TWI550250B - Combined heat sink - Google Patents

Description

Combined heat sink

The present invention relates to a heat sink, and more particularly to a combined heat sink.

Generally, the heat sink is installed inside the electronic product and attached to a wafer or circuit that generates heat energy, and the heat energy is dissipated by conduction to achieve the effect of cooling. In order to make the heat sink easy to conduct heat, most of the heat sinks are used in the industry. The aluminum or copper material with high thermal conductivity is integrally extruded into the heat sink, so the overall structure of the heat sink is the same material or composition, so the overall heat dissipation performance can be consistent.

Although the aluminum heat sink is relatively inexpensive, the heat conduction effect is usually slightly worse than that of the copper heat sink, and the copper heat sink has a good heat conduction effect, but the manufacturing cost is high, and the current heat sink structure cannot be integrated. At the same time, combined with the characteristics of two different materials, to produce a heat sink with good thermal conductivity and low cost, there is room for improvement.

In order to solve the problem that the existing heat sink is integrally molded by the same material and cannot have two different material properties, the main object of the present invention is to provide a combined heat sink which is attached to the heat sink body in an assembled manner. In combination with the heat dissipation chip, the heat sink body can partially replace the heat dissipation block with high thermal conductivity or different materials, so that the local heat dissipation effect of the heat sink body can be improved.

The technical means used in the present invention is to provide a combined heat dissipation The sheet includes: a heat sink body comprising a fixing portion, a heat guiding plate and a plurality of fins, wherein a mounting hole is formed along the axis in the center of the fixing portion, and the heat guiding plate is connected to the fixing portion A heat guide surface is formed on the bottom surface of the heat guide plate. The heat sink body is provided with a plurality of fins in the mounting hole, and at least one communication is provided at the bottom of the heat sink body. The at least one heat dissipating set includes a base and a plurality of fins spaced apart from the base, and a heat guiding surface is formed at a bottom of the base, the at least one heat dissipating group The film is correspondingly mounted on at least one of the mounting grooves of the heat sink body, and the heat guiding surface of the base is coplanar with the heat guiding surface of the heat guiding plate.

In the above-mentioned combined heat sink, the sealing groove of the heat sink body penetrates to both ends of the fixing portion and the mounting hole.

In the above-mentioned combined heat sink, the heat sink body has a fitting groove, and the fitting groove has a long rectangular shape.

In the above-mentioned combined heat sink, the two heat dissipating heat sinks are two, and the two heat sinks are spaced apart from each other, and the two heat sinks are in the shape of a long rectangular shape. They are respectively fitted to the two fitting grooves.

In the above-mentioned combined heat sink, the heat sink system is extruded into an aluminum material, and the heat dissipation film is made of copper.

In the above-mentioned combined heat sink, the number of fins of the heat dissipation assembly is more than the number of fins of the heat dissipation body, so that the fin density of the heat dissipation assembly is dense.

The present invention utilizes the provided combination heat sink to achieve enhanced power efficiency including:

1. The heat sink of the present invention can partially replace the heat-dissipating heat-dissipating component, such as a heat-dissipating component made of a copper or silver material having a high thermal conductivity, or have a high density or The heat-dissipating fins of the special fin design enable the heat sink body to have a local heat-dissipating effect in contact with the heat-conducting surface of the heat source, and have the advantages of low cost and high heat conduction effect.

2. The present invention can combine one or more heat dissipation sheets on the heat sink body, and can also use a heat sink combination of different materials or designs to obtain a better heat conduction effect.

In order to be able to understand the technical features and practical functions of the present invention in detail, and can be implemented in accordance with the contents of the specification, and further illustrated in the following preferred embodiments, the present invention is a combined heat sink. Referring to the preferred embodiment of FIG. 1 and FIG. 2, the heat sink body 10 and the heat sink body 20 are as shown in FIG. 1 and FIG. 2, and the heat sink body 10 is made of copper or aluminum. The metal material having a preferred thermal conductivity is integrally extruded. In the embodiment, the heat sink body 10 is extruded from an aluminum material, and the heat sink body 10 includes a fixing portion 11 and a heat guide. a plate 12 and a plurality of fins 13 , the fixing portion 11 is an elongated hollow cylinder extending vertically downward from the fixing portion 11 , and a mounting hole 111 is formed along the axis in the center of the fixing portion 11 . The heat guide plate 12 is an elongated plate body and is connected below the fixing portion 11 and extends to both ends of the fixing portion 11 to be branched at the bottom of the heat guiding plate 12 A heat guiding surface 121 is formed, and a fitting groove 122 penetrating to the two ends of the fixing portion 11 is defined in the center of the bottom of the heat guiding plate 12, and the fitting groove 122 is penetrated to the mounting hole 111. The fins 13 are elongated rectangular plates and the spacer ring is disposed on the mounting hole 111 and extends to both ends of the fixing portion 11 .

As shown in FIG. 2 and FIG. 3 , the heat dissipation component 20 can be correspondingly assembled into the assembly groove 122 , and the heat dissipation component 20 can be the same material as the heat dissipation body 10 or the heat dissipation coefficient is lower than the heat dissipation coefficient. The metal body of the sheet body 10 is made of a metal material such as copper, silver or gold. In the embodiment, the heat dissipating component 20 is made of a copper material, and the heat dissipating component 20 includes a base 21 and The plurality of fins 22 are corresponding to the elongated body of the mounting groove 122, and a heat guiding surface 211 is formed at the bottom of the base 21, and the plurality of fins 22 are spaced apart from the base 21 The top surface is arranged in an upright manner along the axis of the base 21, and the heat dissipating unit 20 is correspondingly mounted in the mounting groove 122 of the heat sink body 10, as shown in FIG. The heat conducting surface 211 of the base 21 and the heat guiding surface 121 of the two heat guiding plates 12 are formed in a coplanar manner, and the heat radiating film 20 and the heat sink body 10 are combined in a tight fit due to the difference in size. In the present embodiment, the size difference is caused by the difference in the temperature difference between the cold and the hot, and the glue is glued or the like in the embodiment. The heat dissipation assembly 20 is coupled to the heat sink body 10 in a tight fit of the size difference; and the number of the fins 22 of the heat dissipation assembly 20 is greater than the number of the fins 13 of the heat sink body 10. The fins 20 of the heat dissipation fins 20 are denser in density, and a better heat conduction effect can be obtained. Moreover, the heat dissipation fins 20 are not limited to being integrally formed by extrusion, and the fins 22 can be processed into a wave shape. Different shapes such as a curved shape make the heat dissipation sheet 20 obtain a better heat conduction effect, which is not limited in the present invention.

The embodiment of the first preferred embodiment of the present invention is as shown in FIG. 4, and the heat sink body 10 can be sleeved and coupled to a cooling tube by the mounting hole 111, and the heat sink body 10 is The heat conduction surface 121 and the heat conduction surface 211 of the heat dissipation layer 20 are attached to a wafer (not shown), and the heat dissipation layer 20 having a better heat conduction effect is used to obtain better local heat dissipation.

As shown in FIG. 5 and FIG. 6 , it is a second preferred embodiment of the present invention, and the second preferred embodiment is substantially the same as the first preferred embodiment. The difference is that the heat sink body 30 is coupled to The heat sink body 10 has the same material, but has a slightly different shape. The heat sink body 30 includes a fixing portion 31, a heat guiding plate 32 and a plurality of fins 33. The fixing portion 31 is an elongated hollow cylinder. A mounting hole 311 is defined in the center of the fixing portion 31. The heat guiding plate 32 is integrally connected to the bottom of the fixing portion 31. The heat guiding plate 32 is formed with a long rectangular shape. a sealing groove 321 is defined, and the mounting groove 321 is connected to the mounting hole 311. A heat guiding surface 322 is formed on the bottom of the heat guiding plate 32. The plurality of fins 33 are spaced apart from each other. The heat dissipation fins 20A are identical in shape to the heat dissipation fins 20, but the length and the width correspond to the fitting grooves 321 of the heat sink body 30, As shown in FIG. 5, the heat dissipation fins 20A can be correspondingly assembled in the assembly groove 321 and the heat conduction surface 21 of the heat dissipation assembly 20A. 1A is coplanar with the heat guiding surface 322 of the heat guiding plate 32. Other structures, connection methods, and methods of use are the same as those of the first preferred embodiment, and thus will not be described in detail.

As shown in FIG. 7 , it is a third preferred embodiment of the present invention, and the third preferred embodiment is substantially the same as the second preferred embodiment. The difference is that the heat sink body 30A is attached to the thermal guide. The board 32A is provided with two interval settings The assembly groove 321A is configured to be respectively coupled to the two assembly grooves 321A, and the two heat dissipation sheets 20A can be formed by different materials or different fin designs to form a heat dissipation combination having different heat conduction effects. In the present embodiment, the structure and material of the two heat dissipation fins 20A are identical, and other methods and structures are the same as those of the foregoing embodiments, and will not be described in detail.

The invention is capable of assembling heat dissipation sheets of the same or different materials on the heat sink body, and using the fin design with better heat conduction design, the heat sink body can locally generate better cooling and heat conduction effects, and even It can also be used in small electronic products or places with insufficient installation space, and has the advantages of low cost and high thermal conductivity, which is quite practical and convenient.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any one of ordinary skill in the art can use the present invention without departing from the technical features of the present invention. Equivalent embodiments of the local changes or modifications made by the disclosed technology are still within the scope of the technical features of the present invention.

10‧‧‧ Heat sink body

11‧‧‧ Fixed Department

111‧‧‧Installation holes

12‧‧‧Hot guide plate

121‧‧‧Thermal guide surface

122‧‧‧ fitting groove

13‧‧‧Fins

20, 20A‧‧‧ Heat-dissipating film

21‧‧‧Base

211, 211A‧‧‧ heat guide

22‧‧‧Fins

30, 30A‧‧ ‧ heat sink body

31‧‧‧ Fixed Department

311‧‧‧Installation holes

32, 32A‧‧‧heat guide

321, 321A‧‧‧ fitting groove

322‧‧‧Heat guide

33‧‧‧Fins

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an external view of a preferred embodiment of the present invention.

Figure 2 is an exploded view of a preferred embodiment of the present invention.

Figure 3 is a front cross-sectional view of a preferred embodiment of the present invention.

Figure 4 is a view showing an implementation state of a preferred embodiment of the present invention.

Figure 5 is an exploded view of a preferred embodiment of the present invention.

Figure 6 is a front cross-sectional view of a preferred embodiment of the present invention.

Figure 7 is an exploded view of a preferred embodiment of the present invention.

10‧‧‧ Heat sink body

11‧‧‧ Fixed Department

111‧‧‧Installation holes

12‧‧‧Hot guide plate

121‧‧‧Thermal guide surface

122‧‧‧ fitting groove

13‧‧‧Fins

20‧‧‧heating film

21‧‧‧Base

211‧‧‧Heat guide

22‧‧‧Fins

Claims (7)

A combined heat sink comprises: a heat sink body comprising a fixing portion, a heat guiding plate and a plurality of fins, and a mounting hole is formed along the axis in the center of the fixing portion, the heat guiding plate is connected A heat guiding surface is formed on the bottom surface of the heat guiding plate, and a plurality of fins are disposed on the bottom of the heat sink body, and are disposed at the bottom of the heat sink body. At least one heat dissipating surface is connected to the mounting hole; the at least one heat dissipating unit includes a base and a plurality of fins disposed on the bottom of the base, and a heat guiding surface is formed on the bottom surface of the base, the at least The heat dissipating component is correspondingly mounted on at least one of the mounting grooves of the heat sink body, and the heat guiding surface of the base is coplanar with the heat guiding surface of the heat guiding plate. The combined heat sink according to claim 1, wherein the heat sink body has a fitting groove that penetrates to both ends of the fixing portion and the mounting hole. The combined heat sink according to claim 1, wherein the heat sink body has a fitting groove, and the fitting groove has an elongated rectangular shape. The combined heat sink according to claim 1, wherein the heat dissipating set is two, and two heat dissipating grooves are spaced apart from each other, and the two fitting grooves are elongated and rectangular. The two heat dissipating sets are respectively corresponding to the two fitting grooves. The combined heat sink according to any one of claims 1 to 4, wherein the heat sink system is extruded in an aluminum material, and the heat sink is made of copper. The combined heat sink of any one of claims 1 to 4, wherein The number of fins of the heat dissipation assembly is more than the number of fins of the heat dissipation body, so that the fins of the heat dissipation assembly are denser. The combined heat sink of claim 5, wherein the number of fins of the heat dissipation assembly is greater than the number of fins of the heat dissipation body, so that the fins of the heat dissipation assembly are denser.