other cationically polymerizable compound is more preferably 25 parts by weight.
本發明之有機EL顯示元件用密封劑含有陽離子聚合起始劑。 作為上述陽離子聚合起始劑,可列舉熱陽離子聚合起始劑或光陽離子聚合起始劑。尤其於本發明之有機EL顯示元件用密封劑使用熱陽離子聚合起始劑作為上述陽離子聚合起始劑之情形時,可容易地於100℃以下之低溫下使之硬化。The sealing agent for organic EL display elements of the present invention contains a cationic polymerization initiator. Examples of the cationic polymerization initiator include thermal cationic polymerization initiators and photocationic polymerization initiators. Especially when the sealing agent for organic EL display elements of the present invention uses a thermal cationic polymerization initiator as the cationic polymerization initiator, it can be easily cured at a low temperature of 100°C or less.
作為上述熱陽離子聚合起始劑,可列舉:陰離子部分由BF4 - 、PF6 - 、SbF6 - 或(BX4 )- (其中,X表示經至少2個以上之氟或三氟甲基取代之苯基)所構成之鋶鹽、鏻鹽、銨鹽、重氮鎓鹽、錪鹽等。其中較佳為鋶鹽。As the thermal cationic polymerization initiator include: anionic moiety of BF 4 -, PF 6 -, SbF 6 - or (BX 4) - (wherein, X is substituted with at least two or more of fluoro or trifluoromethyl The phenyl) constituted by sulfonium salt, phosphonium salt, ammonium salt, diazonium salt, iodonium salt, etc. Among them, sulfonium salt is preferred.
作為上述鋶鹽,可列舉:三苯基鋶四氟硼酸鹽、三苯基鋶六氟銻酸鹽等。Examples of the above-mentioned sulfonium salt include triphenylsulfonium tetrafluoroborate, triphenylsulfonium hexafluoroantimonate, and the like.
作為上述鏻鹽,可列舉:乙基三苯基鏻六氟銻酸鹽、四丁基鏻六氟銻酸鹽等。As said phosphonium salt, ethyl triphenyl phosphonium hexafluoroantimonate, tetrabutyl phosphonium hexafluoroantimonate, etc. are mentioned.
作為上述銨鹽,例如可列舉:二甲基苯基(4-甲氧基苄基)銨六氟磷酸鹽、二甲基苯基(4-甲氧基苄基)銨六氟銻酸鹽、二甲基苯基(4-甲氧基苄基)銨四(五氟苯基)硼酸鹽、二甲基苯基(4-甲基苄基)銨六氟磷酸鹽、二甲基苯基(4-甲基苄基)銨六氟銻酸鹽、二甲基苯基(4-甲基苄基)銨六氟四(五氟苯基)硼酸鹽、甲基苯基二苄基銨六氟磷酸鹽、甲基苯基二苄基銨六氟銻酸鹽、甲基苯基二苄基銨四(五氟苯基)硼酸鹽、苯基三苄基銨四(五氟苯基)硼酸鹽、二甲基苯基(3,4-二甲基苄基)銨四(五氟苯基)硼酸鹽、N,N-二甲基-N-苄基苯銨六氟銻酸鹽、N,N-二乙基-N-苄基苯銨四氟硼酸鹽、N,N-二甲基-N-苄基吡啶鎓六氟銻酸鹽、N,N-二乙基-N-苄基吡啶鎓三氟甲磺酸等。As the above-mentioned ammonium salt, for example, dimethylphenyl(4-methoxybenzyl)ammonium hexafluorophosphate, dimethylphenyl(4-methoxybenzyl)ammonium hexafluoroantimonate, Dimethylphenyl(4-methoxybenzyl)ammonium tetrakis(pentafluorophenyl)borate, dimethylphenyl(4-methylbenzyl)ammonium hexafluorophosphate, dimethylphenyl( 4-methylbenzyl)ammonium hexafluoroantimonate, dimethylphenyl(4-methylbenzyl)ammonium hexafluorotetra(pentafluorophenyl)borate, methylphenyldibenzylammonium hexafluoro Phosphate, methyl phenyl dibenzyl ammonium hexafluoroantimonate, methyl phenyl dibenzyl ammonium tetra (pentafluorophenyl) borate, phenyl tribenzyl ammonium tetra (pentafluorophenyl) borate , Dimethylphenyl(3,4-dimethylbenzyl)ammonium tetra(pentafluorophenyl)borate, N,N-dimethyl-N-benzylanilinium hexafluoroantimonate, N, N-diethyl-N-benzylanilinium tetrafluoroborate, N,N-dimethyl-N-benzylpyridinium hexafluoroantimonate, N,N-diethyl-N-benzylpyridine Onium trifluoromethanesulfonic acid and so on.
作為上述熱陽離子聚合起始劑中之市售者,例如可列舉:三新化學工業公司製造之熱陽離子聚合起始劑、King Industries公司製造之熱陽離子聚合起始劑等。 作為上述三新化學工業公司製造之熱陽離子聚合起始劑,例如可列舉:San-Aid SI-60、San-Aid SI-80、San-Aid SI-B3、San-Aid SI-B3A、San-Aid SI-B4等。 作為上述King Industries公司製造之熱陽離子聚合起始劑,例如可列舉:CXC-1612、CXC-1821等。As a commercially available one among the above-mentioned thermal cationic polymerization initiators, for example, a thermal cationic polymerization initiator manufactured by Sanshin Chemical Industry Co., Ltd., a thermal cationic polymerization initiator manufactured by King Industries, etc. can be cited. As the thermal cationic polymerization initiator manufactured by Sanxin Chemical Industry Co., Ltd., for example, San-Aid SI-60, San-Aid SI-80, San-Aid SI-B3, San-Aid SI-B3A, San-Aid Aid SI-B4 and so on. As the thermal cationic polymerization initiator manufactured by the above-mentioned King Industries, for example, CXC-1612, CXC-1821, and the like can be cited.
上述光陽離子聚合起始劑只要為藉由光照射而產生質子酸或路易斯酸者則並無特別限定,可為離子性光酸產生型,亦可為非離子性光酸產生型。The photocationic polymerization initiator is not particularly limited as long as it generates a protic acid or a Lewis acid by light irradiation, and may be an ionic photoacid generating type or a nonionic photoacid generating type.
作為上述離子性光酸產生型光陽離子聚合起始劑之陰離子部分,例如可列舉:BF4 - 、PF6 - 、SbF6 - 、(BX4 )- (其中,X表示經至少2個以上之氟或三氟甲基取代之苯基)等。又,作為上述陰離子部分,亦可列舉PFm (Cn F2n + 1 )6 - m - (其中,式中,m係0以上且5以下之整數,n係1以上且6以下之整數)等。 作為上述離子性光酸產生型光陽離子聚合起始劑,例如可列舉:具有上述陰離子部分之芳香族鋶鹽、芳香族錪鹽、芳香族重氮鎓鹽、芳香族銨鹽、(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-鐵鹽等。Examples of the ionic photoacid generator type photo cationic polymerization initiator of the anionic moiety include, for example: BF 4 -, PF 6 - , SbF 6 -, (BX 4) - ( wherein, X represents at least two of the above via Fluorine or trifluoromethyl substituted phenyl) etc. And, as the anionic moiety, it may include PF m (C n F 2n + 1) 6 - m - ( wherein, in the formula, m an integer of 5 or less and above 0 line, line n-1 and an integer of 6 or more of the following) Wait. Examples of the above-mentioned ionic photoacid-generating photocationic polymerization initiator include aromatic sulfonium salts, aromatic iodonium salts, aromatic diazonium salts, aromatic ammonium salts, (2,4 -Cyclopentadien-1-yl)((1-methylethyl)benzene)-iron salt and the like.
作為上述芳香族鋶鹽,例如可列舉:雙(4-(二苯基二氫硫基)苯基)硫基雙六氟磷酸鹽、雙(4-(二苯基二氫硫基)苯基)硫基雙六氟銻酸鹽、雙(4-(二苯基二氫硫基)苯基)硫基雙四氟硼酸鹽、雙(4-(二苯基二氫硫基)苯基)硫基四(五氟苯基)硼酸鹽、二苯基-4-(苯硫基)苯基鋶六氟磷酸鹽、二苯基-4-(苯硫基)苯基鋶六氟銻酸鹽、二苯基-4-(苯硫基)苯基鋶四氟硼酸鹽、二苯基-4-(苯硫基)苯基鋶四(五氟苯基)硼酸鹽、三苯基鋶六氟磷酸鹽、三苯基鋶六氟銻酸鹽、三苯基鋶四氟硼酸鹽、三苯基鋶四(五氟苯基)硼酸鹽、雙(4-(二(4-(2-羥基乙氧基))苯基二氫硫基)苯基)硫基雙六氟磷酸鹽、雙(4-(二(4-(2-羥基乙氧基))苯基二氫硫基)苯基)硫基雙六氟銻酸鹽、雙(4-(二(4-(2-羥基乙氧基))苯基二氫硫基)苯基)硫基雙四氟硼酸鹽、雙(4-(二(4-(2-羥基乙氧基))苯基二氫硫基)苯基)硫基四(五氟苯基)硼酸鹽、三(4-(4-乙醯基苯基)噻吩基)鋶四(五氟苯基)硼酸鹽等。其中較佳為三苯基鋶四(五氟苯基)硼酸鹽等三芳基鋶四(五氟苯基)硼酸鹽。As the above-mentioned aromatic sulfonium salt, for example, bis(4-(diphenyldihydrosulfanyl)phenyl)sulfanyl bishexafluorophosphate, bis(4-(diphenyldihydrosulfanyl)phenyl) )Sulfuryl bishexafluoroantimonate, bis(4-(diphenyldihydrosulfanyl)phenyl)sulfanyl bistetrafluoroborate, bis(4-(diphenyldihydrosulfanyl)phenyl) Sulfuryl tetrakis (pentafluorophenyl) borate, diphenyl-4-(phenylthio) phenyl sulfonium hexafluorophosphate, diphenyl-4-(phenylsulfonyl) phenyl sulfonium hexafluoroantimonate , Diphenyl-4-(phenylthio)phenyl sulfonium tetrafluoroborate, diphenyl-4-(phenylthio) phenyl sulfonium tetrakis (pentafluorophenyl) borate, triphenylsulfonium hexafluoro Phosphate, triphenyl alumium hexafluoroantimonate, triphenyl alumium tetrafluoroborate, triphenyl alumium tetrakis (pentafluorophenyl) borate, bis(4-(bis(4-(2-hydroxyethyl) (Oxy)) phenyl dihydrosulfanyl) phenyl) sulfanyl bishexafluorophosphate, bis(4-(bis(4-(2-hydroxyethoxy))phenyldihydrosulfanyl)phenyl) Sulfuryl bishexafluoroantimonate, bis(4-(bis(4-(2-hydroxyethoxy))phenyldihydrothio)phenyl)thio bistetrafluoroborate, bis(4-( Bis(4-(2-hydroxyethoxy))phenyldihydrothiophenyl)phenyl)thiotetrakis(pentafluorophenyl)borate, tris(4-(4-acetylphenyl)thienyl ) Tetrakis (pentafluorophenyl) borate and the like. Among them, triaryl alumium tetrakis (pentafluorophenyl) borate such as triphenyl alumium tetrakis (pentafluorophenyl) borate is preferable.
作為上述芳香族錪鹽,例如可列舉:二苯基錪六氟磷酸鹽、二苯基錪六氟銻酸鹽、二苯基錪四氟硼酸鹽、二苯基錪四(五氟苯基)硼酸鹽、雙(十二烷基苯基)錪六氟磷酸鹽、雙(十二烷基苯基)錪六氟銻酸鹽、雙(十二烷基苯基)錪四氟硼酸鹽、雙(十二烷基苯基)錪四(五氟苯基)硼酸鹽、4-甲基苯基-4-(1-甲基乙基)苯基錪六氟磷酸鹽、4-甲基苯基-4-(1-甲基乙基)苯基錪六氟銻酸鹽、4-甲基苯基-4-(1-甲基乙基)苯基錪四氟硼酸鹽、4-甲基苯基-4-(1-甲基乙基)苯基錪四(五氟苯基)硼酸鹽等。As the above-mentioned aromatic iodonium salt, for example, diphenyl iodonium hexafluorophosphate, diphenyl iodonium hexafluoroantimonate, diphenyl iodonium tetrafluoroborate, diphenyl iodonium tetrakis (pentafluorophenyl) Borate, bis(dodecylphenyl) hexafluorophosphate, bis(dodecylphenyl) hexafluoroantimonate, bis(dodecylphenyl) tetrafluoroborate, double (Dodecylphenyl) tetrakis (pentafluorophenyl) borate, 4-methylphenyl-4-(1-methylethyl)phenyl hexafluorophosphate, 4-methylphenyl -4-(1-Methylethyl)phenylphosphonium hexafluoroantimonate, 4-methylphenyl-4-(1-methylethyl)phenylphosphonium tetrafluoroborate, 4-methylbenzene 4-(1-methylethyl)phenylphosphonium tetrakis(pentafluorophenyl)borate and the like.
作為上述芳香族重氮鎓鹽,例如可列舉:苯基重氮鎓六氟磷酸鹽、苯基重氮鎓六氟銻酸鹽、苯基重氮鎓四氟硼酸鹽、苯基重氮鎓四(五氟苯基)硼酸鹽等。Examples of the above-mentioned aromatic diazonium salts include: phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoroantimonate, phenyldiazonium tetrafluoroborate, and phenyldiazonium tetrafluoroborate. (Pentafluorophenyl) borate and the like.
作為上述芳香族銨鹽,例如可列舉:1-苄基-2-氰基吡啶鎓六氟磷酸鹽、1-苄基-2-氰基吡啶鎓六氟銻酸鹽、1-苄基-2-氰基吡啶鎓四氟硼酸鹽、1-苄基-2-氰基吡啶鎓四(五氟苯基)硼酸鹽、1-(萘基甲基)-2-氰基吡啶鎓六氟磷酸鹽、1-(萘基甲基)-2-氰基吡啶鎓六氟銻酸鹽、1-(萘基甲基)-2-氰基吡啶鎓四氟硼酸鹽、1-(萘基甲基)-2-氰基吡啶鎓四(五氟苯基)硼酸鹽等。As the above-mentioned aromatic ammonium salt, for example, 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl-2-cyanopyridinium hexafluoroantimonate, 1-benzyl-2 -Cyanopyridinium tetrafluoroborate, 1-benzyl-2-cyanopyridinium tetra(pentafluorophenyl) borate, 1-(naphthylmethyl)-2-cyanopyridinium hexafluorophosphate , 1-(naphthylmethyl)-2-cyanopyridinium hexafluoroantimonate, 1-(naphthylmethyl)-2-cyanopyridinium tetrafluoroborate, 1-(naphthylmethyl) -2-cyanopyridinium tetrakis (pentafluorophenyl) borate and the like.
作為上述(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-鐵鹽,例如可列舉:(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-鐵(II)六氟磷酸鹽、(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-鐵(II)六氟銻酸鹽、(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-鐵(II)四氟硼酸鹽、(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-鐵(II)四(五氟苯基)硼酸鹽等。As the above-mentioned (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-iron salt, for example, (2,4-cyclopentadien-1-yl)( (1-methylethyl)benzene)-iron(II)hexafluorophosphate, (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-iron(II) Hexafluoroantimonate, (2,4-cyclopentadien-1-yl) ((1-methylethyl)benzene)-iron(II) tetrafluoroborate, (2,4-cyclopentadiene) -1-yl)((1-methylethyl)benzene)-iron(II)tetrakis(pentafluorophenyl)borate and the like.
作為上述非離子性光酸產生型光陽離子聚合起始劑,例如可列舉:硝基苄酯、磺酸衍生物、磷酸酯、苯酚磺酸酯、重氮萘醌、N-羥基醯亞胺磺酸酯等。Examples of the nonionic photo-acid-generating photocationic polymerization initiator include: nitrobenzyl ester, sulfonic acid derivative, phosphoric acid ester, phenol sulfonate, diazonaphthoquinone, and N-hydroxyimide sulfonate Acid esters and so on.
作為上述光陽離子聚合起始劑中之市售者,例如可列舉:Midori Kagaku公司製造之光陽離子聚合起始劑、Union Carbide公司製造之光陽離子聚合起始劑、ADEKA公司製造之光陽離子聚合起始劑、3M公司製造之光陽離子聚合起始劑、BASF公司製造之光陽離子聚合起始劑、Solvay公司製造之光陽離子聚合起始劑、San-Apro公司製造之光陽離子聚合起始劑等。 作為上述Midori Kagaku公司製造之光陽離子聚合起始劑,例如可列舉DTS-200等。 作為上述Union Carbide公司製造之光陽離子聚合起始劑,例如可列舉UVI6990、UVI6974等。 作為上述ADEKA公司製造之光陽離子聚合起始劑,例如可列舉SP-150、SP-170等。 作為上述3M公司製造之光陽離子聚合起始劑,例如可列舉FC-508、FC-512等。 作為上述BASF公司製造之光陽離子聚合起始劑,例如可列舉IRGACURE 261、IRGACURE 290等。 作為上述Solvay公司製造之光陽離子聚合起始劑,例如可列舉PI2074等。 作為上述San-Apro公司製造之光陽離子聚合起始劑,例如可列舉CPI-100P、CPI-200K、CPI-210S等。Examples of commercially available photocationic polymerization initiators include: photocationic polymerization initiator manufactured by Midori Kagaku, photocationic polymerization initiator manufactured by Union Carbide, and photocationic polymerization initiator manufactured by ADEKA. Starter, photocationic polymerization initiator manufactured by 3M, photocationic polymerization initiator manufactured by BASF, photocationic polymerization initiator manufactured by Solvay, photocationic polymerization initiator manufactured by San-Apro, etc. As the photocationic polymerization initiator manufactured by Midori Kagaku, for example, DTS-200 can be cited. As the photocationic polymerization initiator manufactured by Union Carbide, for example, UVI6990, UVI6974, etc. can be cited. Examples of the photocationic polymerization initiator manufactured by ADEKA include SP-150 and SP-170. Examples of the photocationic polymerization initiator manufactured by 3M include FC-508 and FC-512. Examples of the photocationic polymerization initiator manufactured by BASF include IRGACURE 261 and IRGACURE 290. As the photocationic polymerization initiator manufactured by Solvay, for example, PI2074 and the like can be cited. Examples of the photocationic polymerization initiator manufactured by San-Apro include CPI-100P, CPI-200K, and CPI-210S.
於上述陽離子聚合起始劑中,可較佳地使用相對陰離子為硼酸鹽系之四級銨鹽(以下,亦稱為「硼酸鹽系四級銨鹽」)。 上述硼酸鹽系四級銨鹽之相對陰離子較佳為BF4 - 或(BX4 )-(其中,X表示經至少2個以上之氟或三氟甲基取代之苯基)。Among the above-mentioned cationic polymerization initiators, a quaternary ammonium salt whose relative anion is a borate type (hereinafter, also referred to as "borate-based quaternary ammonium salt") can be preferably used. The relative anion of the above-mentioned borate-based quaternary ammonium salt is preferably BF 4 - or (BX 4 )- (where X represents a phenyl group substituted with at least two fluorine or trifluoromethyl groups).
上述陽離子聚合起始劑之含量相對於上述陽離子聚合性化合物100重量份,較佳下限為0.05重量份,較佳上限為10重量份。藉由上述陽離子聚合起始劑之含量為該範圍,所得之有機EL顯示元件用密封劑之硬化性、保存穩定性、及硬化物之耐濕性更優異。上述陽離子聚合起始劑之含量之更佳下限為0.1重量份,更佳上限為5重量份。The content of the cationic polymerization initiator is preferably 0.05 parts by weight in the lower limit and 10 parts by weight in the upper limit with respect to 100 parts by weight of the cationically polymerizable compound. When the content of the cationic polymerization initiator is within this range, the resulting sealant for an organic EL display element has more excellent curability, storage stability, and moisture resistance of the cured product. The lower limit of the content of the cationic polymerization initiator is more preferably 0.1 parts by weight, and the upper limit is more preferably 5 parts by weight.
本發明之有機EL顯示元件用密封劑可含有熱硬化劑。 作為上述熱硬化劑,例如可列舉:醯肼化合物、咪唑衍生物、酸酐、二氰二胺、胍衍生物、改質脂肪族聚胺、各種胺與環氧樹脂之加成產物等。 作為上述醯肼化合物,例如可列舉:1,3-雙(肼基羰乙基)-5-異丙基乙內醯脲、癸二醯肼、間苯二甲醯肼、己二醯肼、丙二醯肼等。 作為上述咪唑衍生物,例如可列舉:1-氰基乙基-2-苯基咪唑、N-(2-(2-甲基-1-咪唑基)乙基)脲、2,4-二胺基-6-(2'-甲基咪唑基-(1'))-乙基-對稱三、N,N'-雙(2-甲基-1-咪唑基乙基)脲、N,N'-(2-甲基-1-咪唑基乙基)-己二醯胺、2-苯基-4-甲基-5-羥基甲基咪唑、2-苯基-4,5-二羥基甲基咪唑等。 作為上述酸酐,例如可列舉:四氫鄰苯二甲酸酐、乙二醇雙(脫水偏苯三酸酯)等。 該等熱硬化劑可單獨使用,亦可組合2種以上而使用。The sealing agent for organic EL display elements of the present invention may contain a thermosetting agent. Examples of the thermosetting agent include hydrazine compounds, imidazole derivatives, acid anhydrides, dicyandiamine, guanidine derivatives, modified aliphatic polyamines, and addition products of various amines and epoxy resins. As the above-mentioned hydrazine compound, for example, 1,3-bis(hydrazinocarbonylethyl)-5-isopropylhydantoin, sebacic hydrazine, isophthalic hydrazine, hexadihydrazine, Malondihydrazine and so on. Examples of the imidazole derivatives include 1-cyanoethyl-2-phenylimidazole, N-(2-(2-methyl-1-imidazolyl)ethyl)urea, and 2,4-diamine Base-6-(2'-Methylimidazolyl-(1'))-ethyl-symmetric three , N,N'-bis(2-methyl-1-imidazolylethyl)urea, N,N'-(2-methyl-1-imidazolylethyl)-hexamethylenediamide, 2-phenyl -4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, etc. As said acid anhydride, tetrahydrophthalic anhydride, ethylene glycol bis (dehydrated trimellitate), etc. are mentioned, for example. These thermosetting agents may be used alone or in combination of two or more kinds.
作為上述熱硬化劑中之市售者,例如可列舉:大塚化學公司製造之熱硬化劑、Ajinomoto Fine-Techno公司製造之熱硬化劑等。 作為上述大塚化學公司製造之熱硬化劑,例如可列舉SDH、ADH等。 作為上述Ajinomoto Fine-Techno公司製造之熱硬化劑,例如可列舉:Amicure VDH、Amicure VDH-J、Amicure UDH等。As a commercially available one among the above-mentioned thermosetting agents, for example, a thermosetting agent manufactured by Otsuka Chemical Co., Ltd., a thermosetting agent manufactured by Ajinomoto Fine-Techno, etc. can be cited. Examples of the thermosetting agent manufactured by the above-mentioned Otsuka Chemical Co., Ltd. include SDH, ADH, and the like. Examples of the thermosetting agent manufactured by Ajinomoto Fine-Techno include Amicure VDH, Amicure VDH-J, and Amicure UDH.
上述熱硬化劑之含量相對於上述陽離子聚合性化合物100重量份,較佳下限為0.5重量份,較佳上限為30重量份。藉由上述熱硬化劑之含量為0.5重量份以上,所得之有機EL顯示元件用密封劑之熱硬化性更優異。藉由上述熱硬化劑之含量為30重量份以下,所得之有機EL顯示元件用密封劑之保存穩定性更優異,且硬化物之耐濕性更優異。上述熱硬化劑之含量之更佳下限為1重量份,更佳上限為15重量份。The content of the thermosetting agent is preferably 0.5 parts by weight in the lower limit and 30 parts by weight in the upper limit with respect to 100 parts by weight of the cationically polymerizable compound. When the content of the thermosetting agent is 0.5 parts by weight or more, the resulting sealant for an organic EL display element has more excellent thermosetting properties. When the content of the thermosetting agent is 30 parts by weight or less, the resulting sealant for an organic EL display device has more excellent storage stability, and the cured product has more excellent moisture resistance. The lower limit of the content of the thermal hardening agent is more preferably 1 part by weight, and the upper limit is more preferably 15 parts by weight.
本發明之有機EL顯示元件用密封劑較佳為含有穩定劑。藉由含有上述穩定劑,本發明之有機EL顯示元件用密封劑之保存穩定性更優異。The sealing agent for organic EL display elements of the present invention preferably contains a stabilizer. By containing the above-mentioned stabilizer, the sealing agent for an organic EL display element of the present invention is more excellent in storage stability.
作為上述穩定劑,可較佳地使用芳香族胺化合物。 作為上述芳香族胺化合物,例如可列舉苄胺、胺基苯酚型環氧樹脂等。 作為上述胺基苯酚型環氧樹脂,可列舉三環氧丙基對胺基苯酚等。 其中較佳為苄胺。 該等穩定劑可單獨使用,亦可組合2種以上而使用。As the aforementioned stabilizer, aromatic amine compounds can be preferably used. As said aromatic amine compound, benzylamine, aminophenol type epoxy resin, etc. are mentioned, for example. As said aminophenol type epoxy resin, triglycidyl p-aminophenol etc. are mentioned. Among them, benzylamine is preferred. These stabilizers may be used alone or in combination of two or more kinds.
上述穩定劑之含量相對於上述陽離子聚合性化合物100重量份,較佳下限為0.001重量份,較佳上限為2重量份。藉由上述穩定劑之含量為該範圍,所得之有機EL顯示元件用密封劑維持優異之硬化性,且保存穩定性更優異。上述穩定劑之含量之更佳下限為0.005重量份,更佳上限為1重量份。With respect to 100 parts by weight of the cationically polymerizable compound, the content of the stabilizer preferably has a lower limit of 0.001 parts by weight and a preferably upper limit of 2 parts by weight. When the content of the stabilizer is in this range, the resulting sealant for an organic EL display element maintains excellent curability and has more excellent storage stability. The lower limit of the content of the stabilizer is more preferably 0.005 part by weight, and the upper limit is more preferably 1 part by weight.
本發明之有機EL顯示元件用密封劑可含有矽烷偶合劑。上述矽烷偶合劑具有提高本發明之有機EL顯示元件用密封劑與基板等之接著性的作用。The sealing agent for organic EL display elements of the present invention may contain a silane coupling agent. The above-mentioned silane coupling agent has a function of improving the adhesiveness of the sealing agent for organic EL display elements of the present invention to a substrate or the like.
作為上述矽烷偶合劑,例如可列舉:3-胺基丙基三甲氧基矽烷、3-巰基丙基三甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-異氰酸基丙基三甲氧基矽烷等。該等矽烷偶合劑可單獨使用,亦可組合2種以上而使用。Examples of the above-mentioned silane coupling agent include: 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanate Group propyl trimethoxysilane and so on. These silane coupling agents may be used alone or in combination of two or more kinds.
上述矽烷偶合劑之含量相對於上述陽離子聚合性化合物100重量份,較佳下限為0.1重量份,較佳上限為10重量份。藉由上述矽烷偶合劑之含量為該範圍,抑制剩餘矽烷偶合劑滲出,且提高接著性之效果更優異。上述矽烷偶合劑之含量之更佳下限為0.5重量份,更佳上限為5重量份。 又,就低釋氣性之觀點而言,上述矽烷偶合劑之含量相對於上述陽離子聚合性化合物100重量份,較佳上限為0.5重量份,更佳上限為0.1重量份,進而較佳上限為0.01重量份。The content of the silane coupling agent relative to 100 parts by weight of the cationic polymerizable compound has a preferred lower limit of 0.1 parts by weight and a preferred upper limit of 10 parts by weight. When the content of the silane coupling agent is in this range, the effect of suppressing the exudation of the excess silane coupling agent and improving the adhesion is more excellent. The lower limit of the content of the silane coupling agent is more preferably 0.5 parts by weight, and the upper limit is more preferably 5 parts by weight. In addition, from the viewpoint of low outgassing properties, the content of the silane coupling agent relative to 100 parts by weight of the cationically polymerizable compound has a preferred upper limit of 0.5 parts by weight, a more preferred upper limit of 0.1 parts by weight, and a more preferred upper limit of 0.01 parts by weight.
本發明之有機EL顯示元件用密封劑於無損本發明之目的之範圍內,可進而含有表面改質劑。藉由含有上述表面改質劑,可提高本發明之有機EL顯示元件用密封劑之塗膜之平坦性。 作為上述表面改質劑,例如可列舉界面活性劑或調平劑等。The sealing agent for organic EL display elements of the present invention may further contain a surface modifier within the range that does not impair the purpose of the present invention. By containing the above-mentioned surface modifier, the flatness of the coating film of the sealing agent for organic EL display elements of the present invention can be improved. As said surface modifier, surfactant, a leveling agent, etc. are mentioned, for example.
作為上述表面改質劑,例如可列舉聚矽氧系、丙烯酸系、氟系等者。 作為上述表面改質劑中之市售者,例如可列舉:BYK-Chemie Japan公司製造之表面改質劑、AGC Seimi Chemical公司製造之表面改質劑等。 作為上述BYK-Chemie Japan公司製造之表面改質劑,例如可列舉BYK-330、BYK-340、BYK-345等。 作為上述AGC Seimi Chemical公司製造之表面改質劑,例如可列舉Surflon S-611等。Examples of the above-mentioned surface modifier include silicone-based, acrylic-based, fluorine-based, and the like. As a commercially available one among the above-mentioned surface modifiers, for example, a surface modifier manufactured by BYK-Chemie Japan, a surface modifier manufactured by AGC Seimi Chemical, etc. can be cited. Examples of the surface modifier manufactured by BYK-Chemie Japan include BYK-330, BYK-340, BYK-345, and the like. As the surface modifier manufactured by AGC Seimi Chemical, for example, Surflon S-611 and the like can be cited.
本發明之有機EL顯示元件用密封劑於無損本發明之目的之範圍內,為了提高元件電極之耐久性,可含有與有機EL顯示元件用密封劑中所產生之酸反應的化合物或離子交換樹脂。The sealing agent for an organic EL display element of the present invention may contain a compound or ion exchange resin that reacts with the acid generated in the sealing agent for an organic EL display element in order to improve the durability of the element electrode within the range that does not impair the purpose of the present invention. .
作為上述與所產生之酸反應之化合物,可列舉與酸中和之物質、例如鹼金屬之碳酸鹽或碳酸氫鹽、或者鹼土金屬之碳酸鹽或碳酸氫鹽等。具體而言,例如可使用碳酸鈣、碳酸氫鈣、碳酸鈉、碳酸氫鈉等。As the above-mentioned compound that reacts with the generated acid, a substance neutralized with an acid, for example, a carbonate or bicarbonate of an alkali metal, or a carbonate or bicarbonate of an alkaline earth metal, etc. may be mentioned. Specifically, for example, calcium carbonate, calcium hydrogen carbonate, sodium carbonate, sodium hydrogen carbonate, etc. can be used.
作為上述離子交換樹脂,可使用陽離子交換型、陰離子交換型、兩離子交換型中之任一種,尤佳為可吸附氯化物離子之陽離子交換型或兩離子交換型。As the above-mentioned ion exchange resin, any of a cation exchange type, an anion exchange type, and a two-ion exchange type can be used, and a cation exchange type or two-ion exchange type capable of adsorbing chloride ions is particularly preferable.
本發明之有機EL顯示元件用密封劑為了調整黏度等,可含有溶劑,但有產生因殘留之溶劑而有機發光材料層劣化或產生釋氣等問題之虞,因此較佳為不含溶劑,或溶劑之含量為0.05重量%以下。The sealant for an organic EL display element of the present invention may contain a solvent in order to adjust viscosity, etc. However, it may cause problems such as deterioration of the organic light-emitting material layer or outgassing due to the remaining solvent, so it is preferably free of solvent, or The content of the solvent is 0.05% by weight or less.
又,本發明之有機EL顯示元件用密封劑可視需要含有硬化延遲劑、補強劑、軟化劑、塑化劑、黏度調整劑、紫外線吸收劑、抗氧化劑等公知之各種添加劑。In addition, the sealant for organic EL display elements of the present invention may optionally contain various known additives such as curing retarders, reinforcing agents, softeners, plasticizers, viscosity modifiers, ultraviolet absorbers, and antioxidants.
本發明之有機EL顯示元件用密封劑使用E型黏度計於25℃、2.5 rpm之條件下所測得之黏度之較佳上限為2000 mPa・s。藉由上述黏度為2000 mPa・s以下,所得之有機EL顯示元件用密封劑之塗佈性優異。上述黏度之更佳上限為1500 mPa・s,進而較佳上限為1000 mPa・s。 又,上述黏度之較佳下限為10 mPa・s。 上述黏度例如可使用VISCOMETER TV-22(東機產業公司製造)作為E型黏度計,於CP1之錐板上進行測定。The sealant for the organic EL display device of the present invention uses an E-type viscometer to measure the viscosity under the conditions of 25° C. and 2.5 rpm. The preferable upper limit of the viscosity is 2000 mPa·s. With the above viscosity being 2000 mPa·s or less, the resulting sealant for organic EL display devices has excellent coatability. The more preferable upper limit of the aforementioned viscosity is 1500 mPa·s, and the more preferable upper limit is 1000 mPa·s. In addition, a preferable lower limit of the aforementioned viscosity is 10 mPa·s. The above-mentioned viscosity can be measured on the cone plate of CP1 using VISCOMETER TV-22 (manufactured by Toki Sangyo Co., Ltd.) as an E-type viscometer, for example.
本發明之有機EL顯示元件用密封劑之硬化物於25℃之鈉D線之折射率之較佳下限為1.55。藉由上述折射率為該範圍,與電極或鈍化膜之折射率差較小,結果所得之有機EL顯示元件之光萃取效率優異。上述折射率之更佳下限為1.56。 上述「鈉D線之折射率」可使用阿貝式折射率計進行測定。 又,作為測定上述折射率之硬化物,例如可使用長度20 mm、寬度10 mm、厚度0.5~1 mm左右之測定片。測定上述折射率之硬化物若為熱硬化性密封劑,則可藉由於100℃加熱30分鐘而獲得,若為光熱硬化性密封劑,則可藉由於照射2000 mJ/cm2 左右之紫外線後於100℃加熱30分鐘而獲得。The preferred lower limit of the refractive index of the sodium D-line at 25°C of the cured product of the sealing agent for the organic EL display element of the present invention is 1.55. Since the refractive index is in this range, the refractive index difference with the electrode or the passivation film is small, and as a result, the obtained organic EL display device has excellent light extraction efficiency. A more preferable lower limit of the aforementioned refractive index is 1.56. The above-mentioned "refractive index of sodium D line" can be measured using an Abbe refractometer. In addition, as a cured product for measuring the aforementioned refractive index, for example, a measuring piece having a length of 20 mm, a width of 10 mm, and a thickness of about 0.5 to 1 mm can be used. If the cured product for measuring the above refractive index is a thermosetting sealant, it can be obtained by heating at 100°C for 30 minutes. If it is a photothermal curing sealant, it can be obtained by irradiating ultraviolet rays of about 2000 mJ/cm 2 It is obtained by heating at 100°C for 30 minutes.
本發明之有機EL顯示元件用密封劑可尤佳地用作被覆具有有機發光材料層之積層體而進行密封之面內密封劑。 又,本發明之有機EL顯示元件用密封劑可較佳地用於頂部發光型有機EL顯示元件之密封。The sealant for an organic EL display element of the present invention can be particularly preferably used as an in-plane sealant for coating and sealing a laminate having an organic light-emitting material layer. In addition, the sealing agent for organic EL display elements of the present invention can be preferably used for sealing top emission type organic EL display elements.
作為使用本發明之有機EL顯示元件用密封劑來密封有機EL顯示元件之方法,例如可列舉具有如下步驟之方法等:於有機EL顯示元件基板面,藉由印刷、點膠法或噴墨法等,將本發明之有機EL顯示元件用密封劑塗佈於基材;及藉由加熱及/或光照射使所塗佈之有機EL顯示元件用密封劑硬化。As a method of sealing an organic EL display element using the sealant for an organic EL display element of the present invention, for example, a method having the following steps: on the surface of the organic EL display element substrate, by printing, dispensing, or inkjet Etc., apply the sealant for an organic EL display element of the present invention to a substrate; and harden the applied sealant for an organic EL display element by heating and/or light irradiation.
於將本發明之有機EL顯示元件用密封劑塗佈於基材之步驟中,本發明之有機EL顯示元件用密封劑可塗佈於基材之整面,亦可塗佈於基材之一部分。作為藉由塗佈所形成之本發明之有機EL顯示元件用密封劑之密封部之形狀,只要為能夠自外部大氣保護具有有機發光材料層之積層體之形狀,則並無特別限定,可為完全被覆該積層體之形狀,亦可於該積層體之周邊部形成封閉圖案,亦可於該積層體之周邊部形成一部分設有開口部之形狀之圖案。In the step of applying the sealant for organic EL display elements of the present invention to a substrate, the sealant for organic EL display elements of the present invention may be applied to the entire surface of the substrate, or may be applied to a part of the substrate . The shape of the sealing portion of the sealant for organic EL display elements of the present invention formed by coating is not particularly limited as long as it is a shape that can protect the laminate having the organic light-emitting material layer from the outside atmosphere. To completely cover the shape of the laminated body, a closed pattern may be formed on the periphery of the laminated body, or a pattern of a shape with a part of openings may be formed on the periphery of the laminated body.
於藉由加熱使上述有機EL顯示元件用密封劑硬化之情形時,就減少對具有有機發光材料層之積層體之損壞,並且使之充分地硬化之觀點而言,較佳為於50℃以上且120℃以下進行加熱。When the sealing agent for organic EL display elements is cured by heating, from the viewpoint of reducing damage to the laminate having the organic light-emitting material layer and curing it sufficiently, it is preferably at least 50°C And heating is performed below 120°C.
於藉由光照射使本發明之有機EL顯示元件用密封劑硬化之情形時,本發明之有機EL顯示元件用密封劑可藉由照射300 nm以上且400 nm以下之波長及300 mJ/cm2 以上且3000 mJ/cm2 以下之累計光量之光,而使之較佳地硬化。When the sealant for organic EL display elements of the present invention is cured by light irradiation, the sealant for organic EL display elements of the present invention can be irradiated with a wavelength of 300 nm or more and 400 nm or less and 300 mJ/cm 2 The light with the cumulative amount of light above and below 3000 mJ/cm 2 makes it better hardened.
作為用於上述光照射之光源,例如可列舉:低壓水銀燈、中壓水銀燈、高壓水銀燈、超高壓水銀燈、準分子雷射、化學燈、黑光燈、微波激發水銀燈、金屬鹵化物燈、鈉燈、鹵素燈、氙氣燈、LED燈、螢光燈、太陽光、電子束照射裝置等。該等光源可單獨使用,亦可併用2種以上。 該等光源根據上述光陽離子聚合起始劑之吸收波長來適當選擇。As the light source for the above light irradiation, for example, low pressure mercury lamp, medium pressure mercury lamp, high pressure mercury lamp, ultra high pressure mercury lamp, excimer laser, chemical lamp, black light lamp, microwave excited mercury lamp, metal halide lamp, sodium lamp, halogen Lamps, xenon lamps, LED lamps, fluorescent lamps, sunlight, electron beam irradiation devices, etc. These light sources may be used alone, or two or more types may be used in combination. The light sources are appropriately selected according to the absorption wavelength of the aforementioned photocationic polymerization initiator.
作為對本發明之有機EL顯示元件用密封劑照射光之手段,例如可列舉各種光源之同時照射、間隔時間差之逐次照射、同時照射與逐次照射之組合照射等,可使用任一照射手段。As means for irradiating the sealing agent for organic EL display element of the present invention with light, for example, simultaneous irradiation of various light sources, sequential irradiation with an interval time difference, combined irradiation of simultaneous irradiation and sequential irradiation, etc. can be used. Any irradiation means can be used.
利用藉由加熱及/或光照射使上述有機EL顯示元件用密封劑硬化之步驟所得之硬化物可進而經無機材料膜被覆。 作為構成上述無機材料膜之無機材料,可使用以往公知者,例如可列舉氮化矽(SiNx )或氧化矽(SiOx )等。上述無機材料膜可為1層,亦可為積層複數層而成者。又,可使上述無機材料膜與由本發明之有機EL顯示元件用密封劑所構成之樹脂膜交替重複而被覆上述積層體。The cured product obtained by the step of curing the above-mentioned sealant for an organic EL display element by heating and/or light irradiation can be further coated with an inorganic material film. As the inorganic material constituting the above-mentioned inorganic material film, conventionally known materials can be used, and examples thereof include silicon nitride (SiN x ) or silicon oxide (SiO x ). The above-mentioned inorganic material film may be one layer, or a plurality of layers may be laminated. In addition, the above-mentioned inorganic material film and the resin film composed of the sealing agent for an organic EL display element of the present invention may be alternately repeated to cover the above-mentioned laminate.
製造上述有機EL顯示元件之方法可具有將塗佈有本發明之有機EL顯示元件用密封劑之基材(以下,亦稱為「一基材」)與另一基材貼合之步驟。 塗佈本發明之有機EL顯示元件用密封劑之基材(以下,亦稱為「一基材」)可為形成有具有有機發光材料層之積層體之基材,亦可為未形成有該積層體之基材。 於上述一基材為未形成有上述積層體之基材之情形時,只要於貼合上述另一基材時,以可自外部大氣保護上述積層體之方式將本發明之有機EL顯示元件用密封劑塗佈於上述一基材即可。即,可於貼合另一基材時將密封劑整面地塗佈於成為上述積層體之位置之場所,或於貼合另一基材時將封閉圖案之密封劑部形成為完全容納成為上述積層體之位置之場所的形狀。 又,作為密封上述有機EL顯示元件之方法,可使用所謂攔壩填充密封之方法。即,可使用如下方法:首先,於有機EL顯示元件之基板上,以包圍顯示部之周緣之方式塗佈硬化性漿料;其次,於所塗佈之硬化性漿料之內側塗佈本發明之有機EL顯示元件用密封劑,一面利用周緣之硬化性漿料防止密封劑之溢出,一面貼合對向之密封基板;其後,藉由加熱及/或光照射使周緣之硬化性漿料與擴散至內側之本發明之有機EL顯示元件用密封劑硬化。The method of manufacturing the above-mentioned organic EL display element may have a step of bonding a substrate coated with the sealing agent for an organic EL display element of the present invention (hereinafter, also referred to as "a substrate") and another substrate. The substrate on which the sealing agent for organic EL display elements of the present invention is applied (hereinafter, also referred to as "a substrate") may be a substrate on which a laminate having an organic light-emitting material layer is formed, or may not be formed on The base material of the laminate. When the one substrate is a substrate on which the laminate is not formed, the organic EL display element of the present invention is used for the organic EL display element of the present invention as long as the other substrate is bonded to protect the laminate from the outside atmosphere. The sealant may be applied to the above-mentioned one substrate. That is, when bonding another substrate, the sealant can be applied to the entire surface of the place that becomes the position of the laminate, or when bonding another substrate, the sealant part of the closed pattern can be formed so as to be completely contained. The shape of the location of the above-mentioned layered body. In addition, as a method of sealing the above-mentioned organic EL display element, a method of so-called dam filling sealing can be used. That is, the following method can be used: firstly, on the substrate of the organic EL display element, the curable paste is applied so as to surround the periphery of the display part; secondly, the present invention is applied to the inner side of the applied curable paste The sealant for organic EL display devices uses the curable paste on the periphery to prevent the sealant from overflowing, and the other side is attached to the opposite sealing substrate; then, the curable paste on the periphery is made by heating and/or light irradiation. The sealant for the organic EL display element of the present invention that has spread to the inside is hardened.
藉由加熱及/或光照射使上述有機EL顯示元件用密封劑硬化之步驟可於貼合上述一基材與上述另一基材之步驟之前進行,亦可於貼合上述一基材與上述另一基材之步驟之後進行。 於貼合上述一基材與上述另一基材之步驟之前進行藉由加熱及/或光照射使上述有機EL顯示元件用密封劑硬化之步驟的情形時,本發明之有機EL顯示元件用密封劑較佳為自進行加熱及/或光照射至進行硬化反應而無法接著之適用時間為1分鐘以上。藉由上述適用時間為1分鐘以上,於貼合上述一基材與上述另一基材之前,不會過度進行硬化,可獲得更高之接著強度。The step of curing the above-mentioned organic EL display device sealant by heating and/or light irradiation may be performed before the step of bonding the above-mentioned one substrate and the above-mentioned another substrate, or may be performed after bonding the above-mentioned one substrate and the above-mentioned substrate. The step of another substrate is carried out afterwards. When the step of curing the above-mentioned organic EL display device sealing agent by heating and/or light irradiation is performed before the step of laminating the above-mentioned one substrate and the above-mentioned another substrate, the sealing agent for the organic EL display device of the present invention is It is preferable that the application time from heating and/or light irradiation to the hardening reaction and failure to adhere to the agent is 1 minute or more. By the above-mentioned application time being 1 minute or more, before bonding the above-mentioned one base material and the above-mentioned another base material, it will not be over-hardened, and higher bonding strength can be obtained.
於貼合上述一基材與上述另一基材之步驟中,貼合上述一基材與上述另一基材之方法並無特別限定,較佳為於減壓環境下貼合。 上述減壓環境下之真空度之較佳下限為0.01 kPa,較佳上限為10 kPa。藉由上述減壓環境下之真空度為該範圍,由真空裝置之氣密性或真空泵之能力來達成真空狀態無需花費較長時間,從而可更有效率地去除貼合上述一基材與上述另一基材時之本發明之有機EL顯示元件用密封劑中之氣泡。 [發明之效果]In the step of bonding the one substrate and the another substrate, the method for bonding the one substrate and the another substrate is not particularly limited, and bonding is preferably performed under a reduced pressure environment. The preferred lower limit of the vacuum degree under the aforementioned reduced pressure environment is 0.01 kPa, and the preferred upper limit is 10 kPa. With the vacuum degree in the above reduced pressure environment in this range, it does not take a long time to achieve the vacuum state by the airtightness of the vacuum device or the ability of the vacuum pump, so that the bonding of the above-mentioned substrate and the above-mentioned substrate can be removed more efficiently. Bubbles in the sealing compound for organic EL display elements of the present invention when another substrate is used. [Effects of Invention]
根據本發明,可提供一種低釋氣性及塗佈性優異、且能夠獲得光萃取效率優異之有機EL顯示元件的有機EL顯示元件用密封劑。According to the present invention, it is possible to provide a sealing agent for an organic EL display element which is excellent in low outgassing properties and coating properties, and can obtain an organic EL display element having excellent light extraction efficiency.
以下列舉實施例對本發明更詳細地進行說明,但是本發明並不僅限定於該等實施例。The following examples are given to illustrate the present invention in more detail, but the present invention is not limited to these examples.
(實施例1~8、比較例1~4) 按照表1、2所記載之摻合比,使用攪拌混合機以攪拌速度2000 rpm攪拌混合各材料,藉此製作實施例1~8、比較例1~4之各有機EL顯示元件用密封劑。作為攪拌混合機,使用AR-250(Thinky公司製造)。(Examples 1 to 8, Comparative Examples 1 to 4) In accordance with the blending ratios described in Tables 1 and 2, each material was stirred and mixed with a stirring mixer at a stirring speed of 2000 rpm to produce each of the sealing agents for organic EL display elements of Examples 1 to 8 and Comparative Examples 1 to 4. As the stirring mixer, AR-250 (manufactured by Thinky) was used.
<評價> 對實施例及比較例中所得之各有機EL顯示元件用密封劑進行以下之評價。將結果示於表1、2。<Evaluation> The following evaluations were performed on each of the sealing agents for organic EL display elements obtained in the examples and comparative examples. The results are shown in Tables 1 and 2.
(1)黏度 對實施例及比較例中所得之各有機EL顯示元件用密封劑,使用E型黏度計,測定25℃、2.5 rpm之條件下之黏度。作為E型黏度計,使用VISCOMETER TV-22(東機產業公司製造)。(1) Viscosity For each organic EL display device sealant obtained in the Examples and Comparative Examples, the viscosity under the conditions of 25° C. and 2.5 rpm was measured using an E-type viscometer. As the E-type viscometer, VISCOMETER TV-22 (manufactured by Toki Sangyo Co., Ltd.) was used.
(2)塗佈性 對於實施例及比較例中所得之各有機EL顯示元件用密封劑100重量份,加入平均粒徑10 μm之聚合物小珠0.3重量份,利用行星式攪拌裝置使之均勻地分散。作為聚合物小珠,使用Micropearl SP(積水化學工業公司製造)。準備2片長度5 cm、寬度5 cm之玻璃基板,將所得之分散液0.1 mL放置於一玻璃基板之中央部,測定30秒後擴散之直徑。 將該直徑為5.5 mm以上之情形記為「◎」,將5.0 mm以上且未達5.5 mm之情形記為「○」,將4.5 mm以上且未達5.0 mm之情形記為「△」,將未達4.5 mm之情形記為「×」,評價塗佈性。(2) Coatability To 100 parts by weight of each organic EL display device sealant obtained in the Examples and Comparative Examples, 0.3 parts by weight of polymer beads with an average particle diameter of 10 μm were added, and they were uniformly dispersed using a planetary stirring device. As the polymer beads, Micropearl SP (manufactured by Sekisui Chemical Co., Ltd.) was used. Prepare 2 glass substrates with a length of 5 cm and a width of 5 cm. Place 0.1 mL of the resulting dispersion on the center of a glass substrate, and measure the diameter of the diffusion after 30 seconds. If the diameter is 5.5 mm or more is marked as "◎", if the diameter is greater than 5.0 mm and less than 5.5 mm is marked as "○", if the diameter is greater than 4.5 mm and less than 5.0 mm is marked as "△", The case of less than 4.5 mm is recorded as "×", and the spreadability is evaluated.
(3)硬化性 對實施例及比較例中所得之各有機EL顯示元件用密封劑求出硬化時之反應率。 對實施例1~4、6、8及比較例1~4中所得之有機EL顯示元件用密封劑,使用示差掃描熱量測定(Hitachi High-Tech Science公司製造,「DSC6220」)進行反應熱量測定,使用下述計算式(I)算出反應率。計算式(I)中,H0 係於氮氣環境下使用鋁樣品盤,於未硬化之狀態下以升溫速率10℃/分鐘自40℃升溫至200℃時之反應熱量。又,計算式(I)中,H1 係將於100℃加熱30分鐘而硬化之有機EL顯示元件用密封劑以升溫速率10℃/分鐘自40℃升溫至200℃時之反應熱量。 (H0 -H1 )/H0 (I) 又,對實施例5及7中所得之有機EL顯示元件用密封劑,使用Photo-DSC(TA Instruments公司製造,「DSC Q100」與光源裝置「Qseries PCA」之組合),進行照射活性能量線時及升溫時之反應熱量測定,使用下述計算式(II)算出反應率。計算式(II)中,H2 係使用高壓水銀燈(無截止濾光鏡),於25℃氮氣環境下,以照度3.7 W/cm2 照射累計光量1.5 J/cm2 之活性能量線,照射後即刻以升溫速率10℃/分鐘自40℃升溫至200℃時之活性能量線照射前至升溫結束之總發熱量。上述累計光量係使用UV-351(ORC公司製造)測定波長351 nm之累計光量所得者。又,計算式(II)中,H3 係於上述條件下照射活性能量線後即刻以升溫速率20℃/分鐘升溫至100℃,於100℃保持30分鐘後,以10℃/分鐘冷卻至25℃,其後以升溫速率10℃/分鐘升溫至200℃時之「冷卻至25℃後至升溫結束至200℃」之發熱量(H3 )。 (H2 -H3 )/H2 (II) 將反應率為90%以上之情形記為「◎」,將80%以上且未達90%之情形記為「○」,將60%以上且未達80%之情形記為「△」,將未達60%之情形記為「×」,評價硬化性。(3) Curability The reaction rate at the time of curing was determined for each of the sealing agents for organic EL display elements obtained in the Examples and Comparative Examples. The sealing compounds for organic EL display elements obtained in Examples 1 to 4, 6, 8 and Comparative Examples 1 to 4 were subjected to the measurement of the reaction calorie using differential scanning calorimetry (manufactured by Hitachi High-Tech Science, "DSC6220"). The reaction rate was calculated using the following calculation formula (I). In the calculation formula (I), H 0 is the heat of reaction when the aluminum sample pan is used in a nitrogen environment and the heating rate is 10°C/min in the unhardened state from 40°C to 200°C. In addition, in the calculation formula (I), H 1 is the heat of reaction when the sealant for an organic EL display device is heated at 100° C. for 30 minutes to harden it from 40° C. to 200° C. at a heating rate of 10° C./min. (H 0- H 1 )/H 0 (I) In addition, for the organic EL display device sealing compound obtained in Examples 5 and 7, Photo-DSC (manufactured by TA Instruments, "DSC Q100" and light source device " Qseries PCA” combination), the reaction calorie is measured when irradiated with active energy rays and when the temperature is raised, and the reaction rate is calculated using the following calculation formula (II). In the calculation formula (II), H 2 uses a high-pressure mercury lamp (without cut-off filter), irradiates an active energy line of 1.5 J/cm 2 with an illuminance of 3.7 W/cm 2 under a nitrogen environment at 25°C. After irradiation Immediately use the heating rate of 10°C/min from 40°C to 200°C for the total calorific value before the active energy ray is irradiated to the end of the temperature rise. The above-mentioned cumulative light quantity is obtained by measuring the cumulative light quantity with a wavelength of 351 nm using UV-351 (manufactured by ORC). In addition, in the calculation formula (II), H 3 is irradiated with active energy rays under the above-mentioned conditions and immediately raised to 100°C at a heating rate of 20°C/min, kept at 100°C for 30 minutes, and then cooled to 25°C at 10°C/min. ℃, and then heating up to 200℃ at a heating rate of 10℃/min after cooling to 25℃ to 200℃ at the end of heating (H 3 ). (H 2 -H 3 )/H 2 (II) If the reaction rate is more than 90%, mark it as "◎", if it is over 80% and less than 90%, mark it as "○", and mark it as 60% or more and The case of less than 80% is recorded as "△", the case of less than 60% is recorded as "×", and the hardening property is evaluated.
(4)折射率及光萃取效率 將厚度1 mm之聚矽氧橡膠片打穿為長度20 mm、寬度10 mm之長方形,製作模具。將該模具置於脫模PET膜上,向模具中填充實施例及比較例中所得之各有機EL顯示元件用密封劑後,以不殘留氣泡之方式將另一片脫模PET膜進行覆蓋,從而獲得積層體。將所得之積層體夾於2片玻璃板之間並加以固定,使密封劑硬化。對實施例1~4、6、8及比較例1~4中所得之有機EL顯示元件用密封劑,於100℃加熱30分鐘而使之硬化,對實施例5及7中所得之有機EL顯示元件用密封劑,使用UV-LED照射1500 mJ/cm2 之波長365 nm之紫外線後,於90℃加熱30分鐘使之硬化。其後,剝離PET膜,自聚矽氧橡膠片取出密封劑之硬化物,獲得長度10 mm、寬度20 mm、厚度1 mm之試片。對所得之試片使用阿貝式折射率計測定於25℃之鈉D線之折射率。作為阿貝式折射率計,使用NAR-4T(Atago公司製造)。 又,考慮與電極或鈍化膜之折射率差,將折射率為1.56以上之情形記為「○」,將1.54以上且未達1.56之情形記為「△」,將未達1.54之情形記為「×」,評價光萃取效率。(4) Refractive index and light extraction efficiency The polysiloxane rubber sheet with a thickness of 1 mm is punched into a rectangle with a length of 20 mm and a width of 10 mm to make a mold. The mold was placed on a release PET film, and after each organic EL display device sealant obtained in the examples and comparative examples was filled in the mold, another release PET film was covered so that no air bubbles remained. Obtain a laminated body. The obtained laminate is sandwiched between two glass plates and fixed to harden the sealant. The sealants for organic EL display elements obtained in Examples 1 to 4, 6, 8 and Comparative Examples 1 to 4 were heated at 100°C for 30 minutes to harden, and the organic EL display obtained in Examples 5 and 7 was displayed The sealant for components is cured by irradiating 1500 mJ/cm 2 of ultraviolet rays with a wavelength of 365 nm with a UV-LED, and then heating it at 90°C for 30 minutes. After that, the PET film was peeled off, and the cured product of the sealant was taken out from the silicone rubber sheet to obtain a test piece with a length of 10 mm, a width of 20 mm, and a thickness of 1 mm. The obtained test piece was used to measure the refractive index of the sodium D-line at 25° C. using an Abbe refractometer. As the Abbe refractometer, NAR-4T (manufactured by Atago Corporation) was used. In addition, considering the difference in refractive index with the electrode or the passivation film, the case where the refractive index is 1.56 or higher is marked as "○", the case where the refractive index is higher than 1.54 and less than 1.56 is marked as "△", and the case less than 1.54 is recorded as "×", evaluate the light extraction efficiency.
(5)低釋氣性 將實施例及比較例中所得之各有機EL顯示元件用密封劑稱量300 mg,封入至小玻璃瓶中後使之硬化。對實施例1~4、6、8及比較例1~4中所得之有機EL顯示元件用密封劑,於100℃加熱30分鐘使之硬化,對實施例5及7中所得之有機EL顯示元件用密封劑,使用UV-LED照射1500 mJ/cm2 之波長365 nm之紫外線後,於90℃加熱30分鐘使之硬化。進而,將該小玻璃瓶於85℃之恆溫烘箱中加熱100小時,使用氣相層析質譜分析儀測定小玻璃瓶中之氣化成分量。作為氣相層析質譜分析儀,使用JMS-Q1050(日本電子公司製造)。 將氣化成分量未達50 ppm之情形記為「○」,將50 ppm以上且未達100 ppm之情形記為「△」,將100 ppm以上之情形記為「×」,評價低釋氣性。(5) Low outgassing. Weigh 300 mg of each organic EL display device sealant obtained in the Examples and Comparative Examples, and seal them in a small glass bottle to harden them. The sealants for organic EL display elements obtained in Examples 1 to 4, 6, 8 and Comparative Examples 1 to 4 were cured by heating at 100°C for 30 minutes, and the organic EL display elements obtained in Examples 5 and 7 Use the sealant to irradiate 1500 mJ/cm 2 of 365 nm ultraviolet rays with a UV-LED, and then heat it at 90°C for 30 minutes to harden it. Furthermore, the vial was heated in a constant temperature oven at 85°C for 100 hours, and the amount of vaporized components in the vial was measured using a gas chromatography mass spectrometer. As a gas chromatography mass spectrometer, JMS-Q1050 (manufactured by JEOL Ltd.) was used. If the amount of vaporized components is less than 50 ppm, mark it as "○", if it is more than 50 ppm and less than 100 ppm, mark it as "△", and if it is 100 ppm or more, mark it as "×" to evaluate low outgassing. .
[表1]
[表2]
根據本發明,可提供一種低釋氣性及塗佈性優異、且能夠獲得光萃取效率優異之有機EL顯示元件的有機EL顯示元件用密封劑。According to the present invention, it is possible to provide a sealing agent for an organic EL display element which is excellent in low outgassing properties and coating properties, and can obtain an organic EL display element having excellent light extraction efficiency.
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