CN202384331U - Light mixing LED packaging structure - Google Patents
Light mixing LED packaging structure Download PDFInfo
- Publication number
- CN202384331U CN202384331U CN2011203792273U CN201120379227U CN202384331U CN 202384331 U CN202384331 U CN 202384331U CN 2011203792273 U CN2011203792273 U CN 2011203792273U CN 201120379227 U CN201120379227 U CN 201120379227U CN 202384331 U CN202384331 U CN 202384331U
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- Prior art keywords
- led chip
- light
- led
- change
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 239000000919 ceramic Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000001228 spectrum Methods 0.000 claims abstract description 13
- 230000005540 biological transmission Effects 0.000 claims description 15
- 239000004033 plastic Substances 0.000 claims description 15
- 239000012780 transparent material Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 239000003292 glue Substances 0.000 abstract 2
- 230000002596 correlated effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000009877 rendering Methods 0.000 description 6
- 230000005457 Black-body radiation Effects 0.000 description 5
- 230000001795 light effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000035876 healing Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004643 material aging Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
A light mixing LED (Light Emitting Diode) packaging structure comprises a first LED chip, a second LED chip, a first driving unit, a second driving unit and packaging glue which are arranged on a ceramic substrate; wherein the ceramic substrate has an electrical connection circuit; the first LED chip and the second LED chip which respectively emit different colored lights are coated by the packaging glue; the first driving unit fixedly drives the first LED chip, in order to generate a fixed emitting light which has a fixed spectrum and a fixed brightness, while the second driving unit variably drives the second LED chip, in order to generate a variable emitting light which has a variable spectrum and a variable brightness; and the fixed emitting light and the variable emitting light can form a required final emitting light after being mixed. Therefore, the light mixing LED packaging structure of the utility model can raise flexibility in actual use, and can improve operation reliability at the same time.
Description
Technical field
The utility model relates to a kind of package structure for LED, and fixing especially respectively reaching changes the mixed light function that drives at least two light-emitting diode chip for backlight unit and reach at least two light-emitting diode chip for backlight unit.
Background technology
Light-emitting diode is to use light source quite widely at present, such as being applied to display backlight source, lighting source, sign with light source, decoration lighting source or billboard.Different light-emitting diodes can produce different coloured light, can produce ruddiness, green glow, blue light and white light respectively such as ruddiness, green glow, blue light and white light emitting diode.But; The spectrum of light-emitting diode has significant otherness with the spectrum that is similar to the natural daylight of black body radiation, and therefore, the emission light of light-emitting diode can make human eye produce factitious visually-perceptible; When especially being used as illuminating light source, so general light-emitting diode is not suitable for illumination application.
At present the most frequently used with the parameter that quantizes light source characteristic be the color rendering index (Color Rendering Index, CRI) and correlated colour temperature (Correlated Color Temperature, CCT).
Color rendering index (CRI) is the relative different of object in the color that shows under the light source irradiation to be measured and its color under reference light source (such as sunlight) irradiation; And the CRI value is low more; The color that is appeared is got over distortion, and the CRI of sunlight is 100, and fluorescent lamp is 60-85; The fluorescent material white light LEDs is 60-90, and two-color white light LED is between 10-60.
Correlated colour temperature (CCT) is meant to being not the light source of black body radiation, the black body radiation temperature when for example fluorescent lamp or LED, its radiative particular color can produce identical particular color according to black body radiation.For example the CCT of display is that the white light that ruddiness (R), green glow (G), blue light (B) that D65 is meant display are appeared behind mixed light is to be same as black body radiation at 6500 ° of white lights that K appeared.
Therefore, for reaching the characteristic of natural daylight, led light source need have the high CRI of healing, and to the different application field, led light source need have specific CCT value.In the prior art, the settling mode of prior art, the fluorescent material that is the suitable dosage of allotment in packaging plastic is to regulate radiative at last (CRI) and the correlated colour temperature (CCT) of light-emitting diode; But fluorescent material can reduce the brightness performance; And can't arbitrarily change the characteristics of luminescence, therefore, need a kind of mixed light package structure for LED; But the electric mixed light function that provides elasticity to change is to solve above-mentioned prior art problems.
The utility model content
The main purpose of the utility model is providing a kind of mixed light package structure for LED; Comprise ceramic substrate, first led chip, second led chip, first driver element, second driver element and packaging plastic; Wherein first led chip, second led chip, first driver element and second driver element are placed on the ceramic substrate; And ceramic substrate has the circuit of being electrically connected; Packaging plastic coats first led chip and second led chip of launching different color light respectively; The first driver element fixed drive, first led chip is producing the fixed transmission light of tool fixed spectrum and brightness, and the change of second driver element drives second led chip to produce the change emission light that tool movably becomes spectrum and brightness, and fixed transmission light and change emission light can form required last emission light behind mixed light.
First led chip can be in order to produce the blue-light LED chip of blue light; And second led chip can be in order to produce the red LED chip of ruddiness; Therefore; Can be by second driver element control change ruddiness that red LED chip produced, and then carry out mixed light with fixedly blue light that blue-light LED chip is produced, to reach required mixed light effect.
The mixed light package structure for LED of the utility model can be kept under whole original brightness; Mixed light is provided the led light source of required correlated colour temperature and color rendering index to the electric driving means of mat to regulate change emission light; That is utilize electrical means to reach the mixed light effect; But not use the means of chemical mixed light, thereby increase the elasticity on actual the use, can improve operation reliability simultaneously.
Another purpose of the utility model is providing a kind of mixed light package structure for LED; Can further comprise the 3rd led chip and the 3rd driver element; And the 3rd led chip is by the 3rd driver element drive; Use generation and be different from the emission light of first led chip and second led chip, and can produce required last emission light through mixed light with the emission light of first led chip and second led chip.
Description of drawings
Fig. 1 shows the sketch map of the utility model mixed light package structure for LED.
Fig. 2 shows the sketch map of another embodiment mixed light package structure for LED of the utility model.
Embodiment
Following conjunction with figs. is done more detailed explanation to the execution mode of the utility model, makes with the skilled personnel after studying this specification carefully, can implement according to this.
With reference to figure 1, the sketch map of the utility model mixed light package structure for LED.As shown in Figure 1; The mixed light package structure for LED of the utility model comprises ceramic substrate 10, first led chip 21, second led chip 22, first driver element 31, second driver element 32 and packaging plastic 40; In order to produce the last emission light of required correlated colour temperature of tool (CCT) and color rendering index (CRI); Wherein first led chip 21, second led chip 22, first driver element 31 and second driver element 32 are placed on the ceramic substrate 10, and ceramic substrate has the circuit of being electrically connected (not shown).
First led chip 21 and second led chip 22 can be launched the emission light of different color light respectively.Packaging plastic 40 is to be made up of transparent material, such as silica gel or epoxy resin, and further comprises fluorescent material, and packaging plastic 40 coating first led chip 21 and second led chips 22, and attached on the ceramic substrate 10, using provides isolated protective effect.
For example; Choose blue-light LED chip and be used as first led chip 21; Be used as second led chip 22 with red LED chip, and fixedly blue light and change ruddiness form behind mixed light and launches at last light, and be noted that; First led chip 21 and second led chip 22 of the utility model can be the led chip that other launches mutual different color light, promptly first led chip 21 and second led chip 22 can be in red LED chip, green light LED chip and the blue-light LED chip arbitrarily wherein two.
With reference to figure 2, the sketch map of another embodiment mixed light package structure for LED of the utility model.As shown in Figure 2; Another embodiment of the utility model is the embodiment that is similar to first figure; Its main difference is; Another embodiment of the utility model further comprises the 3rd led chip 23 and the 3rd driver element 33, and wherein the 3rd led chip 23 is by the 3rd driver element 33 drive, can be fixed drive or change driving; Use to produce and be different from radiative another emission light L3 that first led chip 21 and second led chip 22 are produced, and this another emission light L3 further penetrate adhesive layer 40 with the change emission light L2 of the fixed transmission light L1 of first led chip 21 and second led chip 22 and mixed light to produce required last emission light.Such as, first led chip 21 is a blue-light LED chip, second led chip 22 is a red LED chip, and the 3rd led chip 23 is the green light LED chip.In addition, but the 3rd driver element 33 mats provide fixed current or change electric current to drive the 3rd led chip 23 with fixed drive or change.
The characteristics of the utility model are that the mixed light package structure for LED is to utilize electrical means to reach the mixed light effect, but not the chemical mixed light means of mat allotment fluorescent material dosage; Therefore; Can avoid the use of excessive fluorescent material and reduce the problem of brightness, and then can keep original or preset brightness, and reach required CCT and CRI; Using increases the elasticity of led light source on reality is used, and can further improve the reliability of integrated operation simultaneously.In addition, but the mat driver element regulate the drive current size and enlarge last radiative color rendering scope.
The above is merely in order to explain the preferred embodiment of the utility model; Be not that attempt is done any pro forma restriction to the utility model according to this; Therefore; All have in following any modification or change of making relevant the utility model of identical creation spirit, all must be included in the protection category of the claim of the utility model.
Claims (8)
1. a mixed light package structure for LED is characterized in that, this mixed light package structure for LED comprises:
One ceramic substrate has the circuit of being electrically connected;
One first led chip is placed on this ceramic substrate;
One second led chip is placed on this ceramic substrate;
One first driver element is placed on this ceramic substrate, and is electrically connected to this first led chip, in order to the fixed transmission light of this first led chip of fixed drive with generation tool fixed spectrum and brightness;
One second driver element; Be placed on this ceramic substrate; And be electrically connected to this second led chip, drive this second led chip in order to change and launch light, and the radiative color of this change be the color that is different from this fixed transmission light with a change that produces tool variable spectrum and brightness; And
One packaging plastic; Constitute by transparent material; This packaging plastic coats a LED chip and this second led chip; And attached on this ceramic substrate, fixed transmission light that this first led chip produced and the change that this second led chip produced emission light penetrate this packaging plastic and mixed light formation one last emission light.
2. mixed light package structure for LED as claimed in claim 1 is characterized in that, this first driver element provides fixed current with this first led chip of fixed drive, and this second driver element provides the change electric current to drive this second led chip with change.
3. mixed light package structure for LED as claimed in claim 1 is characterized in that the transparent material of this packaging plastic comprises silica gel or epoxy resin.
4. mixed light package structure for LED as claimed in claim 1 is characterized in that, this first led chip and this second led chip be in a red LED chip, a green light LED chip and the blue-light LED chip arbitrarily wherein two.
5. a mixed light package structure for LED is characterized in that, this mixed light package structure for LED comprises:
One ceramic substrate has the circuit of being electrically connected;
One first led chip is placed on this ceramic substrate;
One second led chip is placed on this ceramic substrate;
One the 3rd led chip is placed on this ceramic substrate;
One first driver element is placed on this ceramic substrate, and is electrically connected to this first led chip, in order to the fixed transmission light of this first led chip of fixed drive with generation tool fixed spectrum and brightness;
One second driver element; Be placed on this ceramic substrate; And be electrically connected to this second led chip, drive this second led chip in order to change and launch light, and the radiative color of this change be the color that is different from this fixed transmission light with a change that produces tool variable spectrum and brightness;
One the 3rd driver element; Be placed on this ceramic substrate; And be electrically connected to the 3rd led chip; Tool is fixed or another emission light of variable spectrum and brightness to produce to drive the 3rd led chip in order to fixing or change, and this another radiative color is to be different from this fixed transmission light and the radiative color of this change; And
One packaging plastic; Constitute by transparent material; This packaging plastic coats this first led chip, this second led chip and the 3rd led chip; And attached on this ceramic substrate, the fixed transmission light that this first led chip produced, the change that this second led chip produced emission light and this another emission light that the 3rd led chip produced penetrate this packaging plastic and mixed light formation one last emission light.
6. mixed light package structure for LED as claimed in claim 5; It is characterized in that; This first driver element provides fixed current with this first led chip of fixed drive; This second driver element provides the change electric current to drive this second led chip with change, and the 3rd driver element provides fixed current or change electric current to drive the 3rd led chip with fixed drive or change.
7. mixed light package structure for LED as claimed in claim 5 is characterized in that the transparent material of this packaging plastic comprises silica gel or epoxy resin.
8. mixed light package structure for LED as claimed in claim 5; It is characterized in that; This first led chip is a red LED chip; And this second led chip and the 3rd led chip are respectively one of them that choose from a green light LED chip and a blue-light LED chip, and this second led chip and the 3rd led chip are different.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203792273U CN202384331U (en) | 2011-10-09 | 2011-10-09 | Light mixing LED packaging structure |
| PCT/CN2012/001319 WO2013053199A1 (en) | 2011-10-09 | 2012-09-27 | Light-mixing light-emitting diode packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203792273U CN202384331U (en) | 2011-10-09 | 2011-10-09 | Light mixing LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202384331U true CN202384331U (en) | 2012-08-15 |
Family
ID=46632814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203792273U Expired - Fee Related CN202384331U (en) | 2011-10-09 | 2011-10-09 | Light mixing LED packaging structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202384331U (en) |
| WO (1) | WO2013053199A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013053199A1 (en) * | 2011-10-09 | 2013-04-18 | Chen Jeong-Shiun | Light-mixing light-emitting diode packaging structure |
| CN103196049A (en) * | 2013-03-06 | 2013-07-10 | 深圳市晶台光电有限公司 | LED (light-emitting diode) lamp panel adopting integrated COB (chip on board) packaging technology |
| CN104077975A (en) * | 2014-07-18 | 2014-10-01 | 广东威创视讯科技股份有限公司 | Light emitting diode display screen and encapsulating structure |
| CN104282672A (en) * | 2013-07-03 | 2015-01-14 | 云光科技股份有限公司 | Color temperature adjustable type light-emitting diode packaging structure |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4679183B2 (en) * | 2005-03-07 | 2011-04-27 | シチズン電子株式会社 | Light emitting device and lighting device |
| JP2009545107A (en) * | 2006-07-28 | 2009-12-17 | ティーアイアール テクノロジー エルピー | Light source with edge emitting elements |
| KR101154758B1 (en) * | 2008-11-18 | 2012-06-08 | 엘지이노텍 주식회사 | Semiconductor light emitting device and LED package having the same |
| US8384097B2 (en) * | 2009-04-08 | 2013-02-26 | Ledengin, Inc. | Package for multiple light emitting diodes |
| CN101592291A (en) * | 2009-06-26 | 2009-12-02 | 惠州市斯科电气照明有限公司 | LED lamp preparation method that a kind of colour temperature is adjustable and LED lamp |
| US20110037081A1 (en) * | 2009-08-12 | 2011-02-17 | Wu-Cheng Kuo | White light-emitting diode packages with tunable color temperature |
| CN202384331U (en) * | 2011-10-09 | 2012-08-15 | 九江正展光电有限公司 | Light mixing LED packaging structure |
-
2011
- 2011-10-09 CN CN2011203792273U patent/CN202384331U/en not_active Expired - Fee Related
-
2012
- 2012-09-27 WO PCT/CN2012/001319 patent/WO2013053199A1/en active Application Filing
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013053199A1 (en) * | 2011-10-09 | 2013-04-18 | Chen Jeong-Shiun | Light-mixing light-emitting diode packaging structure |
| CN103196049A (en) * | 2013-03-06 | 2013-07-10 | 深圳市晶台光电有限公司 | LED (light-emitting diode) lamp panel adopting integrated COB (chip on board) packaging technology |
| CN104282672A (en) * | 2013-07-03 | 2015-01-14 | 云光科技股份有限公司 | Color temperature adjustable type light-emitting diode packaging structure |
| CN104077975A (en) * | 2014-07-18 | 2014-10-01 | 广东威创视讯科技股份有限公司 | Light emitting diode display screen and encapsulating structure |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013053199A1 (en) | 2013-04-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120815 Termination date: 20131009 |