TW201510240A - 新穎粉末 - Google Patents

新穎粉末 Download PDF

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TW201510240A
TW201510240A TW103120755A TW103120755A TW201510240A TW 201510240 A TW201510240 A TW 201510240A TW 103120755 A TW103120755 A TW 103120755A TW 103120755 A TW103120755 A TW 103120755A TW 201510240 A TW201510240 A TW 201510240A
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coating
cast iron
metal powder
powder
surface coating
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TWI661058B (zh
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Peter Olserius
Barbara Maroli
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Hoganas Ab Publ
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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C38/00Ferrous alloys, e.g. steel alloys
    • C22C38/18Ferrous alloys, e.g. steel alloys containing chromium
    • C22C38/40Ferrous alloys, e.g. steel alloys containing chromium with nickel
    • C22C38/54Ferrous alloys, e.g. steel alloys containing chromium with nickel with boron
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
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    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K10/00Welding or cutting by means of a plasma
    • B23K10/02Plasma welding
    • B23K10/027Welding for purposes other than joining, e.g. build-up welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
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    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
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    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3033Ni as the principal constituent
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    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3053Fe as the principal constituent
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    • B23K35/3053Fe as the principal constituent
    • B23K35/3066Fe as the principal constituent with Ni as next major constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3053Fe as the principal constituent
    • B23K35/308Fe as the principal constituent with Cr as next major constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3053Fe as the principal constituent
    • B23K35/308Fe as the principal constituent with Cr as next major constituent
    • B23K35/3086Fe as the principal constituent with Cr as next major constituent containing Ni or Mn
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/011Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of iron alloys or steels
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    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/0433Nickel- or cobalt-based alloys
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    • C22C19/03Alloys based on nickel or cobalt based on nickel
    • C22C19/05Alloys based on nickel or cobalt based on nickel with chromium
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    • C22C19/03Alloys based on nickel or cobalt based on nickel
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    • C22C19/058Alloys based on nickel or cobalt based on nickel with chromium without Mo and W
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    • C23C24/00Coating starting from inorganic powder
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    • C23C24/10Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
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    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
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Abstract

本發明係關於一種新金屬粉末,其適用於塗佈鑄鐵部件。本發明亦關於一種藉由使用該新金屬粉末塗佈鑄鐵部件之方法。特別重要的是使用該金屬粉末塗佈玻璃模具表面的可能性。本發明亦關於藉由該金屬粉末塗佈之金屬部件(諸如鑄鐵部件)或玻璃模具。

Description

新穎粉末
本發明係關於一種新金屬粉末,其適用於塗佈鑄鐵部件。本發明亦關於一種藉由使用該新金屬粉末塗佈鑄鐵部件之方法。特別重要的是使用該金屬粉末塗佈玻璃模具表面的可能性。本發明亦關於藉由金屬粉末塗佈之金屬部件(諸如鑄鐵部件)或玻璃模具。
藉由對工具塗佈耐磨與耐腐蝕表面,可延長在重度磨損與腐蝕條件下工作之金屬工具之壽命。可在不同工業中發現該等金屬工具,且其例如可由低合金鋼、青銅、不鏽鋼或鑄鐵製成。
許多工業具有經受磨損、腐蝕及熱循環之鑄鐵部件。此等包括空心玻璃製造、汽車、海洋、地面接合工具等。此類工具的一實例為用於生產玻璃瓶及罐之工具。為延長設備的壽命,關鍵部件(例如模具與導環邊緣、柱塞及頸環表面)塗佈有鎳基自熔性粉末。使用不同的硬面焊方法:舉例而言,藉由火焰噴塗、隨後熔融或HVOF、隨後熔融來塗佈柱塞,而使用粉末焊接或轉移式電漿電弧(PTA)焊接來塗佈模具邊緣、頸環、導環。
玻璃之形成在兩個步驟中進行:在所謂的毛坯模具中進行的預成型,及在所謂的完成模具中進行的最終成型。與模具接觸之玻璃之溫度在毛坯模具中大致為1100℃,且在完成模具中為700-800℃。模具之溫度可能波動高達550-600℃,而表面溫度在短時間內甚至可能 更高。另外,模具表面與化學活性玻璃接觸。模具之重要需求為良好的表面修整、良好的耐熱衝擊性、抗尺寸變化性、抗氧化性及抗生長性。此導致三個關鍵問題:玻璃黏著/黏附於模表面及形成不規則形狀(表面粗糙化);模氧化;及模之磨損/凹痕。
此等問題導致玻璃產物之缺陷且限制模的使用壽命。
一般而言,自熔合金被定義為鐵基、鎳基、鈷基或銅基合金,其含有0.5-5%之硼、0.1-6%之矽及至多3%之碳以及強韌的碳化物及硼化物形成物,如W及/或Mo及/或Cr。大部分於商業中使用之自熔合金為Ni基合金,其含有超過1.5%之硼與矽(單獨或以組合方式)。硼與矽降低熔點數百度;其藉由還原Ni、Co、Cr及Fe之氧化物促進潤濕;其形成輕質的低熔點矽酸硼玻璃,該玻璃流向沈積物的表面且防止其氧化。硼亦為一種強力硬化劑,其與鎳、鉻、鉬、鎢及鐵形成硬質硼化物。。就Ni基自熔合金而言,硼含量在1-3.5%範圍內,其取決於鉻的含量,且鉻含量可高達16%。
用於不同工業之基板材料可為低合金鋼、節狀或層狀鑄鐵、青銅或不鏽鋼。對於一些應用而言,層狀鑄鐵為較佳的選擇,因為其具有良好熱導率,從而允許更高生產率及更低成本。因為鑄鐵對開裂敏感(由於石墨薄片之低強度、低延展性及接近零的熱膨脹係數),所以藉由層狀鑄鐵之堆焊(overlay welding)進行硬面焊為困難的。裂痕形成亦可出現在其他類型之基板(諸如青銅或不鏽鋼)的硬面焊中。目前,僅當用鎳基自熔品級進行鑄鐵部件之堆焊時,才可獲得無縫塗佈。
由於成本及環境及健康方面的擔憂,一直以來希望藉由向粉末中引入更多Fe來降低合金成本,但所進行之嘗試並未成功,導致在層狀鑄鐵熱影響區(HAZ,heat affected zone)中之裂痕形成有所增加。
本發明提供一種針對上述問題之解決方案。本發明人已顯示,提高金屬粉末之鐵含量且使用此粉末對由鑄鐵(例如層狀鑄鐵)製成之部件進行堆焊(諸如PTA焊接)同時避免裂痕形成為可能的。
藉由稀釋具有相對較高鐵量之鎳基品級,同時將鉻與鎳的量最佳化,且使用此合金粉末對金屬基板進行表面塗佈(例如鑄鐵之PTA焊接),獲得具有以下特性之塗層:與當前使用之鎳基自熔品級類似的硬度;與當前使用之鎳基品級類似的焊接及機械加工行為;可避免在鑄鐵熱影響區中之裂痕及/或將裂痕減少至與鎳基品級之裂痕相當的尺寸;比在當前使用之鎳基自熔品級中更少的孔及更少的游離石墨;更低的材料成本;在處理及焊接期間對環境更小的衝擊及更無害的工作條件。
可最佳化Cr及鎳的量以最小化在鑄鐵熱影響區中的裂痕之總長度,使得裂痕總長度為0μm至最大1100μm。
藉由用鎳稀釋鐵基塗層,在塗層中之游離石墨及孔隙率的量逐漸減少,且在含16%之鎳時,孔及游離石墨的量低於常用Ni基材料中可見的量。
本發明亦具有最小化鎳用量之優勢,從而在粉末生產、處理及焊接期間,減小對健康及/或環境之潛在影響。
圖1. LOM顯微圖,其顯示在層狀鑄鐵上堆焊的樣本I之截面。顯示了塗層與基板之間的接合區域。在鑄鐵HAZ中未觀察到裂痕。
圖2. LOM顯微圖,其顯示在層狀鑄鐵上堆焊的比較實例3之截面。顯示了塗層與基板之間的接合。在鑄鐵HAZ中觀察到始於塗層邊緣之裂痕。
圖3. 來自實例8之表面塗層結果。
圖4. 來自實例9之表面塗層結果。
圖5. 來自實例10之表面塗層結果。
圖6. 來自實例11之表面塗層結果。
貫穿本文,待覆蓋或已被覆蓋之金屬部件或組件(例如鑄鐵組件)將被稱作基板。
塗佈基板表面之方法可稱為「表面塗佈」或「硬面焊」或堆焊。
本發明係基於以下認識:具有相對較高Fe含量之金屬粉末可用於對基板(例如鑄鐵、低合金碳鋼、青銅或不鏽鋼部件)進行表面塗佈,同時在塗層與基板之間最小限度地形成裂痕。用於表面塗佈之方法可為使得金屬粉末可在鑄鐵部件上沈積之任何方法。該等方法包括例如轉移式電漿電弧(PTA)或雷射表面被覆;熱噴塗法,諸如HVOF或HVAF、火焰噴塗、電漿噴塗或冷噴塗。
根據本發明使用之金屬粉末可藉由霧化具有適量合金元素之熔融物生成。氣-氣霧化或氣-水霧化為該等方法之實例。粒度的選擇取決於用於表面塗佈之沈積方法及所選之設備,且處在技術人員之能力範圍內。對於PTA而言,粒度可在10μm至250μm範圍內,較佳地在53μm與212μm之間;對於雷射表面被覆而言,粒度可在45μm至150μm之範圍內;對於火焰噴塗而言,粒度可在36μm至125μm之範圍內;且對於HVOF、HVAF、冷噴塗或電漿噴塗而言,粒度可在53μm與10μm之間。
本發明提供:
1. 適合於藉由熱噴塗或焊接表面被覆金屬部件進行表面塗佈之金屬粉末,其由以下組成:5-20%之Cr;0.5-5%之Si;0.2-3.5%之B;12-70%之Ni;0-1.5%之C;0-2%之P;其餘部分為Fe。
2. 如第1點之金屬粉末,其由以下組成:5-9%之Cr;2-3%之 Si;0.2-2%之B;16-55%之Ni;0-1.5%之C;0-2%之P;其餘部分為Fe。
3. 如第1或2點之金屬粉末,其由以下組成:5.5-8%之Cr;2-3%之Si;0.2-2%之B;16-50%之Ni;0-1.5%之C;0-2%之P;其餘部分為Fe。
4. 如第1至3點中任一項之金屬粉末,其適合於藉由轉移式電漿電弧焊接或雷射表面被覆來表面塗佈。
5. 如第1至4點中任一項之金屬粉末,其適合於對鑄鐵進行表面塗佈。
6. 如第1至5點中任一項之金屬粉末的用途,其用於鑄鐵組件之轉移式電漿電弧焊接或雷射表面被覆。
7. 具有使用如第1至5點中任一項之粉末製成之表面塗層的金屬或鑄鐵組件。
金屬粉末可用於節狀及層狀鑄鐵之表面修整。
在又一態樣中,本發明提供已使用金屬粉末進行塗佈或表面修整之鑄鐵部件。
實例 實例1
用於以下實例中之粉末係藉由習知的氣體霧化製成,且其隨後在53μm與150μm之間經篩分。不同粉末之含量顯示於表1。
實例2
如下塗佈具有90mm直徑及約35mm高度之層狀鑄鐵盤。在熔爐中在380℃下於空氣中預加熱該等盤。沿著盤直徑,沈積寬度約為1cm的一個層。使用以下焊接參數:焊接電流90-105A、焊接速度6-7cm/min、進料速率28-30g/min、3.5l/min之進料氣體、PTA束之振盪、1-2A之導頻電流。焊接之後,在蛭石中冷卻樣本。
實例3
如下對具有90mm直徑及約35mm高度之層狀鑄鐵盤進行雷射表面被覆。在熔爐中在380℃下於空氣中預加熱該等盤。藉由使用具有12mm×2mm之光點且裝備有共軸粉末進料器的4kW導向二極體雷射,沿著盤直徑沈積寬度約為1cm的一個層。使用以下雷射表面被覆參數:2kW之功率、4-5mm/sec之表面被覆速度、31g/min之粉末進料速率及10-11l/min之保護氣體。所得結果顯示於表2中。
實例4
藉由使用模滲透劑,關於塗層中之裂痕形成對經過焊接之組件進行評估。用高滲透性紅色染料塗佈樣本,該紅色染料經由毛細作用被拉入表面瑕疵或裂痕中。一段時間後,自表面移除過量染料,且施加白色顯影劑。顯影劑將滲透劑自與表面連通之缺陷中拉出,且當存在與表面接觸之裂痕時,顯影劑使其可見。沒有塗層展現與表面接觸之裂痕。
實例5
基板材料之稀釋度. 輕微研磨樣本表面以移除表面氧化物,且在分別大約為7mm2之兩個區域中藉由手持式x射線螢光分析器分析塗層的化學性質。隨後評估平均塗層化學性質。藉由瞭解粉末及基板之化學組成,材料稀釋度計算如下:稀釋度=ρc(Xc+s-Xc)/ρs(Xs-Xc+s)+ρc(Xc+s-Xc)
ρc=熔融粉末合金之密度(kg/m3)
ρs=基板材料之密度(kg/m3)
Xc+s=元素X在沈積物中之重量%
Xc=元素X在粉末合金中之重量%
Xs=元素X在基板中之重量%
所作之測試顯示所有材料之稀釋度在5-20%範圍內。
實例6
在塗層表面,用布勒硬度儀(Buehler hardness meter)量測具有30kgf(HV30)負荷之維氏硬度(Vickers hardness)。在硬度量測之前,用氧化鋁石對塗層進行平面研磨,以獲得平行於樣本底部之平坦表面。平面研磨之後,用500目且隨後用800目的碳化矽紙進行精細研磨。對塗層表面進行五次壓痕處理,且計算平均硬度。
實例7
微觀結構. 在光學顯微鏡下分析樣本。大約在塗層的中間,垂直於焊接方向切割用於金相研究之樣本。在電木中使樣本成型,接著在Al2O3石上及在9μm布上對其進行平面研磨。隨後在3μm布上拋光樣本,接著在1μm布上拋光,以獲得鏡樣表面。在經過拋光之狀態下觀察樣本以評估對於基板之接合程度、最長長度>100μm之孔之數目、游離石墨之存在、在塗層及/或鑄鐵熱影響區中之裂痕。在塗層中未發現裂痕。在一些樣本中,在鑄鐵HAZ中觀察到始於塗層邊緣之裂痕。量測裂痕之長度,且在兩個塗層邊緣處之全部裂痕長度報導於表1(關於經PTA塗佈之樣本)及表2(關於經雷射表面被覆之樣本)。在經檢測的截面中,最大長度在>100μm以上之孔之數目在0與5之間,且與比較實例1-3中之孔之數量類似。
實例8
藉由火焰噴塗,隨後熔融,在低合金碳鋼上沈積粉末I。對直徑為20mm之圓柱形棒進行塗佈。首先將棒噴砂處理,隨後用Metco 5P-II槍對其噴塗。在空氣中藉由氧乙炔焊炬進行熔融。在噴塗及熔融期間旋轉該等棒。獲得對基板之良好接合及正常孔隙度。參見圖3。
實例9
藉由UniqueCoat Technologies M3 HVAF槍在低合金碳鋼上沈積粉末I。用於測試之所選粒度為25-37μm。對直徑約為20mm之硬幣進行塗佈。在塗佈之前,將樣本噴粒處理。使用空氣及丙烷作為燃燒氣體,同時使用空氣作為運載氣體。進料速率為100g/min。塗層之概觀顯示於圖4中。在接合區域中之黑色粒子為來自噴粒處理步驟之氧化鋁。
實例10
藉由PTA焊接在SS 5716-15型鋁青銅基板(典型化學組成為:77-82%之Cu、8.5-11%之Al、4-6%之Ni、2.5-5%之Fe)上沈積粉末I。對直 徑大約為920mm及高度為30mm之盤進行塗佈。在塗佈之前,在空氣中在450℃下預加熱盤。使用以下製程參數:效果90A、焊接速度7cm/min、進料速率25g/min。沈積一個層。可獲得對基板具有良好接合之無裂痕塗層。圖5。
實例11
藉由PTA焊接在AISI316L型不鏽鋼基板上沈積粉末I。在具有50×100×30mm尺寸之桿上進行塗佈。就塗佈而言,使用以下製程參數:效果110A、焊接速度7cm/min、進料速率25g/min。沈積一個層。獲得對基板具有良好接合之無裂痕塗層。
實例12
將50%之粉末I與50%之球形鑄造碳化鎢WC/W2C混合。藉由使用4kW二極體雷射對混合物進行雷射表面被覆。使用3kW之功率及5mm/sec之表面被覆速度被覆混合物。塗層之截面顯示於圖6中。

Claims (7)

  1. 一種適合於藉由熱噴塗或焊接表面被覆金屬部件進行表面塗佈之金屬粉末,其由以下組成:5-20%之Cr;0.5-5%之Si;0.2-3.5%之B;12-70%之Ni;0-1.5%之C;0-2%之P;其餘部分為Fe。
  2. 如請求項1之金屬粉末,其由以下組成:5-9%之Cr;2-3%之Si;0.2-2%之B;16-55%之Ni;0-1.5%之C;0-2%之P;其餘部分為Fe。
  3. 如請求項1或2之金屬粉末,其由以下組成:5.5-8%之Cr;2-3%之Si;0.2-2%之B;16-50%之Ni;0-1.5%之C;0-2%之P;其餘部分為Fe。
  4. 如請求項1至3中任一項之金屬粉末,其適合於藉由轉移式電漿電弧焊接或雷射表面被覆來進行表面塗佈。
  5. 如請求項1至4中任一項之金屬粉末,其適合於對鑄鐵進行表面塗佈。
  6. 一種如請求項1至5中任一項之金屬粉末的用途,其用於鑄鐵組件之轉移式電漿電弧焊接或雷射表面被覆。
  7. 一種金屬或鑄鐵組件,其具有使用如請求項1至5中任一項之粉末製成的表面塗層。
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