TW201503424A - Flexible LED package - Google Patents

Abstract

A flexible LED(Light-Emitting Diode) package including a flexible transparent substrate, a flexible circuit layer, at least one LED chip, a flexible transparent cover and at least one phosphor-containing laminate. The flexible transparent substrate has an upper surface and a lower surface. The circuit layer is disposed on the upper surface of the flexible transparent substrate. The LED chip is disposed on the upper surface of the flexible transparent substrate and electrically connected to the flexible transparent circuit layer. The flexible transparent cover disposed the upper surface of flexible transparent substrate and covers the LED chip and the flexible circuit layer. The phosphor-containing laminate is overlaid on one of the flexible transparent cover and the lower surface of the flexible transparent substrate. Thereby, the flexible LED package of the present invention can achieve uniform double-sided lighting effect.

Description

Flexible LED package

The invention relates to an LED package structure, in particular to a flexible LED package with flexible and double-sided illumination.

Light-Emitting Diode (LED) has the advantages of small size, low power consumption, high brightness, high color performance, fast response and continuous use of 20,000 to 50,000 hours. It is energy-saving and environmentally friendly. Therefore, it gradually replaces the solid-state light source (SSL) system such as traditional fluorescent lamps and electric bulbs, and is widely used in various fields such as electronic products, display device backlights, indicator lights, and mobile communication.

In general, the conventional LED package structure is designed to improve the luminous efficiency, and a reflective layer is disposed on one side of the LED package structure, and a transparent substrate is disposed on the other side of the reflective layer to allow the light source to penetrate the light source. The light-transmissive substrate achieves the purpose of improving luminous efficiency. For example, Chinese Patent No. M391722 discloses a high-efficiency white LED package structure, which uses a reflective layer and a phosphor layer to collect a reflective light source and a phosphor layer to form a high-efficiency white light. LED.

However, the LED light source will still have some loss during the reflection process, and cause different degrees of light loss according to the length or angle of the reflection path, and can only achieve the effect of single-sided illumination. However, how to reduce the loss of LED light energy and improve its applicability has always been a problem that major manufacturers are eager to solve.

In view of this, the inventors of the present invention have devoted themselves to research and cooperate with the application of the theory, and have proposed an invention which is reasonable in design and effective in improving the above problems, thereby improving the applicability of the LED.

The main object of the present invention is to provide a flexible LED package for improving the loss caused by the light source of the conventional LED package during the reflection process, so as to improve the light extraction efficiency and achieve the light source effect of uniform illumination on both sides.

A flexible LED package according to an embodiment of the invention includes: a flexible transparent substrate, a bendable circuit layer, at least one light emitting diode, and a flexible transparent cover and a fluorescent a patch, wherein the flexible transparent substrate has an upper surface and a lower surface, the bendable circuit layer is disposed on the upper surface of the flexible transparent substrate, and the light emitting diode is disposed on the flexible surface The upper surface of the transparent substrate is electrically connected to the bendable circuit layer, and the flexible transparent cover is disposed on the upper surface of the flexible light-transmitting plate and covers the light-emitting diode And the bendable circuit layer, the fluorescent patch covering one of the flexible transparent cover and the lower surface of the flexible transparent substrate.

In an embodiment of the invention, the flexible transparent cover comprises a phosphor powder, and the fluorescent patch covers the lower surface of the flexible transparent substrate.

In one embodiment of the present invention, the number of the fluorescent patches is two, and one of the two fluorescent patches covers the flexible transparent cover, and the other of the two fluorescent patches covers the flexible The lower surface of the light transmissive substrate.

In one embodiment of the invention, the fluorescent patch comprises a peelable light transmissive substrate and a phosphor layer disposed on the peelable light transmissive substrate.

In one embodiment of the invention, the fluorescent patches each comprise a tear-off transparent substrate and a phosphor layer disposed on the peelable light-transmissive substrate.

In one embodiment of the present invention, a fluorescent adhesive layer of one of the two fluorescent patches covers the flexible transparent cover, and the other of the two fluorescent stickers covers the flexible The lower surface of the light transmissive substrate.

The present invention has at least the following advantages:

1. The materials used in the flexible LED package of the present invention are flexible and highly transparent polymer materials, which are suitable for various display devices and lighting devices, and are not subject to Its appearance is limited.

2. The flexible LED package of the present invention can utilize two upper and lower fluorescent patches to achieve double-sided illumination and can respectively function as different color lights. Furthermore, since the life of the phosphor powder is generally not as good as that of the LED, the present invention uses a fluorescent patch instead of the conventional LED package structure to apply the phosphor powder to the outer surface of the LED or distributed in the package cover to avoid fluorescence. The powder is directly affected by the heat generated by the LED, further extending the life of the phosphor powder.

3. The fluorescent patch of the flexible LED package of the present invention comprises a phosphor layer made of phosphor powder mixed with silicone or epoxy resin, and the phosphor powder is distributed on the package cover compared to the conventional LED package structure. In the body, the distribution of the phosphor powder is uniform, and the effect of uniform color light is produced.

4. The flexible LED package of the present invention can solve the problem of repackaging when the fluorescent powder of the conventional LED package structure is unevenly distributed or the fluorescent powder is replaced by replacing the fluorescent patch, thereby providing a simpler method. Process procedures to reduce process costs.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

10, 10'‧‧‧Flexible LED package

11‧‧‧Flexible transparent substrate

111‧‧‧Upper surface

112‧‧‧ lower surface

12‧‧‧Flexible circuit layer

13‧‧‧Lighting diode

14‧‧‧Flexible transparent cover

141‧‧‧Fluorescent powder

15‧‧‧Fluorescent patch

15a‧‧‧First fluorescent patch

15b‧‧‧Second Fluorescent Patch

151‧‧‧Removable light-transmitting substrate

152‧‧‧Fluorescent layer

1 is a cross-sectional view of a flexible LED package in accordance with a first embodiment of the present invention.

2 is a cross-sectional view of a flexible LED package in accordance with a second embodiment of the present invention.

3 is a perspective view of the flexible LED package of FIG. 2.

4 is a schematic view of an embodiment of the flexible LED package of FIG. 2.

[First Embodiment]

1 is a schematic cross-sectional view of a flexible LED package 10 according to a first embodiment of the present invention. The flexible LED package 10 of the present embodiment includes a flexible transparent substrate. The board 11 , a bendable circuit layer 12 , at least one light emitting diode 13 , a flexible transparent cover 14 and a fluorescent patch 15 .

Specifically, the flexible transparent substrate 11 is made of a material having high light transmittance and flexibility, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and poly Yttrium imine (PI), polymethyl methacrylate (PMMA) or polyether oxime (PES), etc., but not limited thereto. In the present embodiment, the flexible transparent substrate 11 has an upper surface 111 and a lower surface 112 having a thickness of 0.01 to 1 mm.

The bendable circuit layer 12 is formed on the upper surface 111 of the flexible transparent substrate 11 by printing, sputtering, or the like. The conductive material may be ITO, silver paste (Ag) or aluminum ink (Al). Or a composite material comprising the foregoing two materials, but not limited thereto. Accordingly, the bendable wiring layer 12 can maintain electrical communication even when the flexible transparent substrate is bent and bent.

The light emitting diode 13 is disposed on the upper surface 111 of the flexible transparent substrate 11 and electrically connected to the bendable circuit layer 12. As shown in FIG. 1 , the number of the light-emitting diodes 13 is five, but not limited thereto, and the number thereof can be adjusted according to actual application requirements; the light-emitting diodes 13 are arranged at intervals in a bendable manner. The circuit layer 12 is folded and electrically connected to the bendable circuit layer 12 through the positive and negative electrodes. In this embodiment, the substrate selected for the LED 13 may be a substrate made of spinel, SiC or Sapphire, so that the light emitted by each of the LEDs 13 can be The substrate is penetrated to the external environment.

The flexible transparent cover 14 is disposed on the upper surface 111 of the flexible transparent substrate 11 and covers the bendable circuit layer 12 and the light emitting diode 13; the flexible transparent cover 14 is also highly transparent. Made of light and flexible polymer materials such as polycarbonate (PC), polystyrene (PS), acrylic (Acrylic), epoxy (Epoxy), silicone (Silicone), cellulose acetate (CA) or any combination of the above materials, the material of the flexible transparent cover 14 of the present embodiment is not limited thereto.

The flexible transparent cover 14 further includes a uniformly distributed phosphor powder 141, wherein the phosphor powder 141 is made of a material having high stable light-emitting characteristics, such as a garnet system. (Ganet), Sulfate, Nitrate, Silicate, Aluminate, or any combination thereof, but not limited thereto, having a wavelength of about 300 nm to 700nm. The phosphor powder 141 has a particle diameter of 1 to 25 μm.

The fluorescent patch 15 is disposed on the lower surface 112 of the flexible transparent substrate 11 and includes a peelable transparent substrate 151 and a fluorescent adhesive layer disposed on the peelable transparent substrate 151. 152. The material of the light-transmissive substrate 151 is the same as that of the flexible transparent substrate 11, and therefore will not be described here. The phosphor layer 152 is used to mix the phosphor powder 141 into a transparent gel and ring. A material such as an oxy-resin is formed on the surface of the light-transmissive substrate 151 by coating, but is not limited thereto.

In more detail, the method for manufacturing the fluorescent patch 15 generally comprises the following steps: first, mixing the fluorescent powder 141 into the light-permeable silicone, and mixing the fluorescent powder 141 and the silicone with a homogenizer to form a colloid; Then, the gel of the previous step is formed on the peelable transparent substrate 151 by spraying or wet coating, that is, a phosphor layer 152 is formed; then, the phosphor layer 152 is pre-tested. The color temperature reaches the target color temperature, and a transparent silicone having a thickness of 50-200 μm is coated on the surface of the fluorescent adhesive layer 152, that is, the fluorescent patch 15; and the fluorescent patch 15 is attached to the flexible transparent substrate. The lower surface 112 of the surface 11 is further dried to completely cure the phosphor layer 152 and the transparent silicone, thereby stably adhering to the peelable transparent substrate 151 and the lower surface 112 of the flexible transparent substrate 11.

In this embodiment, the thickness of the light-transmissive substrate 151 can be less than 1 mm; the thickness of the phosphor layer 152 is 20 to 50 μm; and the mixing ratio of the phosphor powder 141 to the silicone or epoxy resin is 30 to 60%. Preferably, it is 40%; for the material of the silicone or epoxy resin, it is preferably dried at a temperature of 80 to 150 ° C for 1 to 3 hours.

It should be noted that after the fluorescent patch 15 is stably attached to the lower surface 112 of the flexible transparent substrate 11, the peelable transparent substrate 151 can be further removed to obtain a better luminance; Furthermore, the flexibility of the present invention can be improved by pre-testing the color temperature of the phosphor layer 152 and making the fluorescent patch 15 attached to the substrate, and then further removing the light-transmissive substrate 151. Process yield of the LED package; The phosphor powder used in the fluorescent patch 15 can be different from the phosphor powder 141 contained in the flexible translucent cover, and further achieves double-sided illumination and respectively different color lights.

[Second embodiment]

2 is a schematic cross-sectional view of a flexible LED package 10 ′ according to a second embodiment of the present invention. The difference from the first embodiment is that the flexible transparent cover of the flexible LED package of the present embodiment The fluorescent powder 141 may not be included, and the other fluorescent patch 15 may be covered on the flexible transparent cover 14.

Specifically, in the embodiment, the flexible LED package includes a flexible transparent substrate 11 , a bendable circuit layer 12 , at least one light emitting diode 13 , and a flexible transparent cover 14 . And at least one fluorescent patch 15. The number of the fluorescent patches 15 is two. The first fluorescent patch 153 covers the lower surface 112 of the flexible transparent substrate 11 , and the second fluorescent patch 154 covers the flexible transparent cover 14 . On, to achieve the effect of double-sided illumination.

It should be noted that after the two fluorescent patches are stably attached to the lower surface 112 of the flexible transparent substrate 11 and the flexible transparent cover 14, the peelable transparent substrate 151 can be further removed. In order to obtain a better light-emitting brightness; the phosphor powder contained in the two fluorescent patches may also be different to achieve double-sided illumination and respectively different color lights; and the fluorescent patch 15 is used instead of the fluorescent light. The powder layer is coated on the outer surface of the light emitting diode or the fluorescent powder is distributed in the package body, so that the fluorescent powder is directly affected by the heat generated by the light emitting diode, thereby prolonging the service life of the fluorescent powder, and Avoid uneven distribution of phosphor powder and cause uneven color of light.

Please refer to FIG. 3 , which is a perspective view of the flexible LED package of FIG. 2 . It can be seen that the flexible LED package 10' of the present invention can be flexed into a spiral shape for use in decorative lamps, and can be flexed into a wave or arc shape according to actual application requirements. 4 is a schematic diagram of a flexible LED package implementation of FIG. 2, which shows that the flexible LED package 10' of the present invention can be flexed into a shape required for practical applications, and provides double-sided illumination. Can be used for different color lights, and can be applied to double-sided display devices such as large billboards, advertising plates or hanging signboards, and can be free from appearance limit.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Any changes or modifications made to the scope of the present invention should still fall within the scope of the present invention.

10'‧‧‧Flexible LED package

11‧‧‧Flexible transparent substrate

111‧‧‧Upper surface

112‧‧‧ lower surface

12‧‧‧Flexible circuit layer

13‧‧‧Lighting diode

14‧‧‧Flexible transparent cover

15a‧‧‧First fluorescent patch

15b‧‧‧Second Fluorescent Patch

Claims (10)

A flexible LED package comprising: a flexible transparent substrate having an upper surface and a lower surface; a bendable circuit layer disposed on the upper surface of the flexible transparent substrate; at least one light emitting And a flexible transparent cover disposed on the flexible transparent substrate And covering the light emitting diode and the bendable circuit layer; and at least one fluorescent patch covering one of the flexible transparent cover and the lower surface of the flexible transparent substrate . The flexible LED package of claim 1, wherein the flexible transparent cover comprises a fluorescent powder covering the lower surface of the flexible transparent substrate. The flexible LED package of claim 1, wherein the number of the fluorescent patches is two, and one of the two fluorescent patches covers the flexible transparent cover, the two fluorescent patches The other of the covers covers the lower surface of the flexible light transmissive substrate. The flexible LED package of claim 2, wherein the fluorescent patch comprises a peelable light transmissive substrate and a phosphor layer disposed on the peelable light transmissive substrate. The flexible LED package of claim 3, each of the fluorescent patches comprises a tear-off transparent substrate and a phosphor layer disposed on the peelable light-transmissive substrate. The flexible LED package of claim 5, wherein a fluorescent adhesive layer of one of the two fluorescent patches covers the flexible transparent cover, and the other of the two fluorescent patches A photoresist layer covers the lower surface of the flexible light transmissive substrate. The flexible LED package of claim 6, wherein the flexible transparent substrate and the phosphor layer have a thickness ratio of 1:1 to 50:1, and the flexible transparent substrate can be peeled off The thickness ratio of the light-transmitting substrate is 1:1 to 20:1. The flexible LED package of claim 7, wherein the fluorescent glue layer is firefly The light powder is mixed with a silicone or epoxy material in a mixing ratio of 30% to 60%. The flexible LED package of claim 8, wherein the phosphor powder is selected from the group consisting of Garnet, Sulfate, Nitrate, Silicate, and Aluminate. A group consisting of any combination of Aluminate and the like, and the phosphor powder has a particle diameter of from 1 μm to 25 μm. The flexible LED package of any one of claims 1 to 9, wherein the material of the flexible transparent substrate is selected from the group consisting of polyethylene terephthalate (PET), polyimine (PI), and polyphthalene. A group consisting of ethylene glycol formate (PEN), polymethyl methacrylate (PMMA), and polyether oxime (PES).