JP2015109340A - Optical semiconductor device manufacturing method, system, manufacturing condition determination device and manufacturing management device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical semiconductor device manufacturing method which adjusts a coating layer to have a uniform thickness thereby to achieve excellent luminescent efficiency and reduces the number of processes thereby to improve manufacturing efficiency; and provide a system, a manufacturing condition determination device and a manufacturing management device for determining and managing a manufacturing condition of the optical semiconductor device manufacturing method.SOLUTION: A manufacturing method of an optical semiconductor device 20 comprises: a varnish manufacturing process S1 of manufacturing a varnish 11 which contains particles and a hardening resin; an encapsulation layer manufacturing process S2 of manufacturing an A-stage encapsulation layer 12 from the varnish 11; and an encapsulation process S3 of encapsulating an optical semiconductor element 13 by means of the A-stage encapsulation layer 12.

Description

  The present invention relates to an optical semiconductor device manufacturing method, system, manufacturing condition determining device, and manufacturing management device, and more particularly, an optical semiconductor device manufacturing method, a system for determining and managing the manufacturing conditions, a manufacturing condition determining device, and a manufacturing management device. About.

  Conventionally, as an optical semiconductor device manufacturing method, first, an uncured curable resin composition containing particles and a curable resin is prepared, and then potted on a package or the like on which a light emitting diode is mounted, and then cured. A method for curing a functional resin composition is known (for example, see Patent Document 1 below).

  Alternatively, an A-stage varnish containing particles and a curable resin is prepared, and then applied to a release sheet, then converted to a B-stage, and then the light-emitting diode mounted on the substrate is covered with the B-stage sheet. Thereafter, a method of converting the B stage sheet into a C stage has been proposed (see, for example, Patent Document 2 below).

JP 2007-332314 A JP 2013-140848 A

  However, the method of Patent Document 1 has a problem that the thickness of the cured layer of the curable resin composition is likely to be non-uniform, and thus the light emission efficiency of the optical semiconductor device is lowered.

  On the other hand, the method of Patent Document 2 requires a step of preparing a B-stage sheet from an A-stage varnish, which requires a lot of man-hours. As a result, there is a problem that it is difficult to improve the manufacturing efficiency of the manufacturing method of the optical semiconductor device.

  An object of the present invention is to determine a manufacturing method of an optical semiconductor device and a manufacturing condition thereof, in which a coating layer is prepared with a uniform thickness and has excellent luminous efficiency, can reduce man-hours, and improve manufacturing efficiency. Another object of the present invention is to provide a management system, a manufacturing condition determination device, and a manufacturing management device.

  In order to achieve the above object, an optical semiconductor device manufacturing method of the present invention includes a varnish manufacturing process for manufacturing a varnish containing particles and a curable resin, a coating layer manufacturing process for manufacturing an A-stage coating layer from the varnish, And a coating step of coating the optical semiconductor element with the coating layer of the A stage.

  According to this method, since the optical semiconductor element is coated with the coating layer of the A stage, it is possible to reduce the number of steps for preparing the B stage sheet as in Patent Document 2. Therefore, man-hours can be reduced and the manufacturing efficiency of the optical semiconductor device can be improved.

  Further, according to this method, after the A-stage covering layer is manufactured from the varnish, the optical semiconductor element is covered with the A-stage covering layer, so that the covering layer is more uniform than the potting as in Patent Document 1. Can be prepared with a sufficient thickness. Therefore, an optical semiconductor device having excellent light emission efficiency can be obtained.

  As a result, according to this method, an optical semiconductor device having excellent luminous efficiency can be obtained at low cost.

  The system of the present invention is a system for determining and managing the manufacturing conditions of the coating layer manufacturing process in the method for manufacturing an optical semiconductor device described above, wherein the system includes a manufacturing condition determining device and a manufacturing management device. The manufacturing condition determination device includes a first information storage area for storing first information related to the optical semiconductor element and the optical semiconductor device, and a second information storage area for storing second information related to the varnish. And determining means for determining the manufacturing condition based on the first information stored in the first information storage area and the second information stored in the second information storage area, The management device is based on a third information storage area for storing third information related to the manufacturing condition determined by the determination means, and the third information stored in the third information storage area. It is characterized in that it comprises a management means for managing the manufacturing conditions of the coating layer manufacturing process.

  In this system, the manufacturing condition determination apparatus includes a first information storage area, a second information storage area, and a determination unit, while the manufacturing management apparatus includes a third information storage area and a management unit.

  The manufacturing condition determining device stores each of the first information and the second information in each of the first information storage area and the second information storage area, and the determining means determines the manufacturing conditions of the coating layer manufacturing process. This can be determined and provided to the manufacturing management device.

  In the production management device, the third information related to the production condition provided from the production condition determination device is stored in the third information storage area, and the coating layer is produced by the management means based on the third information. Manage process manufacturing conditions.

  Therefore, the manufacturing conditions of the coating layer manufacturing process can be determined separately from the manufacturing management apparatus by the manufacturing condition determination apparatus, and can be managed by the manufacturing management apparatus.

  Moreover, the 3rd information relevant to the manufacturing conditions of the coating layer manufacturing process provided from a manufacturing condition determination apparatus is based on 1st information and 2nd information. Therefore, the production management device can accurately manage the production conditions of the coating layer production process by the management means based on the third information provided from the production condition determination device. As a result, the target optical semiconductor device can be manufactured with high accuracy.

  The system of the present invention further determines and manages the manufacturing conditions of the varnish manufacturing process, and the determining means includes the first information stored in the first information storage area and the second information storage area. The manufacturing condition of the varnish manufacturing process is further determined based on the second information stored in the varnish, and the management means determines the varnish based on the third information stored in the third information storage area. It is preferable to further manage the manufacturing conditions of the manufacturing process.

  In this system, the determining means further determines manufacturing conditions of the varnish manufacturing process based on the first information stored in the first information storage area and the second information stored in the second information storage area, The management means further manages the manufacturing conditions of the varnish manufacturing process based on the third information stored in the third information storage area. Therefore, a coating layer suitable for the target optical semiconductor device can be manufactured with high accuracy, and further, the target optical semiconductor device can be manufactured with high accuracy.

  In the system of the present invention, it is preferable that the first information includes information related to a substrate on which the optical semiconductor element is mounted.

  According to this system, since the first information includes information related to the substrate on which the optical semiconductor element is mounted, the manufacturing condition determining apparatus also includes information related to the substrate on which the optical semiconductor element is mounted. It can be provided with information.

  Therefore, based on the highly accurate third information related to the manufacturing condition determined based on the first information, the manufacturing management device can manage the manufacturing condition of the coating layer manufacturing process with higher accuracy.

  In the system of the present invention, the manufacturing management device includes at least one lot information of particles, curable resin, varnish, and optical semiconductor element, and / or a manufacturing amount of the optical semiconductor device per unit period. Preferably, the apparatus includes a fourth information storage area that stores four information, and a correction unit that corrects the manufacturing conditions of the coating layer manufacturing process based on the fourth information stored in the fourth information storage area. It is.

  Lot information of particles, curable resin, varnish, and optical semiconductor element varies from lot to lot. In addition, the manufacturing amount of the optical semiconductor device per unit period varies for each unit period. Therefore, the physical properties of the manufactured optical semiconductor device may vary from lot to lot and / or unit period. In such a case, it is complicated for the manufacturing condition determination device to determine the manufacturing conditions based on the fourth information every time.

  However, in this system, in the production management apparatus, at least one lot information of particles, curable resin, varnish and optical semiconductor element stored in the fourth information storage area by the correcting means, and / or the unit period Based on the fourth information including the manufacturing amount of the hit optical semiconductor device, the manufacturing conditions of the coating layer manufacturing process can be corrected. Therefore, the target optical semiconductor device can be accurately manufactured by correcting the manufacturing conditions of the coating layer manufacturing process in response to the variation in the lot information and / or the manufacturing amount of the optical semiconductor device.

  In the system of the present invention, the manufacturing condition determining device includes a fifth information storage area for storing fifth information related to manufacturing conditions for manufacturing the coating layer before this time, and the fifth information storage area includes the fifth information storage area. It is preferable to determine manufacturing conditions for manufacturing the coating layer this time based on the stored fifth information.

  According to this system, the manufacturing condition determination device can accumulate the fifth information related to the manufacturing conditions in which the coating layer was manufactured before this time. Therefore, based on the manufacturing conditions accumulated in the past, a coating layer suitable for the target optical semiconductor device can be manufactured this time, and further, the target optical semiconductor device can be manufactured accurately this time.

  In the system of the present invention, it is preferable that the manufacturing condition determining device communicates with the manufacturing management device remotely via a network.

  According to this system, since the manufacturing condition determining device communicates with the manufacturing management device remotely via the network, even if the manufacturing condition determining device is remotely located with respect to the manufacturing management device, the manufacturing condition determining device The determined manufacturing conditions of the coating layer manufacturing process can be quickly provided to the manufacturing management apparatus.

  In the system of the present invention, the manufacturing management device may be provided in a coating layer manufacturing device, and the manufacturing condition determination device may be provided in a control department located at a far end with respect to the coating layer manufacturing device. Is preferred.

  According to this system, the manufacturing management device is provided in the coating layer manufacturing device, and the manufacturing condition determination device is determined even if the manufacturing condition determination device is provided in the control department located at the far end with respect to the coating layer manufacturing device. Since the apparatus remotely communicates with the manufacturing management apparatus via the network, the manufacturing conditions of the coating layer manufacturing process determined by the manufacturing condition determining apparatus in the control department can be quickly provided to the manufacturing management apparatus.

  The manufacturing condition determining apparatus of the present invention is a manufacturing condition determining apparatus for determining manufacturing conditions of the coating layer manufacturing process in the above-described manufacturing method of an optical semiconductor device, and includes first information related to the optical semiconductor element. A first information storage area for storing; a second information storage area for storing second information relating to the varnish; the first information stored in the first information storage area; and the second information storage area Determining means for determining the manufacturing condition based on the second information stored in the storage device.

  The manufacturing condition determining apparatus includes a first information storage area, a second information storage area, and a determination unit.

  Therefore, according to this manufacturing condition determination device, each of the first information and the second information is stored in each of the first information storage area and the second information storage area, and the determination means manufactures the coating layer manufacturing process. Conditions can be determined.

  As a result, based on the manufacturing conditions of the coating layer manufacturing process, the target optical semiconductor device can be manufactured with high accuracy.

  Further, the manufacturing condition determining apparatus of the present invention further determines manufacturing conditions of the varnish manufacturing process, and the determining means stores the first information stored in the first information storage area and the second information storing. It is preferable that the manufacturing conditions of the varnish manufacturing process are further determined based on the second information stored in the region.

  In the manufacturing condition determining apparatus, the determining means further determines the manufacturing conditions of the varnish manufacturing process based on the first information stored in the first information storage area and the second information stored in the second information storage area. decide. Therefore, a coating layer suitable for the target optical semiconductor device can be manufactured with high accuracy, and further, the target optical semiconductor device can be manufactured with high accuracy.

  In the manufacturing condition determining apparatus of the present invention, it is preferable that the first information includes information related to a substrate on which the optical semiconductor element is mounted.

  According to this manufacturing condition determining apparatus, since the first information includes information related to the substrate on which the optical semiconductor element is mounted, the manufacturing condition determining apparatus also includes information related to the substrate on which the optical semiconductor element is mounted. It can be provided together with each of the information described above.

  Therefore, the target optical semiconductor device can be manufactured with high accuracy.

  Moreover, the manufacturing condition determination apparatus of the present invention includes a fifth information storage area for storing fifth information related to manufacturing conditions for manufacturing the coating layer before this time, and is stored in the fifth information storage area. It is preferable to determine manufacturing conditions for manufacturing the coating layer this time based on the fifth information.

  According to this manufacturing condition determining apparatus, it is possible to accumulate the fifth information related to the manufacturing conditions for manufacturing the coating layer before this time. Therefore, based on the manufacturing conditions accumulated in the past, a coating layer suitable for the target optical semiconductor device can be manufactured this time, and further, the target optical semiconductor device can be manufactured accurately this time.

  The production management apparatus of the present invention is a production management apparatus for managing the production conditions of the coating layer production process in the method for producing an optical semiconductor device described above, and stores third information relating to the production conditions. 3 information storage area, and the management means which manages the said manufacturing conditions of the said coating layer manufacturing process based on the said 3rd information stored in the said 3rd information storage area, It is characterized by the above-mentioned.

  According to this manufacturing management apparatus, the third information related to the manufacturing conditions of the coating layer manufacturing process is stored in the third information storage area, and based on the third information, the management means performs the process of the coating layer manufacturing process. Manufacturing conditions can be managed with high accuracy.

  Therefore, the target optical semiconductor device can be manufactured with high accuracy.

  The production management device of the present invention further manages the production conditions of the varnish production process, and the management means performs the varnish production process based on the third information stored in the third information storage area. It is preferable to further manage the manufacturing conditions.

  According to this manufacturing management apparatus, since the management means further manages the manufacturing conditions of the varnish manufacturing process based on the third information stored in the third information storage area, the covering suitable for the target optical semiconductor device The layer can be manufactured with high accuracy, and the target optical semiconductor device can be manufactured with high accuracy.

  The production management device of the present invention stores at least one kind of lot information of particles, curable resin, varnish, and optical semiconductor element, and / or fourth information including the production amount of the optical semiconductor device per unit period. Preferably, the information processing apparatus includes a fourth information storage area to be corrected, and correction means for correcting the manufacturing conditions of the coating layer manufacturing process based on the fourth information stored in the fourth information storage area.

  Lot information of particles, curable resin, varnish, and optical semiconductor element varies from lot to lot. In addition, the manufacturing amount of the optical semiconductor device per unit period varies for each unit period. Therefore, the physical properties of the manufactured optical semiconductor device may vary from lot to lot and / or unit period. In such a case, it is complicated for the manufacturing condition determination device to determine the manufacturing conditions based on the fourth information every time.

  However, in this production management apparatus, the correction means stores at least one lot information of particles, curable resin, varnish and optical semiconductor element and / or light per unit period stored in the fourth information storage area. Based on the fourth information including the manufacturing amount of the semiconductor device, the manufacturing conditions of the coating layer manufacturing process can be corrected. Therefore, the target optical semiconductor device can be accurately manufactured by correcting the manufacturing conditions of the coating layer manufacturing process in response to the variation in the lot information and / or the manufacturing amount of the optical semiconductor device.

  According to the method for manufacturing an optical semiconductor device of the present invention, an optical semiconductor device having excellent light emission efficiency can be obtained at low cost.

  According to the system of the present invention including the manufacturing condition determining device and the manufacturing management device of the present invention, the manufacturing management device can be determined separately from the manufacturing management device and managed by the manufacturing management device. Can do. Moreover, the target optical semiconductor device can be manufactured with high accuracy.

FIG. 1 is a process diagram of an embodiment of a method of manufacturing an optical semiconductor device according to the present invention. FIG. 1A is a diagram illustrating a laminate of a substrate on which an optical semiconductor element is mounted and a release sheet provided with a coating layer. FIG. 1B shows a step of stacking the substrate and the coating layer, and FIG. 1C shows a step of peeling off the release sheet. FIG. 2 shows a schematic block diagram of an embodiment of the system of the present invention. FIG. 3 is a schematic configuration diagram of a system according to a modification of FIG.

  One embodiment of a method for manufacturing an optical semiconductor device of the present invention includes a varnish manufacturing process for manufacturing a varnish containing particles and a curable resin, a coating layer manufacturing process for manufacturing an A stage coating layer from the varnish, and an A stage A coating step of coating the optical semiconductor element with the coating layer; Hereinafter, each process is explained in full detail.

<Varnish manufacturing process>
Examples of the particles include phosphors and fillers.

  The phosphor has a wavelength conversion function, and examples thereof include a yellow phosphor capable of converting blue light into yellow light, and a red phosphor capable of converting blue light into red light.

Examples of the yellow phosphor include silicate phosphors such as (Ba, Sr, Ca) ₂ SiO ₄ ; Eu, (Sr, Ba) ₂ SiO ₄ : Eu (barium orthosilicate (BOS)), such as Y ₃ Al. Garnet-type phosphors having a garnet-type crystal structure such as ₅ O ₁₂ : Ce (YAG (yttrium, aluminum, garnet): Ce), Tb ₃ Al ₃ O ₁₂ : Ce (TAG (terbium, aluminum, garnet): Ce) Examples thereof include oxynitride phosphors such as Ca-α-SiAlON.

Examples of the red phosphor include nitride phosphors such as CaAlSiN ₃ : Eu and CaSiN ₂ : Eu.

  Examples of the shape of the phosphor include a spherical shape, a plate shape, and a needle shape.

  The average value of the maximum length of the phosphor (in the case of a sphere, the average particle diameter) is, for example, 0.1 μm or more, preferably 1 μm or more, and for example, 200 μm or less, preferably 100 μm or less. It is.

  The absorption peak wavelength of the phosphor is, for example, 300 nm or more, preferably 430 nm or more, and, for example, 550 nm or less, preferably 470 nm or less.

  The phosphors can be used alone or in combination.

  The blending ratio of the phosphor is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, for example, 80 parts by mass or less, preferably 50 parts by mass with respect to 100 parts by mass of the curable resin. Or less.

  Examples of the filler include organic fine particles such as silicone particles (specifically, including silicone rubber particles), inorganic fine particles such as silica (for example, fumed silica), talc, alumina, aluminum nitride, and silicon nitride. Etc. Further, the average value of the maximum length of the filler (in the case of a spherical shape, the average particle diameter) is, for example, 0.1 μm or more, preferably 1 μm or more, and, for example, 200 μm or less, preferably 100 μm or less. The filler can be used alone or in combination. The blending ratio of the filler is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, for example, 70 parts by mass or less, preferably 100 parts by mass of the curable resin. It is 50 parts by mass or less.

  An example of the curable resin is a one-step curable resin.

  The one-step curable resin has a one-step reaction mechanism and is a curable resin that is completely cured by the first-step reaction. As the one-step curable resin, for example, a one-step curable thermosetting resin that is cured by heating, for example, one-step curable active energy ray curing that is cured by irradiation with active energy rays (for example, ultraviolet rays, electron beams, etc.). For example, a functional resin. Preferably, a one-step curable thermosetting resin is used.

  Specifically, examples of the one-step curable thermosetting resin include silicone resin, epoxy resin, polyimide resin, phenol resin, urea resin, melamine resin, and unsaturated polyester resin. Preferably, a one-step curable silicone resin is used from the viewpoint of translucency and durability.

The viscosity of the A-stage one-stage curable resin is, for example, 1,000 mPa · s or more, preferably 3,000 mPa · s or more, more preferably 5,000 mPa · s or more. 1,000,000 mPa · s or less, preferably 500,000 mPa · s or less, more preferably 200,000 mPa · s or less. The viscosity of the A-stage one-stage curable resin is measured at a rotational speed of 99 s ⁻¹ by adjusting the temperature of the A-stage one-stage curable resin to 25 ° C. and using an E-type cone. The following viscosities are measured by the same method as described above.

  The blending ratio of the curable resin is, for example, 30% by mass or more, preferably 40% by mass or more, and more preferably 50% by mass with respect to the varnish (hereinafter may be referred to as a particle-containing curable resin composition). % Or more, for example, 98% by mass or less, preferably 95% by mass or less, and more preferably 90% by mass or less.

  Moreover, a solvent can also be contained in the particle-containing curable resin composition as necessary.

  Examples of the solvent include aliphatic hydrocarbons such as hexane, aromatic hydrocarbons such as xylene, and siloxanes such as vinylmethyl cyclic siloxane and both-end vinyl polydimethylsiloxane. A solvent is mix | blended with a particle | grain containing curable resin composition by the compounding ratio which becomes a viscosity which a particle | grain containing curable resin composition mentions later.

  In order to prepare the particle-containing curable resin composition, the desired particle type, the mixing ratio of the particles, the average value of the maximum length of the particles, the type of the curable resin, the viscosity of the curable resin, the compounding of the curable resin When the ratio and particles contain a phosphor, they are blended based on the absorption peak wavelength of the phosphor, the viscosity of the varnish, and the like. Subsequently, they are mixed using a stirrer or the like.

  In this way, an A-stage varnish is prepared.

  That is, since the varnish contains the A-stage curable resin, the varnish is the A-stage varnish.

  The viscosity of the varnish at 25 ° C. and 1 atm is set to such an extent that the varnish does not spill from the peripheral edge of the upper surface of the release sheet 28 (described later, see FIG. 1A). 1,000 mPa · s or more, preferably 4,000 mPa · s or more, more preferably 8,000 mPa · s, for example, 1,000,000 mPa · s or less, preferably 500,000 mPa · s. Hereinafter, it is more preferably 200,000 mPa · s or less.

<Coating layer manufacturing process>
In order to produce the A-stage coating layer from the varnish, for example, first, the varnish is applied to the surface of the release sheet 28 as shown in FIG. 1A.

  Examples of the release sheet 28 include polymer films such as polyethylene films and polyester films (such as PET), for example, ceramic sheets, such as metal foil. Preferably, a polymer film is used. Further, the surface of the release sheet 28 can be subjected to a peeling treatment such as a fluorine treatment.

  In order to apply the varnish to the surface of the release sheet 28, for example, an application device such as a dispenser, an applicator, or a slit die coater can be used, and a dispenser is preferably used.

  The thickness of the coated A-stage coating layer 50 is, for example, 10 μm or more, preferably 50 μm or more, and, for example, 2,000 μm or less, preferably 1,000 μm or less.

  When a varnish contains a solvent, the coating layer 50 after application | coating can also be heated. The heating condition is a condition in which the curing reaction of the curable resin is not substantially accelerated. Specifically, the temperature is, for example, 40 ° C. or higher, preferably 60 ° C. or higher. 150 ° C or lower, preferably 130 ° C or lower. The heating time is, for example, 1 minute or more, preferably 5 minutes or more, and for example, 60 minutes or less, preferably 40 minutes or less.

<Coating process>
In order to cover the optical semiconductor element 13 with the A-stage covering layer 50, for example, first, as shown in FIG. 1A, a substrate 14 on which the optical semiconductor element 13 is mounted is prepared.

  Examples of the substrate 14 include an insulating substrate such as a silicon substrate, a ceramic substrate, a polyimide resin substrate, and a laminated substrate in which an insulating layer is laminated on a metal substrate. The outer shape of the substrate 14 is not particularly limited, and examples thereof include a substantially rectangular shape in plan view and a substantially circular shape in plan view. The dimension of the board | substrate 14 is selected suitably, for example, maximum length is 2 mm or more, for example, Preferably, it is 10 mm or more, for example, is 300 mm or less, Preferably, it is 100 mm or less.

  Further, on the surface of the substrate 14, a conductor pattern (including an electrode (not shown) for electrical connection with a terminal (not shown) of the optical semiconductor element 13 described below and a wiring continuous therewith ( (Not shown) is formed. Examples of the conductor pattern include conductors such as gold, copper, silver, and nickel.

  Further, the surface of the substrate 14 is formed flat. Or although not shown in figure, the recessed part recessed toward the back surface (upper surface in FIG. 1) may be formed in the surface (lower surface in FIG. 1) in which the optical semiconductor element 13 in the board | substrate 14 is mounted.

  The optical semiconductor element 13 is an LED (light emitting diode element), LD (laser diode), or the like that converts electrical energy into light energy, and has, for example, a cross section whose thickness is shorter than the length in the surface direction (length in the direction perpendicular to the thickness direction). A substantially rectangular shape can be mentioned. The optical semiconductor element 13 is preferably a blue LED that emits blue light. The dimensions of the optical semiconductor element 13 are appropriately selected according to the application and purpose. Specifically, the thickness is, for example, 10 μm or more and 1000 μm or less, and the maximum length is, for example, 0.05 mm or more, preferably , 0.1 mm or more, and for example, 5 mm or less, preferably 2 mm or less.

  The emission peak wavelength of the optical semiconductor element 13 is, for example, 400 nm or more, preferably 430 nm or more, and, for example, 500 nm or less, preferably 470 nm or less.

  The optical semiconductor element 13 is flip-chip mounted or connected to the substrate 14 by wire bonding, for example.

  Also, a plurality (three in FIG. 1) of optical semiconductor elements 13 can be mounted on one substrate 14. The number of mounted optical semiconductor elements 13 per substrate 14 is, for example, 1 or more, preferably 4 or more, and for example, 2000 or less, preferably 400 or less.

  Next, in this method, the substrate 14 on which the optical semiconductor element 13 is mounted is installed in the stacking device 35. The laminating apparatus 35 includes two flat plates 41 that are opposed to each other with an interval in the vertical direction and that can move the laminating apparatus 35 and the substrate 14 in the vertical direction.

  In order to install the substrate 14 on which the optical semiconductor element 13 is mounted in the stacking device 35, specifically, the substrate 14 is installed on the lower flat plate 41 so that the optical semiconductor element 13 faces downward.

  Separately, a coating layer 50 provided on the upper surface of the release sheet 28 is disposed to face the lower side of the optical semiconductor element 13. That is, the release sheet 28 is disposed on the upper surface of the lower flat plate 41 so that the coating layer 50 faces the optical semiconductor element 13 (that is, downward).

  Next, as shown in FIG. 1B, the optical semiconductor element 13 is covered with a covering layer 50. The optical semiconductor element 13 is embedded by the covering layer 50. Specifically, the substrate 14 and the coating layer 50 are stacked close to each other by the stacking device 35. Specifically, as shown by the arrow in FIG. 1A and FIG. 1B, the substrate 14 on which the optical semiconductor element 13 is mounted is lowered (pressed down) with respect to the release sheet 28 provided with the coating layer 50. That is, the upper flat plate 41 is lowered. Alternatively, as shown by the phantom arrows in FIG. 1A and FIG. 1B, the release sheet 28 provided with the coating layer 50 is raised (pushed up) with respect to the substrate 14 on which the optical semiconductor element 13 is mounted. That is, the lower flat plate 41 is raised.

  Thus, the optical semiconductor element 13 is covered with the covering layer 50. That is, the optical semiconductor element 13 is embedded by the coating layer 50.

  Thereafter, the A-stage coating layer 50 is made C-stage (completely cured).

  For example, if the curable resin is a thermosetting resin, the A-stage coating layer 50 is heated.

  Specifically, it is put into an oven (not shown) while maintaining the sandwiched state of the coating layer 50 by the laminating apparatus 35. Thereby, the coating layer 50 of the A stage is heated.

  The heating temperature is, for example, 80 ° C. or higher, preferably 100 ° C. or higher, and for example, 200 ° C. or lower, preferably 180 ° C. or lower. The heating time is, for example, 10 minutes or more, preferably 30 minutes or more, and for example, 10 hours or less, preferably 5 hours or less.

  By heating the coating layer 50, the A-stage coating layer 50 is made C-staged (completely cured).

  On the other hand, if the curable resin is an active energy ray curable resin, the coating layer 50 is irradiated with active energy rays. As a result, the A-stage coating layer 50 is made C-stage (completely cured). Specifically, the A-stage coating layer 50 is irradiated with ultraviolet rays using an ultraviolet lamp or the like.

  Thus, the optical semiconductor device 20 including the covering layer 50, the optical semiconductor element 13 sealed by the covering layer 50, and the substrate 14 on which the optical semiconductor element 13 is mounted is manufactured.

  In FIG. 1B, a plurality of (three) optical semiconductor elements 13 are provided in one optical semiconductor device 20.

  Thereafter, as shown in FIG. 1C, the release sheet 28 is peeled off from the coating layer 50 as indicated by an arrow.

  After that, if necessary, when a plurality of optical semiconductor elements 13 are mounted on one substrate 14, the covering layer 50 can be cut into pieces corresponding to each optical semiconductor element 13. .

[Operational effect of optical semiconductor device manufacturing method]
According to this method, since the optical semiconductor element 13 is covered with the coating layer 50 of the A stage, it is possible to reduce the man-hour for preparing the B stage sheet as in Patent Document 2. Therefore, man-hours can be reduced and the manufacturing efficiency of the manufacturing condition determination apparatus 20 can be improved.

  Further, according to this method, since the A-stage coating layer 50 is manufactured from the varnish and then the optical semiconductor element 13 is coated with the A-stage coating layer 50, the coating is compared with the potting as in Patent Document 1. Layer 50 can be prepared with a uniform thickness. Therefore, the optical semiconductor device 20 having excellent luminous efficiency can be obtained.

  As a result, according to this method, the optical semiconductor device 20 having excellent luminous efficiency can be obtained at low cost.

[Modification]
In the coating process of FIG. 1B, the sheet-fed coating layer 50 and the release sheet 28 are stacked on the substrate 14 on which the optical semiconductor element 13 is mounted using a stacking device 35 including two flat plates 41. For example, although not shown, the long covering layer 50 and the release sheet 28 can be continuously stacked on the substrate 14 on which the plurality of optical semiconductor elements 13 are mounted using a roll device or the like.

  According to this method, the manufacturing efficiency of the optical semiconductor device 20 can be further improved.

[System configuration]
Next, a system for determining and managing the manufacturing conditions of the coating layer manufacturing process in the method for manufacturing the optical semiconductor device 20 will be described.

  As shown in FIG. 2, the system 1 is a system provided in a control department 5 of a sealing layer manufacturing factory and an optical semiconductor device manufacturing factory 4 provided separately from the sealing layer manufacturing factory. The system 1 includes a varnish production step S1 for producing a varnish 11 containing particles and a curable resin, and a sealing layer production step S2 for producing a sealing layer 12 as an example of an A-stage coating layer from the varnish 11 (covering layer production). Example of process), and varnish manufacturing process S1 and sealing layer manufacturing process in the manufacturing method of optical semiconductor device 20 including sealing process S3 (an example of a covering process) for sealing optical semiconductor element 13 with sealing layer 12 Determine and manage the manufacturing conditions of S2. The system 1 includes a manufacturing condition determination device 2 and a sealing layer manufacturing management device 3 as a manufacturing management device.

  The control department 5 is provided, for example, in a sealing layer manufacturing factory capable of manufacturing the same sealing layer 12 as the sealing layer 12 manufactured by the sealing layer manufacturing apparatus 34 (described later) of the optical semiconductor device manufacturing factory 4. ing.

  The control department 5 includes a manufacturing condition determination device 2.

  The manufacturing condition determination device 2 includes a first memory 6 as a first information storage area, a second memory 7 as a second information storage area, a first CPU 8 as a determination unit, and a fifth memory as a fifth information storage area. And a memory 10.

  The first memory 6 stores first information 15 related to the optical semiconductor element 13, the substrate 14 on which the optical semiconductor element 13 is mounted, and the optical semiconductor device 20.

  Specifically, as the first information 15, for example, as information related to the optical semiconductor element 13, for example, the shape of the optical semiconductor element 13, the dimensions of the optical semiconductor element 13, the emission peak wavelength of the optical semiconductor element 13, the substrate 14 Examples include the number of optical semiconductor elements 13 mounted per unit area, the number of optical semiconductor elements 13 mounted per substrate 14, and the like.

  As the first information 15, specifically, information related to the substrate 14 includes, for example, the outer shape of the substrate 14, the dimensions of the substrate 14, the surface shape of the substrate 14 (such as the presence or absence of a recess), and the like. .

  Further, as the first information 15, specifically, as information related to the optical semiconductor device 20, for example, the color temperature of the optical semiconductor device 20, the total luminous flux of the optical semiconductor device 20, the light distribution characteristics of the optical semiconductor device 20. Etc. Specifically, the target color temperature is, for example, 4600K or more and, for example, 5500K or less when the target light color is day white. In addition, when the target light color is warm white, the target color temperature is, for example, 3250K or more, and for example, 3800K or less. The target color temperature is selected from the above temperature range.

  The first memory 6 is configured to be input from a first information source 21 included in the optical semiconductor device manufacturing factory 4.

  The second memory 7 stores second information 16 related to the varnish 11.

  Specifically, as the second information 16, for example, as information related to the particle, for example, the average value of the particle type, the mixing ratio of the particle, and the maximum length of the particle (in the case where the particle is spherical, the average value) Particle diameter). In addition, when particle | grains contain the above-mentioned fluorescent substance, the absorption peak wavelength of fluorescent substance is also mentioned as information relevant to particle | grains. Further, as the second information 16, specifically, as information related to the curable resin, for example, the type of the curable resin, the viscosity of the curable resin, the blending ratio of the curable resin, the curing rate of the curable resin Etc. Furthermore, as the 2nd information 16, specifically, the viscosity of a varnish is mentioned as information relevant to a varnish, for example. Furthermore, as the second information 16, in the case where a positioning mark (not shown) is provided on the above-described release sheet 28, information on the relative positions of the plurality of varnishes 11 after application is also included.

  The 2nd information 16 is constituted so that it may be inputted from the 2nd information source 22 which control department 5 of a sealing layer manufacturing factory has.

  The first CPU 8 is a determination device that determines the manufacturing conditions of the sealing layer 12 based on the first information 15 stored in the first memory 6 and the second information 16 stored in the second memory 7.

  The first CPU 8 stores predetermined program processing in advance, and the first CPU 8 determines the manufacturing conditions of the sealing layer 12 according to the program processing.

  Examples of manufacturing conditions for the sealing layer 12 include application conditions for the varnish 11. In addition, when a varnish contains a solvent, the heating conditions at the time of drying a varnish by heating etc. are mentioned.

  Examples of application conditions for the varnish 11 include the shape of the varnish 11 immediately after application, the thickness of the varnish 11 immediately after application, and the like. The above-described shape includes a shape in which the varnishes 11 are spaced apart from each other.

  The first CPU 8 is configured to be able to read the first information 15 stored in the first memory 6 and the second information 16 stored in the second memory 7.

  The fifth memory 10 is an area for storing the manufacturing conditions of the sealing layer 12 determined by the first CPU 8.

  The fifth memory 10 is provided with a recording area (not shown) in which the fifth information 19 related to the manufacturing conditions for manufacturing the sealing layer 12 before this time can be recorded. Note that the fifth information 19 recorded and accumulated in the recording area is read by the first CPU 8 in this manufacturing, and is again configured to determine the manufacturing conditions of the sealing layer 12 by the first CPU 8. Yes.

  The optical semiconductor device manufacturing factory 4 includes a sealing layer manufacturing device 34 and a sealing device 32.

  The sealing layer manufacturing device 34 includes a varnish manufacturing device 33, a coating device 31, and a sealing layer manufacturing management device 3.

  The varnish production apparatus 33 includes, for example, a container 52 equipped with a stirrer 51.

  The coating device 31 includes, for example, a dispenser, an applicator, and a slit die coater. Moreover, although not shown in figure, the coating device 31 can also be equipped with the oven which has a heater arrange | positioned at intervals.

  The sealing layer manufacturing management device 3 includes a third memory 23 as a third information storage area, a fourth memory 24 as a fourth information storage area, and a second CPU 25 as a correction means that is a management means.

  The third memory 23 stores third information 17 related to the manufacturing conditions of the sealing layer 12 determined by the first CPU 8.

  The third information 17 includes the manufacturing conditions of the sealing layer 12 determined by the first CPU 8.

  The third memory 23 is configured such that the third information 17 determined in the fifth memory 10 is input from the fifth memory 10.

  The fourth memory 24 stores at least one kind of lot information of particles, curable resin, varnish and optical semiconductor element 13 and / or fourth information 18 including the production amount of the optical semiconductor device 20 per unit period. .

  The lot information is information that fluctuates with the change of the lot, and specifically, the average value of the maximum length of particles that differ depending on the lot (the average particle diameter when the particles are spherical), etc. In addition, the viscosity of the curable resin, which varies depending on the lot, may be used. In addition, when particle | grains contain fluorescent substance, the absorption peak wavelength of the fluorescent substance which changes with lots is mentioned as lot information of fluorescent substance. Furthermore, information related to varnishes that vary from lot to lot includes the viscosity of the varnish resulting from different lots of the particles and / or curable resin.

  The production amount of the optical semiconductor device 20 per unit period is, for example, 1,000 or more, preferably 5,000 or more, as the production amount of the optical semiconductor device 20 per month. It is selected from a range of 200,000 or less.

  The fourth memory 24 is configured to receive the fourth information 18 from the first information source 21 in the optical semiconductor device manufacturing factory 4 and the second information source 22 in the control department 5.

  Among the fourth information 18, examples of the fourth information 18 </ b> B input from the first information source 21 include lot information of the optical semiconductor element 13 and the production amount of the optical semiconductor device 20 per unit period. Examples of the fourth information 18A input from the second information source 22 include particle lot information, curable resin lot information, and varnish lot information.

  Predetermined program processing is stored in advance in the second CPU 25, and the second CPU 25, based on the third information 17 stored in the third memory 23, manufacture conditions of the varnish manufacturing step S 1, and sealing layer manufacture The manufacturing conditions in step S2 are managed. The second CPU 25 can also correct the manufacturing conditions of the varnish manufacturing process S1 and the manufacturing conditions of the sealing layer manufacturing process S2 based on the fourth information 18 stored in the fourth memory 24.

  The second CPU 25 is configured to be able to read the third information 17 stored in the third memory 23 and the fourth information 18 stored in the fourth memory 24.

  The second CPU 25 is configured to be able to manage and modify each of the manufacturing conditions of the varnish manufacturing process S1 and the manufacturing conditions of the sealing layer manufacturing process S2 in each of the varnish manufacturing apparatus 33 and the coating apparatus 31.

  The sealing device 32 includes a stacking device 35 and a sealing control device 36.

  As the laminating apparatus 35, for example, a laminating machine having two flat plates 41 which are opposed to each other with an interval in the vertical direction and can move the sealing layer 12 and the substrate 14 in the vertical direction is selected.

  The sealing control device 36 is configured to control the sealing conditions in the sealing step S3. The sealing control device 36 is provided with a memory (not shown) so that the sealing condition of the sealing step S3 is input from the first information source 21 and the sealing condition of the sealing step S3 is controlled. ,It is configured.

  Next, a method for manufacturing the optical semiconductor device 20 in the optical semiconductor device manufacturing factory 4 using the system 1 will be described.

1. Manufacturing Condition Determination Step In this method, first information 15 is first input from the first information source 21 to the first memory 6. The input of the first information 15 to the first memory 6 is not particularly limited. For example, the first information 15 may be input through a line such as a network connecting the first information source 21 and the first memory 6. Alternatively, for example, the first information 15 can be input to the second memory 7 from the first information source 21 via communication means such as fax, mail, and mail.

  Separately, the second information 16 is input from the second information source 22 to the second memory 7. The method for inputting the second information 16 to the second memory 7 is the same as the method for inputting the first information 15 to the first memory 6.

  Next, the first CPU 8 reads out the first information 15 stored in the first memory 6 and the second information 16 stored in the second memory 7, and then, according to a predetermined program process, these first information Based on 15 and the second information 16, the manufacturing condition of the sealing layer 12 is determined as the third information 17 (described in detail below).

2. Manufacturing management process Thereafter, the third information 17 determined by the first CPU 8 is recorded in the fifth memory 10, and then the third information 17 recorded in the fifth memory 10 is input to the third memory 23. .

  The method for inputting the third information 17 to the third memory 23 is the same as the method for inputting the first information 15 to the first memory 6.

  Separately, the fourth information 18 is input from the first information source 21 and the second information source 22 to the fourth memory 24. The method for inputting the fourth information 18 to the fourth memory 24 is the same as the method for inputting the first information 15 to the first memory 6.

  Thereafter, the second CPU 25 reads out the third information 17 stored in the third memory 23, and subsequently, according to a predetermined program process, based on the third information 17, the manufacturing conditions of the varnish manufacturing step S1, and the sealing The production conditions of the layer production process S2 are managed.

  And in the sealing layer manufacturing apparatus 34, based on the manufacturing conditions managed by 2nd CPU25, varnish manufacturing process S1 and sealing layer manufacturing process S2 are implemented sequentially.

3. Varnish manufacturing process S1
In the varnish manufacturing apparatus 33, first, the varnish manufacturing process S1 is performed according to the manufacturing conditions managed by the second CPU 25.

  Specifically, in varnish manufacturing process S1, first, each of particle | grains and curable resin is prepared, these are mixed, and varnish 11 is prepared as a particle | grain containing curable resin composition.

  The particles are selected from, for example, the above examples, specifically, phosphors and fillers.

  The shape of the phosphor is selected from the above examples. The average value of the maximum length of the phosphor (in the case of a spherical shape, the average particle diameter) is selected from the above exemplary range. The absorption peak wavelength of the phosphor is selected from the above exemplary range. The blending ratio of the phosphor is selected from the above-described exemplary range.

  The filler is selected from the above examples. The average value of the maximum length of the filler (in the case of a spherical shape, the average particle diameter) is selected from the above-described exemplary range. The blending ratio of the filler is selected from the above exemplary range.

  The curable resin is selected from the above examples. The viscosity of the A-stage one-stage curable resin is selected from the above-described exemplary range. The blending ratio of the curable resin is selected from the above-described exemplary range.

  In order to prepare the particle-containing curable resin composition, specifically, as shown in FIG. 2, in the varnish manufacturing apparatus 33, each component described above in the container 52 is managed by the second CPU 25. Manufacturing conditions of step S1, for example, the type of varnish 11 managed by the second CPU 25, more specifically, the average value of the type of particles, the blending ratio of particles, and the maximum length of particles managed by the second CPU 25 ( If the particles are spherical, the average particle diameter), the type of curable resin, the viscosity of the curable resin, the blending ratio of the curable resin, and if the particles contain a phosphor, the absorption peak wavelength of the phosphor Based on the viscosity of the varnish 11 and the like. Subsequently, they are mixed using a stirrer 51.

  In this way, A-stage varnish 11 is prepared.

  The viscosity of the varnish 11 under the conditions of 25 ° C. and 1 atm is adjusted so as to be within the above-described exemplary range.

4). Sealing layer manufacturing process S2
In the coating device 31, after the varnish manufacturing step S1, the sealing layer manufacturing step S2 is performed according to the manufacturing conditions managed by the second CPU 25.

  That is, the sealing layer 12 is manufactured from the varnish 11.

  In order to manufacture the sealing layer 12, for example, first, the varnish 11 is applied to the surface of the release sheet 28.

  The release sheet 28 is selected from the above examples. The shape of the release sheet 28 is not particularly limited, and is selected from, for example, a substantially rectangular shape in plan view (including a strip shape and a long shape). Further, as the release sheet 28, the presence / absence of formation of a positioning mark (not shown), and the positional information and dimensions of the positioning mark are selected. The mark is formed so that a region where the varnish 11 is applied is secured.

  The coating device 31 that applies the varnish 11 to the surface of the release sheet 28 is selected from, for example, a dispenser, an applicator, and a slit die coater. Preferably, it is selected from a dispenser.

  The thickness of the sealing layer 12 is selected from the application conditions of the varnish 11 so as to be in the above-described exemplary range.

  That is, the varnish 11 is applied so as to be adjusted to the manufacturing conditions managed by the second CPU 25, specifically, the shape of the varnish 11 immediately after application and the thickness of the varnish 11 immediately after application, which are managed by the second CPU 25. It is selected from the application conditions of the device 31.

  When a positioning mark (not shown) is formed on the release sheet 28, the positioning mark is checked while confirming the application position with respect to the positioning mark by a sensor (not shown) provided in the coating device 31. The relative position of the varnish 11 with respect to is adjusted.

  Thereafter, when the varnish 11 contains a solvent, the varnish 11 is dried. Specifically, the varnish 11 is heated. The heating condition is selected from the above-described exemplary range.

  Thereby, the sealing layer 12 provided on the surface of the release sheet 28 is manufactured.

5. Sealing step S3
In the stacking device 35 of the sealing device 32, after the sealing layer manufacturing step S2, the sealing step S3 is performed according to the conditions controlled by the sealing control device 36.

  Specifically, in the sealing step S3, first, a substrate 14 on which the optical semiconductor element 13 is mounted is prepared.

  The substrate 14 is selected from the above examples. The outer shape of the substrate 14 is selected from the above examples. The dimensions of the substrate 14 are selected from the above examples.

  The optical semiconductor element 13 is selected from the above examples. The dimension of the optical semiconductor element 13 is selected from the above-described exemplary range. The emission peak wavelength of the optical semiconductor element 13 is selected from the above-described exemplary range.

  The optical semiconductor element 13 is flip-chip mounted or connected to the substrate 14 by wire bonding, for example.

  Further, the optical semiconductor element 13 can be mounted in plural numbers (three in FIG. 1) on one substrate 14. The number of mounted optical semiconductor elements 13 per substrate 14 is selected from the above-described exemplary range.

  Next, in this method, the substrate 14 on which the optical semiconductor element 13 is mounted is installed in the stacking device 35. The stacking device 35 is selected from the above examples. As the method of installing the substrate 14 on which the optical semiconductor element 13 is mounted in the laminating apparatus 35, the above-described example is adopted.

  Next, the optical semiconductor element 13 is covered with the sealing layer 12. The above-described example is adopted as a method of covering the optical semiconductor element 13 with the sealing layer 12.

  Thereafter, the A-stage sealing layer 12 is changed to the C-stage.

  For example, the A-stage sealing layer 12 is converted to the C-stage based on the heating condition of the sealing layer 12 and the active energy ray irradiation conditions in the C-staging controlled by the sealing controller 36.

  Specifically, when the thermosetting type is selected as the one-step curable resin, the A-stage sealing layer 12 is heated.

  Specifically, the laminating apparatus 35 is put into the oven while maintaining the sandwiched state of the sealing layer 12 by the flat plate 41. As a result, the A-stage sealing layer 12 is heated.

  The heating temperature is selected from the above exemplary range. The heating time is selected from the above-described exemplary range.

  By heating the sealing layer 12, the A-stage sealing layer 12 is C-staged (completely cured).

  Thus, the optical semiconductor device 20 including the sealing layer 12, the optical semiconductor element 13 sealed by the sealing layer 12, and the substrate 14 on which the optical semiconductor element 13 is mounted is manufactured.

  Thereafter, as shown in FIG. 1C, the release sheet 28 is peeled off from the sealing layer 12 as indicated by an arrow.

6). Accumulation of manufacturing conditions, lot change and manufacturing amount per unit period In the manufacturing of the sealing layer 12 before this time, the manufacturing conditions of the varnish manufacturing process S1 and the manufacturing conditions of the sealing layer manufacturing process S2 are as follows. Are recorded and accumulated in a recording area (not shown).

  That is, the fifth memory 10 inputs the third information 17 to the third memory 23 and stores the third information 17 as it is in the recording area of the fifth memory 10 as the fifth information 19 that is past information.

  And by manufacture of the sealing layer 12 this time, 1st CPU8 is the 5th memory 10, and the manufacturing conditions of the varnish manufacturing process S1 which manufactured the sealing layer 12 before this time, and sealing layer manufacture The manufacturing conditions of the step S2 are read, and based on this, the manufacturing conditions of the current varnish manufacturing step S1 and the manufacturing conditions of the current sealing layer manufacturing step S2 are determined.

  In addition, the lot information of at least one kind of particles, curable resin, varnish, and optical semiconductor element, and / or the production amount of the optical semiconductor device 20 per unit period varies. Corresponding to the fluctuation, the fourth information 18 is input from the first information source 21 and the second information source 22 to the fourth memory 24, and then the second CPU 25 is stored in the fourth memory 24. The fourth information 18 is read, and the manufacturing conditions of the varnish manufacturing process S1 and / or the manufacturing conditions of the sealing layer manufacturing process S2 are corrected according to a predetermined program process.

[System effects]
In the system 1, the manufacturing condition determination device 2 includes the first memory 6, the second memory 7, and the first CPU 8, while the sealing layer manufacturing management device 3 includes the third memory 23 and the second CPU 25. With.

  Then, the manufacturing condition determination device 2 stores the first information 15 and the second information 16 in the first memory 6 and the second memory 7, respectively, and the first CPU 8 performs the process of the sealing layer manufacturing step S2. Manufacturing conditions can be determined and provided to the sealing layer manufacturing management device 3.

  Then, in the sealing layer manufacturing management device 3, the third information 17 related to the manufacturing conditions provided from the manufacturing condition determining device 2 is stored in the third memory 23, and the third information 17 is based on the third information 17. The manufacturing conditions of the sealing layer manufacturing step S2 are managed by the 2CPU 25.

  Therefore, the manufacturing conditions of the sealing layer manufacturing step S2 can be determined separately from the sealing layer manufacturing management device 3 by the manufacturing condition determination device 2, and the sealing layer manufacturing management device 3 manages them. Can do.

  Further, the third information 17 related to the manufacturing conditions of the sealing layer manufacturing process S <b> 2 provided from the manufacturing condition determining device 2 is based on the first information 15 and the second information 16. Therefore, the sealing layer manufacturing management device 3 can accurately manage the manufacturing conditions of the sealing layer manufacturing step S2 by the second CPU 25 based on the third information 17 provided from the manufacturing condition determining device 2. As a result, the target optical semiconductor device 20 can be manufactured with high accuracy.

  Further, in this system 1, the first CPU 8 determines the manufacturing conditions of the varnish manufacturing process S 1 based on the first information 15 stored in the first memory 6 and the second information 16 stored in the second memory 7. Further, the second CPU 25 further manages the manufacturing conditions of the varnish manufacturing process S <b> 1 based on the third information 17 stored in the third memory 23. Therefore, the sealing layer 12 suitable for the target optical semiconductor device 20 can be manufactured with high accuracy, and further, the target optical semiconductor device 20 can be manufactured with high accuracy.

  Furthermore, according to this system 1, since the first information 15 includes information related to the substrate 14 on which the optical semiconductor element 13 is mounted, the manufacturing condition determination apparatus 2 uses the substrate 14 on which the optical semiconductor element 13 is mounted. The information related to the optical semiconductor element 13 and the information related to the optical semiconductor device 20 can also be provided.

  Therefore, based on the highly accurate third information 17 related to the manufacturing conditions of the sealing layer manufacturing process S2 determined based on the first information 15, the sealing layer manufacturing management device 3 performs the sealing layer manufacturing process S2. The manufacturing conditions can be managed with higher accuracy.

  In the system 1, in the sealing layer manufacturing management apparatus 3, at least one lot information of particles, curable resin, varnish, and optical semiconductor element 13 stored in the fourth memory 24 by the second CPU 25, and / Or based on the 4th information 18 containing the manufacturing amount of the optical semiconductor device 20 per unit period, the manufacturing conditions of sealing layer manufacturing process S2 can be corrected. Therefore, the manufacturing conditions of the varnish manufacturing process S1 and the manufacturing conditions of the sealing layer manufacturing process S2 are corrected in response to the lot information and / or the fluctuation of the manufacturing amount of the optical semiconductor device 20, and the object The optical semiconductor device 20 can be manufactured with high accuracy.

  Furthermore, according to the system 1, the fifth memory 10 of the manufacturing condition determination device 2 can accumulate the fifth information 19 related to the manufacturing conditions for manufacturing the sealing layer 12 before this time. Therefore, based on the manufacturing conditions accumulated in the past, the sealing layer 12 suitable for the target optical semiconductor device 20 can be manufactured this time, and further, the target optical semiconductor device 20 can be manufactured accurately this time. .

  According to this system, since the manufacturing condition determining device 2 can remotely communicate with the sealing layer manufacturing management device 3 via the network, the manufacturing condition determining device 2 is remotely located with respect to the sealing layer manufacturing management device 3. Even if it does, the manufacturing conditions of sealing layer manufacturing process S2 determined in the manufacturing condition determination apparatus 2 can be rapidly provided to the sealing layer manufacturing management apparatus 3. FIG.

  Furthermore, according to this system 1, the sealing layer manufacturing management device 3 is provided in the sealing layer manufacturing device 34 of the optical semiconductor device manufacturing factory 4, and the manufacturing condition determination device 2 is connected to the sealing layer manufacturing device 34. On the other hand, even if it is provided in the control department 5 located at the far end, the manufacturing condition determination device 2 can remotely communicate with the sheet manufacturing management device 3 via the network. The manufacturing conditions of S2 can be quickly provided to the sheet manufacturing management device 3.

  The manufacturing condition determination device 2 includes a first memory 6, a second memory 7, and a first CPU 8.

  Therefore, according to this manufacturing condition determination device 2, the first information 15 and the second information 16 are stored in the first memory 6 and the second memory 7, respectively, and the first CPU 8 performs the varnish manufacturing process S1. Manufacturing conditions and the manufacturing conditions of sealing layer manufacturing process S2 can be determined.

  As a result, based on the manufacturing conditions of the varnish manufacturing step S1 and the manufacturing conditions of the sealing layer manufacturing step S2, the target optical semiconductor device 20 can be accurately manufactured.

  Further, in the manufacturing condition determining apparatus 2, the second CPU 25 performs the varnish manufacturing step S 1 based on the first information 15 stored in the first memory 6 and the second information 16 stored in the second memory 7. Manufacturing conditions and the manufacturing conditions of sealing layer manufacturing process S2 are further determined. Therefore, the sealing layer 12 suitable for the target optical semiconductor device 20 can be manufactured with high accuracy, and further, the target optical semiconductor device 20 can be manufactured with high accuracy.

  Further, according to the manufacturing condition determining apparatus 2, since the first information 15 includes information related to the substrate 14 on which the optical semiconductor element 13 is mounted, the manufacturing condition determining apparatus 2 has the optical semiconductor element 13 mounted thereon. The information related to the substrate 14 can also be provided together with the information related to the optical semiconductor element 13 and the information related to the optical semiconductor device 20.

  Therefore, the target optical semiconductor device 20 can be manufactured with high accuracy.

  According to the manufacturing condition determining apparatus 2, the fifth information 19 related to the manufacturing conditions for manufacturing the sealing layer 12 before this time can be accumulated. Therefore, based on the manufacturing conditions accumulated in the past, the sealing layer 12 suitable for the target optical semiconductor device 20 can be manufactured this time, and further, the target optical semiconductor device 20 can be manufactured accurately this time. .

  According to the sealing layer manufacturing management device 3, the third information 23 including the manufacturing conditions related to the varnish manufacturing process S1 and the manufacturing conditions related to the manufacturing conditions of the sealing layer manufacturing process S2 is stored in the third memory 23. The second CPU 25 can accurately manage the manufacturing conditions related to the varnish manufacturing process S1 and the manufacturing conditions of the sealing layer manufacturing process S2 based on the third information 17.

  Therefore, the target optical semiconductor device 20 can be manufactured with high accuracy.

  Moreover, according to this sealing layer manufacturing management apparatus 3, 2nd CPU25 is based on the 3rd information 17 stored in the 3rd memory 23, manufacturing conditions relevant to varnish manufacturing process S1, and sealing layer manufacture Since the manufacturing conditions in the step S2 are further controlled, the sealing layer 12 suitable for the target optical semiconductor device 20 can be manufactured with high accuracy, and further, the target optical semiconductor device 20 can be manufactured with high accuracy. it can.

  Further, in the sealing layer manufacturing management device 3, the second CPU 25 stores at least one kind of lot information of particles, curable resin, varnish, and optical semiconductor element stored in the fourth memory 24, and / or a unit period. Based on the fourth information 18 including the manufacturing amount of the corresponding optical semiconductor device 20, the manufacturing conditions related to the varnish manufacturing process S1 and the manufacturing conditions of the sealing layer manufacturing process S2 can be corrected. Therefore, the manufacturing conditions related to the varnish manufacturing process S1 and the manufacturing conditions of the sealing layer manufacturing process S2 are corrected by easily responding to fluctuations in the lot information and / or the manufacturing amount of the optical semiconductor device 20. The optical semiconductor device 20 can be accurately manufactured.

[Modification]
In the description of FIG. 3, the same members as those in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the embodiment of FIG. 2, the manufacturing condition determination device 2 and the sealing layer manufacturing management device 3 have a one-to-one relationship, that is, one sealing layer manufacturing management device 3 for one manufacturing condition determination device 2. Is provided. However, the correspondence relationship between the manufacturing condition determination device 2 and the sealing layer manufacturing management device 3 is not limited to this. For example, as shown in FIG. A layer production management device 3 can also be provided.

  Specifically, the sealing layer manufacturing management device 3 is installed in each of a plurality of optical semiconductor device manufacturing factories 4 provided independently of each other. The manufacturing condition determination device 2 and the plurality of sealing layer manufacturing management devices 3 can input a plurality of first information 15 from the first information source 21 included in each of the plurality of sealing layer manufacturing management devices 3 to the first memory 6. And the third information 17 determined by the first CPU 8 can be input from the fifth memory 10 to the plurality of third memories 23.

  In the embodiment of FIG. 3, one manufacturing condition determination device 2 provides the third information 17 to one sealing layer manufacturing management device 3 </ b> A (3), and one sealing layer manufacturing management device 3 </ b> A ( 3) The first information 15 is obtained from the first information source 21 and stored in the first memory 6, the first information 15 is accumulated in the fifth memory 10, and another sealing layer manufacturing management device It can also be provided to 3B (or another plurality of sealing layer manufacturing management devices 3B and 3C) (3).

  That is, one manufacturing condition determination device 2 has a plurality of first information 15 (first information 15 to be stored in the first memory 6, specifically, provided from a plurality of sealing layer manufacturing management devices 3. Information related to the optical semiconductor element 13, information related to the substrate 14, and information related to the optical semiconductor device 20) can be unified. That is, one manufacturing condition determination device 2 aggregates the first information 15 of the plurality of sealing layer manufacturing management devices 3, and stores the third information 17 corresponding to them in the plurality of sealing layer manufacturing management devices 3. It can function as an intensive manufacturing condition determination device 2 that can be provided.

  Therefore, it is possible to provide the third information 17 with high accuracy to each sealing layer manufacturing management device 3 while being one manufacturing condition determining device 2.

  In the embodiment of FIG. 2, the system 1 determines and manages the manufacturing process of the varnish manufacturing process S1. That is, the manufacturing conditions of the varnish manufacturing process S1 are managed by the sealing layer manufacturing management device 3. However, the system 1 can also be configured so that the system 1 does not determine and manage the manufacturing process of the varnish manufacturing process S1. Specifically, it is also possible to manage only the manufacturing conditions of the sealing layer manufacturing process S2 without managing the manufacturing conditions of the varnish manufacturing process S1.

  According to this embodiment, since it is not necessary for the second CPU 25 to manage the manufacturing conditions of the varnish manufacturing step S1, the configuration of the second CPU 25 can be simplified.

  In the embodiment of FIG. 2, as the manufacturing management apparatus of the present invention, the sealing layer manufacturing management apparatus 3 manages the manufacturing conditions of the sealing layer manufacturing process S2, and the sealing control apparatus 36 performs the sealing process S3. For example, the sealing layer manufacturing management device 3 also serves as the sealing control device 36 to constitute one manufacturing management device, and the manufacturing conditions of the sealing layer manufacturing step S2 It is also possible to manage both the sealing conditions in the sealing step S3.

  2 and 3, the sealing layer 12 is selected as a phosphor layer (phosphor-containing sealing layer). For example, although not shown, the sealing layer does not contain a phosphor. (Resin layer) 12 can also be selected.

  In the description of FIG. 2, the first information 15 includes information related to the substrate 14 on which the optical semiconductor element 13 is mounted. However, the first information 15 may be configured without including the information.

DESCRIPTION OF SYMBOLS 1 System 2 Manufacturing condition determination apparatus 3 Sheet manufacturing management apparatus 6 1st memory 8 1st CPU
11 Varnish 12 Sealing layer 13 Optical semiconductor element 14 Substrate 15 First information 16 Second information 17 Third information 20 Optical semiconductor device 23 Third memory 24 Fourth memory 50 Coating layer S1 Varnish manufacturing process S2 Coating layer manufacturing process S3 Sealing Stop process

Claims (15)

Varnish production process for producing varnish containing particles and curable resin,
A coating layer production process for producing an A-stage coating layer from the varnish; and
A method of manufacturing an optical semiconductor device comprising a coating step of coating an optical semiconductor element with the coating layer of the A stage. A system for determining and managing manufacturing conditions of the coating layer manufacturing process in the method of manufacturing an optical semiconductor device according to claim 1,
The system includes a manufacturing condition determination device and a manufacturing management device,
The manufacturing condition determining device is:
A first information storage area for storing first information related to the optical semiconductor element and the optical semiconductor device;
A second information storage area for storing second information related to the varnish;
Determining means for determining the manufacturing conditions based on the first information stored in the first information storage area and the second information stored in the second information storage area;
The manufacturing management apparatus is
A third information storage area for storing third information related to the manufacturing conditions determined by the determining means;
And a management unit that manages the manufacturing conditions of the coating layer manufacturing process based on the third information stored in the third information storage area. The system further determines and manages the manufacturing conditions of the varnish manufacturing process;
The determination means further determines the manufacturing conditions of the varnish manufacturing process based on the first information stored in the first information storage area and the second information stored in the second information storage area. Decide
The system according to claim 2, wherein the management unit further manages the manufacturing condition of the varnish manufacturing process based on the third information stored in the third information storage area.   The system according to claim 2, wherein the first information includes information related to a substrate on which the optical semiconductor element is mounted. The manufacturing management apparatus is
A fourth information storage area storing at least one kind of lot information of particles, curable resin, varnish, and optical semiconductor element, and / or fourth information including the production amount of the optical semiconductor device per unit period;
The correction means which correct | amends the said manufacturing conditions of the said coating layer manufacturing process based on the said 4th information stored in the said 4th information storage area, The any one of Claims 2-4 characterized by the above-mentioned. The system described in the section. The manufacturing condition determining device is:
A fifth information storage area for storing fifth information related to manufacturing conditions for manufacturing the covering layer before this time;
6. The manufacturing condition for manufacturing the covering layer at this time is determined based on the fifth information stored in the fifth information storage area. 6. System.   The system according to any one of claims 2 to 6, wherein the manufacturing condition determination device performs remote communication with the manufacturing management device via a network. The manufacturing management device is provided in the coating layer manufacturing device,
The system according to claim 7, wherein the manufacturing condition determination device is provided in a control department located at a far end with respect to the coating layer manufacturing device. A manufacturing condition determining device for determining manufacturing conditions of the coating layer manufacturing process in the method of manufacturing an optical semiconductor device according to claim 1,
A first information storage area for storing first information related to the optical semiconductor element;
A second information storage area for storing second information related to the varnish;
And determining means for determining the manufacturing conditions based on the first information stored in the first information storage area and the second information stored in the second information storage area. Manufacturing condition determination device. The manufacturing condition determining device further determines manufacturing conditions of the varnish manufacturing process,
The determination means further determines the manufacturing conditions of the varnish manufacturing process based on the first information stored in the first information storage area and the second information stored in the second information storage area. The manufacturing condition determination device according to claim 9, wherein the determination is performed.   The manufacturing condition determination apparatus according to claim 9, wherein the first information includes information related to a substrate on which the optical semiconductor element is mounted. A fifth information storage area for storing fifth information related to manufacturing conditions for manufacturing the covering layer before this time;
12. The manufacturing condition for manufacturing the coating layer at this time is determined based on the fifth information stored in the fifth information storage area, according to claim 9. Manufacturing condition determination device. A manufacturing management device for managing manufacturing conditions of the coating layer manufacturing process according to claim 1,
A third information storage area for storing third information related to the manufacturing conditions;
A manufacturing management apparatus comprising: a management unit that manages the manufacturing conditions of the coating layer manufacturing process based on the third information stored in the third information storage area. The production management device manages the production conditions of the varnish production process,
The manufacturing management apparatus according to claim 13, wherein the management means further manages the manufacturing conditions of the varnish manufacturing process based on the third information stored in the third information storage area. . A fourth information storage area storing at least one kind of lot information of particles, curable resin, varnish, and optical semiconductor element, and / or fourth information including the production amount of the optical semiconductor device per unit period;
The manufacturing method according to claim 13, further comprising correction means for correcting the manufacturing condition of the coating layer manufacturing process based on the fourth information stored in the fourth information storage area. Management device.

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