TW201437594A - Heat sink with heat pipe - Google Patents

Abstract

A heat sink with pipe comprises a first body, a second body and a heat pipe. The first body comprises a first heat conduction part and a plurality of first fins, and the first fins are disposed at the first heat conduction part. The second body comprises a second heat conduction part and a plurality of second fins, and the second fins are disposed at the second heat conduction part, wherein the first heat conduction part has a first grooving, and the second heat conduction part has a second grooving which is corresponding to the first grooving. An end of heat pipe is disposed in the first grooving, and the second heat conduction part is combined with the first heat conduction part, the heat pipe is inserting in the second grooving. The second fins with the second fins are overlapped and staggered arrangement.

Description

Heat pipe radiator

The present invention relates to a heat sink, and more particularly to a heat pipe heat sink.

With the rapid development of high technology in today's society, the volume of electronic components in electronic products is becoming more and more small, and the density per unit area is getting higher and higher, and the overall performance is continuously enhanced. Under these factors, In order to keep the operating temperature of each component of the electronic device within a reasonable range, a heat sink must be added to the electronic component that generates heat to promote heat exchange with the environment, if there is no good heat sink effectively Excluding the waste heat generated by electronic components, the excessive temperature of such waste heat will cause electronic components to generate electron detachment and thermal stress, and cause system stability to decrease, and shorten the life of the electronic components themselves. Therefore, how to eliminate these waste heat to avoid Overheating of electronic components has always been a problem that cannot be ignored.

Conventional heat sinks are most commonly used in aluminum extrusion. At present, the traditional aluminum extrusion heat sink uses a single extrusion rework method to make the discontinuous surface between the base and the plurality of fins uninterrupted to achieve one-piece molding. structure. In use, the base of the aluminum extruded heat sink with heat sink fins is attached to the heat pipe or the heat generating component (such as a central processing unit, an image processor or a wafer), and there is no connection between the base and the plurality of fins. The characteristics of the contact with the thermal impedance make the heat transfer between the base and the fins good, and the heat dissipation efficiency is fast. However, aluminum extrusion is limited by the mold making and forming technology, so that the aspect ratio of the fins to the height of the fins has a certain upper limit, and it is impossible to make a heat sink of high-density fins, so that it cannot be further improved. The surface area of the heat sink leads to insufficient heat dissipation area. Affect the heat dissipation effect.

Because the heat dissipation area of the conventional aluminum extrusion type heat sink is insufficient, in order to improve the heat dissipation rate of the conventional heat sink structure, it is necessary to increase the number of heat dissipation fins to increase the total heat dissipation area. However, the use of the machine tool and the fixture increases the fins. The number increases the fin density, and the thickness of the fins is easily broken due to the thinning of the fins, resulting in problems such as difficulty in processing and increase in cost.

Therefore, if the aluminum extruded heat sink can increase the number of fins and reduce the spacing between the fins to achieve the effect of multiplying the total heat area, it can have faster heat transfer efficiency and better than the prior art. Cooling effect.

In view of the above problems, the present invention provides a heat pipe type heat sink, thereby solving the problem that the conventional aluminum extruded radiator cannot be made into a heat sink having high density fins due to limitation of mold making and forming technology, so that the heat dissipation area is insufficient, thereby affecting Its heat dissipation effect and other issues.

The invention provides a heat pipe type heat sink, comprising a first body, a second body and a heat pipe. The first body includes a first heat conducting portion and a plurality of first heat dissipating fins, and the plurality of first heat dissipating fins are spaced apart from each other on the first heat conducting portion, and the adjacent first heat dissipating fins are formed a second body includes a second heat conducting portion integrally formed with the plurality of second heat dissipating fins, and the plurality of second heat dissipating fins are spaced apart from the second heat conducting portion, and the adjacent second heat dissipating fins Forming a gap therebetween, wherein the first heat conducting portion has a first slot, the second heat conducting portion has a second slot, the second slot corresponds to the first slot, and one end of the heat pipe is disposed at the first slot The second heat conducting portion is coupled to the first heat conducting portion, the heat conducting tube is embedded in the second slot, and the second heat dissipating fin is staggered with the first heat dissipating fins and overlaps each other.

The effect of the invention is that the heat pipe type heat sink can not only enable the two bodies to be clamped and fixed in the way of the upper and lower fastenings, but also closely adhere to each other to increase the heat transfer rate, and at the same time, the heat dissipation fins are staggered and phased. The overlapping structure design fills the gap between the fins, thereby reducing the distance between the fins and the fins, so that the heat pipe radiator can have a high density of fins, thereby making the total heat dissipation area Greatly increased to achieve good heat dissipation. In addition, the heat sink fin shape can be used as a spindle type design, so that the part of the heat pipe is larger in contact with the heat pipe, and the two sides are thinner, so that the heat source can be quickly transmitted to the two sides of the heat sink fin, and the temperature is uniform. Fast heat dissipation.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

100‧‧‧Heat tube radiator

110‧‧‧First Ontology

111‧‧‧First heat transfer department

112‧‧‧First heat sink fin

113‧‧‧First slotting

120‧‧‧Second ontology

121‧‧‧Second heat conduction section

122‧‧‧Second heat sink fins

123‧‧‧Second slotting

130‧‧‧Heat pipe

140‧‧‧thermal base

141‧‧‧heat conducting plate

142‧‧‧Fin set

Fig. 1 is an exploded perspective view showing a heat pipe type heat sink according to a first embodiment of the present invention.

Fig. 2 is a schematic view showing the combination of the heat pipe type heat sink according to the first embodiment of the present invention.

FIG. 3 is a schematic view showing the arrangement of the first heat dissipation fin and the second heat dissipation fin of the heat pipe type heat sink according to the first embodiment of the present invention.

Fig. 4 is a perspective view showing a heat pipe type heat sink according to a second embodiment of the present invention.

The heat pipe type heat sink 100 according to the second embodiment of the present invention is an aluminum extruded heat sink as an embodiment, but is not limited to the type disclosed in the embodiment, and those skilled in the art may The appearance of the heat pipe type heat sink 100 of the present invention is correspondingly changed according to actual design requirements or usage requirements.

Please refer to the exploded schematic view and the combined schematic view of the heat pipe type heat sink of the first embodiment shown in FIGS. 1 to 3. The heat pipe heat sink 100 of the present embodiment is used for being coupled to an electronic component that generates a large amount of heat when operating, such as a central processing unit (CPU) or a graphics processing unit (GPU). The heat pipe radiator 100 includes a first A body 110, a second body 120, and a heat pipe 130, and the material of the first body 110 and the second body 120 may be aluminum or aluminum alloy, which is beneficial for extrusion. Process and good thermal conductivity and heat dissipation.

The first body 110 of the present embodiment includes a first heat conducting portion 111 and a plurality of first heat radiating fins 112. The plurality of first heat radiating fins 112 may be, but not limited to, spaced apart from the first heat conducting portion. The two sides of the first heat conducting portion 111 are disposed on the opposite sides of the first heat conducting portion 111 as an example, but are not limited thereto. In addition, a gap is formed between the first heat dissipation fin 112 and the adjacent other first heat dissipation fin 112. The second body 120 includes a second heat-conducting portion 121 and a plurality of second heat-dissipating fins 122. The plurality of second heat-dissipating fins 122 are spaced apart from the left and right sides of the second heat-conducting portion 121. A gap is formed between the heat dissipation fins 122 and the adjacent other second heat dissipation fins 122. The material used in the heat pipe heat sink 100 disclosed in the present invention is not limited to aluminum or aluminum alloy materials, and those skilled in the art can fabricate the heat pipe heat sink 100 according to actual needs.

The detailed structure of the heat pipe heat sink 100 is further described. The bottom surface of the first heat conducting portion 111 has a first slot 113, the top surface of the second heat conducting portion 121 has a second slot 123, and the first slot 113 And the second slot 123 penetrates the front and rear ends of the first heat conducting portion 111 and the second heat conducting portion 121 respectively. The heat pipe 130 is clamped and fixed between the first slot 113 of the first body 110 and the second slot 123 of the second body 120, and the shape of the heat pipe 130 may be, but not limited to, a bent form. The shape of the first slot 113 and the second slot 123 and the shape and size of the heat pipe 130 are matched to each other to form a semicircular structure. The width of one end of the first heat-dissipating fins 112 of the first heat-dissipating portion 111 is not greater than the height of the first heat-conducting portion 111, and each of the second heat-dissipating fins 122 is connected to the second heat-conducting portion 121. When the width of one end is not greater than the height of the second heat conducting portion 121, when the first body 110 and the second body 120 are coupled to each other, the first heat conducting portion 111 and the second heat conducting portion 121 can be bonded to each other to ensure mutual adhesion. The first heat dissipation fins 112 and the second heat dissipation fins 122 may be interlaced and staggered.

It is further explained that the heat pipe type heat sink 100 of the present embodiment can contact the heat source of the first heat conducting portion 111 of the first body 110 with respect to the other side of the first slot 113, and one end of the heat pipe 130 is disposed at the first slot. 113, and when the second heat conducting portion 121 of the second body 120 is coupled to the first heat conducting portion 111 of the first body 110, the second heat radiating fin 122 connects one end portion of the second heat conducting portion 121 against the first portion The heat dissipating fins 112 are connected to one end of the first heat conducting portion 111, and the heat conducting tubes 130 are correspondingly embedded in the second slots 123, so that the surface of the heat conducting tube 130 is closely attached to the first slot 113 and the second slot 123. The inner wall. In addition, the solder paste may be coated on the heat conducting tube 130, so that the first heat conducting portion 111 and the second heat conducting portion 121 are tightly coupled to the heat conducting tube 130 through the solder paste to increase the heat transfer rate of each other.

The manner in which the first heat transfer portion 111 and the second heat transfer portion 121 are combined may be soldering or fitting. When the second heat-dissipating portion 121 is combined with the first heat-dissipating portion 111, the plurality of second heat-dissipating fins 122 and the plurality of first heat-dissipating fins 112 are interpenetrated in the gap between the adjacent heat-dissipating fins. Forming a staggered structure, and overlapping the heat dissipation fins of the second heat dissipation fin 122 away from the end of the second heat conduction portion 121 and the first heat dissipation fin 112 away from the first heat conduction portion 111 The gap between the fins is reduced, thereby reducing the distance between the fin and the fin, so that the heat pipe type heat sink 100 can greatly increase the total heat dissipation area by increasing the number of fins, so as to achieve better heat dissipation effect. As shown in Figure 3.

In addition, the thickness of each of the first heat dissipation fins 112 is tapered from the other end of each of the first heat dissipation fins 112 connected to the first heat conduction portion 111 toward the other end away from the first heat conduction portion 111. Similarly, each of the second heat dissipation fins 122 The thickness of each of the second heat dissipating fins 122 is connected to the end of the second heat conducting portion 121 away from the first The other end of the heat conducting portion 121 is tapered, so that the shape of each of the heat dissipating fins 112 and 122 is a spindle-shaped structure, so that one end of the first heat conducting portion 111 and the second heat conducting portion 121 has a large cross-sectional area. The two sides are thinner and have a larger heat dissipating surface area, so that the heat source can be quickly transferred to the ends of the first fins 112 and the second fins 122 to achieve uniform temperature and fast heat dissipation.

It should be noted that the number of heat pipe heat sinks 100 disclosed in the present invention is not limited to the number of embodiments, and those skilled in the art can change the heat pipe heat dissipation of the present invention according to actual needs. The location and number of configurations of the device 100.

Based on the above structure, the body of the heat pipe type heat sink of the present invention has the heat pipe clamped and fixed in the manner of the upper and lower snaps, and is closely attached to each other to increase the heat transfer rate, and the heat dissipation fins are staggered and overlap each other. The structural design is used to fill the gap between the fins, thereby reducing the distance between the fins and the fins, so that the total heat dissipation area of the heat pipe type heat sink is greatly increased to achieve a good heat dissipation effect. In addition, the shape of the heat sink fin is a spindle type, so that the part of the heat pipe is larger in area, and the two sides are thinner, so that the heat source can be quickly transmitted to the two sides of the heat sink fin to achieve uniform temperature and fast heat dissipation. The effect.

The overall structure of the heat pipe heat sink 100 disclosed in the second embodiment of the present invention is similar to that of the heat pipe heat sink of the first embodiment described above, and therefore the following content will be described in detail only for differences between the two.

Please refer to the combined schematic diagram of the heat pipe type heat sink of the second embodiment shown in FIG. The heat pipe heat sink 100 according to the second embodiment of the present invention further includes a heat conduction base 140 for coupling to a central processing unit (CPU) or a graphics processing unit (GPU). When it generates a lot of heat on the electronic components. The thermally conductive base 140 includes a heat conducting plate 141 and a fin set 142. The fin group 142 is disposed on the heat conducting board 141, and the heat conducting tube 130 is fixed to the heat conducting board 141 and the fin group at one end away from the first body 110 and the second body 120. Between 142, the fixing manner may be the way of piercing, embedding or welding. The heat conducting plate 141 is in contact with the heat generating component in a large area, so that the heat source can be quickly transmitted to the upper heat pipe 130, and then the heat source is transmitted to the fin group 142, the first body 110, and the heat source 130 in an average and rapid manner. The second body 120, and then through the fin group 142, the plurality of first heat dissipation fins and the plurality of second heat dissipation fins exchange heat with the outside air, thereby helping to increase the heat transfer rate, and more greatly The heat dissipation effect of the heat pipe type heat sink 100 is improved.

It can be clearly understood from the above embodiments of the present invention that the heat pipe type heat sink of the present invention can be used to solve the problem that the conventional aluminum extruded radiator cannot be made high due to the limitation of mold making and forming technology. The problem of the heat sink of the density fins.

Compared with the prior art, the heat pipe type heat sink of the present invention not only uses the two bodies to clamp and fix the heat pipe through the upper and lower fastening manners, so as to increase the heat transfer rate, and at the same time, the heat dissipation fins are staggered and overlapped. The design is to fill the gap between the fins, thereby reducing the distance between the fins and the fins, so that the total heat dissipation area of the heat pipe type heat sink is greatly increased to achieve a good heat dissipation effect. Moreover, the design of the heat sink fin shape is a spindle type, and the effect of uniform temperature and fast heat dissipation is achieved. In addition, the thermal base is selectively disposed to assist in heat dissipation, which helps to further improve the heat dissipation performance, and thus has good heat transfer and high heat dissipation.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

100‧‧‧Heat tube radiator

110‧‧‧First Ontology

111‧‧‧First heat transfer department

112‧‧‧First heat sink fin

113‧‧‧First slotting

120‧‧‧Second ontology

121‧‧‧Second heat conduction section

122‧‧‧Second heat sink fins

123‧‧‧Second slotting

130‧‧‧Heat pipe

Claims (8)

A heat pipe type heat sink includes: a heat pipe; a first body comprising a first heat conducting portion and a plurality of first heat radiating fins spaced apart from the first heat conducting portion, the first heat conducting portion having a first Slotting, one end of the heat pipe is disposed in the first slot; and a second body includes a second heat conducting portion and a plurality of second heat radiating fins spaced apart from the second heat conducting portion, the second The heat conducting portion has a second slot, and the second slot corresponds to the first slot; wherein the second heat conducting portion is coupled to the first heat conducting portion, and the heat conducting tube is embedded in the second slot And the second heat dissipation fins are staggered with the first heat dissipation fins and overlap each other. The heat pipe type heat sink of claim 1, wherein the thickness of the first heat dissipation fins is from one end of the first heat dissipation fins to the one end of the first heat conduction portion Shrink. The heat pipe type heat sink of claim 2, wherein the thickness of the second heat dissipation fins is from one end of the second heat dissipation fins to the end of the second heat conduction portion Shrink. The heat pipe type heat sink of claim 3, wherein a width of one end of each of the first heat dissipating fins connecting the first heat conducting portion is not greater than a height of the first heat conducting portion, and each of the second heat dissipating fins is connected The width of one end of the second heat conducting portion is not greater than the height of the second heat conducting portion, and the end portion of the second heat dissipating fin connecting the second heat conducting portion is connected to the first heat dissipating fin to connect the first heat conducting portion One end of the second heat dissipating fin is away from one end of the second heat conducting portion The first heat dissipation fins overlap each other away from one end of the first heat conduction portion. The heat pipe type heat sink of claim 1, wherein the first slot and the second slot have a structural shape that matches a diameter of the heat pipe. The heat pipe type heat sink of claim 5, wherein a surface of the heat pipe is attached to an inner wall surface of the first groove and the second groove. The heat pipe heat sink of claim 1, further comprising a heat conducting base, the other end of the heat pipe being connected to the heat conducting base. The heat pipe type heat sink of claim 7, wherein the heat conducting base comprises a heat conducting plate and a fin set, the fin set is disposed on the heat conducting plate, and the other end of the heat conducting tube is fixed to the heat conducting Between the plate and the set of fins.