TW201442130A - 可增進積體電路基板植球良率之方法 - Google Patents

可增進積體電路基板植球良率之方法 Download PDF

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Publication number
TW201442130A
TW201442130A TW102115240A TW102115240A TW201442130A TW 201442130 A TW201442130 A TW 201442130A TW 102115240 A TW102115240 A TW 102115240A TW 102115240 A TW102115240 A TW 102115240A TW 201442130 A TW201442130 A TW 201442130A
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Taiwan
Prior art keywords
ball
fixture
suction
solder
air
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TW102115240A
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English (en)
Chinese (zh)
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TWI501328B (https=
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Zhao-Shang Chen
Yu-Kai Lin
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Zen Voce Corp
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW102115240A 2013-04-29 2013-04-29 可增進積體電路基板植球良率之方法 TW201442130A (zh)

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TW102115240A TW201442130A (zh) 2013-04-29 2013-04-29 可增進積體電路基板植球良率之方法

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TW102115240A TW201442130A (zh) 2013-04-29 2013-04-29 可增進積體電路基板植球良率之方法

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TW201442130A true TW201442130A (zh) 2014-11-01
TWI501328B TWI501328B (https=) 2015-09-21

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110466988A (zh) * 2019-09-18 2019-11-19 苏州台皇鑫精密机械有限公司 一种自动接料下料装置
CN111162024A (zh) * 2018-11-07 2020-05-15 普罗科技有限公司 用于安装导电球的设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2380964B (en) * 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
GB0221893D0 (en) * 2002-09-20 2002-10-30 Avecia Ltd Process

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111162024A (zh) * 2018-11-07 2020-05-15 普罗科技有限公司 用于安装导电球的设备
TWI702706B (zh) * 2018-11-07 2020-08-21 南韓商普羅科技有限公司 用於安裝導電球的設備
CN111162024B (zh) * 2018-11-07 2023-02-17 普罗科技有限公司 用于安装导电球的设备
CN110466988A (zh) * 2019-09-18 2019-11-19 苏州台皇鑫精密机械有限公司 一种自动接料下料装置

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TWI501328B (https=) 2015-09-21

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