TW201338688A - 散熱裝置 - Google Patents
散熱裝置 Download PDFInfo
- Publication number
- TW201338688A TW201338688A TW101108554A TW101108554A TW201338688A TW 201338688 A TW201338688 A TW 201338688A TW 101108554 A TW101108554 A TW 101108554A TW 101108554 A TW101108554 A TW 101108554A TW 201338688 A TW201338688 A TW 201338688A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- heat
- dissipation fin
- fin
- base
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims description 37
- 238000009434 installation Methods 0.000 description 3
- 238000009960 carding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
一種散熱裝置,包括有底座及散熱鰭片組,所述底座包括有卡扣部,所述散熱鰭片組對應所述卡扣部開設有卡槽,所述卡扣部卡於所述卡槽中而將所述散熱鰭片固定於所述底座上。
Description
本發明涉及一種散熱裝置,特別是涉及一種包括有鰭片與底座之散熱裝置。
習知之電子元件散熱裝置一般是於電子元器件上設置散熱器,散熱器一般包括有底座、散熱鰭片及插入該散熱鰭片並連接該底座之熱傳導管,散熱鰭片通常是藉由焊接等固定方式固定於所述底座上,拆裝所述散熱鰭片均不方便。
鑒於以上內容,有必要提供一種方便安裝所述散熱鰭片組之散熱裝置。
一種散熱裝置,包括有底座及散熱鰭片組,所述底座包括有卡扣部,所述散熱鰭片組對應所述卡扣部開設有卡槽,所述卡扣部卡於所述卡槽中而將所述散熱鰭片組固定於所述底座上。
與習知技術相比,所述底座上之卡扣部卡於所述散熱鰭片組之卡槽中,無需焊接,很方便。
請參閱圖1,於本發明之一較佳實施方式中,一散熱裝置可固定於兩支撐片10上,包括有一底座20、一散熱鰭片組30及兩熱管50。於一實施方式中,所述兩支撐片10呈鏡像對稱。
請參照圖2,每一支撐片10包括有一支撐部11,設於所述支撐部11相對兩端之轉折部13及分別設於兩所述轉折部13上之兩安裝部15。所述支撐部11上開設有兩固定孔111。
所述底座20包括有底板21,所述底板21之上表面凸設有三卡扣部23,所述三卡扣部23平行設於所述底板21上。每一卡扣部23包括有一自所述底板21延伸形成之頸部231及一連接所述頸部231之頭部233。於一實施方式中,所述頸部231之直徑小於所述頭部233之直徑。所述底板21對應所述支撐片10之每一固定孔111開設有一安裝孔211。所述底板21之下表面用以接觸一發熱元件(圖未示),並開設有用以收容所述兩熱管50之兩安裝槽25。於一實施方式中,所述三卡扣部23相互平行。
請一起參照圖5,所述散熱鰭片組30包括有一第一散熱鰭片31及複數第二散熱鰭片33。所述第一散熱鰭片31及每一第二散熱鰭片33分別包括有一片體311。所述片體311之下端設有一第一折邊313,於上端設有一第二折邊314。於一實施方式中,所述第一折邊313及所述第二折邊314分別與所述片體311大致垂直,所述第一折邊313與所述第二折邊314大致平行。所述片體311開設有連通所述第一折邊313之三卡槽315,並於所述第二折邊314之下端開設有一通孔3111及一定位孔3113。每一卡槽315包括有一窄部3151及一連通所述窄部3151之寬部3153。於一實施方式中,所述窄部3151之直徑小於所述寬部3153之直徑。所述第一折邊313及所述第二折邊314上分別開設有連通所述片體311兩缺口3131。於一實施方式中,每一缺口3131之邊緣大致組成一“凸”字形。請一起參照圖4,每一第二散熱鰭片33之第一折邊313及第二折邊314分別於每一缺口3131之前端設有一卡固部331。於一實施方式中,每一卡固部331大致呈“凸”字形。
請參照圖2,每一熱管50包括有一導熱部51、一延伸部53及一連接所述導熱部51及所述延伸部53之連接部55。於一實施方式中,所述熱管50大致呈“U”字形。
請參照圖1及圖3,組裝時,將所述底座20放置於所述兩支撐片10上,並使所述底座20上之安裝孔211對齊所述支撐片10上之固定孔111,藉由鎖固件40所鎖入所述固定孔111及所述安裝孔211而將所述底座20固定於所述兩支撐片10上。
將所述第二散熱鰭片33之卡固部331對應卡入第一散熱鰭片31之缺口3131中而將第一散熱鰭片31及所述第二散熱鰭片33固定於一起,並藉由同樣之方式,將剩下所述第二散熱鰭片33固定於一起。
將上述組裝好之散熱鰭片組30安裝到所述底座20上,使所述散熱鰭片組30上之三卡槽315分別卡入所述底座20上之三卡扣部23中,所述卡扣部23之頭部233擠壓對應卡槽315之窄部3151,直到所述頭部233收容於所述寬部3153中。所述熱管50之導熱部51收容於一所述安裝槽25中,所述熱管50之延伸部53卡於所述散熱鰭片組30之通孔3111中。由此,將所述散熱裝置組裝完畢。
綜上所述,本發明確已符合發明專利要求,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,舉凡熟悉本發明技藝之人士,爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。
10...支撐片
11...支撐部
111...固定孔
13...轉折部
15...安裝部
20...底座
21...底板
211...安裝孔
23...卡扣部
231...頸部
233...頭部
25...安裝槽
30...散熱鰭片組
31...第一散熱鰭片
311...片體
3111...通孔
3113...定位孔
313...第一折邊
3131...缺口
314...第二折邊
315...卡槽
3151...窄部
3153...寬部
33...第二散熱鰭片
331...卡固部
40...鎖固件
50...熱管
51...導熱部
53...延伸部
55...連接部
圖1是本發明固定裝置之一較佳實施例及兩支撐片之一立體組裝圖。
圖2是圖1之一立體分解圖。
圖3是圖1中散熱鰭片組之一立體圖。
圖4是圖3中IV部分之一放大圖。
圖5是圖1中第一散熱鰭片及第二散熱鰭片之立體分解圖。
10...支撐片
11...支撐部
111...固定孔
13...轉折部
15...安裝部
20...底座
21...底板
211...安裝孔
23...卡扣部
231...頸部
233...頭部
25...安裝槽
30...散熱鰭片組
40...鎖固件
50...熱管
51...導熱部
53...延伸部
55...連接部
Claims (10)
- 一種散熱裝置,包括有底座及散熱鰭片組,其改進在於:所述底座包括有卡扣部,所述散熱鰭片組對應所述卡扣部開設有卡槽,所述卡扣部卡於所述卡槽中而將所述散熱鰭片組固定於所述底座上。
- 如申請專利範圍第1項所述之散熱裝置,其中所述散熱鰭片組包括有第一散熱鰭片及若干第二散熱鰭片,所述第一散熱鰭片開設有缺口,每一第二散熱鰭片設有卡固部,一所述第二散熱鰭片之卡固部卡於所述第一散熱鰭片之缺口中而將所述第二散熱鰭片及所述第一散熱鰭片上。
- 如申請專利範圍第2項所述之散熱裝置,其中每一第二散熱鰭片還開設有缺口,一所述第二散熱鰭片之卡扣部卡入與相鄰的另一第二散熱鰭片的缺口中,從而將相鄰之兩第二散熱鰭片固定一起。
- 如申請專利範圍第1項所述之散熱裝置,其中所述卡扣部包括有頸部及頭部,所述卡槽包括有窄部及寬部,所述頭部穿過所述窄部而卡於所述寬部中,所述頸部卡於所述窄部中。
- 如申請專利範圍第4項所述之散熱裝置,其中所述頸部之直徑小於所述頭部之直徑。
- 如申請專利範圍第4項所述之散熱裝置,其中所述窄部之直徑小於所述寬部之直徑。
- 如申請專利範圍第2項所述之散熱裝置,其中所述第一散熱鰭片及每一第二散熱鰭片分別包括有第一折邊,所述底座還包括有底板,所述第一折邊抵壓所述底板。
- 如申請專利範圍第7項所述之散熱裝置,其中所述第一散熱鰭片及每一第二散熱鰭片還包括有片體及第二折邊,所述第一折邊及所述第二折邊均大致垂直於所述片體,並相互平行。
- 如申請專利範圍第7項所述之散熱裝置,其中所述底板上設有三卡扣部,所述三卡扣部相互平行。
- 如申請專利範圍第1項所述之散熱裝置,其中所述散熱裝置還包括有熱管,所述熱管包括有導熱部、延伸部及連接所述導熱部及所述延伸部之連接部,所述底座開設有安裝槽,所述散熱鰭片組開設有通孔,所述導熱部收容於所述導熱部上,所述延伸部卡於所述通孔中。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012100631029A CN103313577A (zh) | 2012-03-12 | 2012-03-12 | 散热装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201338688A true TW201338688A (zh) | 2013-09-16 |
Family
ID=49113017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101108554A TW201338688A (zh) | 2012-03-12 | 2012-03-14 | 散熱裝置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130233528A1 (zh) |
CN (1) | CN103313577A (zh) |
TW (1) | TW201338688A (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2894954B1 (en) * | 2013-12-06 | 2021-08-11 | Marchesi Metal Technology (Suzhou) Co., Ltd | Heat dissipation housing structure connected to heat dissipation fin |
CN104812211A (zh) * | 2015-04-01 | 2015-07-29 | 太仓陶氏电气有限公司 | 一种变频器用散热器 |
CN109341374B (zh) * | 2018-11-14 | 2024-04-09 | 苏州永腾电子制品有限公司 | 高效散热器 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW587768U (en) * | 2003-01-30 | 2004-05-11 | Molex Inc | Heat-dissipating device |
US20050051297A1 (en) * | 2003-09-05 | 2005-03-10 | Jui-Chen Kuo | Heat sink |
US7441592B2 (en) * | 2006-11-26 | 2008-10-28 | Tsung-Hsien Huang | Cooler module |
US7650929B2 (en) * | 2007-09-30 | 2010-01-26 | Tsung-Hsien Huang | Cooler module |
US20090229790A1 (en) * | 2008-03-13 | 2009-09-17 | Asia Vital Components Co., Ltd. | Radiating fin assembly for thermal module |
US8251132B2 (en) * | 2008-03-27 | 2012-08-28 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat sink assembly and method for manufacturing the same |
-
2012
- 2012-03-12 CN CN2012100631029A patent/CN103313577A/zh active Pending
- 2012-03-14 TW TW101108554A patent/TW201338688A/zh unknown
- 2012-11-30 US US13/690,285 patent/US20130233528A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN103313577A (zh) | 2013-09-18 |
US20130233528A1 (en) | 2013-09-12 |
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