TW201425857A - 散熱器組合 - Google Patents

散熱器組合 Download PDF

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Publication number
TW201425857A
TW201425857A TW101149728A TW101149728A TW201425857A TW 201425857 A TW201425857 A TW 201425857A TW 101149728 A TW101149728 A TW 101149728A TW 101149728 A TW101149728 A TW 101149728A TW 201425857 A TW201425857 A TW 201425857A
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TW
Taiwan
Prior art keywords
heat sink
heat
base
sink assembly
pipe
Prior art date
Application number
TW101149728A
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English (en)
Inventor
Hsuan-I Lin
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW101149728A priority Critical patent/TW201425857A/zh
Priority to US13/727,559 priority patent/US20140174699A1/en
Publication of TW201425857A publication Critical patent/TW201425857A/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一種散熱器組合，包括一基座、一熱管、一第一散熱器及第二散熱器，熱管包括固定於基座的定位部及插設於第一散熱器的導熱部，第二散熱器固設於基座與第一散熱器之間。

Description

散熱器組合
本發明是關於一種散熱器組合。
習知散熱裝置通常包括一基座、一散熱器及一設於該底座與散熱器之間的U形熱管，使散熱器與底座之間存在間隙，風流自該間隙流出而使流經散熱器的風量減小，影響散熱器的散熱效果。
鑒於以上，有必要提供一種可增強散熱效果的散熱器組合。
一種散熱器組合，包括一基座、一熱管、一第一散熱器及第二散熱器，熱管包括固定於基座的定位部及插設於第一散熱器的導熱部，第二散熱器固設於基座與第一散熱器之間。
相較習知技術，該散熱器組合的第二散熱器固設於基座與第一散熱器之間，能增強風流阻抗，使熱交換更充分，提高散熱效率。
請參照圖1，本發明散熱器組合的較佳實施方式用以對安裝於一主機板300上的一發熱元件302散熱。該散熱器組合包括一基座20、一第一散熱器40、一第二散熱器60及複數U形的熱管80。
該基座20包括一座體22及一連接件24。
該座體22包括一概呈方形的基板222，該基板222的中部開設一開口223。該基板222於開口223相對的兩側分別開設複數鎖固孔224。該基板222的每一側的兩端相間隔地向上延伸兩擋風片226。兩擋風片226之間形成一缺口227。該基板222的四角處分別設有一將該座體22固定於該主機板300的鎖固件228。
該連接件24包括一支撐板242及自該支撐板242相對的兩端的上部向外延伸的兩連接板244。每一連接板244開設複數通孔246。該支撐板242的上表面開設複數相互平行的收容槽247。
該第一散熱器40包括複數第一散熱片42，每一第一散熱片42開設複數穿插孔44。
該第二散熱器60包括一底板62及複數自該底板62垂直向上延伸的第二散熱片64。該底板62的底面對應該連接件24的收容槽247開設複數卡槽66。每一卡槽66的延伸方向垂直於第二散熱片64。
每一熱管80概呈U形，包括一水平的定位部82、兩向上延伸的導熱部84及連接定位部82的兩端與兩導熱部84的連接部83。
請參照圖2，組裝時，將連接件24的支撐板242收容於該基座20的開口223內，使該支撐板242的底面貼設於該發熱元件302。複數螺釘穿過該連接件24的通孔246，分別鎖固於該基座20的鎖固孔224內。將熱管80的定位部82的下部收容於該連接件24的收容槽247內，並藉由焊接固定，使每一擋風片226正對熱管80的定位部82與導熱部84之間的連接部83。將該第二散熱器60置於該連接件24上，使熱管80的定位部82上側部收容於對應的卡槽66內，並藉由焊接固定。將熱管80對應的導熱部84穿入每一第一散熱片42的穿插孔44並藉由焊接固定，使該等第一散熱片42平行間隔地固定於熱管80的導熱部84上。該第一散熱器40的底部與該基座20的擋風片226抵持，並藉由焊接固定。此時，該第二散熱器60位於該基座20的兩缺口227之間。
請參照圖3，使用時，該發熱元件302工作產生的熱量傳導至連接件24後，一部分熱量經熱管80傳導至第一散熱器40，另一部分熱量傳導至第二散熱器60。風流自散熱器組合的一側流入第一散熱器40及穿過基座20的缺口227流入第二散熱器60，減少從該第一散熱器40與基座20之間的間隙直接流出，增大了風流阻抗，使風流與第一、第二散熱片44、64能充分接觸，更利於熱交換，提高散熱效率。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
300．．．主機板
302．．．發熱元件
20．．．基座
22．．．座體
222．．．基板
223．．．開口
224．．．鎖固孔
226．．．擋風片
227．．．缺口
228．．．鎖固件
24．．．連接件
242．．．支撐板
244．．．連接板
246．．．通孔
247．．．收容槽
40．．．第一散熱器
42．．．第一散熱片
44．．．穿插孔
60．．．第二散熱器
62．．．底板
64．．．第二散熱片
66．．．卡槽
80．．．熱管
82．．．定位部
83．．．連接部
84．．．導熱部
圖1係本發明散熱器組合的較佳實施方式的立體分解圖。
圖2係圖1的組裝圖。
圖3係圖2的側視圖。
300．．．主機板
20．．．基座
226．．．擋風片
227．．．缺口
40．．．第一散熱器
60．．．第二散熱器
80．．．熱管

Claims (7)

  1. 一種散熱器組合，包括一基座、一熱管、一第一散熱器及第二散熱器，熱管包括固定於基座的定位部及插設於第一散熱器的導熱部，第二散熱器固設於基座與第一散熱器之間。
  2. 如申請專利範圍第1項所述之散熱器組合，其中該基座包括一方形的座體，座體的每一側相間隔地凸設兩擋風片，兩擋風片之間形成一缺口，熱管還包括設於定位部與導熱部之間的連接部，每一擋風片正對熱管的連接部，該第二散熱器正對該基座的兩缺口。
  3. 如申請專利範圍第2項所述之散熱器組合，其中該第一散熱器設於該座體的上部，該第一散熱器的底部抵接於該等擋風片。
  4. 如申請專利範圍第2項所述之散熱器組合，其中該基座還包括一設於該座體的連接件，該座體開設一開口，該連接件包括一收容於該開口內的支撐板及自該支撐板相對的兩端向外延伸並固定於該座體上的連接板，該等擋風片分別位於該開口的兩側，該第二散熱器固定於該連接板上。
  5. 如申請專利範圍第4項所述之散熱器組合，其中該支撐板的上表面開設一用以收容該熱管的定位部的下部的收容槽。
  6. 如申請專利範圍第5項所述之散熱器組合，其中該第二散熱器包括一底板及複數凸設於該底板上的第二散熱片，該底板的開設一用以收容該熱管的定位部的上部的卡槽。
  7. 如申請專利範圍第1項所述之散熱器組合，其中該第一散熱器包括複數第一散熱片，每一第一散熱片開設有供熱管的導熱部插入的穿插孔。
TW101149728A 2012-12-25 2012-12-25 散熱器組合 TW201425857A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101149728A TW201425857A (zh) 2012-12-25 2012-12-25 散熱器組合
US13/727,559 US20140174699A1 (en) 2012-12-25 2012-12-26 Heat dissipation assembly

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Application Number Priority Date Filing Date Title
TW101149728A TW201425857A (zh) 2012-12-25 2012-12-25 散熱器組合

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TW201425857A true TW201425857A (zh) 2014-07-01

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US (1) US20140174699A1 (zh)
TW (1) TW201425857A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105758237A (zh) * 2016-04-07 2016-07-13 同度能源科技（江苏）股份有限公司 一种具有纵横热管的散热器
US10165668B2 (en) * 2017-02-16 2018-12-25 Dell Products, Lp Heat exchanger for an information handling system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7866375B2 (en) * 2006-12-01 2011-01-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
CN101201676B (zh) * 2006-12-15 2010-05-19 富准精密工业(深圳)有限公司 散热装置
US20090027858A1 (en) * 2007-07-24 2009-01-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating device assembly
US7764500B2 (en) * 2007-08-31 2010-07-27 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Electronic system with a heat sink assembly
TWM336474U (en) * 2008-03-03 2008-07-11 Tai Sol Electronics Co Ltd Heat dissipater with external flow guiding function
US7701718B2 (en) * 2008-09-23 2010-04-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly
CN101835364B (zh) * 2009-03-13 2013-08-07 富准精密工业(深圳)有限公司 散热装置
CN101861082A (zh) * 2009-04-11 2010-10-13 富准精密工业(深圳)有限公司 散热装置

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