TW201524730A - Nano-grade optical alignment and embossment leveling device - Google Patents

Abstract

The present invention relates to a nano-grade optical alignment and embossment leveling device, which is provided with a frame set, an alignment module, and an embossment mold set. The frame set is disposed with a base, a lifting seat and an upper frame. The alignment module is mutually combined with the frame set and disposed with an XXY alignment platform, a piezoelectric adjustment platform, an interferometer feedback set, a triangulation laser feedback set, and a mark image recognition set. The embossment module is combined with the frame set and the alignment module and disposed with an upper mold set, a lower mold set, and a standard calibration mold. when embossment is performed, the piezoelectric adjustment platform and the triangulation laser feedback set are utilized to perform leveling, making the upper and lower molds maintain parallel, so as to increase the thickness precision of the embossment product for enhancing the product quality and yield rate, thereby providing a nano-grade optical alignment and embossment leveling device which has high alignment precision and can be monitored in real time.

Description

Nano-optical alignment and imprinting leveling device

The invention relates to an optical alignment and imprinting leveling device, in particular to a nanometer optical alignment and imprinting leveling device.

At present, in the manufacturing process of alignment and embossing, mainly after aligning the upper and lower molds of a mold set, the embossing operation of the two molds is performed, wherein the upper and lower sides of the mold set are used. The mold needs to have precise alignment. Therefore, in the process of alignment, the charge-coupled device (CCD) is used to align with the mark design set on a mold set, and cooperate with image processing. Ways to improve the effectiveness and practicality of existing non-contact scanning measurements.

However, due to the low price of existing charge coupled device cameras, and sometimes it is necessary to use multiple charge coupled device cameras at the same time, and with an expensive optical lens set, the accuracy of image alignment can be improved to micron. The level will increase the cost required by the user; in addition, when the camera is captured by the charge-coupled component, it is often interfered by the light and the noise, resulting in poor resolution and accurate alignment. It is necessary to make judgments through vision, which will increase the inaccuracy in measurement. Therefore, the alignment accuracy of the system in the process of image alignment is limited to the micrometer level, and the above-mentioned alignment method cannot be used immediately. The position signal between the upper and lower molds can only provide the initial relative positional relationship between the upper and lower molds when the embossing operation is not performed.

At present, in the process of imprinting, a hydraulic bladder equalizing device is mainly used to allow pressure. The force can be evenly dispersed between the upper and lower molds, thereby achieving automatic leveling of the upper and lower molds, thereby providing a passive compensation method. However, when the angular error between the upper mold and the lower mold is too large, The axis (assuming the upper and lower molds are placed up and down in the Z-axis direction) easily causes poor parallelism between the upper and lower dies during the ascending pressure, and the parallelism between the two dies cannot be accurately controlled. Relatively increase the defect rate after product manufacturing.

In order to solve the shortcomings and shortcomings of the existing CCD image alignment device and the hydraulic capsule pressure device for the alignment and imprinting process, which are costly and susceptible to environmental influences, the research and testing have finally developed. An invention that improves upon existing deficiencies.

The main object of the present invention is to provide a nano-scale optical alignment and imprinting leveling device that is aligned by an off-axis alignment method, which is transmitted through a known corrected mark image recognition group and An interferometer feedback group returns the position signals of the upper and lower molds, and then compensates with a high-precision XXY alignment platform, so that high-precision alignment can be performed between the upper and lower molds, and the imprinting is performed. During the process, the interferometer feedback group can instantly monitor the relative position (X, Y) and angle (θ _Z ) error signals between the upper and lower molds, and use a triangular laser feedback group and a piezoelectric Adjusting the platform to instantly compensate for the height and angle changes between the upper and lower dies, effectively improving the current alignment accuracy and the problem of not being able to monitor the position of the upper and lower molds in real time.

The nano-optical alignment and embossing leveling device of the present invention is provided with a frame group, a pair of position modules and an embossing module, wherein: the frame group is provided with a base, a lifting seat and an upper frame The lifting base is combined with the base and is provided with a lifting drive group and a lifting platform. The lifting driving group is disposed at the bottom of the base, and the lifting platform is combined with the lifting driving group and located above the base The upper frame is fixedly coupled with the base and located above the lifting seat; the alignment module is combined with the frame group and is provided with an XXY alignment platform, a piezoelectric adjustment platform, an interferometer feedback group, a triangular laser feedback group and a marked image recognition group, the XXY alignment platform is fixed on the lifting platform and has a lower bonding plate and a plurality of alignment positions a driving group and an upper bonding board, the lower bonding board is fixedly coupled with the lifting platform, and each of the alignment driving groups is fixed on a top surface of the lower bonding board, and the upper bonding board is fixed with each of the alignment driving groups Combinedly located above the lower bonding plate, the piezoelectric adjustment platform is combined with the upper bonding plate of the XXY alignment platform, the interferometer feedback group is combined with the base and provided with a first displacement measuring group, a second displacement measuring group and an angular displacement measuring group, wherein the interferometer feedback group has three degrees of freedom, wherein the two displacement measuring groups are respectively disposed on the top surface of the base, and the angular displacement measuring group The triangular laser feedback set is disposed on the piezoelectric adjustment platform and is provided with three triangular laser displacement meters, and each triangular laser displacement meter is respectively directed to the upper frame of the frame group. a laser beam is emitted in a direction, and the mark image recognition group is opposite to the upper frame And the embossing module is combined with the frame group and the aligning module and is provided with an upper module, a lower module and a standard calibration die, and the upper module is combined with the upper frame to be located at the mark Below the image recognition group, the upper module is provided with an upper mold fixture and an upper mold, the upper mold fixture is fixedly coupled with the bottom of the upper frame, and the upper mold is detachably disposed thereon a mold fixture and located below the mark image recognition group, the lower module is provided with a lower mold clamp and a lower mold and combined with the piezoelectric adjustment platform, the lower mold clamp is fixed on the piezoelectric Adjusting the platform, the lower mold is detachably coupled with the lower mold fixture, and the standard calibration mold is disposed on the piezoelectric adjustment platform for correcting the position of the marked image recognition group.

Further, the pedestal is provided with a plurality of struts and a combined platform combined with the top surfaces of the struts, the hoisting drive group is provided with a lifting motor and a lifting shaft, and the lifting motor is fixed at the bottom of the combined platform, the lifting shaft The lifting platform is coupled to the lifting motor and extends to the top surface of the combined platform. The lifting platform is fixedly coupled with the top surface of the lifting shaft and located above the bonding platform. The lifting platform is provided with a plurality of lifting portions. Platform and the combined platform of the slide rail The lifting platform can be smoothly raised or lowered relative to the combined platform along with the lifting shaft, and the upper frame is fixedly coupled with the combined platform and located above the lifting seat, the upper frame is provided with a plurality of The supporting beam combined with the supporting beam and a combined frame fixedly combined with each supporting beam.

Further, each of the alignment driving groups is provided with a pair of position driving motors, a ball guiding screw and a linear sliding rail, and each of the alignment driving motors is fixed on the lower bonding plate, and the ball guiding screw is coupled to the alignment driving motor Combined with a sliding block, the linear sliding rail is fixed on the lower bonding plate and parallel to the ball guiding screw, and the sliding block of the ball guiding screw is slidably combined with the linear sliding rail, the upper bonding plate The sliding block of each of the alignment driving groups is fixedly disposed above the lower bonding plate, and the XXY alignment platform is provided with three alignment driving groups, wherein the two alignment driving groups are along the X axis of the frame group. The movement in the direction while the other alignment drive group moves in the Y direction of the frame group.

Preferably, the piezoelectric adjustment platform is provided with a lower fixing plate, a plurality of micro-stepping driving groups and an upper fixing plate, and the lower fixing plate is fixedly combined with the upper bonding plate of the XXY alignment platform, and each micro step The driving group is combined with the top surface of the lower fixing plate and is provided with a fine adjustment member, a fixing sleeve, a piezoelectric actuator and a flexible body, wherein the fine adjustment member is disposed in the lower fixing plate, the fixing sleeve The cylinder is fixed on the top surface of the lower fixing plate and located above the fine adjustment member, the piezoelectric actuator is disposed in the fixing sleeve and the top end extends out of the fixing sleeve, and the flexible body and the pressure The electric actuator extends from the top end of the fixing sleeve, and the upper fixing plate is fixedly coupled with the flexible body of each micro-stepping driving group and located above the lower fixing plate, and each triangular thunder The displacement meters are arranged on the upper fixing plate of the piezoelectric adjustment platform at an annular interval.

Preferably, the interferometer feedback group is combined with the bonding platform of the base, the first displacement measuring group is provided with a binding column, an interferometer feedback device and a plane mirror, and the binding column is fixed on the combination On the platform, the interferometer feedback device is disposed on a top surface of the binding column, and the plane mirror is fixed The second displacement measuring group is disposed on the upper fixing plate of the piezoelectric adjusting platform and facing the interferometer feedback device. The second displacement measuring group is provided with a binding column, an interferometer feedback device and a plane mirror, and the binding column is fixed on the The interferometer feedback device is disposed on the top surface of the binding column, and the plane mirror is fixed on the upper fixing plate of the piezoelectric adjustment platform and faces the interferometer feedback device, the angular displacement measuring group The beam is disposed on the binding column of the first displacement measuring group and is provided with a beam splitter, a focusing lens and a four-quadrant sensor. The beam splitter is located in the interferometer back-up device and the plane mirror of the first displacement measuring group. In order to divide the beam reflected by the plane mirror into two, one of the sub-beams enters the interferometer feedback device, and the focusing lens focuses on the other sub-beam after the spectroscopic beam splitting, and the four quadrants The sensor receives the partial beam that is focused by the focusing lens.

Preferably, the marking image recognition group is provided with four image capturing devices, wherein each image capturing device is extended downward to the bottom of the upper frame and is composed of a camera, a coaxial light source and a high magnification objective lens. .

Preferably, the upper mold fixture is provided with a top plate, a fine adjustment device, a bottom plate, a locking device, two sliding tracks, a fixed substrate and an upper cover plate, wherein the top plate is fixed to the bottom of the upper frame Combining and providing an upper opening at the center, the fine adjustment device is disposed at the bottom of the top plate and is provided with a plurality of micro-testers and a plurality of rotary fine-tuning bearings, each micro-tester is disposed at the bottom of the top plate, and each rotary fine-tuning bearing In combination with each of the micro-testers, the bottom plate is combined with the rotary fine-tuning bearings of the fine-tuning device to be located below the top plate, and the bottom plate is provided at the center with a lower opening communicating with the opening of the top plate. The locking device is combined with the bottom plate and extends downward to the bottom of the bottom plate. The locking device is provided with a plurality of electromagnets and a plurality of adjusting screws, and the electromagnets are combined with the bottom plate to be located at the periphery of the lower opening. And extending from the bottom of the bottom plate, and two sliding rails are fixed on the bottom of the bottom plate and located on two sides of the lower opening, the fixed substrate is slidably disposed between the two sliding rails and can be coupled with the locking device Electromagnetic Adsorption phase locking, and the upper lid cover disposed on the clamping plate fixed substrate.

Preferably, the upper mold is detachably disposed on the fixed substrate of the upper mold fixture and abuts against the upper cover clamp, and the upper mold can move to the image of the mark image recognition group along with the fixed substrate. Below the picker, the upper mold is a square frame and two positioning marks are provided on the diagonal.

Preferably, the upper cover plate is provided with a micro-electromechanical process biaxial microelectronic level on the top surface, and the lower mold clamp is fixed on the upper fixing plate of the piezoelectric adjustment platform and is provided with a fixed cylinder seat. The cylinder base is provided with at least one electromagnet and a plurality of positioning pins, and the electromagnet is disposed in the fixed cylinder base, and each positioning pin protrudes from the top surface of the fixed cylinder base and surrounds the at least one electromagnet, the lower The mold is provided with a micro-electromechanical process biaxial microelectronic level and a plurality of positioning holes, the microelectromechanical process biaxial microelectronic level is disposed at the bottom of the lower mold, and each positioning hole is disposed at the bottom of the lower mold and respectively respectively The positioning pin of the mold fixture is combined. The lower mold is a circular plate body and is provided with two positioning marks on the diameter.

Preferably, the standard calibration die is used to correct the position of each image capture device of the marked image recognition group, and the standard calibration mold includes four positioning marks, and each positioning mark can be a circle, a cross, a square. Polygons, triangles, hexagons, etc.

According to the foregoing technical features, the nanometer optical alignment and imprinting leveling device of the present invention, when performing an imprinting process, the lifting motor and the lifting shaft are matched with a nanometer optical scale for a long stroke millimeter level ( And (mm) lifting, and using the piezoelectric adjustment platform and the triangular laser feedback group to perform micro-nano level (nm) positioning control and leveling action, effectively and instantly adjust the angular relationship between the upper and lower molds (Z, θ _X , θ _Y ), so that the upper and lower molds are kept in parallel at any time, thereby making the thickness of the embossed finished product high in precision, effectively improving the quality and yield of the finished product, thereby providing a pair of precision Nano-optical alignment and imprinting leveling device with high degree of real-time monitoring.

10‧‧‧Framework

11‧‧‧Base

111‧‧‧ pillar

112‧‧‧ Combined platform

12‧‧‧ Lifting seat

13‧‧‧Upper frame

131‧‧‧Support beam

132‧‧‧ binding box

14‧‧‧ Lifting drive group

141‧‧‧ Lift motor

142‧‧‧ Lifting shaft

15‧‧‧ Lifting platform

16‧‧‧slide group

20‧‧‧ alignment module

21‧‧‧XXY alignment platform

211‧‧‧Under the board

212‧‧‧ alignment drive group

213‧‧‧Upper board

214‧‧‧Alignment drive motor

215‧‧‧Ball lead screw

216‧‧‧Linear slides

217‧‧‧Sliding block

22‧‧‧ Piezoelectric adjustment platform

221‧‧‧ fixed plate

222‧‧‧Microstepping drive group

223‧‧‧Upper fixing plate

224‧‧‧ fine adjustments

225‧‧‧Fixed sleeve

226‧‧‧ Piezoelectric Actuator

227‧‧‧Flexible body

23‧‧‧Interferometer feedback group

24‧‧‧Triangular laser feedback team

241‧‧‧Triangular laser displacement gauge

25‧‧‧Marking image recognition group

251‧‧‧Image capture device

26‧‧‧First Displacement Measurement Group

261‧‧‧ binding column

262‧‧‧Interferometer backhaul

263‧‧‧Flat mirror

27‧‧‧Second displacement measurement group

271‧‧‧ binding column

272‧‧Interferometer backhaul

273‧‧‧Flat mirror

28‧‧‧Angle displacement measurement group

281‧‧‧beam splitter

282‧‧‧focus lens

283‧‧‧ four-quadrant sensor

30‧‧‧ Imprinting module

31‧‧‧Upper module

32‧‧‧Next module

33‧‧‧Standard calibration mold

331‧‧‧ Positioning Mark

34‧‧‧Upper clamp fixture

341‧‧‧ top board

342‧‧‧floor

343‧‧‧Sliding track

344‧‧‧Fixed substrate

345‧‧‧Upper splint

346‧‧‧Open hole

347‧‧‧ opening

348‧‧‧Micro-electromechanical process biaxial microelectronic level

35‧‧‧Upper mold

351‧‧‧ Positioning Mark

36‧‧‧ fine-tuning device

361‧‧‧Micro-tester

362‧‧‧Rotary fine-tuning bearings

37‧‧‧Locking device

371‧‧‧Electromagnet

372‧‧‧Adjustment screw

38‧‧‧Down mold fixture

381‧‧‧ fixed base

382‧‧‧Electromagnet

383‧‧‧Locating pin

39‧‧‧ Lower mold

391‧‧‧Micro-electromechanical process biaxial microelectronic level

392‧‧‧Positioning holes

393‧‧‧ Positioning Mark

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a preferred embodiment of the present invention.

Figure 2 is a side elevational view of a preferred embodiment of the present invention.

Figure 3 is a partial exploded perspective view of a preferred embodiment of the present invention.

Figure 4 is a partial perspective view of a preferred embodiment of the present invention.

Figure 5 is a perspective external view of a piezoelectric adjustment platform in accordance with a preferred embodiment of the present invention.

Figure 6 is a partial exploded perspective view of a piezoelectric adjustment platform in accordance with a preferred embodiment of the present invention.

Figure 7 is a perspective view of the upper mold holder of the preferred embodiment of the present invention.

Figure 8 is a partial perspective exploded view of the upper mold fixture of the preferred embodiment of the present invention.

Figure 9 is a partial exploded perspective view of the lower module of the preferred embodiment of the present invention.

Figure 10 is a top plan view of an upper mold, a lower mold, and a standard correction mold in accordance with a preferred embodiment of the present invention.

FIG. 11 is a schematic diagram of the operation of marking image recognition according to a preferred embodiment of the present invention.

FIG. 12 is another schematic diagram of performing operation of marking image recognition according to a preferred embodiment of the present invention.

Figure 13 is a schematic illustration of the geometry of a preferred embodiment of the invention as a positioning mark.

In order to understand the technical features and practical functions of the present invention in detail, and in accordance with the contents of the specification, the following is further illustrated in the preferred embodiment shown in the drawings (shown in FIGS. 1 to 3). The invention provides a nanometer optical alignment and imprinting leveling device, which is provided with a frame group 10, a pair of bit modules 20 and an imprinting module 30, wherein: the frame group 10 is provided with a base 11. A lifting base 12 and an upper frame 13, wherein the base 11 is provided with a plurality of pillars 111 and a coupling platform 112 coupled with the top surfaces of the pillars 111, and the lifting platform 12 is coupled with the base 11 and A lifting drive unit 14 and a lifting platform 15 are provided. The lifting driving unit 14 is provided with a lifting motor 141 and a lifting shaft 142. The lifting motor 141 is fixed to the bottom of the coupling platform 112. Further, the lifting motor 141 is A long-stroke millimeter (mm) level lifting operation can be performed with a nanometer optical scale (not shown), and the lifting shaft 142 is coupled to the lifting motor 141 in a liftable manner and extends to the bonding platform 112. The top surface, preferably, the lift motor 142 can be a stepping motor a servo motor, a brushless motor or a cross-flow motor or a voice coil motor, etc., the lifting platform 15 is fixedly coupled to the top surface of the lifting shaft 142 and located above the coupling platform 112. Further, the lifting platform 12 A plurality of rail sets 16 combined with the lifting platform 15 and the combining platform 112 are provided, so that the lifting platform 15 can smoothly rise or fall with respect to the combining platform 112 along with the lifting shaft 142, and the upper frame 13 is The upper frame 13 is provided with a plurality of support beams 131 combined with the joint platform 112 and a joint frame fixedly coupled with the support beams 131. 132; Please further refer to FIG. 4 to FIG. 6 , the alignment module 20 is combined with the frame group 10 and is provided with an XXY alignment platform 21 , a piezoelectric adjustment platform 22 , and an interferometer feedback group. 23, a triangular laser feedback group 24 and a marked image recognition group 25, wherein the XXY alignment platform 21 is fixed on the lifting platform 15 and is provided with a lower bonding board 211, a plurality of alignment driving groups 212 and An upper binding plate 213, the lower bonding plate 211 is coupled to the lifting platform The phasing driving unit 212 is fixed on the top surface of the lower bonding plate 211 and is respectively provided with a pair of position driving motors 214, a ball guiding screw 215 and a linear sliding rail 216, and each of the alignment drives The motor 214 is fixed on the lower bonding plate 211 and can be a linear motor, a servo motor or a stepping motor. Preferably, the XXY alignment platform 21 is provided with three alignment driving groups 212, two of which are The bit drive group 212 moves along the X-axis direction of the frame group 10, and the other alignment drive group 212 moves along the Y direction of the frame group 10. The ball lead screw 215 is coupled to the alignment drive motor 214. Combined with a sliding block 217, the linear sliding rail 216 is fixed on the lower bonding plate 211 and parallel with the ball guiding screw 215, and the sliding block 217 of the ball guiding screw 215 is slidably coupled with the linear The slide rails 216 are combined, and the upper joint plate 213 is fixedly coupled with the sliding block 216 of each of the alignment drive groups 212 to be located above the lower joint plate 211; the piezoelectric adjustment platform 22 is coupled to the XXY alignment platform 21 Combined with a lower fixing plate 221, a plurality of micro-stepping driving groups 222 and an upper fixing 223, the lower fixing plate 221 is fixedly coupled with the upper binding plate 213 of the XXY alignment platform 21, and each micro-stepping driving group 222 is combined with the top surface of the lower fixing plate 221 and is provided with a fine adjustment member 224, A fixing sleeve 225, a piezoelectric actuator 226 and a flexible body 227, wherein the fine adjustment member 224 is disposed in the lower fixing plate 221, and the fixing sleeve 225 is fixed to the lower fixing plate 221 The top surface is located above the fine adjustment member 224. The piezoelectric actuator 226 is disposed in the fixing sleeve 225 and the top end extends out of the fixing sleeve 225. The flexible body 227 is coupled to the piezoelectric body. The actuator 226 is fixedly coupled to the top end of the fixing sleeve 225, and the upper fixing plate 223 is fixedly coupled to the flexible body 227 of each micro-stepping driving group 222 to be located above the lower fixing plate 221; The interferometer feedback group 23 is combined with the bonding platform 112 of the base 11 and is provided with a first displacement measuring group 26, a second displacement measuring group 27 and an angular displacement measuring group 28, thereby feedback interferometer set 23 having three degrees of freedom (X, Y, and θ _Z), wherein the first displacement measurement set 26 is provided with a binding post 261, a feedback interferometer 262 and a plane mirror 263, the binding post 261 is fixed on the bonding platform 112, the interferometer backer 262 is disposed on the top surface of the binding post 261, and the plane mirror 263 is fixed on the piezoelectric adjustment The upper fixed plate 223 of the platform 22 faces the interferometer feedback device 262. The second displacement measuring group 27 is provided with a coupling post 271, an interferometer feedback device 272 and a plane mirror 273. The binding post 271 is fastened. The interferometer feedback device 272 is disposed on the top surface of the binding post 271, and the plane mirror 273 is fixed on the upper fixing plate 223 of the piezoelectric adjustment platform 22 and faces the interference. The angle detector 272 is disposed on the binding post 261 of the first displacement measuring group 26 and is provided with a beam splitter 281, a focusing lens 282 and a four-quadrant sensor 283. The beam splitter 281 is located between the interferometer back-up 262 and the plane mirror 263 of the first displacement measuring group 26, thereby dividing the light beam reflected by the plane mirror 263 into two, wherein a sub-beam is fed into the interferometer. 262, and the focusing lens 282 is another sub-beam after splitting the beam splitter 281 Focusing, the four-quadrant sensor 283 is configured to receive a split beam that is focused by the focus lens 282; the triangular laser feedback set 24 is disposed on the piezoelectric adjustment platform 22 and is provided with three triangular rays The displacement displacement meter 241, wherein each of the triangular laser displacement meters 241 is arranged on the upper fixing plate 223 of the piezoelectric adjustment platform 22 at an annular interval and respectively emits a laser beam toward the upper frame 13 of the frame group 10. The mark image recognition group 25 is combined with the upper frame 13 and is provided with four image pickers 251 (CCD), wherein each image picker 251 is extended downward to the bottom of the upper frame 13 and can be a camera, a coaxial light source and a high-magnification objective lens; and as shown in FIGS. 3 and 7 to 9, the imprint module 30 is combined with the frame group 10 and the alignment module 20 There is an upper module 31, a lower module 32 and a standard calibration die 33. The upper module 31 is combined with the upper frame 13 and located below the marked image recognition group 25. The upper module 31 is provided with an upper portion. a mold fixture 34 and an upper mold 35, the upper mold fixture 34 is provided with a top plate 341, a micro The device 36, a bottom plate 342, a locking device 37, two sliding rails 343, a fixed substrate 344 and an upper cover plate 345, wherein the top plate 341 is fixedly coupled with the bottom of the upper frame 13 and is provided at the center. The upper opening 346 is disposed at the bottom of the top plate 341 and is provided with a plurality of micro-testers 361 and a plurality of rotary fine-tuning bearings 362. Each micro-detector 361 is disposed at the bottom of the top plate 341, and each rotation The fine adjustment bearing 362 is combined with each of the micro-testers 361; the bottom plate 342 is located below the top plate 341 in combination with the rotary fine-tuning bearings 362 of the fine adjustment device 36, and the bottom plate 342 is provided at the center. a lower opening 347 is formed in the top plate 341, and the locking device 37 is coupled to the bottom plate 342 and extends downward to the bottom of the bottom plate 342. The locking device 37 is provided with a plurality of electromagnets 371 and a plurality of The adjusting screws 372 are combined with the bottom plate 342 to be located at the periphery of the lower opening 347 and protrude from the bottom of the bottom plate 342, and the adjusting screws 372 are combined with the electromagnet 371 to be located on the bottom plate. 342, and the two sliding tracks 343 are fixed on The bottom of the bottom plate 342 is located at two sides of the lower opening 347. The fixed substrate 344 is slidably disposed between the two sliding rails 343 and can be occluded with the electromagnets 371 of the locking device 37. The upper cover plate 345 is disposed on the fixed substrate 344, and the upper cover plate 345 is provided on the top surface with a micro-electromechanical process (MEMS) biaxial microelectronic level 348; the upper mold 35 is detachably disposed on the upper mold The upper substrate 354 is placed on the fixed substrate 344 of the fixture 34 and abuts against the upper cover plate 345, so that the upper mold 35 moves to the lower side of each image picker 251 of the mark image recognition group 25 along the fixed substrate 344. The upper mold 35 is a square frame and is provided with two positioning marks 351 on the diagonal line as shown in FIG. 10; the lower module 32 is combined with the piezoelectric adjustment platform 22 and is provided with a lower mold clamp. 38 and a lower mold 39, the lower mold fixture 38 is fixed on the upper fixing plate 223 of the piezoelectric adjustment platform 22 and is provided with a fixed cylinder base 381, and the fixed cylinder base 381 is provided with at least one electromagnet 382 and a plurality of positioning pins 383, wherein the at least one electromagnet 382 is disposed in the fixed socket 381, and each The positioning pin 383 is disposed on the top surface of the fixed cylinder base 381 and is provided with the at least one electromagnet 382. The lower mold 39 is detachably coupled with the lower mold fixture 38 and is provided with a micro-electromechanical process double The axis microelectronic level 391 and the plurality of positioning holes 392 are disposed at the bottom of the lower mold 39, and the positioning holes 392 are disposed at the bottom of the lower mold 39 and respectively The positioning pin 383 of the lower mold fixture 38 is combined. The lower mold 39 is a circular plate body and is provided with two positioning marks 393 in diameter as shown in FIG. 10; the standard correction mold 33 is disposed on the The piezoelectric adjustment platform 22 is configured to correct the position of each of the image capturing devices 251 of the marking image recognition group 25, wherein the standard calibration mold 33 includes four positioning marks 331 as shown in FIG. 10, wherein each positioning mark 331 can be a circular, cross, square, triangular, hexagonal, etc. polygon pattern as shown in FIG.

When the nano-optical alignment and imprinting leveling device of the present invention is operated, when the XXY alignment platform 21 is displaced relative to the base 11, it is provided with two sets of alignment in the X-axis direction of the frame group 10 The driving motor 214 provides the X-direction displacement signal by using the two-axis simultaneous motion, and provides the angular displacement in the θ _Z direction by using the biaxial displacement signal difference amount, and a set of the alignment driving motor 214 in the Y-axis direction of the frame group, mainly A Y-direction signal can be provided, wherein the laser beams of the interferometer feedback devices 262, 272 of the two displacement measurement groups 26, 27 can be reflected by the corresponding plane mirrors 263, 273, respectively, back to the corresponding interferometer feedback device 262. In 272, the X-direction position signal and the Y-direction position signal of the XXY alignment platform 21 are obtained, and the θ _Z angular displacement signal of the XXY alignment platform 21 is obtained by using the angular displacement measurement group 28, wherein the The angular displacement measuring group 28 is configured to use the beam splitter 263 reflected by the plane mirror 263 of the first displacement measuring group 26 to pass the beam into a penetrating beam through the beam splitter 281 before being received by the interferometer backer 262. With a refracted beam, The penetrating beam is received by the interferometer feedback device 262 in the X-direction position signal, and the refracted beam is incident on the focusing lens 282, and then focused by the focusing lens 282, and the spot is focused into the four-quadrant position. On the sensor 283, when the plane mirror 263 generates the θ _Z angular displacement signal, the four-quadrant position sensor 283 can obtain the angular displacement signal of the θ _Z of the XXY alignment platform 21 by the position change of the light spot. The XXY alignment platform 21 can perform high-precision nano-level positioning control with a control accuracy of up to 50 nanometers.

Moreover, the erecting position of the mark image recognition shadow group 25 is a reference reference. Therefore, the present invention calibrates the relevant position signals of the four image image pickers 251 through the standard calibration die 33, which corrects the standard. The mold 33 is placed on the XXY alignment platform 21, and the positioning mark 331 of the standard calibration mold is moved to the lower side of each image picker 251 through the XXY alignment platform 21, and then the center of the two image pickers 251 is moved. Adjusted to the center of two of the positioning marks 331. At this time, the position (X1, Y1) of the XXY registration platform 21 is recorded through the two displacement measuring groups 26, 27, and the other two images are captured in the same manner. The center of the 251 is adjusted to the center of the other two positioning marks 331 to obtain another set of position signals (X2 and Y2), and four sets of position signals (X1, Y1) and (X2, Y2) can be used to obtain four positions. The relative position (X, Y) of the image capturer 251 (X = X ₁ - X ₂ , Y = Y _{1 -} Y ₂ ), and the marker image recognition group 25 can be calibrated to a known correct position.

The upper mold 35 is placed in the fixed substrate 344, and the upper mold 35 is fixed in the fixed substrate 344 by the upper cover clamp 345, and slides along the two sliding rails 343 to slide the upper mold 35 to mark the image recognition. Below the two image pickers 251 of the group 25, the electromagnets 371 of the locking device 37 are energized to adsorb and lock the fixed substrate 344. At this time, the X, Y of the upper mold 35 are transmitted through the fine adjustment device 36. θ _Z three degrees of freedom, the two positioning marks 351 of the upper mold 35 are adjusted to the central position range of the two corresponding image pickers 251, and the adjusting screw 372 of the locking device 37 is used to adjust the θ of the upper mold 35. _X , θ _Y , the upper mold 35 is finely adjusted to a horizontal state, and the lower mold 39 is transmitted through a plurality of positioning holes 392 which are linearly opposite to the positioning pins of the lower mold holder 38 and the battery iron 382 is energized. The lower mold 39 is quickly positioned in such a manner that the lower mold 39 is adsorbed.

When the upper and lower molds 35, 39 are respectively fixed in the upper and lower mold fixtures 34, 38, the off-axis alignment operation is started, wherein the alignment flow and operation manner are as follows:

A. Positioning mark calculation method: The calculation method of the positioning mark 351, 393 can adopt pattern recognition or edge detection, mainly to calculate the offset value of the positioning mark 351, 393 and the center of the image. After the theoretical alignment is completed, the positioning mark 351, 393 must be located just in the center of the image, and the form of the positioning marks 351, 393 is mainly polygon as shown in Fig. 13, and the three patterns of freedom can be obtained from a single pattern by means of polygon pattern recognition (X, Y, θz) position signal.

B. Marking the image recognition group: As shown in FIG. 11, the upper mold 35 or the lower mold 39 respectively need to use two sets of image pickers 251, which are arranged according to the shape of the upper and lower molds 35, 39 and The shape of the upper and lower molds 35, 39 is not limited to a rectangular shape, and may be various shapes such as a circular shape, an elliptical shape, and a polygonal shape, and the alignment surfaces of the upper and lower molds 35, 39 are not Limited to the plane, each of the image pickers 251 can be adjusted through the jig so that the image pickers 251 can focus on the positioning marks 351, 393 at different heights.

C. Mold position calculation method: Please refer to FIG. 12, the calculation method of the position of the upper and lower molds 35, 39 is to calculate the position of the positioning marks 351, 393 through image processing, and then calculate the position of the mark. The position of the upper and lower molds 35, 39 in the space, since the positioning marks 351, 393 of the present invention adopt a characteristic pattern, the upper and lower molds 35, 39X axis, Y axis and θ can be obtained after the identification is completed. The position of the _Z axis, but in order to obtain higher recognition accuracy of the θ _Z axis, the upper and lower molds 35 and 39 are respectively combined with the two image capturing devices 251 for image capturing, and are obtained by the image capturing devices 251. The positioning mark is transplanted (△X and △Y), and the geometric relationship between the positioning marks (△ x = L sin θ ) can be used to obtain a more accurate θ _Z- axis angular displacement.

D. Alignment mode of the alignment system: The present invention calculates the relative error of the upper and lower molds 35, 39 by using the positioning marks 351, 393. Therefore, the position of the mark image recognition group 25 needs to be corrected first, and each image 撷The lens magnification of the extractor 251 is also corrected. The present invention employs an off-axis alignment, which operates as follows: 1. The upper mold 35 is placed on the upper mold fixture 34. The image pickup error of the upper mold 35 is obtained by the two image pickers 251, and the position and angle of the upper mold 35 are adjusted by the fine adjustment device 36 of the upper mold fixture 34 to make the positioning mark 351 of the upper mold 35. The lower mold 39 is disposed on the lower mold fixture 38, and the image pickup error of the lower mold 39 is obtained through the other two image pickers 251. The XXY alignment platform 21 and the piezoelectric adjustment platform 22 adjust the position and angle of the lower mold 39 such that the positioning mark 393 of the lower mold 39 is disposed at the center of the two corresponding image pickers 251; 3. Calculated separately The position of the positioning marks 351, 393 of the upper and lower molds 35, 39 and the four images are captured. Position difference amount _{(X, Y, θ Z)} 251 of the center; and 4. identified by the upper and lower molds 35, 39 and the positioning marks 351,393 four positions of the image capturing device 251 of the center (X, Y , θ _Z ) the difference amount and the relative position signal (X _CCD , Y _CCD ), and the positioning feedback control of the XXY alignment platform 21 is performed through the interferometer feedback group 23 feedback signal, so that the center position and the upper mold 39 are The center positions of the dies 35 are overlapped, and the lower mold 39 is moved to the initial position of the embossing operation, that is, the high-precision nano-scale optical aligning operation of the present invention is completed.

In addition, in the process of imprinting and leveling, the present invention can improve the passive compensation method using the conventional hydraulic pressure equalizing device, and an active piezoelectric adjustment platform 22 is matched with the triangular laser feedback group 24 for high precision. The positioning control is used to adjust the parallelism between the upper and lower molds 35, 39, wherein the upper mold 35 is placed in the upper mold fixture 34, and the upper mold fixture 34 has convenient exchange and fast The function of loading and unloading, after the upper mold 35 is placed in the upper mold fixture 34, the upper mold is clamped by the strong suction force generated by each electromagnet 371 attached to the upper mold fixture 34. with the fixed substrate 34434 is fixed by the adjustment device 36 adjusts the upper mold fixtures XYθ 34 in three degrees of freedom _Z, so that the two upper mold 351 is adjusted to the positioning mark wherein two image capturing 251 35 The center position range is adjusted by using the fine adjustment screw 372 of the locking device 37 to adjust θ _X , θ _Y , and the angle is adjusted by using the micro-electromechanical process biaxial microelectronic level 348 located on the upper cover plate 345. Modulate to a horizontal state.

A microelectromechanical process biaxial microelectronic level 391 and four positioning holes 392 are disposed in the bottom of the lower mold 39, so that the lower mold 39 can be quickly positioned and placed in the lower mold fixture 38, and can be The electromechanical process biaxial microelectronic level 391 knows the deviation angle (θ _X , θ _Y ) when the lower mold 39 is placed in the lower mold fixture 38, and the lower mold 39 is adsorbed and locked by the electromagnet 382. On the lower mold fixture 38, the lower mold 39 is then adjusted to a horizontal state by the piezoelectric adjustment platform 22.

The method for horizontally adjusting the lower mold 39 by using the piezoelectric adjustment platform 22 mainly focuses the light beam of each triangular laser displacement displacement meter 241 of the triangular laser feedback group 24 on the upper mold 35, through which the upper beam 35 is directed. The mold 35 reflects the light beam and obtains three Z-direction displacement signals (Z ₁ , Z ₂ , Z ₃ ) by the triangular laser displacement meters 241, and respectively drives the corresponding piezoelectric actuators by the three displacement signals. 226, the corresponding flexible body 227 is elastically deformed, thereby adjusting the angle of the piezoelectric adjustment platform 22, and finally the microelectromechanical process biaxial microelectronics of the triangular laser returning group 24 and the lower mold 39 can be obtained. The angle signal of the level 391 adjusts the upper mold 35 and the lower mold 39 to the same plane, and the leveling operation steps are as follows:

A. Correcting and adjusting the angular deflection of the upper mold: detecting the angle signal of the upper mold 35 by using the micro-electromechanical process biaxial microelectronic level 348, and adjusting the θ of the upper mold 35 by using the fine adjustment screw 372 of the locking device 37. _X , θ _Y , the upper mold 35 is finely adjusted to a horizontal state.

B. Correcting and adjusting the angular yaw of the lower mold: detecting the angle signal of the lower mold 39 by using the micro-electromechanical process biaxial microelectronic level 391 mounted on the lower mold 39, and adjusting the piezoelectric adjustment platform 22 θ _X , θ _Y of the lower mold 39 finely adjusts the lower mold 39 to a horizontal state.

C. Triangular laser feedback group monitoring: during the imprinting process, the lower mold will rise along the Z direction of the frame group 10 along with the lifting drive group 14, and the angle of the lower mold 39 during the ascending process The yaw may be generated. At this time, the triangular laser feedback group 24 can be used to instantly monitor the angular change between the upper and lower dies 35, 39, and feedback to the piezoelectric adjustment platform 22, thereby instantly adjusting the upper portion. And the angular relationship between the lower molds 35, 39, so that the upper and lower molds 35, 39 can be kept parallel and horizontal at any time.

After the above-mentioned leveling operation, the embossing is performed by a two-stage control method, wherein the lifting motor 141 and the lifting shaft 142 of the lifting and lowering drive group 14 are combined with a nanometer optical scale for long stroke. Z-axis imprinting operation of millimeter level (mm), and using a piezoelectric adjustment platform 22 and a high-resolution triangular laser feedback group 24 to perform positioning control and leveling of micro-nano level (nm) Actuating, and further adjusting the height-angle relationship (Z, θ _X , θ _Y ) between the upper and lower dies 35, 39, so that the upper and lower dies 35, 39 are kept parallel, so that the thickness precision of the embossed finished product Preferably, the overall quality and yield are improved. The imprint process of the present invention is as follows:

A. The lower mold 39 is fed to the embossed position by the XXY alignment stage 21, and then an embossed material is uniformly applied to the lower mold 39.

B. Using the lifting motor 141 and the lifting shaft 142 with a nanometer optical scale, the millimeter level (mm) movement of the long stroke is performed, and then the piezoelectric adjustment platform 22 is used with the high-resolution triangular laser feedback. In group 24, micron nanometer (nm) positioning is performed to control the height change between the upper and lower molds 35, 39, and the thickness control of the imprinted product is completed.

C. Using the piezoelectric adjustment platform 22 with a high-resolution triangular laser feedback group 24. Perform micro-nano level (nm) positioning to control the angle change between the upper and lower molds 35, 39 to complete the parallelism control of the imprinted product.

D. The interferometer feedback group 23 immediately monitors the change of X, Y and θ _Z of the lower mold 39 during the (62) imprint rise process, and performs an instant compensation operation by using the XXY alignment platform 21, so that the The XYθ _Z position between the upper and lower dies 35, 39 can be maintained at the same position during the initial stage to the completion stage of the embossing process, effectively controlling the position of the embossed product.

According to the foregoing technical features, the nanometer optical alignment and imprinting leveling device of the present invention, when performing the imprinting process, the lifting motor 141 and the lifting shaft 142 are matched with a nanometer optical scale for long stroke millimeters. Level (mm) lifting, and using the piezoelectric adjustment platform 22 and the triangular laser feedback group 24 to perform micro-nano level (nm) positioning control and leveling action, effectively and instantly adjust the upper and lower molds The angular relationship (Z, θ _X , θ _Y ) between 35 and 39 allows the upper and lower molds 35, 39 to maintain a parallel state at any time, thereby making the thickness of the imprinted product high in precision and effectively improving the quality of the finished product. And yield, to provide a pair of high-precision and instantly monitorable nano-level optical alignment and imprinting leveling device.

10‧‧‧Framework

11‧‧‧Base

111‧‧‧ pillar

112‧‧‧ Combined platform

12‧‧‧ Lifting seat

13‧‧‧Upper frame

131‧‧‧Support beam

132‧‧‧ binding box

15‧‧‧ Lifting platform

16‧‧‧slide group

25‧‧‧Marking image recognition group

251‧‧‧Image capture device

Claims (10)

The invention relates to a nano-level optical alignment and imprinting leveling device, which comprises a frame group, a pair of position modules and an embossing module, wherein: the frame group is provided with a base, a lifting seat and an upper frame. The lifting base is coupled with the base and is provided with a lifting drive group and a lifting platform. The lifting driving group is disposed at the bottom of the base, and the lifting platform is disposed above the base in combination with the lifting driving group. The upper frame is fixedly coupled to the base and located above the lifting base; the alignment module is combined with the frame group and is provided with an XXY alignment platform, a piezoelectric adjustment platform, and an interferometer feedback group. a triangular laser feedback group and a marked image recognition group, the XXY alignment platform is fixed on the lifting platform and is provided with a lower bonding plate, a plurality of alignment driving groups and an upper bonding plate, and the lower bonding plate In combination with the lifting platform, each of the aligning driving groups is fixed on the top surface of the lower bonding board, and the upper bonding board is fixedly coupled with the aligning driving groups and located above the lower bonding board, the piezoelectric The adjustment platform is combined with the upper binding plate of the XXY alignment platform, The interferometer feedback group is combined with the base and is provided with a first displacement measurement group, a second displacement measurement group and an angular displacement measurement group, so that the interferometer feedback group has three degrees of freedom, wherein The two displacement measurement groups are respectively disposed on the top surface of the base, and the angular displacement measurement is set on the first displacement measurement group, and the triangular laser feedback assembly is disposed on the piezoelectric adjustment platform. There are three triangular laser displacement meters, each triangular laser displacement meter respectively emitting a laser beam toward the upper frame of the frame group, the marked image recognition group is combined with the upper frame; and the imprint module and the frame The group and the alignment module are combined and provided with an upper module, a lower module and a standard calibration mold. The upper module is combined with the upper frame and located below the marked image recognition group. An upper mold fixture and an upper mold, the upper mold clamp is fixedly coupled to the bottom of the upper frame, and the upper mold is detachably disposed on the upper mold fixture and located in the mark image recognition group Below, the lower module is combined with the piezoelectric adjustment platform and Have a lower mold a clamping fixture and a lower mold, the lower mold clamping fixture is fixed on the piezoelectric adjustment platform, the lower mold is detachably combined with the lower mold clamping fixture, and the standard calibration mold is disposed on the piezoelectric adjustment On the platform, the position of the marked image recognition group is corrected. The nano-level optical alignment and imprinting leveling device according to claim 1, wherein the base is provided with a plurality of pillars and a combined platform combined with the top surfaces of the pillars, the lift driving group is provided with a lifting motor and a lifting shaft fixed to the bottom of the combined platform, the lifting shaft is detachably coupled to the lifting motor and extended to a top surface of the combined platform, the lifting platform being fixed to a top surface of the lifting shaft The combination is located above the bonding platform, and the lifting platform is provided with a plurality of sliding rail groups combined with the lifting platform and the combined platform, so that the lifting platform can smoothly rise relative to the combined platform with the lifting shaft or Decreasing, the upper frame is fixedly coupled with the combined platform and located above the lifting seat, the upper frame is provided with a plurality of supporting beams combined with the combined platform and a combined frame fixedly coupled with each supporting beam . The nanometer optical alignment and imprinting leveling device according to claim 1 or 2, wherein each of the alignment driving groups is provided with a pair of bit driving motors, a ball guiding screw and a linear sliding rail, and each of the alignment driving motors Fixed on the lower bonding plate, the ball guiding screw is combined with the alignment driving motor and provided with a sliding block fixed on the lower bonding plate and parallel to the ball guiding screw, the ball The sliding block of the lead screw is slidably coupled with the linear sliding rail, and the upper bonding plate is fixedly coupled with the sliding block of each of the alignment driving groups to be located above the lower bonding plate, and the XXY alignment platform is provided with three The alignment driving group, wherein the two alignment driving groups move along the X-axis direction of the frame group, and the other alignment driving group moves along the Y direction of the frame group. The nano-level optical alignment and imprinting leveling device according to claim 3, wherein the piezoelectric adjustment platform is provided with a lower fixing plate, a plurality of micro-stepping driving groups and an upper fixing plate, and the lower fixing plate and The upper combined plate phase of the XXY alignment platform is fixedly combined, and each microstepping driving group is combined with the top surface of the lower fixing plate and provided with a fine adjustment member, a fixing sleeve, a piezoelectric actuator and a flexible body, The fine adjustment member is disposed in the lower fixing plate, the fixing sleeve is fixed on the top surface of the lower fixing plate and located above the fine adjustment member, and the piezoelectric actuator is disposed in the fixing sleeve and the top end is Extending out of the fixing sleeve, the flexible body is fixedly coupled to the top end of the fixing sleeve, and the upper fixing plate is fixed to the flexible body of each micro-stepping driving group. The combination is located above the lower fixing plate, and each of the triangular laser displacement meters is arranged on the upper fixing plate of the piezoelectric adjustment platform at an annular interval. The nano-level optical alignment and imprinting leveling device according to claim 4, wherein the interferometer feedback group is combined with the bonding platform of the base, and the first displacement measuring group is provided with a binding column and a An interferometer feedback device and a plane mirror, the binding column is fixed on the bonding platform, the interferometer feedback device is disposed on a top surface of the bonding column, and the plane mirror is fixed on the upper fixing plate of the piezoelectric adjusting platform Up and facing the interferometer feedback device, the second displacement measuring group is provided with a binding column, an interferometer feedback device and a plane mirror, the binding column is fixed on the bonding platform, and the interferometer feedback device is arranged On the top surface of the binding column, the plane mirror is fixed on the upper fixing plate of the piezoelectric adjustment platform and facing the interferometer feedback device, and the angular displacement measurement is set in the combination of the first displacement measurement group. a beam splitter, a focusing lens and a four-quadrant sensor are disposed on the column, and the beam splitter is located between the interferometer back-up device and the plane mirror of the first displacement measuring group, thereby dividing the beam reflected by the plane mirror Second, one of the sub-beams enters the interferometer backhaul And the focusing lens focuses on another partial beam split by the beam splitter, and the four-quadrant sensor receives the partial beam that is focused by the focusing lens. The nano-level optical alignment and imprinting leveling device of claim 5, wherein the marking image recognition group is provided with four image capturing devices, wherein each image capturing device is extended downward to the upper frame. The bottom is composed of a camera, a coaxial light source and a high-magnification objective lens. The nano-scale optical alignment and imprinting leveling device according to claim 6, wherein the upper mold fixture is provided with a top plate, a fine adjustment device, a bottom plate, a locking device, two sliding tracks, and a solid a fixed substrate and an upper cover plate, wherein the top plate is fixedly coupled with the bottom of the upper frame and has an upper opening at the center, the fine adjustment device is disposed at the bottom of the top plate and is provided with a plurality of micro-testers and a plurality of rotations Fine-tuning the bearing, each micro-tester is disposed at the bottom of the top plate, and each of the rotary fine-tuning bearings is respectively combined with each micro-tester, and the bottom plate is combined with the rotary fine-tuning bearings of the fine-tuning device and located under the top plate, the bottom plate A lower opening communicating with the opening of the top plate is disposed at the center, and the locking device is combined with the bottom plate and extends downward to the bottom of the bottom plate. The locking device is provided with a plurality of electromagnets and several Adjusting screws, each electromagnet is combined with the bottom plate to be located at the periphery of the lower opening and extending out of the bottom of the bottom plate, and the two sliding rails are fixed at the bottom of the bottom plate and are located on both sides of the lower opening, the fixing The substrate is slidably disposed between the two sliding rails and is occludably locked to the electromagnets of the locking device, and the upper cover clip is disposed on the fixed substrate. The nano-scale optical alignment and imprinting leveling device of claim 7, wherein the upper mold is detachably disposed on the fixed substrate of the upper mold fixture and abuts the upper cover plate, the upper mold The fixed substrate can be moved to the underside of each of the image capturing devices of the marking image recognition group, wherein the upper mold is a square frame and two positioning marks are disposed on the diagonal line. The nano-scale optical alignment and imprinting leveling device of claim 8, wherein the upper cover plate is provided with a micro-electromechanical process biaxial microelectronic level on the top surface, and the lower mold clamp is fixed at the pressure The upper fixing plate of the electric adjustment platform is provided with a fixed cylinder seat, the fixed cylinder base is provided with at least one electromagnet and a plurality of positioning pins, the electromagnet is disposed in the fixed cylinder base, and each positioning pin is protruded from the The top surface of the fixed cylinder base is provided with the at least one electromagnet, the lower mold is provided with a micro-electromechanical process biaxial microelectronic level and a plurality of positioning holes, and the microelectromechanical process biaxial microelectronic level is disposed at the bottom of the lower mold And each positioning hole is disposed at the bottom of the lower mold and is respectively combined with the positioning pin of the lower mold fixture. The lower mold is a circular plate body and is provided with two positioning marks on the diameter. The nano-level optical alignment and imprinting leveling device of claim 9, wherein the standard calibration mold is used to correct the position of each image capturing device of the marking image recognition group, and the standard calibration mode The device includes four positioning marks, and each positioning mark can be a pattern of a circle such as a circle, a cross, a square, a triangle, a hexagon, or the like.