TW201425887A - Thermoelectric heat flow meter and thermoelectric transformation efficiency measure device - Google Patents

Abstract

A thermoelectric heat flow meter comprises a thermoelectric module and a cooling device. The heat from the thermoelectric module is received from the cooling system and then is dissipated to the environment through a heat dissipation mechanism in the cooling system. A voltage corresponding to the heat flowing through thermoelectric module may be measured from the thermoelectric module. The thermoelectric module comprises a first heat conduction substrate, a second heat conduction substrate, and a plurality of P-type thermoelectric elements and N-type thermoelectric elements disposed between the first heat conduction substrate and the second heat conduction substrate. The plurality of P-type thermoelectric elements and N-type thermoelectric elements are spaced at intervals and electrically connected.

Description

Thermoelectric heat flow meter and thermoelectric conversion efficiency measuring device

The invention relates to a thermoelectric heat flow meter, in particular to a thermoelectric heat flow meter having a thermoelectric module composed of a P-type and an N-type thermoelectric material.

In recent years, the need for heat measurement has been gradually taken into account in the field of heat treatment. Since the conventional thermometer cannot accurately obtain important thermal information, the heat flow meter that defines the magnitude of the heat transfer amount and evaluates the heat transfer performance is generated during the measurement of the heat transfer process. In 1914, the first heat flow sensor that was used to directly measure heat flow in the field appeared. At that time, Professor Henky of Germany was to measure the heat flow through the floor of the brewery. The floor was covered with soft cork with a known thermal conductivity λ (W/m.K) and thickness d (m) to measure the temperature difference between the upper and lower sides of the cork board. After reaching a steady state, the heat flux density Q(W/m ² ) through the cork board can be Q=λ/d. The value of ΔT is the prototype of the current heat flow meter. However, when the area of the heat source to be tested is getting smaller and smaller, or the distance of the above d is shorter and shorter (<1 cm), the error value of the thermometer for measuring the temperature difference will seriously affect the result of the heat flow meter interpretation, so the use Thermally conductive heat flow meters will not be suitable under certain stringent measurement conditions.

In 1924, Schmidt used a thermopile (Thermopile) wound around a rubber belt to measure the heat flux. It is generally considered to be the first practical heat flow meter. For example, the working principle of the thermopile is that when the temperature of the object to be tested differs from the temperature of the heat flow meter itself, the thermopile generates a voltage output signal, and the temperature difference is larger. The larger the voltage signal is between tens (μV) and thousands (μV), so the average user is using A voltage amplification process must be performed on it. As shown in Figure 1, the thermopile consists of a series of thermocouples connected in series, the main principle is based on the "Seebeck Effect" effect. Thermocouples are generally composed of two conductors of different materials. When a temperature difference is generated at both ends of the galvanic couple, the thermocouple generates a voltage signal whose magnitude is proportional to the temperature difference across the galvanic couple. In the future, this method will be gradually extended to the production of various heat flow meters.

In order to obtain the multi-point average measurement results, the number of coils wound by a measuring head of the Schmidt form heat flow meter is up to tens or hundreds of turns, and the heterogeneous metal interface between the coils needs to be connected in series, since the solder joint is Handmade, each solder joint condition is different, so the structure and processing method determine the performance of each heat flow meter. At that time, the consistency of the accuracy of the heat flow meter is quite different.

Embodiments disclose a thermoelectric heat flow meter including a thermoelectric module and a heat dissipating device, wherein the thermoelectric module is composed of a first heat conducting substrate, a second heat conducting substrate, a plurality of P-type thermoelectric materials, and a plurality of N-type thermoelectric materials, wherein The plurality of P-type and the plurality of N-type thermoelectric materials are disposed between the first heat-conducting substrate and the second heat-conducting substrate, and the plurality of P-type thermoelectric materials and the plurality of N-type thermoelectric materials are spaced apart from each other and electrically connected in series; In order to collect heat from the thermoelectric module, the heat is dissipated to the environment via the heat dissipation mechanism. In addition, the thermoelectric heat flow meter further comprises a thermometer and an electric meter. The thermometer is placed between the second heat conduction substrate of the thermoelectric module and the heat dissipation device, and the electric meter is electrically connected with the thermoelectric module to detect the open circuit voltage of the thermoelectric module.

The embodiment also discloses a thermoelectric conversion efficiency measuring device for measuring a to-be-tested The thermoelectric conversion efficiency of the thermoelectric module, the thermoelectric module to be tested has an upper end face and a lower end face, and the device for measuring the thermoelectric conversion efficiency of the thermoelectric module comprises: a heating plate, the thermoelectric module to be tested is attached to the lower side of the heating plate; The calibrated thermoelectric module has the structure described above; a heat dissipating device is configured to receive heat from the calibrated thermoelectric module, and the heat is dissipated to the environment via the heat dissipating mechanism; a hot end thermometer of the module to be tested is configured to be tested The upper end surface of the thermoelectric module; a calibration module hot end thermometer disposed between the lower end surface of the thermoelectric module to be tested and the calibration thermoelectric module; and a calibration module cold end thermometer disposed under the calibration thermoelectric module Between the end face and the heat sink.

The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention.

The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

Referring to FIG. 1 , a thermoelectric module disclosed in the embodiment is shown. The thermoelectric module 100 is composed of a first heat conductive substrate 101 , a second heat conductive substrate 102 , a plurality of P-type thermoelectric materials 103 , and a plurality of N-type thermoelectric devices. Material composition 104. A plurality of P-type thermoelectric materials 103 and a plurality of N-type thermoelectric materials 104 are disposed in the first heat Between the conductive substrate 101 and the second heat conductive substrate 102. A plurality of P and N type thermoelectric materials are arranged in a pair of P and N types, and each pair of P and N type thermoelectric materials is connected to the upper electrode 105, and different pairs of thermoelectric materials are connected by the following electrodes 106 to form electricity. Sexual tandem. Hereinafter, for convenience of description, the P-type thermoelectric material 103 and the N-type thermoelectric material 104 are sometimes simply referred to as the thermoelectric material 103 and the thermoelectric material 104, respectively.

As the first heat conduction substrate 101 and the second heat conduction substrate 102, a ceramic substrate such as an alumina plate commonly known as a ceramic plate can be used. The P and N type thermoelectric materials are thermoelectric crystal grains, and in the present embodiment, are designed in a rectangular column shape. The P and N type thermoelectric materials are mainly composed of (Bi, Sb) ₂ Te ₃ and Bi ₂ (Te, Se) ₃ groups, and doped with other trace elements. The first heat conduction substrate 101 and the second heat conduction substrate 102 may be other electrically insulating materials other than the above aluminum oxide plate, such as aluminum nitride plate, mica plate, etc.; the thermoelectric materials 103, 104 may also be other thermoelectric crystal grains, such as PbTe. , other thermoelectric materials such as GeTe, Zn ₄ Sb ₃ , Mg ₂ Si, Fe ₂ Si. The upper electrode 105 and the lower electrode 106 may also be other conductive materials such as pure metals such as Fe, Ag, or alloys thereof.

The upper electrode 105 and the lower electrode 106 are directly adhered to the first heat conduction substrate 101, the second heat conduction substrate 102, or the two are only in contact with each other. In another embodiment, the upper electrode 105 and the lower electrode 106 and the thermoelectric material are added. For the bonding between 103 and 104, Ni/Au may be first plated on the bonding surface of the upper electrode 105 and the lower electrode 106, and then the thermoelectric materials 103 and 104 may be bonded by Sn bonding.

In an embodiment, in order to measure the output voltage of the thermoelectric module, two positive and negative power lines, that is, a positive output power line 107 and a negative output power line 108, may be connected to the first pair and the last pair of thermoelectric materials. The positive output power line 107 and the negative output power line 108 are connected by an electric meter to measure the output voltage V _{out of the} thermoelectric module.

Therefore, when the thermoelectric module of the embodiment is used to measure the heat flow rate of a heat source to be tested, the heat generated by the heat source to be tested is absorbed by the upper end surface 100a of the thermoelectric power module, and then the lower end surface 100b of the thermoelectric module 100. When flowing to the heat dissipating component, the thermoelectric module 100 generates an open circuit voltage (V _oc ). Therefore, the open circuit voltage (V _oc ) of the thermoelectric module 100 is detected through an electric meter.

Please refer to "Fig. 2", which is a schematic diagram of a thermoelectric heat flow meter calibration device for obtaining a calibration curve of a thermoelectric module. That is, after the thermoelectric module of the foregoing embodiment is applied to the open circuit voltage (V _oc ) measured by the heat flow timing after being corrected by the embodiment, the calibration curve of the embodiment can be used to calculate the flow through the upper and lower sides. Heat flow at both ends.

The thermoelectric heat flow meter calibration device of the present embodiment includes a thermoelectric module 100, a heat sink 200, a thermometer 212, an electric meter 260, and a known heat source 280.

The composition of the thermoelectric module 100 is similar to the foregoing embodiment, and details are not described herein again.

The heat sink 200 includes a heat collecting material 210 and a heat dissipating mechanism 250.

Wherein, the heat collecting material 210 can use a copper plate having a certain thickness and a certain area. The upper end surface 210a of the heat collecting material 210 is placed under the lower end surface 100b of the thermoelectric module 100 so as to absorb the heat of the thermoelectric module 100. In order to increase the heat collecting effect of the heat collecting material 210, the present embodiment sandwiches a high thermal conductive interface material 211 between the upper end surface 210a of the heat collecting material 210 and the lower end surface 100b of the thermoelectric module 100, for example, a high thermal conductivity of SiO ₂ . Interface materials or oyster sauce, thermal grease, etc. In addition to the copper plate, the heat collecting material 210 can also be other high thermal conductive materials such as aluminum, graphite, graphite/aluminum composite materials, diamond/aluminum composite materials, and the like.

The heat absorbed by the heat collecting material 210 can be carried away from the heat collecting material 210 by a heat dissipating mechanism 250. In this embodiment, the heat dissipating mechanism 250 includes a cooling fluid 251, a water cooling seat 252, a water inlet 253, a water outlet 254, and a pump 255. The water cooling seat 252 is processed by a certain thickness and a certain area of copper blocks. One side of the water-cooling seat 252 is provided with a water inlet 253 and a water outlet 254, and the fluid passage 257 is disposed inside and outside the water-cooling seat 252 for the cooling fluid to flow. The upper surface of the water cooling seat 252 is in contact with the heat collecting material 210. When the heat dissipating mechanism 250 is in operation, the pump 255 introduces the cooling fluid 251 from the water inlet 253 into the water cooling seat 252, and the heat absorbed by the water cooling seat 252 from the heat collecting material 210 is discharged through the water outlet 254. Finally, the heat is used. The heat exchange mechanism of the fan 256 or the air compressor is discharged to the external environment.

In another embodiment, the main function of the water-cooling base 252 is to absorb the heat of the heat-collecting material 210. Therefore, the water-cooling base 252 and the heat-collecting material 210 can be combined into each other, that is, water-cooled. A portion of the seat 252 is provided for use as the heat collecting material 210.

In this embodiment, a thermometer 212 is further disposed and buried in the heat collecting material 210 to measure the cold junction temperature (T _L ) of the thermoelectric module 100. Of course, in another embodiment, the thermometer 212 can also be disposed between the lower end surface 100b of the thermoelectric module 100 and the interface of the heat collecting material 210 without being buried in the heat collecting material 210.

In the embodiment, the steps of correcting the heat flux curve of the thermoelectric module 100 are specifically described as follows.

First, a heat source 280 of known heat flux is prepared, and the upper end surface 100a of the thermoelectric module 100 is brought into contact with the known heat source 280. In the present embodiment, the heat source 280 having a heat flow rate is constituted by a resistance heater whose heat flow rate is controlled by the electric power supplied to the heater. Of course, in order to obtain an accurate heat flow rate, the heat source 280 is thermally insulated and coated on the peripheral surface except the surface in contact with the thermoelectric module 100.

Next, the pump 255 of the heat sink 250 is turned on, the cooling fluid 251 enters the water cooling seat 252 via the water inlet 253, and the temperature of the lower end surface 100b of the thermoelectric module 100 is controlled by controlling the heat sink 250. In this embodiment, the temperature of the lower end surface 100b of the thermoelectric module 100 is fixed to 25 °C.

When the heat flux of the known heat source 280 is absorbed by the upper end surface 100a of the thermoelectric module 100 and then flows from the lower end surface 100b of the thermoelectric module to the heat sink 250, the thermoelectric module 100 is subjected to the Seebeck effect. , generating an open circuit voltage (V _oc ).

Finally, the heat flow rate of the known heat source 280 is changed, and the open circuit voltage (V _oc ) of the thermoelectric module 100 is measured by the electric meter 260.

In this embodiment, after the above steps, a calibration curve between the heat flux of the thermoelectric module 100 and the open circuit voltage (V _oc ) can be measured, and the result is shown in FIG. 3 .

As described above, the calibration curve in this embodiment fixes the cold end temperature of the lower end surface 100b of the thermoelectric module 100 to 25 °C. Of course, when the temperature of the cold end of the lower end surface 100b of the thermoelectric module 100 is different, the calibration curve will be different. In addition, in the present embodiment, only the cold end temperature of the lower end surface 100b of the thermoelectric module 100 is used as a basis for correction; similarly, the hot end temperature of the upper end surface 100a of the thermoelectric module 100 may be used as a basis for correction. That is, the heat flow meter calibration method of the present embodiment can measure the open circuit voltage (V _oc ) of the thermoelectric module 100, the temperature (T _H ) of the upper (hot) end surface 100a of the thermoelectric module, and the lower (cold). The temperature (T _L ) of the end face 100b can be used to know the heat flux and open circuit voltage (V _oc ) flowing through the thermoelectric module, the hot end (T _H ) and the cold end temperature (T _L ) of the thermoelectric module. The relationship correction curve. After obtaining the thermoelectric module after the calibration curve, it can be applied to measure the heat flow of the power supply.

Please refer to Figure 4 for a schematic diagram of a thermoelectric ammeter. The structure is similar to the embodiment of FIG. 2, except that the heat source is a heat source 290 to be measured as a radiant heat source.

The heat of the heat source 290 to be tested is absorbed by the upper end surface 100a of the first heat conduction substrate 101 of the thermoelectric module 100, and then flows through the upper electrode 105 of the thermoelectric module 100, the thermoelectric materials 103 and 104, the lower electrode 106, and finally by the second The lower end surface 100b of the thermally conductive substrate 102 is finally transmitted through the heat sink 250 to dissipate this heat to the environment.

In this embodiment, the upper end surface of the thermoelectric module 100 is directed to a heat source 290 to be tested. In this embodiment, the heat source 290 to be tested may be a radiant heat source and is not in contact with the upper end surface 100a of the thermoelectric power module 100. Of course, the heat source 290 to be tested may be a conductive heat source as shown in FIG. 1 in addition to the radiation form.

In the present embodiment, when the heat from the heat source 290 to be tested is absorbed by the upper end surface 100a of the thermoelectric module 100 and then flows from the lower end surface 100b of the thermoelectric module 100 to the heat sink 250, the thermoelectric module 100 is generated. An open circuit voltage (V _oc ). The apparatus of this embodiment has an electric meter 260 that can be used to detect the open circuit voltage (V _oc ) of the thermoelectric module 100. The heat flux of the heat source 290 to be tested can be known by measuring the open circuit voltage (V _oc ) and measuring the cold junction temperature (T _L ) of the thermoelectric module 100 by the thermometer 212.

Please refer to FIG. 5 , which is a schematic diagram of a thermoelectric heat flow meter with an air cooling kit disclosed in another embodiment. The thermoelectric heat flow meter of the present embodiment having an air cooling kit includes a thermoelectric module 100, a heat sink 270, a thermometer 212, and an electric meter 260. The thermoelectric module 100 and the thermometer 212 are similar to the foregoing embodiments, and are not described herein again. The heat sink 270 is specifically described below.

The heat sink 270 includes at least one set of heat sink fins 271 and at least one set of heat sink fans 272. The heat dissipating fins 271 and the heat collecting material 210 in the embodiment may be integrated into each other in addition to being in contact with each other as described above, that is, a portion of the heat dissipating fins 271 is provided as the heat collecting material 210.

In this embodiment, the upper end surface of the thermoelectric module 100 is directed toward a heat source 291 to be tested, which is in contact with the upper end surface 100a of the thermoelectric module 100. When the heat generated by the heat source 291 to be tested is absorbed by the upper end surface 100a of the thermoelectric module 100 and then flows from the lower end surface 100b of the thermoelectric module 100 to the heat sink 270, the thermoelectric module 100 generates an open circuit voltage ( V _oc ). The device of this embodiment has an electric meter 260. The open circuit voltage (V _oc ) is measured by the electric meter 260, and the cold end temperature (T _L ) of the thermoelectric module 100 is measured by the cold end thermometer 212. The heat flux of the heat source 291. Of course, the above-mentioned heat source 291 to be tested may be a heat source in the form of radiation in addition to the conduction heat source as shown in the figure.

The "figure 6" is a thermoelectric conversion efficiency measuring device for measuring the thermoelectric conversion efficiency of a thermoelectric module to be tested. The embodiment disclosed in "Fig. 6" uses the thermoelectric module of "Fig. 1" as a measuring device for measuring the module efficiency of another thermoelectric module. As shown in FIG. 6, the thermoelectric conversion efficiency measuring device includes a heating plate 390, a thermoelectric module 120 to be tested, a corrected thermoelectric module 110, a heat sink 250, a calibration module hot end thermometer 215, and a mold to be tested. The hot end thermometer 214 is combined with the electric meter 260.

The device of this embodiment mainly utilizes the thermoelectric module 100 of the first embodiment of the present invention as an efficiency measuring device for the thermoelectric module to be tested. Therefore, in addition to the thermoelectric module 120, the heating plate 390, the calibration module hot end thermometer 215, and the module hot end thermometer 214 to be tested, the configuration of the device of the present embodiment, such as the corrected thermoelectric module 110 The heat sink 250 is the same as the embodiment of FIG. 2 .

In this embodiment, the steps of measuring the module efficiency of the thermoelectric module 120 to be tested are specifically described as follows.

A heating plate 390 of adjustable output power is prepared, which is disposed on the thermoelectric module 120. The thermoelectric conversion efficiency of the thermoelectric module 120 to be tested is unknown, and has an upper end surface 120a and a lower end surface 120b. The upper end surface 120a is placed under the heating plate 390 and absorbs heat of the heating plate 390. The thermoelectric conversion efficiency of the corrected thermoelectric module 110 is known to have an upper end surface 110a and a lower end surface 110b, and its structure and composition are similar to those of the "Fig. 1" embodiment. The module hot end thermometer 214 is disposed in the heating plate 390, adjacent to the upper end surface 120a of the thermoelectric module 120 to be tested, and measures the hot end temperature (T _H ) of the thermoelectric module 120 to be tested. The heat collecting material 218 is disposed between the lower end surface 120a of the thermoelectric module 120 to be tested and the upper end surface 110a of the calibration thermoelectric module 110. The calibration module hot end thermometer 215 is disposed in the heat collecting material 218 to measure the thermoelectricity to be tested. The cold junction temperature (T _H ') of the module 120. The cold junction thermometer 216 of the calibration thermoelectric module is disposed in the heat collecting material 210 of the lower end surface 110b of the calibration thermoelectric module 110, and the cold junction temperature (T _L ') of the calibration thermoelectric module 110 is measured. The electric meters 260 and 261 respectively detect the open circuit voltages (V _oc , V _oc ') of the thermoelectric module 120 to be tested and the calibration thermoelectric module 110.

By measuring the open circuit voltage (V _oc ') of the thermoelectric module 110, the heat (Q) flowing through the thermoelectric module 120 to be tested can be obtained by the above method; similarly, the open circuit voltage of the thermoelectric module 120 to be tested is determined. After (V _oc ) is measured by the electric meter 260, the thermoelectric module 120 to be tested is externally connected to a variable resistor in series, and the resistance value is adjusted to the impedance matching condition, and the voltage value (V _L ) across the external resistor is crossed at this time. It is half of the open circuit voltage of the thermoelectric module 120 to be tested, that is, V _L = 1/2 V _oc . Then, the current (I _L ) passing through the external resistance value is measured by the electric meter 260 to obtain the maximum power generation (P _MAX ) of the module to be tested, that is, P _MAX = V _L × I _L .

Comparing and measuring the maximum power generation (P _MAX ) rate of the thermoelectric module 120 to be tested and correcting the heat flow rate (Q) derived by the thermoelectric module 110, the thermoelectric conversion efficiency (η) of the thermoelectric module 120 to be tested can be derived. , which is

The embodiment discloses a thermoelectric module composed of a thermoelectric material, which is composed of a plurality of pairs of P-type and N-type semiconductor materials, and has a larger Seebeck coefficient than a metal material, and is to be tested. When the temperature of the material is different from the temperature of the pyroelectric heat flow meter, the generated voltage signal is between several tens (mV) and several (V). Therefore, there is no need to perform voltage amplification. By using the above advantages, a thermoelectric heat flow meter is designed, and the heat to be measured is converted into an open circuit voltage, and the open circuit voltage is directly measured, and the heat flowing through the object to be tested can be quickly and accurately determined.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

100‧‧‧Thermal module

100a‧‧‧ upper end

100b‧‧‧ lower end

101‧‧‧First heat transfer substrate

102‧‧‧Second heat conduction substrate

103‧‧‧P type thermoelectric materials

104‧‧‧N type thermoelectric materials

105‧‧‧Upper electrode

106‧‧‧lower electrode

107‧‧‧ positive output power cord

108‧‧‧Negative output power cord

110‧‧‧corrected thermoelectric modules

110a‧‧‧Correct the upper end of the thermoelectric module

110b‧‧‧Correct the lower end of the thermoelectric module

120‧‧‧Thermal module to be tested

120a‧‧‧ Upper end face of the thermoelectric module to be tested

120b‧‧‧The lower end of the thermoelectric module to be tested

200‧‧‧ Heat sink

210‧‧‧ Collecting materials

210a‧‧ ‧ upper end of heat collecting material

211‧‧‧High thermal interface material

212‧‧‧ thermometer

214‧‧‧Test module hot end thermometer

215‧‧‧ Calibration Module Hot End Thermometer

216‧‧‧ Calibration module cold junction thermometer

218‧‧‧ Collecting materials

250‧‧‧heating mechanism

251‧‧‧Cooling fluid

252‧‧‧Water Cooling Block

253‧‧‧ Inlet

254‧‧‧Water outlet

255‧‧‧ pump

256‧‧‧fan

257‧‧‧ fluid passage

260‧‧‧Electric meter

261‧‧‧Electric meter

270‧‧‧ Heat sink

271‧‧‧ Heat sink fins

272‧‧‧ cooling fan

280‧‧‧known heat source

290‧‧‧heat source to be tested

291‧‧‧heat source to be tested

390‧‧‧heating plate

Figure 1 is a thermoelectric module disclosed in the embodiment.

Figure 2 is a schematic diagram of a thermoelectric heat flow meter calibration device.

Figure 3 is a calibration curve of the heat flux and open circuit voltage of the thermoelectric module.

Figure 4 is an embodiment of a thermoelectric heat flow meter in which a radiant heat source to be tested is used.

Figure 5 is a thermoelectric heat flow meter with an air cooling kit.

Figure 6 is a thermoelectric module conversion efficiency measuring device.

100‧‧‧Thermal module

100a‧‧‧ upper end

100b‧‧‧ lower end

101‧‧‧First heat transfer substrate

102‧‧‧Second heat conduction substrate

103‧‧‧P type thermoelectric materials

104‧‧‧N type thermoelectric materials

105‧‧‧Upper electrode

106‧‧‧lower electrode

107‧‧‧ positive output power cord

108‧‧‧Negative output power cord

Claims (13)

A thermoelectric heat flow meter includes: a thermoelectric module comprising a first heat conductive substrate, a second heat conductive substrate, a plurality of P-type thermoelectric materials, and a plurality of N-type thermoelectric materials, wherein a plurality of P-type and a plurality of N-type thermoelectric materials are disposed between the first heat-conducting substrate and the second heat-conducting substrate, and the plurality of P-type thermoelectric materials and the plurality of N-type thermoelectric materials are spaced apart from each other and electrically connected in series; a heat dissipating device disposed under the thermoelectric module for receiving heat from the thermoelectric module; a thermometer disposed between the second heat conducting substrate of the thermoelectric module and the heat dissipating device; and an electric meter The utility model is electrically connected to the thermoelectric module for detecting an open circuit voltage of the thermoelectric module. The thermoelectric heat flow meter of claim 1, wherein the P-type thermoelectric material of the thermoelectric module and the N-type thermoelectric material are (Bi, Sb) ₂ Te ₃ or Bi ₂ (Te, Se) ₃ For the main ingredients. The thermoelectric heat flow meter of claim 1, further comprising a heat collecting material, wherein the heat collecting material is disposed between the thermoelectric module and the heat sink. The thermoelectric heat flow meter of claim 3, wherein the heat accumulating material is a material having high thermal conductivity. The pyroelectric heat flow meter of claim 4, wherein a layer of high thermal conductivity interface material is disposed between the heat collecting material and the lower end surface of the thermoelectric module. The thermoelectric heat flow meter of claim 5, wherein the heat sink is a water cooling kit. The thermoelectric heat flow meter of claim 6, wherein the water cooling kit comprises: a cooling fluid; a water cooling seat; a fluid passage disposed inside and outside the water cooling seat for the cooling fluid to flow; Arranging on one side of the water-cooling seat; a water outlet disposed on one side of the water-cooling seat; and a pump for flowing the cooling fluid from the water inlet into the water-cooling seat, and absorbing the heat-dissipating device in the water-cooling seat The heat is then discharged through the water outlet; wherein the water cooling seat is in contact with the heat collecting material, or the water cooling seat is integrated with the heat collecting material. The pyroelectric heat flow meter of claim 7, wherein the heat of the cooling fluid in the water cooling seat is dissipated to the environment by a cold air compressor or a fan. The thermoelectric heat flow meter of claim 5, wherein the heat dissipating device of the heat dissipating component is an air cooling kit. The thermoelectric heat flow meter of claim 9, wherein the heat dissipating device comprises at least one set of heat dissipating fins and at least one set of heat dissipating fans; wherein the heat dissipating fins are in contact with the heat collecting material, or the heat dissipating fins and the heat dissipating fins The heat collecting material is integrated. A thermoelectric conversion efficiency measuring device for measuring a thermoelectric conversion efficiency of a thermoelectric module to be tested, the thermoelectric module to be tested having an upper end surface and a lower end surface, the thermoelectric The conversion efficiency measuring device comprises: a heating plate, the thermoelectric module to be tested is disposed under the heating plate; and a calibration thermoelectric module having the structure according to any one of the items 1 to 12 of claim 1 a heat dissipating device is disposed under the calibration thermoelectric module for receiving heat from the calibration thermoelectric module; a hot end thermometer of the module to be tested is disposed on the upper end surface of the thermoelectric module to be tested; The hot-end thermometer is disposed between the thermoelectric module to be tested and the calibration thermoelectric module; and a calibration module cold-end thermometer is disposed between the calibration thermoelectric module and the heat dissipation device. The thermoelectric conversion efficiency measuring device of claim 11, further comprising an electric meter electrically connected to the calibration thermoelectric module for detecting an open circuit voltage of the thermoelectric module to be tested. The thermoelectric conversion efficiency measuring device of claim 11, further comprising a heat collecting material, wherein the heat collecting material is disposed between the lower end surface of the correcting thermoelectric module and the heat sink.