JP3161896U - Heat dissipation module - Google Patents

Abstract

Disclosed is a heat dissipation module that is simple in production, requires less construction, and more effectively saves costs. A heat dissipation module includes a base and a heat transfer tube. The base includes a heat receiving surface and a heat conducting surface on the opposite side of the heat receiving surface. A heat dissipation part 301 is provided. The heat absorbing portion includes a flat surface 3031 and is joined together with the conductive surface to be integrally coupled, and a portion 3032 that does not form a flat surface is configured to extend from the flat surface in the axial direction. [Selection] Figure 2

Description

  The present invention relates to a heat dissipating module for electronic equipment, and more particularly to a heat dissipating module that is simple in production, reduces the number of construction steps, and saves cost more effectively.

An electronic component (e.g., CPU) in a current electronic device (e.g., a notebook personal computer) generates a large amount of heat energy during operation, and raises the temperature of the electronic component. If the heat is not properly dissipated, the electronic component is overheated and the operation becomes unstable. In some cases, the entire electronic device is stopped or burned out. In addition, as the speed of various electronic components increases, the amount of heat generated is increased accordingly, and thus a heat dissipation module for various electronic devices is essential.

As shown in FIG. 1, a heat radiation module 1 of a known notebook personal computer or monitor or a thin electronic device includes a base 10, a plurality of heat transfer tubes 11, and a heat radiation fan unit 12. The above-described base 10 includes a raised portion 101, the raised portion 101 is configured to protrude from the surface of the base 10, and the other surface of the base 10 is on an opposing heat generating component (for example, a CPU). Contact. Further, the raised portion 101 described above is provided with a plurality of semicircular concave grooves 103, and these heat transfer tubes 11 are accommodated and fixed. Each of the heat transfer tubes 11 includes a heat absorption end 111 and a heat dissipation end 112, the heat dissipation end 112 is inserted into the heat dissipation fan unit 12, and the heat absorption end 111 is accommodated in the concave groove 103 so that the base 10 absorbs it. The energy generated from the generated heat generating component is conducted to the heat radiating end 112, and the heat radiating end 112 transmits the heat amount to the connected heat radiating fan unit 12 to quickly radiate heat.

However, although the known heat radiation module 1 can achieve a heat radiation effect, another problem occurs. That is, when actually manufacturing, it is necessary to squeeze and mold the base 10 and the raised portion 101 on the base 10, so that the whole base 10 has a high material cost. As a problem, during the manufacturing process, the relationship between the above-mentioned raised portions 101 must be taken into account, so that production and construction become difficult. In addition, the plurality of raised portions 101 on the base 10 increase the thickness and weight of the base 10 as a whole, and cannot achieve the effect of reducing the weight, and further increase the cost.

JP 2009-270750 A

    Problems to be solved are that the cost increases, production and construction become difficult, and the weight cannot be reduced.

    Therefore, the inventor has for many years derived from experience and research in this area how to solve the above known problems and disadvantages.

  The present invention includes a base and a heat transfer tube. The aforementioned base includes a heat receiving surface and a heat conducting surface on the opposite side of the heat receiving surface, and the heat transfer tube includes a heat absorbing portion and a heat radiating portion. The heat absorption part is formed mainly by forming a part of the side surface in a plane and joining together with the surface of the conduction surface, and the non-planar part is constituted by extending in the axial direction from the plane. Features.

  The heat dissipating module of the present invention has advantages that it saves cost, requires less construction, simplifies production, has a very good heat dissipating effect, and can be reduced in weight.

It is a perspective view of a well-known heat dissipation module. It is a perspective view of the Example of this invention. It is a local section directions figure of an example of the present invention.

In order to improve the above-described problems, it is a main object of the present invention to provide a heat dissipation module that provides a structure in which a base and a heat transfer tube are combined and integrated, and that effectively saves costs.

   The next purpose of the present invention is to provide a heat dissipation module that is simple to produce and requires few construction processes.

An object of the present invention is to provide a heat dissipation module that achieves weight reduction.

It is a next object of the present invention to provide a heat radiation module having a good heat radiation effect.

In order to achieve the above object, the present invention has a heat receiving surface, a base having a conductive surface on the opposite side of the heat receiving surface, a heat transfer tube having a heat absorbing portion and a heat radiating portion, and a heat absorbing portion. The heat radiation module is formed by forming a part of the side surface into a flat surface and extending in the axial direction from the flat surface portion instead of the flat surface, and the above-mentioned flat surface matches the conductive surface and is joined together. Configure.

In order to explain the above-mentioned object of the present invention and its structural and functional characteristics, an example will be described based on the drawings.

2 and 3, the present invention is a heat dissipation module, and includes a base 20 and a heat transfer tube 30 in the embodiment of the present invention. The aforementioned base 20 includes a heat receiving surface 201 and a heat conducting surface 202 opposite to the heat receiving surface 201, and the heat receiving surface 201 and a heat generating component (for example, CPU) are in close contact with each other, By absorbing the amount of heat generated in the heat generating component (not shown), the heat is transmitted to the heat transfer tube 30 and radiated.

The aforementioned heat transfer tubes 30 are arranged with a gap in the heat conduction surface 202 coupled to the base 20 or with no gap. In this embodiment, the heat transfer tubes 30 are arranged without a gap. Further, the heat transfer tube 30 includes a heat radiating portion 301 and a heat absorbing portion 303. The heat absorbing portion 303 forms a part of the side surface of the heat transfer tube on a flat surface 3031. Other than that portion, 3032 is not flat and extends from the flat surface 3031 in the axial direction. Extend. The plane 3031 mentioned above is in contact with the plane of the conductive surface 202 and is integrally coupled to constitute the heat radiation module 2. Further, a cooling medium flow path 3035 is formed by the flat surface 3031 and the non-planar portion 3032, and the cooling medium flow path 3035 and the heat absorption part 303 are either a D-shaped shape or an arch-shaped shape. The mode is shown in FIG.

In addition, each of the heat absorbing portions 303 described above forms a heat radiating space 32 between them, and heat from each heat transfer tube 30 is quickly radiated by the fluid flowing in the heat radiating space 32 to achieve a heat radiating effect. In addition, the above-described heat radiation space 32 sets a different heat radiation assist function according to the user's request. As a specific embodiment, the gap distance between the heat transfer tubes 30 is adjusted, and the width of the heat radiation space 32 is further adjusted. That is, the width of the heat radiation space 32 described above may be smaller than, equal to, or larger than the width of the heat transfer tube 30, resulting in a different heat radiation assist function.

Furthermore, the structure in which the flat surface 3031 of the heat absorbing portion 303 of the heat transfer tube 30 of the present invention is in contact with and integrated with the conductive surface 202 of the base 20 effectively saves cost and achieves a good heat dissipation effect. Further, the assembly is reduced in production, the production is simplified, and the entire base 20 is reduced in weight.

As shown in FIG. 2, the heat dissipation module 2 described above further includes a heat radiator 4, the heat radiator 4 includes a plurality of heat radiation fins 41, and the heat radiation portions 301 of the heat transfer tubes 30 are inserted into the heat radiation fins 41, Combine to form one piece.

The above description is only a preferred embodiment of the present invention, and all the changes in the above-described method, shape, structure and apparatus of the present invention are within the scope of the claims of the present invention.

2 Heat radiation module 20 Base 201 Heat receiving surface 202 Conductive surface 30 Heat transfer tube 301 Heat radiation portion 303 Heat absorption portion 3031 Plane 3032 Non-planar part 3035 Cooling medium flow path 32 Heat radiation space 4 Heat radiator 41 Heat radiation fin

Claims (10)

In the heat dissipation module,
A base having a heat receiving surface and a heat conducting surface opposite to the heat receiving surface;
A heat absorption part and a heat radiation part are provided, and the heat absorption part is joined together integrally with a part of the side surface as a plane, and is opposed to the plane of the conductive surface. A heat dissipating module comprising a heat transfer tube formed by extension.   The heat dissipation module according to claim 1, wherein the cross-sectional space formed by the flat surface and the non-planar portion constitutes a cooling medium flow path.   The heat dissipation module according to claim 1, wherein each of the heat absorption parts forms a heat dissipation space with a space between each other.   2. The heat dissipation module according to claim 1, wherein the heat transfer tubes are arranged with a gap or without a gap.   The heat radiation module according to claim 3, wherein a width of the heat radiation space is smaller than a width of the heat transfer tube.   The heat radiation module according to claim 3, wherein the heat radiation space has the same width as the heat transfer tube.   The heat radiation module according to claim 3, wherein a width of the heat radiation space is larger than a width of the heat transfer tube.   The heat radiating module according to claim 1, wherein the heat radiating module further includes a heat radiating device, and the heat radiating device includes a plurality of heat radiating fins, and the heat radiating portion is inserted into the heat radiating fins and integrally coupled. module.   The heat radiation module according to claim 1, wherein the heat receiving surface of the base is in close contact with the heat generating component. The heat radiating module according to claim 1, wherein the heat absorbing portion has one of a D-shape and an arch shape.

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