TW201409210A - 固定件 - Google Patents

固定件 Download PDF

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Publication number
TW201409210A
TW201409210A TW101130551A TW101130551A TW201409210A TW 201409210 A TW201409210 A TW 201409210A TW 101130551 A TW101130551 A TW 101130551A TW 101130551 A TW101130551 A TW 101130551A TW 201409210 A TW201409210 A TW 201409210A
Authority
TW
Taiwan
Prior art keywords
cylinder
spring
pole
legs
gasket
Prior art date
Application number
TW101130551A
Other languages
English (en)
Inventor
Tsung-Ming Chen
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW101130551A priority Critical patent/TW201409210A/zh
Priority to US13/598,653 priority patent/US8934247B2/en
Publication of TW201409210A publication Critical patent/TW201409210A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
    • F16B5/06—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of clamps or clips
    • F16B5/0607—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of clamps or clips joining sheets or plates to each other
    • F16B5/0621—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of clamps or clips joining sheets or plates to each other in parallel relationship
    • F16B5/065—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of clamps or clips joining sheets or plates to each other in parallel relationship the plates being one on top of the other and distanced from each other, e.g. by using protrusions to keep contact and distance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/60—Biased catch or latch
    • Y10T403/602—Biased catch or latch by separate spring

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Of Plates (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一種固定件，包括一本體、一墊片及一彈簧，該本體包括一柱體、設於該柱體之頂端之兩卡扣及設於該柱體之底端之兩卡腳，該柱體之圓周面鄰近卡腳凸設一環形之擋止部，該兩卡扣之末端背向分別凸設一半圓錐形之卡齒，該兩卡腳之末端背向分別凸設一半圓錐形之突起，該墊片套設於該柱體，該彈簧套設於該柱體並夾置於該墊片與該擋止部之間。

Description

固定件
本發明涉及一種固定件。
習知技術中，常採用螺絲穿過散熱器及主機板並鎖入螺母，將散熱器固定於電子元件之上。然，該固定方法佔用空間大，常需要切割散熱鰭片以騰出裝設空間，不僅繁瑣，且削弱了散熱器之散熱功能。
鑒於以上，有必要提供一種方便固定兩工件並節省空間之固定件。
一種固定件，包括一本體、一墊片及一彈簧，該本體包括一柱體、設於該柱體之頂端之兩卡扣及設於該柱體之底端之兩卡腳，該柱體之圓周面鄰近卡腳凸設一環形之擋止部，該兩卡扣之末端背向分別凸設一半圓錐形之卡齒，該兩卡腳之末端背向分別凸設一半圓錐形之突起，該墊片套設於該柱體，該彈簧套設於該柱體並夾置於該墊片與該擋止部之間。
相較習知技術，該固定件之卡扣及卡腳可分別卡入兩工件，將兩工件相對固定，不會佔用空間，非常方便。
請參照圖1及圖2，本發明固定件用以將一散熱器10固定於一主機板20上。該主機板20上設有一電子元件22。該主機板20於該電子元件22之兩側分別開設至少一穿孔24。
該散熱器10包括一底板12及自該底板12之頂面向上垂直延伸之複數散熱鰭片14。該底板12對應該主機板20之穿孔24至少開設兩通孔120。
該固定件包括一本體30、一彈簧40及一墊片50。該本體30包括一柱體31、設於該柱體31之頂端之兩相互平行之卡扣32及設於該柱體31之底端之兩相互平行之卡腳34。該兩卡扣32之末端背向分別凸設一半圓錐形之卡齒320。該兩卡腳34之末端背向分別凸設一半圓錐形之突起340。該柱體31之圓周面鄰近卡腳34凸設一環形之擋止部310。該彈簧40及該墊片50套設於該柱體31，使該彈簧40夾置於該墊片50與該擋止部310之間。
組裝時，該散熱器10置於該電子元件22之上方。兩固定件分別穿設於該散熱器10之兩通孔120並卡合於該主機板20。每一固定件之卡扣32相向彈性變形使卡齒320自下而上穿過該散熱器10之對應通孔120，直至該兩卡齒320穿出該散熱器10之底板12之頂面，該兩卡扣32彈性恢復使卡齒320擋止於該底板12之頂面，該固定件之墊片50擋止於該底板12之底面。該固定件之卡腳34相向彈性變形使突起340穿過該主機板20之對應穿孔24，直至該兩突起340穿出該主機板20之底面，該兩卡腳34彈性恢復使突起340擋止於該主機板20之底面，該擋止部310擋止於該主機板20之頂面。
需要拆卸該散熱器10時，相向按壓每一固定件之兩突起340，使該固定件之兩突起340脫離該主機板20對應之穿孔24，即可拆下該散熱器10。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
10．．．散熱器
12．．．底板
14．．．鰭片
120．．．通孔
20．．．主機板
22．．．電子元件
24．．．穿孔
30．．．本體
31．．．柱體
32．．．卡扣
320．．．卡齒
34．．．卡腳
340．．．突起
310．．．擋止部
40．．．彈簧
50．．．墊片
圖1係本發明固定件之立體組裝圖。
圖2係圖1之固定件用以將一散熱器固定於一主機板之剖面示意圖。
30．．．本體
31．．．柱體
32．．．卡扣
320．．．卡齒
34．．．卡腳
340．．．突起
310．．．擋止部
40．．．彈簧
50．．．墊片

Claims (1)

  1. 一種固定件，包括一本體、一墊片及一彈簧，該本體包括一柱體、設於該柱體之頂端之兩卡扣及設於該柱體之底端之兩卡腳，該柱體之圓周面鄰近卡腳凸設一環形之擋止部，該兩卡扣之末端背向分別凸設一半圓錐形之卡齒，該兩卡腳之末端背向分別凸設一半圓錐形之突起，該墊片套設於該柱體，該彈簧套設於該柱體並夾置於該墊片與該擋止部之間。
TW101130551A 2012-08-22 2012-08-22 固定件 TW201409210A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101130551A TW201409210A (zh) 2012-08-22 2012-08-22 固定件
US13/598,653 US8934247B2 (en) 2012-08-22 2012-08-30 Fastener

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101130551A TW201409210A (zh) 2012-08-22 2012-08-22 固定件

Publications (1)

Publication Number Publication Date
TW201409210A true TW201409210A (zh) 2014-03-01

Family

ID=50147835

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101130551A TW201409210A (zh) 2012-08-22 2012-08-22 固定件

Country Status (2)

Country Link
US (1) US8934247B2 (zh)
TW (1) TW201409210A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9435590B2 (en) * 2014-04-07 2016-09-06 Microsoft Technology Licensing, Llc Thin heat transfer device for thermal management
JP6459418B2 (ja) * 2014-11-13 2019-01-30 富士電機株式会社 半導体装置およびその製造方法
US9706659B2 (en) * 2014-12-15 2017-07-11 Intel Corporation Attachment device
US10051763B2 (en) * 2016-10-01 2018-08-14 Intel Corporation Local stress-relieving devices, systems, and methods for electronic assemblies
US12055173B2 (en) * 2021-06-15 2024-08-06 Lockheed Martin Corporation Flexible head fasteners

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Publication number Priority date Publication date Assignee Title
US5730210A (en) * 1997-02-24 1998-03-24 Silicon Integrated Systems Corporation Heat sink having an assembling device
TW500244U (en) * 1999-06-11 2002-08-21 Foxconn Prec Components Co Ltd Buckle device for heat dissipater
TW443715U (en) * 1999-06-17 2001-06-23 Foxconn Prec Components Co Ltd Fastener of heat dissipation device
KR100457220B1 (ko) * 2002-02-27 2004-11-16 잘만테크 주식회사 칩셋 냉각용 히트싱크장치
US6752577B2 (en) * 2002-02-27 2004-06-22 Shu-Chen Teng Heat sink fastener
CN2681328Y (zh) * 2003-12-11 2005-02-23 鸿富锦精密工业（深圳）有限公司 散热器扣具
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Publication number Publication date
US8934247B2 (en) 2015-01-13
US20140055955A1 (en) 2014-02-27

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