TW201446387A - Laser shield component, laser process device, and laser illuminating method - Google Patents

Abstract

The invention divides a line beam in a manner ensuring a part avoiding illumination to a processed object, and the divided line beam can illuminate the processed object. The invention disposes a part or all of a shielding component to enable relative movement relative to a laser light path in a line beam shape, and along with the movement, the shape adjustment of the divided line beam can be performed to obtain the line beam. The line beam is obtained by dividing the line beam according to a shape determined by a moving position of the shielding component, and the line beam can illuminate the processed object without replacement of an optical system or adjusting time, and the laser will not be illuminated to a portion forming an obstacle for illumination or a portion unwanted for illumination. Therefore, necessary processes can be performed with a good productivity and a good quality.

Description

Laser light shielding member, laser processing device, and laser light irradiation method

The present invention relates to a laser light shielding member that divides a line beam shape of laser light to obtain a plurality of line beams, a laser processing device that divides a line beam and processes the object to be processed, and laser light irradiation. method.

A method of performing laser processing using a line beam for a workpiece to be used in a liquid crystal display or an organic electroluminescence (EL) display is known.

In such laser processing, it is known that, for example, a stable and high-quality semiconductor film (ruthenium film) formed only at a desired position is aggregated into a linear or rectangular shape ( The strip-shaped continuous oscillation laser light is turned on and off, and is scanned and annealed to be modified into a strip-shaped polycrystalline tantalum film (see Patent Document 1).

Further, when applied to a system on glass (SOG) or the like, a method is known in which, in order to homogenize a transistor characteristic of a thin film transistor (TFT) at a high level, In particular, a TFT having excellent mobility and high-speed driving is realized in a peripheral circuit region, and an a-Si film 2 is formed on a glass substrate. Patterned in a line shape (ribbon shape), or island shape (island shape), on the surface of the a-Si film or the back surface of the glass substrate, scanning from the CW laser 3 in the direction of the arrow in time The a-Si film is crystallized by continuously outputting the energy beam (see Patent Document 2, FIG. 1(a), FIG. 1(b)).

[Prior Art Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent No. 2004-151668

[Patent Document 2] Japanese Patent Publication No. 2005-354087

In the above-described laser annealing apparatus, when the laser beam is irradiated to the laser processing target and the laser annealing treatment is performed, the beam length of the laser beam is adjusted in accordance with the size of the laser processing object, and The portion of the energy density unevenness generated at the end of the long axis of the beam is removed, and the beam shielding material is used in the long axis direction.

Moreover, as the substrate becomes large, the beam size also increases, and productivity is improved by reducing the number of scans.

However, there is a portion on the substrate where irradiation is impossible, and for example, there is a case where there is a discolored portion when laser light is irradiated. There are also cases where impurities are generated if exposed to laser light. Therefore, although there is a method of reducing the beam length of the laser light in order to avoid the irradiation of the portion, there is a problem that the productivity is lowered. question.

The present invention has been made to solve the above problems as described above, and an object of the invention is to provide a line beam splitting in such a manner as to ensure a portion to be shielded from being irradiated to a target object, and to illuminate the divided line beam Laser light shielding member to the object to be processed, laser processing device, and laser light irradiation method.

In the laser light shielding member of the present invention, the first aspect of the invention is a laser light shielding member that shields a part of the laser light from the linear beam shape and forms a plurality of divided lines that illuminate the object to be processed. The light beam is characterized in that the shielding member is provided so that part or all of the shielding member can be relatively moved with respect to the optical path of the linear beam shape, and the shape adjustment of the divided line beam can be performed in accordance with the movement. .

In the first aspect of the invention, the laser light shielding member according to the second aspect of the invention is characterized in that the shape of the shielding is changed in accordance with the movement.

According to a second aspect of the present invention, in the second aspect of the invention, the shape of the shielding shape is changed stepwise or continuously in accordance with the movement.

According to a fourth aspect of the present invention, in the laser light shielding member of the first aspect of the invention, the movement includes a sliding movement and/or a rotation movement.

The laser light shielding member according to a fifth aspect of the present invention is characterized by the first present invention In any one of the fourth inventions, the shape of the line beam is adjusted to a length adjustment of the line beam in the longitudinal direction.

A laser processing apparatus according to a sixth aspect of the present invention includes: a laser light source that outputs laser light; and an optical system that shapes the laser light into a line beam shape and guides it to a target object; and the processed object holding portion holds the above The object to be processed is irradiated with the above-described laser light; and the laser light shielding member according to any one of the first to fifth inventions, The laser beam shielding member is disposed such that the laser light having the linear beam shape is guided to the optical path of the object to be processed held by the object holding portion, and the transmission of a part of the line beam is blocked. A plurality of divided line beams can be formed.

According to a seventh aspect of the invention, in the laser processing apparatus of the present invention, the shielding member is capable of sliding movement and/or rotational movement.

According to a sixth aspect of the invention, in the sixth aspect of the invention, in the sixth aspect of the invention, the object to be processed has a laminated structure, and the object to be processed is subjected to a peeling process.

According to a ninth aspect of the invention, in the sixth aspect of the invention, the object to be processed is a substrate having a semiconductor layer, and the semiconductor layer is crystallized or crystallized.

In a laser processing apparatus according to a tenth aspect of the present invention, the object to be processed according to the sixth aspect of the present invention, wherein the object to be processed is a plastic substrate.

The laser light irradiation method of the eleventh invention is characterized in that the laser light is shaped into In the shape of the line beam, a part or all of the movable shielding member is disposed on the optical path of the line beam, and a part of the line beam is shielded to form a plurality of divided line beams, and the line beam that has undergone the division is irradiated To the object to be processed, the shape of the divided line beam is determined in accordance with the above-described arrangement position according to the above movement.

According to the invention, the line beam is split by the shielding member, and the divided line beam is irradiated to the object to be processed. The shielding member can be changed by changing the shape of the divided linear light beam, thereby obtaining a plurality of irradiation patterns for the object to be processed.

In addition, as the object to be processed, various objects to be treated by irradiating the laser light of the line beam are used, and the object thereof is various purposes such as peeling, crystallization, and activation. In order to achieve the above object, a glass substrate or a plastic substrate having a semiconductor layer can be exemplified as the object to be processed.

Further, the laser light that is shaped into a line beam shape is not limited to pulse-oscillation laser light, continuous-oscillation laser light, or the like, and the type of the laser is also a gas laser, a solid laser, or a semiconductor laser, and is not particularly limited.

The shielding member changes its shape by movement, and the shape of the divided line beam can be changed. The shadow shape that changes by movement can be continuously changed with the movement, and can be changed stepwise, or can be a combination of continuous change and phase change.

In addition, the shielding of the shielding member can completely prevent the transmission of the laser light, and can also transmit the laser light to the extent that the transmittance is lowered to remove the influence of the irradiation surface of the object to be processed.

Further, the movement of the shielding member can be performed by a sliding movement, a rotational movement, or the like, and can be rotated by a plurality of rotating shafts during the rotational movement. The sliding movement may be moved in a direction crossing the plane direction of the shielding member, in addition to moving in the surface direction of the shielding member. Moreover, the above various movements can also be combined.

The movement of the shielding member can be performed by either manual or driving, and automatic movement by control can also be performed. Further, the movement of the shielding member may be relative to the optical path of the linear beam, and the relative movement of the shielding member may be performed by the movement of the linear beam.

As described above, according to the invention of the present application, the line beam is obtained by dividing the line beam by a shape determined according to the moving position of the shielding member, and the line beam can be irradiated to the object to be processed. Moreover, it is not necessary to replace the optical system, adjust the time, etc., and the laser beam is irradiated to the object to be processed without irradiating the laser beam to the portion where the irradiation is hindered or the portion where the irradiation is not desired, so that the productivity is good and the quality is good. Good to carry out the required processing.

1‧‧‧ Laser processing unit

2‧‧‧Processing room

3‧‧‧Scanning device

4‧‧‧Abutment

6‧‧‧Introduction window

7‧‧‧Control Department

10‧‧‧Laser light source

11‧‧‧Attenuator

15‧‧‧Laser light

12‧‧‧Optical system

12a‧‧‧Mirror

12b‧‧‧both beamer

12c‧‧‧Mirror

12d‧‧‧ Concentrating lens

13, 13a, 13b, 13c, 13d, 13e, 13f, 13g‧‧‧ ‧ shielding materials

130, 130a, 130b, 130c, 130d, 131d, 130e, 130f, 130g‧‧‧

20‧‧‧Long-axis end shelter

100‧‧‧Semiconductor substrate

100a‧‧‧glass substrate

100b‧‧‧Amorphous film

110‧‧‧Processed Department

110a‧‧‧Unilluminated area

111‧‧‧Processing Department

150, 151‧‧‧ line beam

150a, 151a‧‧‧ flat

150b, 151b‧‧‧ slope section

FIG. 1 is a view showing an outline of a laser processing apparatus including a shielding member according to an embodiment of the present invention.

2(a) and 2(b) are diagrams showing a beam profile of a cross section in the longitudinal direction of a line beam before and after division as an embodiment of the present invention.

3(a) and 3(b) show shielding as an embodiment of the present invention. A schematic view of the optical path in the vicinity of the member is a schematic view showing a contour of the divided light beam, and is a view showing a plane of the semiconductor substrate.

4(a) and 4(b) are a plan view and a front view showing a detailed shape of a shielding member according to an embodiment of the present invention.

5(a) to 5(d) are plan and front views showing changes in the shielding shape accompanying the movement of the shielding member according to the embodiment of the present invention.

Fig. 6 is a plan view showing a modified example of the shielding member according to the embodiment of the present invention.

Fig. 7 is a plan view showing another modified example of the shielding member according to the embodiment of the present invention.

Fig. 8 is a plan view showing still another modification of the shielding member according to the embodiment of the present invention.

Fig. 9 is a plan view showing still another modification of the shielding member according to the embodiment of the present invention.

FIG. 10 is a front elevational view showing still another modification of the shielding member according to the embodiment of the present invention.

Fig. 11 is a front elevational view showing still another modification of the shielding member according to the embodiment of the present invention.

Fig. 12 is a plan view showing still another modification of the shielding member according to the embodiment of the present invention.

FIG. 13 is a schematic view showing a vicinity of a long-axis end shielding portion of the conventional laser processing apparatus and an outline of a beam profile.

Hereinafter, a laser processing apparatus including a shielding member according to an embodiment of the present invention will be described based on Fig. 1 .

The laser processing apparatus 1 includes a processing chamber 2 in which a scanning device 3 is disposed. The scanning device 3 is provided with a base 4, and the base 4 is movable in the X direction (scanning direction) by the scanning device 3, and the base 4 can be further moved in the Y direction.

Further, the processing chamber 2 is provided with an introduction window 6 for introducing a line beam from the outside.

In the laser processing, the semiconductor substrate 100 is formed on the base 4, and the semiconductor substrate 100 is formed by forming an amorphous ruthenium film 100b or the like on the glass substrate 100a or the like. The semiconductor substrate 100 corresponds to a target object. In addition, the object to be processed is not limited to the semiconductor substrate 100. For example, a semiconductor film or the like can be formed on the plastic substrate as a target object.

Further, the laser processing apparatus according to the present embodiment is described as a laser annealing treatment for crystallizing an amorphous film by laser processing. However, as the invention of the present application, the contents of the laser processing are The present invention is not limited thereto. For example, the non-single-crystal semiconductor film may be single-crystallized or the crystalline semiconductor film may be modified. Moreover, peeling of the object to be processed can also be performed.

A laser light source 10 is disposed outside the processing chamber 2. The laser light source 10 can output any one of pulsed oscillating laser light and continuous oscillating laser light, but the present invention is not limited to any of the above.

In the present embodiment, the laser light source 10 outputs pulsed laser light 15. The laser light 15 adjusts the energy density using an attenuator 11 as needed, and includes The optical system 12 of the mirror 12a, the homogenizer 12b, the mirror 12c, the collecting lens 12d, and the like are shaped or deflected into a line beam shape or the like. Further, the optical member constituting the optical system 12 is not limited to the above, and may include various lenses, mirrors, waveguides, and the like. A line beam 150 whose beam cross-sectional shape is linear by the optical system 12 described above is obtained. The size of the line beam 150 is not particularly limited, and examples of the shape on the surface of the object to be processed include, for example, a short axis width of 0.155 mm to 0.450 mm and a major axis width of 370 mm to 1300 mm.

Further, a shielding member 13 is disposed between the collecting lens 12d and the introduction window 6, and is positioned on the optical path of the line beam 150 to divide and shape the line beam 150 into a plurality of line beams; and the long-axis end shielding portion 20, The long axis end of the line beam 150 is shielded. The shielding member 13 and the long-axis end shielding portion 20 may be integrated, and may be configured separately.

The shielding member 13 is movable relative to the optical path of the line beam 150, and the movement position adjustment can be performed manually or/or the movement position can be adjusted by the driving portion. The movement can be performed by sliding or rotating relative to the optical path, and it is also possible to combine the above. The shielding member 13 can be retracted to the outside of the optical path of the line beam 150 and moved into the optical path of the line beam 150 when the line beam 150 is shielded, or can be moved only in the optical path. In the present embodiment, the shielding member 13 is disposed between the optical system 12 and the introduction window 6, and the shielding member 13 may be disposed between the introduction window and the object to be processed.

Further, the laser processing apparatus 1 includes a scanner unit 3, a drive unit (not shown) for shielding the member 13, and a control unit 7 for controlling the laser light source 10 and the like. Control unit 7 A central processing unit (CPU) or a program, a memory unit, etc. that are operated by a central processing unit (CPU).

Next, the operation of the laser processing apparatus 1 will be described.

The laser light source 10 is pulse-oscillated at a predetermined repetition frequency under the control of the control unit 7, and outputs the laser light 15 at a predetermined output. The laser light 15 is exemplified by a wavelength of 400 nm or less and a pulse half value width of 200 ns or less. However, the invention is not limited to these.

The laser light 15 is adjusted by the attenuator 11 controlled by the control unit 7 to adjust the pulse energy density. The attenuator 11 is set to a predetermined attenuation rate to adjust the attenuation rate such that the irradiation pulse energy density most suitable for crystallization is obtained on the irradiation surface of the ruthenium film 100b. For example, when the amorphous ruthenium film 100b is crystallized or the like, the energy density on the irradiation surface is adjusted to be 250 mJ/cm ² to 500 mJ/cm ² .

The laser light 15 that has passed through the attenuator 11 is shaped into a line beam shape by the optical system 12, and the short axis width is concentrated to become the line beam 150. The line beam 150 is shaped, for example, such that the length on the long axis side of the ruthenium film 100b is 370 mm to 1300 mm, and the length on the short axis side is 100 μm to 500 μm.

As shown in the long-axis cross-sectional beam profile of FIGS. 2(a) and 2(b), the line beam 150 includes a flat portion 150a having a maximum energy intensity of 96% or more, and a steepness portion 150b. Both end portions in the long axis direction have a smaller energy intensity than the flat portion 150a, and the energy intensity gradually decreases toward the outside. The slope portion 150b can be set in a range of 10% to 90% of the maximum intensity.

Fig. 13 is a view showing an outline of an optical path of a conventional laser annealing treatment apparatus. The Similarly to the laser processing apparatus 1 of the above-described embodiment, the laser processing apparatus includes an optical system such as a mirror 12c and a collecting lens 12d, and an optical path between the collecting lens 12d and an introduction window (not shown). The long-axis end shield portion 20 of the long-axis end portion of the shielded-line beam 150 is disposed. The inclination of the slope portion 150b of the line beam 150 can be reduced by cutting the long-axis end portion of the line beam by the long-axis end shielding portion 20. Also shown in Fig. 13 is the beam profile of the line beam 150 whose long axis end has been cut.

In the present embodiment, the control unit 7 controls the movement of the shielding member 13, and obtains a line beam in which a part of the line beam 150 is shielded and divided.

3(a) and 3(b) show the above examples. The long-axis direction end portion of the line beam 150 that has passed through the shielding member 13 and the long-axis end portion shielding portion 20 is shielded by the long-axis end portion shielding portion 20, and a part of the flat portion is separated by the long-axis direction of the line beam 150. The shielding portion 130 of the shielding member 13 positioned at intervals is shielded, thereby obtaining a plurality of divided line beams 151 whose length of the long axis is shortened, and the line beam 151 is irradiated onto the semiconductor substrate 100.

The beam profile of the divided line beam 151 is shown together in Fig. 3(a). A more detailed beam profile is shown in Figure 2(b). In the case of the line beam 151, each of the line beams 151 has a flat portion 151a and a slope portion 151b on both sides in the longitudinal direction, and the adjacent flat portions 151a have intervals corresponding to the interval of the shield portion 130.

Further, FIG. 3(b) is a plan view showing the semiconductor substrate 100 to be distributed by the processing unit 110 at intervals. The line beam 151 is divided so as to have a major axis length that matches the width of the processed portion 110 (the horizontal direction in the drawing). therefore, The shielding portion 130 is arranged on the shielding member 13 in accordance with the arrangement of the processed portions 110.

In the laser processing apparatus 1, the reticle 100b can be moved at a predetermined scanning speed, and the line beam 151 is irradiated by the irradiation of the line beam 151 in accordance with the arrangement of the processed portion 110. After the irradiation for a predetermined period of time, the irradiation of the laser light is turned off (OFF) for a short time, and the laser light is irradiated again, whereby the unirradiated area 110a can be secured in the scanning direction. By repeating the above steps, the semiconductor substrate 100 is processed so as not to irradiate the laser light other than the processed portion 110, thereby obtaining the processing portion 111 distributed in an island shape.

Further, the shielding member 13 can change the shape or position of the shielding portion 130 by movement, whereby the shape of the divided linear light beam can be changed. The following is explained.

4(a) and 4(b) show the detailed shape of the shielding member 13.

The shielding member 13 has a shielding portion 130 whose width is stepwise different in the short-axis direction of the line beam 150, and the width of each shielding portion 130 is the same in the longitudinal direction of the line beam 150. Each of the shielding portions 130 is coupled to each other by a base portion, and each of the shielding portions 130 is integrally movable. When the shielding member 13 is moved in the short-axis direction of the line beam 150 and the shielding portion 130 is positioned in the line beam 150 with a predetermined shielding width, the shape of the divided line beam can be adjusted according to the shielding width.

Further, in terms of the shape of the shielding portion, it is preferable that the edge direction of the shielding edge is perpendicular or arbitrary with respect to the long-axis direction of the line beam, and the cross-section in the irradiation direction of the line beam is reduced toward the shielding edge, and further More desirably, the shadow edge is sharp. Thereby, it is possible to prevent or suppress the diffraction of the line light beam 150 due to the shielding edge of the shielding portion, thereby adversely affecting the semiconductor substrate 100.

5(a) to 5(d) show a schematic shape in which the width of the shielding portion 130 on the optical path of the shielding member 13 is changed with respect to the optical path, and the outline of the beam profile of the divided linear beam. In the shielding member 13, the length and the interval in the longitudinal direction of each of the divided line beams can be adjusted stepwise.

Fig. 6 shows a shielding member 13a of another example.

The shielding member 13a has a shielding portion 130a having an isosceles triangle shape with a space therebetween, and the shielding portion 130a continuously changes in width along the short-axis direction of the line beam 150. Further, each of the shielding portions 130a can move independently of each other, and the shielding width can be changed by moving in the short-axis direction of the line beam 150, whereby the long-axis length of the divided line beam can be adjusted. Moreover, the number of divided line beams can also be changed by having a part of the shielding portion 130a on the optical path and the other shielding portion 130a being located outside the optical path.

Further, in this embodiment, the long-axis end shield portion 20 is movable along the long-axis direction of the line beam 150, and the between the both end portions of the divided line beam can be changed by adjustment in the optical system 12. size.

Fig. 7 shows a shielding member 13b of still another example.

Similarly to the shielding member 13, the shielding member 13b has a shape in which the width in the major axis direction is different stepwise along the short-axis direction of the line beam 150. However, the shielding member 13b is different from the shielding member 13 in that each shielding portion 130b is individually movable in the short-axis direction, and the shielding portion 130b can be adjusted by moving the shielding portion 130b in the short-axis direction of the line beam 150 to adjust the shielding width. The length of the long axis of the segmented line beam. Further, the number of divided line beams may be changed by positioning a part of the shielding portion 130b on the optical path and a part of the shielding portion 130b outside the optical path.

In each of the above-described shielding members, the case where the width in the major axis direction is gradually or continuously changed in the same direction (increased or decreased) along the short-axis direction of the line beam 150, but may not be described. There is a tendency to increase and decrease, and the width in the long axis direction differs depending on the moving position.

Fig. 8 shows a shielding member 13c of still another example.

The shielding member 13c has a plurality of shielding portions 130c spaced apart from each other in the longitudinal direction of the beam, and each shielding portion 130c is individually movable in the short-axis direction. The shielding portion 130c has different major axis widths in the short-axis direction position, and the difference does not have a fixed tendency to increase or decrease, and the shielding width can be changed by moving the shielding portions 130c in the short-axis direction of the line beam 150. , thereby adjusting the length of the long axis of the split line beam. Moreover, the width in the longitudinal direction of each of the shielding portions 130c is such that it does not have a size in the short-axis direction, and has a suitable width in accordance with the movement position in the short-axis direction.

Further, although each of the shielding members in the above-described shielding members has the same shape, each of the shielding portions may have a different shape.

Fig. 9 shows a shielding member 13d of still another example. In this embodiment, the shielding portion 130d and the shielding portion 131d are alternately arranged in the longitudinal direction and have different shapes from each other. The shielding portion 130d is configured to gradually change in width in the longitudinal direction along the short-axis direction. Therefore, by moving in the same direction, the width in the long axis direction can be sequentially increased or decreased. The change in the width in the major axis direction of the shielding portion 131d does not have a tendency to increase or decrease in a fixed manner, but has a suitable width in the major axis direction according to the position in the short axis direction.

By appropriately moving the shielding portion 130d and the shielding portion 131d, the divided line beams can be obtained in various lengths. In the present embodiment, the case where the shielding members having different shapes are alternately arranged has been described. However, in the present invention, the arrangement method is not particularly limited, and the types of the shielding members having different shapes are not particularly limited.

Further, although the shielding portion is moved in the short-axis direction in each of the shielding portions described above, the shielding portion may be moved in the same plane as the short-axis direction so as to have an angle with the short-axis direction, and may be short and short. The planes with the same axial direction move along the long axis direction. Further, it is also possible to move in a plane having an angle with respect to the short-axis direction. The moving direction is not limited to one direction and can be performed in multiple directions.

In each of the above embodiments, the shielding portion has been slidably moved, but the shielding portion is also rotatable. The following is explained.

Fig. 10 shows another shielding member 13e in which a plurality of shielding portions 130e are arranged at intervals in the longitudinal direction. The shielding portion 130e has a flat plate shape and has a rotation axis along the short-axis direction of the line beam 150, and is rotatable and driven with the rotation axis. By this rotation, the effective width of the shielding in the long-axis direction in the irradiation direction of the line beam 150 can be changed. Each of the shielding portions 130e may be rotated in conjunction with each other, and some or all of them may be independently rotated. When the rotation is independently rotatable, the shielding shape can be changed by the difference in the rotation angle between some or all of the shielding portions 130e.

Fig. 11 shows a shielding member 13f of still another example, in which a plurality of shielding portions 130f are arranged at intervals along the longitudinal direction. The shielding portion 130f has a rotation axis along the short-axis direction of the line beam 150, and is rotationally driven in accordance with the rotation axis. The shape of the outer peripheral surface of each of the shielding portions 130f is different in the circumferential direction, and can be rotated by the above and according to the rotational position. The effective width of the shielding relative to the long-axis direction of the line beam 150 is changed. Further, similarly to the above-described embodiment, each of the shielding portions 130f can be rotated in conjunction with each other, and some or all of them can be independently rotated. When the rotation is independently rotatable, the shielding shape can be changed by the difference in the rotation angle between some or all of the shielding portions 130f.

Further, in the above-described embodiment, the rotation axis has been described along the short axis direction, but the direction of the rotation axis is not particularly limited, and a plurality of rotation axes may be provided.

Further, although the left and right shape symmetry in the longitudinal direction of each of the masking materials is mainly described, the left and right shapes may be different.

Fig. 12 shows a shielding member 13g of another example.

The shielding member 130g continuously changes in the direction of the short axis of the line beam 150 along the short axis direction of the line beam 150, and the left side of the long axis direction has a right-angled triangular shape along the minor axis direction, according to the short axis. The direction of movement of the direction changes continuously in the direction of the long axis direction. The length in the long-axis direction of the divided line beam can be adjusted by moving the shielding portion 13g in the short-axis direction, and the end position in the long-axis direction of the divided line beam can be adjusted on one side. Each of the shielding portions 130g may be interlocked, and some or all of the shielding portions may be independently moved.

The shape of each of the shielding members described above is shown as an example. As the invention of the present application, the shape of the shielding member is not particularly limited, and the shielding shape may be changed according to the movement.

Further, at least the surface of each of the shielding members to be irradiated on the side of the laser beam is preferably formed into a rough surface in order to prevent reflection of the laser light. Or each The upper surface of the shielding member may also be at an angle of incidence of 90 degrees with respect to the laser light by imparting an angle. With these countermeasures and the vertical reflection of the laser light, it is possible to prevent the reflected light from returning to the optical system.

Alternatively, the surface of the shielding member may also reflect the line beam, and the upper surface thereof is angled so that the reflected light is reflected in a direction different from the optical system. Providing a measuring device that measures the intensity (power or energy density, etc.) of the reflected light, and adjusts the energy output of the laser light by using the measurement result, or adjusts the attenuation rate of the attenuator, thereby enabling the laser processing object to reach Fixed power.

Further, in the above-described embodiment, the case where the shielding member has been completely moved has been described. For example, the shape of the divided line beam can be adjusted by changing the shielding shape by the combination of the fixed shielding portion and the movable shielding portion.

The present invention has been described above based on the above embodiments, but the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the scope of the invention.

13‧‧‧Shielding materials

20‧‧‧Long-axis end shelter

100‧‧‧Semiconductor substrate

110‧‧‧Processed Department

111‧‧‧Processing Department

130‧‧ ‧Mask

Claims (11)

A shielding member that shields a part of the laser beam from the transmission of the linear beam shape to form a plurality of divided line beams that are irradiated to the object to be processed, the laser light shielding member being characterized in that the shielding member is set to be a part or All of the optical paths of the laser beam can be relatively moved with respect to the linear beam shape, and the shape of the divided line beam can be adjusted in accordance with the movement. The laser light shielding member according to the first aspect of the invention is characterized in that the shape of the shielding is changed in accordance with the movement. The laser light shielding member according to claim 2, which is provided with a shape in which the shielding shape changes stepwise or continuously in accordance with the movement. The laser light shielding member according to any one of claims 1 to 3, wherein the movement comprises a sliding movement and/or a rotational movement. The laser light shielding member according to any one of claims 1 to 4, wherein the shape of the line beam is adjusted to a length adjustment of a longitudinal direction of the line beam. A laser processing apparatus, comprising: a laser light source that outputs laser light; an optical system that shapes the laser light into a line beam shape and guides it to a processed object; and the processed object holding portion holds the And a laser light shielding member according to any one of claims 1 to 5, The laser light shielding member is disposed such that the laser light having the shape of the line beam is guided to the optical path of the object to be processed held by the object holding portion, and is partially A plurality of divided line beams can be formed by shielding the transmission of the line beam. The laser processing apparatus according to claim 6, wherein the shielding member is capable of sliding movement and/or rotational movement. The laser processing apparatus according to claim 6 or 7, wherein the object to be processed has a laminated structure, and the object to be processed is subjected to a peeling process. The laser processing apparatus according to claim 6 or 7, wherein the object to be processed is a substrate having a semiconductor layer, and crystallization or crystallization of the semiconductor layer is performed. The laser processing apparatus according to any one of claims 6 to 9, wherein the object to be processed is a plastic substrate. A laser light irradiation method is characterized in that a laser beam is shaped into a line beam shape, and a part or all of the movable shielding member is disposed on an optical path of the line beam to shield a part of the line beam from being transmitted. The plurality of divided line beams irradiate the line beam that has undergone the division to the object to be processed, and the shape of the divided line beam is determined corresponding to the arrangement position according to the movement.