JP5725518B2 - Laser light shielding member, laser processing apparatus, and laser light irradiation method - Google Patents

Description

  The present invention relates to a laser beam shielding member that divides a line beam-shaped laser beam to obtain a plurality of line beams, a laser processing apparatus that divides a line beam and processes an object to be processed, and a laser beam irradiation method.

A method of performing laser processing on a processing target used for a liquid crystal display or an organic EL display using a line beam is known.
In such laser processing, for example, continuous-wave laser light focused in a linear or rectangular shape (band shape) is turned on / off on a stable and high-quality semiconductor film (silicon film) formed only at a desired position. However, it is known that the film is annealed by scanning while being reformed into a strip-like polycrystalline silicon film (see Patent Document 1).
In addition, when applied to system-on-glass, etc., in order to homogenize the transistor characteristics of the TFT at a high level and realize a TFT that has excellent mobility and can be driven at high speed, particularly in the peripheral circuit region, a -Si film 2 is patterned into a linear shape (ribbon shape) or an island shape (island shape), and is continuously output from the CW laser 3 to the surface of the a-Si film or the back surface of the glass substrate with respect to time. An apparatus that crystallizes an a-Si film by irradiating and scanning an energy beam in the direction of an arrow is known (see Patent Document 2, FIGS. 1A and 1B).

JP 2004-151668 A JP 2005-354087 A

As described above, in the conventional laser annealing apparatus, when the laser processing object is irradiated with the laser beam and the laser annealing process is performed, the beam length of the laser light is adjusted according to the size of the laser processing object. A beam shielding material is used in the long axis direction for the purpose of removing a portion where the energy density generated at the end of the long axis of the beam is not uniform.
As the substrate becomes larger, productivity is improved by increasing the beam size and reducing the number of scans.
However, depending on the substrate, there are portions that should not be irradiated, and for example, there may be portions that are burned when irradiated with laser light. There is a problem that impurities are generated when laser light is irradiated. For this reason, there is a method of dealing with this by shortening the beam length of the laser beam in order to avoid the irradiation to that portion, but there is a problem that productivity is lowered.

  The present invention has been made to solve the above-described problems of the prior art. The line beam is divided so that a portion where irradiation is avoided can be secured on the object to be processed, and the divided line beam is covered. An object is to provide a laser light shielding member, a laser processing apparatus, and a laser light irradiation method that enable irradiation of a processing body.

That is, among the laser light shielding members of the present invention, the first aspect of the present invention shields transmission of the full width of the short axis along the short axis direction in part of the long axis direction with respect to the laser beam having a line beam shape. In addition to the shielding of the full width of the short axis in the range excluding the long axis end, the laser beam is transmitted to form a plurality of divided line beams irradiated to the object to be processed,
The shield member has a shield shape that extends with a length exceeding the minor axis width of the line beam, and the width shape of the shield member changes stepwise or continuously in the length direction. A part or all of the optical path is installed so as to be relatively slidable in the short axis width direction of the laser light in the length direction, and the shielding shape for shielding the laser light changes with the movement. Thus, the shape of the divided line beam can be adjusted.
The laser light shielding member according to the second aspect of the present invention shields transmission of the full width of the short axis along the short axis direction in part of the long axis direction with respect to the laser beam having the line beam shape in the first aspect of the present invention. In addition to shielding the full width of the short axis , the shielding member is a shielding member that transmits the laser beam and forms a plurality of divided line beams that are irradiated onto the object to be processed. A part or all of the optical path of the laser beam having a shape is installed so as to be relatively rotatable , and the shape of the divided line beam is adjusted by changing the shielding shape with respect to the laser beam with the movement. It is made possible.
According to a third aspect of the present invention, there is provided the laser light shielding member according to the second aspect , wherein the shielding member extends in a shielding shape with a length exceeding a minor axis width of the line beam, and is stepped in the length direction. The width shape of the laser beam is changed continuously or continuously, and a part or the whole of the optical path of the laser beam having the line beam shape can be slid relative to the short axis width direction of the laser beam in the length direction. It is installed, and the shielding shape with respect to the laser light is changed with the rotation or / and the sliding movement, so that the shape of the divided line beam can be adjusted .
The laser beam shielding member according to a fourth aspect of the present invention is characterized in that, in any one of the first to third aspects of the invention, the shape adjustment of the line beam is a length adjustment of the long direction of the line beam. Do

A laser processing apparatus according to a fifth aspect of the present invention includes a laser light source that outputs laser light, an optical system that shapes the laser light into a line beam shape and guides the laser light to a target object, and the object to be irradiated in preparation for irradiation with the laser light. An object-to-be-processed holding part that holds the object to be processed, and the laser light shielding member according to claim 1,
The laser beam shielding member is a part of the long axis direction of the line beam on an optical path to which the laser beam having the line beam shape is guided and reaches the object to be processed held by the object holding unit. In the short axis direction, the transmission of the full width of the short axis is shielded, and the laser light is transmitted in a range other than the shielding of the full width of the short axis width except for the end of the long axis, and a plurality of divided lines To be arranged so that a beam can be formed.
A laser processing apparatus according to a sixth aspect of the present invention is characterized in that, in the fifth aspect of the present invention, the object to be processed has a laminated structure, and the object to be processed is peeled off.
A laser processing apparatus according to a seventh aspect of the present invention is the laser processing apparatus according to the fifth or sixth aspect , wherein the object to be processed is a substrate having a semiconductor layer, and the semiconductor layer is crystallized or activated. It is characterized by being.
According to an eighth aspect of the present invention, there is provided the laser processing apparatus according to any one of the fifth to seventh aspects, wherein the object to be processed is a plastic substrate.

According to the present invention, the line beam is divided by the shielding member, and the object to be processed is irradiated with the divided line beam. The shielding member can change the shape of the line beam after being divided by movement, and a plurality of irradiation patterns for the object to be processed can be obtained.
In addition, as a to-be-processed object, the various thing which irradiates with the laser beam of a line beam can be made into object, The objective also includes various things, such as peeling, crystallization, and activation. For these purposes, examples of the object to be processed include a glass substrate and a plastic substrate having a semiconductor layer.

The laser beam shaped into a line beam shape is not limited to pulsed laser beam, continuous wave laser beam, etc., and the type of laser is not particularly limited, such as gas laser, solid state laser, semiconductor laser, etc. Absent.
The shielding member changes the shielding shape by movement and can change the line beam shape after being divided. The shielding shape that changes due to movement may change continuously with movement, may change stepwise, or may be a combination thereof.

The shielding of the shielding member may be such that the laser beam is transmitted to such an extent that the transmittance can be reduced and the influence on the irradiated surface of the object to be processed can be eliminated, in addition to completely preventing the transmission of the laser beam. .
Moreover, the movement of the shielding member can be performed by slide movement, rotation movement, or the like, and the rotation movement may be performed by a plurality of rotation axes. In addition to moving along the surface direction of the shielding member, the slide movement may be performed in a direction crossing the surface direction of the shielding member. Moreover, it is also possible to combine these.
The movement of the shielding member may be performed manually or by driving, or may be performed automatically by control. The movement of the shielding member is not limited as long as it can move relative to the optical path of the line beam, and the movement of the shielding member may be performed by moving the line beam.

  As described above, according to the present invention, it is possible to obtain a line beam divided in a shape determined by the moving position of the shielding member, and to irradiate the object to be processed. It is possible to irradiate the workpiece with the line beam without irradiating the laser beam to the part that does not require irradiation or the part that you do not want to irradiate. Moreover, desired processing can be performed with high quality.

It is a figure which shows the outline of the laser processing apparatus containing the shielding member which is one Embodiment of this invention. Similarly, it is a figure which shows the beam profile of the long-axis direction cross section of the line beam before and behind parting. Similarly, it is the schematic which shows the optical path of the shielding member vicinity, the schematic which shows the parted beam profile, and the figure which shows the plane of a semiconductor substrate. Similarly, it is the top view and front view which show the detailed shape of a shielding member. Similarly, it is the top view and front view explaining the change of the shielding shape accompanying the movement of a shielding member. Similarly, it is a top view which shows the example of a change of a shielding member. Similarly, it is a top view which shows the other example of a change of a shielding member. Similarly, it is a top view which shows the other modification of a shielding member. Similarly, it is a top view which shows the other modification of a shielding member. Similarly, it is the front which shows the other modification of a shielding member. Similarly, it is the front which shows the other modification of a shielding member. Similarly, it is a top view which shows the other modification of a shielding member. It is the figure which shows the schematic which shows the long-axis end part shield part vicinity in the conventional laser processing apparatus, and the outline of a beam profile.

Below, the laser processing apparatus provided with the shielding member which concerns on one Embodiment of this invention is demonstrated based on FIG.
The laser processing apparatus 1 includes a processing chamber 2, and a scanning device 3 is provided in the processing chamber 2. A base 4 is installed on the scanning device 3, and the base 4 can be moved in the X direction (scanning direction) by the scanning device 3, and the base 4 can be further moved in the Y direction. It may be what became.
The processing chamber 2 is provided with an introduction window 6 for introducing a line beam from the outside.

At the time of laser processing, a semiconductor substrate 100 in which an amorphous silicon film 100b or the like is formed on a glass substrate 100a or the like on the base 4 is installed. The semiconductor substrate 100 corresponds to an object to be processed. Further, the object to be processed is not limited to the semiconductor substrate 100. For example, an object in which a semiconductor film or the like is formed on a plastic substrate can be used as the object to be processed.
Although the laser processing apparatus of the present embodiment is described as related to laser annealing for crystallizing an amorphous film by laser processing, the present invention is not limited to this, For example, a non-single-crystal semiconductor film may be single-crystallized or a crystalline semiconductor film may be modified. Further, the object to be processed may be peeled off.

A laser light source 10 is installed outside the processing chamber 2. The laser light source 10 may output either a pulsed laser beam or a continuous wave laser beam, and the present invention is not limited to either one.
In this embodiment, the laser light source 10 outputs a pulsed laser beam 15. The energy density of the laser light 15 is adjusted by the attenuator 11 as necessary, and the optical system 12 including the reflecting mirror 12a, the homogenizer 12b, the reflecting mirror 12c, the condenser lens 12d, and the like is shaped or deflected into a line beam shape or the like. Is made. In addition, the optical member which comprises the optical system 12 is not limited to the above, Various lenses, a mirror, a waveguide part, etc. can be provided. The optical system 12 provides a line beam 150 whose beam cross-sectional shape is a line shape. The size of the line beam 150 is not particularly limited, but examples of the shape on the surface of the object to be processed include a short axis width of 0.155 to 0.450 mm and a long axis width of 370 to 1300 mm.

Further, between the condensing lens 12d and the introduction window 6, the long axis of the line beam 150 and the shielding member 13 which is positioned on the optical path of the line beam 150 and divides the line beam 150 into a plurality of line beams. A long-axis end portion shielding portion 20 that shields the end portion is disposed. The shielding member 13 and the long-axis end shielding portion 20 may be integrated, or may be configured separately.
The shielding member 13 is movable with respect to the optical path of the line beam 150, and the movement position adjustment by manual operation and / or the movement position adjustment by the drive unit can be performed. The movement can be performed by sliding or rotating relative to the optical path, or a combination thereof. The shielding member 13 may be retracted outside the optical path of the line beam 150 and may move into the optical path of the line beam 150 when the line beam 150 is shielded, or may move only within the optical path. In this embodiment, the shielding member 13 is disposed between the optical system 12 and the introduction window 6. However, the shielding member 13 may be positioned between the introduction window and the object to be processed.

  In addition, the laser processing apparatus 1 includes a control unit 7 that controls the scanning device 3, a drive unit (not shown) of the shielding member 13, the laser light source 10, and the like. The control unit 7 includes a CPU, a program for operating the CPU, a storage unit, and the like.

Next, the operation of the laser processing apparatus 1 will be described.
In the laser light source 10, the pulse is oscillated at a predetermined repetition frequency under the control of the control unit 7, and the laser light 15 is output at a predetermined output. Examples of the laser beam 15 include those having a wavelength of 400 nm or less and a pulse half width of 200 nsec or less. However, the present invention is not limited to these.
The pulse energy density of the laser beam 15 is adjusted by the attenuator 11 controlled by the control unit 7. The attenuator 11 is set to a predetermined attenuation rate, and the attenuation rate is adjusted so that an irradiation pulse energy density optimum for crystallization can be obtained on the irradiation surface of the silicon film 100b. For example, when the amorphous silicon film 100b is crystallized, the energy density can be adjusted to 250 to 500 mJ / cm ² on the irradiated surface.

  The laser beam 15 that has passed through the attenuator 11 is shaped into a line beam shape by the optical system 12 and the short axis width is condensed into a line beam 150. For example, the line beam 150 is shaped on the silicon film 100b so that the length on the long axis side is 370 to 1300 mm and the length on the short axis side is 100 μm to 500 μm.

  As shown in the long-axis cross-sectional beam profile of FIG. 2, the line beam 150 has a flat portion 150a that is 96% or more of the maximum energy intensity, and is positioned at both ends in the long-axis direction, and is more than the flat portion 150a. A steepness portion 150b that has a small energy intensity and gradually decreases toward the outside. The steepness portion 150b can be a region in the range of 10% to 90% of the maximum strength.

  FIG. 13 shows an outline of an optical path in a conventional laser annealing apparatus. Similarly to the laser processing apparatus 1 of the above embodiment, this laser processing apparatus also includes optical systems such as a reflection mirror 12c and a condensing lens 12d, and an optical path between the condensing lens 12d and an introduction window (not shown). In addition, a long-axis end shielding portion 20 that shields the long-axis end portion of the line beam 150 is disposed. The inclination of the steepness portion 150b of the line beam 150 can be reduced by cutting the long-axis end portion of the line beam by the long-axis end shielding portion 20. FIG. 13 also shows the beam profile of the line beam 150 with the major axis end cut.

In the present embodiment, the control unit 7 controls the movement of the shielding member 13 to shield a part of the line beam 150 and obtain a divided line beam.
An example is shown in FIG. The line beam 150 that has passed through the shielding member 13 and the long-axis end shield part 20 is shielded at the long-axis end part by the long-axis end shield part 20, and a part of the flat part is the length of the line beam 150. A plurality of divided line beams 151 whose major axis length is reduced are obtained by being shielded by the shielding portion 130 of the shielding member 13 that is spaced apart in the axial direction, and the semiconductor substrate 100 is irradiated with the line beams 151. Is done.
FIG. 3A also shows the beam profile of the divided line beam 151. A more detailed beam profile is shown in FIG. The line beam 151 has a flat portion 151 a and a steepness portion 151 b on both sides in the long axis direction for each line beam 151, and the adjacent flat portions 151 a have an interval according to the interval of the shielding portion 130. doing.

  FIG. 3B is a plan view of the semiconductor substrate 100 in which the processing target portions 110 are allocated at intervals in the vertical and horizontal directions. The line beam 151 is divided so as to have a major axis length that matches the width of the processing target 110 (in the horizontal direction in the figure). Therefore, the shielding unit 130 is arranged on the shielding member 13 in accordance with the arrangement of the processing target 110.

In the laser processing apparatus 1, it is possible to perform the overlap irradiation of the line beam 151 according to the arrangement of the processing target 110 by irradiating the line beam 151 while moving the silicon film 100b at a predetermined scanning speed. After the irradiation for a predetermined time, the irradiation with the laser beam is turned off for a short time and the irradiation with the laser beam is performed again, whereby the unirradiated region 110a can be secured in the scanning direction. By repeating this, the semiconductor substrate 100 is processed so as not to irradiate the laser light other than the processing target portion 110, and processing portions 111 distributed in an island shape are obtained.
Moreover, the shielding member 13 can change the shape and position of the shielding part 130 by movement, and can change the shape of the line beam divided by this. This will be described below.

FIG. 4 shows the detailed shape of the shielding member 13.
The shielding member 13 has shielding portions 130 having different widths stepwise along the minor axis direction of the line beam 150. In the major axis direction of the line beam 150, the shielding portions 130 have the same width. Yes. Each shielding part 130 is connected by the base, and each shielding part 130 can move integrally. When the shielding member 13 is moved in the short axis direction of the line beam 150 and the shielding part 130 is positioned on the line beam 150 with a predetermined shielding width, the shape of the line beam divided according to the shielding width can be adjusted. it can.
The shape of the shielding portion is such that the edge direction of the shielding edge is perpendicular to the major axis direction of the line beam or an arbitrary angle, and the cross section in the line beam irradiation direction becomes smaller toward the shielding edge. Desirably, and more preferably, the shielding edge is sharp. Thereby, it is possible to prevent or suppress the occurrence of the adverse effect on the semiconductor substrate 100 due to the diffraction of the line beam 150 caused by the shielding edge of the shielding part.

  5A to 5D show a state in which the shielding member 13 moves with respect to the optical path, the width of the shielding part 130 positioned in the optical path is changed, and the schematic shape of the beam profile of the divided line beam. It is shown. With this shielding member 13, the length and the interval in the major axis direction of each divided line beam can be adjusted stepwise.

FIG. 6 shows another example of the shielding member 13a.
The shielding member 13a has isosceles triangular shielding portions 130a having a width that continuously changes along the minor axis direction of the line beam 150 at intervals. In addition, each shielding part 130a can be moved independently of each other, and the major axis length of the divided line beam is adjusted by changing the shielding width by moving in the minor axis direction of the line beam 150. Can do. In addition, the number of line beams divided can be changed by positioning some of the shielding portions 130a in the optical path and other shielding portions 130a outside the optical path.
Further, in this embodiment, the long-axis end shield part 20 is movable in the long-axis direction of the line beam 150 and is adjusted to the adjustment in the optical system 12 so that both end parts of the divided line beam are obtained. The size between can be changed.

FIG. 7 shows another example of the shielding member 13b.
Similarly to the shielding member 13, the shielding member 13 b has a shape in which the width in the major axis direction is gradually changed along the minor axis direction of the line beam 150. However, unlike the shielding member 13, the shielding member 13b is configured such that each shielding part 130b can move independently in the minor axis direction and is shielded by moving each shielding part 130b in the minor axis direction of the line beam 150. By changing the width, the major axis length of the divided line beam can be adjusted. In addition, the number of the divided line beams can be changed by positioning some of the shielding portions 130b in the optical path and positioning some of the shielding portions 130b outside the optical path.

In each of the shielding members described above, the long axis direction width is changed in the same tendency (increase or decrease) along the minor axis direction of the line beam 150. However, the shielding member has a tendency to increase or decrease. Without limitation, the width in the major axis direction may vary depending on the movement position.
FIG. 8 shows another example of the shielding member 13c.
The shielding member 13c has a plurality of shielding parts 130c spaced from each other in the line beam major axis direction, and each shielding part 130c is movable in the minor axis direction independently. The shields 130 c have different long-axis widths without having a constant increasing or decreasing tendency at the short-axis direction position, and are shielded by moving each shield 130 c in the short-axis direction of the line beam 150. By changing the width, the major axis length of the divided line beam can be adjusted. The major axis direction width of each shielding part 130c does not tend to be large or small in the minor axis direction, and is configured to have an appropriate width according to the movement position in the minor axis direction.

Moreover, in each said shielding member, although each shielding part demonstrated as what has the same shape, each shielding part may have a different shape.
FIG. 9 shows another example of the shielding member 13d. In this embodiment, the shielding portions 130d and the shielding portions 131d are alternately arranged in the long axis direction and have different shapes. The shielding part 130d is configured such that the long-axis direction width changes stepwise along the short-axis direction. Therefore, by moving in the same direction, it is possible to sequentially increase or decrease the width in the long axis direction. The shielding part 131d does not have a constant increase or decrease in change in the long-axis direction width, and has an appropriate long-axis direction width according to the short-axis direction position.
By appropriately moving the shielding part 130d and the shielding part 131d, it is possible to obtain a divided line beam with various lengths. In this embodiment, the description has been given on the assumption that the shielding members having different shapes are alternately arranged. However, the present invention is not particularly limited to the arrangement method, and the types of the shielding members having different shapes are particularly limited. It is not limited.

  In addition, although each said shielding part demonstrated what the shielding part moves along a short-axis direction, even if it moves in the same plane as a short-axis direction so that it may have an angle with a short-axis direction. Moreover, it may move along the long axis direction in the same plane as the short axis direction. Further, the minor axis direction may move in a plane having an angle. The moving direction is not limited to one direction, and may be performed in a plurality of directions.

In each of the above-described embodiments, the shielding part has been described as sliding, but the shielding part may be rotationally moved. This will be described below.
FIG. 10 shows another shielding member 13e, and a plurality of shielding portions 130e are arranged at intervals along the long axis direction. The shielding part 130e has a flat plate shape and has a rotation axis along the minor axis direction of the line beam 150, and can be driven to rotate according to the rotation axis. By this rotation, the shielding effective width in the major axis direction in the irradiation direction of the line beam 150 can be changed. Each shielding part 130e may rotate in conjunction with each other, or may partially or entirely rotate independently. When it is possible to rotate independently, the shielding shape can be changed by changing the rotation angle between some or all of the shielding portions 130e.
FIG. 11 shows another example of the shielding member 13f, and a plurality of shielding portions 130f are arranged at intervals along the long axis direction. The shielding part 130f has a rotation axis along the minor axis direction of the line beam 150, and can be driven to rotate according to the rotation axis. Each shielding portion 130f has a different shape of the outer peripheral surface at the circumferential position, and the rotation enables the shielding effective width in the major axis direction with respect to the line beam 150 to be changed according to the rotational position. Moreover, each shielding part 130f may rotate in conjunction with each other as in the above-described embodiment, or may be partially or entirely rotatable independently. When it is possible to rotate independently, the shielding shape can be changed by changing the rotation angle between some or all of the shielding portions 130e.
In the above embodiment, the rotation axis is described as being along the minor axis direction, but the direction of the rotation axis is not particularly limited, and a plurality of rotation axes may be provided.

Moreover, although the said shielding material mainly demonstrated what the left-right shape in a major axis direction is symmetrical, the left-right shape may differ.
FIG. 12 shows another example of the shielding member 13g.
The shielding member 130g has a right triangle shape in which the inclination of the outer piece continuously changes along the short axis direction of the line beam 150 on the right side in the long axis direction, and the outer piece on the left side in the long axis direction has the short axis direction. The major axis direction width changes continuously according to the movement position in the minor axis direction. The long axis direction length of the divided line beam can be adjusted by moving the shielding part 13g in the short axis direction, and the end position of the divided line beam in the long axis direction can be adjusted on one side. Can do. Each shielding part 130g may be interlocked, or may be movable independently by a part or all of the shielding parts.

  The shape of each shielding member described above is shown as an example, and the shape of the shielding member is not limited to a specific shape as an invention of the present application, and the shielding shape can be changed according to movement. That's fine.

In addition, it is desirable that at least the surface of each shielding member described above on the side irradiated with the laser beam be a rough surface in order to prevent reflection of the laser beam. Alternatively, the upper surface of each shielding member may be angled so as not to be 90 degrees with respect to the incident angle of the laser light. By these measures, the reflected light can be prevented from returning to the optical system by the vertical reflection of the laser light.
Alternatively, the surface of the shielding member may reflect the line beam, and the upper surface thereof may be angled so that the reflected light is reflected in a direction different from the optical system. By providing a measuring instrument that measures the intensity (power or energy density) of this reflected light, the laser processing is performed by adjusting the energy output of the laser light or adjusting the attenuation factor of the attenuator using the measurement results. A certain power can reach the object.

  Further, in the above embodiment, the description has been given of the case where the entire shielding member moves, but for example, the shape of the line beam divided by changing the shielding shape by the combination of the fixed shielding portion and the movable shielding portion is adjusted. May be.

  As described above, the present invention has been described based on the above embodiment, but the present invention is not limited to the content of the above embodiment, and appropriate modifications can be made without departing from the scope of the present invention. .

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 2 Processing chamber 3 Scanning apparatus 4 Base 6 Introduction window 7 Control part 10 Laser light source 12 Optical system 12a Reflection mirror 12b Homogenizer 12c Reflection mirror 12d Condensing lens 13, 13a, 13b, 13c, 13d, 13e, 13f , 13g Shielding member 130, 130a, 130b, 130c, 130d, 131d, 130e, 130f, 130g Shielding part 20 Long axis end shielding part 100 Semiconductor substrate

Claims (8)

With respect to line beam shaped laser light , the transmission of the full width of the short axis is shielded along the short axis direction in a part of the long axis direction, and other than the shielding of the full width of the short axis within the range excluding the long axis end portion A shielding member that forms a plurality of divided line beams through which the laser beam is transmitted and is irradiated on the object to be processed;
The shield member has a shield shape that extends with a length exceeding the minor axis width of the line beam, and the width shape of the shield member changes stepwise or continuously in the length direction. A part or all of the optical path is installed so as to be relatively slidable in the short axis width direction of the laser light in the length direction, and the shielding shape for shielding the laser light changes with the movement. Therefore, the shape of the divided line beam can be adjusted. To the laser light line beam shape along the short axis direction at a portion in the long axis direction and blocking the transmission of the short axis width overall width, said the laser beam is transmitted in the non-shielding of the short axis width the entire width, the A shielding member that forms a plurality of divided line beams that are irradiated to the processing body,
The shielding member is installed so that a part or all of the shielding member can rotate and move relative to the optical path of the laser beam having the line beam shape, and the shielding shape with respect to the laser beam changes with the movement, and is divided. The laser beam shielding member is characterized in that the shape of the line beam can be adjusted. The shielding member extends in a shielding shape with a length exceeding the minor axis width of the line beam, and its width shape changes stepwise or continuously in the length direction. A part or the whole of the optical path is installed so as to be slidable relative to the short axis width direction of the laser light in the length direction, and the shielding against the laser light with the rotation or / and the sliding movement. 3. The laser light shielding member according to claim 2, wherein the shape of the line beam is changed so that the shape of the divided line beam can be adjusted. Laser light blocking member according to any one of claims 1 to 3, wherein the shape adjustment of the line beam is the length of the long axial adjustment of the line beam. A laser light source that outputs laser light; an optical system that shapes the laser light into a line beam shape and guides the laser light to a target object; and a target object holding unit that holds the target object in preparation for irradiation with the laser light; The laser light shielding member according to claim 1,
The laser beam shielding member is a part of the long axis direction of the line beam on an optical path to which the laser beam having the line beam shape is guided and reaches the object to be processed held by the object holding unit. In the short axis direction, the transmission of the full width of the short axis is shielded, and the laser light is transmitted in a range other than the shielding of the full width of the short axis width except for the end of the long axis, and a plurality of divided lines A laser processing apparatus arranged so as to form a beam. The laser processing apparatus according to claim 5 , wherein the object to be processed has a laminated structure, and performs a peeling process of the object to be processed. 7. The laser processing apparatus according to claim 5 , wherein the object to be processed is a substrate having a semiconductor layer, and crystallizes or activates the semiconductor layer. The laser processing apparatus according to claim 5 , wherein the object to be processed is a plastic substrate.

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