TW201410763A - Resin composition having high thermal conductivity - Google Patents

Abstract

Provided is a resin composition having high thermal conductivity which has an excellent thin-wall fluidity while maintaining a high thermal conductivity. The resin composition having high thermal conductivity comprises: 100 parts by mass of a polyarylene sulfide resin (A); and 80 to 600 parts by mass of magnesium oxide (B) that has been surface-treated with a vinyl alkoxy silane compound. It is preferred that the surface-treated magnesium oxide (B) has an average particle diameter, that is determined by the laser diffraction scattering method, of greater than 10 mum and not greater than 100 mum. It is preferred that the vinyl alkoxy silane sticks to the surface of the surface-treated magnesium oxide (B) at a ratio of 0.3-1.5 mass% relative to the magnesium oxide.

Description

High thermal conductivity resin composition

The present invention relates to a highly thermally conductive resin composition using a poly(aryl ether) resin.

A poly-arylene ether resin (hereinafter referred to as "PAS resin") represented by polyphenylene ether resin (hereinafter referred to as "PPS resin") has high heat resistance and mechanical properties. It is widely used in electrical and electronic machine parts and materials, automotive machine parts materials, chemical machine parts and materials, etc., chemical resistance, dimensional stability, and flame retardancy. The heat resistance of the PAS resin and the thermal conductivity of the activated thermally conductive filler are known as high thermal conductivity resin compositions in which a PAS resin and a thermally conductive filler are blended. As the thermally conductive filler, for example, a metal such as copper, silver, iron, or aluminum, or a filler containing the metal, a carbon-based filler such as carbon or graphite, or alumina, magnesia, cerium oxide, or oxidation is used. A filler of a metal oxide such as zinc or titanium oxide.

Among them, magnesium oxide is useful in addition to high thermal conductivity and moderate hardness and insulation. The applicant proposes to include surface-treated magnesium oxide, that is, magnesium oxide having a coating layer containing a magnesium phosphate compound, and PAS. A lipid high thermal conductivity resin composition such as a resin (Patent Document 1). The high thermal conductivity resin composition improves the moldability and the moist heat resistance and solves the problem.

In addition, PAS resins are listed, as well as surface treated The resin composition of the magnesium oxide is disclosed in the resin compositions of Patent Document 2 and Patent Document 3.

Patent Document 2 discloses a resin composition comprising a PAS resin and magnesium oxide or the like which is surface-treated with an alkoxydecane compound. In the resin composition, the purpose of using the surface-treated magnesium oxide is to impart corrosion resistance. Further, the amount of the magnesium oxide blended is a small amount, and the amount of the resin composition which exhibits high heat conduction is not obtained. In other words, it is not a resin composition having high thermal conductivity.

Patent Document 3 discloses a resin composition (a molding material for electrical insulation and a heat releasing member) comprising a PAS resin and a magnesium oxide surface-treated at 800 ° C or higher. The purpose of using the surface-treated magnesium oxide in the resin composition is to impart high thermal conductivity and moist heat resistance. Therefore, the surface-treated magnesium oxide is characterized in that it is surface-treated after calcination at 800 ° C or higher. In addition, examples of the surface treatment agent used for the surface treatment include a decane coupling agent, a titanate coupling agent, and the like.

In recent years, in order to reduce the size and thickness of various products such as electrical products, it is required to maintain a high thermal conductivity and excellent mechanical properties, and a resin composition excellent in thin-walled flowability. .

The high thermal conductivity resin composition disclosed in Patent Document 1 exhibits high fluidity, but the fluidity of thin walls cannot be said to have fluidity. The resin composition disclosed in other patent documents is also not a thin-walled fluid.

Prior technical literature

Patent literature

Patent Document 1: Japanese Laid-Open Patent Publication No. 2006-282783

Patent Document 2: Japanese Patent Publication No. 8-12886

Patent Document 3: Japanese Patent Laid-Open Publication No. 2002-38010

The present invention provides a highly thermally conductive resin composition which maintains high thermal conductivity and is excellent in thin-wall fluidity.

The present invention for solving the above problems is as follows.

(1) A highly thermally conductive resin composition formulated with (A) 100 parts by mass of a poly(arylene ether) resin; and (B) 80 to 600 parts by mass of magnesium oxide previously treated with a vinyl alkoxydecane compound .

(2) The above-mentioned (B) surface-treated magnesium oxide having a mean particle diameter measured by a laser diffraction scattering method of more than 10 μm and not more than 100 μm is the above-mentioned (1) disclosed high-heat-conductive resin composition.

(3) The high thermal conductivity resin disclosed in the above (1) or (2), wherein the amount of the vinyl alkoxysilane of the magnesium oxide is from 0.3 to 1.5% by mass in the surface of the magnesium oxide surface-treated (B). combination.

(4) Further, the (C) alkoxy decane compound is blended in an amount of 0.1 to 2 parts by mass of the high thermal conductive resin composition disclosed in any one of the above (1) to (3).

According to the present invention, it is possible to provide high thermal conductivity while thin wall A highly thermally conductive resin composition excellent in fluidity.

Fig. 1 is a graph showing the relationship between the amount of magnesium oxide (A to C) and 0.5 mmtBF for 100 parts by mass of the PPS resin.

Fig. 2 is a graph showing the relationship between the amount of magnesium oxide (F to H) and 0.5 mmtBF for 100 parts by mass of the PPS resin.

Fig. 3 is a graph showing the relationship between the amount of magnesium oxide (D and E) and 0.5 mmtBF for 100 parts by mass of the PPS resin.

The high thermal conductivity resin composition of the present invention is characterized by comprising 100 parts by mass of a (A) poly(arylene ether) resin, and (B) magnesium oxide 80 to 600 previously treated with a vinyl alkoxy decane compound. Parts by mass.

Hereinafter, each component of the fat-high thermal conductive resin composition of the present invention will be described in detail.

[(A) Poly(aryl ether resin)]

The poly(aryl ether) resin as the component (A) is mainly a polymer compound composed of -(Ar-S)- (exclusively, Ar is an aryl group) as a repeating unit, and can be generally used in the present invention. Molecular structure of PAS resin.

As the above-mentioned extended aryl group, for example, p-phenylene, meta-phenylene, o-phenylene, substituted phenyl, p,p'-diphenylphenyl, p,p'- A biphenyl group, a p,p'-diphenylene ether group, a p,p'-diphenylenecarbonyl group, a naphthyl group or the like. The PAS resin may contain only a homopolymer of the above repeating unit, and a copolymer containing different repeating units described below may be preferable in terms of workability and the like.

As a homopolymer, it is preferred to use a p-phenylene group as an exoaryl group. A PPS resin having a p-phenylene ether group as a repeating unit. Further, as the copolymer, among the above-mentioned aryl groups containing an aryl ether, two or more different combinations may be used, and among them, it is particularly preferable to use a p-phenylene ether group and a meta-phenylene group. A combination of ether groups. Among them, the para-phenylene ether group is 70% by mole or more, preferably 80% by mole or more, and is suitable for physical properties such as heat resistance, moldability, and mechanical properties. Further, among these PAS resins, a substantially linear high molecular weight polymer obtained by polycondensation of a monomer mainly composed of a bifunctional halogen aromatic compound is particularly preferably used. Further, in the (A) PAS resin used in the present invention, two or more kinds of molecular weight PAS resins may be used in combination.

Further, in addition to the PAS resin having a linear structure, it may be mentioned In the polycondensation polymerization, a monomer such as a polyhalogenated aromatic compound having three or more halogen substituents is used in a small amount to partially form a polymer having a branched structure or a crosslinked structure, or a low molecular weight linear structural polymer in oxygen. A polymer which is heated at a high temperature to be oxidized or crosslinked or thermally crosslinked to increase the melt viscosity and to improve the formability. However, the polymer formed by the branched structure or the crosslinked structure has a reduced fluidity due to the formation amount of the branched structure or the crosslinked structure, and must be taken care of at the time of use.

In the present invention, the melt viscosity (310 ° C, cutting speed 1216 sec ^-1 ) of the PAS resin as the matrix resin is used, and in the case of the above-mentioned mixed system, it is preferably 200 Pa ‧ or less, of which 8 to 150 Pa ‧ is due to the mechanical The balance between physical properties and fluidity is excellent and particularly preferred. When the melt viscosity exceeds 200 Pa ‧ , the fluidity becomes difficult, and the occurrence is not good.

[(B) pre-treated with a vinyl epoxy decane compound Magnesium oxide

In the present invention, (B) magnesium oxide surface-treated with a vinyl epoxy decane compound (hereinafter referred to as "surface-treated magnesium oxide") is used to impart high thermal conductivity and high thin-wall fluidity. Provisioning. Therefore, in the present invention, a vinyl alkoxy decane compound is used as a surface treatment agent for magnesium oxide, and among the alkoxy decane compounds, only a vinyl alkoxy decane compound is used to exhibit remarkable thin-wall fluidity. . On the other hand, even if magnesium oxide surface-treated with an alkoxydecane compound other than a vinyl alkoxydecane compound is used, it does not exhibit thin-wall fluidity, exhibits remarkable thin-wall fluidity, and is a vinyl alkoxy group. The surface treatment of decane compounds is indispensable.

(B) Surface treatment of magnesium oxide as a surface treatment for B The alkenyl alkoxydecane compound is preferably a decane compound having one or more vinyl groups and having two or three alkoxy groups in one molecule, and examples thereof include a vinyltrimethoxydecane hydrolyzate and a vinyl triethyl group. A hydroxane hydrolyzate, a vinyl tris(?-methoxyethoxy)decane hydrolyzate or the like, among which a vinyltrimethoxydecane hydrolyzate is preferred.

In the present invention, (B) surface treatment of magnesium oxide surface, for oxidation The adhesion amount of the magnesium vinyl alkoxy decane compound is preferably from 0.3 to 1.5% by mass, more preferably from 0.5 to 1% by mass. When the amount of the vinyl alkoxydecane compound adhered is from 0.3 to 1.5% by mass, significant thin-wall fluidity is exhibited.

(B) Surface treatment of magnesium oxide by laser diffraction scattering method The average particle diameter (hereinafter referred to as "average particle diameter" alone) is preferably more than 10 μm and 100 μm or less, more preferably 15 μm or more and 60 μm from the viewpoint of improving the fluidity of the thin wall. Hereinafter, it is preferably 25 μm or more and 50 μm or less.

Further, in the present invention, the "average particle diameter measured by the laser diffraction scattering method" means a particle diameter of 50% of the integrated value in the particle size distribution measured by the laser diffraction scattering method.

In the present invention, (B) surface-treated magnesium oxide is formulated in an amount of 80 to 600 parts by mass based on 100 parts by mass of the (A) PAS resin. When the amount is less than 80 parts by mass, the thermal conductivity is lowered, and when it exceeds 600 parts by mass, the fluidity is lowered to deteriorate the formability. (B) The amount of the surface-treated magnesium oxide is preferably from 110 to 450 parts by mass, more preferably from 120 to 450 parts by mass.

[(C) alkoxydecane compound]

In the present invention, (C) alkoxydecane compound may be formulated in order to improve mechanical properties. However, since the fluidity is lowered when the (C) alkoxydecane compound is blended, sacrificial fluidity is obtained in order to obtain mechanical properties. Therefore, as will be described later, the amount of the compounding is small.

The (C) alkoxydecane compound is not particularly limited, and examples thereof include an alkoxy group such as an epoxy alkoxysilane, an amino alkoxysilane, a vinyl alkoxysilane, or a mercapto alkoxysilane. Base decane. These may be used alone or in combination of two or more. Further, the alkoxy group preferably has 1 to 10 carbon atoms, particularly preferably 1 to 4 carbon atoms.

Examples of the epoxy alkoxydecane include γ-glycidoxypropyltrimethoxydecane, β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, and γ-ring. Oxypropoxypropyltriethoxydecane, and the like.

Examples of the amino alkoxydecane include γ-aminopropyltrimethoxydecane, γ-aminopropyltriethoxydecane, γ-aminopropylmethyldimethoxydecane, and γ. -Aminopropylmethyldiethoxydecane, N-(β-aminoethyl)-γ-aminopropyltrimethoxydecane, N-phenyl-γ-aminopropyltrimethoxydecane Γ- Diallylaminopropyltrimethoxydecane, γ-diallylaminopropyltriethoxydecane, and the like.

As an example of the vinyl alkoxy decane, vinyl trimethyl Oxy decane, vinyl triethoxy decane, vinyl tris (β-methoxyethoxy) decane, and the like.

As an example of a mercapto alkoxy decane, γ-mercaptopropyl three can be cited. Methoxydecane, γ-mercaptopropyltriethoxydecane, and the like.

Among them, preferred are epoxy alkoxydecane and aminoalkoxy Particularly preferred is gamma-aminopropyltriethoxydecane.

In the present invention, (C) alkoxydecane compound, for (A) PAS 100 parts by mass of the resin is preferably formulated in an amount of 0.1 to 2 parts by mass, more preferably 0.2 to 0.8 parts by mass.

The highly thermally conductive resin composition of the present invention is produced by (1) mixing and kneading all the raw materials, (2) blending the alkoxydecane compound in the PAS resin, and mixing and kneading the surface treated magnesium oxide. In the method, (3) a method in which a PAS resin is melted, a method in which alkoxydecane compound is added as a filler in surface-treated magnesium oxide, or the like, and any of the methods can exert the effects of the present invention, but in order to utilize PAS resin and The alkoxydecane compound reacts to increase the mechanical strength, and more efficiently reacts the PAS resin with the alkoxydecane compound, preferably (2) the alkoxydecane compound is formulated in the PAS resin, and is compounded after the melt-kneading Manufactured by a method of surface treating magnesium oxide.

[filler]

The high thermal conductivity resin composition of the present invention has mechanical strength, heat resistance, dimensional stability (resistance to deformation, warpage), and electrical properties within the scope of the present invention. The performance improvement of the quality or the like may be a formulation of an inorganic or organic filler, and a fibrous, granular or plate-shaped filler is used depending on the purpose.

Examples of the fibrous filler include glass fibers and boron fibers. An inorganic fibrous material such as potassium titanate fiber. A particularly representative fibrous filler is glass fiber. Further, a high melting point organic fiber material such as polyamide, fluororesin or acrylic resin may be used.

Examples of the powdery filler include quartz powder and glass beads. Glass powder, calcium citrate, aluminum silicate, kaolin, talc, clay, diatomaceous earth, strontium silicate, iron oxide, titanium oxide, metal oxide of zinc oxide, metal of calcium carbonate, magnesium carbonate A carbonate of a carbonate, a calcium sulfate or a barium sulfate.

Further, examples of the plate-shaped filler include mica and glass flakes.

One type or two or more types of the above inorganic fillers may be used in combination.

[Other ingredients]

The high thermal conductive resin composition of the present invention generally contains a known substance, that is, a coloring agent such as a flame retardant, a dye or a pigment, an antioxidant or an ultraviolet ray, in a thermoplastic resin as long as it does not impair the effects of the present invention. A stabilizer such as a stabilizer, a lubricant, a crystallization accelerator, a crystal nucleating agent, or another resin may be added, or an additive may be added as needed.

High thermal conductivity resin combination of the present invention obtained as described above The material is excellent in thin-wall fluidity, and even if it is a small-sized complicated shape or thinned, it can maintain high thermal conductivity while being easily formed. In addition, the high heat conductive resin composition of the present invention exhibits high heat and humidity resistance and chemical resistance by a molded article obtained by injection molding, extrusion molding, or blow molding. Dimensional stability, flame retardancy, and excellent heat release. The advantage of utilizing this advantageous point can be applied to a heat exchanger, a heat release plate, an optical pickup, and the like which generate heat inside and radiate heat to the outside.

Furthermore, as other uses, for example, it can be used for LEDs and sensations. Electrical, electronic parts, lighting parts, TV parts, rice cooker parts, microwave oven parts, iron parts, photocopying machine parts, printing instruments, etc. for connectors, connectors, sockets, terminal blocks, printed circuit boards, motor parts, ECU boxes, etc. It is used for parts of households and business electrical parts, such as parts and fax machines, parts, heaters, and parts for air conditioners.

Example

Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to the following examples.

The raw material components shown in Tables 1 to 4 were dry blended, and then introduced into a two-axis extruder (the magnesium oxide system was separately added from the side feed portion of the extruder) at a cylinder temperature of 320 ° C, and the mixture was kneaded and granulated. .

From the pellets, various test pieces (different depending on the evaluation items) were produced by an injection molding machine, and evaluated. The results are shown in Tables 1 to 4.

Further, Examples 1 to 10 and Comparative Examples 1 to 8 shown in Tables 1 to 2 are examples in which the average particle diameter is 50 μm as the component (B), and Examples 11 to 16 in Table 3 are compared and compared. Examples 9 to 11 are examples in which the average particle diameter is 10 μm as the component (B), and Examples 17 to 19 and Comparative Examples 12 to 14 shown in Table 4 are used as the component (B), and the average particle diameter is 30 μm. An example of the person.

In addition, the details of each raw material component used are shown below.

(A) component (PAS resin)

PPS resin 1: manufactured by KUREHA Co., Ltd., FORTON KPS W202A (melting viscosity: 20 Pa ‧ (cutting speed: 1216 sec-1, 310 ° C))

PPS resin 2: manufactured by KUREHA Co., Ltd., FORTON KPS W214A (melting viscosity: 130 Pa‧s (cutting speed: 1216 sec-1, 310 ° C))

PPS resin 3: manufactured by KUREHA Co., Ltd., FORTON KPS W220A (melting viscosity: 220 Pa‧s (cutting speed: 1216 sec-1, 310 ° C))

(B) component (surface treated magnesia)

Magnesium oxide A: RF-50-SC manufactured by Ube Materials Co., Ltd. (surface treatment: vinyl alkoxy decane 0.5% by mass) (average particle diameter 50 μm)

Magnesium oxide B: RF-50-AC manufactured by Ube Materials Co., Ltd. (surface treatment: amino alkoxy decane 0.5% by mass) (average particle diameter: 50 μm)

Magnesium oxide C: Ube Materials Co., Ltd. RF-98 (not surface treated) (average particle size 50 μm)

Magnesium oxide D: RF-50-SC modified product manufactured by Ube Materials Co., Ltd. (surface treatment: vinyl alkoxy decane 0.5% by mass) (average particle diameter 30 μm)

Magnesium oxide E: CF2-100B (coated magnesium oxide containing phosphorus) manufactured by TATEHO CHEMICAL INDUSTRIES (average particle size 27 μm)

Magnesium oxide F: RF-10C-SC manufactured by Ube Materials Co., Ltd. (surface treatment: vinyl alkoxy decane 0.5% by mass) (average particle diameter 10 μm)

Magnesium oxide G: RF-10C-SC manufactured by Ube Materials Co., Ltd. (surface treatment: vinyl alkoxy decane 1.5% by mass) (average particle Trail 10μm)

Magnesium oxide H: RF-10C-EC manufactured by Ube Materials Co., Ltd. (surface treatment: epoxy resin 0.5% by mass) (average particle diameter 10 μm)

(C) component (alkoxydecane compound)

Alkoxydecane compound: γ-aminopropyl triethoxy decane: manufactured by Shin-Etsu Chemical Co., Ltd., KBE-903P

In each of the examples and comparative examples, test pieces were prepared and evaluated for each.

(1) Thermal conductivity

The barrel temperature of the injection molding was 320 ° C, and the mold temperature was 150 ° C to prepare a disk-shaped molded article having a diameter of 30 mm and a thickness of 2 mm. The thermal conductivity was measured by a thermal disk thermal property measuring apparatus (TPA-501, manufactured by Kyoto Electronics Manufacturing Co., Ltd.) using a sample of four test pieces which were superimposed.

(2) Warpage test

Injection molding was carried out at a cylinder temperature of 320 ° C and a mold temperature of 150 ° C. A test piece (width 10 mm, thickness 4 mmt) was prepared according to ISO 3167, and warpage strength (FS) and warpage modulus (FM) were measured according to ISO178.

(3) Melting viscosity

For the component (A) (PPS resin), a capillary viscometer manufactured by Toyo Seiki Co., Ltd. was used, and a capillary of 310 ° C and a cutting speed of 1216 sec ^-1 was measured using a 1 mm ψ × 20 mm L/plate die as a capillary. Melt viscosity.

With respect to the prepared resin (the above-mentioned small particles), a capillary viscometer manufactured by Toyo Seiki Co., Ltd. was used, and a capillary temperature of 310 ° C and a cutting speed of 1000 sec ^{-1 was} measured using a 1 mm ψ × 20 mm L/plate mold as a capillary.

(4) Thin wall fluidity (thickness 0.5mmt strip flow: 0.5mmt BF)

The injection molding was carried out, and a rod-shaped molded article having a width of 5 mm and a thickness of 0.5 mm was formed under the conditions of a cylinder temperature of 320 ° C, an injection pressure of 100 MPa, and a mold temperature of 150 ° C, and the flow distance was measured. The average value of the five tests was taken as the flow distance. Fig. 1 to Fig. 3 show the relationship between the amount of magnesium oxide (A to H) of 100 parts by mass of the PPS tree and 0.5 mmt BF. Further, each of the graphs of magnesium oxides A to H in the drawings of Figs. 1 to 3 is based on the data of the following examples and comparative examples.

i) Figure 1

Magnesium oxide A: Examples 4, 7, 5, 9, 6

Magnesium oxide B: Comparative Examples 1, 2, 3

Magnesium oxide C: Comparative Examples 4, 5, 6, 7

Ii) the pattern of Figure 2

Magnesium oxide F: Examples 11, 12, 15

Magnesium oxide G: Examples 13, 14, 16

Magnesium oxide H: Comparative Examples 9, 10, 11

Iii) the schema of Figure 3

Magnesium oxide D: Examples 17, 18, 19

Magnesium oxide E: Comparative Examples 12, 13, 14

As shown in Table 1 and Table 2, as an example of the component (B), an example in which the average particle diameter is 50 μm is used. The following facts are further known from Tables 1 and 2. That is, each of Example 5, Comparative Example 3, and Comparative Example 6 is an example in which 236 parts by mass of the component (B) is used, but as the component (B), the surface-treated magnesium oxide of the present invention is used. 5, for any of the evaluation results are good, using Comparative Example 3 of magnesium oxide surface treated with amino alkoxydecane, and In Comparative Example 6 using untreated magnesium oxide, it was not preferable at 0.5 mmt BF. In other words, it can be understood that excellent thin wall fluidity cannot be exhibited. Therefore, by using the same surface-treated magnesia as the component (B), by comparing the examples 1 to 3 in which the PPS resins having different melt viscosities are different, it is understood that the balance between the mechanical properties and the thin-wall fluidity is further It is a PPS resin with a viscosity of 200 Pa‧s or less.

Further, the same magnesium oxide was used as the component (B), and the blending amount was different. From the comparison between Example 6 and Comparative Example 8, it was found that Comparative Example 8 which does not reach the lower limit of the range specified in the present invention is heat conduction. The rate was lowered, and the thermal conductivity obtained in Example 6 was a good result of 0.5 mmt BF. Therefore, when the amount of the component (B) is within the range of the present invention, it is understood that both high thermal conductivity and excellent thin-wall fluidity are obtained.

Further, the presence or absence of the composition of the component (C) is different from that of the examples 7 and 8, and the comparison of the examples 9 and 10 shows that the component (C) is blended, and although the fluidity is slightly lowered, the mechanical strength (warpage strength, Increased warpage modulus).

Further, according to Fig. 1, in the case of using the surface-treated magnesium oxide (magnesium oxide A) of the present invention, it is understood that any of the blending amounts exhibits excellent thin-wall fluidity.

Table 3 is as described above, and either one is used as the component (B). An example of a particle size of 10 μm. The following facts are further known from Table 3. That is, Examples 11 and 13 and Comparative Example 9 are examples in which the amount of the component (B) is 101 parts by mass. Examples 11 and 13 are examples in which the adhesion amount of the vinyl alkoxysilane of the surface-treated magnesium oxide of the component (B) is different, and the evaluation results of either of them are good, and it is known that the component (B) is used via the ring. Comparative Example 9 of the oxy-resin surface-treated magnesium oxide was 0.5 mmt BF difference, and the thin-wall fluidity was lowered.

Further, from Fig. 2, it is understood that the amount of the vinyl alkoxysilane attached to the surface-treated magnesium oxide of the component (B) is 0.5% by mass, and the case of 1.5% by mass is more significant for 0.5 mmt BF. Longer, thin-walled fluidity results in better results.

Table 4, as described above, is an example in which the average particle diameter of 30 μm is used as the component (B). The following facts are further known from Table 4 and FIG. That is, Example 18 and Comparative Example 13 are examples in which 236 parts by mass of the component (B) is blended, and as the component (B), Example 18 uses the surface-treated magnesium oxide of the present invention, and Comparative Example 13 uses a coating containing phosphorus. Magnesium oxide. When Example 18 was compared with Comparative Example 13, it was found that 0.5 mmt BF was particularly long and the thin-wall fluidity was excellent.

Further, in Example 19 and Comparative Example 14, the difference between the amount of the component (B) and the comparative example 13 was different from that of Example 18 and Comparative Example 13. In these examples, Example 19 was found to be particularly long in 0.5 mmt BF compared with Comparative Example 14, and was excellent in thin-wall fluidity.

Claims (4)

A highly thermally conductive resin composition formulated with: (A) 100 parts by mass of a poly(arylene ether) resin; and (B) magnesium oxide previously treated with a vinyl alkoxydecane compound (hereinafter referred to as "surface treatment oxidation" Magnesium") 80 to 600 parts by mass. The high thermal conductivity resin composition according to the first aspect of the invention, wherein the (B) surface-treated magnesium oxide has an average particle diameter measured by a diffraction scattering method of more than 10 μm or more and 100 μm or less. The high thermal conductivity resin composition according to claim 1 or 2, wherein the surface of the surface-treated magnesium oxide (B) has a platinum alkoxysilane attached to the magnesium oxide in an amount of from 0.3 to 1.5% by mass. The high thermal conductivity resin composition according to claim 1 or 2, wherein the (C) alkoxydecane compound is further blended in an amount of 0.1 to 2 parts by mass.