TW201400828A - Substrate inspection pin - Google Patents
Substrate inspection pin Download PDFInfo
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- TW201400828A TW201400828A TW102118761A TW102118761A TW201400828A TW 201400828 A TW201400828 A TW 201400828A TW 102118761 A TW102118761 A TW 102118761A TW 102118761 A TW102118761 A TW 102118761A TW 201400828 A TW201400828 A TW 201400828A
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- inspection pin
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
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- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Description
本發明是有關於一種基板檢驗接腳。 The invention relates to a substrate inspection pin.
多種基板檢驗裝置已被提出並商業化。其中一包括多條配線之配線圖案係形成於一印刷電路板上，且此配線圖案是否依據其被檢驗之設計完成。 A variety of substrate inspection devices have been proposed and commercialized. One of the wiring patterns including the plurality of wirings is formed on a printed circuit board, and whether the wiring pattern is completed according to the designed design.
舉例而言，已經使用用於檢驗電氣特徵(例如配線圖案是否是無電連接或導通等等)之裝置作為基板檢驗裝置。 For example, a device for inspecting electrical characteristics such as whether a wiring pattern is electrically connected or turned on or the like has been used as a substrate inspection device.
已使用下述裝置作為用於檢驗電氣特徵之其中一個裝置，此裝置藉由允許一基板檢驗接腳接觸印刷電路板(其為一待檢驗之物件)上之配線圖案之兩端之焊墊來測量一電阻，並藉由使用測量的電阻來判定配線圖案之開路及短路缺陷。 The following apparatus has been used as one of the means for verifying electrical characteristics by allowing a substrate inspection pin to contact the pads on both ends of the wiring pattern on the printed circuit board which is an object to be inspected. A resistance is measured, and the open circuit and short-circuit defects of the wiring pattern are determined by using the measured resistance.
在此狀況下，基板檢驗接腳之一中心最好是接觸到焊墊之一中心，但由於關於不同型式之設備之各種機械對準公差，在製造一夾具時之一加工公差，以及印刷電路板本身之一規模方面的改變，在基板檢驗接腳之中心與焊墊之中心之間一般常沒有對準。 In this case, the center of one of the substrate inspection pins is preferably in contact with one of the centers of the pads, but due to various mechanical alignment tolerances for different types of devices, one of the machining tolerances in the manufacture of a fixture, and the printed circuit A change in the scale of one of the plates themselves is generally not aligned between the center of the substrate inspection pins and the center of the pads.
依此方式，當基板檢驗接腳之中心與待檢驗之焊墊之中心之 間的不對準發生超過一某個程度時，基板檢驗接腳之邊緣變成與一鄰近焊墊接觸，藉以導致短路之產生。 In this way, when the center of the substrate inspection pin and the center of the pad to be inspected When the misalignment occurs more than a certain degree, the edge of the substrate inspection pin becomes in contact with an adjacent pad, thereby causing a short circuit.
同時，依據相關技藝，日本專利公開第2005-338065號揭露一種基板檢驗夾具及檢驗方法。 At the same time, according to the related art, a substrate inspection jig and an inspection method are disclosed in Japanese Patent Laid-Open Publication No. 2005-338065.
本發明對於提供一種具有一適合於小型化之焊墊之寬度之形狀之基板檢驗接腳已作出努力。 SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a substrate inspection pin having a shape suitable for miniaturized solder pads.
此外，本發明對於提供一種相對於與焊墊之中心之不對準允許較大公差之基板檢驗接腳已作出努力。 Moreover, the present invention has made an effort to provide a substrate inspection pin that allows for greater tolerances relative to misalignment with the center of the pad.
依據本發明之一較佳實施例，提供一種基板檢驗接腳，包括：一本體部分；及一接觸部分，其係形成於本體部分之一端並具有一平面形狀，其中接觸部分之一直徑小於本體部分之一直徑。 According to a preferred embodiment of the present invention, a substrate inspection pin includes: a body portion; and a contact portion formed at one end of the body portion and having a planar shape, wherein one of the contact portions has a smaller diameter than the body One of the diameters.
在此狀況下，接觸部分之直徑可能在本體部分之直徑之30%至70%之範圍內被形成。 In this case, the diameter of the contact portion may be formed within a range of 30% to 70% of the diameter of the body portion.
此外，接觸部分之直徑可能在本體部分之直徑之10%至90%之範圍內被形成。 Further, the diameter of the contact portion may be formed within a range of 10% to 90% of the diameter of the body portion.
此外，一個在本體部分與接觸部分之間的連接部分可能被形成以向外凸出。 Further, a connecting portion between the body portion and the contact portion may be formed to protrude outward.
此外，一個在本體部分與接觸部分之間的連接部分可具有一階梯狀形狀。 Further, a connecting portion between the body portion and the contact portion may have a stepped shape.
此外，一個在本體部分與接觸部分之間的連接部分可能被形 成以向內部凸出。 In addition, a connecting portion between the body portion and the contact portion may be shaped It is convex to the inside.
依據本發明之一較佳實施例，提供一種基板檢驗接腳，其接 觸一基板檢驗裝置中之一配線圖案之兩端之焊墊，用於檢驗配線圖案之一電性連接狀態，其中接觸焊墊之一部分具有一平面形狀。 According to a preferred embodiment of the present invention, a substrate inspection pin is provided, which is connected A pad for touching both ends of the wiring pattern in the substrate inspection device for inspecting an electrical connection state of the wiring pattern, wherein a portion of the contact pad has a planar shape.
在此狀況下，基板檢驗接腳可包括一本體部分；及一接觸部 分，其係形成於本體部分之一端同時接觸焊墊，並具有一平面形狀，其中接觸部分之一直徑小於本體部分之一直徑。 In this case, the substrate inspection pin may include a body portion; and a contact portion And a portion formed at one end of the body portion while contacting the bonding pad and having a planar shape, wherein one of the contact portions has a diameter smaller than a diameter of one of the body portions.
此外，接觸部分之直徑可能在本體部分之直徑之30%至70% 之範圍內被形成。 In addition, the diameter of the contact portion may be 30% to 70% of the diameter of the body portion It is formed within the scope.
此外，接觸部分之直徑可能在本體部分之直徑之10%至90% 之範圍內被形成。 In addition, the diameter of the contact portion may be 10% to 90% of the diameter of the body portion It is formed within the scope.
本發明之上述與其他目的、特徵及優點將從下述的詳細說明 配合附圖而更清楚理解到。 The above and other objects, features and advantages of the present invention will be described in detail It is more clearly understood in conjunction with the drawings.
110‧‧‧本體部分 110‧‧‧ body part
100‧‧‧基板檢驗接腳 100‧‧‧Substrate inspection pin
120‧‧‧接觸部分 120‧‧‧Contact section
第1A及1B圖分別為顯示依據本發明之一實施例之一基板檢驗接腳之剖面圖與底部平面視圖；第2圖係為顯示依據本發明之另一實施例之一基板檢驗接腳之剖面圖；第3圖係為顯示依據本發明之又另一實施例之一基板檢驗接腳之剖面圖；及第4圖係為顯示依據本發明之一實施例之一短路產生率依照另一個基 板檢驗接腳之一平面部分之一直徑之變化之曲線圖。 1A and 1B are respectively a cross-sectional view and a bottom plan view showing a substrate inspection pin according to an embodiment of the present invention; and FIG. 2 is a view showing a substrate inspection pin according to another embodiment of the present invention; FIG. 3 is a cross-sectional view showing a substrate inspection pin according to still another embodiment of the present invention; and FIG. 4 is a view showing a short circuit generation rate according to an embodiment of the present invention. base A graph showing the change in diameter of one of the planar portions of the board verification pin.
本發明之目的、特徵及優點將從下述較佳實施例之詳細說明 配合附圖而更清楚理解到。遍及這些附圖之相同的參考數字係用於標示相同或類似的元件，且省略掉其冗餘說明。又，在下述說明中，專門用語"第一"、"第二"、"一側"、"另一側"等等係用於區別某個元件與其他元件，但這種元件之架構不應被解釋成受限於這些專門用語。又，在本發明之說明中，當確定相關技藝之詳細說明將模糊化本發明之要點時，將省略其說明。 The objects, features and advantages of the present invention will be described in detail It is more clearly understood in conjunction with the drawings. The same reference numbers are used throughout the drawings to refer to the same or similar elements and the redundant description is omitted. Also, in the following description, the terms "first", "second", "one side", "the other side", etc. are used to distinguish one element from another, but the structure of such element should not be It is interpreted to be limited to these specific terms. Further, in the description of the present invention, when it is determined that the detailed description of the related art will obscure the gist of the present invention, the description thereof will be omitted.
以下將參考附圖詳細說明本發明之較佳實施例。 Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
同時，本發明並未受限於一印刷電路板，且可能應用至各種基板之電氣配線檢驗，例如一撓性基板、一多層配線基板、一供一液晶顯示器或一電漿顯示器用之電極板，一個半導體封裝基板、一薄膜載體等等。 Meanwhile, the present invention is not limited to a printed circuit board, and may be applied to electrical wiring inspection of various substrates, such as a flexible substrate, a multilayer wiring substrate, an electrode for a liquid crystal display or a plasma display. A board, a semiconductor package substrate, a film carrier, and the like.
第1A及1B圖分別為顯示依據本發明之一實施例之一基板檢驗接腳之剖面圖與底部平面視圖，第2圖係為顯示依據本發明之另一實施例之一基板檢驗接腳之剖面圖，而第3圖係為顯示依據本發明之又另一實施例之一基板檢驗接腳之剖面圖。 1A and 1B are respectively a cross-sectional view and a bottom plan view showing a substrate inspection pin according to an embodiment of the present invention, and FIG. 2 is a view showing a substrate inspection pin according to another embodiment of the present invention. FIG. 3 is a cross-sectional view showing a substrate inspection pin according to still another embodiment of the present invention.
參見第1A及1B圖，一基板檢驗接腳100包括一本體部分110及一接觸部分120，接觸部分120係形成於本體部分110之一端並具有一平面形狀。 Referring to FIGS. 1A and 1B, a substrate inspection pin 100 includes a body portion 110 and a contact portion 120 formed at one end of the body portion 110 and having a planar shape.
一般而言，基板檢驗接腳100可能由一撓性及彈性導電金屬材料所構成，但本發明並未特別受限於此。 In general, the substrate inspection pin 100 may be composed of a flexible and elastic conductive metal material, but the invention is not particularly limited thereto.
於此，導電金屬材料可具有鎢、鈹-銅(Be-Cu)等等，但本發 明並未受限於此。 Here, the conductive metal material may have tungsten, beryllium-copper (Be-Cu), etc., but the present invention Ming is not limited to this.
於本實施例中，基板檢驗接腳100之本體部分110之一端(亦 即接觸印刷電路板(其係為待檢驗之一物件)上之一焊墊之接觸部分120)具有一平面形狀，如第1圖所示。 In this embodiment, the substrate is inspected at one end of the body portion 110 of the pin 100 (also That is, the contact portion 120 of one of the pads on the contact printed circuit board (which is one of the objects to be inspected) has a planar shape as shown in FIG.
在此狀況下，一平面部分之一直徑(F)可能形成為小於本體 部分110之一直徑(2R)。 In this case, one of the plane portions may have a smaller diameter (F) than the body One of the portions 110 has a diameter (2R).
此外，依據本實施例，一個在本體部分110與接觸部分120 之間的連接部分係被形成以向外凸出，但形狀並未特別受限於此。舉例而言，如第2圖所示，所形成的連接部分可能具有一階梯狀形狀，或可能向內部凸出。 Further, according to the embodiment, one is in the body portion 110 and the contact portion 120 The connecting portion between them is formed to protrude outward, but the shape is not particularly limited thereto. For example, as shown in Fig. 2, the formed connecting portion may have a stepped shape or may protrude toward the inside.
亦即，在本體部分110與接觸部分120之間的連接部分之形 狀並未特別受限制，且只要接觸部分120係以平面形狀被形成，其之任何形狀就可能是可能的。 That is, the shape of the connecting portion between the body portion 110 and the contact portion 120 The shape is not particularly limited, and any shape thereof may be possible as long as the contact portion 120 is formed in a planar shape.
依此方式，在依據本實施例之基板檢驗接腳100中，接觸焊 墊之接觸部分120係以平面形狀被形成，因此，避免基板檢驗接腳100從焊墊之一表面可滑動地移動，藉以建立一穩定檢驗環境。 In this manner, in the substrate inspection pin 100 according to the embodiment, contact welding The contact portion 120 of the pad is formed in a planar shape, thereby preventing the substrate inspection pin 100 from slidably moving from the surface of one of the pads, thereby establishing a stable inspection environment.
依據本實施例之基板檢驗接腳100之接觸部分120之一直徑 (亦即，平面部分之一直徑)，可能最好是在本體部分110之一直徑之30%至70%之範圍內被形成。 The diameter of one of the contact portions 120 of the substrate inspection pin 100 according to the present embodiment (i.e., one of the diameters of the planar portion) may preferably be formed in the range of 30% to 70% of the diameter of one of the body portions 110.
此乃因為，當平面部分之一直徑小於本體部分110之直徑之 30%時，可能增加基板檢驗接腳100係從待檢驗之焊墊之表面可滑動地移動之可能性，且可能增加平面部分接觸鄰近焊墊藉以導致短路之產生之可能 性。 This is because when one of the planar portions has a smaller diameter than the diameter of the body portion 110 At 30%, it is possible to increase the possibility that the substrate inspection pin 100 is slidably moved from the surface of the pad to be inspected, and may increase the possibility that the planar portion contacts the adjacent pad to cause a short circuit. Sex.
此外，此乃因為當平面部分之直徑超過本體部分10之直徑 之70%時，可能增加下述可能性：在基板檢驗接腳100之一中心與待檢驗之焊墊之一中心之間的不對準發生時，平面部分之邊緣接觸一鄰近焊墊，藉以導致短路之產生。 Moreover, this is because when the diameter of the planar portion exceeds the diameter of the body portion 10 At 70%, it is possible to increase the possibility that when the misalignment between the center of one of the substrate inspection pins 100 and the center of one of the pads to be inspected occurs, the edge of the planar portion contacts an adjacent pad, thereby causing Short circuit occurs.
亦即，如上所述，基板檢驗接腳100之接觸部分120之直徑， 係在本體部分110之直徑之30%至70%之範圍內被形成，因此，擴大在基板檢驗接腳100之中心與待檢驗之焊墊之中心之間的一不對準公差範圍，藉以避免同時接觸待檢驗之焊墊及一鄰近焊墊之短路之產生。 That is, as described above, the substrate inspects the diameter of the contact portion 120 of the pin 100, It is formed in the range of 30% to 70% of the diameter of the body portion 110, thereby expanding a misalignment tolerance between the center of the substrate inspection pin 100 and the center of the pad to be inspected, thereby avoiding simultaneous Contact with the solder pad to be inspected and a short circuit adjacent to the pad.
為了證實相對於上述數值範圍中的限制之性能，執行下述實 驗。 In order to confirm the performance with respect to the limits in the above numerical range, the following implementation is performed. Test.
在實驗之前，製造出一實驗用的印刷電路板。 Prior to the experiment, an experimental printed circuit board was fabricated.
形成一千個焊墊以作為使用於實驗中之印刷電路板，每個焊 墊具有16μm之寬度，且各個焊墊之間的一空間係為24μm。 Forming a thousand pads as printed circuit boards for use in experiments, each soldering The pads have a width of 16 μm and a space between the pads is 24 μm.
此外，一配線圖案係為每個焊墊而延伸，且一阻焊層係形成 於印刷電路板上，阻焊層包括一開口部，用於暴露焊墊之一部分與配線圖案。 In addition, a wiring pattern is extended for each pad, and a solder resist layer is formed. On the printed circuit board, the solder resist layer includes an opening for exposing a portion of the pad and the wiring pattern.
依此方式，製造出一百個實驗用的印刷電路板。 In this way, one hundred experimental printed circuit boards were produced.
此外，製造出使用於實驗中之基板檢驗接腳及包括基板檢驗 接腳之檢驗夾具。 In addition, the substrate inspection pins used in the experiment are manufactured and the substrate inspection is included. Check fixture for the pin.
在此狀況下，製造出六種基板檢驗接腳，其分別具有基板檢 驗接腳之一本體部分之相同的直徑(在本實驗中為45μm)，亦即，0μm、5 μm、15μm、30μm、40μm及45μm之基板檢驗接腳之一平面部分之一直徑，並製造出檢驗夾具以使一千個基板檢驗接腳為每種基板檢驗接腳聚集在一起。 Under this condition, six kinds of substrate inspection pins are manufactured, which respectively have a substrate inspection. Verify the same diameter of the body part of one of the pins (45 μm in this experiment), ie, 0 μm, 5 The substrate of μm, 15 μm, 30 μm, 40 μm, and 45 μm examines the diameter of one of the planar portions of the pin, and manufactures an inspection jig such that one thousand substrate inspection pins are gathered for each of the substrate inspection pins.
亦即，將一千個基板檢驗接腳(每個具有0μm之平面部分 之直徑)聚集在一起，藉以形成單一檢驗夾具，且每個具有5μm、15μm、30μm、40μm以及45μm之平面部分之直徑之基板檢驗接腳係各別被應用，因此，這些實驗係藉由使用總共六個檢驗夾具來實施。 That is, one thousand substrate inspection pins (each having a plane portion of 0 μm) The diameters are gathered together to form a single inspection jig, and each of the substrate inspection pin systems having a diameter of a planar portion of 5 μm, 15 μm, 30 μm, 40 μm, and 45 μm is applied separately, and therefore, these experiments are performed by using A total of six inspection fixtures were implemented.
實驗被實施如下。 The experiment was carried out as follows.
首先，藉由允許一飛針測試機(flying probe tester)接觸到為每 一百個製造的印刷電路板露出之焊墊來預先確認短路是否產生。 First, by allowing a flying probe tester to touch each One hundred manufactured printed circuit boards are exposed to the pads to confirm in advance whether a short circuit is generated.
接著，藉由允許包括具有0μm之平面部分之直徑之基板檢 驗接腳之檢驗夾具接觸到為每一百個製造的印刷電路板露出之配線圖案，並比較這個與藉由使用飛探針測試而被確認的一結果，測量出一短路產生率。 Next, by allowing substrate inspection including the diameter of the plane portion having 0 μm The test fixture of the test pin contacts the wiring pattern exposed for each of the hundreds of manufactured printed circuit boards, and compares this with a result confirmed by the use of the flying probe test to measure a short circuit generation rate.
接著，藉由使用包括每個具有5μm、15μm、30μm、40 μm以及45μm之平面部分之直徑之基板檢驗接腳之每一個檢驗夾具，連續測試一百個印刷電路板，然後，測量出短路產生率按照平面部分之直徑的變化。 Next, by using each including 5 μm, 15 μm, 30 μm, 40 Each of the inspection jigs of the substrate inspection pins having a diameter of μm and a plane portion of 45 μm was continuously tested for one hundred printed circuit boards, and then the rate of occurrence of the short circuit was measured in accordance with the diameter of the planar portion.
依此方式，由上述實驗所測量之結果係顯示於第4圖之一曲 線圖中。 In this way, the results measured by the above experiment are shown in one of the four pictures. In the line graph.
如第4圖之曲線圖所示，當短路產生率為0%時，平面部分 之直徑係為15μm至30μm。由此看來，吾人可看出平面部分之直徑係對 應至本體部分之直徑(45μm)之30%至70%之範圍。 As shown in the graph of Fig. 4, when the short circuit generation rate is 0%, the plane portion The diameter is from 15 μm to 30 μm. From this point of view, we can see that the diameter of the plane part is It should be in the range of 30% to 70% of the diameter (45 μm) of the body portion.
同時，如第4圖之曲線圖所示，當短路產生率為0.5%或更 小時，平面部分之直徑係為5μm至40μm。由此看來，吾人可看出平面部分之直徑係對應至本體部分之直徑(45μm)之10%至90%之範圍。 At the same time, as shown in the graph of Fig. 4, when the short circuit generation rate is 0.5% or more In the hour, the diameter of the planar portion is 5 μm to 40 μm. From this point of view, it can be seen that the diameter of the planar portion corresponds to a range of 10% to 90% of the diameter (45 μm) of the body portion.
亦即，可瞭解到當接觸焊墊之一部分具有一平面形狀縱使平 面部分之直徑係為5μm時，可迅速改善短路產生率。 That is, it can be understood that when one part of the contact pad has a planar shape, even flat When the diameter of the surface portion is 5 μm, the short-circuit generation rate can be quickly improved.
依據本發明之本實施例，基板檢驗接腳之一端(亦即，接觸 焊墊之一部分)係以一平面形狀被形成，俾能在接觸焊墊時避免基板檢驗接腳從焊墊可滑動地被移動，藉以建立一穩定檢驗環境，藉以降低在焊墊之一中心與基板檢驗接腳之一中心之間的一不對準的發生。 According to the embodiment of the present invention, one end of the substrate inspection pin (ie, contact One of the pads is formed in a planar shape, and the substrate inspection pin is prevented from being slidably moved from the pad when contacting the pad, thereby establishing a stable inspection environment, thereby reducing the center of one of the pads A misalignment between the centers of one of the substrate inspection pins occurs.
此外，依據本發明之本實施例，基板檢驗接腳之末端之一直 徑係小於本體部分之一直徑，藉以擴大一公差範圍，於其中縱使在待檢驗之一焊墊之一中心與基板檢驗接腳之一中心之間的不對準發生，仍可藉由允許基板檢驗接腳接觸一鄰近焊墊而產生短路。 Further, according to the embodiment of the present invention, the substrate is inspected at the end of the pin The diameter is smaller than the diameter of one of the body portions, thereby expanding a tolerance range in which even if the misalignment between the center of one of the pads to be inspected and the center of one of the substrate inspection pins occurs, the substrate inspection can be performed by allowing the substrate to be inspected. The pin contacts a neighboring pad to create a short circuit.
綜上所述，雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
110‧‧‧本體部分 110‧‧‧ body part
100‧‧‧基板檢驗接腳 100‧‧‧Substrate inspection pin
120‧‧‧接觸部分 120‧‧‧Contact section
Claims (10)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120064510A KR20130141245A (en) | 2012-06-15 | 2012-06-15 | Pin for substrate testing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201400828A true TW201400828A (en) | 2014-01-01 |
Family
ID=49985433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102118761A TW201400828A (en) | 2012-06-15 | 2013-05-28 | Substrate inspection pin |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2014002140A (en) |
| KR (1) | KR20130141245A (en) |
| TW (1) | TW201400828A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114960344A (en) * | 2022-06-17 | 2022-08-30 | 广东高捷体育产业有限公司 | Sports ground structure and scratch-resistant anti-skid ground |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0381669A (en) * | 1989-08-24 | 1991-04-08 | Tokyo Kasoode Kenkyusho:Kk | Probe for probe card |
| WO2003012828A2 (en) * | 2001-04-09 | 2003-02-13 | Kla-Tencor, Inc. | Systems and methods for measuring properties of conductive layers |
| JP2004093355A (en) * | 2002-08-30 | 2004-03-25 | Toshiba Corp | Pd ALLOY SERIES PROBE PIN AND PROBE PIN DEVICE USING IT |
| JP2006119024A (en) * | 2004-10-22 | 2006-05-11 | Tokyo Electron Ltd | Probe and its manufacturing method |
| JP2009025164A (en) * | 2007-07-19 | 2009-02-05 | Tokugen:Kk | Inspecting tool and method of manufacturing the same |
-
2012
- 2012-06-15 KR KR1020120064510A patent/KR20130141245A/en not_active Application Discontinuation
-
2013
- 2013-05-28 TW TW102118761A patent/TW201400828A/en unknown
- 2013-05-31 JP JP2013116503A patent/JP2014002140A/en not_active Ceased
Also Published As
| Publication number | Publication date |
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| KR20130141245A (en) | 2013-12-26 |
| JP2014002140A (en) | 2014-01-09 |
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