TWI501328B - - Google Patents

Info

Publication number
TWI501328B
TWI501328B TW102115240A TW102115240A TWI501328B TW I501328 B TWI501328 B TW I501328B TW 102115240 A TW102115240 A TW 102115240A TW 102115240 A TW102115240 A TW 102115240A TW I501328 B TWI501328 B TW I501328B
Authority
TW
Taiwan
Application number
TW102115240A
Other languages
Chinese (zh)
Other versions
TW201442130A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW102115240A priority Critical patent/TW201442130A/zh
Publication of TW201442130A publication Critical patent/TW201442130A/zh
Application granted granted Critical
Publication of TWI501328B publication Critical patent/TWI501328B/zh

Links

TW102115240A 2013-04-29 2013-04-29 可增進積體電路基板植球良率之方法 TW201442130A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102115240A TW201442130A (zh) 2013-04-29 2013-04-29 可增進積體電路基板植球良率之方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102115240A TW201442130A (zh) 2013-04-29 2013-04-29 可增進積體電路基板植球良率之方法

Publications (2)

Publication Number Publication Date
TW201442130A TW201442130A (zh) 2014-11-01
TWI501328B true TWI501328B (https=) 2015-09-21

Family

ID=52422992

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102115240A TW201442130A (zh) 2013-04-29 2013-04-29 可增進積體電路基板植球良率之方法

Country Status (1)

Country Link
TW (1) TW201442130A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102078935B1 (ko) * 2018-11-07 2020-02-19 주식회사 프로텍 도전성 볼 탑재 장치
CN110466988A (zh) * 2019-09-18 2019-11-19 苏州台皇鑫精密机械有限公司 一种自动接料下料装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6592020B1 (en) * 2001-09-04 2003-07-15 Henkel Loctite Adhesives Limited Lead-free solder paste
WO2004028225A1 (en) * 2002-09-20 2004-04-01 Avecia Limited Printing process and solder mask ink composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6592020B1 (en) * 2001-09-04 2003-07-15 Henkel Loctite Adhesives Limited Lead-free solder paste
WO2004028225A1 (en) * 2002-09-20 2004-04-01 Avecia Limited Printing process and solder mask ink composition

Also Published As

Publication number Publication date
TW201442130A (zh) 2014-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees