CN1609624A - Automatic tester for electronic elements and testing method thereof - Google Patents

Automatic tester for electronic elements and testing method thereof Download PDF

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Publication number
CN1609624A
CN1609624A CN 200410011246 CN200410011246A CN1609624A CN 1609624 A CN1609624 A CN 1609624A CN 200410011246 CN200410011246 CN 200410011246 CN 200410011246 A CN200410011246 A CN 200410011246A CN 1609624 A CN1609624 A CN 1609624A
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electronic component
motherboard
test
district
back plate
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CN 200410011246
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Chinese (zh)
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资重兴
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Individual
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Individual
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Priority to CN 200410011246 priority Critical patent/CN1609624A/en
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Abstract

The present invention discloses one kind of automatic electronic element measuring apparatus and method. The measuring apparatus consists of at least one system unit board, two pick-ups, one holding area, one conveyer and one control computer. The measuring method includes the following steps: picking up one electronic element with the pick-up controlled with the computer and setting in the measuring board; performing measurement; transmitting the measured data to the computer for comparison and judgement; and taking out the tested electronic element with the other pick-up and storing the electronic element based on the measurement result. The present invention has high measurement speed and lowered measurement cost, and is suitable for mass measurement.

Description

The automatic test device of electronic component and method of testing thereof
Technical field
The present invention relates to a kind of automatic test device and method of testing thereof of electronic component, automatic test device and method of testing thereof that particularly a kind of electric crystal of finishing applicable to encapsulation carries out the full test operation.
Background technology
Known electronic component and electronic product etc., in the middle of processing procedure and before dispatching from the factory, all can carry out QC actions such as a series of check and test, except guaranteeing its product quality, and can be because of detecting the flaw on the action discovery processing procedure, to revise, to improve or to change, in order to do promoting its yield of products.Wafer package now or microprocessor manufacturer; usually offer between the warranty period of long term consumer; even lifelong guarantor admittedly; therefore need especially in the product processing procedure and before dispatching from the factory through tight quality keyholed back plate; especially regular meeting carries out comprehensive test job before dispatching from the factory; to guarantee that each wafer has good quality and functional effect on the market, reduce its follow-up QC cost by this.
But the actual method of testing of known wafer, be to use most manpowers to guard the put cabinet of several tests respectively with motherboard, this is put cabinet inside and plural number test is installed plants the dress test with motherboard for wafer, so a people only can guard the several host plate and put cabinet, causes the increase of human cost; Secondly, known test jobs is with manpower wafer to be planted to be loaded on the Test Host plate, through after a series of test actions, take off electric crystal with manpower again, as seen it wastes many times in previous operations (wafer of taking) and subsequent job (taking out wafer and difference storing etc.) action, it is very dark to influence QC speed, be unfavorable for a large amount of productions, return factory's maintenance cost between warranty period backward, increased the manufacturing and the QC cost of product though so can reduce, for consumers, genus is unfavorable eventually.
Summary of the invention
The objective of the invention is to solve above-mentioned commonly see with manpower guard Test Host plate put that cabinet carries out that the detection speed that electronic components test exists is slow, manufacturing and the high problem of QC cost, and provide a kind of and improve test speed, reduce the QC cost, be suitable for the automatic test device and the method for testing thereof of the electronic component of substantive test QC.
The automatic test device of the present invention's electronic component, at least include that a motherboard is put cabinet, two groups of capture devices, are taken in district, a conveying device, a keyholed back plate main frame, it is vertical counter that motherboard is put cabinet, this motherboard is put and is provided with plural number test motherboard, test motherboard and keyholed back plate main frame line in the cabinet; Two groups of capture devices be carry out electronic component get pick, transplanting and put the automated machine device of action, it is arranged at motherboard respectively and puts place, cabinet two sides, two groups of capture devices and keyholed back plate main frame line; Taking in trivial branch has and surveys the district and survey the district, puts electronic component for concentrating, and takes in the district and is provided with a collating unit, this collating unit and keyholed back plate main frame line; Conveying device is not survey electronic component and be transported to motherboard and put the cabinet place taking in the district, and export the electronic component of surveying that motherboard is put cabinet to take in the district conveyer, this conveying device is located at two groups of capture devices and is taken between the collating unit in district, conveying device and keyholed back plate main frame line; The keyholed back plate main frame is that the order capture device produces specific action, line is monitored electronic components test quality effect with motherboard with unification in test, can carry out the comparison and the difference of electronic component quality, and can store test, than the device of reciprocity data, the test that makes motherboard put cabinet by the signal line constitutes line with motherboard and keyholed back plate main frame by this, forms the automatic test device of electronic component.
Described motherboard is put cabinet below and is provided with a working area, and this working area is divided into and surveyed the lattice district and do not survey the lattice district, the electronic component of having surveyed and not surveyed for temporary transient storing respectively.
Described motherboard is put cabinet and is several, forms uprightly shape side by side, and each motherboard is put cabinet and all respectively is provided with two groups of capture devices.
Described capture device and collating unit are rail mounted mechanical arm or elbow formula mechanical arm, or the mechanical hook-up of other available robotization instruction control is wherein a kind of.
Described conveying device is provided with an input part and an efferent, is used for distinguishing delivering electronic components.
The automatic test device method of testing of the present invention's electronic component may further comprise the steps:
(B), implant electronic component: control a capture device by the keyholed back plate main frame with signal and get and pick electronic component and plant the test motherboard of putting cabinet in motherboard;
(C), test: the test of being put cabinet by motherboard is tested with motherboard and electronic component collocation;
(D), main frame keyholed back plate: the test data data that will test with motherboard passes to the keyholed back plate main frame, is compared, distinguished quality, the effect of each electronic component by the keyholed back plate main frame;
(E), take out electronic component: take out the electronic component that test is finished with another capture device of keyholed back plate host computer control, and deposit electronic component according to the test result classification.
In addition, before described step (B) is implanted electronic component, (A) input electronic element in steps also, the step of this input electronic element is to be delivered to motherboard with the electronic component that conveying device will be taken in the district to put the cabinet place, gets for capture device and picks test.
After described step (E) was taken out electronic component, also (F) exported electronic component in steps, and the step of this output electronic component is with conveying device electronic component to be delivered to take in to distinguish to sentence to leave concentratedly.
The present invention has improved test speed, has reduced the QC cost, has been suitable for the substantive test QC owing to adopt automatic test device and method of testing thereof that electronic component is tested.
Description of drawings
Fig. 1 is the vertical view of the automatic test device of the present invention's electronic component.
Fig. 2 puts view of cabinet for the motherboard in the automatic test device of the present invention's electronic component.
Fig. 3 puts cabinet another side view for the motherboard in the automatic test device of the present invention's electronic component.
Fig. 4 is the automatic test device method of testing FB(flow block) of the present invention's electronic component.
Embodiment
See also Fig. 1, Fig. 2, shown in Figure 3, put cabinet 1 for the automatic test device of the present invention's electronic component includes a motherboard at least, two groups of capture devices 2,2`, take in district's 3, one conveying device 4, a keyholed back plate main frame 5, and by wired or wireless signal line, can carry out the automatic test operation of electronic component, wherein:
Motherboard is put cabinet 1 and is provided the device that the plural number test is provided with motherboard 11 arrangements, vertical lattice cabinet or screen work that it communicates for the two sides, the also structure that do not communicate of two sides, this motherboard is put and is provided with a plurality of tests motherboard 11 in the cabinet 1, this test can be general desktop computer or laptop or individual action secretary (PDA) or other microcomputer main frame with motherboard 11, motor, the motherboard of equipment such as machinery, and put cabinet 1 below in motherboard and be provided with a working area 12, this working area 12 is divided at least one lattice district 121 and that surveyed and is not surveyed lattice district 122, for the electronic component 10 that temporary transient storing has respectively been surveyed and do not surveyed, test is with motherboard 11 and keyholed back plate main frame 5 lines;
Two groups of capture devices 2,2` can carry out electronic component to get and pick automatically, the automated machine device of transplanting and storing action, it can be a kind of rail mounted mechanical arm or elbow formula mechanical arm, or the mechanical hook-up of other available robotization instruction control is wherein a kind of, two groups of capture devices 2,2` and keyholed back plate main frame 5 lines, two capture devices 2,2` is provided with the acquisition 21 of at least one electronic component, 21`, two capture devices 2,2` is arranged at motherboard respectively and puts place, cabinet 1 two sides, an available wherein capture device 2 is packed electronic component in the action of test with motherboard 11, and another is got device 2` and can be taken out electronic components and be placed in take in motherboard 11 by test and distinguish 3, or makes two groups of capture devices 2,2` implants and takes out the electronic component action separately;
Taking in district 3 is to be used for the concentrated device that electronic component has detected and do not detect of distinguishing, can be an article placing cabinet is arranged at motherboard and locates around putting cabinet 1, and separated at least one district 31 and that surveyed and surveyed district 32, with the electronic component 10 of concentrating storing to detect and do not detected respectively, this takes in the collating unit 33 that district 3 can be provided with a robotization, this collating unit 33 can be rail mounted mechanical arm or elbow formula mechanical arm, or the mechanical hook-up of other available robotization instruction control is wherein a kind of, the not survey electronic component 10 of not surveying district 32 can be picked and placeed in following conveying device 4 by this, and fetch by conveying device 4 and to survey electronic component 10 and concentrate to be placed in and survey district 31, this collating unit 33 and keyholed back plate main frame 5 lines;
Conveying device 4 is that the above-mentioned district 3 of taking in is not surveyed electronic component and is delivered to motherboard and puts cabinet 1 place, and the electronic component 10 of surveying that motherboard is put cabinet 1 exported to and take in district's conveyer of 3, conveying device 4 can be equivalent devices such as conveying belt or delivery wheel, this conveying device 4 is located at two groups of capture devices 2,2` and is taken in 33 of district's collating units of 3, conveying device 4 is provided with an input part 41 and an efferent 42, to carry out the transportation action of above-mentioned electronic component 10, conveying device 4 and keyholed back plate main frame 5 lines respectively;
Keyholed back plate main frame 5 is unified monitoring electronic components test quality effects, carry out the comparison and the difference of electronic component quality, can store test, than reciprocity data, and can order capture device 2,2` to produce the rear end host computer of specific action, it includes comparison, differentiation, stores test data and produces required software and the hardware device of specific instruction;
By this, by wired or wireless signal line 6 modes, make each test that motherboard puts cabinet 1 respectively or unified and keyholed back plate main frame 5 lines, and make and respectively organize capture device 2,2` and keyholed back plate main frame 5 formation lines with motherboard 11, so, the automatic test device of promptly forming the present invention's electronic component; And this keyholed back plate main frame 5 also can with above-mentionedly take in district 3, collating unit 33 and conveying device 4 constitutes lines, in order to do making uses of arranging in pairs or groups mutually of a whole set of automatic test device, makes testing process more attain smooth and easy, coordination.
As shown in Figure 1 and Figure 2, the present invention's motherboard is put cabinet 1 and can be provided with a plurality of simultaneously, form vertical type shape side by side, and put cabinet 1 two sides in each motherboard and install capture device 2,2` respectively, and make conveying device 4 be located at two groups of capture devices 2,2` and take in 33 of district's collating units of 3, the test group that forms electronic component by this is to promote testing efficiency.
See also Fig. 4 and cooperate Fig. 1, Fig. 2, shown in Figure 3, the automatic test device method of testing of the present invention's electronic component may further comprise the steps:
(A) input electronic element: do not survey district 32 by the collating unit 33 of taking in district 3 from it and take out the input part 41 that electronic component 10 is placed in conveying device 4, electronic component 10 is delivered to each motherboard puts cabinet 1 place, make capture device 2 or capture device 2` pick and place again putting the not survey lattice district 122 of cabinet 1 temporary, or directly enter following (B) flow process in motherboard;
(B), implant electronic component: control one or more groups capture device 2 with signal by keyholed back plate main frame 5, make this capture device 2 unified or put the not survey lattice district 122 of cabinet 1 or conveying device 4 by motherboard respectively and get and pick for example action such as wafer of electronic component 10, and this electronic component 10 planted the test of putting cabinet 1 in motherboard with motherboard 11, make each electronic component 10 and test constitute with motherboard 11 that link can actual collocation user mode;
(C), test: the test of putting cabinet 1 by motherboard with motherboard 11 and electronic component 10 for example collocation such as wafer carry out the test action of actual uses, wherein, respectively test with motherboard 11 other software of testing indispensability, hardware etc. be installed;
(D), main frame keyholed back plate: motherboard is put the data such as data that the test of cabinet 1 tested with motherboard 11 and passed to keyholed back plate main frame 5, compare, distinguish quality, operating speed and the effect etc. of each electronic component by soft, the hardware established in the keyholed back plate main frame 5, can show test results with display immediately, and comparison and differentiation data etc. can be stored in the recordable hardware device of disk drive or magnetic tape station or other;
(E), take out electronic component: with keyholed back plate main frame 5 according to comparison result, by instruction signal unified or respectively the main control system plate put cabinet 1 another capture device 2` and take out the electronic component 10 that test is finished, and make capture device 2` deposit electronic component 10 is put cabinet 1 in motherboard the lattice of survey district 121 according to the test result classification, or directly be positioned over the delivery section 42 of conveying device 4, automatically finish the test jobs of electronic component by this, said classification is as being divided into faulty materials, low-power, grade such as high-quality;
(F), output electronic component: put the capture device 2 of cabinet 1 or capture device 2` by motherboard and surveyed lattice district 121 or test has been surveyed the efferent 42 that electronic component 10 is placed in conveying device 4 with motherboard 11 taking-ups from it, to survey electronic component 10 be delivered to take in the district 3, making collating unit 33 pick and place in surveying district 31 again concentrates, in order to do for carrying out the postorder processing procedure, for example print, packing etc.
The automatic test device of the present invention's electronic component since by motherboard put cabinet 1, two groups of electronic components capture device 2,2`, take in district 3, conveying device 4 and keyholed back plate main frame 5 and form, and implant electronic component, (C) test, (D) main frame keyholed back plate, (E) by above-mentioned main step (B) and take out electronic component, therefore can carry out the full test work of electronic component by 5 unifications of keyholed back plate main frame fully, only need a people to monitor keyholed back plate main frame 5, therefore can significantly reduce the human cost of QC.
Secondly, the present invention can control capture device 2,2` by keyholed back plate main frame 5, take in district 3, collating unit 33 and conveying device 4, to carry out the forward and backward exercises of electronic component 10 tests, therefore can be by suitable motion flow planning, shorten preceding previous operations of test job and follow-up classification and put the time of operation, make test speed and output be easy to make clear, and promote the speed of its integrated testability operation, so can reduce QC cost before the product export such as electronic component by this.
The automatic test device method of testing of the present invention's electronic component, its control capture device 2,2`, take in district 3, collating unit 33 and conveying device 4 produces actors, also can be undertaken, or make this keyholed back plate main frame 5 be respectively Test Host and main control system part by other host computer equipment.In addition, the present invention singly is not confined to the test jobs of electronic element products before dispatching from the factory, it also can be installed in the specific production line, to get the electronic component of picking in the processing procedure at random or comprehensively, wafer in the encapsulation process etc. for example, and carry out above-mentioned test jobs, in order to do the quality of monitoring electronic component at any time, and can be by stored comparison data of keyholed back plate main frame 5 etc., as the foundation of improving electronic component process apparatus or work such as maintenance, replacing; Therefore, such as with the automatic test device and the method for testing thereof of the present invention's electronic component, be embodied as in the electronic product processing procedure or dispatch from the factory before the QC form, all should be claim of the present invention and comprise.

Claims (9)

1, a kind of automatic test device of electronic component, it is characterized in that: it includes, and a motherboard is put cabinet, two groups of capture devices, are taken in district, a conveying device, a keyholed back plate main frame, wherein, it is vertical counter that motherboard is put cabinet, this motherboard is put and is provided with plural number test motherboard, test motherboard and keyholed back plate main frame line in the cabinet; Two groups of capture devices be carry out electronic component get pick, transplanting and put the automated machine device of action, it is arranged at motherboard respectively and puts place, cabinet two sides, two groups of capture devices and keyholed back plate main frame line; Taking in trivial branch has and surveys the district and survey the district, puts electronic component for concentrating, and takes in the district and is provided with a collating unit, this collating unit and keyholed back plate main frame line; Conveying device is not survey electronic component and be transported to motherboard and put the cabinet place taking in the district, and export the electronic component of surveying that motherboard is put cabinet to take in the district conveyer, this conveying device is located at two groups of capture devices and is taken between the collating unit in district, conveying device and keyholed back plate main frame line.
2, the automatic test device of a kind of electronic component according to claim 1, it is characterized in that: described motherboard is put cabinet below and is provided with a working area, and what this working area divided into that temporary transient storing surveyed electronic component surveys the not survey lattice district that electronic component is not surveyed in lattice district and temporary transient storing.
3, the automatic test device of a kind of electronic component according to claim 1 and 2 is characterized in that: described motherboard is put cabinet and is several, forms uprightly shape side by side, and each motherboard is put cabinet and all respectively is provided with two groups of capture devices.
4, the automatic test device of a kind of electronic component according to claim 1, it is characterized in that: described capture device and collating unit are rail mounted mechanical arm or elbow formula mechanical arm, or the mechanical hook-up of other available robotization instruction control is wherein a kind of.
5, the automatic test device of a kind of electronic component according to claim 1 is characterized in that: described conveying device is provided with an input part and an efferent that is used for distinguishing delivering electronic components.
6, the automatic test device of a kind of electronic component according to claim 1 is characterized in that: described capture device, take in district, collating unit and conveying device by signal line and keyholed back plate main frame line.
7, a kind of method of testing of automatic test device of a kind of electronic component as claimed in claim 1, this method may further comprise the steps:
(B), implant electronic component: control a capture device by the keyholed back plate main frame with signal and get and pick electronic component and plant the test motherboard of putting cabinet in motherboard;
(C), test: the test of being put cabinet by motherboard is tested with motherboard and electronic component collocation;
(D), main frame keyholed back plate: the test data data that will test with motherboard passes to the keyholed back plate main frame, is compared, distinguished quality, the effect of each electronic component by the keyholed back plate main frame;
(E), take out electronic component: take out the electronic component that test is finished with another capture device of keyholed back plate host computer control, and deposit electronic component according to the test result classification.
8, the method for testing of the automatic test device of a kind of electronic component according to claim 7, it is characterized in that: before described step (B) is implanted electronic component, also has (A) input electronic element step, the step of this input electronic element, be to be delivered to motherboard with the electronic component that conveying device will be taken in the district to put the cabinet place, get for capture device and pick test.
9, the method for testing of the automatic test device of a kind of electronic component according to claim 7, it is characterized in that: after described step (E) is taken out electronic component, also has (F) output electronic component step, the step of this output electronic component is with conveying device electronic component to be delivered to take in to distinguish to sentence to leave concentratedly.
CN 200410011246 2004-11-23 2004-11-23 Automatic tester for electronic elements and testing method thereof Pending CN1609624A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200410011246 CN1609624A (en) 2004-11-23 2004-11-23 Automatic tester for electronic elements and testing method thereof

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Application Number Priority Date Filing Date Title
CN 200410011246 CN1609624A (en) 2004-11-23 2004-11-23 Automatic tester for electronic elements and testing method thereof

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CN1609624A true CN1609624A (en) 2005-04-27

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811368A (en) * 2012-11-08 2014-05-21 英华达(南京)科技有限公司 Chip package test method and system thereof
CN111816966A (en) * 2020-09-14 2020-10-23 中国电子科技集团公司第九研究所 Automatic and rapid debugging method suitable for lumped parameter surface-mounted circulator magnetic field

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811368A (en) * 2012-11-08 2014-05-21 英华达(南京)科技有限公司 Chip package test method and system thereof
CN111816966A (en) * 2020-09-14 2020-10-23 中国电子科技集团公司第九研究所 Automatic and rapid debugging method suitable for lumped parameter surface-mounted circulator magnetic field
CN111816966B (en) * 2020-09-14 2020-11-24 中国电子科技集团公司第九研究所 Automatic and rapid debugging method suitable for lumped parameter surface-mounted circulator magnetic field

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Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
EE01 Entry into force of recordation of patent licensing contract

Assignee: Domintech Co., Ltd.

Assignor: Zi Zhongxing

Contract fulfillment period: 2008.7.4 to 2024.11.23 contract change

Contract record no.: 2008990000188

Denomination of invention: Automatic tester for electronic elements and testing method thereof

Granted publication date: Wei Shouquan

License type: Exclusive license

Record date: 2008.7.4

LIC Patent licence contract for exploitation submitted for record

Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.7.4 TO 2024.11.23

Name of requester: SHUN LEE PRECISION TECHNOLOGY CO.

Effective date: 20080704

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication