TW201438291A - Manufacturing method for optical semiconductor device - Google Patents

Abstract

This manufacturing method for an optical semiconductor device is a manufacturing method for an optical semiconductor device that covers an optical semiconductor element by a phosphor sheet. The method is provided with: a prototyping step which creates and evaluates a prototype; a determination step which, on the basis of the evaluation of the prototype, determines manufacturing conditions for manufacturing an optical semiconductor device; and a manufacturing step which manufactures the optical semiconductor device by, on the basis of the manufacturing conditions determined in the determination step, covering the optical semiconductor element by a B-stage phosphor sheet, and advancing the phosphor sheet to the C-stage. The prototyping step is provided with: a varnish preparation step which prepares varnish including phosphor and curable resin; a B-stage step which forms a B-stage phosphor sheet from the varnish; a C-stage step which advances the phosphor sheet of the stage to a C-stage; and an evaluation step which evaluates the C-stage phosphor sheet.

Description

Optical semiconductor device manufacturing method

The present invention relates to a method of fabricating an optical semiconductor device, and more particularly to a method of fabricating an optical semiconductor device in which an optical semiconductor device is coated with a phosphor sheet.

Conventionally, it has been known to manufacture an LED device by coating and sealing an LED (Light-Emitting Diode) with a phosphor sheet containing a phosphor.

In such an LED device, the light emitted from the LED is wavelength-converted by the phosphor sheet, and the wavelength-converted light is irradiated to the outside.

The color temperature of the light irradiated from the LED device is different from the light-emitting wavelength of the LED, and further depends on, for example, the optical characteristics of the phosphor sheet, specifically, the shape of the phosphor sheet, and the phosphor sheet. The arrangement of the LEDs, the ratio of the phosphors in the phosphor sheet, and the like.

Therefore, the following method is proposed as a method of manufacturing an LED device that can illuminate light of a desired color temperature (for example, refer to Patent Document 1 below).

That is, in Patent Document 1 below, a phosphor sheet is preliminarily formed from a soft capsule material into which a phosphor is injected, and the phosphor sheet is covered with an LED mounted on the substrate, and thereafter, a voltage is applied to the LED. The LED is illuminated to determine the color temperature and to check.

During the inspection, if the color temperature is appropriate, the phosphor sheet is cured by heating after the inspection, and the LED and the substrate are permanently laminated.

On the other hand, if the color temperature is not appropriate during the inspection, the phosphor will be used after the inspection. The sheet is peeled off from the LED and the substrate, and then another type of phosphor sheet is overlaid on the LED mounted on the substrate, and then inspected in the same manner as described above.

In the method proposed in the following Patent Document 1, if the color temperature is not appropriate, the phosphor sheet is replaced with another phosphor sheet, and the LED mounted on the substrate can be directly reused, thereby improving the substrate. And the yield of LED.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-123915

However, in the method proposed in the above Patent Document 1, the phosphor layer before curing is hardened, and deformation such as warpage accompanying hardening shrinkage is apt to occur, and if so, light in the phosphor layer of light emitted from the LED is obtained. The length of the process changes. Therefore, the optical characteristics of the cured phosphor layer and the optical characteristics of the phosphor layer before curing at the time of inspection are largely deviated (varied).

As a result, there is an abnormality in that the target LED device is not easily obtained.

Further, in the method proposed in Patent Document 1, if the phosphor sheet before curing is cured before the inspection, the C-staged phosphor sheet is used when the color temperature is not appropriate during the inspection. After the substrate and the LED, there is an abnormality in the substrate and the LED that cannot be reused.

Further, according to the method proposed in the above Patent Document 1, in the final analysis, each product is inspected to determine whether the color temperature is appropriate, and the phosphor sheet is replaced at any time when it is not appropriate, so that the LED device cannot be sufficiently improved. Abnormal efficiency.

An object of the present invention is to provide a method for producing a semiconductor device which can improve the manufacturing efficiency and improve the precision of manufacturing conditions by using a B-stage phosphor sheet while obtaining a light having excellent light-emitting reliability. Semiconductor device.

A method of manufacturing an optical semiconductor device according to the present invention is characterized in that the photo-semiconductor element is coated with a phosphor sheet, and the photo-semiconductor element is provided with a trial production step for trial-manufacturing and evaluation of the prototype, and a determination step based on the prototype The evaluation determines a manufacturing condition for manufacturing the optical semiconductor device, and a manufacturing step of coating the optical semiconductor element by the phosphor sheet of the B stage based on the manufacturing condition determined by the determining step. In the optical semiconductor device in which the phosphor sheet is C-staged, the trial production step includes a varnish preparation step of preparing a varnish containing a phosphor and a curable resin, and the phosphor sheet is formed into a B-stage from the varnish. In the B-stage step, the C-stage step of the C-stage of the phosphor sheet of the B stage is performed, and the evaluation step of the phosphor sheet of the C stage is evaluated.

According to this method, the determination step determines the manufacturing conditions based on the evaluation of the prototype containing the C-stage phosphor sheet. Further, the manufacturing process is based on the manufacturing conditions determined by the determining step, and the optical semiconductor device is manufactured.

In this case, the phosphor sheet of the prototype to be evaluated is in the C stage. Therefore, in the production conditions, variations in optical characteristics caused by the above-described C-stage are considered in the phosphor sheet.

As a result, in the manufacturing step, an optical semiconductor device excellent in light-emitting reliability can be manufactured.

Further, since the optical semiconductor device is manufactured based on the manufacturing conditions determined based on the evaluation of the prototype, the optical semiconductor device can be mass-produced with excellent precision. Therefore, the manufacturing efficiency of the optical semiconductor device can be sufficiently improved.

Further, in the method of manufacturing an optical semiconductor device according to the present invention, preferably, in the step of step C, the photo-semiconductor element is coated on the phosphor sheet, and in the evaluation step, the firefly is evaluated. The optical sheet is coated with the optical semiconductor device of the optical semiconductor element.

According to this method, in the C-stage step, the optical semiconductor element is coated with the phosphor sheet. That is, the prototype of the optical semiconductor element coated with the phosphor sheet can be configured in the same manner as the optical semiconductor device as the actual product.

Therefore, the manufacturing conditions of the actual product can be determined based on the evaluation of the prototype which constitutes the same product as the actual product.

As a result, the manufacturing conditions can be determined with higher precision, and an optical semiconductor device having further excellent light-emitting reliability can be manufactured.

Further, in the method of manufacturing an optical semiconductor device according to the present invention, it is preferable that the trial production step further includes a trial condition determining step, which is determined based on the trial production conditions and evaluation information of the prototype before the current trial. Trial production conditions for the above prototypes.

According to this method, based on the trial conditions and evaluation information of the prototypes produced in the previous trial, the trial production conditions for the trial production of the prototypes are determined, so that the trial production conditions for the trial production before this time can be accumulated, and the trial production conditions based on the accumulation can be performed. Conditions and evaluation to improve the accuracy of manufacturing conditions. Therefore, an optical semiconductor device excellent in light emission reliability can be obtained.

According to the present invention, the manufacturing conditions can be determined with higher precision, and an optical semiconductor device having more excellent light-emitting reliability can be obtained. Moreover, the manufacturing efficiency of the optical semiconductor device can be sufficiently improved.

1‧‧‧LED device (laser diode device)

2‧‧‧Fuel sheet

3‧‧‧LED (Laser Diode)

4‧‧‧Release sheets

5‧‧‧Substrate

6‧‧‧Prototypes

7‧‧‧ Varnish

13‧‧‧Distributor

20‧‧‧ Press

21‧‧‧ tablet

51‧‧‧Mixer

52‧‧‧ Container

54‧‧‧heater

55‧‧‧ oven

S1‧‧‧Prototype steps

S2‧‧‧Decision steps

S3‧‧‧Manufacturing steps

S4‧‧‧Prototype conditions determination steps

S5‧‧‧ varnish preparation steps

S6‧‧‧B staged steps

S7‧‧‧C stage step

S8‧‧‧Evaluation steps

S9‧‧‧ Recording steps

S11‧‧‧ Varnish preparation steps

S12‧‧‧B staged steps

S13‧‧‧C stage step

Fig. 1 is a flow chart showing a method of manufacturing an LED device as an embodiment of a method of manufacturing an optical semiconductor device according to the present invention.

Figure 2 is a flow chart showing the trial production steps shown in Figure 1.

Figure 3 is a flow chart showing the manufacturing steps shown in Figure 1.

Figure 4 is a diagram showing the steps of preparing the varnish in the trial production step of Figure 2.

Figure 5 is a view showing the coating of the varnish of the B-stage step in the trial production step of Figure 2. formula.

Figure 6 is a diagram showing the heating of the varnish of the B-stage step in the trial production step of Figure 2.

Fig. 7 is a view showing a C-stage step in the trial production step of Fig. 2, that is, a state before the LED sheet is coated with the B-stage phosphor sheet.

Fig. 8 is a view for explaining a C-stage step in the trial production step of Fig. 2, that is, a state in which the LED is covered by the B-stage phosphor sheet.

Fig. 9 is a modification of the trial production step shown in Fig. 2.

A method of manufacturing the LED device 1 as an embodiment of the method of manufacturing an optical semiconductor device according to the present invention will be described with reference to Figs. 1 to 8 .

In the method of manufacturing the LED device 1, as shown in FIG. 8, a method of manufacturing the LED device 1 as an optical semiconductor device of the LED 3 as an optical semiconductor element by the phosphor sheet 2 is manufactured.

As shown in FIG. 1 , the manufacturing method of the LED device 1 includes a trial production step S1 in which the prototype 6 is experimentally produced and evaluated, and a determination step S2 in which the manufacturing conditions for manufacturing the LED device 1 are determined based on the evaluation of the prototype 6; In the manufacturing step S3, based on the manufacturing conditions determined by the determining step, the LED device 1 in which the LED 3 is covered by the B-stage phosphor sheet 2 and the phosphor sheet 2 is C-staged is manufactured.

[Trial production step S1]

The trial production step S1 uses the same manufacturing apparatus (manufacturing equipment) as the manufacturing step S3 described later. Further, in the trial production step S1, a relatively small amount of the prototype 6 is produced in comparison with the LED device 1 mass-produced in the manufacturing step S3. The number of the LED devices 1 which are experimentally produced in the trial production step S1 is, for example, 100 or less, preferably 10 or less, for example, one or more. That is, in the trial production step S1, the prototype 6 was experimentally produced on a small scale. Further, the number of the LED devices 1 is different from the number of the LEDs 3, and corresponds to one substrate 5, and the number is one.

As shown in FIG. 2, the trial production step S1 includes a trial condition determination step S4, a varnish preparation step S5 for preparing a varnish containing a phosphor and a curable resin, and a B-stage step of forming a B-stage phosphor sheet 2 from a varnish. S6, a C-stage step S7 of performing the C-stage of the B-stage phosphor sheet 2, and an evaluation step S8 of evaluating the C-stage phosphor sheet 2.

In the trial production step S1, the varnish preparation step S5, the B-stage step S6, and the C-stage step S7 are carried out based on the trial production conditions determined in the step S4 by the trial production conditions.

<Prototype conditions determination step S4>

The trial condition determination step S4 is a step of determining the trial production conditions for the trial production of the prototype 6 based on the trial conditions and evaluation information of the prototype 6 before the trial.

As information on the trial production conditions, for example, information on the varnish, information on the substrate 5, information on the phosphor sheet 2, and the like can be cited. As information about the varnish, for example, the blending ratio of the phosphor, the average value of the maximum length (the average particle diameter in the case of a spherical shape), and the absorption peak wavelength, for example, the type and viscosity of the curable resin in the A-stage, Ratio of blending, etc. The information on the substrate 5 may, for example, be a shape, a size, or a surface shape (the presence or absence of a concave portion) of the substrate 5, for example, the shape, size, luminescence peak wavelength, and per unit area of the LED 5 mounted on the substrate 5. The number of LEDs 3 to be mounted, the number of LEDs 3 mounted on each substrate 5, and the like. The information on the phosphor sheet 2 includes, for example, the coating conditions of the varnish 7 (specifically, the shape and thickness of the varnish 7), the heating conditions of the varnish 7 in the B-stage, and the irradiation of the active energy ray. The conditions are, for example, the heating conditions of the phosphor sheet 2 in the C-stage, the irradiation conditions of the active energy ray, the pressing conditions, the thickness of the C-stage phosphor sheet 2, and the like.

The information of the evaluation includes, for example, the color temperature of the prototype 6 and the total luminous flux of the prototype 6.

In order to determine the trial production conditions, based on the past trial conditions and evaluation information, the trial production conditions for the trial production are determined in such a manner as to be the target color temperature and/or total luminous flux in the LED device 1 of the prototype.

Further, the information on the trial production conditions and evaluations which have been subjected to the trial production before this time is stored in the memory of the computer or the like which manages the steps of the manufacturing method.

<varnish preparation step S5>

In the varnish preparation step S5, first, a phosphor and a curable resin are separately prepared, and these are mixed to prepare a varnish as a phosphor-containing curable resin composition.

The phosphor has a wavelength conversion function, and examples thereof include a yellow phosphor that converts blue light into yellow light, a red phosphor that converts blue light into red light, and the like.

Examples of the yellow phosphor include a phthalate phosphor such as (Ba, Sr, Ca) ₂ SiO ₄ :Eu, (Sr,Ba) ₂ SiO ₄ :Eu (BOS); Y ₃ Al ₅ O ₁₂ :Ce (YAG (yttrium-aluminum-garnet):Ce), Tb ₃ Al ₃ O ₁₂ :Ce (TAG (鋱-aluminum-garnet):Ce) has a garnet-type crystal structure A garnet-type phosphor, for example, an oxynitride phosphor such as Ca-α-SiAlON.

Examples of the red phosphor include a nitride phosphor such as CaAlSiN ₃ :Eu or CaSiN ₂ :Eu.

Examples of the shape of the phosphor include a spherical shape, a plate shape, and a needle shape. From the viewpoint of fluidity, a spherical shape is preferred.

The average value of the maximum length of the phosphor (the average particle diameter in the case of a spherical shape) is, for example, 0.1 μm or more, preferably 1 μm or more, and is, for example, 2 μm or less, preferably 100 μm or less.

The absorption peak wavelength of the phosphor is, for example, 300 nm or more, preferably 430 nm or more, and is, for example, 550 nm or less, preferably 470 nm or less.

The phosphors can be used alone or in combination.

The blending ratio of the phosphor is, for example, 0.1 part by mass or more, preferably 0.5 part by mass or more, for example, 80 parts by mass or less, and preferably 50 parts by mass or less, based on 100 parts by mass of the curable resin.

Examples of the curable resin include a two-stage reaction mechanism, and the use of the first The first-stage reaction is carried out in a B-stage (semi-hardening), and a two-stage hardening type resin in which C-stage (completely hardening) is carried out by the second-stage reaction.

The two-stage curing type resin is, for example, a two-stage curing type thermosetting resin which is cured by heating, for example, a two-stage curing type which is hardened by irradiation with an active energy ray (for example, ultraviolet rays, electron beams, etc.). Energy line curable resin or the like. Preferably, a two-stage hardening type thermosetting resin is mentioned.

Specifically, examples of the two-stage curing thermosetting resin include a polyoxymethylene resin, an epoxy resin, a polyimide resin, a phenol resin, a urea resin, a melamine resin, and an unsaturated polyester resin. From the viewpoint of light transmittance and durability, a two-stage curable polydecane resin is preferred.

Examples of the two-stage curable polydecane resin include a condensation reaction/addition reaction hardening type polyoxo resin having a condensation reaction and an addition reaction.

Examples of such a condensation reaction/addition reaction-curable polysulfonated resin include, for example, a polyoxyalkylene group containing a decyl alcohol group, an alkenyl group-containing trialkoxysilane, an organic hydrogen polyoxyalkylene group, and the like. The first condensation reaction/addition reaction hardening type polyoxynoxy resin of the condensation catalyst and the rhodium hydrogenation catalyst, for example, a decyl alcohol-based two-end polyoxyalkylene (see the following formula (1)), and an ethylene-containing system a telluride of a saturated hydrocarbon group (refer to the following formula (2)), a telluride containing an ethylenically unsaturated hydrocarbon group (refer to the following formula (3)), an organohydrogenpolyoxyalkylene oxide, a condensation catalyst, and a rhodium hydrogenation catalyst. The second condensation reaction/addition reaction hardening type polyoxyxylene resin, for example, a two-blocked stanol type eucalyptus oil, an alkenyl group-containing dialkoxyalkyl decane, an organic hydrogen polyoxy siloxane, a condensation catalyst, and a hydrazine The third condensation reaction/addition reaction hardening type polyoxymethylene resin of the hydrogenation catalyst contains, for example, an organic polyoxane having at least two olefin alkyl groups in one molecule, and at least two hydrogen groups in one molecule. 4th condensation reaction/addition reaction hardening type polyoxygen tree of organic polyoxyalkylene, hydrazine hydrogenation catalyst and hardening retarder The lipid is, for example, a first organopolyoxyalkylene having at least two ethylenically unsaturated hydrocarbon groups and at least two anthracene hydrogen groups in one molecule, no ethylenically unsaturated hydrocarbon group, and at least two in one molecule. Hydrogen-based second organic polyoxane, hydrazine hydrogenation The fifth condensation reaction/addition reaction hardening type polyoxyxylene resin of the medium and the hydrazine hydrogenation inhibitor, for example, the first organic polymerization containing at least two ethylene-based unsaturated hydrocarbon groups and at least two stanol groups in one molecule a 6th condensation reaction/addition of a phthalic oxide, a second organopolyoxane having no at least two anthracene hydrogen groups in one molecule, a hydrazine hydrogenation inhibitor, and a hydrazine hydrogenation catalyst The reaction-curable polydecene oxide resin, for example, a seventh condensation reaction/addition reaction hardening type polyoxyxylene resin containing a telluride, and a boride or an aluminum compound, for example, an eighth condensation containing a polyaluminoxane and a decane coupling agent Reaction/addition reaction hardening type polyoxyxylene resin or the like.

The condensation reaction/addition reaction-curable polydecane resin is preferably a second condensation reaction/addition reaction-curable polysulfonated resin, and is specifically described in Japanese Laid-Open Patent Publication No. 2010-265436, and the like. For example, polydimethyl methoxy oxane, vinyltrimethoxy decane, (3-glycidoxypropyl) trimethoxy decane, dimethyl polyoxy siloxane-copolymer copolymerized with a decyl alcohol group - methylhydrogenpolysiloxane, tetramethylammonium hydroxide and platinum-carbonyl complex. Specifically, the second condensation reaction/addition reaction hardening type polyfluorene oxide resin, for example, by first adding a telluride containing a vinyl unsaturated hydrocarbon group as a condensation raw material and a telluride containing an ethylenically unsaturated hydrocarbon group, Further, a condensation catalyst is added, followed by addition of an organohydrogenpolyoxyalkylene as an addition raw material, followed by addition of a ruthenium hydrogenation catalyst (addition catalyst).

Thereby, the A-stage 2-stage hardening type resin was prepared.

The viscosity of the A stage 2-stage hardening resin is, for example, 3000 mPa. Above s, preferably 5000 mPa. Above s, again, for example, 20000 mPa. Below s, preferably 11000 mPa. s below. Further, the viscosity of the two-stage hardening type resin of the A stage was adjusted to 25 ° C in the second-stage hardening type resin of the A stage, and the measurement was carried out at a number of revolutions of 99 s ^-1 using an E-shaped cone. The following viscosity was measured by the same method as described above.

The blending ratio of the second-stage curable resin is, for example, 30% by mass or more, preferably 40% by mass or more, more preferably 50% by mass or more, based on the curable resin composition (varnish) containing a phosphor, for example, 98% by mass or less, preferably 95% by mass or less, more preferably 90% by mass or less.

Further, the curable resin composition containing a phosphor may contain a filler and/or a solvent as needed.

Examples of the filler include organic fine particles such as polyfluorene oxide particles (specifically, polyfluorene oxide rubber particles), such as cerium oxide (for example, smoked cerium oxide), talc, alumina, and aluminum nitride. Inorganic fine particles such as tantalum nitride. Further, the average value of the maximum length of the filler (in the case of a spherical shape, the average particle diameter) is, for example, 0.1 μm or more, preferably 1 μm or more, and further, for example, 200 μm or less, preferably 100 μm or less. The fillers may be used singly or in combination. The blending ratio of the filler is, for example, 0.1 part by mass or more, preferably 0.5 part by mass or more, and further, for example, 70 parts by mass or less, preferably 50 parts by mass or less, based on 100 parts by mass of the curable resin.

The solvent may, for example, be an aliphatic hydrocarbon such as hexane, for example, an aromatic hydrocarbon such as xylene, for example, a vinyl methyl cyclic siloxane or a fluorene gas such as a two-terminal vinyl polydimethyl siloxane. . The solvent is blended into a curable resin composition containing a phosphor in a curable resin composition containing a phosphor to have a viscosity ratio of the following.

In order to prepare a curable resin composition containing a phosphor, a two-stage curable resin, a phosphor, a filler and/or a filler prepared as needed are prepared and mixed.

In order to prepare a curable resin composition containing a phosphor, specifically, as shown in FIG. 4, in the mixing container 52 provided with the agitator 51, based on the information regarding the varnish determined in the step S2, specifically, For example, based on the blending ratio of the phosphor, the absorption peak wavelength of the phosphor, and the average value of the maximum length (average particle diameter in the case of a spherical shape), for example, the type, viscosity, blending ratio, etc. of the curable resin in the A stage. , the above components are formulated. Then, the mixture is mixed using a stirrer 51.

Thereby, a varnish was prepared as the phosphor-containing curable resin composition of the A stage.

The viscosity of the varnish at 25 ° C, 1 atmosphere is, for example, 1,000 mPa. Above s, preferably 4,000 mPa. Above s, again, for example, 1,000,000 mPa. s below, Preferably it is 100,000 mPa. s below.

<B-stage step S6>

In the B-stage step S6 shown in Fig. 2, the B-stage phosphor sheet 2 is formed of a varnish.

In order to form the B-stage phosphor sheet 2, as shown in FIG. 5, for example, first, a varnish is applied to the surface of the release sheet 4.

The release sheet 4 may, for example, be a polymer film such as a polyethylene film or a polyester film (PET (polyethylene terephthalate)), for example, a ceramic sheet such as a metal foil. A polymer film is preferred. Further, a release treatment such as fluorine treatment may be performed on the surface of the release sheet 4. Moreover, the shape of the release sheet 4 is not particularly limited, and for example, it is formed in a substantially rectangular shape (including a short strip shape or a long strip shape) in plan view.

In order to apply the varnish to the surface of the release sheet 4, for example, a coating device such as a dispenser, an applicator, or a slit coater is used. Preferably, the dispenser 13 shown in Figure 5 is used.

In addition, the thickness of the phosphor sheet 2 is, for example, 10 μm or more, preferably 50 μm or more, and is, for example, 2000 μm or less, preferably 1000 μm or less, and the varnish is applied onto the release sheet 4 . .

The varnish 7 is applied in a substantially rectangular shape (including a short strip shape or a long strip shape) in a plan view, for example, a circular shape or the like. The varnish 7 constituting the above shape may be formed at a distance from each other.

Further, the varnish 7 can be applied to, for example, a release sheet 4 having a substantially rectangular shape (excluding a long shape) in a plan view, and a B-stage of the single-piece phosphor sheet 2 can be produced by the step B described above. Alternatively, it may be continuously applied to the strip-shaped release sheet 4, and the B-stage described later may be used to form a continuous phosphor sheet 2. Further, in the case where the phosphor sheet 2 is a one-piece type, that is, in the case where a plurality of pieces of the phosphor sheet 2 are produced in the same release sheet 4, the varnish 7 is intermittently coated. .

Thereafter, the applied varnish 7 is subjected to B-stage (semi-hardening).

When the varnish 7 contains a two-stage hardening type thermosetting resin, for example, the applied varnish 7 is heated.

In order to heat the varnish 7, for example, as shown in Fig. 6, an oven 55 having a heater 54 disposed opposite to the upper side and/or the lower side of the release sheet 4 is used.

The heating temperature is, for example, 40 ° C or higher, preferably 80 ° C or higher, more preferably 100 ° C or higher, and is, for example, 200 ° C or lower, preferably 150 ° C or lower, more preferably 140 ° C or lower. The heating time is, for example, 1 minute or longer, preferably 5 minutes or longer, more preferably 10 minutes or longer, and for example, 24 hours or shorter, preferably 1 hour or shorter, more preferably 0.5 hours or shorter.

Alternatively, when the varnish 7 contains a two-stage curable active energy ray-curable resin, the varnish 7 is irradiated with an active energy ray. Specifically, the varnish 7 is irradiated with ultraviolet rays using an ultraviolet lamp or the like.

Thereby, the varnish 7 is subjected to B-stage (semi-hardening) on the one hand, and not C-staged (completely hardened) on the other hand, that is, the phosphor sheet 2 before the C-stage (completely hardened) is formed, that is, B-stage phosphor sheet 2.

Thereby, as shown in FIG. 6, the B-stage phosphor sheet 2 laminated on the surface of the release sheet 4 is manufactured.

Specifically, based on the coating conditions (specifically, the shape and thickness of the varnish 7) determined in the step S2, the heating conditions of the varnish 7 in the B-stage, and the irradiation conditions of the active energy ray, The B-stage phosphor sheet 2 is formed from the varnish 7.

The compressive elastic modulus of the phosphor sheet 2 produced in the sheet production step S3 at 25 ° C is, for example, 0.040 MPa or more, preferably 0.050 MPa or more, more preferably 0.075 MPa or more, and still more preferably Further, it is 0.100 MPa or more, and is, for example, 0.145 MPa or less, preferably 0.140 MPa or less, more preferably 0.135 MPa or less, still more preferably 0.125 MPa or less.

When the compression elastic modulus exceeds the above upper limit, in the C-staged step S7, when the LED 3 is covered by the phosphor sheet 2, when the LED 3 is bonded and connected to the substrate 5, a wire (not shown) occurs. The situation of deformation.

On the other hand, if the compression elastic modulus is less than the above lower limit, it becomes difficult to secure the shape of the phosphor sheet 2. That is, there is a case where the varnish 7 does not form the shape of the phosphor sheet 2.

Thereafter, the continuous B-stage phosphor sheet 2 may be cut into a specific shape together with the continuous release sheet 4 as needed to form a one-piece phosphor sheet 2.

<C-stage step S7>

In the C-stage step S7 shown in FIG. 2, as shown in FIGS. 7 and 8, first, the LED 3 is covered by the B-stage phosphor sheet 2, and secondly, the B-stage phosphor sheet 2 is made. Perform C-stage.

In order to cover the LED 3 by the B-stage phosphor sheet 2, as shown in Fig. 7, first, the substrate 5 on which the LED 3 is mounted is prepared.

The substrate 5 includes, for example, a tantalum substrate, a ceramic substrate, a polyimide substrate, and an insulating substrate such as a laminated substrate in which an insulating layer is laminated on the metal substrate.

Further, on the surface of the substrate 5, a conductor pattern (not shown) including an electrode (not shown) electrically connected to a terminal (not shown) of the LED 3 to be described later, and a wiring connected thereto is formed. The conductor pattern is formed of, for example, a conductor such as gold, copper, silver, or nickel.

Further, the surface of the substrate 5 is formed in a flat shape. Alternatively, although not shown, a concave portion recessed downward may be formed on the surface of the substrate 5 on which the LED 3 is mounted.

The shape of the outer shape of the substrate 5 is not particularly limited, and examples thereof include a substantially rectangular shape in plan view and a substantially circular shape in plan view. The size of the substrate 5 is appropriately selected. For example, the maximum length is, for example, 2 mm or more, preferably 10 mm or more, and for example, 300 mm or less, preferably 100 mm or less.

The LED 3 is an optical semiconductor element that converts electric energy into light energy, for example, a thickness of a section having a thickness in a face-to-face direction (length in the direction orthogonal to the thickness direction) is shorter. shape.

As the LED 3, for example, a blue LED (light emitting diode element) that emits blue light can be cited. The size of the LED 3 is appropriately set depending on the use and purpose, and specifically, the thickness is, for example, 10 to 1000 μm, and the maximum length is, for example, 0.05 mm or more, preferably 0.1 mm or more, and further, for example, 5 mm or less, preferably 2 mm or less.

The emission peak wavelength of the LED 3 is, for example, 400 nm or more, preferably 430 nm or more, and is, for example, 500 nm or less, preferably 470 nm or less.

The LED 3 is flip-chip mounted to the substrate 5, for example, or is bonded by wire bonding.

Further, as shown in FIG. 5, a plurality of (three in FIG. 7) LEDs 3 can be mounted on one substrate 5. The number of LEDs 3 to be mounted on each of the substrates 5 is, for example, one or more, preferably four or more, and for example, 2,000 or less, preferably 400 or less.

Further, the substrate 5 on which the LEDs 3 are mounted is based on the information on the substrate 5 determined in the step S2, for example, the shape, size, and surface shape of the substrate 5 (the presence or absence of the recess), for example, mounted on the substrate 5. The shape and size of the LED 3, the illuminating peak wavelength of the LED 3, the number of LEDs 3 per unit area of the substrate 5, the number of LEDs 3 mounted per substrate 5, and the like are selected and prepared.

Next, in this method, the substrate 5 on which the LEDs 3 are mounted is placed in the press machine 20 shown in FIG.

As the press machine 20, for example, a flat press having two flat plates 21 arranged to face each other at an interval in the vertical direction is used.

When the substrate 5 on which the LEDs 3 are mounted is placed on the press machine 20 as shown in FIG. 7, specifically, the substrate 5 on which the LEDs 3 are mounted is placed on the lower plate 21 of the lower side.

Then, the phosphor sheet 2 (see FIG. 6) laminated on the upper surface of the release sheet 4 is vertically inverted and placed on the upper side of the LED 3 in the opposing direction. That is, the phosphor sheet 2 is placed so as to face the LEDs 3.

Next, as shown in FIG. 8, the LED 3 is covered by the phosphor sheet 2. Specifically, the LED 3 is buried by the phosphor sheet 2.

Further, the LED 3 is covered by the phosphor sheet 2 based on the pressing conditions determined in the step S2.

Specifically, as shown by the arrow in Fig. 7, the phosphor sheet 2 is lowered (pressed down). In detail, the phosphor sheet 2 is pressed against the substrate 5 on which the LED 3 is mounted.

The pressing pressure is, for example, 0.05 MPa or more, preferably 0.1 MPa or more, and is, for example, 1 MPa or less, preferably 0.5 MPa or less.

Thereby, the LED 3 is covered by the phosphor sheet 2. That is, the LED 3 is embedded in the phosphor sheet 2.

Thereby, the LED 3 is sealed by the phosphor sheet 2.

Thereafter, the phosphor sheet 2 is C-staged.

For example, the phosphor sheet 2 is C-staged based on the heating conditions of the phosphor sheet 2 and the irradiation conditions of the active energy ray in the C-stage determination determined in the step S2.

Specifically, when the two-stage curable resin is a two-stage curable thermosetting resin, the phosphor sheet 2 is heated. Specifically, while the pressed state of the phosphor sheet 2 by the flat plate 21 is maintained, it is placed in the oven. Thereby, the phosphor sheet 2 is heated.

The heating temperature is, for example, 80 ° C or higher, preferably 100 ° C or higher, and is, for example, 200 ° C or lower, preferably 180 ° C or lower. Further, the heating time is, for example, 10 minutes or longer, preferably 30 minutes or longer, and for example, 10 hours or shorter, preferably 5 hours or shorter.

The phosphor sheet 2 is C-staged (completely hardened) by heating of the phosphor sheet 2.

In the case where the two-stage curable resin is a two-stage curable active energy ray-curable resin, the phosphor sheet 2 is C-staged by irradiating the phosphor sheet 2 with an active energy ray ( Completely hardened). Specifically, the phosphor sheet 2 is irradiated with an ultraviolet lamp or the like. Shoot ultraviolet light.

Thereby, a prototype 6 including the phosphor sheet 2, the LED 3 sealed by the phosphor sheet 2, and the substrate 5 on which the LED 3 is mounted is experimentally produced.

In FIG. 8, a plurality of (three) LEDs 3 are provided in one prototype 6.

Thereafter, the release sheet 4 is peeled off from the phosphor sheet 2 as shown by the imaginary line of FIG.

Further, when a plurality of LEDs 3 are mounted on one substrate 5 as needed, the phosphor sheet 2 may be cut and singulated in accordance with each of the LEDs 3.

<Evaluation step S8>

In the evaluation step S8, in order to evaluate the phosphor sheet 2 of the C stage, for example, a conductor of the substrate 5 of the prototype 6 (specifically, the prototype 6 of the LED 3 coated with the phosphor sheet 2) is applied. A pattern (not shown) flows a current to cause the LED 3 to illuminate the lighting test.

Specifically, in the lighting test, a current flows through the substrate 5 of the prototype 6, and the color temperature and/or the total luminous flux of the light immediately after the current flows are measured.

Specifically, when the prototype 6 is subjected to the lighting test, the measured value of the color temperature of light is recorded as the evaluation of the prototype 6, and is recorded in the recording step S9 shown in FIG.

Specifically, in the recording step S9, the trial production conditions and evaluation of the prototype 6 are recorded and stored as information of the past (previous) prototype 6 .

[Decision Step S2]

The decision step S2 is the step performed after the trial production step S1. In the decision step S2, based on the evaluation of the prototype 6, the manufacturing conditions for manufacturing the LED device 1 are determined.

For example, the manufacturing conditions are determined based on the trial conditions and evaluations recorded in the trial production step S1.

Specifically, if the measured value of the color temperature of the light of the prototype 6 is within the target range, the trial conditions recorded in the recording step S9 directly become the manufacturing conditions.

When the color of the target light is 昼 white, the target color temperature is, for example, 4600 K. Above, again, for example, 5500 K or less. Further, when the color of the target light is warm white, the target color temperature is, for example, 3250 K or more, and is, for example, 3800 K or less.

On the other hand, if the measured value of the color temperature of the light of the prototype 6 is outside the target range, the manufacturing conditions are determined so as to be the target color temperature based on the trial conditions and evaluations recorded in the recording step S9. Specifically, the trial production conditions are corrected so as to be the target color temperature, and the manufacturing conditions are set. For example, as described above, the information on the varnish, the information on the substrate 5, and the information on the phosphor sheet 2 are corrected, and it is preferable to correct the information on the varnish, and it is more preferable to correct the blending ratio of the phosphor and the fluorescence. The shape of the body, the average value of the maximum length of the phosphor, the wavelength of the absorption peak of the phosphor, and the like are set as manufacturing conditions.

[manufacturing step S3]

Referring to Fig. 1, the manufacturing step S3 is a step performed after the decision step S2. The manufacturing step S3 is a step of manufacturing the LED device 1 based on the manufacturing conditions determined in the decision step S2.

As shown in FIG. 3, the manufacturing step S3 includes a varnish preparation step S11, a B-stage step S12, and a C-stage step S13.

In the manufacturing step S3 (FIG. 1), in addition to the varnish preparation step S11, the B-stage step S12, and the C-stage step S13, respectively, based on the manufacturing conditions determined in the decision step S2, respectively, the varnish preparation in the trial production step S1 is performed. Step S5, the B-stage step S6 and the C-stage step S7 (Fig. 2) are carried out in the same manner.

Thereby, the LED device 1 having the same structure as the prototype 6 is manufactured.

The number of the LED devices 1 mass-produced in the manufacturing step S3 is, for example, 100 or more, preferably 500 or more, more preferably 1,000 or more, and for example, 100,000 or less.

According to this method, the determination step S2 determines the manufacturing conditions based on the evaluation of the prototype 6 including the phosphor sheet 2 of the C stage. Further, in the manufacturing step S3, the LED device 1 is manufactured based on the manufacturing conditions determined by the determining step.

In this case, the phosphor sheet 2 of the prototype 6 to be evaluated is in the C stage. Therefore, in the manufacturing conditions, it is considered that the phosphor sheet 2 is caused by the above-described C-stage formation. Changes in optical characteristics. Specifically, in the production conditions, the phase characteristics are introduced into the fluctuation of the optical characteristics of the phosphor sheet 2 due to deformation such as warpage due to hardening shrinkage.

As a result, in the manufacturing step S3, the LED device 1 excellent in light emission reliability can be manufactured.

Moreover, since the LED device 1 is manufactured based on the manufacturing conditions determined based on the evaluation of the prototype 6, the LED device 1 can be mass-produced (that is, mass-produced) with excellent precision. Therefore, the manufacturing efficiency of the LED device 1 can be sufficiently improved.

Furthermore, the trial production step S1 and the determination step S2 are performed before the manufacturing step S3 for mass production of different types of LED devices 1. Further, in the case where the phosphor and/or the LED 3 are changed in batches, the trial production step S1 and the determination step S2 are, in particular, the average value of the maximum length of the phosphor and the absorption peak. The wavelength or the luminescence peak wavelength of the LED 3 is changed every time.

(variation)

In the embodiment shown in FIG. 8, in the C-stage step S7, first, the LED 3 is coated with the B-stage phosphor sheet, and then the B-stage phosphor sheet 2 is C-staged. However, for example, referring to Fig. 6, the phosphor sheet 2 laminated in the B-stage of the release sheet 4 may be directly C-staged.

In this case, in the evaluation step S8, the amount of warpage accompanying the hardening shrinkage of the phosphor sheet 2 of the C stage is measured. The amount of warpage is obtained by the difference between the amount of depression of the central portion of the phosphor sheet 2 and the amount of protrusion of the peripheral end portion to the upper side.

Preferably, in the C-stage step S7, first, the LED 3 is coated by the B-stage phosphor sheet 2, and then the B-stage phosphor sheet 2 is subjected to the second step. C-stage.

According to this method, the prototype 6 in which the LED 3 is covered by the phosphor sheet 2 can be configured in the same manner as the LED device 1 as the actual product.

Therefore, the manufacturing conditions of the actual product (LED device 1) can be determined based on the evaluation of the prototype 6 which is the same as the actual product (LED device 1).

As a result, the manufacturing conditions can be determined with higher precision, and the LED device 1 having further excellent light-emitting reliability can be manufactured.

Further, in the embodiment of Fig. 2, the trial condition determination step S4 determines the trial production condition based on the past trial production conditions and the evaluation information, but may be, for example, as shown in Fig. 9, not based on the past trial conditions and evaluation. Based on the information, the trial conditions and evaluations recorded in the recording step S9 are determined in the decision step S2 shown in FIG. 1 by predicting the manufacturing conditions.

Preferably, in the trial condition determination step S4, the trial production conditions are determined based on past trial conditions and evaluation information.

According to this method, the trial production conditions of the previous trial production can be accumulated, and the accuracy of the manufacturing conditions can be improved based on the accumulated trial production conditions and evaluation. Therefore, the LED device 1 excellent in light emission reliability can be obtained.

Further, in the embodiment of FIGS. 7 and 8, in the C-stage step S7 (see FIG. 2), first, the LED 3 is covered by the phosphor sheet 2 of the B-stage, and secondly, the phosphor of the B-stage is made. The sheet 2 is C-staged, and for example, the coating and C-stage of the LED 3 of the B-stage phosphor sheet 2 can be simultaneously performed.

Further, in FIG. 8, a plurality of LEDs 3 are provided in one LED device 1. Although not shown, for example, a single LED 3 may be provided.

Further, in the embodiment of FIG. 8, the LED 3 and the LED device 1 are described as an example of the optical semiconductor device and the optical semiconductor device of the present invention, and for example, LD (Laser Diode) 3 may be used. And a laser diode device 1.

[Examples]

The numerical values in the examples and comparative examples shown below may be replaced by the corresponding numerical values (i.e., the upper limit value or the lower limit value) described in the above embodiments.

Example 1 [Trial production step S1] <varnish preparation step S5>

First, for the decyl alcohol-terminated polydimethyloxane heated to 40 ° C [the compound of the following formula (1) wherein R ^{1 is} all methyl, n = 155, the average molecular weight is 11,500. 2,031 g (0.177 mol) of vinyltrimethoxydecane [a compound represented by the following formula (2) wherein R ² is a vinyl group and X ¹ is a methoxy group] 15.76 g (0.106 mol) as ethylene-containing a halide of an unsaturated hydrocarbon group, and (3-glycidoxypropyl)trimethoxydecane [wherein R ³ in the following formula (3) is ³ -glycidoxypropyl group, and X ^{2 is} all methoxy a compound represented by a group] 2.80 g (0.0118 mol) as a telluride containing an ethylenically unsaturated hydrocarbon group [the molar number of the SiOH group of the sulfoalkyl group-terminated polydimethyloxane and the ethylenic unsaturation the molar ratio of the total number of hydrocarbon groups silicide SiX ¹ SiX-containing vinyl group and unsaturated hydrocarbon group of ² of the silicide ^{[SiOH / (SiX 1 + SiX} 2) = 1/1], and mixed with stirring Thereafter, a solution of tetramethylammonium hydroxide in methanol (concentration: 10% by mass) of 0.97 mL (catalyst amount: 0.88 mol, relative to the decyl alcohol-terminated polydimethyl methoxyalkane 100 mol is 0.50 mol. ,phase The condensation raw material was 4.0 mg (4.0 mg) as a condensation catalyst, and the mixture was stirred at 40 ° C for 1 hour. The obtained oil was stirred at 40 ° C for 1 hour while being depressurized (10 mmHg) to remove volatile components. Next, after returning the reaction solution to normal pressure, an organohydrogenpolyoxyalkylene (dimethylpolyoxane) was added in such a manner that the molar ratio of the alkenyl group to the hydrazine group became SiR ^{2 /} SiH = ^1/ 3.0. Copolymer-methylhydrogenpolyoxyalkylene) was stirred at 40 ° C for 1 hour. Thereafter, 0.038 mL of a platinum-carbonyl complex (platinum concentration: 2.0% by mass) was added (the platinum content was 0.375 ppm with respect to the organopolysiloxane, that is, 0.375 × 10 ^-4 g with respect to 100 g of the condensation raw material). The hydrogenation catalyst was stirred at 40 ° C for 10 minutes to prepare a phase A polyoxyxylene resin composition (second condensation reaction / addition reaction hardening type polyoxyl resin). The polyoxyxyl resin composition of the A stage has a viscosity of 8000 mPa at 25 ° C and 1 atm. s.

[Chemical 1]

[Chemical 2] R ² -Si-(X ¹ ) ₃ (2)

[Chemical 3] R ² -Si-(X ¹ ) ₃ (2)

100 parts by mass of the polyoxyxylene resin composition, 20 parts by mass of polyoxyxylene rubber particles (spherical shape, average particle diameter: 7 μm), and 10 parts by mass of YAG particles (spherical shape, average particle diameter: 7 μm) as a yellow phosphor The mixture was placed in a mixing vessel equipped with a stirrer and mixed using a stirrer. Thereby, the varnish of the stage A was prepared. The varnish has a viscosity of 20000 mPa at 25 ° C and 1 atmosphere. s.

<B-stage step S6>

Next, the varnish was applied to the surface of the release sheet containing PET by a dispenser (refer to FIG. 5) in a rectangular shape in plan view (size: 10 mm × 100 mm), and then heated in an oven at 135 ° C for 15 minutes. A B-stage sealing sheet having a thickness of 600 μm laminated on the release sheet was produced.

The compression elastic modulus of the sealing sheet of the B-stage immediately after the production at 25 ° C was measured and found to be 0.040 MPa (refer to Table 1). Specifically, manufactured by Aikoh Engineering The precision load measuring machine calculates the compressive elastic modulus at 25 °C.

<C-stage step S7>

A substrate on which an LED is mounted having a rectangular shape and a thickness of 150 μm is prepared (see FIG. 7). The shape, number and size of the LED and the substrate are described below.

Shape of the substrate: square shape in plan

The size of the substrate: 1 side 8mm, maximum length 11mm

LED shape: overlooking the square shape

LED size: 1 side 0.3mm, maximum length 0.4mm

Number of LED installations: 9

Density of LED: The number of LEDs per unit area (mm ² ) of the substrate is 0.14 / mm ²

: The number of LEDs installed per substrate is 9

LED luminescence peak wavelength: 452nm

Then, the substrate on which the LED is mounted is placed in the press (refer to FIG. 7).

Further, the B-stage sealing sheet was placed in a press machine provided with a substrate (see FIG. 7).

Then, the LED is sealed by a sealing sheet (refer to FIG. 8).

Specifically, the sealing sheet was pressed at room temperature by flat pressing, and the LED was buried with a sealing sheet at a pressure of 0.2 MPa. Thereby, the LED is sealed by the sealing sheet.

Thereafter, the flat sheet for pressing the sealing sheet and the substrate was placed in an oven, and the sealing sheet was heated at 150 ° C for 30 minutes to C-stage the sealing sheet.

Thereafter, the release sheet is peeled off from the sealing sheet (see an arrow in Fig. 8).

Thereby, the prototype is trial-produced.

Furthermore, the number of prototypes is one.

<Evaluation step S8> A. Color temperature

Thereafter, the phosphor sheet of the prototype was evaluated.

Specifically, a current of 100 mA was passed through the substrate of the prototype, and a lighting test of the color temperature of the light immediately after the current was passed by an Intensified Multichannel Photodetector (MCPD-9800, manufactured by Otsuka Electronics Co., Ltd.) was carried out.

The results are shown in Table 1.

B. Warpage amount

Further, the amount of warpage of the phosphor sheet of the prototype was measured.

The results are shown in Table 1.

[Decision Step S2]

It is known that the measured value of the color temperature of the light of the sample is approximately 5,450 K as the target range, so that the blending ratio of the phosphor is kept at 10 parts by mass with respect to 100 parts by mass of the polyoxynoxy resin composition, and the manufacturing conditions are determined. .

[manufacturing step S3]

In the manufacturing step S3, the manufacturing conditions determined in the step S2 (the blending ratio of the phosphor is 10 parts by mass based on 100 parts by mass of the polyoxyxene resin composition) are separately prepared from the varnish in the trial production step S1. Step S5, the B-stage step S6 and the C-stage step S7 are carried out in the same manner. Thereby, an LED device is manufactured.

Furthermore, the number of LED devices is 1000.

[Product evaluation]

The color temperature of the manufactured LED device was measured, and the color temperature became the target of 5,450 K, and the deviation was also within the target range of 5,425 to 5,475 K.

Comparative example 1

Except for the <B-stage step S6>, the same procedure as in the first embodiment is carried out except that the phosphor sheet of the B-stage before the <C-stage step S7> is subjected to the evaluation step S8.

For example, the "A. Color temperature" of the B-stage phosphor sheet in <Evaluation Step S8> and The results of "B. Warpage amount" are shown in Table 1. It is impossible to judge whether or not the color temperature of the manufactured LED device has reached the target value.

(examine)

The difference in color temperature (Tc) between Example 1 and Comparative Example 1 was about 18 K, and it was found that the amount of warpage caused by the hardening shrinkage accompanying the C-stage was large.

Therefore, in the manufacturing conditions determined in the determining step of the first embodiment, the color temperature due to the large amount of warpage is considered, whereby the color temperature of the LED device as the product is within the target range.

On the other hand, in the manufacturing conditions determined in the determining step of Comparative Example 1, the fluctuation of the color temperature due to the large amount of warpage was not considered. Therefore, the color temperature of the LED device as the product was outside the target range.

Furthermore, the above invention is provided as an exemplified embodiment of the present invention, but it is merely illustrative and is not to be construed as limiting. Variations of the invention that are apparent to those skilled in the art are included in the scope of the following claims.

[Industrial availability]

A method of manufacturing an optical semiconductor device is used to manufacture an LED device or an LD device.

S4‧‧‧Prototype conditions determination steps

S5‧‧‧ varnish preparation steps

S6‧‧‧B staged steps

S7‧‧‧C stage step

S8‧‧‧Evaluation steps

S9‧‧‧ Recording steps

Claims (3)

A method of manufacturing an optical semiconductor device, comprising: coating a photo-semiconductor element with a phosphor sheet, comprising: a trial production step of trial-manufacturing a prototype product; and a determining step based on the prototype product The evaluation determines the manufacturing conditions for manufacturing the optical semiconductor device, and the manufacturing step of manufacturing the optical semiconductor element by the B-stage phosphor sheet based on the manufacturing conditions determined by the determining step. In the optical semiconductor device in which the phosphor sheet is C-staged, the trial production step includes a varnish preparation step of preparing a varnish containing a phosphor and a curable resin, and the phosphor sheet of the B-stage is formed from the varnish. In the B-stage step, the C-stage step of the C-stage of the phosphor sheet of the B stage is performed, and the evaluation step of the phosphor sheet of the C stage is evaluated. The method of manufacturing an optical semiconductor device according to claim 1, wherein in the step of step C, the photo-semiconductor element is coated on the phosphor sheet, and in the evaluating step, the phosphor sheet is evaluated The optical semiconductor device covering the above optical semiconductor element. The method for manufacturing an optical semiconductor device according to claim 1, wherein the trial production step further includes a trial condition determining step, which is determined based on the trial production conditions and evaluation information of the prototype before the current trial. Trial conditions.