TW201441018A - Production system and production method for optical display device - Google Patents

Abstract

An optical display device production system is provided with a sticking device which, for a plurality of optical display products conveyed on a line, obtains an optical member by unrolling, from an original roll, a band-shaped optical member sheet having a width corresponding to a display region of the optical display product and cutting the optical member sheet to a length corresponding to the display region, and sticks the optical member to the optical display product. The sticking device is provided with: a sticking head which sticks the optical member to an arc-shaped holding surface to hold the optical member; a carrying device which relatively moves the sticking head and the optical display product while the optical member is stuck to the optical display product; and a driving device which drives the sticking head pressing the optical member onto the optical display product such that the sticking head tilts along the curve of the holding surface.

Description

Production system and production method of optical display device

The present invention relates to a production system and a production method of an optical display device such as a liquid crystal display. The present invention claims priority based on Japanese Patent Application No. 2013-05897, filed on Jan. 21, 2013, and the Japanese Patent Application No. 2013-104149, filed on Jan. content.

Conventionally, in a production system of an optical display device such as a liquid crystal display, an optical component such as a polarizing plate attached to a liquid crystal panel (optical display member) is cut out from a long film to form a layer conforming to the size of a display region of the liquid crystal panel. After being packaged and transported to another production line, it is attached to a liquid crystal panel (for example, refer to Patent Document 1).

Patent Document 1: Japanese Laid-Open Patent Publication No. 2003-255132.

However, in the above-described conventional structure, in consideration of variations in the dimensions of the liquid crystal panel and the ply, and the lamination deviation (positional deviation) of the ply of the liquid crystal panel, a ply which is slightly larger than the display region is cut. Therefore, an unnecessary area (frame portion) is formed in the peripheral portion of the display region, which may hinder the miniaturization of the device.

In view of the above, the present invention provides a production system and a production method of an optical display device which can reduce the frame portion around the display area and achieve the purpose of expanding the display area and miniaturizing the device.

According to a first aspect of the present invention, a production system for an optical display device is provided in a production system of an optical display device formed by bonding an optical component to an optical display component, and is provided with: a laminating device for ejecting a plurality of optical display members transported along a production line from a roll cylinder to a strip-shaped optical component layer corresponding to a width of a display region of the optical display member, and the optical length of the display region The component layer is cut to serve as the optical component, and then the optical component is attached to the optical display component; wherein the bonding device has a bonding head that is held against the arc-shaped holding surface The optical component is attached to the optical display component; the moving device is configured to move the bonding head and the optical display component relative to each other when the optical component is attached; and the driving device is adapted to be attached to the optical component The bonding head that presses the optical component to the optical display member is tilted and moved along the bending of the holding surface.

In the above first aspect, the control device further controls the mobile device and the driving device; wherein the control device controls the driving device and the mobile device to move along the tilt when the bonding is performed. The holding surface of the bonding head generates a moment to the advancing direction of the optical component of the optical display member. Moreover, in the first aspect described above, the driving device performs calibration of the specific reference position with respect to the relative position of the optical component of the bonding head.

Further, in the first aspect, the bonding apparatus further includes: a winding portion that winds the optical component layer together with the separation layer sheet; the cutting portion retains the separation The optical component layer is cut into layers as the optical component, and the peeling portion is peeled off from the separation layer. In this case, the moving device moves the bonding head between a position where the optical component is peeled off from the separation layer and a position where the optical component is bonded to the optical display component. Then, the peeling portion peels the bonding surface of the optical component from the optical display member downward from the separation layer; and the moving device causes the bonding head to face the opposite side of the bonding surface The side surface is held against the holding surface, and the bonding surface is directed downward, and is moved between the peeling position and the bonding position.

Further, according to a second aspect of the present invention, a production system for an optical display device is provided, which is provided in a production system for bonding an optical component to an optical display device formed by an optical display member, and is provided with: a bonding device Rolling a strip-shaped optical component layer having a width wider than either one of a long side or a short side of the display area of the optical display member from the roll drum, and having a length longer than the other side of the long side or the short side of the display area The optical component layer is cut into a layer sheet for a longer length, and then the layer sheet is bonded to the optical display member; and the cutting device is disposed from the layer bonded to the optical display member. The remaining portion of the opposite side of the opposite portion of the display area is cut to form an optical component corresponding to the size of the display area; wherein the bonding device has a bonding head that is held against the arc-shaped holding surface Wherein the layer is attached to the optical display member; the moving device is adapted to move the bonding head and the optical display member when the layer is bonded; and the driving device is adapted to fit the layer , The plies have pressed against inclined to the optical display moving engagement member attached to the head along the curved surface of the holder.

Moreover, in the second aspect, the control device further includes a control device for controlling the mobile device and the driving device; wherein the control device controls the driving device and the mobile device when performing the bonding, along the slave The holding surface of the tilting moving contact head generates a moment in the advancing direction of the layer of the optical display member.

Further, in the second aspect, the bonding apparatus further includes: a winding portion that winds the optical component layer together from the roll drum and the separation layer; the cutting portion retains the separation The optical component layer is cut into layers as the layer; and the peeling portion is peeled off from the separation layer.

Further, according to a third aspect of the present invention, there is provided a method of producing an optical display device, which is provided in a method for producing an optical display device formed by bonding an optical component to an optical display component, comprising: a bonding process, a plurality of optical display members transported along the production line, the strip optical assembly layer corresponding to the width of the display region of the optical display member is rolled out from the roll drum, and the optical assembly layer is cut off for the length of the display area As the optical component, the optical component is then attached to the optical display component; wherein the bonding process has the following steps: maintaining the step of holding the optical component against the arc of the conforming head a moving step of allowing the optical component to hold the bonding head of the holding surface and the optical display component to move relative to each other; and a driving step of pressing the optical component against the bonding head of the optical display component It moves obliquely along the curvature of the holding surface.

Moreover, in the above third aspect, in the driving step and the moving step, the optical component is pressed against the optical display component while the bonding head and the optical display component are relatively opposed. The movement is such that a moment is generated along the advancing direction of the optical component from the holding surface to the optical display member at the time of bonding.

Moreover, according to a fourth aspect of the present invention, there is provided a method of producing an optical display device, which is provided in a method for producing an optical display device formed by bonding an optical component to an optical display component, comprising: a bonding process, Rolling a strip-shaped optical component layer having a width wider than either one of a long side or a short side of the display area of the optical display member from the roll drum, and having a length longer than the other side of the long side or the short side of the display area The optical component layer is cut into a layer sheet for a longer length, and then the layer sheet is bonded to the optical display member; and the cutting process is performed from the layer bonded to the optical display member. The remaining portion of the opposite side of the opposite portion of the display area is cut to form an optical component corresponding to the size of the display area; wherein the bonding process has the following steps: the maintaining step is to hold the layer against the circle An arc-shaped retaining surface; a moving step of causing the bonding head holding the layer to be held on the holding surface and the optical display member to move relative to each other; and a driving step of pressing the layer to the light Display means bonding head moves along the inclined surface of the bent holding.

Moreover, in the fourth aspect, wherein the driving step and the moving step are performed by pressing the layer to the optical display member, and the bonding head and the optical display member are opposite each other. The movement is such that a moment is generated along the advancing direction of the ply from the holding surface to the optical display member at the time of bonding.

Further, according to a fifth aspect of the present invention, there is provided a production system for an optical display device, which is provided in a production system for bonding an optical component to an optical display device formed by an optical display member, and is provided with: a bonding device Rolling a strip-shaped optical component layer having a width wider than either one of a long side or a short side of the display area of the optical display member from the roll drum, and having a length longer than the other side of the long side or the short side of the display area The optical component layer is cut to be a layer sheet for a longer length, and then the layer sheet is attached to the optical display member; and the detecting device detects the optical display member to which the layer sheet is attached and the layer sheet The outer peripheral edge of the bonding surface; and the cutting device is cut from the layer bonded to the optical display member, and the remaining portion disposed outside the corresponding portion of the bonding surface is cut to form a corresponding portion An optical component having a size of a bonding surface; wherein the bonding device has a bonding head for bonding a layer held at an arc-shaped holding surface to the optical display member; and the moving device is attached When the layer is combined, let The bonding head and the optical display member are relatively moved; and the driving device is adapted to press the layer sheet such that the bonding head pressing the layer to the optical display member is inclined along the bending of the holding surface The cutting device cuts the layer along the outer periphery of the bonding surface between the optical display member and the layer detected by the detecting device. In the above configuration, "the bonding surface of the optical display member and the layer sheet" means the surface facing the layer of the optical display member. Specifically, the "outer periphery of the bonding surface" means the surface of the optical display member. The outer periphery of the substrate on the side of the laminate. Moreover, the "corresponding portion of the bonding surface" of the layer means that the display area of the optical display member facing the layer is larger in the layer sheet and smaller than the outer shape of the optical display member (the contour shape in the plan view). The area is an area that avoids functional parts such as an electronic component mounting portion of the optical display unit. Similarly, "corresponding to the size of the bonding surface" means a size larger than the display area of the optical display member and smaller than the outer shape of the optical display member (the outline shape in the plan view).

Moreover, in the fifth aspect, the control device is further configured to control the mobile device and the driving device; wherein the control device controls the driving device and the mobile device when performing the bonding, along the slave The holding surface of the tilting moving contact head generates a moment toward the advancing direction of the layer of the optical display member.

Further, in the fifth aspect, the bonding apparatus further includes: a winding portion that winds the optical component layer together from the winding roller and the separation layer; and the cutting portion retains the separation The optical component layer is cut into layers as the layer; and the peeling portion is peeled off from the separation layer.

Moreover, according to a sixth aspect of the present invention, there is provided a method of producing an optical display device, which is provided in a method for producing an optical display device formed by bonding an optical component to an optical display component, comprising: a bonding process, Rolling a strip-shaped optical component layer having a width wider than either one of a long side or a short side of the display area of the optical display member from the roll drum, and having a length longer than the other side of the long side or the short side of the display area The optical component layer is cut to be a layer sheet for a longer length, and then the layer sheet is attached to the optical display member; the inspection project detects the optical display member to which the layer sheet is bonded and the layer sheet The outer peripheral edge of the bonding surface; and the cutting process, the remaining portion disposed outside the corresponding portion of the bonding surface is cut from the layer bonded to the optical display member to form a size corresponding to the display area The optical component; wherein the bonding process has the following steps: the maintaining step is to hold the layer sheet against the arc-shaped holding surface; and the moving step is to maintain the layer sheet on the holding surface. head The optical display member is relatively moved; and the driving step is such that the bonding head that presses the layer to the optical display member is tilted and moved along the bending of the holding surface; and the cutting engineering is along the detection The outer peripheral edge of the bonding surface between the optical display member and the layer detected by the project is cut to cut the layer.

Moreover, in the sixth aspect, wherein the driving step and the moving step are performed by pressing the layer to the optical display member, and the bonding head and the optical display member are opposite each other. The movement is such that a moment is generated along the advancing direction of the ply from the holding surface to the optical display member at the time of bonding.

According to the present invention, it is possible to suppress the dimensional deviation or the misalignment of the optical component, and to reduce the frame portion around the display region, thereby achieving the purpose of expanding the display region and miniaturizing the device. Moreover, the mobile device and the drive device can be driven independently of each other, whereby the desired torque is applied simultaneously and the optical component or ply is bonded. Therefore, by appropriately adjusting the above-mentioned moment, the amount of deformation generated by the optical component or the laminated sheet after the laminated sheet is suppressed can be suppressed. Moreover, continuous bonding of the optical components can be facilitated, and the production efficiency of the optical display device can be improved. Further, the optical member or the ply can be smoothly held by the oblique movement of the arc-shaped holding surface, and the optical member or the ply can be surely attached to the optical display member by the oblique movement of the same arc-shaped holding surface.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings, and in the present embodiment, a film bonding system which is a part of a production system of an optical display device will be described.

Fig. 1 is a schematic configuration diagram of a film bonding system 1 of the present embodiment. In the film bonding system 1 , for example, a film-shaped optical component such as a polarizing film, a retardation film, or a brightness-increasing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic electro-luminescence (EL) panel. It is therefore part of a production system that produces optical display devices that include the optical display components and optical components. In the film bonding system 1, a liquid crystal panel P is used as the optical display member. In the first drawing, for convenience of illustration, the film bonding system 1 is divided into two layers.

Fig. 2 is a plan view of the liquid crystal panel P seen from the thickness direction of the liquid crystal layer P3. The liquid crystal panel P is provided with a first substrate P1 having a rectangular shape in plan view, a second substrate P2 having a small rectangular shape disposed opposite to the first substrate P1, and a liquid crystal layer P3 enclosing the first substrate P1 and the second substrate. Between P2. The liquid crystal panel P has a rectangular shape along the outer shape of the first substrate P1 in plan view, and a region inside the outer periphery of the liquid crystal layer P3 in plan view is the display region P4.

Fig. 3 is a cross-sectional view taken along line A-A in Fig. 2. The first optical component layer F1, the second optical component layer F2, and the third optical component layer F3 of the elongated strip are appropriately bonded to the front/rear surface of the liquid crystal panel P (refer to FIG. 1 , hereinafter collectively referred to as an optical component The layer FX) is cut out of the first optical component F11, the second optical component F12, and the third optical component F13 (hereinafter, collectively referred to as optical component F1X). In the present embodiment, the first optical component F11 and the third optical component F13 which are polarizing films are bonded to each other on both the backlight side and the display surface side of the liquid crystal panel P, and the backlight side of the liquid crystal panel P is further bonded to each other. The second optical component F12 as a luminance increasing film is overlapped with the first optical component F11.

Fig. 4 is a partial cross-sectional view of the optical component layer FX attached to the liquid crystal panel P. The optical component layer FX has a film-like optical module body F1a, an adhesive layer F2a provided on one side of the optical component body F1a (upper side of FIG. 4), and a layer detachably laminated to the optical layer via the adhesive layer F2a. A separation sheet F3a on the one side of the module body F1a; and a surface protection film F4a laminated on the other side (the lower side of FIG. 4) of the optical unit body F1a. The optical module body F1a has a function of a polarizing plate across the entire area of the display area P4 of the liquid crystal panel P and its peripheral area. In addition, for convenience of illustration, the hatching of each layer in Fig. 4 is omitted.

The optical module main body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the adhesive layer F2a remains on the one surface and is separated from the separation layer F3a. Hereinafter, a portion from which the separation layer sheet F3a is removed from the optical module layer FX is referred to as a bonding layer sheet F5.

The separation layer F3a protects the adhesive layer F2a and the optical module body F1a before being separated from the adhesive layer F2a. The surface protective film F4a is bonded to the liquid crystal panel P together with the optical module body F1a. The surface protective film F4a is disposed on the opposite side of the liquid crystal panel P with respect to the optical module body F1a to protect the optical module body F1a. The surface protective film F4a is separated from the optical module body F1a at a specific time point. Further, the optical component layer FX may be a structure that does not include the surface protective film F4a, and the surface protective film F4a may be a structure that cannot be separated from the optical component body F1a.

The optical module body F1a has a sheet-like polarizing mirror F6, a first film F7 joined by an adhesive or the like on one side of the polarizing mirror F6, and a bonding agent or the like on the other side of the polarizing mirror F6. The second film F8. The first film F7 and the second film F8 protect the protective film such as the polarizer F6.

Further, the optical module body F1a may have a single layer structure composed of one optical layer, or may be a laminated structure in which a plurality of optical layers are laminated to each other. In addition to the polarizer F6, the optical layer may be a retardation film or a luminance increasing film. At least one of the first film F7 and the second film F8 may be subjected to a surface treatment to obtain an anti-glare effect including a hard coat treatment or an anti-glare treatment for protecting the outermost layer of the liquid crystal display unit. The optical module body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separation layer sheet F3a may be bonded to the surface on one side of the optical module body F1a via the adhesive layer F2a.

Fig. 5 is a plan view (top view) of the film bonding system 1. Hereinafter, the film bonding system 1 will be described with reference to Figs. 1 and 5 . In addition, the arrow F in the figure shows the conveyance direction of the liquid crystal panel P. In the following description, the upstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport upstream side, and the downstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport downstream side.

The film bonding system 1 uses the specific position of the main conveying device 5 as the starting point 5a and the ending point 5b of the bonding process. The film bonding system 1 is provided with a first sub-conveying device 6 and a second sub-conveying device 7 extending from the main conveying device 5 in the right-angle direction from the starting point 5a; from the starting point 5a toward the first starting position 6a of the first sub-conveying device 6 a first transfer device 8 that transports the liquid crystal panel P, a cleaning device 9 that is disposed on the first sub-transport device 6, and a first rotary machine tool 11 that is disposed on the downstream side of the panel transport of the first sub-conveying device 6; a first transfer position 6b of the sub-conveying device 6 transports the second transfer device 12 of the liquid crystal panel P toward the first turntable start position 11a of the first rotary machine tool 11; and a first sticker disposed around the first rotary machine tool 11 The device 13 and the second bonding device 15 and the film peeling device 14 are combined.

Further, the film bonding system 1 includes a second rotary machine tool 16 disposed on the downstream side of the panel transfer of the first rotary machine tool 11; and a first rotary table end position 11b from the first rotary machine tool 11 toward the second rotary machine tool a third transfer device 17 for transporting the liquid crystal panel P at the second turntable start position 16a; a third bonding device 18 and an inspection device 19 disposed around the second rotary machine tool 16, and a second rotary machine tool 16 The second transport device 7 on the downstream side of the panel transport; the fourth transport device 21 that transports the liquid crystal panel P from the second turret end position 16b of the second rotary machine tool 16 toward the second home position 7a of the second sub transport device 7 And a fifth conveying device 22 that conveys the liquid crystal panel P from the second end position 7b of the second sub-conveying device 7 toward the end point 5b of the main conveying device 5.

The film laminating system 1 uses a driven main conveying device 5, each sub conveying device (first sub conveying device 6, second sub conveying device 7) and each rotary machine tool (first rotary machine tool 11, second The production line formed by the rotary machine tool 16) transports the liquid crystal panel P, and the liquid crystal panel P is sequentially subjected to a specific process. The liquid crystal panel P is transported on the production line with its front/reverse surfaces horizontal. The liquid crystal panel P is, for example, in the main transport device 5, and conveys the short side of the display region P4 toward the transport direction; each of the sub transport devices (the first sub transport device 6 and the second sub transport device that are perpendicular to the main transport device 5) 7), the long side of the display area P4 is transported in the transport direction; in each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16), the long side of the display area P4 is turned toward each turn. The desktop machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) is transported radially. The symbol 5c in the figure corresponds to the liquid crystal panel P, and displays the rack transported along the main transport device 5.

The layer (corresponding to the optical component F1X) of the bonding layer sheet F5 of a specific length is cut out from the strip-shaped optical component layer FX with respect to the front/rear surface of the liquid crystal panel P. Each part of the film bonding system 1 is integrally controlled by a control device 25 as an electronic control unit.

The first conveying device 8 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction. The first transfer device 8 directly transports the liquid crystal panel P held by the adsorption to the first start position 6a (the left end portion of the fifth drawing) of the first sub-transport device 6 in a horizontal state, at which position The adsorption is released, and the liquid crystal panel P is transferred to the first sub-conveying device 6.

The cleaning device 9 is washed, for example, in a water-washing manner, and the front/rear surface of the liquid crystal panel P is brushed and washed with water, and then the liquid on the front/rear surface of the liquid crystal panel P is removed. Further, the cleaning device 9 may be dry-cleaned to perform static elimination and dust collection on the front/rear surfaces of the liquid crystal panel P. The second transfer device 12 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction. The second transfer device 12 directly transports the liquid crystal panel P held by the adsorption to the first turntable start position 11a of the first rotary machine tool 11 in a horizontal state, and at this position, the adsorption action is released. The liquid crystal panel P is delivered to the first rotary machine tool 11.

The first rotary machine tool 11 has a disk-shaped turntable having a rotation axis in the vertical direction, and the left end portion of Fig. 5 (plan view) serves as the first turntable start position 11a, and is rotationally driven in the clockwise direction. The first rotary machine tool 11 is a first bonding/unloading position 11c at a position (the upper end portion in Fig. 5) that is rotated 90° clockwise from the first turret starting position 11a.

At the first bonding loading/unloading position 11c, the liquid crystal panel P is carried into the first bonding apparatus 13 by a transfer robot not shown. The liquid crystal panel P is bonded to the first optical unit F11 on the backlight side by the first bonding apparatus 13. The liquid crystal panel P to which the first optical unit F11 is bonded is carried from the first bonding apparatus 13 to the first bonding/unloading/receiving position 11c of the first rotary machine tool 11 by a transport robot not shown.

The first rotary machine tool 11 is a film peeling position 11e at a position (the upper right end portion of FIG. 5) that is rotated by 45° in the clockwise direction from the first bonding/unloading/receiving position 11c. At the film peeling position 11e, peeling of the surface protective film F4a of the first optical component F11 is performed by the film peeling device 14. The first rotary table machine 11 is a position (the right end position in the fifth drawing) that is rotated by 45° in the clockwise direction from the film peeling position 11e as the second bonding carry-out/loading position 11d.

At the second bonding carry-out/loading position 11d, the liquid crystal panel P is carried into the second bonding apparatus 15 by a transport robot not shown. The liquid crystal panel P is bonded to the second optical component F12 on the backlight side by the second bonding apparatus 15. The liquid crystal panel P to which the second optical unit F12 is bonded is carried from the second bonding apparatus 15 to the second bonding loading/unloading position 11d of the first rotary machine tool 11 by a transport robot not shown.

The first rotary table machine 11 is a first turntable end position 11b at a position (the lower end portion in the fifth drawing) that is rotated by 90° in the clockwise direction from the second bonding carry-out/loading position 11d. At the first turntable end position 11b, the carry-out operation is performed by the third transfer device 17. The third transport device 17 holds the liquid crystal panel P and is freely transported in the vertical direction and the horizontal direction. The third transfer device 17 transports the liquid crystal panel P held by the adsorption to the second turntable start position 16a of the second rotary machine tool 16, and performs the front/back side of the liquid crystal panel P at the time of the transfer. Inverting, the adsorption is released at the second turntable start position 16a, and the liquid crystal panel P is transferred to the second rotary machine tool 16.

The second rotary machine tool 16 has a disk-shaped turntable having a rotary axis in the vertical direction, and the upper end portion of Fig. 5 (plan view) is used as the second turntable start position 16a, and is rotationally driven in the clockwise direction. The second rotary machine tool 16 is a third bonding carry-out/loading position 16c at a position (the right end portion of the fifth drawing) that is rotated 90° clockwise from the second turret starting position 16a.

At the third bonding carry-out/loading position 16c, the liquid crystal panel P is carried into the third bonding apparatus 18 by a transport robot not shown. The liquid crystal panel P is bonded to the third optical component F13 on the display surface side by the third bonding apparatus 18. The liquid crystal panel P to which the third optical unit F13 is bonded is carried from the third bonding apparatus 18 to the third bonding loading/unloading position 16c of the second rotary machine tool 16 by a transport robot not shown.

The second rotary machine tool 16 is a position (the lower end portion in the fifth drawing) that is rotated 90° clockwise from the third bonding carry-in/loading position 16c as the bonding inspection position 16d. At the bonding inspection position 16d, the inspection device 19 inspects the workpiece (liquid crystal panel P) to which the film is bonded (inspection of whether the position of the optical component F1X is appropriate (whether the positional deviation is within the tolerance) or the like). When the position of the optical module F1X of the liquid crystal panel P is judged to be an incorrect workpiece, it is sent out of the system through the exclusion portion not shown in the drawing.

The second rotary machine tool 16 is a second turntable end position 16b at a position (left end of Fig. 5) that is rotated 90° clockwise from the bonding inspection position 16d. At the second turntable end position 16b, the carry-out operation is performed by the fourth transfer device 21.

The fourth conveying device 21 holds the liquid crystal panel P and is freely transported in the vertical direction and the horizontal direction. The fourth transport device 21 transports the liquid crystal panel P held by the adsorption to the second home position 7a of the second sub-transport device 7, for example, and releases the adsorption at the second home position 7a to liquidize the liquid crystal panel P. The panel P is delivered to the second sub-conveying device 7.

The fifth conveying device 22 holds the liquid crystal panel P and is freely transported in the vertical direction and the horizontal direction. The fifth transport device 22 transports the liquid crystal panel P held by the adsorption to the end point 5b of the main transport device 5, and releases the suction at the end point 5b to transfer the liquid crystal panel P to the main transport device 5. The bonding work of the film bonding system 1 is completed through the above.

Hereinafter, the first bonding apparatus 13 will be described in detail with reference to FIGS. 6 and 7. Figure 6 shows a schematic side view of the first bonding device 13. In addition, the second bonding apparatus 15 and the third bonding apparatus 18 have the same configuration, and detailed description thereof will be omitted. The first bonding apparatus 13 is bonded to the upper surface of the liquid crystal panel P by a layer (first optical component F11) of the bonding layer sheet F5 cut into a specific size in the first optical component layer F1.

As shown in Fig. 6, the first bonding apparatus 13 is provided with a layer sheet conveying device 31 that winds the first optical component layer F1 from the roll drum R1 around which the first optical component layer F1 is wound, and along The first optical component layer F1 is transported in the longitudinal direction of the first optical component layer F1; and the bonding section 40 holds the laminated layer F5 cut from the first optical component layer F1 by the layer transporting device 31. The ply (first optical component F11) is bonded to the upper side of the liquid crystal panel P.

In the layer sheet conveying device 31, the bonding layer sheet F5 is conveyed by using the separation layer sheet F3a as a carrier, and the winding portion 31a is provided to hold the roll drum R1 around which the strip-shaped first optical unit layer F1 is wound, and The first optical component layer F1 is wound up along the longitudinal direction of the first optical component layer F1; the cutting device 31b applies a half cut to the first optical component layer F1 unwound from the takeup roll R1; the blade 31c makes The first optical component layer F1 after being half-cut is wound at an acute angle to separate the bonding layer sheet F5 from the separation layer sheet F3a; and the winding portion 31d is kept separated by the winding portion 31c. Separation drum R2 of layer F3a.

Further, although not shown in the drawings, the layer sheet conveying device 31 has a plurality of guide rollers, and the first optical module layer F1 is wound along a specific conveyance path. The first optical module layer F1 has a width equal to the width of the display region P4 of the liquid crystal panel P (corresponding to the short side length of the display region P4 in the present embodiment) in the horizontal direction (ply width direction) perpendicular to the conveyance direction. .

The winding portion 31a located at the beginning of the layer conveying device 31 and the winding portion 31d at the end of the layer conveying device 31 are, for example, driven in synchronization with each other. Thereby, the unwinding portion 31a winds up the first optical component layer F1 in the conveyance direction of the first optical component layer F1, and the winding portion 31d winds up the separation layer F3a which passes through the blade 31c. In the layer conveyance device 31, the upstream side in the conveyance direction of the first optical module layer F1 (separation layer sheet F3a) is referred to as the layer conveyance upstream side, and the downstream side in the conveyance direction is referred to as the sheet conveyance downstream side.

The cutting device 31b winds the first optical component layer F1 up to the length of the display region P4 (corresponding to the length of the long side of the display region P4 in the present embodiment) in the longitudinal direction perpendicular to the layer width direction. In the case of the length, the entire width of the first optical component layer F1 in the sheet width direction is traversed in the width direction of the layer, and one portion of the thickness direction of the first optical component layer F1 is cut (halved).

The cutting device 31b transmits the tension in the first optical component layer F1, and does not cause the first optical component layer F1 (the separation layer F3a) to be broken or broken (the separation layer F3a having a specific thickness remains). The front and rear positions of the blade are cut, and the half cut is applied to the vicinity of the interface between the adhesive layer F2a and the separation layer F3a. Alternatively, a laser device can be used instead of cutting the blade.

In the first optical component layer F1 after the half-cut, the optical module body F1a and the surface protective film F4a are cut in the thickness direction thereof to form a transverse line across the entire width of the first optical component layer F1 in the layer width direction. The first optical component layer F1 is divided into sections having a length corresponding to the long side of the display region P4 in the longitudinal direction by the transverse line. The partitions are each one of the plies (first optical component F11) of the ply F5.

The blade 31c is located below the first optical component layer F1 which is conveyed slightly horizontally from the left side to the right side of FIG. 6, and is formed to extend at least across the entire width of the first optical component layer F1 in the layer width direction. The blade 31c is wound in such a manner that it is wound in a sliding contact with the side of the separation layer F3a of the first optical component layer F1 after the half cutting.

The blade 31c winds the first optical component layer F1 at an acute angle to its sharp-angled front end. When the first optical component layer F1 is folded back at an acute angle at the front end of the blade 31c, the separation layer F3a is peeled off from the bonding layer F5. At this time, the adhesive layer F2a of the bonding layer sheet F5 (the bonding surface with the liquid crystal panel P) faces downward. Immediately above the front end portion of the blade 31c is a separation layer peeling position 31e, and an arc-shaped holding surface 32a of the bonding head 32, which will be described later, comes into contact with the front end portion of the blade 31c from above, so that the surface of the laminated sheet F5 is protected. The film F4a (the side opposite to the bonding surface) is adhered to the holding surface 32a of the bonding head 32.

The bonding unit 40 has a bonding table 41 for holding the liquid crystal panel P at the time of bonding, and a bonding head 32 having an arc-shaped holding surface 32a which is parallel to the width direction of the layer and protrudes downward; The driving device 42 is a rotary drive bonding head 32; and the moving device 44 moves the bonding head 32 via the driving device 42. The driving device 42 and the mobile device 44 are electrically connected to the control device 25. The control device 25 can independently drive and control the drive device 42 and the mobile device 44.

The bonding table 41 is for holding the liquid crystal panel P to which the bonding layer sheet F5 is bonded. The bonding table 41 holds the liquid crystal panel P by, for example, adsorption. The bonding head 32 is a circular arc-shaped holding surface 32a which is parallel to the width direction of the layer and has a convex shape below. The holding surface 32a has a weaker adhesive force than the bonding surface (adhesive layer F2a) of the bonding layer sheet F5, for example, and the surface protective film F4a of the bonding layer sheet F5 can be repeatedly adhered and peeled off.

The driving device 42 rotates the bonding head 32 so as to be inclined above the blade 31c so as to be parallel to the longitudinal direction and to be inclined along the bending of the holding surface 32a around the axis in the layer width direction. Further, the drive unit 42 causes the bonding head 32 to perform a lifting operation at a specific distance. When the bonding layer sheet F5 is adhered and the bonding layer sheet F5 is adhered and adhered to the liquid crystal panel P as will be described later, the driving device 42 performs the tilting movement of the bonding head 32.

The moving device 44 includes a guide rail 44a that is disposed above the bonding table 41 and the layer transfer device 31, a power unit 44b such as an actuator, and an arm portion 43 that can be moved along the guide rail 44a by the power unit 44b. The bonding head 32 is attached to the front end of the arm portion 43 by the driving device 42. In addition, in the drawings, the moving device 44 is provided with a guide rail 44a extending in the paper surface direction (the width direction of the bonding layer sheet F5), and the arm portion 43 may be in the paper surface running direction (the bonding layer sheet F5) Structure that moves in the width direction).

The moving device 44 moves the arm portion 43 along the guide rail 44a, thereby moving the bonding head 32 between the sheet conveying device 31 and the bonding table 41. In other words, the moving device 44 allows the bonding head 32 to be opposed to the bonding position of the separation layer sheet F3a of the bonding layer sheet F5 and the bonding position of the liquid crystal panel P to the bonding layer sheet F5 (the bonding table 41). mobile.

Further, in the present embodiment, the driving device 42 has a function of moving the bonding head 32 up and down. However, the moving device 44 (arm portion 43) may have a function of moving the bonding head 32 up and down.

The moving device 44 moves the arm portion 43 (the bonding head 32) to the front end portion of the blade edge 31c at the peeling position of the separation layer sheet F3a. At this time, the drive unit 42 rotates the bonding head 32 until the holding surface 32a faces downward, and the curved end side (the right side of FIG. 6) of the holding surface 32a is a lower inclined state.

The driving device 42 lowers the bonding head 32 in the inclined state from above the separation layer peeling position 31e, thereby abutting the curved one end side of the holding surface 32a from the upper side to the front end of the blade 31c, and separating the separation layer. The front end portion of the bonding layer sheet F5 at 31e is adhered to the holding surface 32a.

In the present embodiment, the first detecting camera 34 that detects the leading end of the layer transport downstream side of the layer of the bonded layer sheet F5 at the portion below the end portion of the blade 31c is provided. The detection data of the first detection camera 34 is transmitted to the control device 25. When the first detecting camera 34 detects the downstream end of the bonding layer sheet F5, for example, the control device 25 temporarily stops the layer sheet conveying device 31.

When the first detecting camera 34 detects the downstream side end of the bonding layer sheet F5 and temporarily stops the layer sheet conveying device 31, the control device 25 performs cutting of the bonding layer sheet F5 by the cutting device 31b. That is, the layer between the detection position of the first detection camera 34 (the optical axis extension position of the first detection camera 34) and the cutting position along the cutting device 31b (the position before and after the cutting blade of the cutting device 31b) The distance of the transport route corresponds to the length of the layer of the laminated layer F5.

The cutting device 31b is movable along the layer transport path, and the distance between the detection position of the first detecting camera 34 and the cutting conveyance path between the cutting positions of the cutting device 31b is changed by the movement. The movement of the cutting device 31b is controlled by the control device 25, and when the bonding layer sheet F5 is cut by, for example, the cutting device 31b, the distance of the layer of the laminated layer sheet F5 is rolled up, and when it is cut, In the case where there is a deviation between the broken end and the specific reference position, the deviation is corrected by the movement of the cutting device 31b. Further, the cutting of the bonding layer sheet F5 having a different length may be performed by the movement of the cutting device 31b.

The first detecting camera 34 can also detect the defect mark printed on the bonding layer F5. This defect mark is marked by inkjet or the like from the side of the surface protective film F4a when the defect roll is found in the first optical component layer F1 at the time of manufacture of the roll reel R1.

Here, the defect of the optical component layer FX is, for example, a portion where the solid matter is composed of a foreign matter composed of at least one of a liquid and a gas, or a portion where the surface of the optical component layer FX has irregularities or flaws, because The portion of the optical component layer FX skewed by a skew or material deviation, etc.

The control device 25 lowers the bonding head 32 by the driving device 42, and adheres the front end portion of the bonding layer sheet F5 to the holding surface 32a, and then disconnects the driving device 42 from the bonding head 32. Thereby, the fitting head 32 is freely tilted and moved. In this state, the layer sheet conveying device 31 performs the winding operation of the bonding layer sheet F5.

At this time, since the cutting bonding head 32 is movably tilted by the engagement with the driving device 42, the tilting movement is passively accompanied by the unwinding of the bonding layer sheet F5. In this manner, the bonding layer sheet F5 is taken up and the bonding head 32 is tilted and moved, whereby the layer of the bonding layer sheet F5 is entirely adhered to the holding surface 32a. When the fitting head 32 is tilted until the bonding layer F5 is entirely adhered to the holding surface 32a, the tilting movement is locked in the inclined state by, for example, engagement with the driving device 42. In this state, the driving device 42 raises the bonding head 32 upward toward the separation layer peeling position 31e. Thereafter, the moving device 44 moves the arm portion 43 (the bonding head 32) onto the bonding table 41, and the bonding layer sheet F5 to which the bonding head 32 is adhered is bonded to the liquid crystal panel P as will be described later.

Further, after the bonding layer sheet F5 which has detected the defect mark as described above is adhered to the liquid crystal panel P after being adhered to the bonding head 32, it is moved to the disposal position (discarded position) which avoids the bonding table 41. , overlap and attach to the waste layer and so on. Alternatively, when the defect mark is detected, a process of cutting the laminated layer sheet F5 with a minimum width and discarding it may be provided.

In the present embodiment, when the bonding head 32 to which the bonding layer sheet F5 is adhered is moved from the separation layer peeling position 31e toward the bonding table 41, for example, the bonding layer sheet F5 adhered to the holding surface 32a is opposed to the front end. The two corner portions of the proximal portion of the portion are each photographed by a pair of second detecting cameras 35. The detection data of each of the second detecting cameras 35 is transmitted to the control device 25. The control device 25 confirms, for example, the horizontal direction of the bonding layer sheet F5 of the bonding head 32 (the moving direction of the bonding head 32 and its vertical direction and the rotation direction of the center of the vertical axis) based on the imaging data of each of the second detecting cameras 35. position. In the case where the relative positions of the bonding head 32 and the bonding layer sheet F5 are different, the control device 25 performs the position of the bonding layer sheet F5 of the bonding head 32 as the specific reference position by the driving device 42. Position calibration.

The control device 25 moves the bonding head 32 to a specific position above the bonding table 41. The moving device 44 performs, for example, position alignment of the bonding head 32 and the bonding table 41 so that the front end portion of the bonding layer sheet F5 adhered to the holding surface 32a and the end portion of the liquid crystal panel P held on the bonding table 41 are positioned. Can overlap on the plane.

When the control device 25 is attached, the bonding head 32 in the inclined state is lowered by the driving device 42, whereby the end portion of the bonding layer sheet F5 adhered to the holding surface 32a is abutted from the upper side to the liquid crystal panel P end. The state of the department. The driving device 42 lowers the bonding head 32 and assumes a state in which the bonding layer sheet F5 is pressed against the liquid crystal panel P. At this time, the control device 25 causes the bonding head 32 to be engaged with the driving device 42, and the driving force from the driving device 42 can be transmitted to the bonding head 32.

Fig. 7 is a view for explaining the bonding operation of the first bonding apparatus 13. Further, in the present specification, at the bonding layer sheet F5 adhered to the bonding head 32, deformation (warpage) or very small deformation does not occur when being unwound from the roll drum R1.

In the present embodiment, the control device 25 drives the drive device 42 and the mobile device 44 independently. Specifically, as shown in FIG. 7 , the control device 25 controls the driving device 42 and the moving device 44 to press the bonding layer sheet F5 against the liquid crystal panel P by the bonding head 32 and The relative movement of the liquid crystal panel P generates a moment along the advancing direction of the bonding layer sheet F5 from the holding surface 32a to the liquid crystal panel P at the time of bonding. Thereby, the bonding head 32 is tilted on the liquid crystal panel P in a state in which the moment is generated (refer to FIG. 6).

Here, the advancing direction of the bonding layer sheet F5 of the liquid crystal panel P is, for example, when the bonding layer sheet F5 is bonded from the one end side of the liquid crystal panel P to the other end side, from the one end side toward the other end side. The direction, or the direction from the other end side toward the one end side. When the bonding layer sheet F5 has no adhesion deviation with respect to the bonding head 32, the in-plane direction (the horizontal direction in FIG. 7) perpendicular to the rotation axis of the bonding head 32 is the forward direction.

The bonding head 32 applies the moment when it is attached, and the end surface of the liquid crystal panel P is brought into contact with the holding member 39. The holding assembly 39 can be disposed at the bonding table 41 or at other devices. According to this, the end surface of the liquid crystal panel P is supported by the holding member 39 at the time of bonding, so that the moment can be favorably applied by the bonding head 32. Further, for example, the liquid crystal panel P of the bonding table 41 has a strong adsorption effect, and even if a moment is applied, the adsorption position on the bonding table 41 of the liquid crystal panel P does not vary, and the holding member 39 is not necessarily required.

Here, a case where the bonding operation is performed in a state where the above-described torque is not applied will be described as a comparison. In this case, the cutting head 32 is brought into contact with the driving device 42, and the moving device 44 is moved to perform the bonding operation while the bonding head 32 is freely tilted.

In this way, the moment is not applied to the bonding head 32, and the bonding layer sheet F5 held by the bonding head 32 is bonded while the liquid crystal panel P is stretched obliquely rearward. Therefore, in general, the liquid crystal panel P to which the bonding layer sheet F5 is bonded is highly deformed toward the upper side (hereinafter, referred to as an upper deformation).

On the other hand, in the present embodiment, as shown in Fig. 7, the moving device 44 and the driving device 42 are independently controlled so that the moment applied to the bonding head 32 is applied to the self-adhesive layer F5 of the liquid crystal panel P. A balance is obtained between the tensile stresses received on the side of the bonding head 32. Therefore, the bonding layer sheet F5 bonded to the liquid crystal panel P by the tilting movement of the bonding head 32 in the state in which the moment is applied can suppress the stress (tensile force) applied to the surface of the liquid crystal panel P.

Moreover, the control device 25 drives the driving device 42 and the moving device 44 according to the conditions (for example, material, thickness, warpage state, and the like) of the bonding layer sheet F5 (for example, the amount of movement and movement of the bonding head 32) The torque applied to the fitting head 32 can be adjusted by appropriately changing the speed, the amount of rotation, or the turning speed. Thereby, the first bonding apparatus 13 can suppress the amount of deformation generated in the liquid crystal panel P after the bonding layer sheet F5 is bonded, within a certain range. Here, the amount of deformation within a certain range means that the deformation generated by the liquid crystal panel P does not cause a problem in practical use.

Further, in the present embodiment, the first bonding apparatus 13 is disposed above the bonding table 41 at the bonding position, and is provided with one of the positional calibrations for performing the horizontal direction of the liquid crystal panel P to the third detecting camera 36 (refer to 5, 6)). At the second bonding apparatus 15, above the bonding table 41 at the same bonding position, a pair of fourth detection cameras 37 for performing positional alignment in the horizontal direction of the liquid crystal panel P are provided (refer to FIG. 5). Each of the third detecting cameras 36 captures, for example, the two corners on the left side in the fifth drawing of the glass substrate (first substrate P1) of the liquid crystal panel P, and each of the fourth detecting cameras 37 respectively photographs a glass substrate such as the liquid crystal panel P. The two corners on the left side in the fifth picture.

At the third bonding apparatus 18, one of the positional calibrations for performing the horizontal alignment of the liquid crystal panel P on the fifth bonding camera 38 (refer to FIG. 5) is provided above the bonding table 41 at the same bonding position. Each of the fifth detecting cameras 38 captures, for example, the two corner portions on the left side in the fifth drawing of the glass substrate of the liquid crystal panel P. The detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38) is transmitted to the control device 25. Alternatively, a sensor may be used instead of each of the detecting cameras (the first detecting camera 34 to the fifth detecting camera 38).

The bonding table 41 of each of the bonding devices (the first bonding device 13, the second bonding device 15, and the third bonding device 18) is based on each of the detecting cameras (the first detecting camera 34 to the fifth detecting camera 38). The detection data is driven and controlled by the control device 25. Thereby, the position alignment of the liquid crystal panel P of the bonding head 32 with respect to each bonding position can be performed.

In the liquid crystal panel P, the bonding layer sheet F5 which has been aligned by the bonding head 32 is bonded to each other, thereby suppressing the bonding deviation of the layer sheet FXm, thereby improving the accuracy of the optical axis direction of the optical component F1X with respect to the liquid crystal panel P. Improve the color and contrast of optical display devices.

As described above, the film bonding system 1 of the above-described embodiment is a film bonding system 1 in which the optical module F1X is bonded to the liquid crystal panel P, and includes a bonding device (the first bonding device 13 and the second bonding device). 15. The third bonding apparatus 18) winds out the strip-shaped optical component layers FX corresponding to the width of the display panel P4 of the liquid crystal panel P from the plurality of liquid crystal panels P transported along the production line, and The optical component layer FX is cut as the optical component F1X corresponding to the length of the display region P4, and then the optical component F1X is attached to the liquid crystal panel P; wherein the bonding device (the first bonding device 13) The second bonding device 15 and the third bonding device 18) have a winding portion 31a for winding the optical component layer FX from the roll drum R1 and the separation layer F3a together; the cutting device 31b is The optical component layer FX is cut as the optical component F1X while leaving the separation layer F3a; the blade 31c is peeled off from the separation layer F3a; the bonding head 32 is the optical component The F1X is held against the arc-shaped retaining surface 32a and will remain in the warranty. The optical component F1X of the holding surface 32a is attached to the liquid crystal panel P, and is tilted and moved along the bending of the holding surface 32a; and the moving device 44 is disposed on the separating layer F3a of the optical component F1X. The peeling position (separating layer peeling position 31e) is moved between the bonding position (bonding stage 41) of the liquid crystal panel P of the optical component F1X; and the driving device 42 is attached to the optical component F1X so that The bonding head 32 that presses the optical module F1X to the liquid crystal panel P is tilted and moved along the bending of the holding surface 32a; and the control device 25 controls the moving device 44 and the driving device 42. Next, when the bonding device 25 performs the bonding, the driving device 42 and the moving device 44 are controlled to press the bonding layer sheet F5 against the liquid crystal panel P, and the bonding head 32 and the liquid crystal panel P are opposed to each other. The movement is such that a moment is generated along the advancing direction of the bonding layer sheet F5 from the holding surface 32a to the liquid crystal panel P at the time of bonding.

According to this configuration, the strip-shaped optical component layer FX corresponding to the width of the display region P4 is cut to a specific length as the optical component F1X, and the optical component F1X is held in an arc shape by the tilting movement of the bonding head 32. The surface 32a is attached to the liquid crystal panel P by the tilting movement of the same bonding head 32, thereby suppressing the dimensional deviation or the fitting deviation of the optical component F1X, and the frame portion G around the display region P4 can be reduced. Achieve the expansion of the display area and the miniaturization of the machine. Moreover, the tilting movement of the bonding head 32 to which the torque is applied in the forward direction of the bonding layer sheet F5 is used to bond the optical module F1X to the liquid crystal panel P, so that it can be suppressed from being attached to the liquid crystal after the optical component F1X is bonded. The deformation produced by the panel P. Moreover, continuous bonding of the optical component F1X can be facilitated, and the production efficiency of the optical display device can be improved. Further, the optical unit F1X can be smoothly held by the tilting movement of the arc-shaped holding surface 32a, and the optical unit F1X can be surely attached to the liquid crystal panel P by the tilting movement of the same arc-shaped holding surface 32a.

Further, in the film bonding system 1, the blade 31c is formed such that the bonding surface of the liquid crystal panel P faces downward, and the optical module F1X is peeled off from the separation layer F3a, and the bonding head 32 is bonded to the opposite surface. The side upper side surface is abutted against the holding surface 32a, and the bonding surface is directed downward, and the peeling position and the bonding position are moved so that the bonding surface of the adhesive layer F2a side faces. By transporting the optical component layer FX to the lower side, it is possible to suppress scratches or adhesion of foreign matter on the bonding surface of the optical component layer FX, and it is possible to suppress scratches or adhesion of foreign matter on the bonding surface of the optical component layer FX, and to suppress the adhesion. Poor occurrence.

Moreover, the film bonding system 1 is provided with the liquid crystal panel P moved to a loading position (each turntable start position (the first turntable start position 11a, the second turntable start position 16a)), and the bonding position (each paste) The rotary machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) of the transfer table 41) and the carry-out position (the first turntable end position 11b and the second turntable end position 16b) make the liquid crystal The panel P can efficiently switch the conveying direction, and the rotary machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) can also be used as part of the production line to suppress the length of the production line, and the degree of freedom in setting the system can be improved.

Further, in the film bonding system 1, the bonding apparatus (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding apparatus 18) has a detecting mechanism that detects a defect mark printed on the optical component layer FX. (The first detecting camera 34) holds the portion of the optical component layer FX where the defect mark is detected on the bonding head 32, and transports it to the discarding position (discarded position). Therefore, it is possible to provide a film bonding system 1 which improves the yield ratio of an optical display device and which is excellent in productivity.

(Second embodiment) Next, the structure of the film bonding system of the second embodiment will be described. Fig. 8 is a schematic configuration diagram of a film bonding system 2 of the present embodiment. In Fig. 8, for the sake of convenience of illustration, the film bonding system 2 is divided into two layers. In the following, the same components as those in the first embodiment are denoted by the same reference numerals, and their detailed description is omitted.

In the first embodiment, the case where the width and length of the optical module F1X to which the bonding head 32 is bonded is the same as the display area P4 of the liquid crystal panel P is exemplified. On the other hand, in the present embodiment, the cutting device is provided in which the layer sheet which is larger (the width and the length is larger) than the display region P4 is bonded to the liquid crystal panel P, and the remaining portion of the layer sheet is cut. It is greatly different from the first embodiment.

In the present embodiment, as shown in FIG. 8, the film bonding system 2 is attached to the front/rear surface of the liquid crystal panel P, and the first optical component layer F1 and the second optical component layer F2 are bonded to each other. The first optical component F12, the second optical component F12, and the third optical component F13 (optical component F1X) are cut by the third optical component layer F3 (optical component layer FX).

Further, in the present embodiment, the first layer sheet F1m, the second layer sheet F2m, and the third layer sheet F3m (hereinafter collectively referred to as the layer sheet FXm), which will be described later, are cut by the remaining portion outside the display area. The first optical component F11, the second optical component F12, and the third optical component F13 are formed.

Fig. 9 is a plan view (top view) of the film bonding system 2. Hereinafter, the film bonding system 2 will be described with reference to Figs. 8 and 9. In addition, the arrow F in the figure shows the conveyance direction of the liquid crystal panel P. In the following description, similarly to the first embodiment, the upstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport upstream side, and the downstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport downstream side.

The film bonding system 2 uses the specific position of the main conveying device 5 as the starting point 5a and the ending point 5b of the bonding process. The film bonding system 2 includes: a first sub-transporting device 6 and a second sub-conveying device 7; a first conveying device 8; a cleaning device 9, a first rotary machine tool 11, a second conveying device 12, and a first bonding device 13 and a second bonding device 15; a film peeling device 14; and a first cutting device 51.

Next, the film bonding system 2 includes a second rotary machine tool 16 disposed on the downstream side of the panel transfer of the first rotary machine tool 11, a third transfer device 17, a third bonding device 18, and a second cutting device 52; The second sub-conveying device 7; the fourth conveying device 21; and the fifth conveying device 22.

The film bonding system 2 uses a driven main conveying device 5, each sub conveying device (first sub conveying device 6, second sub conveying device 7) and each rotary machine tool (first rotary machine tool 11, second The production line formed by the rotary machine tool 16) transports the liquid crystal panel P, and the liquid crystal panel P is sequentially subjected to a specific process. The liquid crystal panel P is, for example, in the main transport device 5, and transports the short side of the display region P4 toward the transport direction; each of the sub transport devices (the first sub transport device 6 and the second sub transport device that are perpendicular to the main transport device 5) 7), the long side of the display area P4 is transported in the transport direction; in each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16), the long side of the display area P4 is turned toward each turn. The desktop machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) is transported radially.

The film bonding system 2 is formed by laminating a layer (corresponding to the optical component F1X) of the bonding layer sheet F5 of a specific length from the strip-shaped optical component layer FX with respect to the front/rear surface of the liquid crystal panel P.

The first rotary machine tool 11 is used as a first turntable start position 11a at a loading position from the second transfer device 12 (a left end portion in plan view of Fig. 9), and is rotationally driven in a clockwise direction. The first rotary machine tool 11 is a first bonding/unloading position 11c at a position (the upper end portion in FIG. 9) that is rotated 90° clockwise from the first turret starting position 11a.

At the first bonding loading/unloading position 11c, the liquid crystal panel P is carried into the first bonding apparatus 13 by a transfer robot not shown. In the present embodiment, the first bonding apparatus 13 performs bonding of the first layer sheet F1m on the backlight side of the liquid crystal panel P. The first layer F1m is a layer of the first optical component layer F1 having a larger size than the display region P4 of the liquid crystal panel P. By the first bonding apparatus 13, the first layer sheet F1m can be bonded to the side of one of the front/rear surfaces of the liquid crystal panel P to form the first optical component bonding body PA1. The first optical component bonding body PA1 is carried from the first bonding apparatus 13 to the first bonding loading/unloading position 11c of the first rotary machine tool 11 by a transfer robot arm (not shown).

The first rotary machine tool 11 is a film peeling position 11e at a position (right upper end portion of FIG. 9) that is rotated by 45° in the clockwise direction from the first bonding/unloading position 11c. At the film peeling position 11e, peeling of the surface protective film F4a of the first layer sheet F1m is performed by the film peeling device 14.

The first rotary machine tool 11 is a position (the right end position in the ninth diagram) that is rotated by 45° in the clockwise direction from the film peeling position 11e as the second bonding carry-out/loading position 11d. At the second bonding carry-out/loading position 11d, the liquid crystal panel P is carried into the second bonding apparatus 15 by a transport robot not shown. In the present embodiment, the second bonding apparatus 15 is used to bond the second layer sheet F2m on the backlight side of the liquid crystal panel P. The second layer F2m is a layer of the second optical component layer F2 having a larger size than the display area of the liquid crystal panel P. The second layer F2m can be bonded to the surface of the first layer F1m side of the first optical component bonding body PA1 by the second bonding device 15, to form the second optical component bonding body PA2. The second optical component bonding body PA2 is carried from the second bonding apparatus 15 to the second bonding loading/unloading position 11d of the first rotary machine tool 11 by a transfer robot not shown.

The first rotary table machine 11 is a first turntable end position 11b (first cut position) at a position (the lower end portion in FIG. 9) that is rotated 90 degrees clockwise from the second bonding carry-out/loading position 11d.

In the present embodiment, the first turret end position 11b is a first cutting position at which the first layer F1m and the second layer F2m are cut by the first cutting device 51. The first cutting device 51 cuts off the remaining portion disposed outside the opposing portion of the display region P4 of the liquid crystal panel P from the first layer F1m and the second layer F2m bonded to the liquid crystal panel P, respectively. The first optical component F11 composed of the first optical component layer F1 and the second optical component F12 composed of the second optical component layer F2 are formed as optical components corresponding to the size of the display region P4 of the liquid crystal panel P.

In addition, in the present specification, the "opposing portion with the display region P4" means a region that is larger than the display region P4 and smaller than the outer shape of the optical display member (the liquid crystal panel P), and avoids the electronic component mounting portion. The area of the functional part. In other words, "the remaining portion outside the opposing portion of the display region P4 is cut" includes the case where the remaining portion is cut along the outer periphery of the optical display member (liquid crystal panel P).

After the first layer F1m and the second layer F2m are attached to the liquid crystal panel P, the first optical component F11 and the second optical component F12 are not separated, so as to obtain a peripheral edge of the display region P4. The shape corresponds to the first optical component F11 and the second optical component F12. Moreover, the cutting work of the first layer F1m and the second layer F2m is also simplified.

The remaining portions of the first layer F1m and the second layer F2m are cut from the second optical component bonding body PA2 by the first cutting device 51 to form the first optical component F11 and the second optical component F12. The third optical component is bonded to the surface of one of the front/reverse sides of the liquid crystal panel P. The remaining portion cut from the first layer sheet F1m and the second layer sheet F2m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings. The third optical component bonding body PA3 is attached to the first turntable end position 11b, and is carried out by the third transfer device 17.

The third transport device 17 can hold the liquid crystal panel P (the third optical component bonding body PA3) and can be freely transported in the vertical direction and the horizontal direction. The third transport device 17 transports the liquid crystal panel P held by the adsorption to the second turntable start position 16a of the second rotary machine tool 16, for example, and performs the front/reverse reverse of the liquid crystal panel P at the time of the transfer. In turn, the adsorption is released at the second turntable start position 16a, and the liquid crystal panel P is transferred to the second rotary machine tool 16.

The second rotary machine tool 16 is used as the second turntable start position 16a from the loading position (the upper end portion in the plan view of the ninth drawing) from the third transfer device 17, and is rotationally driven in the clockwise direction. The second rotary machine tool 16 is a third bonding carry-out/loading position 16c at a position (right end portion of the ninth drawing) that is rotated 90° clockwise from the second turret starting position 16a.

At the third bonding carry-out/loading position 16c, the liquid crystal panel P is carried into the third bonding apparatus 18 by a transport robot not shown. In the present embodiment, the third bonding apparatus 18 is used to bond the display surface side third layer sheet F3m. The third layer F3m is a layer of the third optical component layer F3 having a larger size than the display area of the liquid crystal panel P. By the third bonding device 18, the third layer F3m can be bonded to the other side of the front/reverse side of the liquid crystal panel P (the first optical component F11 and the second optical component bonding body PA3) The surface opposite to the surface to which the optical module F12 is bonded is formed to form the fourth optical component bonding body PA4. The fourth optical component bonding body PA4 is carried from the third bonding apparatus 18 to the third bonding loading/unloading position 16c of the second rotary machine tool 16 by a transfer robot not shown.

In the second embodiment, the second rotary machine tool 16 is rotated at a position 90° in the clockwise direction from the third bonding/unloading position 16c (the lower end portion in FIG. 9) as the second cutting position 16d. At the second cutting position 16d, the third layer piece F3m is cut by the second cutting device 52. The second cutting device 52 cuts off the remaining portion disposed outside the opposing portion of the display region P4 of the liquid crystal panel P from the third layer sheet F3m bonded to the liquid crystal panel P to form a display region corresponding to the liquid crystal panel P. P4 size optical component (third optical component F13).

The remaining portion of the third layer sheet F3m is cut from the fourth optical component bonding body PA4 by the second cutting device 52, and the third optical component F13 is bonded to the other side of the front/rear surface of the liquid crystal panel P. Further, the first optical component F11 and the second optical component F12 are bonded to one side of the front/rear surface of the liquid crystal panel P to form a fifth optical component bonding body PA5. The remaining portion cut from the third layer sheet F3m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings.

Here, the first cutting device 51 and the second cutting device 52 are, for example, a carbon dioxide (CO ₂ ) laser cutting machine. Further, the configurations of the first cutting device 51 and the second cutting device 52 are not limited thereto, and for example, other cutting mechanisms such as a cutting blade may be used.

The first cutting device 51 and the second cutting device 52 cut the layer sheet FXm bonded to the liquid crystal panel P without interruption along the outer periphery of the display region P4. The first cutting device 51 and the second cutting device 52 are connected to the same laser output device 53. The first cutting device 51, the second cutting device 52, and the laser output device 53 constitute a cutting mechanism, and the remaining portion disposed outside the opposing portion of the display region P4 is cut off from the layer FXm to form a corresponding portion. The optical component FX is displayed in the size of the display area P4. Since the laser output required for cutting each layer (the first layer F1m, the second layer F2m, and the third layer F3m) is not large, the high output laser output from the laser output device 53 can also be used. The light is divided into two, and is supplied to the first cutting device 51 and the second cutting device 52.

In the present embodiment, the second rotary machine tool 16 is rotated at a position 90° clockwise from the second cutting position 16d (the left end portion of the ninth diagram) as the second turret end position 16b. At the second turntable end position 16b, the fifth optical unit bonding body PA5 is carried out by the fourth transfer device 21.

The fourth transfer device 21 can hold the liquid crystal panel P (the fifth optical component bonding body PA5) and can be freely transported in the vertical direction and the horizontal direction. The fourth transport device 21 transports the liquid crystal panel P held by the adsorption to the second home position 7a of the second sub-transport device 7, for example, and releases the adsorption at the second home position 7a to liquidize the liquid crystal panel P. The panel P is delivered to the second sub-conveying device 7.

The fifth transport device 22 can hold the liquid crystal panel P (the fifth optical component bonding body PA5) and can be freely transported in the vertical direction and the horizontal direction. The fifth transport device 22 transports the liquid crystal panel P held by the adsorption to the end point 5b of the main transport device 5, and releases the suction at the end point 5b to transfer the liquid crystal panel P to the main transport device 5.

The bonding inspection position omitted in the drawing is provided on the transport path of the liquid crystal panel P (fifth optical component bonding body PA5) after the second turntable end position 16b, and is omitted in the drawing at the bonding inspection position. The inspection device inspects the workpiece (liquid crystal panel P) to which the film is attached (check whether the position of the optical component F1X is appropriate (whether the positional deviation is within the tolerance) or the like). When the position of the optical module F1X of the liquid crystal panel P is judged to be an incorrect workpiece, it is sent out of the system through the exclusion portion not shown in the drawing.

The bonding work of the film bonding system 2 is completed through the above.

Hereinafter, the step of bonding the bonding layer sheet F5 to the liquid crystal panel P by the first bonding apparatus 13 will be described as an example. In addition, the description of the bonding work of the second bonding apparatus 15 and the third bonding apparatus 18 having the same configuration as the first bonding apparatus 13 will be omitted.

In the present embodiment, the first bonding apparatus 13 cuts a layer (first layer sheet F1m) of the bonding layer sheet F5 larger than the display region P4 of the liquid crystal panel P from the first optical component layer F1, so that The fitting head 32 is tilted to adhere to the holding surface 32a. The first bonding apparatus 13 is configured such that the bonding head 32 is tilted and moved by the liquid crystal panel P on the bonding table 41, whereby the bonding of the layer (first layer sheet F1m) of the bonding layer sheet F5 is performed.

The bonding table 41 is driven and controlled by the control device 25 based on the detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38). Thereby, the position alignment of the liquid crystal panel P of the bonding head 32 with respect to each bonding position is performed.

The laminated layer F5 (layer sheet FXm) which has been aligned with the position of the bonding head 32 is bonded to the liquid crystal panel P, whereby the bonding deviation of the optical component F1X is suppressed, and the optical component F1X of the liquid crystal panel P can be improved. The accuracy of the optical axis direction improves the color and contrast of the optical display device.

Here, the polarizing film constituting the optical component layer FX is produced by, for example, a polyvinyl alcohol (PVA) film which is dyed by a dichroic dye, and which is made to have a non-uniform thickness or a two-color PVA film. Problems such as uneven dyeing of the pigmentation may cause variations in the optical axis direction in the FX plane of the optical component layer.

Therefore, in the present embodiment, the control device 25 determines the liquid crystal panel P of the optical component layer FX based on the inspection data distributed in the optical axis plane of each part of the optical component layer FX stored in the storage device 24 (refer to FIG. 8). Fit position (relative fit position). Next, each of the bonding apparatuses (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding apparatus 18) performs the layer FXm cut out from the optical component layer FX in accordance with the bonding position. The liquid crystal panel P is positionally aligned, and the liquid crystal panel P is attached to the layer FXm.

The method of determining the bonding position (relative bonding position) of the layer sheet FXm with respect to the liquid crystal panel P is as follows.

First, as shown in FIG. 10A, a plurality of checkpoints CP are set in the width direction of the optical component layer FX, and the optical axis direction of the optical component layer FX is detected at each checkpoint CP. The time at which the optical axis is detected may be the time when the roll drum R1 is manufactured, or may be the period before the half of the optical unit layer FX is unwound from the roll drum R1. The data in the optical axis direction of the optical component layer FX and the optical component layer FX position (the longitudinal direction position and the width direction position of the optical component layer FX) are stored in association with each other (omitted in the drawing).

The control device 25 acquires the optical axis data (inspection data of the in-plane distribution of the optical axis) of each of the inspection points CP from the storage device (omitted from the drawing) to detect the optical component layer FX of the portion in which the layer FXm is cut out. The average optical axis direction of the area divided by the line CL.

For example, as shown in FIG. 10B, the angle (offset angle) between the optical axis direction and the edge line EL of the optical component layer FX is detected at the checkpoint CP each time, with the maximum angle (maximum offset angle) among the offset angles. As θmax, when the minimum angle (minimum offset angle) is θmin, the average value θmid (=(θmax+θmin)/2) of the maximum offset angle θmax and the minimum offset angle θmin is detected as the average offset angle. Next, the average offset angle θmid direction of the edge line EL with respect to the optical component layer FX is detected as the average optical axis direction of the optical component layer FX. Further, the offset angle is calculated, for example, by the edge line EL of the optical component layer FX, the counterclockwise direction being a positive angle, and the clockwise direction being a negative angle.

Then, according to the average optical axis direction of the optical component layer FX detected by the above method, the bonding position (relative bonding position) with respect to the layer FXm of the liquid crystal panel P is determined so as to be long with respect to the display region P4 of the liquid crystal panel P. The edge or short side is at the target angle. For example, in the case where the optical axis direction of the optical component F1X is set to be 90° with respect to the long side or the short side of the display region P4 according to the design specification, the average optical axis direction of the optical component layer FX is longer than the display region P4. The layer FXm is bonded to the liquid crystal panel P with the side or the short side at 90°.

In the present embodiment, the moving device 44 and the driving device 42 are independently controlled to apply a moment to the bonding head 32. Thereby, the balance of the tensile stress received from the first layer sheet F1m adhered to the bonding head 32 to the bonding head side can be adjusted at the liquid crystal panel P. Therefore, in the present embodiment, the amount of deformation generated in the liquid crystal panel P after the first layer sheet F1m is bonded can be maintained within a certain range.

The cutting device (the first cutting device 51 and the second cutting device 52) detects the outer peripheral edge of the display region P4 of the liquid crystal panel P by a detecting mechanism such as a camera, and cuts the patch continuously along the outer periphery of the display region P4. The layer FXm of the liquid crystal panel P is joined. The outer peripheral edge of the display region P4 is detected by photographing the end portion of the liquid crystal panel P, the alignment mark provided on the liquid crystal panel P, or the outermost edge of the black matrix provided in the display region P4. A frame portion G (refer to FIG. 3) having a specific width is disposed on the outer side of the display region P4, and is used for arranging a sealant or the like for bonding the first substrate and the second substrate of the liquid crystal panel P within the width of the frame portion G The cutting of the layer sheet FXm is performed by the cutting device (the first cutting device 51 and the second cutting device 52).

Further, the method of detecting the in-plane average optical axis direction of the optical component layer FX is not limited to the above method. For example, one or a plurality of checkpoints CP are selected from a plurality of checkpoints CP (refer to FIG. 10A) set in the width direction of the optical component layer FX, and the optical axis direction and the optical are detected for each of the selected checkpoints CP. The angle (offset angle) of the edge line EL of the component layer FX. Then, an average value of the offset angles of the selected one or a plurality of checkpoints CP in the optical axis direction is detected. As the average offset angle, the edge line EL of the optical component layer FX and the average offset angle can also be detected. The direction of the clip is the average optical axis direction of the optical component layer FX.

As described above, the film bonding system 2 of the present embodiment includes the bonding apparatus (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding apparatus 18), and the width is from the roll drum R1. The strip-shaped optical component layer FX having a longer length than either one of the long side or the short side of the display region P4 of the liquid crystal panel P is rolled out, and the optical length is longer than the length of the other side of the display area P4 or the other side of the short side The component layer FX is cut to be a layer FXm, and then the layer FXm is bonded to the liquid crystal panel P as an optical component bonding body; and the cutting device (the first cutting device 51 and the second cutting device 52) The layer FXm bonded to the liquid crystal panel P is cut by the remaining portion disposed on the outer side of the facing portion of the display region P4 to form an optical component F1X corresponding to the size of the display region P4. Therefore, it is possible to design the optical unit F1X to have a higher precision when it is placed in the display area P4, and to reduce the frame portion G outside the display area P4 (refer to FIG. 3), and to achieve the purpose of expanding the display area and miniaturizing the device. Further, similarly to the first embodiment, when the layer sheet FXm is bonded, the bonding head 32 applies a moment to the layer sheet FXm, so that the amount of deformation of the liquid crystal panel P after the optical unit F1X is bonded can be suppressed.

Further, in the film bonding system 2, the first cutting device 51 and the second cutting device 52 are laser cutting machines, and the first cutting device 51 and the second cutting device 52 are connected to the same laser output. The device 53 may also divide the laser light output from the laser output device 53 into two, and supply it to the first cutting device 51 and the second cutting device 52. In this case, compared with the case where each of the first cutting device 51 and the second cutting device 52 is connected to each of the laser output devices, the production system of the optical display device can be downsized.

The present invention is not limited to the above-described embodiments, and various changes in the configuration, configuration, shape, size, number, and arrangement of elements may be made without departing from the scope of the invention. For example, in the above-described embodiment, the case where the moving device 44 moves the bonding head 32 to cause the liquid crystal panel P and the bonding head 32 to relatively move, for example, may be used. The bonding head 41 is moved to close the head 32 to form a structure in which the liquid crystal panel P is relatively moved relative to the bonding head 32.

Further, in the above-described embodiment, the bonding layer sheet F5 or the layer sheet (the first layer sheet F1m) adhered to the holding surface 32a of the bonding head 32 is not deformed in advance, or the deformation is extremely small. It is explained as a premise. However, since the bonding layer sheet F5 is usually wound up from the roll drum R1 around which the first optical component layer F1 is wound, the bonding layer sheet F5 is often deformed (warped). When the deformed bonding layer sheet F5 is applied to both surfaces of the liquid crystal panel P, an upper deformation state in which the warpage of the liquid crystal panel P is warped downward (as shown in FIGS. 11A to 11C) may occur. (as shown in Figs. 12A to 12C) an inverted state in which the warp is convex toward the upper side.

The case where the liquid crystal panel P is deformed upward is the three modes shown in FIGS. 11A to 11C. In addition, in the case of the 11A to 11C, the bonding layer sheet bonded to the display surface side of the liquid crystal panel P is referred to as the front side layer sheet FS, and the bonding layer sheet bonded to the opposite side (reverse side) is attached. It is called the back side layer RS.

Fig. 11A shows that the front side layer sheet FS has a relatively strong deformation on the liquid crystal panel P side (hereinafter, referred to as a strong positive warpage), and the rear side layer sheet RS is on the opposite side of the liquid crystal panel P. There is a case where the deformation is relatively weak (hereinafter, referred to as a case of weak back warping). Further, Fig. 11B shows that the front side layer sheet FS has positive warpage, and the rear side layer sheet RS has the same strength of warpage. Further, the 11C chart shows that the front side sheet FS has a relatively weak weak back warp, and the back side sheet RS has a relatively strong strong back warpage.

In the case shown in FIGS. 11A to 11C, the warping direction and the strength relationship between the front side sheet FS and the rear side sheet RS are presumed to occur on the liquid crystal panel after double-sided bonding. The case of deformation.

In the combination of the upper deformation as shown in FIGS. 11A to 11C, when the front side layer FS and the rear side layer sheet RS are bonded together, when the front side layer sheet FS is bonded to the liquid crystal panel P The above-described moment is applied to the bonding head 32, and the above-described moment is applied to the bonding head 32 when the rear side layer RS is attached to the liquid crystal panel P. As a result, it has been confirmed that the deformation of the liquid crystal panel P to which the front side layer FS and the back side layer sheet RS are bonded can be suppressed.

On the other hand, in the case where the above-described moment is applied only to the reverse side of the liquid crystal panel P or when the double-sided bonding is performed, it has been confirmed that the deformation effects of the front side layer FS and the rear side layer sheet RS cannot be corrected, and The liquid crystal panel P after the bonding is deformed.

In the case where the liquid crystal panel P is deformed upward (refer to FIGS. 11A to 11C), the above-described moment is applied when the bonding layer sheet F5 is bonded to one surface (display surface) of the liquid crystal panel P, and the bonding layer is applied. When the sheet F5 is attached to the other surface (reverse surface) without applying the above-described moment, the deformation occurring at the liquid crystal panel P after the bonding can be suppressed.

Further, the case where the liquid crystal panel P is in an inverted shape is the three modes shown in FIGS. 12A to 12C. In addition, in the 12th to 12th drawings, the bonding layer sheet F5 bonded to the display surface side of the liquid crystal panel P is referred to as a front side layer sheet FS, and the bonding layer sheet F5 bonded to the opposite side is referred to as a rear layer. Side layer sheet RS.

Fig. 12A shows that the front side sheet FS has a relatively weak weak positive warpage, and the back side layer sheet RS has a relatively strong strong positive warpage. Further, Fig. 12B shows that the front side sheet FS has a reverse warp and the rear side sheet RS has a positive warpage of the same strength. Further, Fig. 12C shows that the front side sheet FS has a relatively strong strong back warpage, and the back side layer sheet RS has a relatively weak weak back warp.

In the case shown in FIGS. 12A to 12C, it is presumed that the above-described inverted shape is generated in terms of the warping direction and the strength relationship between the front side sheet FS and the rear side sheet RS.

In the combination of the inversion shape as shown in FIGS. 12A to 12C, when the front side layer FS and the rear side layer sheet RS are bonded together, when the front side layer sheet FS is bonded to the liquid crystal panel P, The above torque is not applied to the bonding head 32, and the above moment is applied to the bonding head 32 when the rear side layer RS is attached to the liquid crystal panel P. As a result, it has been confirmed that the deformation of the liquid crystal panel P to which the front side layer FS and the back side layer sheet RS are bonded can be suppressed.

On the other hand, in the case where only the front surface of the liquid crystal panel P or the above-described moment is applied to the double-sided bonding, it has been confirmed that the deformation effects of the front side layer FS and the rear side layer sheet RS cannot be corrected, but The liquid crystal panel P after the bonding is deformed.

In the case where the liquid crystal panel P is deformed upward (refer to FIGS. 12A to 12C), the above-described moment is applied when the bonding layer sheet F5 is bonded to one surface (reverse surface) of the liquid crystal panel P, and the laminated layer is applied. When the F5 is attached to the other surface (display surface) without applying the above torque, deformation of the liquid crystal panel P after bonding can be suppressed.

As described above, according to the present invention, the above-described moment can be appropriately applied when the bonding layer sheet F5 is bonded to at least one surface of the liquid crystal panel P according to the warpage characteristics generated in advance at the bonding layer sheet F5, so as to suppress the liquid crystal panel after bonding. The amount of deformation produced at P.

Further, in the above-described embodiment, as shown in Fig. 7, it is to be noted that the holding unit 39 is provided only on one end side (the left end side in Fig. 7) of the bonding layer sheet F5 which is bonded to the liquid crystal panel P, and is attached. The closing head 32 applies this moment to the case where the holding member 39 is in contact with the end surface of the liquid crystal panel P, but the present invention is not limited thereto. In other words, the holding unit 39 may be disposed on the other end side (the right end side in FIG. 7) to which the liquid crystal panel P is bonded to the bonding layer sheet F5, or on both sides (the left end side of the liquid crystal panel P in FIG. 7) And the right end side). In this case, the bonding head 32 can also apply the moment so that the end surface of the liquid crystal panel P comes into contact with the holding member 39 provided on the other end side. That is, the bonding head 32 can be applied to the liquid crystal panel P in the opposite direction of the applied torque (the direction opposite to the leftward arrow shown in FIG. 7) as shown in FIG. The amount of deformation generated at the rear of the liquid crystal panel P. Further, in the case where the moment is applied to the opposite direction as in the case of Fig. 7, for example, the liquid crystal panel P of the bonding table 41 has a strong adsorption effect, and even if a moment is applied, the liquid crystal panel P In the case where the adsorption position on the bonding table 41 does not vary, the holding member 39 is not necessarily required.

Further, the size of the remaining portion of the layer sheet FXm (beyond the size of the outer portion of the liquid crystal panel P) can be appropriately set in accordance with the size of the liquid crystal panel P. For example, in the case where the layer FXm is applied to a medium-sized and small-sized liquid crystal panel P of 5 inches to 10 inches, the interval between one side of the layer FXm and one side of the liquid crystal panel P is formed on each side of the layer FXm. Set in the range of 2mm to 5mm in length.

Hereinafter, a film bonding system according to a third embodiment of the present invention will be described with reference to Figs. 13 to 15 . Further, in the drawings from Fig. 13 to Fig. 15, for the sake of convenience of illustration, the drawing of the second layer sheet F2m is omitted. In the present embodiment, the same components as those of the film bonding system 2 described in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. Further, in the present embodiment, the remaining portion outside the bonding surface is cut from the layer sheet FXm bonded to the liquid crystal panel P to form the optical module F1X.

The film bonding system of the present embodiment includes a first detecting device 91 (refer to Fig. 14). The first detecting device 91 is provided on the panel transport downstream side of the second bonding carry-in/place position 11d. The first detecting device 91 detects the edge of the bonding surface of the liquid crystal panel P and the first layer sheet F1m (hereinafter referred to as the first bonding surface).

For example, as shown in Fig. 13, the first detecting device 91 detects the edge ED of the first bonding surface SA1 in the four inspection areas CA provided on the conveying path of the upstream conveyor 6 (the outer periphery of the bonding surface) edge). Each of the inspection regions CA is disposed at a position corresponding to the four corner portions of the first bonding surface SA1 having a rectangular outer shape. The edge ED is detected for each liquid crystal panel P conveyed on the production line. The edge ED data detected by the first detecting device 91 is stored in the storage device 24 (refer to Fig. 8).

Further, the arrangement position of the inspection area CA is not limited to this. For example, each inspection area CA may be disposed at a position corresponding to a part of each side of the first bonding surface SA1 (for example, a central portion of each side).

Fig. 14 is a schematic view of the first detecting device 91. As shown in Fig. 14, the first detecting device 91 includes an illumination light source 94 that illuminates the bright edge ED, and an imaging device 93 that is disposed such that the normal direction of the first bonding surface SA1 is closer to the edge ED. In a state in which the inside of the first bonding surface SA1 is inclined, a screen on which the edge ED is imaged from the side of the first layer sheet F1m to which the first optical component bonding body PA1 is bonded is attached.

The illumination light source 94 and the imaging device 93 are disposed in each of the four inspection areas CA (corresponding to the four corners of the first bonding surface SA1) shown in FIG.

Preferably, the angle θ between the normal line of the first bonding surface SA1 and the normal line of the imaging surface 93a of the photographing device 93 (hereinafter referred to as the tilt angle θ of the photographing device 93) can be set as a deviation when the panel is broken apart. Or the burrs or the like do not enter the shooting field of the photographing device 93. For example, in the case where the end surface of the second substrate P2 is shifted to the outside of the end surface of the first substrate P1, the inclination angle θ of the photographing device 93 can be set so as not to enter the end edge of the second substrate P2 into the photographing field of view of the photographing device 93.

Preferably, the inclination angle θ of the photographing device 93 can be set in accordance with the distance H between the first bonding surface SA1 and the center of the imaging surface 93a of the photographing device 93 (hereinafter referred to as the height H of the photographing device 93). For example, when the height H of the imaging device 93 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 93 can be preferably set to an angle in the range of 5° or more and 20° or less. However, in the case where the amount of deviation is known empirically, the height H of the photographing device 93 and the tilt angle θ of the photographing device 93 can be obtained from the amount of deviation. In the present embodiment, the height H of the imaging device 93 is set to 78 mm, and the inclination angle θ of the imaging device 93 is set to 10°.

The illumination light source 94 is fixed to the imaging device 93 and disposed in each of the inspection areas CA.

Further, the illumination light source 94 and the photographing device 93 may be arranged to be movable along the edge ED of the first bonding surface SA1. In this case, one set of the illumination light source 94 and the photographing device 93 may be provided. Further, by this, the illumination light source 94 and the imaging device 93 can move at a position where the edge ED of the first bonding surface SA1 can be easily photographed.

The illumination light source 94 is disposed on the opposite side to the side of the first layer sheet F1m to which the first optical component bonding body PA1 is bonded. The illumination light source 94 is disposed in a state in which the normal direction of the first bonding surface SA1 is inclined toward the outside of the first bonding surface SA1 from the edge ED. In the present embodiment, the optical axis of the illumination source 94 is parallel to the normal line of the imaging surface 93a of the imaging device 93.

In addition, the illumination light source may be disposed on the side of the first optical component bonding body PA1 to which the first layer F1m is bonded.

Further, the optical axis of the illumination light source 94 and the normal line of the imaging surface 93a of the imaging device 93 may also intersect each other with a slight inclination.

Further, as shown in Fig. 15, the imaging device 93 and the illumination light source 94 may be disposed at positions overlapping the edge ED along the normal direction of the first bonding surface SA1. The distance H1 between the first bonding surface SA1 and the center of the imaging surface 93a of the imaging device 93 (hereinafter referred to as the height H1 of the imaging device 93) can preferably be set to easily detect the edge of the first bonding surface SA1. The location of the ED. For example, it is preferable that the height H1 of the photographing device 93 can be set in a range of 50 mm or more and 150 mm or less.

The cutting position of the first layer sheet F1m is adjusted based on the detection result of the edge ED of the first bonding surface SA1. The control device 25 (refer to FIG. 8) acquires the edge ED data of the first bonding surface SA1 stored in the storage device 24 (refer to FIG. 8) to determine the cutting position of the first layer F1m, so that the first The optical module F11 does not exceed the size of the outer side of the liquid crystal panel P (outside of the first bonding surface SA1). The first cutting device 51 cuts the first layer sheet F1m at the cutting position determined by the control device 25.

Returning to Fig. 8 and Fig. 9, the first cutting device 51 is provided on the downstream side of the panel conveyance of the first detecting device 91. The first cutting device 51 cuts off the remaining portions disposed on the outer side of the portion corresponding to the first bonding surface SA1 from the first layer F1m and the second layer sheet F2m bonded to the liquid crystal panel P, respectively. The first optical component F11 composed of the first optical component layer F1 and the second optical component F12 composed of the second optical component layer F2 are formed as optical components corresponding to the size of the first bonding surface SA1.

Here, "the size corresponding to the first bonding surface SA1" is displayed as an area larger than the display area P4 and smaller than the outer shape of the liquid crystal panel P (the outline shape in the plan view), and the electronic component mounting portion is avoided. The size of the area of the functional part.

After the first layer F1m and the second layer F2m are attached to the liquid crystal panel P, the first optical component F11 and the second optical component F12 are not separated, so as to obtain the first bonding surface SA1. The outer peripheral shape conforms to the first optical component F11 and the second optical component F12. Moreover, the cutting work of the first layer F1m and the second layer F2m is also simplified.

The remaining portions of the first layer F1m and the second layer F2m are cut from the second optical component bonding body PA2 by the first cutting device 51 to form the first optical component F11 and the second optical component F12. The third optical component is bonded to the surface of one of the front/reverse sides of the liquid crystal panel P. At this time, the third optical component bonding body PA3 and the portion corresponding to the first bonding surface SA1 (each optical component (the first optical component F11, the second optical component F12)) are left in a frame-like layer ( The remaining portions of the first layer F1m and the second layer F2m) are separated. The remaining portion cut from the first layer sheet F1m and the second layer sheet F2m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings.

Here, the "portion corresponding to the first bonding surface SA1" is a region that is larger than the display region P4 and smaller than the outer shape of the liquid crystal panel P, and is a region that avoids a functional portion such as an electronic component mounting portion. In this embodiment, in the liquid crystal panel P having a rectangular outer shape in plan view, the remaining portions are cut off by laser along the outer periphery of the liquid crystal panel P at three sides other than the functional portion, which is equivalent to the functional portion. On one side, the remaining portion is cut by laser from a position outside the liquid crystal panel P to the display region P4 side. For example, in the case of a bonding surface of a thin film transistor (TFT) substrate corresponding to the first bonding surface SA1, it may be from the side of the liquid crystal panel P at the side corresponding to the functional portion. At the edge (except for the functional portion), the cutting is performed at a position shifted by a certain distance toward the display region P4 side. Further, the region in which the functional portion is included in the liquid crystal panel P (for example, the entire liquid crystal panel P) is not limited to being bonded to the layer. For example, the layer sheet may be attached to the liquid crystal panel P in advance to avoid the area of the functional portion, and thereafter, at three sides of the liquid crystal panel P having a rectangular outer shape in plan view except for the functional portion The remaining portion is cut by laser along the periphery of the liquid crystal panel P.

Further, the film bonding system is provided with a second detecting device 92 (refer to Fig. 14). The second detecting device 92 is provided on the panel transport downstream side of the third bonding carry-in/place position 16c. The second detecting device 92 detects the edge of the bonding surface of the liquid crystal panel P and the third layer sheet F3m (hereinafter referred to as the second bonding surface). The edge data detected by the second detecting device 92 is stored in the storage device 24 (refer to Fig. 8).

The cutting position of the third layer sheet F3m is adjusted based on the detection result of the edge of the second bonding surface. The control device 25 (refer to FIG. 8) obtains the edge data of the second bonding surface stored in the storage device 24 (refer to FIG. 8) to determine the cutting position of the third layer F3m, so that the third optical component F13 does not exceed the size of the outer side of the liquid crystal panel P (outside of the second bonding surface). The second cutting device 52 cuts the third layer sheet F3m at the cutting position determined by the control device 25.

The second cutting device 52 is provided on the downstream side of the panel conveyance of the second detecting device 92. The second cutting device 52 cuts off the remaining portion disposed outside the portion corresponding to the second bonding surface from the third layer sheet F3m bonded to the liquid crystal panel P to form a size corresponding to the second bonding surface. Optical component (third optical component F13).

Here, the "corresponding to the size of the second bonding surface" is displayed as an area larger than the display area P4 and smaller than the outer shape of the liquid crystal panel P (the contour shape in the plan view), and the function of the electronic component mounting portion is avoided. Part of the area size. In the present embodiment, the size of the second substrate P2 is outside.

The remaining portion of the third ply F3m is cut from the fourth optical component bonding body PA4 by the second cutting device 52 to form the third optical component F13 to be bonded to the other side of the front/rear surface of the liquid crystal panel P. The first optical component F11 and the second optical component F12 are bonded to the fifth optical component bonding body PA5 on the side of the front/rear side of the liquid crystal panel P. At this time, the fifth optical component bonding body PA5 is separated from the remaining portion of the frame-shaped third layer sheet F3m after the portion corresponding to the second bonding surface (third optical component F13) is cut. The remaining portion cut from the third layer sheet F3m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings.

Here, the "portion corresponding to the second bonding surface" is a region which is larger than the display region P4 and smaller than the outer shape of the liquid crystal panel P, and is a region in which the functional portion such as the electronic component mounting portion is avoided. In the present embodiment, the remaining portions are cut by laser along the outer periphery of the liquid crystal panel P at four side edges of the liquid crystal panel P having a rectangular outer shape in plan view. For example, in the case where the portion corresponding to the second bonding surface is a bonding surface of a color filter (CF, Color Filter) substrate, since it is not a portion corresponding to the functional portion, on the four sides of the liquid crystal panel P The edge is cut along the periphery of the liquid crystal panel P.

In the present embodiment, the first cutting device 51 is along the outer peripheral edge of the bonding surface (first bonding surface SA1) of the liquid crystal panel P and the first layer sheet F1m captured by the imaging device 93, and the first layer F1m is used. And the second layer sheet F2m is cut off. The second cutting device 52 cuts the third layer sheet F3m along the outer peripheral edge of the bonding surface (second bonding surface) of the liquid crystal panel P and the third layer sheet F3m which are imaged by the image capturing device 93.

As described above, according to the film bonding system of the present embodiment, the layer sheet FXm larger than the display region P4 is bonded to the liquid crystal panel P, and the liquid crystal panel P and the layer sheet FXm to which the layer sheet FXm is bonded are detected. The outer periphery of the bonding surface is cut from the remaining portion of the layer FXm bonded to the liquid crystal panel P so as to be disposed on the outer side of the portion corresponding to the bonding surface, so that a surface corresponding to the bonding surface can be formed on one surface of the liquid crystal panel P. Dimensional optical component F1X. Thereby, it is possible to design the optical unit F1X to correspond to the display area P4 with better precision, and to reduce the frame portion G outside the display area P4, thereby achieving the purpose of expanding the display area and miniaturizing the device.

Further, in the film bonding system of the above-described embodiment, the peripheral edge of the bonding surface is detected for each of the plurality of liquid crystal panels P by using the detecting means, and the bonding is set to each of the respective peripheral edges based on the detected outer periphery. The cutting position of the layer of the liquid crystal panel P. Thereby, the optical component can be cut according to the required size without considering the individual difference in the size of the liquid crystal panel P or the ply, so that there is no quality deviation caused by the individual difference in the size of the liquid crystal panel P or the ply, and the display can be reduced. The frame portion around the area P4 achieves the purpose of expanding the display area and miniaturizing the machine.

It is to be understood that the description of the preferred embodiments of the present invention is intended to Additions, omissions, substitutions, and other changes can be made without departing from the scope of the invention. Therefore, the invention should not be considered as limited by the foregoing description, but should be limited by the scope of the claims.

1,2. . . Film bonding system

5. . . Main conveying equipment

5a. . . starting point

5b. . . end

5c. . . Rack

6. . . First auxiliary conveying equipment

6a. . . First starting position

6b. . . First end position

7. . . Second auxiliary conveying equipment

7a. . . Second starting position

7b. . . Second end position

8. . . First conveying device

9. . . Cleaning device

11. . . First rotary machine

11a. . . First turntable starting position

11b. . . First turntable end position

11c. . . First fit out/loading position

11d. . . Second fit out/loading position

11e. . . Film peeling position

12. . . Second transfer device

13. . . First bonding device

14. . . Film stripping device

15. . . Second bonding device

16. . . Second rotary machine

16a. . . Second turntable starting position

16b. . . Second turntable end position

16c. . . Third fit out/loading position

16d. . . Fit inspection position

17. . . Third transfer device

18. . . Third bonding device

19. . . Inspection device

twenty one. . . Fourth transfer device

twenty two. . . Fifth transfer device

twenty four. . . Storage device

25. . . Control device

31. . . Ply conveying device

31a. . . Roll out

31b. . . Cutting device

31c. . . Blade

31d. . . Coiling department

31e. . . Separation layer peeling position

32. . . Fitting head

32a. . . Keep face

34. . . First detection camera

35. . . Second detection camera

36. . . Third detection camera

37. . . Fourth detection camera

38. . . Fifth detection camera

39. . . Holding component

40. . . Fitting department

41. . . Laminating table

42. . . Drive unit

43. . . Arm

44. . . Mobile device

44a. . . guide

44b. . . Power department

51. . . First cutting device

52. . . Second cutting device

53. . . Laser output device

91. . . First detecting device

92. . . Second detecting device

93. . . Photography device

93a. . . Shooting surface

94. . . Illumination source

CA. . . Inspection area

CL. . . Transverse line

CP. . . checking point

ED. . . End edge

EL. . . Edge line

F. . . Transport direction

F1. . . First optical component layer

F2. . . Second optical component layer

F3. . . Third optical component layer

FX. . . Optical component layer

FXm. . . Layer

F1a. . . Optical component body

F2a. . . Adhesive layer

F3a. . . Separation layer

F4a. . . Surface protection film

F11. . . First optical component

F12. . . Second optical component

F13. . . Third optical component

F1X. . . Optical component

F5. . . Fitting layer

F6. . . Polarizer

F7. . . First film

F8. . . Second film

F1m. . . First layer

F2m. . . Second layer

F3m. . . Third layer

FS. . . Front side layer

G. . . Border part

H. . . height

H1. . . height

P. . . LCD panel

P1. . . First substrate

P2. . . Second substrate

P3. . . Liquid crystal layer

P4. . . Display area

PA1. . . First optical component bonding body

PA2. . . Second optical component bonding body

PA3. . . Third optical component bonding body

PA4. . . Fourth optical component bonding body

PA5. . . Fifth optical component bonding body

R1. . . Roll roller

R2. . . Separation roller

RS. . . Posterior layer

SA1. . . First fit surface

Θmax. . . Maximum offset angle

Θmin. . . Minimum offset angle

Θmid. . . Average offset angle

Fig. 1 is a schematic configuration diagram of a film bonding system according to the first embodiment. Fig. 2 is a plan view showing the structure of a film bonding system of the first embodiment. Fig. 3 is a cross-sectional view taken along line A-A in Fig. 2. Fig. 4 is a cross-sectional view showing the optical component layer of the embodiment. Figure 5 is a plan view of the above film bonding system. Figure 6 is a schematic side view of the first bonding apparatus. Fig. 7 is a view for explaining the bonding operation of the first bonding apparatus. Fig. 8 is a schematic configuration diagram of a film bonding system of a second embodiment. Fig. 9 is a plan view showing the structure of a film bonding system of a second embodiment. Fig. 10A is a view showing an example of a method of determining the bonding position of the optical component layer with respect to the liquid crystal panel. Fig. 10B is a view showing an example of a method of determining the bonding position of the optical component layer with respect to the liquid crystal panel. Fig. 11A is an explanatory diagram of three modes of deformation on the liquid crystal panel. Fig. 11B is an explanatory diagram of three modes of deformation on the liquid crystal panel. Fig. 11C is an explanatory diagram of three modes of deformation on the liquid crystal panel. Fig. 12A is an explanatory diagram of three modes of the inverse shape generated by the liquid crystal panel. Fig. 12B is an explanatory diagram of three modes of the inverse shape generated by the liquid crystal panel. Fig. 12C is an explanatory diagram of three modes of the inverse shape generated by the liquid crystal panel. Figure 13 is a plan view showing the inspection project () of the edge of the bonding surface. Figure 14 is a schematic view of the detecting device. Fig. 15 is a view showing a modification of the detecting device.

13. . . First bonding device

25. . . Control device

31. . . Ply conveying device

31a. . . Roll out

31b. . . Cutting device

31c. . . Blade

31d. . . Coiling department

31e. . . Separation layer peeling position

32. . . Fitting head

32a. . . Keep face

34. . . First detection camera

35. . . Second detection camera

36. . . Third detection camera

40. . . Fitting department

41. . . Laminating table

42. . . Drive unit

43. . . Arm

44. . . Mobile device

44a. . . guide

44b. . . Power department

F1. . . First optical component layer

F11. . . First optical component

F3a. . . Separation layer

F5. . . Fitting layer

P. . . LCD panel

R1. . . Roll roller

R2. . . Separation roller

Claims (18)

A production system for an optical display device, which is a production system for attaching an optical component to an optical display device formed by an optical display component, comprising: a bonding device for a plurality of optical display components carried along a production line, The roll cylinder winds out a strip of optical component corresponding to the width of the display area of the optical display member, and cuts the optical component layer as the optical component for the length of the area to be displayed, and then attaches the optical component to The optical display unit has a bonding head, and an optical component that is held against the arcuate holding surface is attached to the optical display component; and the moving device is attached to the optical device. And moving the bonding head and the optical display component relative to each other; and driving the device to press the optical component to the bonding head of the optical display component along the holding surface It bends and moves obliquely. The production system of the optical display device according to claim 1, further comprising a control device for controlling the mobile device and the driving device; wherein the control device controls the driving device when performing the bonding The moving device generates a torque along a traveling direction of the optical component of the optical display member from a holding surface of the tilting moving bonding head. The production system of an optical display device according to claim 1 or 2, wherein the driving device performs calibration of a specific reference position with respect to a relative position of the optical component of the bonding head. The production system of an optical display device according to any one of claims 1 to 3, wherein the bonding device further comprises: a winding portion, the optical component layer is removed from the roll cylinder The separation layer is rolled out together; the cutting portion is used to cut the optical component layer as the optical component; and the peeling portion is used to peel the optical component from the separation layer. The production system of an optical display device according to claim 4, wherein the moving device causes the bonding head to be at a position where the optical component is peeled off from the separation layer and the optical component Move between the positions where the display parts are attached. The production system of an optical display device according to claim 5, wherein the peeling portion peels the bonding surface of the optical component from the optical display member downward from the separation layer; and In the moving device, the bonding head is held by the upper surface on the opposite side of the bonding surface and held on the holding surface, and the bonding surface is directed downward, and is moved between the peeling position and the bonding position. A production system for an optical display device, which is a production system for attaching an optical component to an optical display device formed by an optical display component, comprising: a bonding device that has a width from a roll of the optical display component; A strip-shaped optical component layer having a longer length on either side of the long side or the short side is rolled out, and the optical component layer is cut as a layer with a length longer than the other of the long side or the short side of the display area a sheet, and then the layer is bonded to the optical display member; and the cutting device cuts off the remaining portion disposed outside the opposite portion of the display region from the layer bonded to the optical display member. Forming an optical component corresponding to the size of the display area; wherein the bonding device has: a bonding head for bonding a layer that is held against the arc-shaped holding surface to the optical display component; When the layer is bonded, the bonding head and the optical display member are relatively moved; and the driving device is adapted to press the layer to the optical display portion when the layer is bonded And tilting movement of the bonding head along a curved surface of the holder. The production system of the optical display device of claim 7, further comprising a control device for controlling the mobile device and the driving device; wherein the control device controls the driving device when performing the bonding The moving device generates a moment along a traveling direction of the bonding head of the optical display member from a holding surface of the tilting moving contact head. The production system of an optical display device according to claim 7 or claim 8, wherein the bonding device further comprises: a winding portion, the optical component layer being separated from the separation roller by the winding roller The cutting portion is obtained by cutting the optical component layer as the layer while leaving the separation layer, and the peeling portion is peeled off from the separation layer. A method for producing an optical display device, which is a method for producing an optical display device formed by bonding an optical component to an optical display component, comprising: a bonding process for a plurality of optical display components carried along a production line, The roll cylinder winds out a strip of optical component corresponding to the width of the display area of the optical display member, and cuts the optical component layer as the optical component for the length of the area to be displayed, and then attaches the optical component to The optical display component; wherein the bonding process has the following steps: maintaining the step of holding the optical component against the arc-shaped retaining surface of the fitting head; and moving the step to retain the optical component The bonding head of the holding surface and the optical display member are relatively moved; and the driving step is such that the bonding head that presses the optical component to the optical display member is tilted and moved along the bending of the holding surface. The method for producing an optical display device according to claim 10, wherein the driving step and the moving step are performed by pressing the optical component to the optical display member and causing the bonding head And the optical display member is relatively moved to generate a moment along the advancing direction of the optical component of the optical display member from the holding surface during bonding. A method for producing an optical display device, which is a method for producing an optical display device formed by bonding an optical component to an optical display component, comprising: a bonding process, wherein a width of the optical roller is larger than a display area of the optical display component; A strip-shaped optical component layer having a longer length on either side of the long side or the short side is rolled out, and the optical component layer is cut as a layer with a length longer than the other of the long side or the short side of the display area a sheet, and then the layer is bonded to the optical display member; and the cutting process is performed by cutting the remaining portion disposed outside the opposite portion of the display region from the layer bonded to the optical display member. Forming an optical component corresponding to the size of the display area; wherein the bonding process has the following steps: maintaining the step of holding the layer sheet against the arc-shaped holding surface; moving the step to let the layer a bonding head held on the holding surface and the optical display member are relatively moved; and a driving step of pressing the layer to the bonding head of the optical display member along the holding surface Qu and tilting movement. The method for producing an optical display device according to claim 12, wherein the driving step and the moving step are performed by pressing the layer to the optical display member and causing the bonding head And the optical display member is relatively moved to generate a moment along the advancing direction from the holding surface to the layer of the optical display member at the time of bonding. A production system for an optical display device, which is a production system for attaching an optical component to an optical display device formed by an optical display component, comprising: a bonding device that has a width from a roll of the optical display component; A strip-shaped optical component layer having a longer length on either side of the long side or the short side is rolled out, and the optical component layer is cut as a layer with a length longer than the other of the long side or the short side of the display area a sheet, and then bonding the layer sheet to the optical display member; the detecting device detects the outer peripheral edge of the bonding surface between the optical display member to which the layer is bonded and the layer; and the cutting device The remaining portion disposed outside the corresponding portion of the bonding surface is cut from the layer bonded to the optical display member to form an optical component corresponding to the size of the bonding surface; wherein the bonding device The utility model has a bonding head which is attached to the optical display component by a layer which is held against the arc-shaped holding surface; and a moving device which is used for bonding the bonding head and the optical Display component And the driving device is adapted to press the layer to cause the bonding head of the optical display member to be tilted to move along the bending of the holding surface; and the cutting device is The outer peripheral edge of the bonding surface between the optical display member and the layer detected by the detecting device cuts the layer. The production system of the optical display device of claim 14, further comprising a control device for controlling the mobile device and the driving device; wherein the control device controls the driving device when performing the bonding The moving device generates a moment along a traveling direction of the bonding head of the optical display member from a holding surface of the tilting moving contact head. The production system of an optical display device according to claim 14 or 15, wherein the bonding device further comprises: a winding portion, the optical component layer being separated from the separation roller by the winding roller The cutting portion is obtained by cutting the optical component layer as the layer while leaving the separation layer, and the peeling portion is peeled off from the separation layer. A method for producing an optical display device, which is a method for producing an optical display device formed by bonding an optical component to an optical display component, comprising: a bonding process, wherein a width of the optical roller is larger than a display area of the optical display component; A strip-shaped optical component layer having a longer length on either side of the long side or the short side is rolled out, and the optical component layer is cut as a layer with a length longer than the other of the long side or the short side of the display area a sheet, and then bonding the layer to the optical display member; detecting the outer periphery of the bonding surface between the optical display member to which the layer is bonded and the layer; and cutting the system The remaining portion disposed outside the corresponding portion of the bonding surface is cut from the ply attached to the optical display member to form an optical component corresponding to the size of the display region; wherein the bonding process has the following steps: Maintaining the step of holding the layer sheet against the arc-shaped holding surface; and moving the step of holding the layer sheet on the holding surface of the bonding head and the optical display member for relative movement; And driving step of causing the bonding head of the optical display member to be tilted and moved along the bending of the holding surface; and the cutting engineering is along the optical display component detected by the inspection project The ply is cut off from the outer peripheral edge of the bonding surface between the plies. The method for producing an optical display device according to claim 17, wherein the driving step and the moving step are performed by pressing the layer to the optical display member and causing the bonding head And the optical display member is relatively moved to generate a moment along the advancing direction of the layer from the holding surface to the optical display member at the time of bonding.