TW201520056A - Substrate bonding apparatus, manufacturing apparatus for display panel and method thereof - Google Patents

Abstract

The invention uniformly presses the substrate and the adhesive layer for adhesion of the adhesive layer, and to reduce voids. The substrate bonding apparatus 20 bonds the liquid crystal panel S1 and a protective panel S2 through an adhesive layer R1 formed on the surface of a liquid crystal panel S1. The substrate bonding apparatus 20 includes a lower plate 22 as a support section to support the liquid crystal panel S1; an upper plate 23 as a holding part configured against the liquid crystal panel S1 to hold the protective panel S2; a lift mechanism 25 driving the upper plate 23, so that the lift mechanism 25 bonds the liquid crystal panel S1 and the protective panel S2; an elastic sheet 24 configured on the surface of the lower plate 22, having the same shape and substantially same size as the adhesive layer R1; only the part which the liquid crystal panel S1 forming the adhesive layer R1 is pressed.

Description

Substrate bonding device, display panel manufacturing device, and display panel manufacturing method

The present invention relates to a substrate bonding apparatus, a display panel manufacturing apparatus including the substrate bonding apparatus, and a display panel manufacturing method.

A display panel used in a liquid crystal display or an organic electroluminescence (EL) display or the like is formed by laminating two substrates, for example, a display panel such as a liquid crystal panel or an organic EL panel, and a protective panel (cover panel). Composition. The two substrates are bonded, for example, via an adhesive layer. The manufacturing device of such a display panel includes an adhesive layer forming portion and a bonding portion. The adhesive layer is formed, for example, by an adhesive such as an adhesive or an adhesive film. For example, when a binder is used as the binder, an adhesive is applied to the surface of at least one of the substrates in the adhesive layer forming portion to form an adhesive layer having a predetermined thickness. Further, in the bonding portion, the two substrates sandwich the adhesive layer to laminate and bond them.

[Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-73300

The bonding portion holds the two substrates to perform pressing. When the pressing portions are not parallel or are not flat, there is a possibility that the substrate receives uneven force during bonding, and the adhesive layer and the substrate are not closely adhered to each other to form a void. In order to prevent the occurrence of voids, it is conceivable to increase the precision of each portion of the substrate bonding apparatus constituting the bonding portion, and to apply pressure uniformly to the substrate to laminate. However, such a highly accurate device is costly.

Further, the substrate may have a case where the surface does not necessarily become a uniform plane, or there may be a case where the surface is undulated. In this case, there is a case where a portion that presses the substrate with a uniform force, a portion that is not transmitted by the pressing force, or a portion that is excessively subjected to the pressing force is generated. Further, there is a case where an error occurs in the parallelism or flatness of the upper and lower plates that are pressed by the substrate and pressed. In this case, there is also a possibility that the substrate and the adhesive layer are not in close contact to form a void. In particular, when a binder is used as the binder, the adhesive layer formed on the surface of the substrate is easily deformed. If such an adhesive layer receives a non-uniform force, the possibility of creating a void between the adhesive layer and the substrate is further improved.

The present invention has been made to solve the above problems, and an object thereof is to provide a substrate which is low in cost, can uniformly press an adhesive layer when a substrate is bonded, and closes a substrate and an adhesive layer to reduce generation of voids. Laminating device A display panel manufacturing apparatus and a display panel manufacturing method of a substrate bonding apparatus.

In order to achieve the object, the substrate bonding apparatus of the present invention bonds a pair of substrates via an adhesive layer formed on a surface of at least one of the substrates, and includes: a support portion that supports the first substrate; and a holding portion The first substrate holds the second substrate at a position facing each other; the driving unit drives at least one of the support portion and the holding portion to bond the pair of substrates via the adhesive layer; and the elastic piece Provided on the surface of the support portion or the holding portion, having a shape similar to the adhesive layer and having substantially the same size, and pressing only the first substrate or the second substrate on which the adhesive layer is formed section.

In the present invention, the surface of the elastic sheet contacting the first substrate or the second substrate has a shape similar to that of the surface of the adhesive layer adhered to the first substrate or the second substrate, and is substantially the same size.

As an aspect of the invention, the elastic sheet contains a foamed resin having independent pores.

The display panel manufacturing apparatus of the present invention is an apparatus for manufacturing a display panel in which a pair of substrates including a display panel are bonded via an adhesive layer, and the manufacturing apparatus includes an adhesive layer forming portion. Forming an adhesive layer on a surface of at least one of the pair of substrates; bonding the portion, bonding the pair of substrates via the adhesive layer; and transferring the bonding portion to the bonding layer forming portion The pair of substrates are transferred between the portions; and the bonding portion includes a support portion that supports the first substrate, and a holding portion that holds the second base at a position facing the first substrate a driving unit that drives at least one of the support portion and the holding portion to bond a pair of substrates via the adhesive layer, and an elastic piece disposed on the support portion or the The surface of the holding portion has a shape similar to that of the adhesive layer and has substantially the same size, and only the portion of the first substrate or the second substrate on which the adhesive layer is formed is pressed.

According to one aspect of the invention, the adhesive layer forming portion includes a binder coating device that applies an adhesive to a surface of the at least one substrate to form the adhesive layer, and the adhesive coating device adjusts the adhesive. An adhesive layer is formed on the surface of the at least one substrate, and the adhesive layer has a surface similar to the surface shape of the first substrate or the second substrate in contact with the elastic sheet and having substantially the same size.

A method of manufacturing a display panel according to the present invention is a method of bonding a pair of substrates including a display panel via an adhesive layer to form a display panel, comprising: forming an adhesive layer on a surface of at least one of a pair of substrates a step of supporting the first substrate by the support portion, a step of holding the second substrate at a position facing the first substrate by the holding portion, and a step of the support portion and the holding portion by the driving portion At least one of driving, thereby bonding a pair of substrates via the adhesive layer; and in the step of bonding the pair of substrates, using the support portion or the holding portion The elastic sheet having a shape similar to the adhesive layer and having substantially the same size on the surface only presses the portion of the first substrate or the second substrate on which the adhesive layer is formed.

According to the present invention, the substrate is bonded via the elastic sheet, whereby even if there is uneven portion or undulation on the surface of the substrate, or there is an error in the parallelism or flatness of the plate pressing the substrate, the pressing force can be uniformly transmitted. To the bonding layer between the substrates. Further, by setting the elastic sheet to a shape similar to the adhesive layer and having substantially the same size, the elastic sheet presses only the portion of the substrate on which the adhesive layer is formed. Therefore, the adhesive layer is uniformly pressed through the substrate, and the other portions are not subjected to excessive force, so that the adhesive layer can be sufficiently stretched and adhered to the substrate to reduce the generation of voids. Thereby, a high-quality liquid crystal display panel can be manufactured at low cost, and a substrate bonding apparatus, a display panel manufacturing apparatus, and a display panel manufacturing method which improve manufacturing efficiency can be provided.

1‧‧‧ Coating Department

2‧‧‧Fitting Department

3‧‧‧ Hardening Department

4‧‧‧Transportation Department

5‧‧‧Loader

6‧‧‧Unloader

7‧‧‧Control device

10‧‧‧Binder coating device

11‧‧‧ platform

12‧‧‧ Coating unit

13‧‧‧UV irradiation unit

14‧‧‧Distributor

20‧‧‧Substrate bonding device

21‧‧‧ chamber

22‧‧‧ Lower side panel

23‧‧‧Upper side panel

24‧‧‧Elastic film

25‧‧‧ Lifting mechanism

30‧‧‧ Hardening device

31‧‧‧ platform

33‧‧‧UV irradiation unit

40‧‧‧Tactile sensor

100‧‧‧Display panel manufacturing device

L‧‧‧LCD panel

R‧‧‧Binder

R1‧‧‧ adhesive layer

S1‧‧‧ LCD panel

S2‧‧‧protection panel

S10‧‧‧ laminated panels

T‧‧‧ slot

Fig. 1 is a schematic configuration diagram of a display panel manufacturing apparatus according to an embodiment of the present invention.

2(A) to 2(D) are views showing the structure and operation of the application portion of the display panel manufacturing apparatus.

3(A) to 3(B) are views showing the structure and action of the bonding portion of the display panel manufacturing apparatus.

4(A) to 4(B) are schematic views for explaining the action of the elastic sheet at the time of bonding.

5(A) to 5(B) are diagrams for explaining a state in which the elastic sheet is not attached. intention.

6(A) to 6(B) are schematic views for explaining a bonding state in which an elastic piece is provided.

Fig. 7 is a schematic view showing a state in which the elastic sheet as a comparative example is larger than the adhesive layer.

Fig. 8 is a schematic view showing a state in which the elastic sheet as a comparative example is smaller than the adhesive layer.

9(A) to 9(B) are views showing the structure and action of the hardened portion of the display panel manufacturing apparatus.

10(A) to 10(B) are views showing the configuration and action of the application portion in the pressure distribution measurement test.

Fig. 11(A) is a pressure distribution diagram of the first embodiment, and Fig. 11(B) is a pressure distribution diagram of the fourth embodiment.

Fig. 12(A) is a pressure distribution diagram of Comparative Example 2, and Fig. 12(B) is a pressure distribution diagram of Comparative Example 3.

Fig. 13(A) is a pressure distribution diagram of the first pressure measurement test of Example 1 in Test 2, and Fig. 13(B) is a pressure distribution diagram of the 600th pressure measurement test of Example 1.

14(A) is a pressure distribution diagram of the first pressure measurement test of Example 2 in Test 2, and FIG. 14(B) is a pressure distribution diagram of the 600th pressure measurement test of Example 2.

Figure 15 (A) is the first pressure measurement test of Example 4 in Test 2. Fig. 15(B) is a pressure distribution diagram of the 600th pressure measurement test of Example 4.

Embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings. Further, in the embodiment, a liquid crystal display panel is used as an example of a display panel manufactured in the display panel manufacturing apparatus. Further, as an example of a pair of substrates bonded to each other in the substrate bonding apparatus, a liquid crystal panel as a display panel and a protective panel covering the liquid crystal panel are used. In other words, the liquid crystal panel and the protective panel are laminated and bonded via the adhesive layer, thereby constituting the liquid crystal display panel.

The adhesive layer can be formed by imparting an adhesive material to the surface of either of the liquid crystal panel and the protective panel, or both. As the adhesive material, for example, a binder using a resin or an adhesive film can be used. In the display panel manufacturing apparatus of the present embodiment, a case where an adhesive layer is formed using a binder will be mainly described.

[composition]

(display panel manufacturing device)

As shown in FIG. 1 , the display panel manufacturing apparatus 100 includes an application unit 1 , a bonding unit 2 , a curing unit 3 , and a conveying unit 4 . Further, the display panel manufacturing apparatus 100 includes a control device 7. The control device 7 performs control of the operation of the devices constituting each unit or control of the transfer timing of the substrate.

The transport unit 4 includes a transport element that transports the liquid crystal panel S1 and the protective panel S2 to each unit, and a drive mechanism. The transporting element can be considered, for example, a turntable, A conveyor or the like may be any device as long as it can transport the substrate between the respective portions.

The liquid crystal panel S1 and the protective panel S2 are carried into the display panel manufacturing apparatus 100 by a loader 5, and are transported by the transport unit 4. The application unit 1 , the bonding unit 2 , and the curing unit 3 are disposed along the transport unit 4 , and the liquid crystal panel S1 and the protective panel S2 are carried into and out of the respective units by a pickup element (not shown). The liquid crystal display panel L is manufactured through the steps which will be described in detail below in each section, and then unloaded from the display panel manufacturing apparatus 100 by an unloader 6.

(coating section)

As shown in FIGS. 2(A) to 2(D), the application unit 1 includes an adhesive application device 10 that applies an adhesive R to the surface of the substrate. In the present embodiment, the application portion 1 functions as an adhesive layer forming portion that forms an adhesive layer on the surface of the substrate by the adhesive R. The application of the adhesive R can be performed on either of the liquid crystal panel S1 and the protective panel S2 constituting the liquid crystal display panel, or both. In the present embodiment, an example in which the adhesive R is applied to the surface of the liquid crystal panel S1 will be described.

The adhesive application device 10 includes a stage 11 and an application unit 12 and an ultraviolet (UV) irradiation unit 13 disposed on the stage 11, and the stage 11 is placed on the conveyance unit 4 and is not shown. The component is picked up and carried into the liquid crystal panel S1 in the coating section 1.

The coating unit 12 applies the adhesive R to the liquid crystal panel S1. The coating unit 12 includes a tank T that houses the adhesive R, and a dispenser 14 that is connected to the tank T via a pipe. As the dispenser 14, for example, a slit coater having a slit-shaped nozzle at its tip end can be used. The dispenser 14 is configured to be movable on the stage 11 by a scanning device (not shown), and ejects the adhesive R contained in the groove T onto the liquid crystal panel S1. In addition, the coating area of the adhesive R can be adjusted by the scanning device. Further, the coating unit 12 includes an advance/retract driving element (not shown), and drives the coating unit 12 so as to be movable forward and backward with respect to the stage 11. Of course, the platform 11 can be driven as long as the coating unit 12 moves relative to the platform 11.

As shown in FIG. 2(A), the coating unit 12 enters above the stage 11, and the adhesive R is ejected from the nozzle of the dispenser 14 onto the liquid crystal panel S1. The dispenser 14 is scanned by a scanning device, whereby the adhesive R is supplied over the entire surface of the liquid crystal panel S1. Further, when a slit coater is used as the dispenser 14, as shown in Fig. 2(B), a projection is formed on the outer edge portion. When the coating is completed, the coating unit 12 is retracted from above the stage 11.

The UV irradiation unit 13 includes one or a plurality of lamps or light emitting diodes (LEDs) that emit ultraviolet rays (UV), and is disposed above the stage 11. As shown in FIG. 2(C), the UV irradiation unit 13 performs UV irradiation on the adhesive R coated on the surface of the liquid crystal panel S1.

In the present embodiment, the binder R is an ultraviolet (UV) curable resin. Therefore, the adhesive R is hardened by UV irradiation. However, the UV irradiation in the coating portion 1 is performed under a weak irradiation intensity or in the atmosphere so as not to cause oxygen inhibition. Therefore, the binder R becomes a so-called temporarily hardened state in which the unhardened portion remains widely. That is, the UV irradiation unit 13 functions as a temporary hardened portion of the display panel manufacturing apparatus. As a result, as shown in FIG. 2(D), an adhesive layer R1 having a predetermined thickness in which the adhesive R is temporarily cured is formed on the surface of the liquid crystal panel S1. Further, as described above, when a slit coater is used as the dispenser 14, the outer edge portion on the upper surface side of the adhesive layer R1 is convex, and a depression is formed on the inner side which is very close thereto.

Since the flow of the adhesive layer R1 is suppressed, the flow of the adhesive layer R1 is suppressed, and the coating of the coating shape or the adhesion of the adhesive layer R1 to the outside of the panel is prevented during the time of the transfer or the like until the bonding is performed as described later. Further, since the unhardened portion remains, the adhesiveness or cushioning property of the adhesive layer R1 is maintained.

However, even in the temporarily hardened state, the adhesive layer R1 retains a little fluidity. As described above, the adhesive R is applied so as to extend over the entire surface of the liquid crystal panel S1, but is applied so as to slightly leave the edge [outer edge] portion of the liquid crystal panel S1. Thereby, in the bonding which will be described later, the adhesion layer R1 is prevented from spreading over the slightly remaining portion of the panel, and excessive exposure to the outside of the panel is prevented.

Further, in the example of FIG. 2, it is considered that the adhesive layer R is applied so as to slightly extend the edge portion of the liquid crystal panel S1 at the time of bonding, but this is always an example. The coating can be applied so as to reach the edge of the liquid crystal panel S1 depending on the viscosity of the adhesive R or the hardness of the adhesive layer R1 after the temporary curing.

The liquid crystal panel S1 in which the adhesive layer R1 is formed is carried out from the coating unit 1 by a pick-up element (not shown), and is carried by the transport unit 4 and carried into the bonding unit 2 . Here, the protective panel S2 is also carried into the bonding unit 2. The transport time point of the liquid crystal panel S1 and the protective panel S2 is performed so as to be merged in the bonding unit 2 Adjustment can be, not limited to one.

For example, the protective panel S2 and the liquid crystal panel S1 are simultaneously carried into the display panel manufacturing apparatus 100, but the protective panel S2 is carried into the bonding unit 2 after passing through the coating unit 1. Further, during the application of the adhesive R to the liquid crystal panel S1 by the application unit 1, the protective panel S2 can stand by in the bonding unit 2. Alternatively, the protective panel S2 may be carried into the display panel manufacturing apparatus 100 at a later time than the liquid crystal panel S1, and may be carried into the bonding portion 2 at the same time as the liquid crystal panel S1 applied in the coating unit 1 is completed. in.

Further, when an adhesive film is used as the adhesive material, the display panel manufacturing apparatus 100 may be provided with a film adhesive portion instead of the application portion 1. In the film adhesive portion, for example, an adhesive film is adhered to the surface of the liquid crystal panel S1. The adhesive film is formed by forming an adhesive surface on both sides and a release paper adhered to one adhesive surface. The adhesive surface to which the release paper is not adhered is superimposed on the surface of the liquid crystal panel S1 to be adhered, and the release paper is peeled off, whereby an adhesive layer can be formed. As for the adhesion of the adhesive film and the peeling of the release paper, an existing device can be used. Further, instead of providing the film sticking portion, the adhesive film may be adhered to the liquid crystal panel S1 before being carried into the display panel manufacturing apparatus 100.

(Fitting Department)

As shown in FIG. 3(A), the bonding unit 2 includes a substrate bonding apparatus 20 that laminates and bonds the liquid crystal panel S1 and the protective panel S2. The substrate bonding apparatus 20 has a configuration in which the lower side plate 22 and the upper side plate 23 are opposed to each other in the chamber 21. The chamber 21 is movable up and down, and when moving upward, the lower side plate 22 and the upper side plate 23 are opened to the outside, and can be carried into the liquid crystal panel S1 and the protective panel S2. If moving downward, the lower side plate 22 The upper side plate 23 is housed in the chamber 21, and a sealed space is formed inside the chamber 21. The chamber 21 can adjust the internal pressure by an exhaust member (not shown). In other words, when the liquid crystal panel S1 and the protective panel S2 are carried in, the chamber 21 is lowered, the inside is sealed, the pressure is reduced, and the pressure is applied in a reduced pressure environment.

The lower side plate 22 serves as a support portion for supporting the substrate placed on the board. The upper side plate 23 serves as a holding portion, and the holding mechanism holds the substrate. In the present embodiment, a case where the liquid crystal panel S1 to which the binder R is applied is supported by the lower side plate 22 and the protective panel S2 is held by the upper side plate 23 will be described as an example.

As the holding mechanism of the upper side plate 23, for example, an electrostatic chuck, a mechanical chuck, a vacuum chuck, an adhesive chuck, and the like which are currently or in the future can be applied. It is also possible to use multiple chucks together. The upper side plate 23 is provided with a lifting mechanism 25 as a driving unit. By the elevating mechanism 25, the upper side plate 23 can be moved in contact with and separated from the lower side plate 22, and as shown in FIG. 3(B), the protective panel S2 held by the upper side plate 23 is pressed against the liquid crystal panel supported by the lower side plate 22. S1 comes up to build up. The liquid crystal panel S1 and the protective panel S2 are bonded via the adhesive layer R1 formed on the surface of the liquid crystal panel S1, thereby forming the laminated panel S10.

The lower side plate 22 may have the same holding mechanism as the upper side plate 23 so that the position of the liquid crystal panel S1 to be placed does not deviate. An elastic piece 24 is attached to the surface of the lower side plate 22 on which the liquid crystal panel S1 is placed. The elastic piece 24 is a sheet having a predetermined thickness, and protrudes from the surface of the lower side plate 22 by a distance corresponding to the thickness. Therefore, the lower side plate 22 supports the liquid crystal panel S1 via the elastic piece 24.

The elastic sheet 24 may contain, for example, a soft resin. As a soft resin, for example A foamed resin is used. The foamed resin has a large number of pores formed therein, and contains gas in the pores, so that the elasticity is high. Further, the pores formed inside the foamed resin are desirably independent pores. The individual holes are ones that are occluded and independent. On the other hand, a single hole is connected to another hole and the continuous one is called a continuous hole. When the pores are continuous pores, the contained gas is easily detached, and it is difficult to maintain elasticity. If the pores are independent pores, the contained gas is hard to be detached, and stable elasticity can be maintained for a long time. As the foamed resin in which the individual pores are formed, for example, foamed enamel can be used. In addition, as the soft resin, for example, a resin rubber such as a nitrile rubber, a fluororubber, or a urethane rubber, or a resin gel such as a ruthenium gel may be used.

Further, it is not necessary that all the pores of the foamed resin are independent pores, and as long as about 80% or more of the pores are independent pores, continuous pores may be present. Further, it is also possible to have no holes on the front and back surfaces of the elastic sheet 24, and only holes are provided inside. Alternatively, a continuous hole may be formed on the front and back surfaces, and an independent hole may be formed inside. In this case, it is sufficient that approximately 80% or more of the internal pores are independent holes.

The elastic sheet 24 is determined in such a manner as to become substantially the same size as the adhesive layer R1 formed on the surface of the liquid crystal panel S1. Specifically, the upper surface of the elastic sheet 24, that is, the surface in contact with the liquid crystal panel S1 has a shape similar to that of the surface of the adhesive layer R1 attached to the side of the liquid crystal panel S1 and has substantially the same size. Further, it is preferable that the lower surface of the elastic piece 24 which is in contact with the lower side plate 22 is also a shape similar to the upper surface and substantially the same size, that is, a shape similar to the adhesive layer R1 and substantially the same size. The thickness of the elastic piece 24 may be the same as that of the adhesive layer R1, but may or may not with. When the liquid crystal panel S1 is placed on the lower side plate 22, the liquid crystal panel S1 is formed such that the adhesive layer R1 formed on the surface of the liquid crystal panel S1 and the elastic sheet 24 disposed on the lower side plate 22 are approximately overlapped as viewed from above. The opposite.

The function of the elastic piece 24 at the time of bonding will be described with reference to Figs. 4(A) to 4(B). As shown in FIG. 4(A), when the upper side plate 23 is lowered and the lower side plate 22 is pressed via the two panels, a reaction force for pressing the upper side plate 23 from the lower side plate 22 occurs. Here, since the elastic piece 24 is interposed between the lower side plate 22 and the liquid crystal panel S1, the reaction force is transmitted from the liquid crystal panel S1 to the adhesive layer R1 via the elastic piece 24. The adhesive layer R1 is stretched by pressing force. As shown in Fig. 4(B), the projection of the outer edge portion of the adhesive layer R1 is also crushed to reach the outer edge of the panel. The elastic piece 24 is also subjected to pressing force and stretched by elasticity.

Here, a description will be given of a situation in which the substrate bonding apparatus 20 does not include the elastic sheet 24 and may be generated when the liquid crystal panel S1 is directly placed on the lower side plate 22. As shown in FIG. 5(A), when there is a state in which the liquid crystal panel S1 is undulated or curved and its surface is uneven, a slight gap is generated between the lower side plate 22 and the liquid crystal panel S1. Due to this gap, there is a possibility that the pressing force of the lower side plate 22 is not uniformly transmitted into the adhesive layer R1 in the adhesive layer R1. In particular, when the slit coater is used for the application of the adhesive R as described above, protrusions may be formed on the outer edge portion of the adhesive layer R1, and a concave portion may be formed on the inner side. If the projection cannot be sufficiently extended, as shown in Fig. 5(B), there is a possibility that the recessed portion on the inner side of the projection remains. In particular, when the adhesive is applied and the temporary hardening is performed before the bonding, since the adhesive is difficult to stretch, the influence becomes remarkable.

As described above, since the inside of the chamber 21 is decompressed, there is not much air entering between the substrates. However, if the adhesive layer R1 is not completely stretched as described above and the depressed portion remains, the bubble may be formed. Clearance (vacuum bubble). In addition, when most of such vacuum bubbles are carried out from the bonding unit 2 and returned to atmospheric pressure, they are crushed by atmospheric pressure and disappear, but they are not all pressed due to the state of the adhesive, particularly the surface shape. Broken and left.

On the other hand, when bonding is performed under the atmosphere, air is naturally present in the recessed portion where the adhesive layer R1 is not completely stretched, and further, since the air has a repulsive force, the possibility of generating bubbles is further improved. Further, in the present embodiment, the bubble-like gap, that is, the vacuum bubble or the bubble is collectively expressed as a void.

On the other hand, when the elastic piece 24 is present, as shown in Fig. 6(A), the elastic piece 24 is flexed and conforms to the undulation or bending, so that the pressing force of the lower side plate 22 is uniformly transmitted to the entire surface of the adhesive layer R1. As shown in Fig. 6(B), the outer edge portion of the adhesive layer R1 is sufficiently stretched, and the concave portion including the inner side is flattened and becomes uniform. Thereby, the generation of voids is reduced.

Further, as described above, the elastic sheet 24 has a shape similar to that of the adhesive layer R1 and has substantially the same size, and the liquid crystal panel S1 is aligned such that the adhesive layer R1 and the elastic sheet 24 are approximately overlapped as viewed from above. Thereby, only the portion of the liquid crystal panel S1 where the adhesive layer R1 is formed is pressed, and the other portions are not subjected to excessive force. Alternatively, it is also possible to prevent a part of the portion in which the adhesive layer R1 is formed from being insufficiently pressed. As a result, it is possible to prevent the adhesive layer R1 from being insufficiently stretched or stretched.

Here, as a comparative example, a case where the elastic piece 24 is larger than the adhesive layer R1 and the case where the elastic piece 24 is smaller than the adhesive layer R1 will be described with reference to FIGS. 7 and 8.

As shown in FIG. 7, when the elastic piece 24 is larger than the adhesive layer R1, the portion of the liquid crystal panel S1 where the edge of the adhesive layer R1 is not formed is excessively pressed upward by the elastic piece 24. Thereby, the portion of the edge of the liquid crystal panel S1 is curved, and the force that presses the adhesive layer R1 toward the inside acts. Thereby, there is a possibility that the stretching of the adhesive layer R1 in the direction of the outer edge of the panel is hindered, the projection of the outer edge portion is not sufficiently crushed, the recessed portion remains, and a void is generated.

As shown in FIG. 8, when the elastic piece 24 is smaller than the adhesive layer R1, a portion which is not pressed by the elastic piece 24 is generated in the adhesive layer R1. In particular, when the outer edge portion of the adhesive layer R1 is not pressed, there is a possibility that the projection of the outer edge portion is not crushed, and the recessed portion on the inner side remains, and voids are generated.

As described above, in the case where the elastic sheet 24 is larger than the adhesive layer R1 and the elastic sheet 24 is smaller than the adhesive layer R1, the adhesive layer R1 is not sufficiently stretched, so that the possibility of void generation is improved. On the other hand, in the present embodiment, since the elastic sheet 24 has a shape similar to that of the adhesive layer R1 and has substantially the same size, the adhesive layer R1 is pressed without any omission via the elastic sheet 24, and the adhesive layer R1 is not formed. The panel section is not subject to extra force. Thereby, the adhesive layer R1 is stretched to the outer edge of the panel, and the projections or depressions of the outer edge portion can be crushed neatly, so that the generation of voids is reduced.

Furthermore, although it is of course derived from the purpose of the embodiment, However, the term "similar shape and substantially the same size" means that the shape and size of the adhesive layer R1 and the elastic sheet 24 may be the same, but need not be identical. Even if there is a slight difference in shape and size between the adhesive layer R1 and the elastic sheet 24, as shown in FIGS. 7 and 8, the portion of the liquid crystal panel S1 where the adhesive layer R1 is not formed is affected as long as it does not cause the following phenomenon. The phenomenon of voids generated by excess force or voids due to the presence of unpressed portions in the adhesive layer R1 is also included in "similar shapes and substantially the same size".

Further, the shape and size of the adhesive layer R1 formed on the surface thereof vary depending on the shape and size of the substrate. Therefore, the elastic piece 24 can be replaced in accordance with the type of the substrate. For example, a substrate can be prepared, attached to a substrate by a double-sided tape or the like, and attached to and detached from the substrate together with the substrate. Alternatively, it may be attached directly to the lower side panel 22 every time it is replaced.

The elastic sheet 24 is preferably at least one which can be measured by an Asker C hardness tester. More preferably, the hardness of the elastic sheet can be 15 or more and 85 or less. The reason for this is that if the elastic sheet 24 is too soft, the stretching is excessive, and as shown in FIG. 7, there is a possibility that the elastic sheet 24 is larger than the adhesive layer R1, and the stretching of the adhesive layer R1 is hindered. Further, there is a possibility that the stretched elastic sheet 24 is exposed and attached on the substrate side due to the material of the elastic sheet 24, and a part of the adhesive layer R1 is peeled off after the pressing is released, resulting in a void. Further, the elastic piece 24 is extremely crushed by pressing and loses elasticity. Conversely, if the hardness of the elastic sheet 24 is too high, there is a possibility that the undulation or bending of the liquid crystal panel S1 is no longer followed. Further, in order to make the elastic sheet 24 difficult to be affected by the change over time, the hardness of the elastic sheet 24 can be set to 35.

Further, when an adhesive film is used as the adhesive material, it is difficult to think that a bump is generated in the adhesive layer R1 as in the case of using the adhesive R. However, if the liquid crystal panel S1 is undulated or bent to be uneven, a gap may be generated between the adhesive film and the liquid crystal panel S1. Therefore, by using the elastic sheet 24 in the same manner as in the case of the binder R, the occurrence of voids can be reduced.

The laminated panel S10 formed by bonding the liquid crystal panel S1 and the protective panel S2 is carried out from the bonding unit 2 by a pick-up element (not shown), and is carried by the transport unit 4 and carried into the hardened portion 3.

(hardened part)

As shown in FIGS. 9(A) to 9(B), the hardened portion 3 includes a curing device 30 that is substantially cured by the adhesive layer R1 that is temporarily cured in the coating portion 1. The curing device 30 includes a stage 31 on which the laminated panel S10 is placed, and a UV irradiation unit 33 disposed on the stage 31. The UV irradiation unit 33 includes one or a plurality of UV lamps or LEDs that emit ultraviolet rays (UV). The irradiation intensity of the UV irradiation unit 33 is adjusted so as to be irradiated with ultraviolet rays necessary for completely curing the adhesive layer R1 which is temporarily hardened in the coating portion 1. Of course, the same is true for the case where the adhesive layer not accompanied by temporary hardening is completely hardened.

Further, when the adhesive film is used as the adhesive material, the hardened portion 3 is not required. Further, the display panel manufacturing apparatus can perform other steps before or after the coating portion 1, the bonding portion 2, and the curing portion 3. Therefore, the display panel manufacturing apparatus may include, for example, imaging the appearance of the substrate in the front stage of the application unit 1 or the front stage of the bonding unit 2 to perform alignment The alignment unit or a tape unit that bundles the completed liquid crystal display panel.

[effect]

The operation of this embodiment having the above configuration will be described.

First, as shown in FIG. 1, the liquid crystal panel S1 and the protective panel S2 are carried in the display panel manufacturing apparatus 100 by the loader 5, and are conveyed by the conveyance part 4. The liquid crystal panel S1 is carried into the coating unit 1 by a pickup element (not shown), and is placed on the stage 11 of the adhesive application device 10 as shown in FIGS. 2(A) to 2(D).

When the liquid crystal panel S1 is placed on the stage 11, the coating unit 12 enters above the stage 11. The adhesive R accommodated in the groove T is applied to the surface of the liquid crystal panel S1 via the dispenser 14 (Fig. 2(A)). Scanning is performed by the scanning device, and as shown in FIG. 2(B), the adhesive R is applied so that the portion of the edge of the liquid crystal panel S1 is slightly left and spread over the entire surface. When the application of the adhesive R is completed, the coating unit 12 is retracted from above the stage 11.

Then, the adhesive R is irradiated with UV by the UV irradiation unit 13, and the adhesive R is temporarily hardened (Fig. 2(C) and Fig. 2(D)). Thereby, an adhesive layer R1 having a predetermined thickness is formed on the surface of the liquid crystal panel S1.

The liquid crystal panel S1 in which the adhesive layer R1 is formed is carried out from the coating unit 1 and transported again by the conveying unit 4. Then, it is carried into the bonding unit 2 by a pickup element (not shown), and is placed on the lower side plate 22 of the substrate bonding apparatus 20 as shown in FIG. 3(A). At this time, the surface on which the adhesive layer R1 is formed faces upward. The protective panel S2 is also carried into the bonding unit 2, and delivered to the upper side plate 23, and then protected. Hold the organization to keep it. At this time, since the chamber 21 moves upward, the lower side plate 22 and the upper side plate 23 are opened. When the conveyance of the two panels is completed, the chamber 21 is driven downward, and the lower side panel 22 and the upper side panel 23 are housed inside the chamber 21. A sealed space is formed inside the chamber 21, and the inside of the sealed space is depressurized by an exhaust member (not shown).

Further, as shown in FIG. 3(B), the upper side plate 23 is lowered toward the lower side plate 22, and the protective panel S2 held by the upper side plate 23 is pressed against the liquid crystal panel S1 supported by the lower side plate 22. The adhesive layer R1 formed on the surface of the liquid crystal panel S1 is pressed against the lower side plate 22 via the liquid crystal panel S1, and is adhered to both of the panels, thereby bonding the two panels. At the time of bonding, even if there is a slight error in the parallelism or flatness of the upper side plate and the lower side plate, in addition, even if there is undulation or bending on the surface of the liquid crystal panel S1, since the elastic piece 24 mounted on the lower side plate 22 conforms to the undulation or Bending, so the adhesive layer R1 is also uniformly pressed. Further, since the elastic sheet 24 has a shape similar to that of the adhesive layer R1 and has substantially the same size, only the portion where the adhesive layer R1 is formed is pressed in the liquid crystal panel S1, and the other portions are not subjected to excessive force. Thereby, the adhesive layer R1 is in close contact with the liquid crystal panel S1 and the protective panel S2, and generation of voids is reduced.

When the bonding of the liquid crystal panel S1 and the protective panel S2 is completed, the decompressed state is released, and the chamber is moved upward to open the sealed space. The laminated panel S10 is carried out from the bonding unit 2, and is again transported by the transport unit 4. Then, the pickup element (not shown) is carried into the hardened portion 3. Further, during the transfer from the bonding unit 2 to the hardened portion 3, the laminated panel S10 can be placed in the atmosphere for a fixed period of time. During this standing time, the laminated panel S10 is pressed by atmospheric pressure to be stabilized. In addition, even in A void remains in the adhesive layer R1, and the void can be reduced by being left for a sufficient period of time.

In the hardened portion 3, as shown in Figs. 9(A) to 9(B), the laminated panel S10 is placed on the stage 31, and the UV irradiation unit 33 is used to irradiate the temporarily hardened adhesive layer R1 to be completely hardened. The intensity of the ultraviolet rays completes the formal hardening of the adhesive layer R1.

[Examples]

Each of the examples and comparative examples of the display panel manufacturing apparatus and the substrate bonding apparatus of the present embodiment was tested, and the characteristics were evaluated.

In each of the examples and the comparative examples, the overall configuration of the display panel manufacturing apparatus and the substrate bonding apparatus is the same, but the elastic sheet 24 is prepared to have different shapes, sizes, materials, and hardnesses.

[Test 1]

For each of the examples and the comparative examples, a lamination test was carried out under the following conditions.

‧ Pressing pressure when bonding... 3.0kg/cm ²

‧Substrate...glass, 152.4×91.4 (mm) rectangle, thickness 0.7mm

‧Environmental pressure when fitting...30Pa

‧Adhesive material...UV (UV) hardening resin with a viscosity of 2900mPa‧s

‧Adhesive layer...approximately 150×90 (mm) (formed to be approximately the same shape (similar shape) as the substrate and approximately the same size)

‧Binder coating thickness...200μm

‧ elastic sheet... thickness is 3mm

‧ Temporary hardening UV intensity... Accumulated light amount is 631mJ/cm2

The ultraviolet curable resin which forms an adhesion layer is apply|coated from the outer edge of a board|substrate to the inner side of about 1 mm. By coating as described above, the adhesive layer becomes substantially the same shape and size as the substrate at the time of bonding.

After the bonding, it was visually confirmed whether or not a void was formed between the substrate and the adhesive layer R1. For those who have voids, the location where the voids are generated is also confirmed. The conditions of the elastic sheets of the respective Examples and Comparative Examples and the presence or absence of voids are shown in Table 1 below.

The hardness is measured according to the Japan Rubber Association standard specification (SRIS0101) and using an Aska C hardness tester. Further, since the ruthenium gel of Example 3 was too soft, the hardness could not be measured by an Aska C hardness tester. The ruthenium gel of Example 3 The penetration measured according to the Japanese standard specification (JIS K2207) was 50 to 55. In the elastic sheets 24 of Examples 1 to 4 and Comparative Example 4, an elastic sheet having the same size as that of the adhesive layer when the ultraviolet curable resin was applied, that is, an elastic sheet of 150 × 90 (mm) was used. As described above, the adhesive layer has substantially the same shape and size as the substrate at the time of bonding, but the difference from each side of the elastic sheet 24 is about 1 mm to 2 mm, and it can be said that the elastic sheet 24 and the adhesive layer have substantially the same shape. Roughly the same size. The elastic sheet 24 of Comparative Example 2 used an elastic sheet each having a side shorter than the adhesive layer R1 by 10 mm. The elastic sheet 24 of Comparative Example 3 used an elastic sheet each having a length of 10 mm longer than the adhesive layer R1. In Comparative Example 1, the elastic sheet 24 was not provided and bonded.

With respect to Example 1, Example 4, Comparative Example 2, and Comparative Example 3, a measurement test of the pressure distribution at the time of bonding was also performed. The pressure distribution was measured under substantially the same conditions as the bonding test, but the adhesive layer R1 was not formed, and the upper side plate 23 and the elastic layer of the substrate bonding apparatus 20 were as shown in Figs. 10(A) to 10(B). A tactile sensor is disposed between the sheets 24. The pressure distribution applied to the substrate is measured by sandwiching the substrate held by the upper side plate 23 and the substrate placed on the elastic piece 24 into the tactile sensor. Fig. 11(A) shows a pressure distribution diagram of the first embodiment, and Fig. 11(B) shows a pressure distribution diagram of the fourth embodiment. Fig. 12(A) shows a pressure distribution diagram of Comparative Example 2, and Fig. 12(B) shows a pressure distribution diagram of Comparative Example 3.

In each of the figures, the pressure distribution has a reference pressure of 100, and a numerical range of 0 to 100 is divided into 16 equal parts, and each range is expressed by the following color chart.

0 (dark blue) ~ 36 (light blue) ~ 50 (green) ~ 70 (yellow) ~ 94 (red) ~100 (pink)

However, since the graph converts the color chart into a gray scale display, there is also a portion that is difficult to distinguish. Add a note to the hard-to-discriminate part. Further, in FIGS. 12 to 14, the color chart is converted into a gradation display.

The results of the test are studied below.

<The presence or absence of elastic sheets>

In Comparative Example 1 in which the elastic sheet 24 was not used, a void was generated in the vicinity of the central portion and the outer edge of the substrate, that is, the void was entirely generated. It is considered that since the pressing force of the lower side plate 22 is not uniformly transmitted to the adhesive layer R1, voids are generated in an all-round manner. On the other hand, Examples 1 to 4 using the elastic sheets are in a state in which voids are not generated or voids are generated only in a part. It is understood that by using the elastic sheet, the pressing force of the lower side plate 22 is uniformly transmitted to the adhesive layer R1, whereby the generation of voids is greatly reduced.

<About the shape and size of the elastic piece>

In Example 1, Comparative Example 2, and Comparative Example 3, the elastic sheet 24 was formed using foamed enamel having a hardness of 35, but the shape and size of the elastic sheet 24 were changed. In the first embodiment, the elastic sheet 24 having the same shape and size as the adhesive layer R1 was used. In Comparative Example 2, the elastic sheet 24 which is smaller than the adhesive layer R1 was used. In Comparative Example 3, an elastic sheet 24 larger than the adhesive layer R1 was used. In Example 1, no void was generated, and in Comparative Example 2 and Comparative Example 3, voids were not formed in the central portion of the substrate, but voids were formed in the vicinity of the outer edge.

As described above, when the elastic sheet 24 is smaller than the adhesive layer R1, a portion which is not pressed by the elastic sheet 24 is generated in the vicinity of the outer edge of the adhesive layer R1. Comparison in Figure 12(A) In the pressure profile of Example 2, the portion of the color on the upper left and the right side in the figure indicates a portion where the pressure is weak. In addition, the difference between the lower side portion and the upper side portion in the drawing indicates that the pressing force is not uniform and is pressed slightly slightly. As can be seen by observing the pressure distribution, it is understood that the pressure near the outer edge of the substrate is weak. Therefore, it is considered that the projection of the outer edge portion of the adhesive layer R1 is not crushed and the recess remains, and a void is formed in the periphery of the substrate.

Further, when the elastic piece 24 is larger than the adhesive layer R1, as described above, the outer edge portion of the substrate is excessively pressed upward by the elastic piece 24. Therefore, it can be considered that the stretching of the adhesive layer R1 is hindered, and a void is generated in the vicinity of the outer edge. As is apparent from the pressure profile of Comparative Example 3 of FIG. 12(B), it is understood that there are portions having different colors on the upper and lower right sides in the drawing, and the pressure distribution of the portions corresponding to the substrates is not uniform. The lower outer edge portion in the drawing generates a slightly stronger pressure, but the pressure of the white portion located on the upper side or the center thereof is weak. The pressure in the slightly white portion of the right side and the upper side of the figure is also weak. In the lamination test, the occurrence of voids was confirmed in the low pressure portion which was observed throughout the entire outer edge in the pressure distribution.

On the other hand, in Example 1 in which the elastic sheet 24 having the same shape and size as that of the adhesive layer R1 was used, no void was generated. As is apparent from the pressure profile of FIG. 11(A), in the first embodiment, it is approximately 94% or more of the reference pressure and the pressure distribution is uniform. Therefore, it is understood that the elastic sheet 24 is uniformly pressed against the portion of the substrate on which the adhesive layer R1 is formed, and the void is effectively reduced.

<About the material of the elastic sheet>

In Example 1 and Example 2, which used foamed enamel as the material of the elastic sheet 24, no void was generated. It can be considered that the reason is that since the foamed enamel is formed with independent holes, This is highly elastic by the contained air, and the adhesive layer R1 can be uniformly pressed.

On the other hand, although the foamed urethane used in the comparative example 4 has a void, the void was generated comprehensively. The reason for this is considered to be that the foamed urethane has a continuous pore, and the contained air easily escapes, and the force for pressing the adhesive layer R1 is weak.

In Example 3 and Example 4, a non-porous enamel gel and a nitrile rubber were used. Both of Example 3 and Example 4 generate voids in a part, but it is possible to prevent the generation of a total void. It is considered that both the ruthenium gel and the nitrile rubber are materials which are not formed with voids but have elasticity, so that the voids can be reduced to some extent. However, it is also considered that there are other factors in the generation of voids in the ruthenium gel. Since the ruthenium gel is a very soft material, the gel is stretched and adhered from the lower side plate toward the substrate side at the time of bonding, and is also attached to the substrate after the pressing is released. When the attached ruthenium gel is peeled off, a part of the adhesive layer R1 is also peeled off, so that a portion which is not bonded by the adhesive layer R1 is formed on one side of the substrate. As a result, it is considered that a void is generated.

Regarding Example 4 using a nitrile rubber, the pressure distribution is shown in Fig. 11(B), and in the figure, the portion having a low pressure was confirmed at the edge portions of the center portion, the upper side, and the right side. The center of the figure appears thick, but it is a pressure indicating about 10% of the pressure reference value below the color chart, and it can be confirmed that the pressure is relatively low. The lightly visible portion of the upper and right edge portions represents a pressure of 50% to 70% of the pressure reference value. The portion of the portion surrounding the central portion where the pressure is low represents a pressure of approximately 100% of the pressure reference value. That is, it is understood that in the fourth embodiment, although the effect of reducing the void is obtained, the pressure difference is large.

<About the hardness of the elastic sheet>

As described above, in the third embodiment, it was confirmed that a part of the adhesive layer R1 was peeled off, and one of the reasons was considered to be that the ruthenium gel was soft to the extent that it could not be measured by the Aska C hardness tester. . From this result, the elastic sheet 24 desirably has a hardness to the extent that it can be measured by at least an Aska C hardness meter. Further, in the elastic sheets 24 of the first, second, and fourth examples having the hardness of 15, 35, and 85, the effect of reducing the voids was confirmed. Therefore, the hardness is preferably 15 or more and 85 or less.

[Test 2]

It is considered that the hardness of the elastic sheet 24 also affects the temporal change of the elastic sheet 24. Therefore, the durability test was carried out for Example 1 using a foamed crucible having a hardness of 35, Example 2 using a foamed crucible having a hardness of 15, and Example 4 using a nitrile rubber having a hardness of 85.

As the endurance test, 600 bonding tests were performed under the following conditions, and it was confirmed whether or not voids were generated in each of the first bonding and the 600th bonding.

‧ Pressing pressure when bonding... 3.0kg/cm ²

‧Substrate...glass, 152.4×91.4 (mm) rectangle, thickness 0.7mm

‧Environmental pressure when fitting...30Pa

‧Adhesive material...Adhesive film with a thickness of 150μm

‧Adhesive layer...152.4×91.4 (mm) (cut the adhesive film in such a way that it becomes the same shape and the same size as the substrate)

‧ elastic sheet... thickness is 3mm

The conditions of the endurance test were substantially the same as those of the test of the test 1, but an adhesive film was used instead of the ultraviolet curable resin as the adhesive material. Therefore, temporary hardening is also not performed.

Further, regarding Example 1, Example 2, and Example 4, 600 pressure distribution measurement tests were also performed under the same conditions as in Test 1.

The results of the respective tests are shown in Table 2 below.

Fig. 13(A) is a pressure distribution diagram in the first pressure distribution measurement test of Example 1, and Fig. 13(B) is a pressure distribution diagram in the 600th pressure distribution measurement test of Example 1. Figure 14 (A) shows the first pressure distribution measurement of Example 2. The pressure distribution map in the test, and FIG. 14(B) is the pressure distribution diagram in the 600th pressure distribution measurement test of Example 2. Fig. 15(A) is a pressure distribution diagram in the first pressure distribution measurement test of Example 4, and Fig. 15(B) is a pressure distribution diagram in the 600th pressure distribution measurement test of Example 4.

In Example 1 in which foamed enamel having a hardness of 35 was used, voids were not generated even after bonding for 600 times. Further, as is clear from FIG. 13(A) and FIG. 13(B), the pressure distribution is substantially uniform regardless of the first time or the sixth time. Even the 600th time became more even. Therefore, it is understood that the change in the time-lapse of the foamed enamel having a hardness of 35 is small.

In Example 2 in which foamed enamel having a hardness of 15 was used, voids were not generated even after bonding for 600 times. However, as is apparent from comparison between FIG. 14(A) and FIG. 14(B), the pressure distribution is uniform in the first time, but in the 600th time, the upper portion of the figure produces a white portion, and pressure is generated. Slightly weaker part. That is, the change with time was observed in the foamed enamel having a hardness of 15.

In Example 4 in which a nitrile rubber having a hardness of 85 was used, no void was observed as compared with the result of Test 1, but it was considered that the reason was that a tacky film having a uniform surface was used instead of a binder which forms a projection at the edge portion as a bonding. material. However, as shown in Fig. 15(A), the pressure distribution has a white portion at the center, and a portion where the pressure is weak can be confirmed at the center portion of the substrate. Further, it is understood that in the 600th time, as shown in FIG. 15(B), the white portion at the center increases, and the portion where the pressure at the center is weak is expanding. Therefore, even if an adhesive film is used, the occurrence of voids is confirmed in the center of the substrate. That is, the change with time was observed in the nitrile rubber having a hardness of 85.

According to the above results, in order to make the elastic sheet 24 difficult to be affected by the change with time, it is desirable to make the hardness of the elastic sheet larger than the hardness 15 and less than 85. When the hardness is 15 or less, the elastic sheet 24 is likely to sink due to a change with time, and the adhesive layer may not be sufficiently pressed, and the occurrence of voids may increase. In addition, when the hardness is 85 or more, the elastic sheet may become harder due to the change over time, and the adhesive layer may not be sufficiently pressed, and the occurrence of voids may increase. If the hardness of the elastic sheet 24 is set to 35, more desirable results can be obtained. Of course, this is ideal in terms of the influence of the change over time, and even if the hardness is 15 or the hardness is 85, the voids can be appropriately reduced by periodically replacing the elastic sheet 24.

[effect]

(1) The substrate bonding apparatus 20 of the present embodiment bonds the liquid crystal panel S1 and the protective panel S2 via the adhesive layer R1 formed on the surface of the liquid crystal panel S1, and includes the lower side plate 22 as a support portion, and supports The liquid crystal panel S1; the upper side plate 23 as the holding portion holds the protective panel S2 at a position facing the liquid crystal panel S1; and the elevating mechanism 25 drives the upper side plate 23 to thereby protect the liquid crystal panel S1 via the adhesive layer R1. The panel S2 is bonded; the elastic sheet 24 is provided on the surface of the lower side panel 22, has substantially the same shape and size as the adhesive layer R1, and only presses the portion of the liquid crystal panel S1 where the adhesive layer R1 is formed. Specifically, the surface of the elastic sheet 24 that contacts the liquid crystal panel S1 has a shape similar to that of the surface of the adhesive layer R1 attached to the liquid crystal panel S1 and has substantially the same size.

The liquid crystal panel S1 and the protective panel S2 are attached via the elastic sheet 24, whereby even if there is uneven portion or undulation on the surface of the panel, or the upper side plate 23 and the lower side There is an error in the parallelism or flatness of the side plates 22, and it is also possible to uniformly transfer the pressing force to the adhesive layer R1. Further, by setting the elastic sheet 24 to a shape similar to the adhesive layer R1 and having substantially the same size, only the portion of the liquid crystal panel S1 where the adhesive layer R1 is formed can be pressed. Therefore, the portion where the adhesive layer R1 is not formed is not subjected to an excessive force, and the adhesive layer R1 can be sufficiently stretched and adhered to the liquid crystal panel S1 and the protective panel S2 to reduce the generation of voids. Thereby, the laminated panel S10 with few defects can be manufactured.

(2) The elastic sheet 24 may contain a foamed resin having independent pores. The elastic sheet has a separate hole containing a gas and thus the gas is hard to be detached, whereby high elasticity can be maintained for a long period of time. Thereby, the generation of voids can be further reduced.

(3) The display panel manufacturing apparatus 100 of the present embodiment includes the substrate bonding apparatus 20 as the bonding unit 2. Further, the adhesive application device 10 having the adhesive layer R applied to the surface of the liquid crystal panel S1 to form the adhesive layer R1 is used as the application portion 1 and includes an adhesive layer R1 for laminating the laminated panel S10 bonded to the bonding portion 2 The curing device 30 serves as the curing portion 3 and includes a conveying portion 4 that conveys the liquid crystal panel S1 and the protective panel S2 between the coating portion 1, the bonding portion 2, and the curing portion 3.

As described in the above (1), the occurrence of voids can be reduced in the substrate bonding apparatus 20. Therefore, the display panel manufacturing apparatus 100 of the present embodiment can manufacture a liquid crystal display panel L of good quality, and can also improve manufacturing efficiency. .

[Other Embodiments]

(1) In the above embodiment, the upper side plate 23 of the substrate bonding apparatus 20 supports the liquid crystal panel S1, and the lower side plate 22 holds the protective panel S2, but the invention is not limited thereto. It is also possible that the lower side panel 22 supports the protective panel S2, and the upper side panel 23 holds the liquid crystal panel S1.

(2) In the above embodiment, the adhesive R is applied to the surface of the liquid crystal panel S1, but may be applied to the surface of the protective panel S2 instead. Alternatively, it may be applied to the surfaces of both the liquid crystal panel S1 and the protective panel S2.

(3) In the above embodiment, the elastic piece 24 is attached to the lower side plate 22. However, the elastic piece 24 may be attached to the upper side plate 23 instead. Alternatively, the elastic piece 24 may be attached to both the lower side plate 22 and the upper side plate 23.

(4) In the above embodiment, the elevating mechanism is provided in the upper side plate 23. However, instead of the lower side plate 22, a lifting mechanism may be provided. Alternatively, an elevating mechanism may be provided in both the lower side plate 22 and the upper side plate 23.

(5) In the above-described embodiment, the liquid crystal panel S1 and the protective panel S2 have been described as an example of the substrate to be bonded. However, the present invention is not limited thereto, and various substrates can be used. For example, an organic EL panel or a touch panel for operation can be used. Further, the bonded substrates are not limited to a pair. In addition to the liquid crystal panel or the protective panel, three or more substrates or two or more pairs of substrates may be bonded together by bonding the touch panel or bonding the protective panel up and down.

(6) In the above embodiment, the application unit 1 and the bonding unit 2 of the display panel manufacturing apparatus are configured as different types of the adhesive application device 10 and the substrate bonding apparatus 20, but they may be configured as the same device. . For example, in the chamber 21 in which the upper side plate 23 and the lower side plate 22 are opposed to each other, the coating unit 12 and the UV irradiation unit 13 are provided to be movable, and the lower side plate 22 is used as the stage 11 of the coating portion 1. That is, after the adhesive R is applied onto the liquid crystal panel S1 placed on the lower side plate 22 and temporarily hardened, the coating unit 12 and the UV irradiation unit 13 are attached from the lower side plate 22 The party retreats and fits.

(7) In the above embodiment, the elastic piece 24 is replaced with the elastic piece 24 in a shape similar to the shape of the adhesive layer R1 formed on the surface of the substrate and substantially the same size, and the elastic piece 24 is replaced in accordance with the shape and size of the substrate, but It is also possible to adjust the coating region of the adhesive layer R in the coating unit 12 so that the adhesive layer R1 becomes a shape similar to the elastic sheet 24 and is substantially the same size. Thus, the elastic piece 24 can use a fixed shape and size.

(8) In the above embodiment, the UV irradiation unit 13 is used as the temporary curing portion of the adhesive application device 10, but the invention is not limited thereto. For example, an electromagnetic wave irradiation unit, a radiation irradiation unit, or an infrared irradiation unit or a heater can be used. The binder to be used may be a resin that is cured by electromagnetic waves, a resin that is cured by radiation, or a thermosetting resin, in combination with a form that is temporarily cured.

(9) In the above embodiment, the necessity of crushing the projection when the slit coater is used as the dispenser 14 has been described. However, the present invention can also be applied when a multi-nozzle is used. In other words, when a plurality of rows of the nozzles are applied to the substrate and the adhesive is stretched, the unevenness is formed on the surface of the formed adhesive layer R1 by the plurality of nozzles. Therefore, the adhesive layer R1 is uniformly pressed by the elastic sheet 24, whereby the unevenness can be crushed. That is, regardless of the state of undulation or deflection of the coated element or the substrate, void-free bonding can be performed, so that the quality of the product can be satisfactorily stabilized and the manufacturing cost thereof can be reduced.

(10) In the embodiment, in the coating portion 1, in the adhesive R Temporary hardening is carried out after the application, but for example, when the viscosity of the adhesive R is high and the coating shape is difficult to be sampled, temporary hardening may not be performed. Further, in the bonding unit 2, the inside of the chamber 21 of the substrate bonding apparatus 20 is decompressed and bonded under vacuum, but it may be bonded in the air. In these cases, it is not necessary to provide an element required for temporarily hardening or forming a space for sealing and decompressing, so that the apparatus can be constructed at a lower cost, and the display panel can be manufactured at low cost.

2‧‧‧Fitting Department

20‧‧‧Substrate bonding device

21‧‧‧ chamber

22‧‧‧ Lower side panel

23‧‧‧Upper side panel

24‧‧‧Elastic film

25‧‧‧ Lifting mechanism

R1‧‧‧ adhesive layer

S1‧‧‧ LCD panel

S2‧‧‧protection panel

Claims (6)

A substrate bonding apparatus for bonding a pair of substrates via an adhesive layer formed on a surface of at least one of the substrates, comprising: a support portion supporting the first substrate; and a holding portion on the first substrate Holding the second substrate at a position facing each other; the driving portion drives at least one of the support portion and the holding portion to bond the pair of substrates via the adhesive layer; and the elastic piece is disposed at The support portion or the surface of the holding portion has a shape similar to the adhesive layer and has substantially the same size, and only the portion of the first substrate or the second substrate on which the adhesive layer is formed is pressed . The substrate bonding apparatus according to claim 1, wherein a surface of the elastic sheet contacting the first substrate or the second substrate has a adhesion to the adhesion layer on the first substrate or the The faces on the second substrate have similar shapes and substantially the same size. The substrate bonding apparatus according to claim 1 or 2, wherein the elastic sheet comprises a foamed resin having independent pores. A manufacturing device for a display panel, which is bonded to a pair of substrates including a display panel via an adhesive layer, comprising: an adhesive layer forming portion for forming an adhesive layer on a surface of at least one of the pair of substrates; a joint portion that bonds the pair of substrates via the adhesive layer; and a transfer portion that transports the one between the adhesive layer forming portion and the bonding portion And the bonding portion includes: a support portion that supports the first substrate; the holding portion holds the second substrate at a position facing the first substrate; the driving portion, the support portion, and the holding portion At least one of the portions is driven to thereby bond the pair of substrates via the adhesive layer; and the elastic sheet is disposed on the surface of the support portion or the holding portion and has a similar structure to the adhesive layer The shape and the substantially same size are pressed only by the portion of the first substrate or the second substrate on which the adhesive layer is formed. The display panel manufacturing apparatus according to claim 4, wherein the adhesive layer forming portion includes an adhesive coating device that applies an adhesive on a surface of the at least one substrate to form the adhesive layer, and the adhesive is bonded. The agent coating device adjusts a coating region of the adhesive, and forms an adhesive layer on a surface of the at least one substrate, the adhesive layer having a first substrate or the second substrate in contact with the elastic sheet Faces that are similar in shape and have roughly the same size. A display panel manufacturing method for manufacturing a display panel by bonding a pair of substrates including a display panel via an adhesive layer, comprising the steps of forming an adhesive layer on a surface of at least one of a pair of substrates a step of supporting the first substrate by the support portion; and a step of holding the second substrate at a position facing the first substrate by the holding portion; a step of bonding at least one of the support portion and the holding portion by a driving portion to bond a pair of substrates via the adhesive layer; and in a step of bonding the pair of substrates Pressing only the first substrate or the second substrate by an elastic piece provided on the surface of the support portion or the holding portion and having a shape similar to the adhesive layer and having substantially the same size There is a portion of the adhesive layer.