TW201418732A - Testing method for chip package and its system - Google Patents
Testing method for chip package and its system Download PDFInfo
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- TW201418732A TW201418732A TW102100527A TW102100527A TW201418732A TW 201418732 A TW201418732 A TW 201418732A TW 102100527 A TW102100527 A TW 102100527A TW 102100527 A TW102100527 A TW 102100527A TW 201418732 A TW201418732 A TW 201418732A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Abstract
Description
本發明是有關於一種晶片封裝測試方法及其系統,且特別是有關於一種在晶片貼附於主機板後,將主機板通電以直接測試晶片是否正常運作之晶片封裝測試方法及其系統。 The present invention relates to a wafer package test method and system thereof, and more particularly to a chip package test method and system for powering a motherboard to directly test whether the wafer is functioning normally after the wafer is attached to the motherboard.
由於晶片封裝(Multi-Chip Package,MCP)所使用之晶片品質及狀況不同,而必須藉由完備的測試方法,以判定積體電路(internal circulation,IC)的好壞。習知,一般積體電路(IC)的應用廠家在進行積體電路(IC)測試時,必須借助特殊的球柵陣列(Ball Grid Array,BGA)治具及應用程式來判定好壞。因此,即便是未貼附前判定是好的積體電路(IC),在貼片到主機板(mainboard,MB)上後,要判斷是否為可以運作的積體電路(IC)仍然很困難,此時,必須將主機板(MB)與機器裝成整機後,進行功能測試才能判定貼片到主機板(MB)的積體電路(IC)是否能夠使用。 Since the quality and condition of the wafer used in the Multi-Chip Package (MCP) are different, it is necessary to determine the quality of the integrated circuit (IC) by a complete test method. Conventionally, in general integrated circuit (IC) application manufacturers must use special Ball Grid Array (BGA) fixtures and applications to determine the quality of the integrated circuit (IC) test. Therefore, even if it is a good integrated circuit (IC) that is determined before the attachment, it is still difficult to determine whether it is a working integrated circuit (IC) after the patch is placed on the mainboard (MB). At this time, the motherboard (MB) and the machine must be installed as a complete machine, and functional tests must be performed to determine whether the integrated circuit (IC) of the chip to the motherboard (MB) can be used.
當主機板(MB)與機器裝成整機後,若發現主機板(MB)上的積體電路(IC)無法運作(或不良)就需要付出很大的維修成本來維修,因此,即使知道是那一個晶片發生故障,由於不良晶片已隨主機板(MB)被封裝成機,所以就必須拆機重新組裝,而造成生產效率損失、庫存不良品增多、修復成本增加及業績受損等不良影響。 When the motherboard (MB) and the machine are installed as a complete machine, if the integrated circuit (IC) on the motherboard (MB) is found to be inoperable (or defective), it will require a large maintenance cost to repair, so even if it is known The chip is faulty. Since the defective chip has been packaged into a machine with the motherboard (MB), it must be disassembled and reassembled, resulting in loss of production efficiency, increased inventory defects, increased repair costs, and impaired performance. influences.
本發明提供一種晶片封裝測試方法及其系統,使主機板上的積體電路在貼附後直接進行測試,以提高測試之便利性,並達到節省成本之目的。 The invention provides a chip packaging test method and a system thereof, which enable the integrated circuit on the motherboard to be directly tested after being attached, so as to improve the convenience of testing and achieve the purpose of cost saving.
本發明提出一種晶片封裝測試方法,步驟包括:先 將一晶片裝設於一主機板上,再透過一電力供應單元提供一運作電力,使主機板呈現運作狀態,接著建立主機板與一管控裝置之一通訊管道,並利用管控裝置發送一測試訊號至主機板,以進行晶片之測試,最後,依據晶片之測試結果,檢驗晶片是否正常運作。 The invention provides a chip packaging test method, and the steps include: Mounting a chip on a motherboard, providing a working power through a power supply unit, causing the motherboard to operate, then establishing a communication channel between the motherboard and a control device, and transmitting a test signal by using the control device Go to the motherboard for wafer testing, and finally, verify that the wafer is functioning properly based on the test results of the wafer.
在本發明之一實施例中,上述之將一晶片裝設於一 主機板上的步驟更包括:建立包括數個主機板的一聯板;以及於聯板的每一主機板上分別裝設一晶片。 In an embodiment of the invention, the chip is mounted on the chip The step on the motherboard further includes: establishing a board including a plurality of motherboards; and installing a chip on each of the motherboards of the board.
在本發明之一實施例中,上述之將一晶片裝設於一 主機板上的步驟更包括:將裝設有晶片之主機板放入一待檢測裝置中。 In an embodiment of the invention, the chip is mounted on the chip The step on the motherboard further includes: placing the motherboard on which the wafer is mounted into a device to be inspected.
在本發明之一實施例中,上述之建立通訊管道的步 驟包括:透過管控裝置之一無線通訊單元連接待檢測裝置之一無線通訊埠,以無線通訊方式建立管控裝置及待檢測裝置之通訊管道。 In an embodiment of the invention, the step of establishing a communication pipeline The method includes: connecting one of the wireless communication units of the device to be detected through one of the wireless communication units of the control device, and establishing a communication device between the control device and the device to be detected by wireless communication.
在本發明之一實施例中,上述之建立通訊管道的步 驟包括:透過一纜線連接管控裝置之一通訊單元及待檢測裝置之一通訊埠,以電性連接方式建立管控裝置及待檢測裝置之通訊管道。 In an embodiment of the invention, the step of establishing a communication pipeline The method includes: connecting a communication unit of one of the control devices and one of the devices to be detected through a cable, and establishing a communication device of the control device and the device to be detected by electrical connection.
本發明提供一種晶片封裝測試系統,包括一主機 板、一電力供應裝置及一管控裝置。主機板裝設一晶片,電力供應裝置提供一運作電力使主機板呈現運作狀態,管控裝置透過一通訊單元建立與主機板的一通訊管道,以發送一測試訊號至主機板,進行晶片之測試,並依據晶片之測試結果,檢驗晶片是否正常運作。 The invention provides a chip package test system, including a host A board, a power supply device and a control device. The motherboard is provided with a chip, and the power supply device provides a working power to make the motherboard display a working state. The control device establishes a communication pipeline with the motherboard through a communication unit to send a test signal to the motherboard for testing the chip. According to the test results of the wafer, it is checked whether the wafer is in normal operation.
在本發明之一實施例中,上述之數個主機板係連結 成一聯板,以將聯板置入一冶具中進行晶片之測試。 In an embodiment of the invention, the plurality of motherboard boards are connected Into a board, the board is placed in a tool for wafer testing.
在本發明之一實施例中,更包括一待檢測裝置以置 入裝設有晶片之主機板,待檢測裝置設有一通訊埠。 In an embodiment of the present invention, a device to be detected is further included The motherboard with the chip is mounted, and the device to be tested is provided with a communication port.
在本發明之一實施例中,上述之通訊埠及通訊單元 係為一藍芽裝置及一紅外線裝置其中之一者。 In an embodiment of the invention, the communication unit and the communication unit It is one of a Bluetooth device and an infrared device.
在本發明之一實施例中,上述之通訊埠及通訊單元 係分別為一通用序列匯流排連接埠,並透過一纜線以插接於通訊埠及通訊單元之通用序列匯流排連接埠,使通訊埠及通訊單元建立通訊管道。 In an embodiment of the invention, the communication unit and the communication unit The system is a universal serial bus connection port, and is connected to a universal serial bus connection port of the communication port and the communication unit through a cable, so that the communication port and the communication unit establish a communication pipe.
本發明因無需將主機板組裝於電子設備中即可進行 測試,因此節約了產品生產過程中的硬件測試儀器成本,同時也省去人工操作,可有效攔截不良品流出,並提高產品品質,更實現生產的即時管控,節約了產品出廠的測試時間,提高生產效能。 The invention can be carried out without assembling the motherboard into the electronic device Testing, thus saving the cost of hardware testing instruments in the production process, and also eliminating manual operations, effectively intercepting the outflow of defective products, improving product quality, realizing immediate control of production, saving test time and improving product delivery time. Production efficiency.
100‧‧‧待檢測裝置 100‧‧‧Device to be tested
110‧‧‧通訊埠 110‧‧‧Communication埠
120‧‧‧主機板 120‧‧‧ motherboard
130‧‧‧晶片 130‧‧‧ wafer
200‧‧‧管控裝置 200‧‧‧Control device
201‧‧‧管控程式 201‧‧‧Control program
210‧‧‧通訊單元 210‧‧‧Communication unit
220‧‧‧顯示單元 220‧‧‧ display unit
300‧‧‧電力供應裝置 300‧‧‧Power supply unit
310‧‧‧正電 310‧‧‧正正
320‧‧‧負電 320‧‧‧negative
400‧‧‧纜線 400‧‧‧ cable
420‧‧‧聯板 420‧‧‧ 联板
S110~S160‧‧‧步驟流程 S110~S160‧‧‧Step procedure
圖1是本發明晶片封裝測試系統之元件方塊圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a block diagram of components of a wafer package test system of the present invention.
圖2A是本發明利用無線通訊進行測試之實施例示意圖。 2A is a schematic diagram of an embodiment of the present invention for testing using wireless communication.
圖2B是本發明利用有線通訊進行測試之實施例示意圖。 2B is a schematic diagram of an embodiment of the present invention for testing using wired communication.
圖3是本發明中將數個主機板連接所成之聯板示意圖。 Fig. 3 is a schematic view showing a connecting board formed by connecting a plurality of motherboards in the present invention.
圖4是對應圖1之晶片封裝測試方法步驟流程圖。 4 is a flow chart corresponding to the steps of the wafer package test method of FIG. 1.
圖5~圖7是本發明實施例之晶片封裝測試方法的細部流程示意圖。 5 to 7 are schematic flow charts showing a method of testing a wafer package according to an embodiment of the present invention.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式,作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.
圖1是本發明晶片封裝測試系統之元件方塊圖。在 圖1中,晶片封裝測試系統包括一待檢測裝置100、一管控裝置200及一電力供應裝置300。待檢測裝置100包括一通訊埠110及一主機板120,主機板120上封裝設一晶片130。電力供應裝置300提供一運作電力使主機板120呈現運作狀態。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a block diagram of components of a wafer package test system of the present invention. in In FIG. 1, the chip package test system includes a device to be detected 100, a control device 200, and a power supply device 300. The device to be tested 100 includes a communication port 110 and a motherboard 120. A chip 130 is packaged on the motherboard 120. The power supply device 300 provides an operational power to cause the motherboard 120 to assume an operational state.
管控裝置200透過一通訊單元210建立與主機板120 的一通訊管道,通訊管道可為無線通訊或有線通訊,其相關通訊方式請容後說明。管控裝置200的管控程式201透過通訊單元210以發送一測試訊號至待檢測裝置100,透過待檢測裝置100的通訊埠110接收測試訊號,以進行主機板120上晶片130的效能測試,並依據晶片130的效能測試結果,檢驗晶片130是否正常運作,若是正常運作的狀態,則將待檢測裝置100上的主機板120進行電子裝置的組裝;若非為正常運作的狀態,則將晶片130自主機板120上拆卸下來以更換新的晶片130。 The control device 200 is established with the motherboard 120 through a communication unit 210. A communication pipe, the communication pipe can be wireless communication or wired communication, and the relevant communication mode should be explained later. The control program 201 of the control device 200 transmits a test signal to the device to be detected 100 through the communication unit 210, and receives the test signal through the communication port 110 of the device 100 to be detected, to perform the performance test of the chip 130 on the motherboard 120, and according to the chip. The performance test result of 130 checks whether the wafer 130 is operating normally. If it is in a normal operation state, the motherboard 120 on the device to be tested 100 is assembled with the electronic device; if it is not in a normal operation state, the wafer 130 is self-supported. The 120 is removed to replace the new wafer 130.
於本實施例中,於本實施例中,更進一步來說,請 參閱圖3,圖3是將上述之主機板120,以數個主機板120連結之方式形成一聯板420(印刷電路板),並將聯板420置入一冶具中,利用冶具使聯板壓合、上電及運作,即可進行印刷電路板(PCB)上晶片之效能測試。 In this embodiment, in this embodiment, further, please Referring to FIG. 3, FIG. 3 is a board 420 (printed circuit board) formed by connecting the above-mentioned motherboard 120 with a plurality of motherboards 120, and the slab 420 is placed in a metallurgical tool, and the slab is made by using a metallurgical tool. Capacitance testing, performance, and operation of the wafer on a printed circuit board (PCB).
請同時參閱圖2A及圖2B,圖2A是本發明利用無線 通訊進行測試之實施例示意圖。圖2B是本發明利用有線通訊進行測試之實施例示意圖。 Please refer to FIG. 2A and FIG. 2B simultaneously, FIG. 2A is a wireless device of the present invention. A schematic diagram of an embodiment of communication testing. 2B is a schematic diagram of an embodiment of the present invention for testing using wired communication.
在圖2A中,待檢測裝置100的通訊埠110是為一藍 芽裝置或一紅外線裝置,而管控裝置200之通訊單元210係與待檢測裝置100的通訊埠110相對應設置,通訊埠110及通訊單元210同時為藍芽裝置,或者通訊埠110及通訊單元210同時為紅外線裝置,藉此,使待檢測裝置100及管控裝置200,透過藍芽裝置或紅外線裝置建立一通訊管道,使待檢測裝置100及管控裝置200藉由通訊管道進行資料之傳遞。 In FIG. 2A, the communication port 110 of the device to be detected 100 is a blue The bud device or an infrared device, and the communication unit 210 of the control device 200 is disposed corresponding to the communication port 110 of the device 100 to be detected, and the communication port 110 and the communication unit 210 are simultaneously a Bluetooth device, or the communication port 110 and the communication unit 210. At the same time, it is an infrared device, whereby the device to be detected 100 and the control device 200 establish a communication pipe through the Bluetooth device or the infrared device, so that the device to be detected 100 and the control device 200 transmit data through the communication pipe.
圖2B與圖2A之差異在於,待檢測裝置100的通訊 埠110是為一通用序列匯流排連接埠,而管控裝置200之通訊單元210同時也是通用序列匯流排連接埠,兩者間透過一纜線400電性連接,使待檢測裝置100的通訊埠110及管控裝置200的通訊單元210透過纜線400的電性連接建立一通訊管道,並以此纜線400使待檢測裝置100及管控裝置200藉由通訊管道進行資料之傳遞。 The difference between FIG. 2B and FIG. 2A lies in the communication of the device to be detected 100. The 埠110 is a universal serial bus connection port, and the communication unit 210 of the control device 200 is also a universal serial bus connection port. The two are electrically connected through a cable 400, so that the communication device 110 of the device to be detected 100 The communication unit 210 of the control device 200 establishes a communication pipe through the electrical connection of the cable 400, and uses the cable 400 to enable the device to be detected 100 and the control device 200 to transmit data through the communication pipe.
請參閱圖4繪示對應圖1之測試項目管控方法的流 程示意圖,圖5至圖7繪示本發明實施例之晶片封裝測試方法的細部流程示意圖。請配置參閱圖1至圖3以利於了解。此方法流程如下:圖4是對應本發明一實施例之步驟流程圖。在圖4中,其主要步驟流程如下:步驟S110:將一晶片130裝設於一主機板120上,將裝設有晶片130之主機板120放入一待檢測裝置100中,更甚至於可將數個主機板120係連結成一聯板420,以將聯板420置入一冶具中進行晶片130之測試。 Please refer to FIG. 4, which illustrates the flow of the test project management method corresponding to FIG. FIG. 5 to FIG. 7 are schematic diagrams showing details of a wafer package test method according to an embodiment of the present invention. Please refer to Figure 1 to Figure 3 for help. The method flow is as follows: Figure 4 is a flow chart corresponding to the steps of an embodiment of the present invention. In FIG. 4, the main steps are as follows: Step S110: A wafer 130 is mounted on a motherboard 120, and the motherboard 120 on which the wafer 130 is mounted is placed in a device 100 to be inspected, and even more A plurality of motherboards 120 are coupled into a single board 420 to place the board 420 in a tool for testing the wafer 130.
如圖3,更可將數個主機板120係連結成一聯板420 以進行測試的,則此步驟的細部施行方式即如圖5所示,建立包括數個主機板120的一聯板420(步驟S111)及於聯板420的每一主機板120上分別裝設一晶片130(步驟S119)。 As shown in FIG. 3, a plurality of motherboards 120 can be connected into a single board 420. For the test, the detailed implementation of this step is as shown in FIG. 5, and a board 420 including a plurality of motherboards 120 is established (step S111) and installed on each motherboard 120 of the board 420. A wafer 130 (step S119).
步驟S120:透過一電力供應單元300提供一運作電 力,使主機板120呈現運作狀態,電力供應單元300較佳為一直流電源,同時傳送正電310及負電320至主機板120,使主機板120呈現運作狀態。 Step S120: providing a working power through a power supply unit 300 The power supply unit 300 is preferably in a running state, and the power supply unit 300 is preferably a continuous power source, and simultaneously transmits the positive power 310 and the negative power 320 to the motherboard 120 to cause the motherboard 120 to assume an operational state.
步驟S130:再透過一管控裝置200之一通訊單元210 連接待檢測裝置100之一通訊埠110,以建立管控裝置及待檢測裝置之一通訊管道,於此步驟中,依據有線、無線通訊的方式不同,此步驟的細部施行方式亦有所不同。 Step S130: re-transmitting through one of the control units 200 of the communication unit 210 A communication port 110 of the device to be detected 100 is connected to establish a communication pipe of the control device and the device to be detected. In this step, the details of the steps are different depending on the manner of wired or wireless communication.
如圖2A,若以無線通訊的方式建立通訊管道,則此 步驟的細部施行方式即如圖6所示,透過一管控裝置之一無線通訊單元,以連接待檢測裝置之一無線通訊埠(步驟S131),無線通訊單元及無線通訊埠較佳為藍芽裝置或紅外線裝置。建立管控裝置及待檢測裝置之一無線通訊管道(步驟S139)。 As shown in Figure 2A, if the communication pipe is established by wireless communication, then this The detailed implementation of the step is as shown in FIG. 6, through a wireless communication unit of a control device to connect one of the wireless communication devices of the device to be detected (step S131), and the wireless communication unit and the wireless communication device are preferably Bluetooth devices. Or an infrared device. A wireless communication pipe of the control device and the device to be detected is established (step S139).
如圖2B,若以有線通訊的方式建立通訊管道,則此 步驟的細部施行方式即如圖7所示,透過一纜線400連接一管控裝置之一通訊單元及待檢測裝置之一通訊埠(步驟S132),通訊單 元及通訊埠較佳為通用序列匯流排連接埠,兩者間透過一纜線400電性連接,藉此以建立通訊管道(步驟S139)。 As shown in Figure 2B, if the communication pipeline is established by wired communication, then this The detailed implementation of the step is as shown in FIG. 7, and a communication unit of one of the control devices and one of the devices to be detected are connected via a cable 400 (step S132), the communication list Preferably, the meta-communication port is a universal serial bus port, and the two are electrically connected through a cable 400 to establish a communication pipe (step S139).
步驟S140:利用管控裝置200發送一測試訊號至待 檢測裝置100的主機板120,以進行晶片130之測試。 Step S140: Send a test signal to the control device 200 to wait for The motherboard 120 of the device 100 is tested for testing of the wafer 130.
步驟S150:依據晶片之測試結果,判斷晶片是否正 常運作,若是正常運作的狀態,則將待檢測裝置100上的主機板120進行電子裝置的組裝,並進行步驟S160;若非為正常運作的狀態,則將晶片130自主機板120上拆卸下來以更換新的晶片130,並回到步驟S120重新進行檢驗。 Step S150: judging whether the wafer is positive according to the test result of the chip In the normal operation state, the motherboard 120 on the device to be tested 100 is assembled with the electronic device, and step S160 is performed; if not in the normal operation state, the wafer 130 is detached from the motherboard 120. The new wafer 130 is replaced and returned to step S120 for re-inspection.
步驟S160:根據判斷結果產生相對應的一提示訊息。 Step S160: Generate a corresponding prompt message according to the judgment result.
綜上所述,本發明應具備下列優點: In summary, the present invention should have the following advantages:
1.本發明可以針對貼片後的主機板(MB)進行積體 電路(IC)測試,以判定積體電路(IC)的可用性。藉由本發明可快速測試、並取得準確性高的測試結果,使應用積體電路(IC)的廠家,能夠及早確認發現貼片後的主機板(MB)上積體電路(IC)是否有使用上的問題,以符合品質管理學上說的“越早發現瑕疵(NG)品所付出的失敗的成本越低”的原則。 1. The present invention can perform integration on a motherboard (MB) after patching. Circuit (IC) testing to determine the availability of integrated circuits (ICs). By the invention, the test result can be quickly tested and obtained with high accuracy, so that the manufacturer of the integrated circuit (IC) can confirm the early use of the integrated circuit (IC) on the motherboard (MB) after the patch is found. The problem is in line with the principle of “the lower the cost of failure to pay for the discovery of NG (NG) products”.
2.本發明中測試程式自動測試,自動判斷主機板(MB) 的積體電路(IC)使用效能,管控裝置可以連接統計過程控制(Statistical Process Control,SPC),也可不連統計過程控制(SPC)單獨測試主機板(MB)上的積體電路(IC)好壞,以配合各種生產流程應用。 2. The test program is automatically tested in the present invention, and the host board (MB) is automatically determined. The integrated circuit (IC) uses efficiency, the control device can be connected to the Statistical Process Control (SPC), or the integrated circuit (IC) on the motherboard (MB) can be tested separately without the statistical process control (SPC). Bad to match various production process applications.
3.本發明可有效節省了生產過程中的硬體測試儀器 成本,透過機器測試,可避免人工操作的疏忽及有效的攔截不良品產出,以提高出貨產品品質,並實現生產的即時管控,節約了測試時間。 3. The invention can effectively save the hardware testing instrument in the production process Cost, through machine testing, can avoid the negligence of manual operation and effectively intercept the output of defective products, so as to improve the quality of the products shipped, and realize the immediate control of production, saving test time.
雖然本發明以前述實施例揭露如上,然其並非用以 限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,所作更動與潤飾之等效替換,仍為本發明之專利保護範圍 內。 Although the present invention is disclosed above in the foregoing embodiments, it is not used The invention is not limited by the spirit and scope of the present invention, and the equivalent replacement of the modification and retouching is still the scope of patent protection of the present invention. Inside.
S110~S160‧‧‧步驟流程 S110~S160‧‧‧Step procedure
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