TW201501899A - Process film, method for using the same, method for manufacturing molded article, and molded product - Google Patents

Abstract

This invention provides a process film capable of creating irregularities on the surface of a molded article with convenient means, and capable of modifying the shape of the irregularities on the molded article in a simple manner. The process film is provided on at least one side thereof with irregularities, and is disposed on at least one of the opposing faces of a pair of upper mold and lower mold constituting a mold device. In a step of hardening a thermosetting resin material which is introduced into the mold device, irregularities are created on the hardened surface of the thermosetting resin material.

Description

Process film and method of using same, manufacturing method of molded article and molded body

The present invention relates to a process film, a method of using the same, a method of producing the molded article, and a molded body.

The molded article composed of the thermosetting resin is excellent in strength. Therefore, the thermosetting resin molded article is used in various applications. Moreover, depending on the application, irregularities may be imparted to the surface of the thermosetting resin molded article. In addition, as a method of providing unevenness to the surface of the thermosetting resin molded article, conventionally, after the thermosetting resin is cured, the surface of the cured product of the thermosetting resin is provided with irregularities or the like using a guillotine or the like.

Moreover, as another method of providing unevenness to the surface of the thermosetting resin molded article, there is a case where a mold having irregularities provided therein is used. As a method of imparting irregularities to the surface of a molded article using such a mold, for example, it is as follows.

Patent Document 1 discloses a method of producing a resin mold which is formed by using a flat metal mold having irregularities of a predetermined shape. Further, Patent Document 1 also discloses a resin molded article formed by using the obtained resin mold. Further, the technique described in Patent Document 1 is a method of producing a resin mold to which irregularities are provided, and is not a method of obtaining a molded article. However, the surface of the resin mold is provided with irregularities by using a mold. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2002-264140

(The subject to be solved by the invention)

However, when the unevenness is applied to the surface of the molded article by the technique of Patent Document 1, the resin molded article of various shapes can be obtained from one expensive metal mold, but it is generated when the molded article is produced. Inappropriate situation. For example, a resin cured product remains on the surface of the mold, and it is difficult to easily change the uneven pattern depending on the application, and it is not suitable for mass-producing a molded article to which unevenness is imparted, but it is not possible to change the shape of the unevenness on the way.

In view of the above, the present invention provides a process film sheet in which the unevenness can be imparted to the surface of the molded article by a simple means, and the uneven shape can be easily changed. (means to solve the problem)

As a result of repeating the intensive research to achieve the above-mentioned problems, the inventors of the present invention found that the process film is disposed so as to have irregularities on at least the surface in contact with the resin material by using the step film having irregularities on the surface. In the mold, the unevenness can be imparted to the surface of the molded article by a simple means, and the uneven shape of the molded article can be easily changed.

That is, according to the present invention, it is possible to provide a process film which has irregularities on at least one side and is disposed on at least one of opposing faces of the upper mold and the lower mold constituting the mold, and is thermally hardened into the inside of the mold. In the step of hardening the resin material, the unevenness is imparted to the surface of the cured product of the thermosetting resin material.

Further, according to the present invention, there is provided a method of using a process film which is produced by using the above process film.

Furthermore, according to the present invention, there is provided a method of producing a molded article comprising the steps of: arranging a first release film on at least one of opposing faces of an upper die and a lower die constituting a mold; and thermosetting The resin material is introduced into the inside of the mold; and the introduced thermosetting resin material is cured; and the first release film sheet has irregularities on at least a surface in contact with the thermosetting resin material, and the thermosetting resin is used. In the foregoing step of hardening the material, the unevenness is imparted to the surface of the cured product of the thermosetting resin material.

Moreover, according to the present invention, it is possible to provide a molded article obtained by the method for producing a molded article, wherein the first release film sheet is adhered to the cured product of the thermosetting resin material in a peelable state. (Effect of the invention)

According to the present invention, it is possible to provide a process film which can impart unevenness to the surface of a molded article by a simple means, and can easily change the uneven shape of the molded article.

Hereinafter, embodiments of the present invention will be described using the drawings. In the drawings, the same components are denoted by the same reference numerals, and their description will be appropriately omitted.

<Processing Film> FIGS. 1 to 4 are cross-sectional views showing an example of the first process film 10 (first release film 10) of the present embodiment. As shown in FIGS. 1 and 2, the first process film sheet 10 of the present embodiment may be one having irregularities 300 on one surface thereof, or may have irregularities 300 on both sides as shown in FIGS. 3 and 4. As a result, the unevenness 300 formed on the surface of the first process film 10 can be transferred to the surface of the cured product of the thermosetting resin material 50 formed by using a mold.

Further, the first process film 10 of the present embodiment can have a single layer structure or a multilayer structure. As shown in FIGS. 1 and 3, in the case where the first process film 10 is formed into a single layer structure, the first process film 10 is formed by a release layer 1 provided with the unevenness 300. On the other hand, in the case where the first process film 10 is formed into a multilayer structure, the first process film 10 must be provided on the surface of the film so that the unevenness 300 is provided, and the release layer 1 is provided on at least the outermost layer. Further, in the case where the first process film 10 is formed into a multilayer structure, the layer structure may be formed in several layers. For example, as shown in FIGS. 2 and 4, the first process film 10 may have a three-layer structure, that is, provided with The release layer 1 of the unevenness 300 is disposed on the release opposing layer 3 opposite to the release layer 1 via the intermediate layer 2 to be described later, and is disposed so as to be sandwiched between the release layer 1 and the release opposite layer 3 The middle layer 2. Here, the release layer 1 is a layer provided to provide the unevenness 300 to the surface of the molded article 200 to be described later. The intermediate layer 2 is a layer provided to improve the followability to the mold. Further, the release opposing layer 3 is a layer provided to improve the mold release property of the mold and the first process film 10.

As shown in FIGS. 1 and 3, when the layer structure of the first process film 10 is formed into a single layer structure, the manufacturing process of the first process film 10 to be described later can be simplified. On the other hand, as shown in FIGS. 2 and 4, when the layer structure of the first process film 10 has a multilayer structure, the mold release property of the molded article 200 can be appropriately adjusted according to the use state of the first process film 10, For the follow-up of the mold.

Further, the loss elastic modulus E" of the first process film 10 measured by the dynamic viscoelastic device in the tensile mode, the frequency of 1 Hz, and the temperature of 120 °C is preferably 1 MPa or more, and more preferably 8 MPa or more. As a result, the follow-up property of the first process film 10 to the mold can be further improved. Further, the loss elastic modulus E" of the first process film 10 measured under the above conditions is preferably 100 MPa or less, and 40 MPa or less. It is further preferred. Thereby, the followability of the first process film 10 to the mold can be further improved.

In the first process film sheet 10 of the present embodiment, the material of the film sheet including the release layer 1 provided with the unevenness 300 is preferably selected from the group consisting of poly(4-methyl-1-pentene) and the like. At least one or more of the group consisting of methylpentene, polybutylene terephthalate, a polystyrene having a syndiotactic structure, and an ethylene-tetrafluoroethylene copolymer. As the polystyrene having a syndiotactic structure, for example, a styrene-butadiene block copolymer can be cited. As a result, the transfer property of the unevenness 300 to the molded article 200 can be further improved.

Further, the thickness of the first process film 10 is preferably 10 μm or more and 200 μm or less, and more preferably 15 μm or more. As a result, the mold release property of the obtained molded article 200 and the first process film sheet 10 can be further improved.

In the case where the resin used for the release layer 1 in which the unevenness 300 is provided in the first process film 10 is crystallized, the degree of crystallization of the resin is preferably 10% or more, and more preferably 30% or more. Thereby, the mold release property with the molded article 200 can be further improved. Further, the degree of crystallization of the resin used in the release layer 1 is preferably 90% or less, more preferably 80% or less. Thereby, the mold release property with the molded article 200 can be further improved.

Further, in the case where the first-process film 10 is formed into a single-layer structure, the entire first-stage film 10 may be formed, and the first process film 10 may have a multilayer structure, and each layer may contain an antioxidant and a slip agent. Anti-caking agents, antistatic agents, ultraviolet absorbers, resin modifiers, colorants such as dyes and pigments, additives such as stabilizers, impact-resistant additives such as fluororesins and silicones, titanium oxide, calcium carbonate, talc, etc. Inorganic filler. Further, in the case where the first process film 10 is formed into a multilayer structure, a resin layer may be provided between the respective resin layers as needed.

Further, the thickness of the release layer 1 in which the unevenness 300 is provided in the first process film 10 is preferably 10 μm or more. Thereby, the mold release property with the molded article 200 can be further improved. Further, the thickness of the release layer 1 is preferably 120 μm or less, and more preferably 50 μm or less. As a result, the shape followability to the mold can be further improved.

Further, the material for forming the intermediate layer 2 is not particularly limited, and examples thereof include an α-olefin polymer such as polyethylene or polypropylene, and ethylene, propylene, butene, pentene, hexene, methylpentene or the like. Α-olefin copolymer of copolymer component, polyester resin such as polyethylene terephthalate or polybutylene terephthalate, nylon-6 (registered trademark), nylon-66 (registered trademark) Polystyrene-based resin, polystyrene resin such as a polystyrene resin having a syndiotactic structure, engineering plastic resin such as polyether oxime or polyphenylene sulfide, and the like may be used singly or in combination. Among these, an α-olefin copolymer is particularly preferred. Specific examples thereof include a copolymer of an α-olefin such as ethylene and a (meth)acrylate, a copolymer of ethylene and vinyl acetate, a copolymer of ethylene and (meth)acrylic acid, and partial ion-crosslinks thereof. Wait.

Further, the material for forming the release opposing layer 3 is not particularly limited, and may be the same as or different from the material for forming the release layer 1, but it is preferably the same.

Hereinafter, the first process film 10 of the present embodiment will be described by taking the multilayer structure shown in FIGS. 2 and 4 as an example.

The unevenness 300 provided in the first process film 10 will be described.

The first process film 10 of the present embodiment has the unevenness 300. That is, it is a step film having irregularities 300 (embossing). By manufacturing the molded article 200 using the first process film 10, the surface shape of the first process film 10 can be transferred to the surface of the molded article 200. As described above, by using the first process film 10 of the present embodiment in the production of a molded article, the unevenness 300 can be transferred from the process film to the surface of the molded article 200. Therefore, the unevenness 300 can be transferred to the surface of the molded article 200 by a simple means without a manufacturing cost and a pneumatic force as compared with the technique of imparting the unevenness provided in the mold described in the above-mentioned prior art.

Moreover, since the molded article 200 is produced by using the first process film 10 of the present embodiment, the unevenness 300 from the first process film 10 can be transferred to the surface of the molded article 200, so that light diffusibility can be obtained. Molded product 200. This can be caused by scattering the transmitted light or the reflected light to the molded article 200 by the unevenness 301 (see FIG. 8) formed in the molded article 200. The unevenness 301 formed in the molded article 200 has various inclination angles and functions as a mirror surface. Thereby, the unevenness 301 can scatter the transmitted light or the reflected light in various directions.

Further, the first process film sheet 10 of the present embodiment is preferably a mirror glossiness I of 60 or more at 60°, and is preferably further improved from the viewpoint of practically improving the optical characteristics of the molded article 200. 5.5 or more is even further preferred. As a result, the unevenness transfer property of the molded article 200 can be further improved. That is, the light diffusibility of the obtained molded article 200 can be further improved. Further, the first process film 10 is preferably 60 or less in specular gloss I of 60°, and practically, from the viewpoint of improving the optical characteristics of the molded article 200, 40 or less is further preferable, and 30 or less is further improved. good. Thereby, the light diffusibility of the obtained molded article 200 can be further improved.

The ten-point average roughness Rz measured in accordance with JIS B0601 is preferably 2 μm or more in accordance with the unevenness 300 (embossing) of the first process film 10 of the present embodiment, and the optical characteristics of the molded article 200 are practically used. From the viewpoint of improvement, 5 μm or more is further more preferable, and 9 μm or more is further more preferable. Thereby, the light diffusibility of the obtained molded article 200 can be further improved. In addition, the ten-point average roughness Rz is preferably 20 μm or less, and from the viewpoint of practically improving the optical characteristics of the molded article 200, 18 μm or less is more preferable, and 14 μm or less is more preferable. Thereby, the light diffusibility of the obtained molded article 200 can be further improved. Further, when the ten-point average roughness Rz of the film subjected to the embossing process is 5 μm or more, when the surface of the process film is subjected to embossing, the film 15 itself can be prevented from being wound into the embossing roll 16 (refer to Figure 5), or the release property is reduced. In particular, when the ten-point average roughness Rz of the unevenness 300 provided in the first-process film 10 is adjusted to the above range, when the molded article 200 and the process film are to be peeled off in a relatively short period of time after molding by a mold, It is possible to prevent a decrease in mold release property, a damage of the process film, or a so-called unsuitable situation such as wrinkles in the process film.

In addition, the irregularities 300 provided in the first process film 10 are artificially formed, and do not include irregularities that are inevitably caused by a film manufacturing process such as wrinkles. In addition, the ten-point average roughness Rz measured according to JIS B0601 is a numerical value of, for example, 1 μm or less. Further, it is preferable that the unevenness 300 in the first process film 10 is not only a part of the first process film 10 but also is provided in the entirety. As a result, the light diffusing function of the molded article 200 can be sufficiently exhibited.

In addition, the average interval (Sm) of the unevenness 300 (embossing) provided in the first process film 10 is not particularly limited, and is preferably 50 μm or more, and more preferably 80 μm or more. Thereby, the mold release property with the molded article 200 can be further improved. Further, the average interval (Sm) of the unevenness 300 is preferably 300 μm or less, and more preferably 250 μm or less. Thereby, the mold release property with the molded article 200 can be further improved.

Next, a method of forming the unevenness 300 provided in the first process film 10 will be described.

The unevenness 300 provided in the first process film 10 is performed by embossing the surface layer of the first process film 10 in an on-line or off-line manner. Here, the embossing process in the line means that the embossing process is performed in the step of producing the film by extrusion molding. The embossing process in an off-line manner means that after the film is formed by extrusion molding, the film surface is embossed using an embossing roll having an embossed surface.

As described above, according to the manufacturing method of the present embodiment, the first process film 10 is embossed in an on-line or off-line manner. Therefore, the shape of the formed unevenness 300 can be easily changed by changing the embossing processing conditions in accordance with the characteristics required for the molded article 200.

Fig. 5 is a view showing a state in which the surface of the step film of the present embodiment is embossed in an off-line manner. The embossing processing method is not particularly limited. As shown in FIG. 5, in the case where embossing is applied off-line, there is a method in which the film 15 is passed through the embossing roll 16 at a high temperature and a high pressure. The embossing temperature (surface temperature of the embossing roll 16) T0 (° C.) is, for example, in the case of using a crystallized resin, which is Tc-40<T0<Tc+10 (wherein Tc is the resin crystal of the release layer 1) Temperature (°C)). When the embossing temperature is less than the lower limit 値, there is a possibility that the surface roughness after the pressing process is less than 2 μm. When the upper limit 値 is exceeded, the resin becomes molten, and the film 15 is wound into the embossing roll 16 during embossing. The possibility.

Further, the pressure for embossing is not particularly limited, and is a line pressure (gauge pressure) of 10 kgf/cm or more and 200 kgf/cm or less, and more preferably 30 kgf/cm or more and 120 kgf/cm or less. Here, when the linear pressure is less than the above lower limit 値, uneven transfer due to embossing may be insufficient. Further, in the case where the linear pressure exceeds the above upper limit 値, there is a possibility that the diaphragm 15 is wound into the embossing roll 16. Further, the front and back temperature difference of the embossing roll 16 is preferably 0 ° C or more and 40 ° C or less. When the front-back temperature difference of the embossing roll 16 exceeds 40 ° C, the film may be easily curled after embossing, and it may be difficult to use.

Fig. 6 is a view showing a state in which the surface of the step film of the present embodiment is embossed in an online manner. As shown in FIG. 6, in the case where the embossing is applied in an in-line manner, there is a method of pressing the embossed roller such as the contact roller 13 against the diaphragm 15 from the stamper 11. As an example, in order to film the extruded resin, first, a roll having embossing on the surface is used as the first roll 12 and/or the contact roll 13 which are provided immediately after extrusion molding. As a result, in the extrusion molding process, the molten resin extruded by the stamper 11 is sandwiched by the first roller 12 and the contact roller 13, and the embossed shape of the surface of the first roller 12 and/or the contact roller 13 is rotated. It is printed on the surface of the diaphragm 15.

In the step of performing the embossing process in the above-described manner, the surface temperature T1 (° C.) of the film 15 when the molten resin is sandwiched between the first roller 12 and the contact roller 13 is preferably Tc- 60 < T1 < Tc-20 is preferred. In the case where T1 exceeds the above lower limit 値, the cooling effect on the molten resin extruded by the stamper 11 can be suppressed from being improved. Therefore, since the decrease in the degree of crystallization of the diaphragm 15 can be suppressed, the mold release property with the molded article 200 can be maintained. In the case where T1 is lower than the above upper limit ,, the film 15 can be prevented from being wound into the embossing roll, or the film 15 can be softened and the embossed film 15 can be collapsed in the subsequent step. Thereby, it is possible to prevent a decrease in the uneven transfer rate on the surface of the molded article 200.

In addition, it is preferable that the surface temperature T2 (° C.) of the diaphragm 15 when the cooling roll (hereinafter referred to as the second roll 14) used to lower the temperature of the process film is pulled back is Tc-150 < T2 < 170. Further, T2 indicates the temperature of the diaphragm 15 from the moment of leaving the first roller 12 to the moment when the second roller 14 is about to be contacted. When T2 exceeds the above lower limit 値, the cooling effect of the diaphragm 15 can be prevented from becoming relatively high. Therefore, since the decrease in the degree of crystallization of the diaphragm 15 can be suppressed, the mold release property with the molded article 200 can be maintained. In the case where T2 is lower than the above upper limit ,, the film 15 can be prevented from being wound into the embossing roll, or the film 15 can be softened and the embossed film 15 can be collapsed in the subsequent step. Thereby, it is possible to prevent a decrease in the uneven transfer rate on the surface of the molded article 200.

Further, it is preferable that the film sheet 15 obtained by extrusion molding is in a state in which the film sheet 15 is brought into contact with the first roller 12 at least about one second from the contact with the first roller 12. In the case of less than one second, the diaphragm 15 is pulled back to the second roller 14 in a relatively softened state. Therefore, the diaphragm 15 may be wound into the second roller 14, and the unevenness of the surface of the embossed film 15 may be collapsed. Thus, by adjusting the embossing processing conditions for the process film, the surface shape of the embossing roll can be transferred to the surface of the process film at a high transfer rate of 60% or more.

Further, the method for producing the process film is not limited, and for example, it can be produced by any one of a production method such as a co-extrusion method, an extrusion lamination method, or a dry lamination method. As shown in FIGS. 2 and 4, in the case where the first process film 10 is formed into a three-layer structure, it can be separated between the release layer 1 and the intermediate layer 2 and between the release opposite layer 3 and the intermediate layer 2, respectively. It is preferable that the adhesive resin layer is not interposed with the adhesive resin layer due to the small amount of bleeding of the end face of the film.

<Method of Using Process Film and Method of Producing Molded Article> Next, a method of using the first process film 10 (first release film 10) of the present embodiment and a method of producing the molded article will be described. Fig. 7 is a cross-sectional view for explaining a method of producing a molded article using the step film of the embodiment.

In the case where the molded article 200 is manufactured using the first process film 10 of the present embodiment, the steps described below must be performed. As shown in Fig. 7, the manufacturing method of the molded article 200 of the present embodiment includes the step of arranging the first process film 10 on at least one of the opposing faces of the upper mold 30 and the lower mold 40 constituting the mold (first The release film sheet 10); the thermosetting resin material 50 is introduced into the inside of the mold; and the introduced thermosetting resin material 50 is cured. The first process film 10 is used to have irregularities 300 on a surface that is in contact with at least the thermosetting resin material 50. In the above-described process of curing the thermosetting resin material 50, the unevenness 300 is applied (transferred) to the surface of the cured product of the thermosetting resin material 50. As a result, since the unevenness 300 formed on the first process film 10 can be transferred to the surface of the molded article 200, the unevenness 300 can be applied to the surface of the molded article 200 by a simple means. In addition, since the unevenness 300 is applied to the surface of the molded article 200 by using the first process film 10, the shape of the unevenness 300 applied to the molded article 200 can be easily changed as compared with the case of using a conventional mold. Further, in the present embodiment, even in the middle of the production of the molded article 200, only the first process film sheet 10 disposed in the mold can be replaced with the desired uneven shape, and the mold can be easily changed to the molded article 200. The shape of the bump 300.

Here, the molded article 200 is used as a light-diffusing optical material having a function of diffusing transmitted light or reflected light. The thermosetting resin material 50 is preferably one containing a thermosetting resin and a phosphor.

Hereinafter, a case where the phosphor is contained in the thermosetting resin material 50 will be exemplified.

First, as shown in FIG. 7(a), the first process film 10 is placed on the surface of the lower mold 40. At this time, the unevenness 300 provided in the first process film 10 is disposed so as to face the upper mold 30 side. Thereby, the unevenness 300 of the diaphragm can be transferred to the surface of the molded article 200.

Further, as shown in FIG. 7(a), the second process film 20 is also disposed on the surface of the mold 30 on which the first process film 10 is not disposed. In the second process film 20, those having no irregularities 300 are used. Thus, the molded article 200 excellent in handleability and mold release property from the second process film 20 can be obtained.

Further, when the first process film 10 and the second process film 20 are disposed in the upper mold 30 and the lower mold 40, vacuum suction is performed from a hole provided in the mold to form the first process film 10 and the second process film. 20 follows, the shape of the close mold is better. Thereby, it is possible to prevent the first process film 10 or the second process film 20 from being disposed inside the mold in a state where wrinkles are generated. Thereby, the appearance of the obtained molded article 200 can be prevented from being wrinkled. Further, when the first process film 10 and the second process film 20 are disposed in the upper mold 30 and the lower mold 40, at least the first process film 10 is pre-formed at a normal temperature to improve the followability of the mold. .

Next, as shown in FIG. 7(b), the thermosetting resin material 50 is introduced into the inside of the mold. The method of introducing the thermosetting resin material 50 into the inside of the mold is not particularly limited. For example, the slurry-like thermosetting resin material 50 may be introduced into the mold, or may be melted at a temperature of 80 ° C or higher. The thermosetting resin material 50 is introduced into the inside of the mold. Further, the thermosetting resin material 50 may be introduced into the inside of the mold all at once, or may be introduced into the inside of the mold in several steps.

Moreover, the introduction of the thermosetting resin material 50 into the inside of the mold can be carried out in the air, or can be carried out in a vacuum, and it is preferable to vacuum-decompress the inside of the mold and then introduce the thermosetting resin material 50 into the mold. Thereby, it is possible to prevent the occurrence of voids in the molded article 200. Moreover, when the thermosetting resin material 50 is introduced into the inside of the mold, a vent pipe can be provided in the mold to extract the internal air.

The thermosetting resin material 50 is preferably one containing a thermosetting resin and a phosphor. As described above, the unevenness 300 formed on the first process film sheet 10 can be transferred to the molded article 200 by using the thermosetting resin material 50 containing the phosphor. Thereby, the molded article 200 excellent in light diffusibility can be obtained.

In addition, the content of the phosphor in the thermosetting resin material 50 of the present embodiment is not particularly limited, and may be 2% by weight or more based on the total amount of the thermosetting resin material 50. Thereby, the light diffusibility of the obtained molded article 200 can be further improved. In addition, the upper limit of the content of the phosphor in the thermosetting resin material 50 is not particularly limited, and the light diffusibility of the obtained molded article 200 can be further improved by being 90% by weight or less.

Further, the phosphor is not particularly limited, and examples thereof include an inorganic phosphor, a pigment, an organic fluorescent dye, and a pseudo-pigment. For the inorganic phosphor, Y ₃ - _X Ga _X A _l5 O can be suitably used. ₁₂ : Ce(0≦x≦3), BaMgAl ₁₆ O ₂₇ :Eu, (Sr,Ca,Ba) ₅ (PO ₄ ) ₃ Cl:Eu, BaMgAl ₁₆ O ₂₇ :Eu, Mn, Zn ₂ GeO ₄ :Mn _{, Y 2 O 2 S: Eu} , 3.5MgO · 0.5MgF 2 · GeO 2: Mn, La 2 O 2 S: Eu, CaS: Eu, LiEuW 2 O 8 , etc., may be suitably used in terms of the pigment phthalocyanine, Organic pigments such as azo, isoindolinone, quinophthalone, and lake pigments, and inorganic pigments such as cobalt blue, blue, and iron oxide, and suitable for organic fluorescent dyes, lanthanide and naphthalene In the case of a simulated pigment, a fluorescent pigment obtained by coloring a powder of a plastic with a fluorescent dye can be suitably used for the pseudo pigment.

Moreover, examples of the thermosetting resin include a polyoxymethylene resin, an epoxy resin, and a phenol resin. Among these, as the thermosetting resin used in the embodiment, a polyoxyxylene resin or an epoxy resin is preferably used. Thereby, the cured product of the thermosetting resin material 50 and the process film can be easily peeled off. That is, the mold release property of the molded article 200 and the process film can be improved. Further, by using a polyoxyxylene resin or an epoxy resin as the thermosetting resin, the mold release property of the mold and the process film can be improved.

As the polyoxyxylene resin used in the present embodiment, for example, a material composed of an alkoxysilane and a decane coupling agent can be used. By introducing an alkoxysilane and a decane coupling agent, extremely fine pores can be formed in the compound, and the low refractive index of the thermosetting resin material 50 becomes possible.

The epoxy resin used in the present embodiment is not particularly limited. For example, the monomer, the oligomer, and the polymer having two or more epoxy groups in one molecule are not particularly limited in molecular weight and molecular structure. Examples thereof include bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, and tetramethyl bisphenol F type epoxy resin; biphenyl type epoxy resin and stilbene type ring; a crystalline epoxy resin such as an oxygen resin or a hydroquinone epoxy resin; a novolac type epoxy resin such as a cresol novolak type epoxy resin, a phenol novolak type epoxy resin, or a naphthol novolak type epoxy resin; a phenolic aralkyl type epoxy resin having a phenyl skeleton, a phenol aralkyl type epoxy resin having a stretched phenyl skeleton, a naphthol aralkyl type epoxy resin having a pendant phenyl skeleton, and an alkoxy group a phenol aralkyl type epoxy resin such as a phenol aralkyl epoxy resin having a naphthalene skeleton; a trifunctional epoxy resin such as a trisphenol methane epoxy resin or an alkyl modified trisphenol methane epoxy resin; and a dimeric cyclopentane Modified diphenolic epoxy resin such as diene-modified phenol epoxy resin, terpene modified phenol epoxy resin; epoxy resin containing heterocyclic ring such as triazine core epoxy resin; 2-functional alicyclic epoxy resin An alicyclic epoxy resin such as a resin may be used alone or in combination of two or more. Further, it is preferably used in a case where the molecular structure has a biphenyl skeleton and the epoxy equivalent is 180 or more.

Next, as shown in FIG. 7(c), the thermosetting resin material 50 introduced into the mold is cured. Thus, the molded article 200 which is adhered to the first process film 10 in a peelable state can be obtained. In addition, the temperature condition for curing the thermosetting resin material 50 is appropriately selected depending on the type of the resin, and is not particularly limited. For example, the glass transition temperature of the resin is Tg, and Tg-100 ° C or more. Tg + 100 ° C or less is preferable, and Tg - 50 ° C or more and Tg + 50 ° C or less is further preferable. Moreover, the temperature at which the thermosetting resin material 50 is hardened can be changed in multiple stages. Further, the thermosetting resin material 50 can be hardened in one stage, and in order to increase the strength of the molded article 200, multi-stage hardening after post-hardening can be performed.

According to the method of using the first process film 10 of the present embodiment and the method of manufacturing the molded article 200, if the thermosetting resin material is cured in the mold, the unevenness can be easily imparted to the surface of the obtained molded article 200. Moreover, the shape of the unevenness 300 formed in the first process film 10 can be changed according to the characteristics required for the molded article 200, and the shape of the unevenness 300 applied to the molded article 200 can be changed. Therefore, the degree of freedom in design can be expanded with respect to the shape of the unevenness 300 imparted to the molded article 200.

Further, according to the method of using the first process film 10 of the present embodiment and the method of manufacturing the molded article 200, the first process film 10 is used to first apply the unevenness 300 to the molded article 200, as described in the above prior art. The shape of the unevenness 300 can be easily changed as compared with the technique of imparting the unevenness provided in the mold to the molded article. In addition, in the present embodiment, even when the first process film 10 disposed in the mold is replaced with a shape having a desired unevenness 300, the molded article 200 can be easily changed to the molded article. The shape of the concave and convex 300 of 200. As described above, the method of applying the unevenness 300 to the molded article 200 by using the first process film 10 is also superior to the conventional technical level in terms of manufacturing cost and labor.

Further, according to the method of using the first process film 10 of the present embodiment and the method of manufacturing the molded article 200, the thermosetting resin material 50 is introduced after the first process film 10 and the second process film 20 are placed in the mold. In the mold, even if the thermosetting resin material 50 is cured and removed from the mold, the cured product of the thermosetting resin material 50 can be prevented from remaining in the mold.

In the present embodiment, the case where the first process film 10 is disposed on the surface of the lower mold 40 will be described as an example. However, the present invention is not limited thereto, and may be in the opposite faces of the mold 30 and the lower mold 40 which constitute the mold. The first process film 10 may be disposed on at least one side. Further, in the above-described embodiment, the second process film 20 is disposed on the surface of the upper mold 30. However, the present embodiment is not limited thereto, and the first mold 30 and the lower mold 40 are not provided with the first one. The second process film 20 may be disposed on the surface of the process film 10. The second process film 20 may have the unevenness 300 or may not include the unevenness 300, and the second process film may be used from the viewpoint of the mold release property of the molded product 200 and the followability to the mold. In the sheet 20, it is preferable that the sheet has no irregularities.

<Molded product> Fig. 8 is a cross-sectional view of the molded article of the present embodiment. As shown in FIG. 8, the molded article 200 of the present embodiment is formed with the unevenness 301 provided by the first process film sheet 10. Further, the molded article 200 can be used as a light-diffusing optical material having a function of diffusing transmitted light or reflected light as described above. Therefore, the molded article 200 can be used for, for example, an LED phosphor, an LED light diffusion film, or the like.

<The molded article obtained by the method of using the process film> FIGS. 9 and 10 are views for explaining the molded body obtained by the method of using the first process film 10 of the present embodiment and the method for producing the molded article 200. In the drawings, (a) is a perspective view, and (b) is a cross-sectional view. As shown in Figs. 9 and 10, in the molded article 400 obtained by the method of using the first process film 10 described above, the first process film 10 is adhered to the hardenable resin material 50 in a peelable state. Things. Thus, the surface of the molded article 200 can be protected by the first process film 10 until the molded article 200 is used. By bringing the first process film 10 into a state of close contact, it is possible to prevent the surface of the molded article 200 from being scratched, and the surface of the molded article 200 from being contaminated.

Further, as shown in FIG. 9, the molded article 400 may be covered by the first process film 10 on both surfaces of the molded article 200, or as shown in FIG. 10, one surface of the molded article 200 may be covered by the first process film 10, and the other may be covered. The surface is covered by the second process film 20, and from the viewpoint of the mold release property between the process films, as shown in FIG. 10, the surface is covered by the first process film 10 and the second process film 20 having no unevenness. It is preferable to perform the adhesion in a peelable state. Thus, the first process film 10 and the second process film 20 can be easily peeled off from the molded article 200. Here, the surface covering the molded article 200 refers to a state in which the surface is covered by the first process film 10 or the second process film 20. Further, the coating means that it may be continuous and partially, as long as at least the surface of the molded article 200 is coated.

Further, as shown in FIGS. 9 and 10, the molded article 400 preferably has a first process film 10 or a process in which the first process film 10 and the second process film 20 are overlapped and adhered to each other around the molded article 200. Part 450 is preferred. As a result, when the molded body 400 is used, the arm of the robot or the hand of the operator can grasp the grip portion 450. Thereby, the molded body 400 can be made excellent in handleability.

Further, it is preferable that the materials for forming the first process film 10 and the second process film 20 are different materials. As a result, when the first process film 10 and the second process film 20 are peeled off from the molded article 200, the mold release property between the process films can be further improved.

Moreover, in the case where the molded article 200 is a light-diffusing optical material having a function of diffusing light or reflected light, it is possible to form a light diffusing property better than that of the surface having no unevenness 301. This is because the transmitted light or reflected light to the molded article 200 can be scattered by the unevenness 301. The unevenness 301 formed in the molded article 200 has various inclination angles and functions as a mirror surface. Thereby, the unevenness 301 can scatter the transmitted light or the reflected light in various directions.

Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than the above may be employed. [Examples]

Hereinafter, the present invention will be described by way of examples, but the invention is not limited thereto.

The raw material components of the first process membrane used in each of the examples are shown below.

The raw materials of the first process film used in the examples shown below are as follows. Poly(4-methyl-1-pentene) (TPX): product number MX002 (manufactured by Mitsui Chemicals, Inc.) polybutylene terephthalate (PBT): product number Novaduran 5020 (manufactured by Mitsubishi Engineering Plastics Co., Ltd.) has a gauge Structured polystyrene (SPS): product number XAREC S108 (manufactured by Idemitsu Kosan Co., Ltd.) Ethylene-tetrafluoroethylene copolymer (ETFE): product number AFLEX C-55APC-55AP (made by Asahi Glass Co., Ltd.) ethylene-methacrylate Copolymer (EMMA): Product No. ACRYFT WD106 (manufactured by Sumitomo Chemical Co., Ltd.) Polypropylene (PP): Product No. Nobrene FH1016 (manufactured by Sumitomo Chemical Industries, Ltd.) Adhesive Polyolefin (AD): MODIC F502 (manufactured by Mitsubishi Chemical Corporation) :MODIC F515A (Mitsubishi Chemical Corporation)

Further, in the following examples, the olefin mixtures A to C were used as the resin forming the intermediate layer. Here, the olefin mixture A to C is the one having the following composition. The olefin mixture A is obtained by mixing EMMA, PP and TPX at a ratio of 5:3:2. The olefin mixture B was obtained by mixing EMMA, PP, AD (F515A) and PBT at a ratio of 3:1.5:4:1.5. The olefin mixture C system was obtained by mixing EMMA, PP, AD (F502) and SPS at a ratio of 3:2:2:3.

<Production of First Process Film> The first process film sheets of the production examples 1-1 to 1-8 and the examples 2-1 to 2-3 were three-layer structures. In the first process film having a three-layer structure as described above, the resins corresponding to the respective layers (the release layer, the intermediate layer, and the release opposite layer) shown in Table 1 are respectively supplied to three extruders, and then three. The laminate mold was co-extruded and laminated to form an assembly. Further, the unevenness provided in the release layer of the first process film of Examples 1-1 to 1-8 and 2-1 to 2-3 was subjected to embossing in an in-line manner.

The first process film sheets of Examples 1 to 9 and 2-4 were produced to have a single layer structure. The first process film having a single-layer structure was obtained by separately supplying the resins shown in Table 1 to an extruder and then performing extrusion molding. Further, the unevenness provided on only one side of the first process film of Examples 1 to 9 and 2-4 was subjected to embossing in an in-line manner.

<Manufacturing of a molded article> First, as shown in Fig. 7, Examples 1-1 to 1-9 and Examples were used in such a manner that the release layer became the thermosetting resin material side and the release layer became the lower mold side. The first process diaphragm of 2-1 to 2-4 is placed in the lower mold and vacuum degassed. Next, the thermosetting resin material is introduced into the inside of the mold and hardened to obtain a molded article. Further, a second process film in which no irregularities are formed is disposed in the upper mold.

<Evaluation method> Surface roughness (Rz: ten-point average roughness) of the release layer of the process film: According to JIS B0601, a surface roughness shape measuring machine (manufactured by Tokyo Seimitsu Co., Ltd., HANDYSURF E-35A) was used for measurement. The measurement was carried out under the conditions of a width of 4000 μm and a speed of 0.6 mm/s.

Optical characteristics: The obtained molded article was attached to an LED element, and the luminous efficiency was evaluated by a goniometer type measuring device (manufactured by Otsuka Electronics Co., Ltd., MCPD 7000). This luminous efficiency is evaluated as "○" in the case of being practically good, and as "X" in the case of being unpractical in practical use.

Loss modulus of elasticity E": For each process film obtained by the above method, a dynamic viscoelastic device (DMS-210 type manufactured by SEIKO Electronics Co., Ltd.) was used, and the loss was measured in a tensile mode, a frequency of 1 Hz, and a temperature of 120 °C. Elastic modulus E". In addition, the unit is MPa.

The specular gloss of the release film of the process film at 60° was measured in accordance with JIS Z8741 using a gloss meter (VG 7000, manufactured by Nippon Denshoku Industries Co., Ltd.) at a measurement angle of 60°.

The evaluation results relating to the above evaluation items are shown in Tables 1 and 2 below.

Actually, the surface of the molded article produced by using the first process film of Examples 1-1 to 1-9 was transferred to the unevenness of the first process film. Moreover, the molded article produced by using the first process film of Examples 1-1 to 1-9 was excellent in optical characteristics. Further, the molded articles produced by using the first process film sheets of Examples 2-1 to 2-4 were optically superior to those of the first process film sheets of Examples 1-1 to 1-9. Although it is slightly inferior, it has optical properties that are practically problem-free.

The present application claims priority based on Japanese Patent Application No. 2013-072879, filed on Mar.

1‧‧‧ release layer
2‧‧‧Intermediate
3‧‧‧Removing the opposite layer
10‧‧‧1st process diaphragm
11‧‧‧Molding
12‧‧‧1st roll
13‧‧‧Contact roller
14‧‧‧second roller
15‧‧‧ diaphragm
16‧‧‧embossing roller
20‧‧‧2nd process diaphragm
30‧‧‧Upper mold
40‧‧‧ Lower mold
50‧‧‧ thermosetting resin material
200‧‧‧Molded goods
300‧‧‧ bump
301‧‧‧ bump
400‧‧‧ molded body
450‧‧‧Control Department
T1‧‧‧ surface temperature
T2‧‧‧ surface temperature

The above and other objects, features and advantages of the present invention will be apparent from

Fig. 1 is a cross-sectional view showing an example of a step film of the embodiment. Fig. 2 is a cross-sectional view showing an example of a step film of the embodiment. Fig. 3 is a cross-sectional view showing an example of a step film of the embodiment. Fig. 4 is a cross-sectional view showing an example of the step film of the embodiment. Fig. 5 is a view showing a state in which the surface of the step film of the present embodiment is embossed in an off-line manner. Fig. 6 is a view showing a state in which the surface of the step film of the present embodiment is embossed in an in-line manner. 7(a) to 7(c) are cross-sectional views for explaining a method of producing a molded article using the step film of the present embodiment. Fig. 8 is a cross-sectional view showing a molded article of the embodiment. Fig. 9 is a view for explaining a molded body of the embodiment, Fig. 9(a) is a perspective view, and Fig. 9(b) is a cross-sectional view. Fig. 10 is a view for explaining a molded body of the embodiment, Fig. 10(a) is a perspective view, and Fig. 10(b) is a cross-sectional view.

1‧‧‧ release layer

10‧‧‧1st process diaphragm

300‧‧‧ bump

Claims (22)

A process film having at least one surface having irregularities and disposed on at least one of opposing faces of the upper mold and the lower mold constituting the mold, and embossing in a step of hardening the thermosetting resin material introduced into the mold The surface of the cured product of the thermosetting resin material is applied. The process film of claim 1, wherein the process film has the unevenness formed by embossing. The process film according to claim 1 or 2, wherein the ten-point average roughness Rz of the process film measured according to JIS B0601 is 5 μm or more and 18 μm or less. The process film of claim 1 or 2, wherein the loss elastic modulus E" of the process film measured by using a dynamic viscoelastic device in a tensile mode, a frequency of 1 Hz, and a temperature of 120 ° C is 1 MPa or more. 100MPa or less. The process film of claim 1 or 2, wherein the process film has a specular gloss I of 60 or more at 60° or less. The process film of claim 1 or 2, wherein the material forming the process film comprises a polyphenylene selected from the group consisting of polymethylpentene, polybutylene terephthalate, and a syndiotactic structure. Ethylene or an ethylene-tetrafluoroethylene copolymer constitutes at least one or more of the group. The process film of claim 1 or 2, wherein the process film has a thickness of 10 μm or more and 200 μm or less. A method of using a process film for producing a molded article by using the process film of any one of claims 1 to 7. A method for producing a molded article, comprising the steps of: arranging a first release film on at least one of opposing faces of an upper mold and a lower mold constituting a mold; and introducing a thermosetting resin material into the mold; The introduced thermosetting resin material is cured, and the first release film sheet has irregularities on at least the surface in contact with the thermosetting resin material, and the unevenness is imparted to the process of curing the thermosetting resin material. To the surface of the cured product of the thermosetting resin material. The method for producing a molded article according to claim 9, wherein the molded article is used as a light-diffusing optical material having a function of diffusing light or reflected light imparted to the unevenness applied to the surface. The method for producing a molded article according to claim 9 or 10, wherein the thermosetting resin material contains a thermosetting resin and a phosphor. The method for producing a molded article according to claim 11, wherein the thermosetting resin contains a polyoxyxylene resin or an epoxy resin. The method for producing a molded article according to claim 9 or 10, wherein the ten-point average roughness Rz of the first release film sheet measured according to JIS B0601 is 5 μm or more and 18 μm or less. The method for producing a molded article according to claim 9 or 10, wherein the unevenness of the first release film is formed by embossing. The method for producing a molded article according to claim 9 or 10, wherein the loss elastic modulus of the first release film is measured by a dynamic viscoelastic device in a tensile mode, a frequency of 1 Hz, and a temperature of 120 ° C. E" is 1 MPa or more and 100 MPa or less. The method for producing a molded article according to claim 9 or 10, wherein the first release film sheet has a specular gloss I of 60 or more at 60° or less. The method for producing a molded article according to claim 9 or 10, wherein in the step of disposing the first release film, the first release film is disposed in the upper mold and the lower mold On either side, the second release film is placed on the other side. A molded article formed by the method for producing a molded article according to any one of claims 9 to 17, wherein the first release film is adhered to the thermosetting resin in a peelable state. Hardened material. A molded body formed by the method for producing a molded article according to claim 17, wherein the first release film and the second release film cover the surface, and the first release film The second release film sheet is adhered to the second release film in a peelable state. The molded article of claim 19, wherein the first release film and the second release film are overlapped and adhered to each other around the molded article. The molded article of claim 19 or 20, wherein the material of the first release film sheet and the second release film sheet are different from each other. The molded article of claim 18 or 19, wherein the material constituting the first release film comprises a polyphenylene selected from the group consisting of polymethylpentene, polybutylene terephthalate, and a syndiotactic structure. Ethylene or an ethylene-tetrafluoroethylene copolymer constitutes at least one or more of the group.