TW201351539A - Chip-sorting device and chip-sorting method, control program, readable memory medium - Google Patents
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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Abstract
Description
本發明係關於自搭載對晶圓進行切割且黏貼至黏著片上之多個半導體晶片之供給平台上，將半導體晶片按序轉移至例如分級不同之排列平台上之晶片分類裝置、及使用其之晶片分類方法、記述有用以使電腦執行該晶片分類方法之各步驟之處理程序之控制程式、以及儲存有該控制程式之可電腦讀取之可讀記憶媒體。 The present invention relates to a wafer sorting apparatus for sequentially transferring a semiconductor wafer onto a sorting platform having different grades, and a wafer using the same, from a supply platform on which a plurality of semiconductor wafers are cut and adhered to an adhesive sheet. A classification method, a control program for causing a computer to execute a processing procedure of each step of the wafer sorting method, and a computer-readable readable memory medium storing the control program.
先前之晶片分類裝置係在可於包含有正交之X軸與Y軸之XY平面上移動之供給平台上搭載切割晶圓。基於來自固定於架台之CCD照相機之切割晶圓之俯視圖像，而判別與晶片位址對應之試驗結果之分級記憶資訊，且藉由機械臂等，於每個級別選擇其晶片，而自供給平台上移載至其他排列平台上之分級薄片上。 Previous wafer sorting devices were equipped with dicing wafers on a supply platform that was movable over an XY plane containing orthogonal X and Y axes. The gradation memory information of the test result corresponding to the wafer address is discriminated based on the top view image of the dicing wafer from the CCD camera fixed to the gantry, and the wafer is selected at each level by a robot arm or the like, and the self-feeding platform is selected. Uploaded onto the grading sheets on other alignment platforms.
雖然在分級薄片上晶片數達到最大規定數量之情形、或可確保最小規定數量以上之晶圓晶片之輸出數量之情形時可進行輸出，但在分級薄片上晶片數不滿最小規定數量之情形時，無法輸出變為庫存。 Although the output can be performed when the number of wafers on the graded sheet reaches the maximum specified number, or when the output quantity of the wafer wafer of the minimum specified number or more can be ensured, when the number of wafers on the graded sheet is less than the minimum specified number, Unable to output to inventory.
圖8係用以說明先前之晶片分類裝置之動作例之流程圖。 Fig. 8 is a flow chart for explaining an operation example of the prior wafer sorting apparatus.
如圖8所示，以對應於晶圓上之晶片位址之方式將例如光特性檢查或電性檢查中之分級資訊儲存至完成級別分類之資料庫內。 As shown in FIG. 8, the hierarchical information in, for example, the optical characteristic inspection or the electrical inspection is stored in the database of the completion level classification in a manner corresponding to the wafer address on the wafer.
首先，於步驟S101中對光特性檢查或電性檢查中之每個級別進行分類處理。即，基於來自完成級別分類之資料庫之每個級別之晶片位址，而自供給平台上之供給薄片上之切割晶圓中選擇同一級之晶 片，而移載至其他排列平台上之分級薄片上。 First, in each step of the light characteristic inspection or the electrical inspection, classification processing is performed in step S101. That is, based on the wafer address of each level from the database of the completion level classification, the same level of crystal is selected from the dicing wafers on the supply sheet on the supply platform. The sheets are transferred to the grading sheets on other alignment platforms.
繼而，於步驟S102中進行數量核對處理。即，判定在分級薄片上晶片數是否達到最大規定數量，或是否可確保末級薄片之最小規定數量以上之晶圓晶片之輸出數量。 Then, the quantity collation processing is performed in step S102. That is, it is determined whether or not the number of wafers on the classified sheet reaches the maximum prescribed number, or whether the output amount of the wafer wafer of the minimum specified number or more of the final sheet is ensured.
接著，於步驟S103中進行輸出處理。即，在分級薄片上晶片數達到最大規定數量之情形、或可確保末級薄片之最小規定數量以上之晶圓晶片之輸出數量之情形時進行輸出。 Next, the output processing is performed in step S103. That is, the output is performed when the number of wafers on the classified sheet reaches the maximum prescribed number or when the number of outputs of the wafer wafer of the minimum specified number of the final sheets is ensured.
其後，在步驟S104中判定是否已完成全部處理，若於步驟S104中完成全部處理(YES)，則結束處理。又，若未於步驟S104中完成全部處理(NO)，則此後返回至步驟S101之分類處理而進行下一次分類處理。 Thereafter, it is determined in step S104 whether or not all processing has been completed. If all processing is completed in step S104 (YES), the processing is terminated. Moreover, if all the processes (NO) are not completed in step S104, the process returns to the sorting process of step S101 and the next sorting process is performed.
又，在步驟S105中進行庫存處理。即，步驟S102之數量核對之結果，在末級薄片上晶片數不滿最小規定數量之情形時，使該分級薄片上之晶片成為庫存。 Further, the inventory processing is performed in step S105. That is, as a result of the number check in step S102, when the number of wafers on the final sheet is less than the minimum specified number, the wafer on the graded sheet is made into stock.
再者，於步驟S106中進行將同一級之複數個分級薄片轉移至一個分級薄片之再收集與再編成處理。 Furthermore, in step S106, a re-collection and re-composition process of transferring a plurality of hierarchical sheets of the same level to one hierarchical sheet is performed.
繼而，於步驟S107中進行數量核對處理。即，判定在分級薄片上晶片數是否達到最大規定數量，或是否可確保末級薄片之最小規定數量以上之晶片之輸出數量。 Then, the quantity collation processing is performed in step S107. That is, it is determined whether or not the number of wafers on the classified sheet reaches the maximum prescribed number, or whether the output amount of the wafer of the minimum specified number or more of the final sheet can be secured.
其後，於步驟S108中進行輸出處理。即，在分級薄片上晶片數達到最大規定數量之情形、或可確保最小規定數量以上之晶片之輸出數量之情形時，進行分級薄片上之晶片之輸出處理。 Thereafter, the output processing is performed in step S108. That is, when the number of wafers on the classified sheet reaches the maximum specified number or when the output amount of the wafer of the minimum specified number or more is ensured, the output processing of the wafer on the classified sheet is performed.
又，步驟S107中分級薄片上之晶片數不滿最小規定數量之情形時，返回至步驟S105，對該晶片進行庫存處理。反復步驟S105~步驟S107，且分級薄片上之晶片數為最小規定數量以上之情形時，於步驟S108中進行分級薄片上之晶片之輸出處理。 When the number of wafers on the grading sheet is less than the minimum specified number in step S107, the process returns to step S105 to perform inventory processing on the wafer. When steps S105 to S107 are repeated and the number of wafers on the grading sheet is the minimum number or more, the wafer output processing on the grading sheet is performed in step S108.
再者，在步驟S109中判定是否已完成全部處理，若於步驟S109中完成全部處理(YES)，則結束處理。又，若未於步驟S109中完成全部處理(NO)，則此後返回至步驟S101，而過渡至下一次分類處理。 Furthermore, it is determined in step S109 whether or not all processing has been completed. If all the processing is completed in step S109 (YES), the processing is terminated. Moreover, if all the processes (NO) are not completed in step S109, the process returns to step S101 and the process proceeds to the next sorting process.
圖9係用以說明先前之晶片分類裝置之其他動作例之流程圖。 Fig. 9 is a flow chart for explaining another example of the operation of the prior wafer sorting apparatus.
如圖9所示，以對應於晶圓上之晶片位址之方式，將例如光特性檢查或電性檢查中之分級資訊記憶於完成級別分類之資料庫內。 As shown in FIG. 9, the hierarchical information in, for example, the optical characteristic inspection or the electrical inspection is stored in the database of the completion level classification in a manner corresponding to the wafer address on the wafer.
首先，於步驟S201中進行裝置設置處理。即，預先在每個級別中準備一片或複數片分級薄片。若預備之分級薄片耗盡，則必須令晶片分類裝置暫時停止，且補充不足之級別之分級薄片後使晶片分類裝置重新啟動。 First, the device setting process is performed in step S201. That is, one or a plurality of classified sheets are prepared in advance in each level. If the prepared grading sheet is exhausted, the wafer sorting device must be temporarily stopped, and the wafer sorting device is restarted after replenishing the grading sheet of the insufficient level.
繼而，於步驟S202中，對光特性檢查或電性檢查中之每個級別進行自供給平台上將晶片分類至不同級之排列平台上之分類處理。即，基於來自完成級別分類之資料庫之每個級別之晶片位址，而從搭載分割半導體晶圓之供給平台上之供給薄片上之切割晶圓中，選擇同一級別之晶片，而移載至其他排列平台上之分級薄片上。 Then, in step S202, each level of the optical characteristic inspection or the electrical inspection is subjected to classification processing on the self-supplying platform to classify the wafers onto the alignment platforms of different stages. That is, based on the wafer address of each level from the database of the completion level classification, the wafer of the same level is selected from the dicing wafer on the supply sheet on the supply platform on which the semiconductor wafer is divided, and is transferred to Others are arranged on the grading sheets on the platform.
接著，於步驟S203中進行數量核對處理。即，判定在分級薄片上晶片數是否達到最大規定數量，或是否可確保末級薄片之最小規定數量以上之晶圓晶片之輸出數量。 Next, the quantity collation processing is performed in step S203. That is, it is determined whether or not the number of wafers on the classified sheet reaches the maximum prescribed number, or whether the output amount of the wafer wafer of the minimum specified number or more of the final sheet is ensured.
總之，進行晶片分類直至此時或直至同一級別之分類晶片自供給平台上輸出完畢。 In summary, wafer sorting is performed until the sorting wafers at this time or up to the same level are output from the supply platform.
其後，於步驟S204中進行輸出處理。即，在分級薄片上晶片數達到最大規定數量之情形、或可確保末級薄片之最小規定數量以上之晶圓晶片之輸出數量之情形時進行輸出。 Thereafter, the output processing is performed in step S204. That is, the output is performed when the number of wafers on the classified sheet reaches the maximum prescribed number or when the number of outputs of the wafer wafer of the minimum specified number of the final sheets is ensured.
再者，在步驟S205中判定是否已完成全部處理，若於步驟S205中完成全部處理(YES)，則結束處理。又，若未於步驟S205中完成全部處理(NO)，則過渡至後續之步驟S206之處理。 Furthermore, it is determined in step S205 whether or not all processing has been completed. If all processing is completed in step S205 (YES), the processing is terminated. Moreover, if all the processing (NO) is not completed in step S205, the process proceeds to the subsequent step S206.
進而，於步驟S206中進行預備分級薄片之核對處理。即，於不同級中核對有無預備之分級薄片，若有預備之分級薄片，則在繼續進行後續之步驟S207之分類處理後，過渡至步驟S203之數量核對處理。 Further, in step S206, the collation processing of the preliminary classification sheet is performed. That is, the presence or absence of the prepared classification sheet is checked in different stages, and if there is a preliminary classification sheet, the classification processing of the subsequent step S207 is continued, and the process proceeds to the quantity verification processing of step S203.
另一方面，於步驟S208中進行庫存處理。即，步驟S203之數量核對之結果，在末級薄片上晶片數不滿最小規定數量之情形時，使該晶片成為庫存。 On the other hand, the inventory processing is performed in step S208. That is, as a result of the quantity check in step S203, when the number of wafers on the final stage sheet is less than the minimum specified number, the wafer is made into stock.
再者，於步驟S209中，進行將同一級別之複數個分級薄片轉移至一個分級薄片之再收集與再編成處理。 Furthermore, in step S209, a re-collection and re-composition process of transferring a plurality of hierarchical sheets of the same level to one hierarchical sheet is performed.
繼而，於步驟S210中進行數量核對處理。即，判定在分級薄片上晶片數是否達到最大規定數量，或是否可確保最小規定數量以上之晶片之輸出數量。 Then, the quantity collation processing is performed in step S210. That is, it is determined whether or not the number of wafers on the classified sheet reaches the maximum prescribed number, or whether the output amount of the wafer of the minimum specified number or more can be secured.
其後，於步驟S211中進行輸出處理。即，在分級薄片上晶片數達到最大規定數量之情形、或可確保最小規定數量以上之晶片之輸出數量之情形時，進行分級薄片上之晶片之輸出處理。 Thereafter, the output processing is performed in step S211. That is, when the number of wafers on the classified sheet reaches the maximum specified number or when the output amount of the wafer of the minimum specified number or more is ensured, the output processing of the wafer on the classified sheet is performed.
又，步驟S210之數量核對之結果，末級薄片上之晶片數不滿最小規定數量之情形時，返回至步驟S208之處理，而對該晶片進行庫存處理。反復步驟S208~步驟S210，而末級薄片上之晶片數為最小規定數量以上之情形時，於步驟S211中進行分級薄片上之晶片之輸出處理。 Further, if the number of wafers on the final sheet is less than the minimum specified number as a result of the number check in step S210, the process returns to step S208, and the wafer is subjected to inventory processing. When steps S208 to S210 are repeated and the number of wafers on the final sheet is the minimum number or more, the wafer output processing on the classified sheet is performed in step S211.
再者，在步驟S212中進行判定是否已完成全部處理之處理，若於步驟S212中完成全部處理(YES)，則結束處理。又，若未於步驟S212中完成全部處理(NO)，則此後過渡至步驟S202之分類處理。 Furthermore, in step S212, a process of determining whether or not all processes have been completed is performed, and if all processes (YES) are completed in step S212, the process is terminated. Moreover, if all the processing (NO) is not completed in step S212, the process proceeds to the sorting processing of step S202.
另一方面，在專利文獻1中，先前之晶片分類裝置係在可於正交之兩軸即X軸與Y軸形成之XY平面上移動之平台上搭載切割後之晶圓，且藉由固定於架台之CCD照相機，而判別半導體晶片之良與不良，並藉由機械裝置等握持該晶圓，首先一次移載至固定於架台之位 置矯正平台上。於正交之2個方向上具有基準之按壓部，且在固定於架台之定位平台上，於該2個方向機械性地按壓晶片而進行定位後，再藉由其他機械裝置等之移載機構握持半導體晶片，從而將半導體晶片移載至特定之場所。 On the other hand, in Patent Document 1, the conventional wafer sorting apparatus mounts the diced wafer on a platform that can move on the XY plane formed by the two orthogonal axes, that is, the X-axis and the Y-axis, and is fixed by In the CCD camera of the gantry, the semiconductor chip is judged to be good or bad, and the wafer is held by a mechanical device or the like, and is first transferred to the position fixed to the gantry. Placed on the correction platform. a pressing portion having a reference in two orthogonal directions, and a positioning mechanism on the mounting platform fixed to the gantry, mechanically pressing the wafer in the two directions to perform positioning, and then transferring the mechanism by another mechanical device or the like The semiconductor wafer is held to transfer the semiconductor wafer to a specific location.
專利文獻1：日本特開平09-036203號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 09-036203
在上述先前之晶片分類裝置中，作為對成為庫存之搭載於末級薄片上之晶片進行輸出之出貨方法，雖然在對同一分級薄片進行再編成而確保晶圓晶片之最小規定數量後進行輸出，但根據該出貨方法，對於少數級別庫存未耗盡，為始終有庫存之狀態，而必須多次進行再編成。 In the above-described conventional wafer sorting apparatus, as a method of shipping a wafer mounted on a final sheet in stock, the same graded sheet is re-programmed to ensure a minimum number of wafer wafers, and then output. However, according to the shipping method, for a small number of levels of inventory is not exhausted, in order to always have an inventory state, and must be re-edited multiple times.
即，不滿最小規定數量之末級薄片上之晶片成為庫存。藉由將其與其他批次之同一級別之末級薄片上之庫存一起進行再編成，而於分級薄片上晶片數達到最大規定數量之情形，或可確保最小規定數量以上之晶片之輸出數量之情形時雖可進行輸出，但由於每次再編成時為移載而對晶片進行拾取及放置，故晶片會受損。 That is, the wafer on the final sheet that is less than the minimum specified number becomes stock. By re-compiling it with the inventory on the final level of the same level of other batches, the number of wafers on the graded sheet reaches the maximum specified number, or the minimum number of outputs of the wafer can be ensured. In the case where the output can be performed, the wafer is damaged and picked up because the wafer is picked up and placed for transfer at each reprogramming.
另一方面，專利文獻1中揭示之上述先前之晶片分類裝置係關於分類機構者，對晶片輸出與庫存之關係完全未揭示。 On the other hand, the above-described conventional wafer sorting apparatus disclosed in Patent Document 1 relates to the classification mechanism, and the relationship between the wafer output and the stock is not disclosed at all.
本發明為解決上述先前之問題者，目的在於提供一種無需進行庫存之再編成，而可防止由再編成所致之移載時產生之晶片損傷之晶片分類裝置及使用其之晶片分類方法、記述有用以使電腦執行該晶片分類方法之各步驟之處理程序之控制程式、以及儲存有該控制程式之可電腦讀取之可讀記憶媒體。 The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a wafer sorting apparatus and a wafer sorting method and method using the same, which can prevent wafer damage caused by re-construction from being transferred. There is a control program for causing a computer to execute a processing procedure of each step of the wafer sorting method, and a computer-readable readable memory medium storing the control program.
本發明之晶片分類裝置係自個別地具有晶片固有之特性資料之母集合分類成規定之每個級別者，具有：分類數量管理運算機構，其係以關於輸出之晶片數量不產生與最小基準數相比更少數之薄片之方式，進行根據該特性資料而分配分類輸出數量作為每個級別之分類數量之運算；及分類機構，其係基於運算出之該分類輸出數量，而控制分類處理；藉此達成上述目的。 The wafer sorting apparatus of the present invention classifies each of the levels of the wafer-specific characteristic data into a predetermined level, and has a classification quantity management arithmetic unit that does not generate the minimum reference number with respect to the number of outputs of the wafer. Calculating the number of classification outputs according to the characteristic data as the number of classifications of each level, and the classification mechanism, based on the calculated output quantity of the classification, and controlling the classification processing; This achieves the above objectives.
又，較好的是，本發明之晶片分類裝置中之分類數量管理運算機構係在上述分類控制機構執行上述分類處理前，針對上述母集合之一部分或整體，以上述規定之每個級別實施關於上述分類數量之運算。 Moreover, it is preferable that the classification quantity management calculation means in the wafer sorting apparatus of the present invention performs the above-described predetermined level for one or all of the parent sets before the classification control means executes the classification processing. The operation of the above number of classifications.
再者，較好的是，本發明之晶片分類裝置中之分類數量管理運算機構係以自進行上述分類處理之第1片分級薄片開始以最大基準數進行分類之方式來運算上述分類數量，且以將自最後開始至少2片分級薄片所載置之晶片數根據剩餘之全部晶片數/剩餘之分級薄片片數而平均化，並將除不盡而餘下之晶片數任意附加於至少一片分級薄片之方式，來運算該分類數量。 Furthermore, it is preferable that the classification quantity management calculation means in the wafer sorting apparatus of the present invention calculates the number of classifications by classifying the first piece of the classified sheet from the classification processing by the maximum reference number, and The number of wafers placed on at least two of the grading sheets from the beginning is averaged according to the remaining number of wafers/the number of remaining grading sheets, and the number of remaining wafers is arbitrarily added to at least one of the grading sheets. The way to calculate the number of categories.
再者，較好的是，本發明之晶片分類裝置中之分類數量管理運算機構係以將進行上述分類處理之所有分級薄片所載置之不同級之全部晶片數量，根據不同級之全部晶片數/不同級之全部分級薄片片數而平均化，且將除不盡而餘下之晶片數任意附加於至少一片分級薄片之方式，來運算該分類數量。 Furthermore, it is preferable that the number-of-class management arithmetic unit in the wafer sorting apparatus of the present invention is based on the total number of wafers of different stages in which all of the classified sheets to be subjected to the sorting process are placed, and the number of all wafers according to different stages. The number of the classified sheets is averaged, and the number of the remaining wafers is arbitrarily added to at least one of the classified sheets to calculate the number of classifications.
再者，較好的是，進而具有：裝置設置機構，其係用以在本發明之晶片分類裝置之分類處理前，將進行該分類處理之每個級別所必須之分級薄片之數量根據上述母集合之不同級之全部晶片之數量預先計算，而準備該必須之分級薄片之數量。 Furthermore, it is preferable to further have: a device setting mechanism for using the number of the grading sheets necessary for each level of the sorting process before the sorting process of the wafer sorting device of the present invention is based on the mother The number of all wafers of different levels of the set is pre-calculated, and the number of necessary graded sheets is prepared.
進而，較好的是，本發明之晶片分類裝置之分類處理係自搭載晶圓切割後之多個半導體晶片之供給平台上，藉由搬送機械臂將該半導體晶片以規定之不同級別按序轉移至排列平台上之分級薄片。 Furthermore, it is preferable that the sorting process of the wafer sorting apparatus of the present invention is performed by sequentially transferring the semiconductor wafers at a predetermined level from a supply platform of a plurality of semiconductor wafers on which the wafers are diced. To the grading sheet on the alignment platform.
本發明之晶片分類方法係自個別地具有晶片固有之特性資料之母集合分類成規定之每個級別者，具有：分類數量管理運算步驟，其係分類數量管理運算機構以關於輸出之晶片數量不產生與最小基準數相比更少數之薄片之方式，進行根據該特性資料而分配分類輸出數量作為每個級別之分類數量之運算；及分類步驟，其係分類機構基於運算出之該分類輸出數量來控制分類處理；藉此達成上述目的。 The wafer sorting method of the present invention is characterized in that each of the parent sets having the characteristic data inherent to the wafer is classified into each of the prescribed levels, and has a classification quantity management operation step, which is a classification quantity management arithmetic unit to not output the number of wafers. a method of generating a smaller number of slices than the minimum reference number, performing an operation of assigning the classified output quantity according to the characteristic data as the number of classifications of each level; and a classification step of the classification information based on the calculated output quantity of the classification To control the classification process; thereby achieving the above objectives.
又，較好的是，本發明之晶片分類方法中之分類數量管理運算步驟係在上述分類控制機構執行上述分類處理前，分類數量管理運算機構針對上述母集合之一部分或整體，以上述規定之每個級別實施與上述分類數量相關之運算。 Moreover, it is preferable that the classification quantity management operation step in the wafer sorting method of the present invention is performed by the classification quantity management arithmetic unit for one or a part of the parent set before the classification processing is performed by the classification control unit. Each level implements an operation related to the number of classifications described above.
再者，較好的是，本發明之晶片分類方法中之分類數量管理運算步驟係以自進行上述分類處理之第1片分級薄片開始以最大基準數進行分類之方式來運算上述分類數量，且以將自最後開始至少2片分級薄片所載置之晶片數根據剩餘之全部晶片數/剩餘之分級薄片片數而平均化，並將除不盡而餘下之晶片數任意附加於至少一片分級薄片之方式，來運算該分類數量。 Furthermore, it is preferable that the classification quantity management calculation step in the wafer sorting method of the present invention calculates the number of classifications by classifying the first piece of the classified sheet from the classification processing by the maximum reference number, and The number of wafers placed on at least two of the grading sheets from the beginning is averaged according to the remaining number of wafers/the number of remaining grading sheets, and the number of remaining wafers is arbitrarily added to at least one of the grading sheets. The way to calculate the number of categories.
進而，較好的是，本發明之晶片分類方法中之分類數量管理運算步驟係以將進行上述分類處理之所有分級薄片所載置之不同級之全部晶片數量，根據不同級之全部晶片數/不同級之全部分級薄片片數而平均化，且將除不盡而餘下之晶片數任意附加至至少一片分級薄片之方式，來運算上述分類數量。 Further, it is preferable that the number-of-class management operation steps in the wafer sorting method of the present invention are all the number of wafers of different stages in which all of the grading sheets to be subjected to the above-described sorting processing are placed, according to the total number of wafers of different stages/ The number of classifications is calculated by averaging all the number of grading sheets of different grades, and arbitrarily adding the remaining number of wafers to at least one sheet of grading sheets.
再者，較好的是，進而具有：裝置設置步驟，其係用以在本發明之晶片分類方法之分類處理前，使裝置設置機構將進行該分類處理 之每個級別所必須之分級薄片之數量，根據上述母集合之不同級之全部晶片之數量預先計算，而準備該必須之分級薄片之數量。 Furthermore, it is preferable to further have: a device setting step for causing the device setting mechanism to perform the classification process before the classification process of the wafer sorting method of the present invention The number of graded sheets necessary for each level is pre-calculated based on the number of all wafers of different levels of the parent set, and the number of necessary graded sheets is prepared.
本發明之控制程式係記述有用以使電腦執行本發明之上述晶片分類方法之各步驟之處理程序者，藉此達成上述目的。 The control program of the present invention is intended to describe a process for causing a computer to execute the steps of the above-described steps of the wafer sorting method of the present invention.
本發明之可讀記憶媒體係儲存有本發明之上述控制程式之電腦可讀取者，藉此達成上述目的。 The readable memory medium of the present invention is a computer readable person storing the above control program of the present invention, thereby achieving the above object.
根據上述構成，以下對本發明之作用加以說明。 According to the above configuration, the action of the present invention will be described below.
在本發明中，在自個別地具有晶片固有之特性資料之母集合分類成規定之每個級別之晶片分類裝置中，具有：分類數量管理運算機構，其係以關於輸出之晶片數量不產生與最小基準數相比更少數之薄片之方式，進行根據特性資料而分配分類輸出數量作為分類數量之運算；及分類機構，其係基於運算出之分類輸出數量，而控制分類處理。 In the present invention, a wafer sorting apparatus that classifies each of the master sets having characteristic data inherent to the wafer into a predetermined level has a classification number management arithmetic unit that does not generate a number of wafers regarding the output. The minimum reference number is compared with a smaller number of slices, and the classification output quantity is assigned as the classification quantity according to the characteristic data; and the classification mechanism controls the classification processing based on the calculated classification output quantity.
藉此，因基於以不產生使輸出之晶片數量與最小基準數相比更少數之薄片之方式，根據特性資料而分配分類輸出數量作為每個級別之分類數量之運算結果，來控制分類處理，故可不進行庫存之再編成，而防止由再編成所致之晶片移載時產生之晶片損傷。 In this way, the classification processing is controlled by assigning the classification output quantity as the calculation result of the classification quantity of each level based on the characteristic data so as not to generate a sheet having a smaller number of wafers than the minimum reference number. Therefore, it is possible to prevent the wafer from being damaged when the wafer is transferred by the re-programming without re-arranging the stock.
如上所述，根據本發明，因依據晶片固有之特性資料而分配分類輸出數量作為每個級別之分類數量，故不會變為庫存，亦不必如先前般進行庫存之再編成，而可防止由再編成所致之晶片移載時產生之晶片損傷。 As described above, according to the present invention, since the number of classified outputs is assigned as the number of classifications for each level based on the characteristic data inherent to the wafer, it does not become stock, and it is not necessary to re-arrange the stock as before, thereby preventing Re-editing the resulting wafer damage caused by wafer transfer.
1‧‧‧晶片分類裝置 1‧‧‧ wafer sorting device
1A‧‧‧晶片分類裝置 1A‧‧‧ wafer sorting device
2‧‧‧供給平台 2‧‧‧Supply platform
3‧‧‧排列平台 3‧‧‧Alignment platform
4‧‧‧搬送機械臂 4‧‧‧Transporting robotic arm
5‧‧‧供給側圖像處理部 5‧‧‧Supply side image processing unit
6‧‧‧排列側圖像處理部 6‧‧‧Arrangement side image processing unit
7‧‧‧卸載機部 7‧‧‧Unloading machine department
8‧‧‧卸載機取出機械臂 8‧‧‧Unloader removes the arm
9‧‧‧控制裝置 9‧‧‧Control device
9A‧‧‧控制裝置 9A‧‧‧Control device
21‧‧‧切割晶圓 21‧‧‧Cut wafer
31‧‧‧分級薄片 31‧‧‧Grade
41‧‧‧夾頭 41‧‧‧ chuck
90‧‧‧輸入部 90‧‧‧ Input Department
91‧‧‧顯示部 91‧‧‧Display Department
92‧‧‧控制部(CPU) 92‧‧‧Control Department (CPU)
92A‧‧‧控制部(CPU) 92A‧‧‧Control Department (CPU)
93‧‧‧RAM 93‧‧‧RAM
94‧‧‧ROM 94‧‧‧ROM
95‧‧‧資料庫 95‧‧‧Database
921‧‧‧分類數量管理最佳化運算機構 921‧‧‧Classification quantity management optimization organization
922‧‧‧裝置設置機構 922‧‧‧Device setting mechanism
923‧‧‧分類機構 923‧‧‧Classification agencies
圖1係概略性地顯示本發明之實施形態1之晶片分類裝置之要部構成例之平面模式圖。 Fig. 1 is a plan view schematically showing an example of a configuration of a main part of a wafer sorting apparatus according to a first embodiment of the present invention.
圖2係圖1之晶片分類裝置之晶片分類控制硬體構成圖。 2 is a diagram showing the hardware composition of the wafer sorting control of the wafer sorting apparatus of FIG. 1.
圖3係顯示對於分級A~I之每個晶圓之晶片數量、每個批次之晶片數量、及每複數批次之晶片數量之圖表。 Figure 3 is a graph showing the number of wafers for each wafer of grades A~I, the number of wafers per batch, and the number of wafers per batch.
圖4係顯示對於分級A~I之每個批次之晶片數量之圖表。 Figure 4 is a graph showing the number of wafers for each batch of grades A~I.
圖5係用以說明圖1之晶片分類裝置之控制部之動作之流程圖。 Fig. 5 is a flow chart for explaining the operation of the control unit of the wafer sorting apparatus of Fig. 1.
圖6係本發明之實施形態2之晶片分類裝置之晶片分類控制硬體構成圖。 Fig. 6 is a view showing a hardware configuration of a wafer sorting control of the wafer sorting apparatus according to the second embodiment of the present invention.
圖7係用以說明圖6之晶片分類裝置之控制部之動作之流程圖。 Fig. 7 is a flow chart for explaining the operation of the control unit of the wafer sorting apparatus of Fig. 6.
圖8係用以說明先前之晶片分類裝置之動作例之流程圖。 Fig. 8 is a flow chart for explaining an operation example of the prior wafer sorting apparatus.
圖9係用以說明先前之晶片分類裝置之其他動作例之流程圖。 Fig. 9 is a flow chart for explaining another example of the operation of the prior wafer sorting apparatus.
以下，關於本發明之晶片分類裝置及晶片分類方法之實施形態1、2，一面參照圖式一面進行詳細說明。另，圖中之構成構件各自之厚度或長度等係依據圖式製作上之觀點而言，而並非限定於圖示之構成。 Hereinafter, the first and second embodiments of the wafer sorting apparatus and the wafer sorting method of the present invention will be described in detail with reference to the drawings. In addition, the thickness, length, and the like of the constituent members in the drawings are not limited to the illustrated configuration, from the viewpoint of the production of the drawings.
圖1係概略性地顯示本發明之實施形態1之晶片分類裝置之要部構成例之平面模式圖。圖2係圖1之晶片分類裝置之晶片分類控制硬體構成圖。 Fig. 1 is a plan view schematically showing an example of a configuration of a main part of a wafer sorting apparatus according to a first embodiment of the present invention. 2 is a diagram showing the hardware composition of the wafer sorting control of the wafer sorting apparatus of FIG. 1.
在圖1中，本實施形態1之晶片分類裝置1具有：供給平台2，其係搭載有作為黏貼於黏著片上之切割晶圓21之多個半導體晶片之LED晶片(以下簡稱為晶片)；排列平台3，其係用於根據例如發光亮度最高之級別A、其次發光亮度較高之級別B等使用用途，而將晶片按序排列至不同級別之分級薄片31上；搬送機械臂4，其係藉由設置於前端部之夾頭41來吸引保持晶片，且自供給平台2轉動搬送至排列平台3上之不同級別之分級薄片31上；供給側圖像處理部5，其係拍攝供給平台2上之切割晶圓21；排列側圖像處理部6，其係拍攝排列於排列平 台3上之分級薄片31之同一級別之晶片；卸載機部7，其係搭載有預備之分級薄片31；卸載機取出機械臂8，其係將卸載機部7上之預備之分級薄片31轉移至排列平台3上；及控制裝置9，其係以控制該等且自個別地具有固有之特性資料(測試結果)之母集合分類成規定之每個級別，並使晶片自供給平台2轉移至排列平台3之方式加以控制。 In the wafer sorting apparatus 1 of the first embodiment, the wafer sorting apparatus 1 of the first embodiment includes a supply stage 2 on which LED chips (hereinafter simply referred to as wafers) of a plurality of semiconductor wafers as the dicing wafers 21 adhered to the adhesive sheets are mounted; The platform 3 is used for sequentially arranging the wafers onto the grading sheets 31 of different grades according to the use level such as the highest level A of the illuminating brightness and the level B of the second highest illuminating brightness; the transporting robot 4 is The holding wafer is sucked and held by the chuck 41 provided at the front end portion, and is transported from the supply platform 2 to the different grades of the grading sheets 31 on the arranging platform 3; the supply side image processing unit 5 is the photographing supply platform 2 The upper dicing wafer 21; the arranging side image processing unit 6, which is arranged in a lined arrangement The wafer of the same level of the grading sheet 31 on the stage 3; the unloader unit 7 is equipped with a preliminary grading sheet 31; and the unloader takes out the robot arm 8, which transfers the prepared grading sheet 31 on the unloader unit 7. Up to the arranging platform 3; and the control device 9 classifying each of the specified levels by controlling the parent set of the inherent characteristic data (test results) and transferring the wafer from the supply platform 2 to The way in which the platform 3 is arranged is controlled.
切割晶圓21係擴展/測試完成後之切割晶圓。於金屬製之環上黏貼有黏著片，該黏著片面上之切割晶圓21上之複數晶片成黏貼狀態。在切割晶圓21中，LED晶片之情形時，1片晶圓中晶片之載置數為30000~120000左右。 The dicing wafer 21 is a diced wafer after expansion/testing. An adhesive sheet is adhered to the metal ring, and the plurality of wafers on the dicing wafer 21 on the adhesive sheet surface are adhered. In the case of the LED wafer in the dicing wafer 21, the number of wafers placed on one wafer is about 30,000 to 120,000.
供給平台2係於X軸方向及Y軸方向自由移動地構成，且以其平台中心為旋轉中心自由旋轉地構成。供給平台2之X軸方向之移動係藉由未圖示之供給平台X軸用馬達之旋轉驅動，而與供給平台2所搭載之X軸用台座之移動共同進行。又，供給平台2之Y軸方向之移動係藉由未圖示之供給平台Y軸用馬達之旋轉驅動，而與供給平台2及X軸用台座所搭載之Y軸用台座之移動共同進行。再者，供給平台2之旋轉動作係藉由未圖示之供給平台θ旋轉用馬達之旋轉驅動，而與供給平台2、X軸用台座及Y軸用台座所搭載之θ旋轉用台座之旋轉共同進行。總之，基於來自供給側圖像處理部5之供給側圖像資訊而定位，且以使同一級別之後續之晶片位於搬送機械臂4之夾頭41所至之位置上之方式，供給平台2按序移動。 The supply platform 2 is configured to be freely movable in the X-axis direction and the Y-axis direction, and is configured to be rotatable around the center of the table as a center of rotation. The movement of the supply platform 2 in the X-axis direction is performed in conjunction with the movement of the X-axis pedestal mounted on the supply platform 2 by the rotation of the supply platform X-axis motor (not shown). Further, the movement of the supply platform 2 in the Y-axis direction is performed by the rotation of the Y-axis turret mounted on the supply platform 2 and the X-axis pedestal by the rotation of the supply platform Y-axis motor (not shown). In addition, the rotation operation of the supply platform 2 is rotated by the rotation of the supply platform θ rotation motor (not shown), and the rotation of the θ rotation pedestal mounted on the supply platform 2, the X-axis pedestal, and the Y-axis pedestal. Work together. In short, it is positioned based on the supply side image information from the supply side image processing unit 5, and the supply platform 2 is pressed so that the subsequent wafer of the same level is positioned at the position of the chuck 41 of the transfer robot arm 4. Order movement.
排列平台3係於X軸方向及Y軸方向自由移動地構成，且以其平台中心為旋轉中心自由旋轉地構成。排列平台3之X軸方向之移動係藉由未圖示之排列平台X軸用馬達之旋轉驅動，而與排列平台3所搭載之X軸用台座之X軸方向之移動共同進行。又，排列平台3之Y軸方向之移動係藉由未圖示之排列平台Y軸用馬達之旋轉驅動，而與排列平台3及其X軸用台座所搭載之Y軸用台座之Y軸方向之移動共同進行。 再者，排列平台3之旋轉動作係藉由未圖示之排列平台θ旋轉用馬達之旋轉驅動，而與排列平台3、其X軸用台座及其Y軸用台座所搭載之θ旋轉用台座之旋轉共同進行。總之，基於來自排列側圖像處理部6之排列側圖像資訊而定位，且以使同一級別之後續之晶片排列於搬送機械臂4之夾頭41運送晶片所至之位置上之方式，排列平台3按序移動。 The alignment stage 3 is configured to be freely movable in the X-axis direction and the Y-axis direction, and is configured to be rotatable around the center of the table as a center of rotation. The movement of the alignment stage 3 in the X-axis direction is performed by the rotation of the X-axis motor of the arrangement platform (not shown), and is performed in conjunction with the movement of the X-axis pedestal mounted on the alignment stage 3 in the X-axis direction. Further, the movement of the arranging platform 3 in the Y-axis direction is driven by the rotation of the Y-axis motor (not shown), and the Y-axis direction of the Y-axis pedestal mounted on the arranging platform 3 and its X-axis pedestal The move is carried out together. In addition, the rotation operation of the arranging platform 3 is θ rotation pedestal mounted on the arranging platform 3, the X-axis pedestal, and the Y-axis pedestal thereof by the rotation of the arranging platform θ rotation motor (not shown). The rotation is performed together. In short, it is positioned based on the arrangement side image information from the arrangement side image processing unit 6, and is arranged such that the subsequent wafers of the same level are arranged on the position where the wafer 41 of the transfer robot arm 4 transports the wafer. Platform 3 moves in order.
於搬送機械臂4設置有於前端吸附且保持晶片之夾頭41，搬送機械臂4係自由旋轉地構成而使夾頭41於供給平台2與排列平台3之間旋轉，且令夾頭41於上下方向自由移動而構成。搬送機械臂4之上下方向之移動係藉由機械臂Z軸用馬達之旋轉驅動，而經由導軌與小齒輪加以進行。又，搬送機械臂4之旋轉動作係藉由機械臂θ旋轉用馬達之旋轉驅動，而經由齒輪加以進行。 The transfer robot arm 4 is provided with a chuck 41 that sucks and holds the wafer at the tip end, and the transfer robot arm 4 is rotatably configured to rotate the chuck 41 between the supply platform 2 and the alignment stage 3, and the chuck 41 is It is configured to move freely in the up and down direction. The movement of the transfer robot arm 4 in the up-and-down direction is performed by the rotation of the robot Z-axis motor, and is performed via the guide rail and the pinion gear. Moreover, the rotation operation of the transfer robot arm 4 is performed by the rotation of the motor θ rotation motor, and is performed via a gear.
控制裝置9係如圖2所示，具有：鍵盤或滑鼠、畫面輸入裝置等輸入部90，其係以電腦系統構成，且可輸入各種指令；顯示部91，其係可根據各種輸入指令而於顯示畫面上顯示初始畫面、選擇引導畫面及處理結果畫面等之各種圖像；作為控制部92之CPU(中央運算處理裝置)，其係進行整體控制，且進行分類數量管理最佳化運算處理及分類處理；作為臨時記憶機構之RAM93，其係於CPU啟動時作為工作記憶體而進行動作；作為可讀記錄媒體(記憶機構)之ROM94，其係記錄有用以使CPU動作之控制程式及該控制程式所使用之各種資料等且可電腦讀取；及完成級別分類之資料庫95，其係用於以對應於晶圓上之晶片位址之方式，記憶例如光特性檢查或電性檢查中之分級資訊且可以此為參照；且以自個別地具有晶片固有之特性資料(測試結果；針對晶片位址之分級資訊)之母集合，將晶片分類至規定之每個級別之方式，將晶片自供給平台2轉移至排列平台3，如此般進行控制。另，該資料庫95雖然與RAM93或ROM94另行設置，但資料庫95可位於RAM93內，亦可位於ROM94內。 As shown in FIG. 2, the control device 9 includes an input unit 90 such as a keyboard, a mouse, and a screen input device. The control unit 9 is configured by a computer system and can input various commands. The display unit 91 can be configured according to various input commands. Various images such as an initial screen, a selection guide screen, and a processing result screen are displayed on the display screen, and the CPU (central processing unit) of the control unit 92 performs overall control and performs classification number management optimization processing. And a sorting process; the RAM 93 as a temporary memory mechanism operates as a working memory when the CPU is started; and the ROM 94, which is a readable recording medium (memory mechanism), records a control program for causing the CPU to operate and The various data used by the control program and the like are computer readable; and the level-of-class database 95 is used to memorize, for example, optical characteristic inspection or electrical inspection in a manner corresponding to the wafer address on the wafer. The grading information can be referred to as a reference; and the parent collection has inherent characteristics of the wafer (test results; grading information for the wafer address) Each level of a predetermined manner to the classification of the wafer, the wafer is transferred from the feed table 2 to the platform 3 are arranged so as controls. Further, although the database 95 is separately provided from the RAM 93 or the ROM 94, the database 95 may be located in the RAM 93 or may be located in the ROM 94.
控制部92具有：作為分類數量管理運算機構之分類數量管理最佳化運算機構921，其係除來自輸入部90之輸入指令之外，基於自ROM94內讀取至RAM93內之控制程式及該控制程式所使用之各種資料，以不產生使輸出之晶片數量與作為最小基準數之最小規定數量(此處為1000個)相比更少數之薄片之方式，進行根據晶片之特性資料而分配分類輸出數量作為每個級別之分類數量之運算；及作為分類控制機構之分類機構923，其係基於運算出之該分類輸出數量而控制晶片分類處理。 The control unit 92 has a classification quantity management optimization calculation unit 921 as a classification quantity management calculation unit, which is based on a control program read from the ROM 94 into the RAM 93 and the control in addition to an input command from the input unit 90. The various materials used in the program are assigned to sort output according to the characteristics of the wafer so as not to produce a smaller number of wafers than the minimum specified number of minimum reference numbers (here, 1000). The number is calculated as the number of classifications for each level; and the classification mechanism 923, which is a classification control mechanism, controls the wafer classification processing based on the calculated number of output of the classification.
ROM94係以硬碟、光碟、磁碟及IC記憶體等可讀記錄媒體(記憶機構)構成。該控制程式及其所使用之各種資料可自攜帶自由之光碟、磁碟及IC記憶體等中下載至ROM94，亦可自電腦之硬碟中下載至ROM94，又可經由無線或有線之網際網路等而下載至ROM94。 The ROM 94 is constituted by a readable recording medium (memory mechanism) such as a hard disk, a compact disk, a magnetic disk, and an IC memory. The control program and the various materials used can be downloaded to the ROM 94 from a free-disc, CD and IC memory, or downloaded from the hard disk of the computer to the ROM 94, or via the wireless or wired Internet. Download to ROM94 by road.
此處，進而對藉由分類數量管理最佳化運算機構921，在過渡至分類處理前事先進行運算之分類數量管理最佳化運算處理加以詳細地說明。 Here, the classification quantity management optimization calculation processing which is calculated in advance by the classification quantity management optimization calculation unit 921 before the transition to the classification processing will be described in detail.
總之，分類數量管理最佳化運算機構921係在分類控制機構923執行分類處理前，針對晶片固有之特性資料(測試結果；針對晶片位址之級別資訊)之母集合之一部分或整體，以規定之每個級別實施與分類數量相關之運算。 In short, the classification quantity management optimization operation unit 921 specifies a part or the whole of the mother set characteristic data (test result; level information for the wafer address) before the classification control unit 923 performs the classification processing. Each level implements operations related to the number of classifications.
所謂分類係拾取來自分割晶圓21之同一級別之晶片，並以每個級別放置於排列平台3上之分級薄片31上而按序排列。 The classification system picks up the wafers of the same level from the divided wafers 21, and arranges them in order on each of the graded sheets 31 on the alignment stage 3.
所謂分級薄片31係以每個級別分類之排列平台3上之薄片。存在級別之分類數之薄片。根據裝置，亦可搭載預備之分級薄片。 The classified sheets 31 are sheets arranged on the platform 3 in a classification of each level. There is a slice of the number of categories. According to the device, a preliminary grading sheet can also be mounted.
所謂完成級別分類之資料庫95係包含測試資料結果之地圖資料，且作為針對晶片位址之分級資訊，記錄有依據規定之分類進行分級之資料。對應於晶片位址進行分級而記憶於完成級別分類之資料庫 95內。 The so-called completion level classification database 95 contains map data of the test data results, and as the classification information for the wafer address, the information classified according to the specified classification is recorded. A database that is graded in accordance with the wafer address and memorized in the completion level classification Within 95.
所謂批次係一批處理中之複數片晶圓片數單位。此處，使1批次為晶圓12片(或25片)。 The batch is a unit of a plurality of wafers in a batch process. Here, one batch is made into 12 wafers (or 25 wafers).
關於晶片固有之特性資料之母集合之一部分或整體，以晶片個別地進行級別分類。若以批次單位考慮，則1片晶圓大小之特性資料係母集合之一部分，1批次大小(晶圓12片)之特性資料之集合資料係母集合之全部。 Regarding one or the whole of the mother set of the characteristic data inherent to the wafer, the wafers are individually classified by level. If the batch unit is considered, the characteristic data of one wafer size is one part of the parent set, and the set data of the characteristic data of one batch size (12 wafers) is the parent collection.
所謂最小規定數量係最小基準數量，由後半組裝中必要之最小單位決定。此處，使晶片數量為例如1000個。若晶片數量在規定數量以下，則成為庫存。 The minimum specified quantity is the minimum number of bases, which is determined by the minimum unit necessary in the second half of assembly. Here, the number of wafers is, for example, 1000. If the number of wafers is less than the specified number, it becomes stock.
所謂最大規定數量係最大基準數量，即以輸出空間(排列分級薄片31上之晶片之區域)決定之數量。此處，使晶片數量為例如10000個。以相對搭載面積之晶片面積與排列之間隔決定數量之上限。 The maximum specified number is the maximum number of bases, i.e., the number determined by the output space (the area of the wafer on which the grading sheets 31 are arranged). Here, the number of wafers is, for example, 10,000. The upper limit of the number is determined by the area of the wafer and the arrangement of the relative mounting area.
雖然若達到最大規定數量則自動進行輸出，但在批次之最後，先前有無法輸出最小規定數量以下之分級薄片31而變為庫存之情形。 Although the output is automatically performed if the maximum prescribed number is reached, at the end of the lot, there is a case where the classified sheet 31 of the minimum specified number or less cannot be output and becomes the stock.
雖然在分級薄片31上同一級別之晶片數達到最大規定數量(此處為10000個)之情形、或可確保最小規定數量(此處為1000個)以上之晶圓晶片之輸出數量之情形時可進行輸出，但在分級薄片上晶片數不滿最小規定數量之情形時不能輸出而變為庫存。對此使用本實施形態1之晶片分類裝置1，以晶片不會成為庫存之方式管理晶片之分類數量。對此，進而使用圖3~圖5進行詳細說明。 Although the number of wafers of the same level on the grading sheet 31 reaches the maximum specified number (here, 10,000), or the minimum number of wafers (here 1000) or more of the output of the wafer wafer can be ensured. The output is made, but when the number of wafers on the classified sheet is less than the minimum specified number, it cannot be output and becomes stock. In this regard, the wafer sorting apparatus 1 of the first embodiment is used to manage the number of sorts of wafers so that the wafers do not become in stock. This will be described in detail with reference to FIGS. 3 to 5 .
圖3係顯示針對級別A~I之每個晶圓之晶片數量、每個批次之晶片數量、及每複數批次之晶片數量之圖表。圖4係顯示針對級別A~I之每個批次之晶片數量之圖表。 Figure 3 is a graph showing the number of wafers for each wafer of level A~I, the number of wafers per batch, and the number of wafers per multiple batches. Figure 4 is a graph showing the number of wafers for each batch of levels A~I.
如圖3及圖4所示，雖然對於級別A，在晶圓單位中並不滿晶片輸出數量，但在批次單位(晶圓12片)中，晶片數量為6000個，於每一片 分級薄片31上晶片為1000個，則可以6片分級薄片31進行輸出。 As shown in FIG. 3 and FIG. 4, although the number of wafer outputs is not satisfied in the wafer unit for the level A, in the batch unit (12 wafers), the number of wafers is 6000, in each piece. When the number of wafers on the grading sheet 31 is 1,000, six sheets of the grading sheet 31 can be output.
又，對於級別B，在批次單位(晶圓12片)中，以最初之分級薄片31輸出10000個晶片，而在第2片分級薄片31上為999個晶片，此係符合晶片數量不滿最小規定數量之1000個之情形，無法進行輸出而變為庫存。為防止此種情形，對本實施形態1之晶片分類裝置1之運算處理進行後述。 Further, for the level B, in the batch unit (12 wafers), 10000 wafers are outputted from the first classified sheet 31, and 999 wafers are formed on the second sheet grading sheet 31, which is in accordance with the minimum number of wafers. In the case of a specified number of 1000, it is impossible to output and become stock. In order to prevent such a situation, the arithmetic processing of the wafer sorting apparatus 1 of the first embodiment will be described later.
再者，對於級別I，在批次單位(晶圓12片)中，晶片數量為300個，不滿晶片輸出數量之1000個，而在複數批次單位中，晶片數量為1300個，為晶片輸出數量1000個以上，而可進行輸出。 Furthermore, for level I, in the batch unit (12 wafers), the number of wafers is 300, less than 1000 wafer output quantities, and in the plurality of batch units, the number of wafers is 1300, which is the wafer output. The number is more than 1000 and can be output.
對於級別B，說明本實施形態1之晶片分類裝置1之運算處理。即，以使輸出數量不產生與最小基準數相比更少數量之分級薄片31之方式，根據晶片之特性資料，計算作為分類數量之分類輸出數量，而執行分類輸出。如上所述，於執行分類處理前，在完成級別分類之資料庫95中，針對晶片之特性資料之母集合之一部分或整體，實施與分類數量相關之運算。 For the level B, the arithmetic processing of the wafer sorting apparatus 1 of the first embodiment will be described. That is, the classification output is performed by calculating the number of classification outputs as the number of classifications based on the characteristic data of the wafer so that the output number does not generate a smaller number of the classification sheets 31 than the minimum reference number. As described above, before the classification process is performed, in the database 95 of the completion level classification, the operation related to the number of classifications is performed for one or a whole of the mother set of the characteristic data of the wafer.
具體而言，分類數量管理最佳化運算機構921係自進行分類處理之第1片分級薄片31開始進行分類(此處為10000個)直至最大基準數(最大規定數量)，且將自最後開始至少2片分級薄片31所載置之晶片數量，根據剩餘之全部晶片數/剩餘之分級薄片片數而平均化，並將除不盡而餘下之晶片數附加至剩餘之分級薄片片數中之至少一片分級薄片31上。分類機構923係基於對剩餘之全部晶片數量進行平均化且附加有餘數之分類輸出數量而控制晶片分類處理。 Specifically, the classification number management optimization calculation unit 921 starts classification (here, 10,000) from the first sheet classification sheet 31 that performs classification processing up to the maximum reference number (maximum prescribed number), and will start from the last. The number of wafers placed on at least two of the grading sheets 31 is averaged according to the remaining number of wafers/the number of remaining grading sheets, and the remaining number of wafers is added to the remaining number of grading sheets. At least one piece of the grading sheet 31. The sorting mechanism 923 controls the wafer sorting process based on averaging the remaining number of all wafers and adding the number of sorted outputs of the remainder.
或，分類數量管理最佳化運算機構921係將進行晶片分類處理之全部分級薄片31所載置之所有晶片數量，根據不同級別之全部晶片數/不同級別之全部分級薄片片數而平均化，且將除不盡而餘下之晶片數附加至任意之至少一片分級薄片上。分類機構923係基於對全部晶 片數量進行平均化且附加有餘數之分類輸出數量，而控制晶片分類處理。 Alternatively, the classification quantity management optimization unit 921 is to average all the wafers placed on all of the classified sheets 31 subjected to the wafer sorting process, and is averaged according to the number of all wafers of different levels/the number of all the divided sheets of different levels. And the remaining number of wafers is added to any at least one of the classified sheets. Classification mechanism 923 is based on all crystals The number of slices is averaged and the number of classified outputs is added to the remainder, and the wafer sorting process is controlled.
例如，自開端之第1片分級薄片31開始進行分類直至最大規定數量(此處為10000個)，且使最後2片分級薄片31所載置之晶片數量平均化。該情形時，在批次單位(晶圓12片)中級別B之晶片數量為10999個之情形時，開端之第1片分級薄片31上所搭載之晶片數量為5500個，而第2片分級薄片31上所搭載之晶片數量為5499個。該等之2片分級薄片31皆可進行輸出處理。該等係與使批次整體平均化之處理相同。 For example, the first piece of the classified sheet 31 from the beginning is sorted up to the maximum prescribed number (here, 10,000 pieces), and the number of wafers placed on the last two sheets of the classified sheets 31 is averaged. In this case, when the number of wafers of the level B in the batch unit (12 wafers) is 10,999, the number of wafers mounted on the first sheet of the classified sheet 31 is 5,500, and the second sheet is classified. The number of wafers mounted on the sheet 31 was 5,499. Both of the two classified sheets 31 can be subjected to output processing. These lines are the same as the process of averaging the batch as a whole.
又，例如，在批次單位(晶圓12片)中特定級別之晶片數量為20999個之情形時，開端之第1片分級薄片31上所搭載之晶片數量為10000個，第2片分級薄片31上搭載5500個，第3片分級薄片31上所搭載之晶片數量為5499個。自最後開始第2片與第3片之各分級薄片31上之晶片個數除不盡之情形時，以使前後任一者之分級薄片31上之晶片個數額外多1個或少1個之方式而搭載晶片。總之，在自最後開始2片分級薄片31中，將1片包含最大規定數量(此處為10000個)之晶片數量各分配至2片分級薄片31上。 Further, for example, when the number of wafers of a specific level in the batch unit (12 wafers) is 20,999, the number of wafers mounted on the first sheet-like sheet 31 at the beginning is 10,000, and the second sheet is classified. There are 5,500 mounted on 31, and the number of wafers mounted on the third grading sheet 31 is 5,499. When the number of wafers on each of the grading sheets 31 of the second and third sheets is incomplete, the number of wafers on the grading sheet 31 of either one of the front and the back is one or more additional ones. The wafer is mounted in such a manner. In summary, in the last two classified sheets 31, one wafer containing the largest specified number (here, 10,000) is allocated to each of the two divided sheets 31.
再者，例如，自開端之第1片分級薄片31開始進行分類直至最大規定數量(此處為10000個)，且使最後3片分級薄片31所載置之晶片數平均化。該情形時，在批次單位(晶圓12片)中級別B之晶片數量為10999個之情形時，開端之第1片分級薄片31上所搭載之晶片數量為3667個，第2片分級薄片31上所搭載之晶片數量為3666個，第3片分級薄片31上所搭載之晶片數量為3666個。該等之3片分級薄片31皆可進行輸出處理。該等係與使批次整體平均化之處理相同。 Further, for example, the first sheet of the classified sheets 31 from the beginning is sorted up to a maximum predetermined number (here, 10,000 sheets), and the number of wafers placed on the last three sheets of the sheet 33 is averaged. In this case, when the number of wafers of the level B in the batch unit (12 wafers) is 10,999, the number of wafers mounted on the first sheet of the classified sheet 31 at the beginning is 3,667, and the second sheet is classified. The number of wafers mounted on 31 is 3,666, and the number of wafers mounted on the third graded sheet 31 is 3,666. All of the three classified sheets 31 can be subjected to output processing. These lines are the same as the process of averaging the batch as a whole.
又，例如，在批次單位(晶圓12片)中特定級別之晶片數量為20999個之情形時，開端之第1片分級薄片31上所搭載之晶片數量為10000個，第2片分級薄片31上所搭載之晶片數量為3667個，第3片分 級薄片31上所搭載之晶片數量為3666個，第4片分級薄片31上所搭載之晶片數量為3666個。在第2片~第4片之各分級薄片31上之晶片個數除不盡之情形時，以使前中後任一者之分級薄片31上之晶片個數額外多1個或少1個之方式而搭載晶片。總之，在自最後開始3片分級薄片31中，將1片包含最大規定數量(此處為10000個)之晶片數量各分配至3片分級薄片31上。 Further, for example, when the number of wafers of a specific level in the batch unit (12 wafers) is 20,999, the number of wafers mounted on the first sheet-like sheet 31 at the beginning is 10,000, and the second sheet is classified. The number of wafers mounted on 31 is 3,667, the third film The number of wafers mounted on the grade sheet 31 was 3,666, and the number of wafers mounted on the fourth graded sheet 31 was 3,666. When the number of wafers on each of the grading sheets 31 of the second to fourth sheets is indispensable, the number of wafers on the grading sheet 31 of either of the front and the back is one or more less. The wafer is mounted in a manner. In summary, in the last three classified sheets 31, one wafer containing the largest specified number (here, 10,000) is allocated to each of the three classified sheets 31.
根據上述構成，以下說明其動作。 According to the above configuration, the operation will be described below.
圖5係用以說明圖1之晶片分類裝置中之控制部之動作之流程圖。 Fig. 5 is a flow chart for explaining the operation of the control unit in the wafer sorting apparatus of Fig. 1.
如圖5所示，以對應於晶圓上之晶片位址之方式將例如光特性檢查或電性檢查中之分級資訊記憶於完成級別分類之資料庫95內。 As shown in FIG. 5, the hierarchical information in, for example, the optical characteristic inspection or the electrical inspection is stored in the database 95 of the completion level classification in a manner corresponding to the wafer address on the wafer.
首先，於步驟S1中，分類數量管理最佳化運算機構921進行分類數量管理最佳化運算處理。即，對分類機所輸出之數量以不產生較少之薄片之方式，根據晶圓地圖上之測試結果計算最佳之分類輸出晶片數量，而實現無損耗之分類輸出。總之，以不產生最小規定數量(此處為例如1000個)以下之分級薄片31之方式，根據同一級別之晶片總數，事先計算求出相當於分級薄片片數之輸出數量。 First, in step S1, the classification quantity management optimization operation unit 921 performs classification quantity management optimization calculation processing. That is, the number of outputs outputted by the sorter is calculated according to the test result on the wafer map in a manner that does not generate a small number of slices, and the lossless classification output is realized. In short, the number of outputs corresponding to the number of classified sheets is calculated in advance based on the total number of wafers of the same level so as not to generate the minimum number of sheets (here, for example, 1000).
具體而言，在批次單位(晶圓12片)中級別B之晶片數量為10999個之情形時，以例如第1片分級薄片31上搭載之晶片數量為5999個，第2片分級薄片31上搭載之晶片數量為5000個之方式，於2片分級薄片31上分配晶片數量。藉此，藉由製作2片為輸出數量(1000個以上)之分級薄片31，可不產生最小規定數量以下之分級薄片31而不會出現庫存。 Specifically, in the case where the number of wafers of the level B in the batch unit (12 wafers) is 10,999, for example, the number of wafers mounted on the first sheet-like sheet 31 is 5,999, and the second sheet of the sheet is 31. The number of wafers to be loaded is 5,000, and the number of wafers is distributed on the two grading sheets 31. Thereby, by making two pieces of the gradation sheet 31 of the output quantity (1000 or more), it is possible to produce the gradation sheet 31 of the minimum specified number or less without occurrence of stock.
繼而，在步驟S2中分類機構923對光特性檢查或電性檢查中之每個級別進行分類處理。即，基於來自完成級別分類之資料庫95之每個級別之晶片位址，而自供給平台2上之供給薄片上之切割晶圓中選擇 同一級別之晶片，且按序排列移載至其他排列平台3上之分級薄片31上。 Then, in step S2, the sorting mechanism 923 performs classification processing on each of the light characteristic inspection or the electrical inspection. That is, based on the wafer address of each level from the database 95 of the completion level classification, the selection of the dicing wafer on the supply sheet on the supply platform 2 is selected. The wafers of the same level are transferred to the grading sheets 31 on the other aligning platforms 3 in order.
接著，在步驟S3中進行輸出處理。即，因於分級薄片31上晶片數達到最大規定數量，或在末級薄片及末級薄片前一個分級薄片31上可確保最小規定數量(此處為1000個)以上之晶片之輸出數量，故不會變為庫存，而皆可進行輸出。 Next, the output processing is performed in step S3. That is, since the number of wafers on the grading sheet 31 reaches the maximum prescribed number, or the output quantity of the minimum number of wafers (here, 1000) or more is ensured on the grading sheet 31 of the final sheet and the last sheet, It does not become inventory, but can be output.
其後，於步驟S4中判定是否已完成全部處理，若於步驟S4中完成全部處理(YES)，則結束處理。又，若未於步驟S4中完成全部處理(NO)，則此後返回至步驟S1，而過渡至下一次分類數量管理最佳化運算處理。 Thereafter, it is determined in step S4 whether or not all processing has been completed. If all processing is completed in step S4 (YES), the processing is terminated. Moreover, if all the processing (NO) is not completed in step S4, the process returns to step S1 and transitions to the next classification quantity management optimization processing.
總之，晶片分類方法具有：分類數量管理運算步驟，其係分類數量管理運算機構921以關於輸出之晶片數量不產生與最小基準數相比更少數之薄片之方式，進行根據特性資料而分配分類輸出數量作為每個級別之分類數量之運算；及分類步驟，其係分類機構923基於運算出之該分類輸出數量來控制分類處理。 In summary, the wafer sorting method has a sorting quantity management operation step of assigning a sorted output according to the characteristic data in such a manner that the number of output wafers does not generate a smaller number of sheets than the minimum reference number. The number is calculated as the number of classifications for each level; and the classification step is performed by the classification mechanism 923 to control the classification processing based on the calculated number of the classification outputs.
如上所述，若根據本實施形態1，則具有：分類數量管理運算機構921，其係以關於輸出之晶片數量不產生與最小基準數相比更少數之薄片之方式，進行根據特性資料而分配分類輸出數量作為每個級別之分類數量之運算；及分類機構923，其係基於運算出之該分類輸出數量而控制分類處理。 As described above, according to the first embodiment, the classification quantity management arithmetic unit 921 performs distribution based on the characteristic data so that the number of wafers to be output does not generate a smaller number than the minimum reference number. The classification output quantity is calculated as the number of classifications of each level; and the classification mechanism 923 controls the classification processing based on the calculated output quantity of the classification.
藉此，於開始分類處理前，以不產生不滿最小規定數量之分級薄片31之方式，根據同一級別之晶片總數而以不同級別計算輸出數量(分類數/分級薄片)。 Thereby, before the classification process is started, the output quantity (category number/classification sheet) is calculated at different levels according to the total number of wafers of the same level in a manner that does not generate the minimum prescribed number of the gradation sheets 31.
因此，由於基於以不產生使輸出之晶片數量與最小基準數相比更少數之薄片之方式，根據特性資料而分配分類輸出數量作為每個級別之分類數量之運算結果來控制分類處理，故不會變為庫存，不必如 先前般進行庫存之再編成，從而可防止由再編成所致之晶片移載時產生之晶片損傷。 Therefore, since the classification processing is controlled based on the characteristic data, the classification output quantity is assigned as the calculation result of the classification quantity of each level, so that the classification processing is not performed, so that the number of wafers to be outputted is not generated as compared with the minimum reference number. Will become stock, not as The inventory is re-formed as before, thereby preventing wafer damage caused by wafer transfer caused by re-programming.
再者，因可防止持續儲存庫存，故可改善產出量，且可削減庫存管理費(工時)。 Furthermore, since the stock can be prevented from being continuously stored, the output can be improved, and the inventory management fee (hours) can be reduced.
圖6係本發明之實施形態2之晶片分類裝置之晶片分類控制硬體構成圖。另，對與圖1及圖2之構成構件發揮相同作用效果之構成構件標註同一符號加以說明。 Fig. 6 is a view showing a hardware configuration of a wafer sorting control of the wafer sorting apparatus according to the second embodiment of the present invention. It is to be noted that the same components as those of the components of FIGS. 1 and 2 are denoted by the same reference numerals.
在圖6中，本實施形態2之晶片分類裝置1A之控制裝置9A具有：鍵盤或滑鼠、及畫面輸入裝置等輸入部90，其係以電腦系統構成，且可輸入各種指令；顯示部91，其係可根據各種輸入指令而於顯示畫面上顯示初始畫面、選擇引導畫面及處理結果畫面等之各種圖像；作為控制部92A之CPU(中央運算處理裝置)，其係進行整體控制；作為臨時記憶機構之RAM93，其係於CPU啟動時作為工作記憶體而進行動作；作為可讀記錄媒體(記憶機構)之ROM94，其係記錄有用以使CPU動作之控制程式及該控制程式所使用之各種資料等且可電腦讀取；及完成級別分類之資料庫95，其係用於以對應於晶圓上之晶片位址之方式，記憶例如光特性檢查或電性檢查中之分級資訊，且可以此為參照；且以自個別地具有晶片固有之特性資料(測試結果；針對晶片位址之級別資訊)之母集合(試驗結果資訊)，分類至規定之每個級別，而將晶片自供給平台2轉移至排列平台3之方式進行控制。另，雖然該資料庫95與RAM93或ROM94另行設置，但資料庫95可位於RAM93內，亦可位於ROM94內。 In Fig. 6, the control device 9A of the wafer sorting apparatus 1A of the second embodiment includes an input unit 90 such as a keyboard, a mouse, and a screen input device, which is constituted by a computer system and can input various commands; the display unit 91 It is possible to display various images such as an initial screen, a selection guide screen, and a processing result screen on the display screen according to various input commands, and the CPU (central processing unit) of the control unit 92A performs overall control; The RAM 93 of the temporary memory mechanism operates as a working memory when the CPU is started up; the ROM 94, which is a readable recording medium (memory mechanism), records a control program for operating the CPU and the control program. Various materials and the like, and computer readable; and a level-of-class database 95 for memorizing hierarchical information such as optical characteristic inspection or electrical inspection in a manner corresponding to the wafer address on the wafer, and This can be referred to as a reference; and the parent collection (test result information) of the characteristic data inherent to the wafer (test result; level information for the wafer address) To a predetermined level of each class, and the wafer is transferred to the arrangement of Embodiment 3 controls the internet from the feed table 2. In addition, although the database 95 is separately provided from the RAM 93 or the ROM 94, the database 95 may be located in the RAM 93 or may be located in the ROM 94.
控制部92A具有：作為分類數量管理運算機構之分類數量管理最佳化運算機構921，其係除來自輸入部90之輸入指令之外，基於自ROM94內讀取至RAM93內之控制程式及該控制程式所使用之各種資 料，以不產生使輸出之晶片數量與作為最小基準數之最小規定數量(此處為1000個)相比更少數之薄片之方式，進行根據晶片之特性資料而分配分類輸出數量作為每個級別之分類數量之運算；裝置設置機構922，其係用以預先計算每個級別所必備之一片或複數片分級薄片31之數量而準備；及作為分類控制機構之分類機構923，其係基於運算出之該分類輸出數量而控制晶片分類處理。 The control unit 92A has a classification number management optimization calculation unit 921 as a classification number management calculation unit, which is based on a control program read from the ROM 94 into the RAM 93 and the control in addition to the input command from the input unit 90. Various resources used by the program The classification output quantity is assigned as each level according to the characteristic data of the wafer so as not to produce a sheet having a smaller number of wafers to be output than the minimum specified number (here, 1000) as the minimum reference number. The operation of the number of classifications; the device setting mechanism 922 is prepared to pre-calculate the number of sheets or a plurality of slice sheets 31 necessary for each level; and the classification mechanism 923 as a classification control mechanism is based on the calculation This classification outputs the number and controls the wafer sorting process.
根據上述構成，以下對其動作加以說明。 According to the above configuration, the operation will be described below.
圖7係用以說明圖6之晶片分類裝置1A之控制部92A之動作之流程圖。 Fig. 7 is a flow chart for explaining the operation of the control unit 92A of the wafer sorting apparatus 1A of Fig. 6.
如圖7所示，以對應於晶圓上之晶片位址之方式將例如光特性檢查或電性檢查中之分級資訊記憶於完成級別分類之資料庫95內。 As shown in FIG. 7, the hierarchical information in, for example, the optical characteristic inspection or the electrical inspection is stored in the database 95 of the completion level classification in a manner corresponding to the wafer address on the wafer.
首先，於步驟S11中，分類數量管理最佳化運算機構921進行分類數量管理最佳化運算處理。即，對分類機所輸出之數量以不產生較少之薄片之方式，根據測試結果預先計算最佳之分類輸出晶片數量，而實現無損耗之分類輸出。總之，以不產生最小規定數量(此處為例如1000個)以下之分級薄片31之方式，根據同一級別之晶片總數，事先計算求出各分級薄片31各自之輸出數量。 First, in step S11, the classification quantity management optimization calculation unit 921 performs classification quantity management optimization calculation processing. That is, the number of outputs outputted by the sorter is pre-calculated based on the test result in a manner that does not generate a small number of slices, thereby achieving a lossless classification output. In short, the number of outputs of each of the classified sheets 31 is calculated in advance based on the total number of wafers of the same level so as not to generate the minimum number of sheets (here, for example, 1000).
具體而言，在批次單位(晶圓12片)中級別B之晶片數量為10999個之情形時，以例如第1片分級薄片31上搭載之晶片數量為5999個，第2片分級薄片31上搭載之晶片數量為5000個之方式，於2片分級薄片31上分配晶片數量。藉此，藉由製作2片為輸出數量(1000個以上)之分級薄片31，可不產生最小規定數量以下之分級薄片31而不會出現庫存。 Specifically, in the case where the number of wafers of the level B in the batch unit (12 wafers) is 10,999, for example, the number of wafers mounted on the first sheet-like sheet 31 is 5,999, and the second sheet of the sheet is 31. The number of wafers to be loaded is 5,000, and the number of wafers is distributed on the two grading sheets 31. Thereby, by making two pieces of the gradation sheet 31 of the output quantity (1000 or more), it is possible to produce the gradation sheet 31 of the minimum specified number or less without occurrence of stock.
繼而，在步驟S12中裝置設置機構922進行裝置設置處理。即，預先計算每個級別所必要之一片或複數片之分級薄片31之數量而準備。 Then, the device setting mechanism 922 performs device setting processing in step S12. That is, the number of the slice sheets 31 or the number of the slice sheets 31 necessary for each level is calculated in advance.
接著，在步驟S13中分類機構923對光特性檢查或電性檢查中之每個級別進行分類處理。即，基於來自完成級別分類之資料庫95之每個級別之晶片位址，而自供給平台2上之供給薄片上之切割晶圓中選擇同一級別之晶片，且按序排列移載至其他排列平台3上之分級薄片31上。 Next, in step S13, the sorting mechanism 923 performs classification processing for each of the light characteristic inspection or the electrical inspection. That is, based on the wafer address of each level from the database 95 of the completion level classification, the same level of wafers are selected from the dicing wafers on the supply sheets on the supply platform 2, and are sequentially transferred to other arrangements. On the grading sheet 31 on the platform 3.
其後，在步驟S14中進行輸出處理。即，因於分級薄片31上晶片數達到最大規定數量，或在末級薄片及末級薄片前一個分級薄片31上可確保最小規定數量(此處為1000個)以上之晶片之輸出數量，故可進行輸出。 Thereafter, the output processing is performed in step S14. That is, since the number of wafers on the grading sheet 31 reaches the maximum prescribed number, or the output quantity of the minimum number of wafers (here, 1000) or more is ensured on the grading sheet 31 of the final sheet and the last sheet, Output is available.
再者，於步驟S15中判定是否已完成全部處理，若於步驟S15中完成全部處理(YES)，則結束處理。又，若未於步驟S15中完成全部處理(NO)，則此後返回至步驟S11，而過渡至下一次分類數量管理最佳化運算處理。 Furthermore, it is determined in step S15 whether or not all processing has been completed. If all the processing is completed in step S15 (YES), the processing is terminated. Moreover, if all the processing (NO) is not completed in step S15, the process returns to step S11, and the transition to the next classification quantity management optimization processing is performed.
總之，晶片分類方法具有：分類數量管理運算步驟，其係分類數量管理運算機構921以關於輸出之晶片數量不產生與最小基準數相比更少數之薄片之方式，進行根據特性資料而分配分類輸出數量作為每個級別之分類數量之運算；裝置設置步驟，其係用以使裝置設置機構922根據母集合之不同級別之全部晶片數量，預先計算進行分類處理之每個級別所必須之分級薄片之數量，而準備必須之分級薄片之數量；及分類步驟，其係分類機構923基於運算出之該分類輸出數量來控制分類處理。 In summary, the wafer sorting method has a sorting quantity management operation step of assigning a sorted output according to the characteristic data in such a manner that the number of output wafers does not generate a smaller number of sheets than the minimum reference number. The number is calculated as the number of classifications of each level; the device setting step is for causing the device setting mechanism 922 to pre-calculate the grading sheets necessary for each level of the classification process according to the total number of wafers of different levels of the parent set. The quantity, and the number of the classified sheets necessary for preparation; and the sorting step, the classification mechanism 923 controls the sorting processing based on the calculated number of the sorted outputs.
如上所述，根據本實施形態2，因基於以不產生使輸出之晶片數量與最小基準數相比更少數之薄片之方式，根據特性資料分配分類輸出數量作為每個級別之分類數量之運算結果來控制分類處理，故不會變為庫存，不必如先前般進行庫存之再編成，而可防止由再編成所致之晶片移載時產生之晶片損傷。 As described above, according to the second embodiment, the classification output quantity is assigned as the operation result of each level based on the characteristic data based on the fact that the number of wafers to be output is not generated to be smaller than the minimum reference number. In order to control the classification process, it does not become inventory, and it is not necessary to re-invent the inventory as before, and the damage of the wafer generated when the wafer is transferred by the re-programming can be prevented.
尤其，在本實施形態2中，若不預備分級薄片31，則不必如先前般必須令晶片分類裝置暫時停止，且補充不足之級別之分級薄片後使晶片分類裝置重新啟動。即，可防止晶片分類裝置之暫時停止及重新啟動。 In particular, in the second embodiment, if the grading sheet 31 is not prepared, it is not necessary to temporarily stop the wafer sorting apparatus as before, and the wafer sorting apparatus is restarted after replenishing the grading sheet of the insufficient level. That is, the temporary stop and restart of the wafer sorting device can be prevented.
如上所述，雖使用本發明較好之實施形態1、2來例示本發明，但本發明不應限定於該實施形態1、2而進行解釋。應理解，本發明應僅依據申請專利範圍而解釋其範圍。本領域技術人員應理解，可根據本發明之具體較好之實施形態1、2之記述，基於本發明之記述及技術常識而實施等價之範圍。本說明書中引用之專利、專利申請案及文獻係與將其內容本身具體地記述於本說明書中一樣，其內容應作為對本說明書之參考而加以援用。 As described above, the present invention is exemplified by the preferred embodiments 1 and 2 of the present invention, but the present invention is not limited to the first and second embodiments. It is to be understood that the invention is to be construed as limited only by the scope of the claims. Those skilled in the art will appreciate that equivalents can be made in accordance with the description of the invention and the common general knowledge of the invention. The patents, patent applications, and documents cited in the specification are the same as the contents of the present specification, and the contents thereof are hereby incorporated by reference.
本發明係在自搭載對晶圓進行切割且黏貼至黏著片上之多個半導體晶片之供給平台上，將半導體晶片按序轉移至例如不同級別之排列平台上之晶片分類裝置及使用其之晶片分類方法、記述有用以使電腦執行該晶片分類方法之各步驟之處理程序之控制程式、以及儲存有該控制程式之可電腦讀取之可讀記憶媒體之領域中，根據晶片固有之特性資料而將分類輸出數量分配為每個級別之分類數量，故不會變為庫存，不必如先前般進行庫存之再編成，而可防止由再編成所致之晶片移載時產生之晶片損傷。 The present invention is directed to a wafer sorting apparatus for sequentially transferring semiconductor wafers onto, for example, different levels of alignment platforms, and wafer sorting using the same, from a supply platform on which a plurality of semiconductor wafers are mounted and bonded to the adhesive sheets. The method, the control program for describing a processing procedure for causing a computer to execute each step of the wafer sorting method, and the computer-readable readable memory medium storing the control program, according to characteristics inherent to the wafer The classification output quantity is assigned to the number of classifications of each level, so it does not become inventory, and it is not necessary to re-invent the inventory as before, and the wafer damage caused by the re-programming of the wafer transfer can be prevented.
1‧‧‧晶片分類裝置 1‧‧‧ wafer sorting device
1A‧‧‧晶片分類裝置 1A‧‧‧ wafer sorting device
2‧‧‧供給平台 2‧‧‧Supply platform
3‧‧‧排列平台 3‧‧‧Alignment platform
5‧‧‧供給側圖像處理部 5‧‧‧Supply side image processing unit
6‧‧‧排列側圖像處理部 6‧‧‧Arrangement side image processing unit
7‧‧‧卸載機部 7‧‧‧Unloading machine department
8‧‧‧卸載機取出機械臂 8‧‧‧Unloader removes the arm
9‧‧‧控制裝置 9‧‧‧Control device
21‧‧‧切割晶圓 21‧‧‧Cut wafer
31‧‧‧分級薄片 31‧‧‧Grade
41‧‧‧夾頭 41‧‧‧ chuck
91‧‧‧顯示部 91‧‧‧Display Department
Claims (13)
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| JP2012103500 | 2012-04-27 |
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| TWI601224B TWI601224B (en) | 2017-10-01 |
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| JP (1) | JP5941982B2 (en) |
| CN (1) | CN104254911B (en) |
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| WO (1) | WO2013161173A1 (en) |
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| WO2018163389A1 (en) * | 2017-03-09 | 2018-09-13 | 株式会社Ｆｕｊｉ | Wafer feed device |
| CN110366772B (en) * | 2017-03-09 | 2023-06-23 | 株式会社富士 | Component mounting machine |
| CN109830447B (en) * | 2019-01-17 | 2020-11-27 | 深圳赛意法微电子有限公司 | Semiconductor wafer chip sorting method, semiconductor product packaging method and semiconductor product packaging system |
| CN112612660B (en) * | 2020-12-16 | 2024-02-13 | 海光信息技术股份有限公司 | Specification information database creation method, chip selection method, device and system |
| CN113387167B (en) * | 2021-06-18 | 2023-04-28 | 上海金东唐科技有限公司 | Laser chip processing method and device and electronic equipment |
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| JPH01172536A (en) * | 1987-12-25 | 1989-07-07 | Daihatsu Motor Co Ltd | Heat insulating and heat-resistant ceramic porous body conjugate metallic material |
| JPH04343485A (en) * | 1991-05-21 | 1992-11-30 | Dowa Mining Co Ltd | Semiconductor pellet sortor |
| JPH0936203A (en) * | 1995-07-20 | 1997-02-07 | Canon Inc | Transfer body device and its control method |
| JPH10144741A (en) * | 1996-11-07 | 1998-05-29 | Rohm Co Ltd | Method and device for classifying ability of ic chip |
| JP3605009B2 (en) * | 2000-08-03 | 2004-12-22 | 三洋電機株式会社 | Method for manufacturing semiconductor device |
| AT6405U1 (en) * | 2002-06-05 | 2003-10-27 | Card Casinos Austria Res & Dev | CHIP SORTING DEVICE |
| TW200848722A (en) * | 2007-06-15 | 2008-12-16 | King Yuan Electronics Co Ltd | Automatic optical inspection device |
| JP4931710B2 (en) * | 2007-06-29 | 2012-05-16 | 株式会社リコー | Non-defective chip classification method on wafer, chip quality determination method using the same, chip classification program, chip quality determination program, marking mechanism, and semiconductor device manufacturing method |
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| JP5941982B2 (en) | 2016-06-29 |
| TWI601224B (en) | 2017-10-01 |
| CN104254911B (en) | 2016-07-06 |
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