KR100744082B1 - Multi layers printed circuit board and the method for producing the same - Google Patents

Abstract

Multi-layer printed circuit board according to an embodiment of the present invention is a substrate, a ground wiring formed on the substrate, an insulating layer formed on the ground wiring, a circuit wiring formed on the insulating layer, formed of a metallic material, and circuit wiring And a circuit wiring protection layer formed on the upper portion. Ground wires are formed on the upper surface of the substrate so as to cross each other in the first direction and the second direction, and the width thereof is formed to be 9 mil to 60 mil.

According to the multilayered printed circuit board of the present invention, various impedance matching shapes are included in the ground wiring without adjusting the width of the circuit wiring, thereby efficiently performing impedance matching.

Printed Circuit Board, Impedance Matching, Ground Wire, Lattice Shape, Diamond Shape

Description

Multilayer printed circuit board and its manufacturing method {MULTI LAYERS PRINTED CIRCUIT BOARD AND THE METHOD FOR PRODUCING THE SAME}

1 is a perspective view of a conventional multilayer printed circuit board,

2 is a cross-sectional view of a multilayer printed circuit board according to an exemplary embodiment of the present disclosure.

3 is a cross-sectional view of a multilayer printed circuit board according to an embodiment of the present invention;

4 is a plan view of a ground wiring in the multilayered printed circuit board of FIGS. 2 and 3;

5 is a graph showing an increase in impedance according to a width of a multilayer printed circuit board grounding wiring and a width of a circuit wiring according to an embodiment of the present invention;

6A and 6B are micrographs of an experimental sample for measuring impedance changes when the ground wiring width and the circuit wiring width were simultaneously changed.

7 is a graph showing an increase in impedance according to the width of a printed circuit board grounding wiring according to an embodiment of the present invention.

8a and 8b are lattice-shaped micrographs with a width of 10 mils to 60 mils of the ground wiring;

9 is a cross-sectional view of a rigid and flexible multilayer printed circuit board according to an embodiment of the present invention.

10A is a plan view of a right angle grounding wiring according to an embodiment of the present invention;

FIG. 10B is a plan view of right and diagonal ground wires having a pitch width of 12 mil and 20 mil according to an embodiment of the present invention; FIG.

11 is a plan view showing a diamond shape formed on the ground wiring according to the embodiment of the present invention;

12 is a plan view illustrating a diamond shape having an empty inside formed in a ground wiring according to an embodiment of the present invention;

FIG. 13 is a view showing a wiring width and a space width of FIG. 12;

14 is a perspective view of a diamond-shaped grounding wiring having a dual structure according to an embodiment of the present invention;

15 is a perspective view of a diamond-shaped grounding wire having a three-dimensional structure according to an embodiment of the present invention;

16 is a perspective view of a shape having a beam structure according to an embodiment of the present invention;

17A illustrates a cross-sectional view of a substrate and a copper foil layer laminated on the substrate, according to an embodiment of the present invention.

FIG. 17B shows a photoresist laminated on the upper surface of the copper foil layer, and FIG. 17C shows a photomask stacked on the upper surface of the photoresist.

Fig. 17D shows the exposure on the upper surface of the photomask,

Fig. 17E shows an etching of a portion except the ground circuit after the exposure;

Fig. 17F shows a protective layer laminated on the upper surface of the ground circuit.

Fig. 17G shows a protective layer laminated on the upper surface of the ground circuit and an insulating layer stacked thereon,

Fig. 17H shows a laminated copper foil layer and photoresist on the upper surface of the insulating layer,

Fig. 17I shows a photomask laminated on the photoresist top surface,

FIG. 17J shows an exposure and an etching except for the ground circuit; FIG.

Fig. 17K shows a protective layer laminated on the ground circuit.

Description of Drawings

10, 100, 100´ (for ground wiring) Substrate 110: Copper foil layer

115, 115´: photoresist 120, 120´: photomask

130, 130´: Grounding wiring 140: (hard circuit board) Grounding wiring

150: (flexible circuit board) ground wiring 160, 160´: (ground wiring) protective layer

20, 200, 200a, 200b, 200c, 200d, 200e: insulation layer

210: (hard circuit board) first insulating layer

220: (hard circuit board) second insulating layer

220´: (hard circuit board) third insulating layer

210 ': (hard circuit board) fourth insulating layer 300: copper foil layer

30,310, 310a, 310b, 310c, 310d, 310e, 320, 330, 340: circuit wiring

40,400, 400a, 400b, 400c, 400d, 400e: (circuit wiring) protective layer

420: (circuit wiring for hard circuit board) protective layer

430: (circuit wiring for flexible circuit board) protective layer

500: polyimide layer

A, A´: rigid circuit board B: flexible circuit board

W _S1 , W _S2 : Ground wiring space width (for impedance matching)

W _L , W _L1 , W _L2 : Ground Wire Width (for impedance matching)

T1: thickness of the diamond-like first layer shape having a three-dimensional structure

T2: thickness of the diamond-like second layer shape having a three-dimensional structure

The present invention relates to a multilayer printed circuit board and a method of manufacturing the same. In particular, it relates to a multilayer printed circuit board comprising an improved grounding wiring and a method of manufacturing the same.

Figure 1 shows a perspective view of a conventional multilayer printed circuit board.

In general, a multi-layer printed circuit board (multi-layer PCB) is composed of a substrate 10, an insulating layer 20, a circuit wiring 30, and a protective layer 40.

 Recently, with the development of computer and communication technology, the speed of signal transmission in electronic devices has become important. Accordingly, it is important to match impedances between components and wiring in printed circuit boards or between printed circuit boards and external components.

In general, impedance matching is performed to adjust the width of the pattern form (hereinafter, referred to as a shape) of the circuit wiring 30, the thickness of the insulating layer 20, the dielectric constant Er, the thickness of the circuit wiring 30, and the like. A method of matching is known.

Currently, multilayer printed circuit boards are widely used for high frequency signal processing.

In the manufacture of multilayer printed circuit boards for high frequency signal processing, problems such as propagation delay, transmission line reflection, signal loss, interconnection and impedance matching due to high connection density are problematic. In addition, the impedance matching is more difficult as the layer of the printed circuit board is multi-layer (multi-layer), the finer the circuit wiring 30 is advanced. For example, in the multilayer printed circuit board, it is difficult to realize the width of the circuit wiring 30 to less than 50 μm (2 mil). In addition, considering the complexity of the circuit to increase the width of the circuit wiring 30, the limit is clear. Therefore, there is a limit to matching the impedance by adjusting the width of the circuit wiring 30 in this way.

Therefore, there is a need for a new impedance matching method capable of matching impedance without adjusting the width of the circuit wiring 30.

An object of the present invention is to provide a multi-layer printed circuit board that can match the impedance without adjusting the circuit wiring width by using the improved ground wiring.

In order to achieve the above object, a multilayer printed circuit board according to an aspect of the present invention is formed of a substrate, a ground wiring formed on the substrate, an insulation layer formed on the ground wiring, an insulation layer formed on the upper surface, and formed of a metal material. Circuit wiring, and a circuit wiring protective layer formed on the circuit wiring. Ground wires are formed on the upper surface of the substrate so as to cross each other in the first direction and the second direction, and the width thereof is formed to be 9 mil to 60 mil.

According to another aspect of the present invention, a multilayer printed circuit board includes a substrate, a ground wiring formed on the substrate, an insulating layer formed on the ground wiring, a circuit wiring formed on the insulating layer, and formed of a metal material, and circuit wiring. And a circuit wiring protection layer formed on the upper portion. The ground wire is formed by continuously arranging one or more predetermined shapes having a width of 9 mils to 60 mils in the first direction, the second direction, and the third direction.

A composite multilayer printed circuit board according to another aspect of the present invention includes a multilayer printed circuit board according to a feature of the present invention, and a flexible substrate connecting between the multilayer printed circuit boards. The flexible substrate includes a polyimide layer, a ground wiring formed on and under the polyimide layer, and a protective layer formed on the ground wiring.

According to another aspect of the present invention, a multi-layer printed circuit board is formed to form a metal layer on an upper surface of the substrate, and to etch the metal layer to cross each other in a first direction and a second direction, the width of which is 9 mil to Forming a ground wiring to be 60 mil, forming an insulating layer on the circuit wiring, forming a circuit wiring with a metal material on the insulating layer, and forming a circuit wiring protection layer on the circuit wiring It includes.

According to another aspect of the present invention, there is provided a method of manufacturing a multilayer printed circuit board, the substrate being formed to cross each other in a first direction and a second direction on an upper surface of the substrate, and a width of 9 mil to 60 mil in width, the ground A first insulating layer formed on the wiring, a first circuit wiring formed on the first insulating layer, a second insulating layer formed on the first circuit wiring, and a second insulating layer formed on the first circuit wiring And a second circuit wiring formed in the metal material.

According to another aspect of the present invention, there is provided a method of manufacturing a multilayer printed circuit board, wherein the third insulating layer is formed under the ground wiring, the third circuit wiring is formed under the second insulating layer, and is formed of a metal material. A fourth insulating layer formed under the third circuit wiring, a fourth circuit wiring formed under the fourth insulating layer, and formed of a metal material, a fifth insulating layer formed under the fourth circuit wiring, and the fifth insulation And a fifth circuit wiring formed under the layer and formed of a metallic material.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In the present invention, the multilayer printed circuit board includes a rigid printed circuit board (Rigid PCB), a flexible printed circuit board (Flexible PCB or FPC), and a rigid-flex printed circuit board (Rigid-Flex PCB). The multilayer printed circuit board according to an embodiment of the present invention may be each type of printed circuit board. In addition, the above-described different types of printed circuit boards may be combined to form a multilayer printed circuit board of the present invention.

Hereinafter, a printed circuit board according to an exemplary embodiment of the present invention will be described with reference to FIG. 2.

The printed circuit board includes a substrate 100, a ground wiring 130, a ground wiring protection layer 160, an insulating layer 200, a circuit wiring 310, and a circuit wiring protection layer 400.

Here, the substrate 100 is made of an insulator or the like, and serves as an insulation and heat sink (or heat sink) in the printed circuit board.

The ground wiring 130 is formed on the upper surface of the substrate 100. The ground wiring 130 is preferably made of a metal such as copper (Cu). The ground wiring 130 enables the multilayer printed circuit board of the present invention to be impedance matched.

The ground wiring protection layer 160 protects and insulates the ground wiring 130 and is formed on an upper surface of the ground wiring 130. In addition, an epoxy, a polyimide film, or the like is used as the material of the ground wiring protection layer 160.

The insulating layer 200 is positioned between the circuit wiring 310 and the ground wiring 130. In addition, the insulating layer 200 insulates and bonds the circuit wiring 310 and the ground wiring 130. The material of the insulating layer 200 is an epoxy resin, glass fiber, or the like.

The circuit wiring 310 is formed in a predetermined shape according to the circuit design to be formed by the user. As the material of the circuit wiring 310, a metal material such as copper (Cu) or the like is generally used.

The circuit wiring protection layer 400 protects and insulates the circuit wiring 310 formed on the insulating layer 200. An epoxy resin, a photoinitiator, or the like is used as the material of the circuit wiring protection layer 400. It is also possible to use industrial ink.

3 is a multilayer printed circuit board, and the printed circuit board of FIG. In other words, the multilayer printed circuit board of FIG. 3 has an insulating layer on the upper surface of the ground wiring 130 'and the ground wiring protection layer 160' and the ground wiring protection layer 160 'with the substrate 100' as the center. 200a to 200e), a circuit printed circuit board 310a to 310e formed on the insulating layer 200a to 200e, and a circuit printed circuit board protective layer 400a to 400e stacked on the top surface of the circuit wiring 310a to 310e. It is about. The multilayer printed circuit board may be easily matched with impedances in the width and shape of various ground wires described below. In addition, the circuit wirings can be easily changed to the ground wiring, and each circuit wiring is connected to the ground wiring and vias. Here, L03 'represents a ground wiring, and all L01', L02 ', and L04' to L06 'layers except L03' represent circuit wiring. In addition, the layers L01 ', L02' and L04 'to L06' except for L03 'can be easily converted to ground wiring.

Hereinafter, a grid-type ground wiring 130 will be described as an embodiment of the present invention with reference to FIGS. 4 to 8a and b.

4 illustrates a grating-shaped ground line 130 and an insulating layer 200 formed to cross each other in a first direction and a second direction. The grid-shaped ground wires 130 cross each other in the first direction and the second direction in a regular shape on the upper surface of the substrate 100 for the impedance matching.

The impedance of a multilayer printed circuit board varies mainly with the width of the wiring. Thus, the grid-shaped ground wiring width affects the impedance of the multilayer printed circuit board. In other words, impedance matching is possible without changing the width of the circuit wiring by changing the grid wiring width, which is an embodiment of the present invention. Hereinafter, the impedance matching according to an embodiment of the present invention will be described in detail.

5 to 10a and b and Tables 1 to 4 below refer to impedances that vary according to the width of the ground wiring 130 or the width of the circuit wiring 310.

5, 6A, B, and Table 1 measure impedance changes when the ground wiring width is changed to 9 mils to 11 mils and the circuit wiring width is changed to 3 mils to 8 mils.

TABLE 1

(Pitch width = ground wiring width + space width, circuit width: circuit wiring width, impedance unit: Ω)

Table 1 shows the impedance change when the pitch width is changed from 0 mil to 11 mil and the circuit wiring width is changed to 3 mil to 8 mil. The unit 1 mil represents 25 μm. Same as below.

5 is a graph of Table 1, Figure 6a, b is a micrograph of the experimental sample of Table 1. 6A shows an upper side view of the ground wiring 130 and the substrate 100. 6B is a micrograph of a signal wiring part including the circuit wiring 310 and a ground wiring part including the ground wiring 130 when the pitch width of the ground wiring is changed to 9 mils to 11 mils.

Experimental conditions of Table 1, in the double-sided FPC (flexible printed circuit), the width of the ground wiring 130 was fixed to 5mil. In addition, the thickness of the ground wiring 130 and the circuit wiring 310 is 25㎛. And the material of the insulating layer 200 was polyimide, and the thickness was 25 micrometers. In the above experiments, the effect on the ground wiring pitch width is about 10% impedance increase when the pitch width is 9 mil, and 15% when the pitch width is 11 mil, compared with the conventional impedance matching technique using the circuit wiring. It could be confirmed that the increase.

As a result of the experiment of FIG. 5 and Table 1, it can be seen that the wider the circuit wiring width, the smaller the increase in impedance with respect to the ground wiring pitch width change.

In addition, as can be seen from the results of Table 1, it is necessary to adjust the ground wiring pitch to 20 mil or more in order to obtain an impedance value that is approximately doubled. Therefore, in the following Figure 7 and Table 2, the experiment was performed by adjusting the pitch width from 10mil to 60mil.

 TABLE 2

(Pitch width = ground wiring width + space width, impedance unit: Ω, wiring width: ground wiring width)

Table 2 and FIG. 7 show that the circuit width is fixed at 5 mils, and the width (W _L ) 0 mil of the reference grid grounding line 130 is increased and the width is increased from 10 mils to 60 mils. 8A illustrates the ground wiring 130, the insulation layer 200, and the circuit wiring 310 in detail. 8B is a photomicrograph of the lattice shape. In addition, the experimental conditions of Table 2 are the same as the conditions of Table 1.

As a result, the experiment was able to obtain the impedance value corresponding to 1.2 times to 3 times compared to the conventional technology only by adjusting the ground wiring pitch width. That is, when the circuit width to be implemented for the limited insulation layer thickness and the target impedance matching is minute, and it is impossible to cope with the problem of circuit wiring formation in the general printed circuit board manufacturing process, the grounding as shown in Table 1 and Table 2 of the present invention Only by adjusting wiring pitch width

Next, with reference to Table 3 and Figure 9, it looks at the change of the impedance according to the width of the grid ground wiring 130 in the rigid and flexible printed circuit board of an embodiment of the present invention.

TABLE 3

 (Impedance unit: Ω)

Table 3 relates to impedance values of the multi-layer printed circuit board, in particular, the rigid and flexible multi-layer printed circuit board shown in FIG. In Table 3 and FIG. 9, L01 to L06 indicate circuit wiring and ground wiring of the hard circuit board, respectively. That is, L01, L03, L04, and L06 are circuit wiring layers, and L02 and L05 are ground wiring layers. Here, impedance was measured only on the rigid circuit board, not on the flexible circuit board. In addition, the experimental conditions of Table 3 are the same as those of Table 2, except that the multilayer rigid and flexible circuit board.

9, a description will be given of a rigid and flexible multilayer printed circuit board as an embodiment of the present invention.

FIG. 9 discloses such a rigid and flexible multilayered printed circuit board composed of one flexible PCB B between two rigid PCBs A and A ', It is not limited. That is, a plurality of rigid and flexible multilayer printed circuit boards can be formed.

The rigid multilayer circuit boards A and A 'may include ground wirings 140 and 140', a first insulating layer 210, a second insulating layer 220, a third insulating layer 220 'and a fourth insulating layer 210'. ), Circuit wirings 320 and 320 ', and protective layers 420 and 420', a polyimide layer 500, a circuit wiring 330 attached to the polyimide layer 500, and the like.

And a ground wiring 150, a circuit wiring 340, a protective layer 430, and a polyimide layer 500 of the flexible multilayer circuit board B.

The ground wirings 140 and 140 'of the rigid multilayer circuit boards A and A', the insulating layers 210, 220, 210 'and 220', the circuit wiring 320 and 320 'and the protective layers 420 and 420', and the flexible multilayer circuit board The ground wiring 150, the circuit wiring 340, and the protection layer 430 of (B) have the same material and role as the components of the circuit board described with reference to FIG. 2. Therefore, the polyimide layer 500 and the like which are characteristic portions of the rigid multilayer circuit boards A and A 'and the flexible multilayer circuit board B will be described below.

The circuit wiring 330 and the polyimide layer 500 may be replaced with a flexible copper clad laminate (FCCL). Here, the polyimide layer 500 serves as a polymer resin to allow the flexible copper clad laminate to have a bending characteristic.

In addition, since the polyimide layer 500 has a bending characteristic, the rigid multilayer circuit boards A and A 'may be bent around the flexible multilayer circuit board B. FIG. In addition, the protective layer 600 of the flexible multilayer circuit board B serves to protect and insulate the ground layer 150 and the circuit wiring 340 of the flexible multilayer circuit board, and a Coberlay photomask ), Etc. Here, the Coberlay photomask is made of a polyimide having a bending property and an adhesive having an adhesive property as a material.

The flexible circuit board B is manufactured in a partially welded form due to workability problems of the printed circuit board. The partial contact form covers a portion of the inner layer portion of each of the rigid circuit boards A and A '.

The rigid and flexible circuit boards form a shape for impedance matching on the ground wires 140 and 150 of the substrate 100.

TABLE 4

(Impedance unit: Ω, outer layer: L01´, L06´ layer, inner layer: L03´, L04´ layer)

Table 4 and FIGS. 10A and B are detailed diagrams of impedance data and experiments on how impedance changes in the multilayered printed circuit board of FIG. 3. 10A shows that the circuit wiring 310 is formed and the ground wiring 130 is formed at right angles. FIG. 10B shows the pitch widths of the ground wiring 130 being 12 mils and 20 mils, and formed at right angles and diagonals. And, # 1 to # 10 represent positions where impedance is measured. In addition, the L01 'and L06' layers represent the circuit wiring layers of the uppermost layer and the lower layer of the multilayer printed circuit board, and the L03 'and L04' layers represent the circuit wiring layers of the inner layer. In this case, Table 4 measures the impedances of the L01 ', L06' layers and the L03 ', L04' layers. In this case, the L02 'and L05' layers are circuit wiring layers, and impedance measurements similar to those of the layers on which the impedance is measured are omitted in Table 4.

In addition, even if the layers L01 'to L06' are replaced with ground wires, it can be easily predicted that results similar to those of Table 4 will be obtained due to the characteristics of impedance.

Table 4 is an average of three substrates tested at right angle outer layer, right angle inner layer, diagonal outer layer, and diagonal outer layer when the width is 1m and 1m and the pitch width is 12mil and 20mil, respectively. The right outer layer is a ground wiring 130 formed on the outer layer of the multilayer printed circuit board at a right angle to the substrate, the right inner layer is a ground wiring 130 formed on the inner layer of the multilayer printed circuit board at a right angle to the substrate, the diagonal In the outer layer, the ground wiring 130 is formed diagonally with respect to the substrate on the outer layer of the multilayer printed circuit board, and in the diagonal inner layer, the ground wiring 130 is formed diagonally with respect to the substrate in the inner layer of the multilayer printed circuit board. That is, each of the multilayer printed circuit boards has a circuit wiring and a ground wiring 130 formed diagonally with the ground wiring 130 formed at right angles on the circuit wiring 310. Therefore, the impedance change according to the shape of the ground wire 130 having various shapes can be predicted through the ground wire 130 formed at right angles and diagonal lines. Among the measured impedances in the experiment, the 20 mil right-angle outer layer showed a difference of 13.56 between the maximum value and the minimum value of the impedance. Therefore, in this case, the impedance can be easily matched only if the mass producer has a difference between the maximum value and the minimum value desired by the user within the actual manufacturing process within a specification of ± 5Ω.

Overall, in the double-sided FPC of Tables 1 and 2, the rigid and flexible circuit boards of Table 3, and the multilayer printed circuit board of Table 4, the pitch width effect of the ground wiring 130 is compared to the target value. If the pitch of the ground wire is adjusted from 9 to 60 mils, it can be implemented to ± 5Ω specifications.

Therefore, when Tables 1 to 4 are analyzed, the ratio of the ground wiring 130 to the substrates having a width of 1 m and a width of 1 m, respectively, is 12.8 to 60 percent for the flexible circuit boards A and A ', and the flexible circuit In the case of the substrate B, it was found that the case was 0.8 to 60 percent. That is, in the case of the rigid circuit boards A and A ′ in Table 3 or Table 4, when the space width of the impedance matching shape is 4 mils (pitch width 9 mils), the ratio of the total area is about 60 percent, and the multilayer When the space width of the impedance matching shape of the printed circuit board is 13 mils (pitch width 18 mils), the ratio of the total width is 12.8 percent. In addition, in the flexible circuit board B in Tables 1 to 3, when the space width of the impedance matching shape is 4 mils (pitch width 9 mils), the ratio occupies about 60 percent of the total area, and the multilayer printed circuit board For a space width of 55 mils (pitch width 60 mils) of the impedance-matching shape, the proportion of the total area is 0.8 percent.

Therefore, in the rigid or flexible circuit board, the sum of the widths of the widths W _L of the shape is not preferable because the impedance deviation becomes large when the ratio of the total width of the ground wiring 130 is 0.8 percent or less, and is 60 percent. In this case, it is not preferable because the mass producer exceeds the desired impedance specification.

Hereinafter, referring to FIGS. 11 to 16, a simple shape and a complex shape of the ground line 130 will be described as another impedance matching method according to an embodiment of the present invention.

11 illustrates a simple shape of the diamond ground wire 130 according to an embodiment of the present invention. The ground wire 130 of FIG. 11 shows a diamond-shaped ground wire 130 connected only to an edge part, unlike the shape of the ground wire 130 of FIG. 4. Then, the impedance matching experiment was performed with the ground wiring 130 of FIG. Here, when the ground wiring width (W _L1 , W _L2 ) and the space width (W _S1 , W _S2 ) is adjusted to match the ratio of the ground wiring 130 to 0.8 to 60 percent of the overall width, the diamond of Figure 11 In the multilayer printed circuit board to which the ground wiring is applied, it is confirmed that the difference between the maximum value and the minimum value, which is the impedance matching specification, is within ± 5Ω.

As another embodiment of the present invention, a double diamond shape which is a composite shape is shown in FIG. FIG. 13 is a diagram showing a ground wiring width W _L and a space width W _S that influence impedance matching in the diamond shape of FIG. 12. The double diamond shape includes an internal shape within an external shape. For this reason, the double diamond shape is electrically separated from the outer diamond shape and the inner diamond shape. In a general experiment, even in the electrically separated situation, the ground wiring 130 mutually influences the circuit passing thereon in a high frequency environment. That is, the present invention is applied to a specification in which the degree of integration of components (memory semiconductor, IC chip, etc.) mounted on a printed circuit board is high and the signal processing speed is high. Therefore, the impedance changes according to the diamond width of the line width (W _L ), the space width (W _S ) and the width (not shown) in which the respective outer and inner shapes are separated.

14-15 illustrate one embodiment of another composite shape in accordance with the present invention. The composite shape is a three-dimensional structure of another diamond shape using the diamond-shaped interior shown in FIG. Also, for impedance matching, the user may change the lower layer thickness T1 and the upper layer thickness T2 of the double layer diamond of FIG. 15. It is natural that impedance matching is easy due to this change in thickness.

Figure 16 illustrates an irregular shape as another embodiment of the present invention. The shape shown in this figure is a beam shape. That is, the beam shape is an irregular shape of the shape of the ground wiring 130. Therefore, the impedance varies depending on the width W _L , the space width W _S1 , W _S2 , and the like of each beam shape. 14 to 16 illustrate a ground wiring shape formed to continuously cross each other in a first direction, a second direction, and a third direction. Here, the ground wiring shape in the third direction may have a predetermined direction and shape.

In addition to this shape, various regular shape collections may be irregularly arranged to be used for the impedance matching.

In addition, it is preferable that the corner shape of the regular shape and the irregular shape is curved. This is because the corner portions of the regular shape and the irregular shape may have a bad influence on the impedance matching due to severe leakage of electromagnetic waves in an ultrahigh frequency environment when the corner portions of the regular shape and the irregular shape are not curved.

Hereinafter, a method of manufacturing a multilayer printed circuit board according to an exemplary embodiment of the present invention will be described with reference to FIGS. 17A to 17J. The manufacturing method of the multilayer printed circuit board is largely divided into a method of forming the ground wiring 130 and a method of forming the circuit wiring 310.

First, a method of forming the ground wiring 130 will be described below.

FIG. 17A illustrates a cross-sectional view of a substrate 100 and a copper foil layer 110 stacked on an upper surface of the substrate 100 according to an embodiment of the present invention. The copper foil layer 110 is a laminated single layer to make a single diamond shape as shown in FIG.

FIG. 17B shows the photoresist 115 stacked on the upper surface of the copper foil layer 110. The photoresist 115 is mainly used a photosensitive polymer.

FIG. 17C illustrates a photomask 120 stacked on the top surface of the photoresist 115. In this case, a photomask 120 having a variety of shapes of the ground wiring 130 may be used.

 FIG. 17D shows the exposure on the upper surface of the photomask 120. At this time, only a portion of the bottom surface of the ground wiring 130 is exposed to light.

FIG. 17E shows etching of portions (photoresist, etc.) except for the ground wiring 130 after the exposure. Only the portion corresponding to the circuit portion of the photomask 120 remains by the etching process, and the etching process may be repeated several times for precise etching.

FIG. 17F illustrates a protective layer 160 stacked on an upper surface of the ground line 130 on the upper surface of the substrate 100.

After the ground wiring 130 is formed by the above methods, the circuit wiring 310 is formed. Therefore, the manufacturing method of the circuit wiring 310 is demonstrated below.

As shown in FIG. 17G, the insulating layer 200 is stacked on the protective layer 160. 17H, the copper foil layer 110 is laminated on the upper surface of the insulating layer 200. 17I, the photoresist 115 and the photomask 120 are stacked on the upper surface of the copper foil layer 110. 17J, portions except for the circuit wiring 310 are exposed and etched. As shown in FIG. 17K, the protective layer 400 is stacked on the circuit wiring 310.

The exposure and etching techniques used in the method of forming the ground wiring 130 and the circuit wiring 310 used to manufacture the multilayer printed circuit board of the present invention may employ a technique generally used. Therefore, detailed description of this general manufacturing method is omitted.

Due to the impedance matching and method of the present invention configured as described above has the following effects.

First, the impedance matching is included in the ground wiring of the multilayer printed circuit board, so that impedance matching is easily performed without adjusting the width of the circuit wiring.

Second, by including an impedance matching shape in the ground wiring of the multilayer printed circuit board, impedance matching is achieved without defects and high productivity regardless of the circuit width of the circuit wiring.

Third, it is possible to match the fine impedance by repeating the shape of the ground wiring.

Fourth, to maximize the ease of impedance matching by including another shape in the constant shape or complex shape of the grounding wiring.

Fifth, the edge portion of the shape of the impedance matching circuit of the ground line is curved to allow more efficient impedance matching.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications belong to the appended claims.

Claims (15)

Board; A ground wire formed on the upper surface of the substrate so as to cross each other in a first direction and a second direction and having a pitch width of 9 mil to 60 mil; An insulating layer formed on the ground wiring; A circuit wiring formed on the insulating layer and formed of a metal material; And A circuit wiring protection layer formed on the circuit wiring; Multilayer printed circuit board comprising a. The method of claim 1, And the width of the ground wire corresponds to 0.8% to 60% of the width of the substrate. Board; A ground wire having one or more predetermined shapes having a pitch width of 9 mils to 60 mils continuously arranged in a first direction, a second direction, and a third direction; An insulating layer formed on the ground wiring; A circuit wiring formed on the insulating layer and formed of a metal material; And A circuit wiring protection layer formed on the circuit wiring; Multilayer printed circuit board comprising a. The method of claim 3, And the width of the ground wiring corresponds to 0.8% to 60% of the width of the substrate. 5 or more multilayer printed circuit board of any one of claims 1 to 4, Polyimide layer; A ground wire formed on or below the polyimide layer; and A protective layer formed on the ground wiring; A flexible substrate including a connection between the two or more multilayer printed circuit boards; Composite multilayer printed circuit board further comprising. The method of claim 5, And said ground wiring has a pitch width of 9 mils to 60 mils. The method of claim 5, And the width of the ground wiring corresponds to 0.8% to 60% of the width of the substrate. Board; A ground wire formed on the upper surface of the substrate so as to cross each other in a first direction and a second direction and having a pitch width of 9 mil to 60 mil; A first insulating layer formed on the ground wiring; A first circuit wire formed on the first insulating layer and formed of a metal material; A second insulating layer formed on the first circuit wiring; and A second circuit wire formed on the second insulating layer and formed of a metal material; Multilayer printed circuit board comprising a. The method of claim 8, A third insulating layer formed under the ground wiring; A third circuit wire formed under the fourth insulating layer and formed of a metal material; A fourth insulating layer formed under the fourth circuit wiring line; A fourth circuit wire formed under the fifth insulating layer and formed of a metal material; A fifth insulating layer formed under the fifth circuit wiring line; And A fifth circuit wire formed under the sixth insulating layer and formed of a metal material; The multilayer printed circuit board further comprising. The method of claim 8, And said ground wiring has a pitch width of 9 mils to 60 mils. The method of claim 8, And the width of the ground wiring corresponds to 0.8% to 60% of the width of the substrate. In the manufacturing method of a multilayer printed circuit board, Forming a metal layer on the upper surface of the substrate; Etching the metal layer so as to cross each other in a first direction and a second direction, and forming a ground line such that a pitch width thereof is 9 mil to 60 mil; Forming an insulating layer on the circuit wiring; Forming circuit wiring on the insulating layer using a metal material; And Forming a circuit wiring protection layer on the circuit wiring; Method of manufacturing a multilayer printed circuit board comprising a. The method of claim 12, And forming a width of the ground line to correspond to 0.8% to 60% of the width of the substrate. In the manufacturing method of a multilayer printed circuit board, Forming a metal layer on the upper surface of the substrate; Etching the metal layer to form one or more predetermined shapes continuously arranged in a first direction and a second direction, the ground wires having a pitch width of 9 mils to 60 mils; Forming an insulating layer on the circuit wiring; Forming circuit wiring on the insulating layer using a metal material; And Forming a circuit wiring protection layer on the circuit wiring; Method of manufacturing a multilayer printed circuit board comprising a. The method of claim 14, And the width of the ground wiring is formed to correspond to 0.8% to 60% of the width of the substrate.

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