TW201508843A - 電子零件裝置之製造方法 - Google Patents

電子零件裝置之製造方法 Download PDF

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Publication number
TW201508843A
TW201508843A TW103115864A TW103115864A TW201508843A TW 201508843 A TW201508843 A TW 201508843A TW 103115864 A TW103115864 A TW 103115864A TW 103115864 A TW103115864 A TW 103115864A TW 201508843 A TW201508843 A TW 201508843A
Authority
TW
Taiwan
Prior art keywords
sealing
sheet
electronic component
semiconductor wafer
resin
Prior art date
Application number
TW103115864A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroyuki Senzai
Takeshi Matsumura
Eiji Toyoda
Chie Iino
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW201508843A publication Critical patent/TW201508843A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW103115864A 2013-05-23 2014-05-02 電子零件裝置之製造方法 TW201508843A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013108840A JP2014229768A (ja) 2013-05-23 2013-05-23 電子部品装置の製造方法

Publications (1)

Publication Number Publication Date
TW201508843A true TW201508843A (zh) 2015-03-01

Family

ID=51933389

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103115864A TW201508843A (zh) 2013-05-23 2014-05-02 電子零件裝置之製造方法

Country Status (5)

Country Link
JP (1) JP2014229768A (fr)
CN (1) CN105210180A (fr)
SG (1) SG11201509540UA (fr)
TW (1) TW201508843A (fr)
WO (1) WO2014188824A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6237732B2 (ja) * 2015-08-28 2017-11-29 東洋インキＳｃホールディングス株式会社 電子部品モジュールの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1783470B (zh) * 1996-07-12 2013-02-06 富士通半导体股份有限公司 半导体装置
JP3397743B2 (ja) * 1996-07-12 2003-04-21 富士通株式会社 半導体装置
JP2004146556A (ja) * 2002-10-24 2004-05-20 Towa Corp 樹脂封止方法、樹脂封止装置、及び樹脂シート
WO2006100765A1 (fr) * 2005-03-23 2006-09-28 Renesas Technology Corp. Procede de fabrication d’un dispositif semi-conducteur et dispositif de moulage par compression
JP2011001473A (ja) * 2009-06-19 2011-01-06 Hitachi Chem Co Ltd 電子部品用絶縁材料

Also Published As

Publication number Publication date
SG11201509540UA (en) 2015-12-30
CN105210180A (zh) 2015-12-30
JP2014229768A (ja) 2014-12-08
WO2014188824A1 (fr) 2014-11-27

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