TW201430461A - Lighting module and backlight module - Google Patents
Lighting module and backlight module Download PDFInfo
- Publication number
- TW201430461A TW201430461A TW102138186A TW102138186A TW201430461A TW 201430461 A TW201430461 A TW 201430461A TW 102138186 A TW102138186 A TW 102138186A TW 102138186 A TW102138186 A TW 102138186A TW 201430461 A TW201430461 A TW 201430461A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- light
- conductive block
- light source
- source module
- Prior art date
Links
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
本發明是關於一種光源模組,且特別關於一種光源模組光源的連接方式。 The invention relates to a light source module, and in particular to a connection mode of a light source module light source.
圖5為一習知背光模組的示意圖。如圖5所示,於背光模組100中,複數個發光二極體110設置於發光二極體燈條102上,發光二極體燈條102的連接器104置於背板106的定位槽108定位,且發光二極體燈條102利用導熱膠帶(圖未示)貼附於背板106的側邊以固定於背板106上。然而,依上述的組裝及定位方式,連接器104於組入背板106時需進行對位,但對位過程容易產生偏移,且連接器104所在的區域無法設置發光二極體110,因此會於背光模組100上顯示為光學暗區,影響該區域的光學品質。 FIG. 5 is a schematic diagram of a conventional backlight module. As shown in FIG. 5, in the backlight module 100, a plurality of LEDs 110 are disposed on the LED strip 102, and the connector 104 of the LED strip 102 is placed in the positioning slot of the backplane 106. 108 is positioned, and the LED strip 102 is attached to the side of the backing plate 106 by a thermal conductive tape (not shown) to be fixed to the backing plate 106. However, in the above assembly and positioning manner, the connector 104 needs to be aligned when being assembled into the backing plate 106, but the alignment process is likely to be offset, and the area in which the connector 104 is located cannot be provided with the light emitting diode 110. It will be displayed on the backlight module 100 as an optical dark area, which affects the optical quality of the area.
其他的習知設計例如台灣專利號TWM379173揭露一種串接式發光二極體元件,包括一金屬基板、至少一發光二極體以及至少一封裝層。金屬基板表面設置串接電路及電極接點,發光二極體可直接於串接電路之電極接點處連接撓性線材,且撓性線材的尾端設置有電連接器以與另一發光二極體電性連接。 Other conventional designs, such as Taiwan Patent No. TWM379173, disclose a series-connected light-emitting diode element comprising a metal substrate, at least one light-emitting diode, and at least one encapsulation layer. The surface of the metal substrate is provided with a series circuit and an electrode contact, and the light emitting diode can directly connect the flexible wire at the electrode contact of the serial circuit, and the tail end of the flexible wire is provided with an electrical connector to be combined with another light. The polar body is electrically connected.
本發明提供一種可減少光學暗區產生並簡化組裝過程的光源模組及背光模組。 The invention provides a light source module and a backlight module which can reduce the generation of optical dark areas and simplify the assembly process.
本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。為達上述之一或部份或全部目的或是其他目的,本發明之一實施例提供一種光源模組,包含一發光二極體 燈條、一導電塊以及一電源電路板。發光二極體燈條設置於鄰近導光板位置處,發光二極體燈條包含一基板及至少一發光二極體,且基板具有一第一表面及一相對於第一表面的第二表面,所述至少一發光二極體設置於基板的第一表面上,且基板形成有至少一導電接墊及一電路圖案,電路圖案電性連接導電接墊及所述至少一發光二極體。導電塊設置於發光二極體燈條的基板,且具有一第一端及一第二端,其中導電塊的第一端接觸導電接墊且第二端電性連接電源電路板。 Other objects and advantages of the present invention will become apparent from the technical features disclosed herein. In order to achieve one or a part or all of the above or other purposes, an embodiment of the present invention provides a light source module including a light emitting diode. A light bar, a conductive block, and a power circuit board. The light-emitting diode light bar is disposed adjacent to the position of the light guide plate, the light-emitting diode light bar comprises a substrate and at least one light-emitting diode, and the substrate has a first surface and a second surface opposite to the first surface, The at least one light emitting diode is disposed on the first surface of the substrate, and the substrate is formed with at least one conductive pad and a circuit pattern, and the circuit pattern is electrically connected to the conductive pad and the at least one light emitting diode. The conductive block is disposed on the substrate of the light-emitting diode strip, and has a first end and a second end, wherein the first end of the conductive block contacts the conductive pad and the second end is electrically connected to the power circuit board.
本發明之另一實施例提供一種背光模組,包含一導光板及一光源模組,光源模組包含一發光二極體燈條、一導電塊以及一電源電路板。發光二極體燈條設置於鄰近導光板位置處,發光二極體燈條包含一基板及至少一發光二極體,且基板具有一第一表面及一相對於第一表面的第二表面,所述至少一發光二極體設置於基板的第一表面上,且基板形成有至少一導電接墊及一電路圖案,電路圖案電性連接導電接墊及所述至少一發光二極體。導電塊設置於發光二極體燈條的基板,且具有一第一端及一第二端,其中導電塊的第一端接觸導電接墊且第二端電性連接電源電路板。 Another embodiment of the present invention provides a backlight module including a light guide plate and a light source module. The light source module includes a light emitting diode light bar, a conductive block, and a power circuit board. The light-emitting diode light bar is disposed adjacent to the position of the light guide plate, the light-emitting diode light bar comprises a substrate and at least one light-emitting diode, and the substrate has a first surface and a second surface opposite to the first surface, The at least one light emitting diode is disposed on the first surface of the substrate, and the substrate is formed with at least one conductive pad and a circuit pattern, and the circuit pattern is electrically connected to the conductive pad and the at least one light emitting diode. The conductive block is disposed on the substrate of the light-emitting diode strip, and has a first end and a second end, wherein the first end of the conductive block contacts the conductive pad and the second end is electrically connected to the power circuit board.
於本發明的一實施例中,更包括一背板,且背板具有至少一開口,其中,發光二極體燈條承靠於背板上且導電塊穿過開口以電性連接電源電路。 In an embodiment of the invention, a backplane is further included, and the backplane has at least one opening, wherein the LED strip is supported by the backplane and the conductive block passes through the opening to electrically connect the power circuit.
於本發明的一實施例中,背板開口的壁面可塗佈有絕緣材料。 In an embodiment of the invention, the wall surface of the back plate opening may be coated with an insulating material.
於本發明的一實施例中,發光二極體燈條包含複數發光二極體,且導電接墊設於兩相鄰發光二極體間。 In an embodiment of the invention, the light emitting diode light bar comprises a plurality of light emitting diodes, and the conductive pads are disposed between the two adjacent light emitting diodes.
於本發明的一實施例中,更包含一散熱件,抵靠基板的第二表面。 In an embodiment of the invention, a heat sink is further disposed to abut against the second surface of the substrate.
於本發明的一實施例中,導電塊具有相對設置的一第一部、一第二部及一連接部,第一部與第二部彼此具有一間距,連接部連接第一部及第二部,第一部電性連接導電接墊,第二部貼附於散熱片,且第一部與第二部共同夾持基板及散熱片。 In an embodiment of the invention, the conductive block has a first portion, a second portion and a connecting portion disposed opposite to each other, the first portion and the second portion have a spacing from each other, and the connecting portion connects the first portion and the second portion The first portion is electrically connected to the conductive pad, the second portion is attached to the heat sink, and the first portion and the second portion jointly sandwich the substrate and the heat sink.
於本發明的一實施例中,導電接墊位於第一表面上。 In an embodiment of the invention, the conductive pads are on the first surface.
於本發明的一實施例中,導電塊夾設於基板的第二表面與散熱件間。 In an embodiment of the invention, the conductive block is interposed between the second surface of the substrate and the heat sink.
於本發明的一實施例中,導電塊基板的第二表面形成有一第一凹槽,散熱件對應形成有一第二凹槽,且導電塊置入第一凹槽及第二凹槽以夾設於基板的第二表面與散熱件間。 In an embodiment of the present invention, the second surface of the conductive block substrate is formed with a first recess, and the heat dissipating member is correspondingly formed with a second recess, and the conductive block is disposed in the first recess and the second recess to be disposed. Between the second surface of the substrate and the heat sink.
於本發明的一實施例中,導電塊可具有一基部、一第一凸出部及一第二凸出部,第一凹槽對應第一凸出部的外形且第二凹槽對應第二凸出部的外形。 In an embodiment of the invention, the conductive block may have a base portion, a first protruding portion and a second protruding portion, the first groove corresponding to the outer shape of the first protruding portion and the second groove corresponding to the second portion The shape of the projection.
於本發明的一實施例中,第一凹槽及第二凹槽的壁面可塗佈有絕緣材料。 In an embodiment of the invention, the wall surfaces of the first groove and the second groove may be coated with an insulating material.
於本發明的一實施例中,導電接墊位於第一凹槽中。 In an embodiment of the invention, the conductive pads are located in the first recess.
於本發明的一實施例中,電源電路板具有一電源接座,且導電塊的第二端插入電源接座以電連接電源電路板。 In an embodiment of the invention, the power circuit board has a power socket, and the second end of the conductive block is inserted into the power socket to electrically connect the power circuit board.
於本發明的一實施例中,導電塊的第二端為一柱狀結構或一針狀結構。 In an embodiment of the invention, the second end of the conductive block is a columnar structure or a needle-like structure.
於本發明的一實施例中,導電塊的導電塊第二端為一中空圓柱插頭。 In an embodiment of the invention, the second end of the conductive block of the conductive block is a hollow cylindrical plug.
綜上所述,本發明的實施例至少具有下列其中一個優點:藉由上述各個實施例的設計,僅須將導電塊插入電源接座即可組裝發光二極體燈條並產生電性連接至電源電路板的效果,無需額外的元件對位步驟,故可簡化光源模組的組裝過程。再者,上述各個實施例的設計可省略習知的連接器構件,故可進一步減少光學暗區的產生,且省略連接器產生的空間可進行其他的光學佈局,例如可利用該空間額外設置發光二極體以進一步提高出光均勻性。 In summary, the embodiment of the present invention has at least one of the following advantages: by the design of each of the above embodiments, the LED can be assembled and electrically connected by simply inserting the conductive block into the power socket. The effect of the power board eliminates the need for additional component alignment steps, which simplifies the assembly process of the light source module. Furthermore, the design of each of the above embodiments can omit the conventional connector member, so that the generation of the optical dark area can be further reduced, and the space generated by the connector can be omitted to perform other optical layouts, for example, the space can be additionally used to provide illumination. The diode is further improved in light uniformity.
本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉實施例並配合所附圖式,作詳細說明如 下。 Other objects and advantages of the present invention will become apparent from the technical features disclosed herein. The above and other objects, features, and advantages of the present invention will become more apparent and understood. under.
10、100‧‧‧背光模組 10, 100‧‧‧ backlight module
12‧‧‧導光板 12‧‧‧Light guide plate
14、102‧‧‧發光二極體燈條 14, 102‧‧‧Lighting diode strips
14a‧‧‧基板 14a‧‧‧Substrate
14b‧‧‧發光二極體 14b‧‧‧Lighting diode
14c‧‧‧第一表面 14c‧‧‧ first surface
14d‧‧‧第二表面 14d‧‧‧second surface
16‧‧‧散熱件 16‧‧‧ Heat sink
18‧‧‧導電塊 18‧‧‧Electrical block
181、281‧‧‧第一端 181, ‧ ‧ ‧ first end
182、282‧‧‧第二端 182, 282‧‧‧ second end
18a‧‧‧導電塊基部 18a‧‧‧Electrical block base
18b‧‧‧導電塊第一凸出部 18b‧‧‧first bump of the conductive block
18c‧‧‧導電塊第二凸出部 18c‧‧‧second bump of conductive block
22、106‧‧‧背板 22, 106‧‧‧ Backplane
22a‧‧‧背板開口 22a‧‧‧ Back panel opening
24‧‧‧電源電路板 24‧‧‧Power circuit board
24a‧‧‧電源接座 24a‧‧‧Power socket
24b‧‧‧中空圓柱凸起 24b‧‧‧ hollow cylindrical bulge
26‧‧‧導熱膠帶 26‧‧‧ Thermal Tape
28‧‧‧導電塊 28‧‧‧Electrical block
28a‧‧‧導電塊第一部 28a‧‧‧The first part of the conductive block
28b‧‧‧導電塊第二部 28b‧‧‧The second part of the conductive block
28c‧‧‧連接部 28c‧‧‧Connecting Department
32‧‧‧彈片 32‧‧‧Shrap
104‧‧‧連接器 104‧‧‧Connector
C‧‧‧電路圖案 C‧‧‧ circuit pattern
H‧‧‧導電通孔 H‧‧‧ conductive through hole
P‧‧‧導電接墊 P‧‧‧Electrical pads
M、N、R‧‧‧凹槽 M, N, R‧‧‧ grooves
圖1a為本發明一實施例的光源模組的剖面示意圖。 FIG. 1a is a cross-sectional view of a light source module according to an embodiment of the invention.
圖1b為本發明一實施例的背光模組的剖面示意圖。 FIG. 1b is a cross-sectional view of a backlight module according to an embodiment of the invention.
圖2為本發明一實施例的導電塊的示意圖。 2 is a schematic view of a conductive block in accordance with an embodiment of the present invention.
圖3A及圖3B為本發明另一實施例的導電塊的示意圖。 3A and 3B are schematic views of a conductive block according to another embodiment of the present invention.
圖4為本發明一實施例的導電塊與電源接座接合型態的示意圖。 4 is a schematic view showing a state in which a conductive block and a power supply socket are joined to each other according to an embodiment of the present invention.
圖5為一習知背光模組的示意圖。 FIG. 5 is a schematic diagram of a conventional backlight module.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本發明。 The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.
圖1a為本發明一實施例的光源模組的示意圖,圖1b為本發明一實施例的背光模組的示意圖。請參照圖1a及圖1b,一光源模組10包含一發光二極體燈條14、一散熱件16、一導電塊18以及一電源電路板24。在圖1b中一背光模組100包含一導光板12及一光源模組10,光源模組10包含一發光二極體燈條14、一散熱件16、一導電塊18以及一電源電路板24。發光二極體燈條14設置於鄰近導光板12位置處且包含一基板(例如是電路板)14a及至少一發光二極體14b,基板14a具有一第一表面14c及一相對於第一表面14c的第二表面14d,發光二極體14b設置於基板14a的第一表面14c上,且基板14a形成有至少一導電接墊P及一電路圖案C,電路圖案C電性連接導電接墊P及發光二極體14b。詳言之,電路圖案C包括一導電通孔H貫通基板14a的第一表面14c及第二表面14d,導電通孔H電性連接導電接墊P。散熱件16設置於背板22上並抵靠發光二極體 燈條14,且導電塊18設置於發光二極體燈條14的基板14a且具有一第一端181及一第二端182,例如可夾設於基板14a的第二表面14d與散熱件16間。背板22承靠散熱件16及發光二極體燈條14以限位散熱件16及發光二極體燈條14。散熱件16及發光二極體燈條14可藉由導熱膠帶26固定於背板22上。背板22具有至少一開口22a,導電塊18的第一端181接觸形成於基板14a的導電接墊P以電性連接發光二極體14b,且導電塊18的第二端182電性連接該電源電路板24。詳言之,導電塊18穿過背板22的開口22a以電性連接一電源電路板24。 1a is a schematic diagram of a light source module according to an embodiment of the invention, and FIG. 1b is a schematic diagram of a backlight module according to an embodiment of the invention. Referring to FIG. 1a and FIG. 1b , a light source module 10 includes a light-emitting diode light strip 14 , a heat sink 16 , a conductive block 18 , and a power circuit board 24 . In FIG. 1 b , a backlight module 100 includes a light guide plate 12 and a light source module 10 . The light source module 10 includes a light emitting diode strip 14 , a heat sink 16 , a conductive block 18 , and a power circuit board 24 . . The light-emitting diode strip 14 is disposed adjacent to the position of the light guide plate 12 and includes a substrate (for example, a circuit board) 14a and at least one light-emitting diode 14b. The substrate 14a has a first surface 14c and a first surface. The second surface 14d of the 14c, the light emitting diode 14b is disposed on the first surface 14c of the substrate 14a, and the substrate 14a is formed with at least one conductive pad P and a circuit pattern C, and the circuit pattern C is electrically connected to the conductive pad P And the light emitting diode 14b. In detail, the circuit pattern C includes a conductive via H through the first surface 14c and the second surface 14d of the substrate 14a, and the conductive via H is electrically connected to the conductive pad P. The heat sink 16 is disposed on the back plate 22 and abuts the light emitting diode The light bar 14 is disposed on the substrate 14a of the LED strip 14 and has a first end 181 and a second end 182. For example, the second surface 14d and the heat sink 16 can be sandwiched between the substrate 14a. between. The back plate 22 bears against the heat sink 16 and the LED strip 14 to limit the heat sink 16 and the LED strip 14 . The heat sink 16 and the LED strip 14 can be fixed to the backboard 22 by a thermal tape 26. The back plate 22 has at least one opening 22a. The first end 181 of the conductive block 18 contacts the conductive pad P formed on the substrate 14a to electrically connect the light emitting diode 14b, and the second end 182 of the conductive block 18 is electrically connected to the back end. Power circuit board 24. In detail, the conductive block 18 passes through the opening 22a of the back plate 22 to electrically connect to the power circuit board 24.
圖2為本發明一實施例的導電塊的示意圖。導電塊的外形並不限定。如圖2所示,導電塊18具有一縱長的基部18a及由基部18a兩側凸伸的一第一凸出部18b及一第二凸出部18c,發光二極體燈條14的基板14a的第二表面14d可對應第一凸出部18b的外形形成一凹槽M,且散熱件16可對應第二凸出部18c的外形形成一凹槽N,導電塊18置入凹槽M、N以夾設於發光二極體燈條14的基板14a的第二表面14d與散熱件16間。導電接墊P位於該第一凹槽M中與導電塊18電性接觸。電路圖案C電性連接該導電接墊P及該至少一發光二極體14b。詳言之,電路圖案C包括一導電通孔H貫通基板14a的第一表面14c及第二表面14d,導電通孔H電性連接導電接墊P。導電塊18的第二端182可如圖1所示通過背板22的開口22a並插入電源電路板24的電源接座24a以使導電塊18電性連接電源電路板24。導電塊18的第二端182可為一柱狀結構或一針狀結構,本實施例為柱狀結構。 2 is a schematic view of a conductive block in accordance with an embodiment of the present invention. The shape of the conductive block is not limited. As shown in FIG. 2, the conductive block 18 has an elongated base portion 18a and a first protruding portion 18b and a second protruding portion 18c protruding from both sides of the base portion 18a. The substrate of the LED strip 14 The second surface 14d of the 14a can form a groove M corresponding to the outer shape of the first protruding portion 18b, and the heat dissipating member 16 can form a groove N corresponding to the outer shape of the second protruding portion 18c, and the conductive block 18 is placed into the groove M. N is interposed between the second surface 14d of the substrate 14a of the light-emitting diode strip 14 and the heat sink 16. The conductive pad P is located in the first groove M in electrical contact with the conductive block 18 . The circuit pattern C is electrically connected to the conductive pad P and the at least one light emitting diode 14b. In detail, the circuit pattern C includes a conductive via H through the first surface 14c and the second surface 14d of the substrate 14a, and the conductive via H is electrically connected to the conductive pad P. The second end 182 of the conductive block 18 can be inserted into the power socket 24a of the power circuit board 24 through the opening 22a of the backboard 22 as shown in FIG. 1 to electrically connect the conductive block 18 to the power circuit board 24. The second end 182 of the conductive block 18 can be a columnar structure or a needle-like structure. This embodiment is a columnar structure.
於本實施例中,導電塊18係夾設於基板14a的第二表面14d與散熱件16間,於另一實施例中,若不設置散熱件16,亦可膠合或卡合的方式直接將導電塊18設置於發光二極體燈條14的基板14a的第二表面14d,並藉由導熱膠帶26將基板14a直接固定於背板22上(圖未示)。再者,凹槽M、N及背板開口22a的壁面可塗佈絕緣材料,使導電塊18與散熱件16、背板22間保持絕緣狀態。 In this embodiment, the conductive block 18 is interposed between the second surface 14d of the substrate 14a and the heat sink 16. In another embodiment, if the heat sink 16 is not provided, the conductive block 18 may be directly bonded or snapped. The conductive block 18 is disposed on the second surface 14d of the substrate 14a of the light-emitting diode strip 14, and the substrate 14a is directly fixed to the back plate 22 by a thermal conductive tape 26 (not shown). Furthermore, the walls of the grooves M, N and the back plate opening 22a may be coated with an insulating material to keep the conductive block 18 from the heat sink 16 and the back plate 22 in an insulated state.
圖3A及圖3B為本發明另一實施例的導電塊的示意圖。請同時參考圖3A及圖3B,發光二極體燈條14的基板14a的第一表面14c上設有一導電接墊P,電路圖案C電性連接該導電接墊P及該至少一發光二極體14b。在一實施例中,基板14a及散熱件16亦可形成有對應導電塊28輪廓外形的凹槽R以使導電塊28能更穩固地固定於發光二極體燈條14,本發明對此不加以限制。導電塊28具有一第一部28a、一第二部28b及一連接部28c。第一部28a及一第二部28b相對設置且彼此具有一間距。連接部28c連接第一部28a及第二部28c。當導電塊28的連接部28c置入凹槽R時,導電塊28的第一部28a與該第二部28b共同夾持該基板14及該散熱片16。詳言之,導電塊28的第一部28a可貼附基板14a的第一表面14c,且第一部28a的底端,即導電塊28的第一端281可接觸設於第一表面14c上且位於兩個相鄰發光二極體14b間的導電接墊P,使導電塊28電性連接發光二極體14b。第二部28b可貼附散熱件16的一側,且第二部28b的第二端282可如圖1a、1b所示通過背板22的開口22a並嵌入電源電路板24的電源接座24a,以使導電塊28電性連接電源電路板24。本實施例的導電塊28的第二端282為一針狀結構。於另一實施例中,亦可省略散熱件16且導電塊28的第一部28a及第二部28b分別貼附基板14a的第一表面14c及第二表面14d,並分別電連接發光二極體14b及電源電路板24。 3A and 3B are schematic views of a conductive block according to another embodiment of the present invention. Referring to FIG. 3A and FIG. 3B, the first surface 14c of the substrate 14a of the LED strip 14 is provided with a conductive pad P. The circuit pattern C is electrically connected to the conductive pad P and the at least one light emitting diode. Body 14b. In an embodiment, the substrate 14a and the heat sink 16 may also be formed with a recess R corresponding to the contour of the conductive block 28 to enable the conductive block 28 to be more stably fixed to the LED strip 14 . Limit it. The conductive block 28 has a first portion 28a, a second portion 28b and a connecting portion 28c. The first portion 28a and the second portion 28b are oppositely disposed and have a spacing from each other. The connecting portion 28c connects the first portion 28a and the second portion 28c. When the connecting portion 28c of the conductive block 28 is placed in the recess R, the first portion 28a of the conductive block 28 and the second portion 28b sandwich the substrate 14 and the heat sink 16. In detail, the first portion 28a of the conductive block 28 can be attached to the first surface 14c of the substrate 14a, and the bottom end of the first portion 28a, that is, the first end 281 of the conductive block 28 can be contacted on the first surface 14c. The conductive pads P between the two adjacent light-emitting diodes 14b electrically connect the conductive blocks 28 to the light-emitting diodes 14b. The second portion 28b can be attached to one side of the heat sink 16, and the second end 282 of the second portion 28b can pass through the opening 22a of the back plate 22 and be embedded in the power socket 24a of the power circuit board 24 as shown in FIGS. 1a, 1b. So that the conductive block 28 is electrically connected to the power circuit board 24. The second end 282 of the conductive block 28 of the present embodiment has a needle-like structure. In another embodiment, the heat sink 16 may be omitted and the first portion 28a and the second portion 28b of the conductive block 28 are respectively attached to the first surface 14c and the second surface 14d of the substrate 14a, and electrically connected to the light emitting diodes respectively. Body 14b and power circuit board 24.
於本發明各個實施例的設計,導電塊與電源接座的結構形態及連接方式並不限定。舉例而言,如圖4所示,導電塊18的第二端182可為一中空圓柱插頭,電源接座24a具有一中空圓柱凸起24b。導電塊18的第二端182的內徑略大於電源接座24a的中空圓柱凸起24b的外徑以利插入電源接座24a。再者,可設置例如金屬彈片32的輔助結構,金屬彈片32可抵接第二端182以進一步確保導電塊18與電源接座24a間的接合動作及電連接效果。 In the design of each embodiment of the present invention, the structural form and connection manner of the conductive block and the power socket are not limited. For example, as shown in FIG. 4, the second end 182 of the conductive block 18 can be a hollow cylindrical plug, and the power socket 24a has a hollow cylindrical protrusion 24b. The inner diameter of the second end 182 of the conductive block 18 is slightly larger than the outer diameter of the hollow cylindrical projection 24b of the power supply socket 24a to facilitate insertion into the power supply socket 24a. Furthermore, an auxiliary structure such as a metal dome 32 may be provided. The metal dome 32 may abut the second end 182 to further ensure the bonding action and electrical connection between the conductive block 18 and the power socket 24a.
藉由上述各個實施例的設計,僅須將導電塊18插入電源接座24a即可組裝發光二極體燈條14並產生電連接至電源電路 板24的效果,無需額外的元件對位步驟,故可簡化光源模組的組裝過程。再者,上述各個實施例的設計可省略習知的連接器構件,故可進一步減少光學暗區的產生,且省略連接器產生的空間可進行其他的光學佈局,例如可利用該空間額外設置發光二極體以進一步提高出光均勻性。 With the design of each of the above embodiments, the light-emitting diode strip 14 can be assembled and electrically connected to the power supply circuit only by inserting the conductive block 18 into the power socket 24a. The effect of the board 24 eliminates the need for additional component alignment steps, thereby simplifying the assembly process of the light source module. Furthermore, the design of each of the above embodiments can omit the conventional connector member, so that the generation of the optical dark area can be further reduced, and the space generated by the connector can be omitted to perform other optical layouts, for example, the space can be additionally used to provide illumination. The diode is further improved in light uniformity.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。另外本發明的任一實施例或申請專利範圍不須達成本發明所揭露之全部目的或優點或特點。此外,摘要部分和標題僅是用來輔助專利文件搜尋之用,並非用來限制本發明之權利範圍。本說明書或申請專利範圍中提及的“第一”、“第二”等用語僅用以命名元件的名稱,而並非用來限制元件數量上的上限或下限。 The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention. The terms "first", "second", and the like, as used in the specification or the claims, are used to refer to the names of the elements, and are not intended to limit the upper or lower limit of the number of elements.
10‧‧‧光源模組 10‧‧‧Light source module
12‧‧‧導光板 12‧‧‧Light guide plate
14‧‧‧發光二極體燈條 14‧‧‧Lighting diode strip
14a‧‧‧基板 14a‧‧‧Substrate
14b‧‧‧發光二極體 14b‧‧‧Lighting diode
16‧‧‧散熱件 16‧‧‧ Heat sink
18‧‧‧導電塊 18‧‧‧Electrical block
22‧‧‧背板 22‧‧‧ Backplane
22a‧‧‧背板開口 22a‧‧‧ Back panel opening
24‧‧‧電源電路板 24‧‧‧Power circuit board
24a‧‧‧電源接座 24a‧‧‧Power socket
26‧‧‧導熱膠帶 26‧‧‧ Thermal Tape
P‧‧‧導電接墊 P‧‧‧Electrical pads
Claims (26)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310016085.8A CN103925514A (en) | 2013-01-16 | 2013-01-16 | Light source module and backlight module |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201430461A true TW201430461A (en) | 2014-08-01 |
Family
ID=51143824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102138186A TW201430461A (en) | 2013-01-16 | 2013-10-23 | Lighting module and backlight module |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN103925514A (en) |
TW (1) | TW201430461A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104791671A (en) * | 2015-05-08 | 2015-07-22 | 京东方科技集团股份有限公司 | Backlight source, testing system and method and display device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101279126B1 (en) * | 2010-05-04 | 2013-06-26 | 엘지디스플레이 주식회사 | Backlight unit and liquid crystal display device using the same |
KR20120102174A (en) * | 2011-02-16 | 2012-09-18 | 삼성디스플레이 주식회사 | Backlight assembly, display apparatus having the same and method for assembling the display apparatus |
US20120294040A1 (en) * | 2011-05-16 | 2012-11-22 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Light-emitting diode heat-dissipation structure and backlight module |
KR101824884B1 (en) * | 2011-07-07 | 2018-02-02 | 엘지이노텍 주식회사 | Backlight Unit |
CN102588840A (en) * | 2012-02-16 | 2012-07-18 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display (LCD) device |
-
2013
- 2013-01-16 CN CN201310016085.8A patent/CN103925514A/en active Pending
- 2013-10-23 TW TW102138186A patent/TW201430461A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN103925514A (en) | 2014-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI488343B (en) | Led package and light bar having the same | |
JP5097461B2 (en) | Liquid crystal display and backlight module thereof | |
TWI487987B (en) | Back light module and display device using the same | |
TWI696015B (en) | Display device | |
US8287171B2 (en) | Light emitting diode device and display device | |
KR100878721B1 (en) | Replaceable led back light unit | |
JP2007193946A (en) | Light-emitting device | |
JP6569894B2 (en) | Lighting device and connector | |
US20100172124A1 (en) | Light source, light-emitting module having the same and backlight unit having the same | |
JP5635659B1 (en) | Surface light emitter unit and unit connector | |
JP5740144B2 (en) | Light emitting module and light emitting device | |
WO2021248548A1 (en) | Micro light-emitting diode display panel, manufacturing method therefor, and display device | |
US20130215627A1 (en) | Electronic unit base and electronic module and electronic device using the same | |
JP3217354U (en) | Lighting device | |
TW201430461A (en) | Lighting module and backlight module | |
WO2016070824A1 (en) | Led straight lamp | |
JP2007234470A (en) | Light emitting device | |
TWI457514B (en) | Lighting device | |
US20120294040A1 (en) | Light-emitting diode heat-dissipation structure and backlight module | |
JP5870218B2 (en) | Electrical connector | |
US9370100B2 (en) | Light emitting module | |
TWI523271B (en) | Plug-in light-emitting unit and light-emitting device | |
TWI504991B (en) | Light source module | |
US8288782B2 (en) | Backlight module and light-emitting source package structure thereof | |
KR101098951B1 (en) | Light emitting device |