TW201528413A - Batch type apparatus for processing substrate - Google Patents

Abstract

The present invention discloses a batch type apparatus for processing substrate. The batch type apparatus for processing substrate of the present invention is a batch type apparatus for processing substrate used for processing a plurality of substrates, which is characterized by comprising a main body and a door unit. The main body has a chamber for providing a substrate processing space. The chamber has a plurality of grooves for loading/unloading the plurality of substrates. The door unit is arranged in front of the main body to open/close at least one groove.

Description

Batch type substrate processing device Field of invention

The present invention relates to a batch type substrate processing apparatus, and more particularly to a substrate processing by minimizing heat loss inside a chamber by individually opening and closing a groove through a door unit disposed in front of the body. A batch type substrate processing apparatus with improved efficiency of a process.

Background of the invention

The substrate processing apparatus is generally classified into a vapor deposition (Vapor Deposition) apparatus and an annealing (Annealing) apparatus when manufacturing a flat panel display, a semiconductor, a solar cell, or the like.

The vapor deposition device is a device for forming a transparent conductive layer, an insulating layer, a metal layer or a germanium layer constituting a core structure of a flat panel display, and is LPCVD (Low Pressure Chemical Vapor Deposition) or PECVD (Plasma-Enhanced). Chemical Vapor Deposition: Chemical vapor deposition equipment such as chemical vapor deposition, and physical vapor deposition equipment such as sputtering.

Secondly, the annealing device is a device for improving the characteristics of the vapor deposited film after vapor deposition of the film on the substrate, in order to form a vapor deposited film. A crystallization or phase change heat treatment device.

Generally, the substrate processing has a single-substrate type for processing one substrate and a batch type for processing a plurality of substrates. The monolithic substrate processing apparatus has the advantage of being simple in structure, but has the disadvantage of reduced productivity, and therefore, mass-produced substrate processing apparatuses are often used for mass production.

Fig. 1 is a perspective view showing the structure of a conventional batch type substrate processing apparatus 10'.

As shown, the conventional batch substrate processing apparatus 10' includes a body 100' having a chamber 105' for providing a substrate processing space, a plurality of substrates (not shown) mounted on the chamber 105', and a plurality of substrates (not shown) The door unit 110' in front of the body 100'. The door unit 110' is slidable up and down, and the inlet and outlet 101' formed in front of the body 100' is opened and closed.

In the conventional batch type substrate processing apparatus 10', since only one door unit 110' is opened and closed with one inlet and outlet 101', when the inlet and outlet 101' is opened, most of the space of the chamber 105' is exposed to the outside, and the unloading process is completed. The problem that the heat inside the chamber 105' is completely lost to the outside when the substrate 50'. Even when only a few substrates have to be unloaded in the substrate processing, the gate unit 110' must be slid to open the entire inlet and outlet 101', so that the temperature inside the reduced chamber 105' is raised to the temperature required for the process. There is a problem with wasting power.

Summary of invention

The present invention has been developed to solve the above-mentioned problems, The purpose is to provide a batch type substrate processing apparatus that individually switches the tank switches to minimize heat loss from the chamber.

Further, it is an object of the present invention to provide a batch type substrate processing apparatus which is capable of improving the efficiency of a substrate processing process by heating the time inside the chamber.

In order to achieve the above object, a batch substrate processing apparatus according to an embodiment of the present invention is a batch substrate processing apparatus for processing a plurality of substrates, comprising a body and a door unit, the body having a chamber for providing a substrate processing space, The chamber has a plurality of slots for loading/unloading the plurality of substrates; the gate unit is disposed in front of the body to switch at least one of the slots.

According to the invention as constituted above, the grooves can be individually and individually switched to minimize heat loss in the chamber.

Moreover, according to the present invention, the time for heating the inside of the chamber can be shortened, and the efficiency of the substrate processing process can be improved.

10,10'‧‧‧Batch substrate processing unit

50‧‧‧Substrate

100,100’‧‧‧ Ontology

101,101’‧‧‧ entrance

105,105’‧‧‧室

110,110’, 120‧‧‧ door unit

111‧‧‧ Front entrance

112,112’‧‧‧Swing gate

113‧‧‧Axis

114‧‧‧Cylinder

121‧‧‧ main door

125‧‧‧Sub door

125a‧‧‧Upper unit sub-door

125b‧‧‧Second unit sub-door

200‧‧‧heater unit

201‧‧‧Unit heater

220‧‧‧Auxiliary heater unit

220a‧‧‧1st auxiliary heater unit

220b‧‧‧2nd auxiliary heater unit

300‧‧‧ boat

310‧‧‧Receiving station

320‧‧‧Support table

330‧‧‧Support ribs

400‧‧‧Support

410‧‧‧Support

420‧‧‧Support pins

S‧‧‧ slot

1 is a perspective view showing the structure of a conventional batch type substrate processing apparatus.

Fig. 2 is an exploded perspective view showing the structure of a batch type substrate processing apparatus according to an embodiment of the present invention.

Fig. 3 is a perspective view showing a structure in which a substrate according to an embodiment of the present invention is laminated.

Fig. 4 is a perspective view showing the structure of a heater unit according to an embodiment of the present invention.

5 and 6 are front elevational views showing the structure of a door unit according to an embodiment of the present invention.

Fig. 7 is a perspective view and a side cross-sectional view showing the structure of a door unit according to another embodiment of the present invention.

Figure 8 is a side cross-sectional view showing the operation of a door unit according to another embodiment of the present invention.

Fig. 9 is a view showing measurement of temperature changes inside a chamber of a conventional batch type substrate processing apparatus.

Fig. 10 is a view showing measurement of temperature change inside a chamber by applying a door unit according to an embodiment of the present invention.

Form for implementing the invention

The detailed description of the present invention will be described with reference to the accompanying drawings. These embodiments will be described in detail in order to enable the practitioner to fully implement the invention. It is to be understood that although the various embodiments of the invention are different from each other, they are not necessarily mutually exclusive. For example, the specific shapes, structures, and characteristics described herein may be realized in other embodiments without departing from the spirit and scope of the invention. Further, it is to be understood that the position or arrangement of the individual constituent elements in the various embodiments disclosed herein can be modified without departing from the spirit and scope of the invention. Therefore, the following detailed description is not to be taken as a limiting description, and the scope of the invention All scopes are accompanied by a request limit. In the figures, like reference numerals refer to the same or similar functions in various aspects, and the length, the area, the thickness, and the shape thereof may be exaggerated for convenience of description.

In the present specification, a substrate can be understood to include a substrate for a display device such as an LED or an LCD, a semiconductor substrate, a solar cell substrate, and the like.

Further, in the present specification, the substrate processing process can be understood to include a vapor deposition process, a heat treatment process, and the like. However, in the following, it is assumed to be a heat treatment process.

Hereinafter, a batch type substrate processing apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is an exploded perspective view showing a configuration of a batch type substrate processing apparatus 10 according to an embodiment of the present invention, FIG. 3 is a perspective view showing a structure in which a substrate 50 according to an embodiment of the present invention is laminated, and FIG. 4 is a view showing an embodiment of the present invention. A perspective view of the structure of the heater unit 200.

First, the material of the substrate 50 mounted on the batch type substrate processing apparatus 10 is not particularly limited, and a substrate 50 of a plurality of materials such as glass, plastic, polymer, or germanium wafer can be mounted. In the following, a rectangular glass substrate most commonly used for a flat panel display device will be described. The number of the substrates 50 processed by the batch type substrate processing apparatus 10 can be appropriately selected in consideration of the size of the main body 100, the size of the substrate 50, and the like.

The batch type substrate processing apparatus 10 has a body 100 that is formed into an approximately parallelepiped shape to form an appearance, and can be formed inside the body 100 as a chamber 105 for processing a space of a plurality of substrates 50. The body 100 can be The parallelepiped shape may also be formed in various shapes according to the shape of the substrate 50, and the chamber 105 may be disposed in a sealed space. The heater unit 200, the auxiliary heater unit 220, the boat 300, the holder 400, the substrate 50, the gas supply tube (not shown), the gas discharge tube (not shown), and the like may be disposed in the chamber 105, In Fig. 2, the detailed illustration is omitted.

An inlet and outlet 101 for loading/unloading the substrate 50 may be formed on the front side of the body 100. The door unit 110 of the first embodiment that can switch the inlet and outlet 101 or the door unit 120 of the second embodiment (see FIG. 7) can be provided in front of the main body 100.

The batch type substrate processing apparatus 10 of the present invention is characterized in that it includes gate units 110 and 120 disposed on the front surface of the body 100 to switch at least one groove s. Here, the groove s can be defined as a partial area of the inlet and outlet 101 or the chamber 105 in which the door units 110, 120 can be individually opened and closed. More specifically, the groove s is a region in which the substrate holder 400 in which the one substrate 50 and the substrate 50 are stably placed can be arranged, and can be understood as a space between the heater unit 200 and the adjacent heater unit 200 to be described later.

A heat reflecting plate (not shown) may be disposed on the inner side of the door units 110, 120, that is, the side facing the inside of the chamber 105. Since the door units 110 and 120 in which the inlet and outlet 101 are formed basically cause heat loss to the outside, the amount of heat loss to the outside can be reduced by providing the heat reflecting plate. In addition to the above-mentioned heat reflecting plate, other heaters (not shown) may be provided to reduce the amount of heat loss.

By individually switching the slots s by the gate units 110, 120, even if a small number of substrates 50 are unloaded during substrate processing, it is not within the chamber 105. The processing of the substrate 50 is greatly affected, and the amount of heat lost from the inside to the outside of the chamber 105 can be greatly reduced. The details will be described later with reference to FIGS. 5 to 8.

A cover (not shown) is switchably disposed behind the body 100, and can be repaired and replaced, for example, in the interior of the chamber 110, such as a boat 300, a gas supply pipe (not shown), and a gas discharge pipe (Fig. Not shown in the middle).

Referring to FIG. 3, the batch substrate processing apparatus 10 of the present invention may include a boat 300 for supporting a substrate 50 loaded in the chamber 105.

The boat 300 may have a receiving base 310 that is in contact with the bottom surface of the body 100, a support base 320 that is vertically extended from one side end of the receiving base 310, and is horizontally extended from one side of the support base 320 and formed to have each other. A plurality of support ribs 330 are stacked at intervals and above. The boat 300 is disposed in a pair of opposite pairs, and the boat 300 constituting one set may be disposed such that the support ribs 330 oppose each other.

A supporter 400 for supporting the substrate 50 to be stably placed can be mounted on each of the support ribs 330 of the boat 300. Since the holder 400 is disposed inside the chamber 105, it is preferably constituted by quartz or the like which can withstand high temperatures and has almost no change in structure when the substrate 50 is processed.

The holder 400 may have a receiving plate 410 that forms a square plate shape and a lower side portion is supported by the supporting ribs 330, and a plurality of supporting pins 420 that are disposed on the receiving plate 410 to support the lower surface of the substrate 50. The substrate 50 is supported at the upper end of the support pin 420, and the upper end portion of the support pin 420 is preferably formed to be rounded to be in point contact with the substrate 50. In this way, since the lower surface of the substrate 50 is also formed in a state of being substantially exposed as above, the substrate 50 can be uniformly processed. body.

The holders 400 supported by the support ribs 330 of the boat 300 are arranged one above the other to form parallel to each other, and the plurality of substrates 50 may be laminated in the chamber 105 with a certain interval.

Referring to Fig. 4, in order to directly heat the substrate 50, a plurality of heater units 200 disposed along the stacking direction of the substrate 50 may be disposed inside the chamber 100. In order to heat both sides of the substrate 50, the substrate 50 and the holder 400 may be disposed between the heater unit 200 and the adjacent heater unit 200. As described above, the substrate 50, the support 400, and the heater unit 200 disposed on the upper portion and the lower portion of the substrate 50 and the holder 400 may constitute one groove s.

The heater unit 200 may include a plurality of unit heaters 201 having a certain interval in parallel with the short side direction of the substrate 50. The unit heater 201 is a long cylindrical heater of a general length, and may be referred to as a unit body constituting the heater unit 200. The heating element is inserted into the quartz tube, and is transmitted through the terminals provided at both ends to withstand the application of an external power source. And let the heat happen. The unit heater 201 may be disposed from one side of the chamber 110 to the other side. The number of unit heaters 201 is not limited to FIG. 4, and can be variously changed depending on the size of the chamber 105 and the size of the substrate 50.

In addition to the heater unit 200, in order to prevent heat loss inside the chamber 100, a plurality of auxiliary heater units 220 may be provided. The auxiliary heater unit 220 may also include a plurality of unit auxiliary heaters 201 having the same configuration as the heater unit 200.

The plurality of auxiliary heater units 220 may have a first auxiliary heater unit 220a disposed in parallel with the short side direction of the substrate 50, and the substrate 50 The second auxiliary heater unit 220b is disposed in parallel with the longitudinal direction. The first auxiliary heater unit 220a may be disposed on the front surface and the rear surface of the chamber 105, in order to prevent the inlet and outlet 101 formed on the front surface of the main body 100 and the chamber 105 (not shown) formed on the rear surface of the main body 100. The internal heat loss allows the spacing of the unit auxiliary heaters 201 to be more densely arranged.

As described above, the batch type substrate processing apparatus 10 of the present invention arranges the plurality of heater units 200 so as to cover the total area of the substrate 50 housed inside the chamber 105, whereby the total area of the substrate 50 can be heated from the unit. The device 201 is heat-treated uniformly by application of heat.

In order to cool the chamber 105, a cooling pipe (not shown) may be disposed between each unit heater 201. The number of cooling tubes can be varied in accordance with the number of unit heaters 201 provided in the chamber 105. Further, the cooling tubes are not necessarily disposed between the unit heaters 201, and may be disposed only between a part of the unit heaters 201 as long as the inside of the chambers 105 can be appropriately cooled. On the other hand, instead of providing a cooling pipe, a flow path (not shown) through which the refrigerant can be moved is formed inside the rod-shaped unit heater 201, and the unit heater 201 is simultaneously used for the heater and the cooling pipe. .

By providing a cooling tube, the heat inside the chamber 110 can be conducted to the outside of the chamber 110 through the cooling tube, and after the substrate processing is finished, the inside of the chamber 110 is rapidly cooled. Since the inside of the chamber 110 is not cooled to a predetermined temperature or lower after the substrate processing is completed, the unloading operation of the substrate 50 cannot be performed, so that the operation of the cooling tube can be performed, and when the inside of the chamber 110 is rapidly cooled, the substrate can be processed. The productivity of the process is greatly improved.

Hereinafter, the junction of the door units 110 and 120 will be described with reference to FIGS. 5 to 8. Structure and action.

Fig. 5 is a front elevational view showing a door unit 110 including a plurality of swinging doors 112 in a closed state according to the first embodiment of the present invention (Fig. 5(a)), and a front view showing a state in which a part of the swinging doors 112 are opened. (Figure 5 (b).

Referring to Fig. 5(a), the door unit 110 according to the first embodiment of the present invention may have a plurality of swing gates 112 which are formed to correspond to the front surface entrance and exit 111 of the plurality of slots s and which can switch the front and front entrances and exits 111.

The door unit 110 formed with the front side entrance 111 corresponding to the size of the groove s may be disposed in front of the body 100. Since the inlet and outlet 101 of the body 100 is in contact with the front face inlet and outlet 111 of the door unit 110, the shape of the opening and exit opening 101 of the body 100 may be substantially the same as the front faceway 111 of the door unit 110. In order to close the door 101 more closely, the inlet and outlet 101 of the body 100 may be provided with a sealing member (not shown). The front and rear inlets and outlets 111 of the groove s may be tightly closed with the swinging door 112, and a sealing member may be disposed. Not shown). The material of the body 100 and the door unit 110 is preferably stainless steel, but is not limited thereto.

The swing gate 112 is swingable with respect to a predetermined axis 113, and the groove s is opened and closed. In the present specification, it is shown that the shaft 113 is coupled to the lower portion of the swinging door 112, and is coupled to the upper portion of the swinging door 112, and the upper shaft is oscillated as a reference.

The shaft 113 of the swing gate 112 is fixed to the cylinder 114 disposed at both side ends of the door unit 110 to perform a rotational motion, and the swing gate 112 is swung. Since the cylinder 114 is a cylinder that is well known for transmitting power, it can be selected without limitation, and detailed description thereof will be omitted. Also, as long as it can provide rotary power The mechanism for the shaft 113 of the swing gate 112 is not limited to the cylinder 114, and a well-known power supply mechanism such as a motor or a chain can be selected without limitation.

Referring to FIG. 5(b), any swing gate 112 of the door unit 110 can be opened to open one slot s. In FIG. 5(b), only one slot s is opened, but it is not limited thereto, and a plurality of slots s may be independently opened.

In the standby state, the interior of the chamber 105 can be raised to the temperature required for the substrate processing process, and the substrate 50 can be transferred to the support substrate 50 (not shown) by the substrate in a state where at least one groove s is opened. The tank s is placed in the chamber 105 before and after the inlet and outlet 111. Next, the swing gate 112 can be closed, and the substrate 50 is processed in a state where the groove s is closed. The same manner is also applied to the unloading of the substrate 50 after the substrate processing process is in progress or after the substrate processing process is completed.

On the other hand, referring to FIG. 6, when the equipment cost of the swing gate 112' is reduced and a large number of substrates 50 need to be processed, it is also possible to configure one swing gate 112' to open only one slot s, but to open two or two. More than one slot s. At this time, the swing gate 112' is preferably sized to switch two or more slots s. At this time, the size of the entrance and exit 111' must of course also be set to coincide with the size of the swing gate 112'.

Fig. 7 is a perspective view showing a door unit 120 including a main door 121 and a sub door 125 (Fig. 7(a)) and a side sectional view showing an operation direction of the door unit 120 according to a second embodiment of the present invention (Fig. 7(b). )).

Referring to FIGS. 7(a) and 7(b), the door unit 120 according to the second embodiment of the present invention may include a main door 121 and a sub door 125.

The main door 121 is disposed to be in front and rear directions of the body 100 The direction is slid, and the front and rear entrances and exits 101 of the body 100 can be switched. The main door 121 may be formed the same as or larger than the inlet and outlet 101, and in order to close the main door 121 and the inlet and outlet 101 tightly, a sealing member (not shown) may be provided.

The sub-door 125 is disposed to be slidable in the upper and lower directions of the body 100, and can open at least one groove s front surface and seal the remaining groove s. The sub-door 125 may have an upper unit sub-gate 125a and a lower unit sub-gate 125b that are opposed to each other. The upper unit sub-gate 125a and the lower unit sub-gate 125b are slidable in the vertical direction, and are spaced apart from each other or are in contact with each other while switching at least one groove s front surface. When the upper unit sub-gate 125a and the lower unit sub-gate 125b are spaced apart from each other, the space between the spaces can be opened and the front surface of the groove s can be opened. When the distance between the upper unit sub-gate 125a and the lower unit sub-gate 125b is equal to the height of the specific one groove s, the front surface of one groove s can be opened, which is equivalent to a specific number of grooves s. At the height of the height, the front faces of the plurality of slots s can also be opened. In order to tightly close the inlet and outlet 101, the unit sub-gate 125a, and the lower unit sub-door 125b, a sealing member (not shown) may be provided.

Fig. 8 is a side sectional view showing the operation of the door unit 120 according to the second embodiment of the present invention. 8 is a schematic description of a batch type substrate processing apparatus 10 having two slots s for convenience of explanation. The batch type substrate processing apparatus 10 having three or more slots s may also operate at least one slot s of the sub-gate 125. .

Referring to Fig. 8(a), first, the door unit 120 can close the entrance 101 and completely seal the two slots s. The main door 121 can close the entrance 101 and substantially perform the sealing of the slot s, and the sub-gate 125 can be located above and below the main door 121.

Referring to FIG. 8(b), the main door 121 slides in the front and rear directions of the body 100. That is, sliding away from the entrance 101. At the same time, the sub-gate 125 located above and below the main door 121 slides to the lower side (the upper unit sub-gate 125a) and the upper side (the lower unit sub-gate 125b) to abut, and closes the inlet and outlet 101. In other words, when the upper unit sub-gate 125a is closed, the front surface of the upper tank s can be sealed, and when the lower unit sub-gate 125b is closed, the front surface of the lower tank s can be sealed.

Referring to Fig. 8(c), in a state in which the sub-door 125 closes the inlet and outlet 101, only the upper unit sub-gate 125a slides upward and only the upper groove s is opened. Since the lower tank s is still closed by the lower unit sub-gate 125b, the airtightness can be maintained. The loading/unloading can be performed by supporting the substrate 50 by transferring the upper arm slot s, transferring the robot arm (not shown) or the like to the substrate.

On the other hand, the process of FIG. 8(b) can be omitted, and the main door 121 slides in a direction away from the inlet and outlet 101, and at the same time, only the lower unit sub-gate 125b slides upward to open only the upper groove s. Since the lower groove s is closed by sliding to the upper lower unit door 125b, the sealing can be maintained. Loading/unloading can be performed by the support substrate 50 such as a robot arm (not shown) being transferred to the substrate through the upper groove s.

Referring to Fig. 8(d), the upper unit sub-gate 125a is slidable downward to seal the upper groove s, and the lower unit sub-gate 125b is slidable downward to open only the lower groove s. Loading/unloading can be performed by transferring the support substrate 50 such as a robot arm (not shown) through the open lower groove s.

Fig. 9 is a view showing measurement of temperature change inside the chamber 105' of the conventional batch type substrate processing apparatus 10', and Fig. 10 is a view showing measurement of temperature change inside the chamber 105 by applying the gate unit 110 according to an embodiment of the present invention. data.

In the batch type substrate processing apparatus 10' of the prior art, in a state where the temperature inside the chamber 105 is maintained at 380 ° C, the front surface of the body 100' is opened, and the processed substrate 50 is unloaded, and when loaded, it is processed. In the case of the substrate 50, the temperature of the interior of the chamber 105 is at most 146 ° C.

However, in the present invention, as shown in FIG. 9, in a state where the temperature inside the chamber 105 is maintained at 400 ° C, the switch is individually performed in accordance with each of the grooves s, and the substrate 50 is unloaded/loaded, and as a result, the cavity is confirmed. The temperature before and after the interior of the chamber 105 appeared to be at most 48 °C. As a result, it was confirmed that the effect was improved by nearly three times that of the prior art.

As described above, the door units 110 and 120 of the present invention individually operate in the respective grooves s, and individually switch the respective grooves s, thereby having the advantage of minimizing the loss of heat inside the chamber 105 to the outside.

Further, since the amount of heat loss inside the chamber 105 of the present invention is reduced, the power for heating the inside of the chamber 105 is reduced, and the heating time is also shortened, so that the efficiency of the substrate processing process is improved.

The present invention has been described and illustrated by the preferred embodiments of the present invention, but is not limited to the above-described embodiments, and those skilled in the art to which the invention pertains may carry out without departing from the spirit of the invention. A variety of variations and changes. Such modifications and variations are considered to be within the scope of the invention and the scope of the appended claims.

10‧‧‧Batch type substrate processing device

100‧‧‧ body

101‧‧‧ entrances and exits

105‧‧‧ chamber

110‧‧‧door unit

111‧‧‧ Front entrance

112‧‧‧Swing gate

113‧‧‧Axis

114‧‧‧Cylinder

S‧‧‧ slot

Claims (13)

A batch substrate processing apparatus for processing a plurality of substrates, comprising: a body having a chamber for providing a substrate processing space, the chamber having a plurality of slots for loading/unloading the plurality of substrates; and a gate unit And disposed on the front surface of the body to switch at least one of the slots. The batch type substrate processing apparatus according to claim 1, wherein the gate unit has a plurality of swing gates, and each of the swing gates is provided at an entrance and exit of each of the grooves, and the groove can be opened and closed while swinging with respect to a predetermined axis. The batch type substrate processing apparatus of claim 1, wherein the door unit has a main door that is slidable in a front-back direction and an up-and-down direction of the body, and the front surface switch of the body can be disposed; and the sub-door is set to be as described above The doorway can slide in the up-and-down direction when the main door is opened, and can open at least one of the front faces of the grooves and seal the remaining front faces of the grooves. The batch type substrate processing apparatus according to claim 3, wherein the sub-door has an upper unit sub-gate and a lower unit sub-gate that are opposed to each other. The batch type substrate processing apparatus according to claim 4, wherein at least one of the front faces of the grooves is opened through a space between the upper unit sub-door and the lower unit sub-door. The batch type substrate processing apparatus of claim 1, wherein a heat reflecting plate is disposed on an inner side surface of the door unit. A batch type substrate processing apparatus according to claim 1, wherein one substrate can be loaded/unloaded in each of said grooves. The batch type substrate processing apparatus according to claim 1, comprising a plurality of heater units (the heater unit including a plurality of unit heaters) disposed at a predetermined interval along a stacking direction of the substrate, wherein the substrate is disposed in the plural Between the main heater units. A batch type substrate processing apparatus according to claim 8, further comprising a plurality of auxiliary heater units (the aforementioned auxiliary heater unit including a plurality of unit auxiliary heaters) for preventing heat loss in said chamber. The batch type substrate processing apparatus according to claim 9, wherein the plurality of auxiliary heater units have a first auxiliary heater unit disposed in parallel with a short side direction of the substrate, and are disposed in parallel with a longitudinal direction of the substrate The second auxiliary heater unit. A batch type substrate processing apparatus according to claim 8, wherein a cooling tube is disposed between the plurality of unit heaters. The batch type substrate processing apparatus according to claim 8, wherein a flow path for moving the refrigerant is formed inside the unit heater. The batch type substrate processing apparatus according to claim 1, wherein the substrate is placed on the substrate holder in a state of being stably placed on the boat disposed in the body.