TW201446087A - Circuit board structure for high frequency signal - Google Patents

Abstract

A circuit board structure for high frequency signal includes a substrate and a conductive circuit layer. The conductive circuit layer is formed on the substrate and includes a circuit pattern and a connection pad. The circuit pattern includes a base part and a round top part. The base part has a rectangular block shape. The round top part is disposed on the base part and has a semi-sphere shape, which is actually integrated with the base part as one body. The round top part can be varied into a round top part and is embedded in a dielectric glue film. Furthermore, it is applicable to form a double-faced structure of round top and round bottom. By means of configuring the surface of the circuit pattern into a semi-sphere shape, the reflection effect can be enhanced by such a semi-sphere shape, so as to solve the problem that the signals are concentrated in the prior rectangular structure or the signal strength is attenuated due to a rough surface. Therefore, the present invention can be applied in high-frequency and high-speed signal transmission.

Description

Circuit board structure for high frequency signals

The invention relates to a circuit board structure for high frequency signals, in particular, the circuit pattern has a circular arc structure to reduce the attenuation of high frequency signal transmission.

With the development of various electronic products and the development of the semiconductor industry, the existing line density is getting higher and higher, the signal transmission is getting faster and faster, and the demand for high-frequency and high-speed signal transmission is also increasing. First, a cross-sectional view of an embodiment of a conventional circuit board structure. As shown in the first figure, the conventional circuit board structure includes a substrate 100 and a conductive wiring layer 11. The conductive circuit layer 11 is formed on the substrate 100, and includes a circuit pattern layer 13 and a connection pad 15. Generally, the conductive circuit layer 11 is formed by electroplating. In order to increase the reliability of the conductive circuit layer 11, the surface of the substrate 100 may be first made. Roughening, or forming a plating seed layer (not shown) on the surface of the substrate 100, and then removing the plating seed layer after the conductive circuit layer 11 is completed, thus, the wiring pattern layer 13 and the connection pad 15 may be caused. Both the upper surface and the lower surface are rough surfaces 17. Although the rough surface contributes to the connection between the layers, the high-frequency signal transmission has a lot of tips, which makes it easy to concentrate the signal and attenuate the intensity of the signal.

In addition, in order to solve the problem of a rough surface, the first B diagram shows a schematic cross-sectional view of another embodiment of a conventional circuit board structure. As shown in FIG. B, the conductive circuit layer 11 is embedded in the dielectric film 120 by using a buried method, and the circuit pattern layer 13 and the connection pad 15 are exposed on the surface of the dielectric film 120. . This line pattern layer 13 has a rectangular cross section, but there is still a problem that the signal tends to concentrate on the tip.

In order to meet the current and future development trend of electronic products, it is necessary and urgent to change the structure of the line pattern layer on the circuit board to improve the high frequency and high speed signal transmission problems.

The main object of the present invention is to provide a circuit board structure for a high frequency signal, the circuit board structure for high frequency signals comprising a substrate and a conductive circuit layer, the conductive circuit layer being formed on the substrate and comprising a plurality of lines a pattern and a plurality of connection pads, the line patterns and the connection pads being electrically connected. The main feature is that each of the circuit patterns includes a base portion and a dome portion. The base portion is a rectangular block shape, and the dome portion is located on the base portion and is half-spherical, and is actually integrated with the base portion. The line pattern of the line pattern has a circularity ratio of 25 to 60%.

Another object of the present invention is to change the aforementioned circuit board structure to a buried type, in which a conductive circuit layer is embedded in a dielectric film, and a dome portion of the line pattern is inverted to form a round bottom. Further, the circuit pattern may have both a dome portion and a round bottom portion, the original bottom portion and the base portion being embedded in the dielectric film, and the dome portion protruding from the surface of the dielectric film.

By setting the surface of the line pattern layer to a semicircular shape and increasing the reflection effect by a semicircular shape, the problem of signal concentration and attenuation can be reduced, and the signal can be applied to high-frequency, high-speed signal transmission.

10‧‧‧ Conductive circuit layer

11‧‧‧ Conductive circuit layer

13‧‧‧ line pattern

15‧‧‧Connecting mat

20‧‧‧ line pattern

21‧‧‧Base section

22‧‧‧ line pattern

25‧‧‧Dome Department

27‧‧‧ round bottom

30‧‧‧Connecting mat

32‧‧‧Connecting mat

34‧‧‧Upper connection pad

36‧‧‧Lower connection pad

100‧‧‧Substrate

120‧‧‧dielectric film

The first A is a schematic cross-sectional view of an embodiment of a conventional circuit board structure.

Figure 1B is a cross-sectional view showing another embodiment of a conventional circuit board structure.

Figure 2A is a cross-sectional view showing the first embodiment of the circuit board structure for high frequency signals of the present invention.

Figure 2B is a cross-sectional view showing a second embodiment of the circuit board structure for high frequency signals of the present invention.

Figure 2C is a cross-sectional view showing the first embodiment of the circuit board structure for high frequency signals of the present invention.

The embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

Referring to Figure 2A, a cross-sectional view of a first embodiment of a circuit board structure for high frequency signals of the present invention is shown. As shown in FIG. 2A, the circuit board structure for high frequency signals according to the first embodiment of the present invention includes a substrate 100 and a conductive circuit layer 10, and the conductive circuit layer 10 is formed on the substrate 100, and the conductive circuit layer 10 is formed on the substrate 100. Include a plurality of line patterns 20 and a plurality of connection pads 30, The circuit pattern 20 and the connection pads 30 are electrically connected (the first figure is not shown in the side view), and each of the circuit patterns 20 includes a base portion 21 and a dome portion 25, and the base portion 21 is a rectangular block shape. The dome portion 25 is located on the base portion 21 and has a half-spherical shape, and is actually integrated with the base portion 21. The height of the line pattern 20 is b, the height of the base portion 21 is a, the line circularity is defined as (ba/a)×100%, and the line circularity of the circuit pattern 20 of the present invention is 25 to 60%. .

Referring to FIG. 2B, a cross-sectional view of a second embodiment of a circuit board structure for a high frequency signal of the present invention is shown. As shown in FIG. 2B, the circuit board structure for high frequency signals according to the second embodiment of the present invention comprises a dielectric film 120 and a conductive circuit layer 10, and the conductive circuit layer 10 is embedded in the dielectric film. 100 is exposed to the upper surface of the dielectric film 120. As in the first embodiment, the conductive circuit layer 10 includes a plurality of circuit patterns 20 and a plurality of connection pads 30, and the circuit patterns 20 and the connection pads 30 are electrically connected (the second figure is not shown in the side view), and each of the The circuit pattern 20 includes a base portion 21 and a round bottom portion 27. The base portion 21 is a rectangular block shape, but the round bottom portion 27 is located below the base portion 21 and is half-spherical, and is actually integrated with the base portion 21. The base portion 21 is exposed to the upper surface of the dielectric film 120. The height of the line pattern 20 is b, the height of the base portion 21 is a, the line circularity is defined as (ba/a)×100%, and the line circularity of the circuit pattern 20 of the present invention is 25 to 60%. .

Referring to FIG. 2C, a cross-sectional view of a third embodiment of a circuit board structure for high frequency signals of the present invention is shown. As shown in FIG. 2C, the circuit board structure for high frequency signals according to the third embodiment of the present invention includes a dielectric film 120 and a conductive circuit layer 12, and the conductive circuit layer 12 is embedded in the dielectric film. Within 120, and protruding from the upper surface of the dielectric film 120. The conductive circuit layer 12 includes a plurality of circuit patterns 22 and a plurality of connection pads 32. The circuit patterns 22 and the connection pads 32 are electrically connected (the third view is not shown in the side view), and each of the circuit patterns 22 includes a The base portion 21, a dome portion 25 and a round bottom portion 27 are formed in a rectangular block shape. The round bottom portion 27 is located below the base portion 21 and is hemispherical. The round bottom portion 27 and the base portion 21 are embedded in the dielectric. Among the films 120, the dome portion 25 has a hemispherical shape, and protrudes above the base portion 21 from the upper surface of the dielectric film 120. The dome portion 25 and the round bottom portion 27 are substantially integrated with the base portion 21. The height of the base portion 21 is a, the sum of the heights of the dome portion 25 and the base portion 21 is c, the sum of the heights of the round bottom portion 27 and the base portion 21 is d, and the circularity ratio of the first line is defined as (ca/a). ×100%, the second line circularity rate is defined as (da/a) × 100%, the first line of the line pattern 20 of the third embodiment The circular rate of the road and the circular rate of the second line are 25~60%.

In addition, the connection pad 32 of the third embodiment includes an upper connection pad 34 and a lower connection pad 36. The upper connection pad protrudes from the upper surface of the dielectric film 120, and the lower connection portion 34 is embedded in the dielectric film 120.

The main feature of the present invention is that the upper part and/or the lower part of the line pattern are formed in a hemispherical shape, and the semi-circular reflection effect is avoided, thereby avoiding the problem that the signal generated by the conventional technology generates noise at the tip end and the signal attenuation is avoided. High-frequency signals that can be used for high-speed transmission.

The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the present invention in any way, and any modifications or alterations to the present invention made in the spirit of the same invention. All should still be included in the scope of the intention of the present invention.

11‧‧‧ Conductive circuit layer

20‧‧‧ line pattern

21‧‧‧Base section

25‧‧‧Dome Department

30‧‧‧Connecting mat

100‧‧‧Substrate

Claims (7)

A circuit board structure for a high frequency signal, comprising: a substrate; and a conductive circuit layer formed on the substrate, and the plurality of circuit patterns and a plurality of connection pads, the circuit patterns are connected to the circuit The pad is electrically connected, and each of the circuit patterns includes a base portion and a dome portion, the base portion is a rectangular block shape, and the dome portion is located on the base portion and is half-spherical, and the dome portion and the base portion are As one. The circuit board structure for high frequency signals according to claim 1, wherein a line circular rate of the circuit patterns is 25 to 60%, and a circular rate of the line is defined as (ba/a)× 100%, a is the height of the base portion, and b is the height of the line pattern. A circuit board structure for a high frequency signal, comprising: a dielectric film; and a conductive circuit layer embedded in the dielectric film and exposed on an upper surface of the dielectric film, the conductive circuit layer comprising a plurality of circuit patterns and a plurality of connection pads, the circuit patterns and the connection pads are electrically connected, each of the circuit patterns includes a base portion and a round bottom portion, the base portion is a rectangular block shape exposed to the dielectric The upper surface of the film, the bottom of the circle is located below the base portion, and is half-spherical, and the bottom of the circle is integral with the base portion. The circuit board structure for high frequency signals according to claim 3, wherein a line circular rate of the line patterns is 25 to 60%, and the line circular rate is defined as (ba/a)× 100%, a is the height of the base portion, and b is the height of the line pattern. A circuit board structure for high frequency signals, comprising: a dielectric film; and a conductive circuit layer, the conductive circuit layer is embedded in the dielectric film and protrudes from an upper surface of the dielectric film And including a plurality of line patterns and a plurality of connection pads, The circuit pattern and the connection pads are electrically connected. Each of the circuit patterns includes a base portion, a dome portion and a round bottom. The bottom portion of the circle and the base portion are embedded in the dielectric film. a rectangular block shape, the bottom of the circle is located below the base portion and is semi-spherical, and the dome portion is hemispherical, located above the base portion and protruding from the upper surface of the dielectric film, the circle The top and the bottom of the circle are integral with the base portion. The circuit board structure for high frequency signals according to claim 5, wherein a first line circular rate and a second line circular rate of the circuit patterns are 25 to 60%, the first The line circularity rate is defined as (ca/a) × 100%, a is the height of the base portion, and c is the sum of the heights of the dome portion and the base portion, and the second line circular rate is defined as (da /a) × 100%, where a is the height of the base portion, and d is the sum of the height of the bottom of the circle and the base portion. The circuit board structure for high frequency signals according to claim 5, wherein each of the connection pads comprises an upper connection pad and a lower connection pad, the upper connection pad protruding from the upper surface of the dielectric film. And the lower connecting portion is embedded in the dielectric film.