TW201350902A - Optical system, exposure apparatus and manufacturing method for equipment - Google Patents
Optical system, exposure apparatus and manufacturing method for equipment Download PDFInfo
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- TW201350902A TW201350902A TW102116193A TW102116193A TW201350902A TW 201350902 A TW201350902 A TW 201350902A TW 102116193 A TW102116193 A TW 102116193A TW 102116193 A TW102116193 A TW 102116193A TW 201350902 A TW201350902 A TW 201350902A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/24—Optical objectives specially designed for the purposes specified below for reproducing or copying at short object distances
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/18—Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/24—Optical objectives specially designed for the purposes specified below for reproducing or copying at short object distances
- G02B13/26—Optical objectives specially designed for the purposes specified below for reproducing or copying at short object distances for reproducing with unit magnification
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/0836—Catadioptric systems using more than three curved mirrors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2008—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Lenses (AREA)
Abstract
Description
本發明是有關一種在製造液晶顯示元件、半導體元件時使用的光微影工程中所使用的光學系統、曝光裝置以及使用該曝光裝置製造設備的方法。 The present invention relates to an optical system, an exposure apparatus, and a method of manufacturing an apparatus using the exposure apparatus, which are used in an optical lithography process used in manufacturing a liquid crystal display element and a semiconductor element.
近年來,在個人電腦、電視機等顯示裝置中,正在大量使用液晶顯示基板。藉由使用光微影工程,在玻璃基板上把透明的薄膜電極圖案形成為所希望的形狀來製作液晶顯示基板。為了進行光微影工程,使用投影曝光裝置,該投影曝光裝置在預先描繪所希望的圖案的光罩上照射曝光光,經由投影光學系統,把光罩上的圖案投影到塗佈光抗蝕劑的玻璃基板等基板上,使基板進行曝光。在液晶顯示基板的製造中,使用藉由鏡面投射方式的投影曝光裝置。 In recent years, liquid crystal display substrates have been widely used in display devices such as personal computers and televisions. A liquid crystal display substrate was produced by forming a transparent thin film electrode pattern into a desired shape on a glass substrate by using a photolithography project. In order to perform photolithography, a projection exposure apparatus is used which irradiates exposure light on a mask that draws a desired pattern in advance, and projects a pattern on the mask to a coating photoresist via a projection optical system. The substrate is exposed on a substrate such as a glass substrate. In the manufacture of a liquid crystal display substrate, a projection exposure apparatus by mirror projection is used.
使用圖4,說明在日本特開2006-78631號公報、日本特開2008-89832號公報所揭示的習知之鏡面投射方式的投影曝光裝置。照明光學系統101會將從載置在照明光學系統101內部的高壓水銀燈所發出的光,整形成所希望的形狀,對著描繪圖案的光罩102進行照明。來自照明光學 系統101的光,對光罩102照明之後,入射到容納有投影光學系統的鏡筒103內。入射到鏡筒103內的光由平面反射鏡131以及凹面反射鏡132反射,導向投影光學系統的光瞳的附近。在投影光學系統光瞳的附近,設置有凹凸透鏡133以及凸面反射鏡134。 A conventional projection-projection type projection exposure apparatus disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. 2008-89832. The illumination optical system 101 illuminates the light emitted from the high-pressure mercury lamp placed inside the illumination optical system 101 into a desired shape, and illuminates the mask 102 that draws the pattern. From illumination optics The light of the system 101 is illuminating the reticle 102 and then incident on the lens barrel 103 in which the projection optical system is housed. The light incident into the lens barrel 103 is reflected by the plane mirror 131 and the concave mirror 132, and is guided to the vicinity of the pupil of the projection optical system. A meniscus lens 133 and a convex mirror 134 are provided in the vicinity of the pupil of the projection optical system.
藉由平面反射鏡131以及凹面反射鏡132被反射的光,透過凹凸透鏡133之後,藉由凸面反射鏡134被反射,再次透過凹凸透鏡133。再次透過凹凸透鏡133的光,再次藉由凹面反射鏡132以及平面反射鏡131被反射,到達塗佈感光劑的基板104。在基板104的位置,來自光罩102的透射光以及繞射光產生干擾,成像光罩102的圖案,對基板104進行曝光。光罩102以及板104分別被設置於圖未表示的光罩工件台以及基板工件台,使光罩工件台以及基板工件台邊同步掃描、邊進行曝光,就能夠實現對大畫面的基板104的曝光。 The light reflected by the plane mirror 131 and the concave mirror 132 passes through the meniscus lens 133, is reflected by the convex mirror 134, and passes through the meniscus lens 133 again. The light that has passed through the lenticular lens 133 is again reflected by the concave mirror 132 and the plane mirror 131, and reaches the substrate 104 on which the sensitizer is applied. At the position of the substrate 104, the transmitted light from the reticle 102 and the diffracted light interfere, and the pattern of the reticle 102 is imaged to expose the substrate 104. The mask 102 and the plate 104 are respectively disposed on the mask workpiece stage and the substrate workpiece stage (not shown), and the mask workpiece stage and the substrate workpiece stage are simultaneously scanned and exposed, whereby the substrate 104 of the large screen can be realized. exposure.
近年來,液晶顯示基板日趨大畫面化,為了回應其要求,曝光裝置的曝光區域也擴大起來。如果曝光區域增大,則每單位面積的光量變小,曝光所需要的時間變長,作為曝光裝置的生產率降低。因此,使用多根作為曝光用的光源的輸出為10KW左右的大型水銀燈,達到保持高照度、抑制曝光時間。 In recent years, liquid crystal display substrates have become larger and larger, and in response to the demand, the exposure area of the exposure apparatus has also expanded. When the exposure area is increased, the amount of light per unit area becomes small, the time required for exposure becomes long, and the productivity as an exposure apparatus is lowered. Therefore, a large-sized mercury lamp having an output of about 10 kW as a light source for exposure is used, and high illumination is suppressed and exposure time is suppressed.
由於大型水銀燈的數量大增,在曝光工程中的曝光裝置的投影光學系統的內部,會產生非常高的熱負荷。具體而言,曝光光的一部分會被構成投影光學系統的光學零件 吸收,光學零件會蓄熱,該熱會再度被釋放到鏡筒內,藉此光學零件以及光學零件周圍的氣體的溫度會上升。如果光學零件以及光學零件周圍的氣體的溫度上升的話,在光學零件的表面附近會因氣體的對流產生氣體的擺動,且會產生通過擺動之氣體的光線的前進路徑的偏移(像的擺動)。進而,溫度上升的氣體,會蓄積在搭載著投影光學系統的鏡筒內的上部,鏡筒內部的氣體會在鉛直方向成為具有溫度梯度的狀態。 Due to the large increase in the number of large-scale mercury lamps, a very high thermal load is generated inside the projection optical system of the exposure apparatus in the exposure engineering. Specifically, a part of the exposure light is formed as an optical part of the projection optical system. Absorbing, the optical components accumulate heat, which is again released into the lens barrel, whereby the temperature of the optical components and the gas surrounding the optical components rises. If the temperature of the gas around the optical component and the optical component rises, the gas oscillates due to the convection of the gas in the vicinity of the surface of the optical component, and the shift of the forward path of the light passing through the oscillating gas (image swing) occurs. . Further, the gas whose temperature rises is accumulated in the upper portion of the lens barrel in which the projection optical system is mounted, and the gas inside the lens barrel has a temperature gradient in the vertical direction.
在圖4所示的鏡面投射方式的曝光裝置中,在成為投影光學系統的光瞳的凸面反射鏡134的附近,聚光度最高,成為高溫。因而,凹凸透鏡133與凸面反射鏡134之間的空間成為高溫,由於空間不是密閉構造,因此從凸面反射鏡134的近旁開始,向上方產生對流的氣流,形成引發像的擺動等。成像性能由於像這樣在曝光工程中產生的投影光學系統內的氣體的溫度梯度、光學零件的表面附近的氣體的擺動而下降被視為問題。 In the mirror projection type exposure apparatus shown in FIG. 4, the condensing degree is the highest in the vicinity of the convex mirror 134 which becomes the pupil of the projection optical system, and it becomes high temperature. Therefore, the space between the meniscus lens 133 and the convex mirror 134 is high, and since the space is not a closed structure, a convective airflow is generated upward from the vicinity of the convex mirror 134, and an oscillating motion of the image is formed. The imaging performance is considered to be a problem due to the temperature gradient of the gas in the projection optical system generated in the exposure process and the swing of the gas near the surface of the optical component.
因而,本發明提供一種減低光路的一部分之環境氣體對光路的其他部分帶來的影響的光學系統。 Accordingly, the present invention provides an optical system that reduces the effects of ambient gases of a portion of the optical path on other portions of the optical path.
本發明的第1方面,在於提供一種沿著光路按順序配置:第1光學元件、第2光學元件、第3光學元件以及第4光學元件的光學系統中,在前述第3光學元件與前述第4光學元件之間形成有空間,前述光學系統具備用來分離 前述第1光學元件與前述第2光學元件之間的光路和前述空間的構件。 According to a first aspect of the present invention, in an optical system in which first optical elements, second optical elements, third optical elements, and fourth optical elements are arranged in order along an optical path, the third optical element and the first 4 Space is formed between the optical elements, and the aforementioned optical system is provided for separation An optical path between the first optical element and the second optical element and a member of the space.
本發明的第2方面,在於提供一種把形成在光罩的圖案經過投影光學系統投影到基板,並對前述基板進行曝光的曝光裝置,前述投影光學系統包括前述第1方面的光學系統。 According to a second aspect of the present invention, there is provided an exposure apparatus for projecting a pattern formed on a photomask to a substrate through a projection optical system and exposing the substrate, wherein the projection optical system includes the optical system according to the first aspect.
本發明的第3方面,在於提供一種製造設備的方法,前述方法包括:使用前述第2方面的曝光裝置對基板進行曝光;使前述已曝光的基板進行顯影;和加工前述已顯影的基板來製造前述設備。 A third aspect of the present invention provides a method of manufacturing a device, comprising: exposing a substrate using the exposure apparatus of the second aspect; developing the exposed substrate; and processing the developed substrate to manufacture The aforementioned equipment.
本發明的進一步的特徵,藉由參照所附圖面,由以下所舉的例示的實施形態的說明即可明白。 Further features of the present invention will become apparent from the following description of exemplary embodiments.
1‧‧‧照明光學系統 1‧‧‧Lighting optical system
2‧‧‧光罩 2‧‧‧Photomask
3‧‧‧投影光學系 3‧‧‧Projection Optics
4‧‧‧基板(板) 4‧‧‧Substrate (board)
31‧‧‧平面反射鏡(第1光學元件) 31‧‧‧ Planar mirror (first optical element)
32‧‧‧凹面反射鏡(第2光學元件) 32‧‧‧ concave mirror (2nd optical element)
33‧‧‧凹凸透鏡(第3光學元件) 33‧‧‧ lenticular lens (third optical element)
34‧‧‧凸面反射鏡(第4光學元件) 34‧‧‧ convex mirror (fourth optical element)
35‧‧‧鏡筒 35‧‧‧Mirror tube
36‧‧‧光吸收構件 36‧‧‧Light absorbing members
37‧‧‧冷媒用配管 37‧‧‧Condition piping
38‧‧‧配管 38‧‧‧Pipe
39‧‧‧空間 39‧‧‧ Space
圖1是表示本發明的曝光裝置的概略圖。 Fig. 1 is a schematic view showing an exposure apparatus of the present invention.
圖2是表示在圖1中,凸面反射鏡的附近的詳細圖。 Fig. 2 is a detailed view showing the vicinity of a convex mirror in Fig. 1;
圖3是圖1中,由凹面反射鏡32側觀察凸面反射鏡的附近的圖。 Fig. 3 is a view showing the vicinity of a convex mirror viewed from the side of the concave mirror 32 in Fig. 1;
圖4是表示習知的曝光裝置的概略圖。 4 is a schematic view showing a conventional exposure apparatus.
以下,有關本發明的曝光裝置的實施形態,使用圖1做說明。對光罩2進行照明的照明光學系統1,在內部包 括:光源的高壓水銀燈、橢圓鏡、整形光學系統、ND濾光片、光學積分器、聚光透鏡等光學零件。橢圓鏡會將由高壓水銀燈所發出的光,朝特定方向聚光。整形光學系統會將來自橢圓鏡的光分佈,整形成所希望的形狀。ND濾光片是用來調節光強度。光學積分器,會使得光罩兩面的光強度均均的分佈。聚光透鏡,是對通過光學積分器的光進行聚光。 Hereinafter, an embodiment of an exposure apparatus according to the present invention will be described with reference to Fig. 1 . Illumination optical system 1 for illuminating the reticle 2, internally packaged Including: high-pressure mercury lamp, elliptical mirror, shaping optical system, ND filter, optical integrator, concentrating lens and other optical components. The elliptical mirror concentrates the light emitted by the high-pressure mercury lamp in a specific direction. The shaping optics distributes the light from the elliptical mirror into a desired shape. The ND filter is used to adjust the light intensity. The optical integrator will distribute the light intensity on both sides of the mask. A concentrating lens is a condensing light that passes through an optical integrator.
由照明光學系統所射出的曝光光,會照射到已描繪應轉印的圖案的光罩(也稱為底片)2。透過光罩2的光,會經由投影光學系統3到達基板(板)4上,把光罩2上的圖案轉印到板4上,而對板4進行曝光。在板4上預先塗佈著感光劑,藉由在曝光前後實施適當的處理,就能夠在板4上製造出所希望的圖案。 The exposure light emitted by the illumination optical system is irradiated to a photomask (also referred to as a negative film) 2 on which a pattern to be transferred is drawn. The light transmitted through the reticle 2 reaches the substrate (plate) 4 via the projection optical system 3, and the pattern on the reticle 2 is transferred onto the plate 4 to expose the plate 4. A photosensitive agent is applied to the plate 4 in advance, and a desired pattern can be produced on the plate 4 by performing appropriate treatment before and after the exposure.
在投影光學系統3內,沿著從光罩2至板4的光路,按順序配置:平面反射鏡(第1光學元件)31、凹面反射鏡(第2光學元件)32、凹凸透鏡(第3光學元件)33、凸面反射鏡(第4光學元件)34。在本實施形態中,經過光罩2入射到投影光學系統3的光,會因平面反射鏡31被折射,且利用凹面反射鏡32被反射之後,透過凹凸透鏡33,入射到凸面反射鏡34。利用凸面反射鏡34被反射的光,再次透過凹凸透鏡33之後,會再次利用凹面反射鏡32、平面反射鏡31被反射,入射到板4。平面反射鏡31、凹面反射鏡32、凹凸透鏡33以及凸面反射鏡34,是構成沿著光路按順序配置:第1光學元件、第2光學元件 、第3光學元件以及第4光學元件的光學系統。 In the projection optical system 3, the optical path from the mask 2 to the plate 4 is arranged in order: a plane mirror (first optical element) 31, a concave mirror (second optical element) 32, and a meniscus lens (third Optical element 33, convex mirror (fourth optical element) 34. In the present embodiment, the light incident on the projection optical system 3 through the mask 2 is refracted by the plane mirror 31, is reflected by the concave mirror 32, passes through the meniscus lens 33, and enters the convex mirror 34. The light reflected by the convex mirror 34 is again transmitted through the meniscus lens 33, and is again reflected by the concave mirror 32 and the plane mirror 31, and is incident on the plate 4. The plane mirror 31, the concave mirror 32, the meniscus lens 33, and the convex mirror 34 are arranged in order along the optical path: the first optical element and the second optical element The optical system of the third optical element and the fourth optical element.
在本實施方式所介紹的鏡面投射方式的曝光裝置的投影光學系統3中,在光路的上游側配置有凹凸透鏡33,在光路的下游側配置有凸面反射鏡34。在鏡面投射方式的曝光裝置的投影光學系統3中,在設計上把凹凸透鏡33和凸面反射鏡34被配置在投影光學系統3的光瞳的附近。由於凸面反射鏡34的附近,聚光度最高,因此發熱量也多。在凹凸透鏡33與凸面反射鏡34之間形成空間39,以使得藉由照射到凸面反射鏡34的表面的反射膜而由反射膜所產生的熱難以傳遞到凹凸透鏡33。凹凸透鏡33和凸面反射鏡34是利用鏡筒35被固定,空間39是利月凹凸透鏡33、凸面反射鏡34以及鏡筒35被包圍。因而,藉由在反射膜部所產生的熱而昇溫的空間39中的氣體,並不會從空間39釋出,就不會使其在平面反射鏡31與凹面反射鏡32之間的光路產生氣體的擺動。鏡筒35,是構成來用分離平面反射鏡(第1光學元件)31與凹面反射鏡(第2光學元件)之間的光路和空間39的構件。 In the projection optical system 3 of the mirror projection type exposure apparatus described in the present embodiment, the meniscus lens 33 is disposed on the upstream side of the optical path, and the convex mirror 34 is disposed on the downstream side of the optical path. In the projection optical system 3 of the mirror projection type exposure apparatus, the meniscus lens 33 and the convex mirror 34 are disposed in the vicinity of the pupil of the projection optical system 3. Since the convexity of the convex mirror 34 is the highest, the amount of heat generation is also large. A space 39 is formed between the meniscus lens 33 and the convex mirror 34 so that heat generated by the reflection film by the reflection film irradiated onto the surface of the convex mirror 34 is hardly transmitted to the meniscus lens 33. The meniscus lens 33 and the convex mirror 34 are fixed by the lens barrel 35, and the space 39 is surrounded by the lunar meniscus lens 33, the convex mirror 34, and the lens barrel 35. Therefore, the gas in the space 39 which is heated by the heat generated by the reflecting film portion is not released from the space 39, and the optical path between the plane mirror 31 and the concave mirror 32 is not generated. The swing of the gas. The lens barrel 35 is a member that constitutes an optical path and a space 39 between the separation plane mirror (first optical element) 31 and the concave mirror (second optical element).
鏡筒35的材質,是選擇隔熱性優的材料,使熱難以傳遞到外部。在隔著凸面反射鏡34而與凹凸透鏡33相反側(光路的下游側),中介著空間而配置著光吸收構件36。光吸收構件36,是使吸收沒在凸面反射鏡34的表面反射,而透過凸面反射鏡34的光。在凸面反射鏡34與光吸收構件36之間介設著空間,是為了吸收凸面反射鏡34與光吸收構件36的熱膨脹係數之差,並且使得光吸收構 件36所產生的熱難以傳遞到凸面反射鏡34。 The material of the lens barrel 35 is a material that is excellent in heat insulation, and it is difficult to transmit heat to the outside. The light absorbing member 36 is disposed on the side opposite to the meniscus lens 33 (the downstream side of the optical path) via the convex mirror 34 with a space interposed therebetween. The light absorbing member 36 is light that is transmitted through the surface of the convex mirror 34 and transmitted through the convex mirror 34. A space is interposed between the convex mirror 34 and the light absorbing member 36 in order to absorb the difference in thermal expansion coefficient between the convex mirror 34 and the light absorbing member 36, and to make the light absorbing structure The heat generated by the member 36 is difficult to transfer to the convex mirror 34.
在凸面反射鏡34的反射面,為了反射光而製造有反射膜。該反射膜的材質與鋁等金屬相比最好是電介體。選擇電介體的理由是因為與金屬膜相比,電介體的膜照射光時,光吸收度小。在作為反射膜的材質選擇電介體的情況下,與金屬膜相比較,由於不在凸面反射鏡34的光反射面反射,而直接透過的光量增加,因此用來固定凸面反射鏡34的鏡筒35有可能發熱。其結果,凸面反射鏡34附近的溫度上升,在投影光學系統3內部的光路中產生氣體的擺動,使投影光學系統3的成像性能下降。 A reflection film is formed on the reflection surface of the convex mirror 34 in order to reflect light. The material of the reflective film is preferably a dielectric material compared to a metal such as aluminum. The reason why the dielectric is selected is that the light absorption is small when the film of the dielectric is irradiated with light compared with the metal film. When a dielectric is selected as the material of the reflective film, the lens for fixing the convex mirror 34 is fixed because the amount of light directly transmitted is not reflected by the light reflecting surface of the convex mirror 34 as compared with the metal film. 35 may have fever. As a result, the temperature in the vicinity of the convex mirror 34 rises, and the oscillation of the gas occurs in the optical path inside the projection optical system 3, and the imaging performance of the projection optical system 3 is lowered.
於圖2表示凸面反射鏡34的附近的放大圖。在光吸收構件36連接有冷媒用配管37,該冷媒用配管37包括:對光吸收構件36的內部供給溫度受控制的液體(冷媒)的液體供給部和從內部排出液體的液體排出部,且為了防止光吸收構件36過熱,可使冷媒沿著圖2中的箭頭方向流動。冷媒用配管37被引回到投影光學系統3的外部,使用圖未表示的冷凍機等,邊把冷媒的溫度控制為恒定、邊使其循環。冷媒可以經常性循環,也可以僅在光吸收構件36的溫度高於某個臨界值的情況下使其循環。藉由設置冷媒用配管37,就能將光吸收構件36的溫度上升抑制在最小限度,將能夠抑制投影光學系統3的內部的光路中的氣體的擺動。光吸收構件36使用具有高熱傳導率的物質,例如:鋁。流經冷媒用配管37的冷媒,例如為氟系的惰性液體。 An enlarged view of the vicinity of the convex mirror 34 is shown in Fig. 2 . In the light absorbing member 36, a refrigerant pipe 37 is provided, and the refrigerant pipe 37 includes a liquid supply unit that supplies a liquid (refrigerant) whose temperature is controlled to the inside of the light absorbing member 36, and a liquid discharge unit that discharges the liquid from the inside, and In order to prevent the light absorbing member 36 from being overheated, the refrigerant may be caused to flow in the direction of the arrow in FIG. The refrigerant piping 37 is led back to the outside of the projection optical system 3, and is circulated while controlling the temperature of the refrigerant to be constant using a refrigerator or the like not shown. The refrigerant may be circulated frequently, or may be circulated only when the temperature of the light absorbing member 36 is higher than a certain critical value. By providing the refrigerant pipe 37, the temperature rise of the light absorbing member 36 can be minimized, and the oscillation of the gas in the optical path inside the projection optical system 3 can be suppressed. The light absorbing member 36 uses a substance having a high thermal conductivity such as aluminum. The refrigerant flowing through the refrigerant piping 37 is, for example, a fluorine-based inert liquid.
接著,使用圖3,針對凹凸透鏡33與凸面反射鏡34之間的空間39的冷卻方法做記載。圖3是從凹面反射鏡32側觀察空間39以及鏡筒35的剖面圖。如果持續曝光,凹凸透鏡33與凸面反射鏡34之間的空間39的溫度就會逐漸上升。其結果,在空間39內產生溫度分佈,發生像偏、像散等。為了防止發生像偏、像散等,在鏡筒35上連接有配管38,能夠經由配管38,對凹凸透鏡33與凸面反射鏡34之間的空間39,輸送溫度被控制的空氣、氮氣等氣體。配管38是由投影光學系統3的外部被引回。 藉由調節氣體的流量,或者調節對鏡筒35內部的氣體之噴射口的形狀,就能有效的進行凹凸透鏡33與凸面反射鏡34之間的空間39的溫度管理。圖3中的箭頭是模式表示氣體有效流經凹凸透鏡33與凸面反射鏡34之間的空間39的狀況。流經配管38的氣體,例如為空氣、惰性氣體。 Next, a method of cooling the space 39 between the meniscus lens 33 and the convex mirror 34 will be described with reference to FIG. 3 is a cross-sectional view of the space 39 and the lens barrel 35 viewed from the concave mirror 32 side. If the exposure is continued, the temperature of the space 39 between the meniscus lens 33 and the convex mirror 34 gradually rises. As a result, a temperature distribution occurs in the space 39, and image shift, astigmatism, and the like occur. In order to prevent occurrence of image shift, astigmatism, and the like, a pipe 38 is connected to the lens barrel 35, and a gas such as air or nitrogen gas whose temperature is controlled can be supplied to the space 39 between the meniscus lens 33 and the convex mirror 34 via the pipe 38. . The pipe 38 is led back by the outside of the projection optical system 3. The temperature management of the space 39 between the meniscus lens 33 and the convex mirror 34 can be effectively performed by adjusting the flow rate of the gas or adjusting the shape of the gas ejection port to the inside of the lens barrel 35. The arrow in Fig. 3 is a mode in which the mode indicates that the gas efficiently flows through the space 39 between the meniscus lens 33 and the convex mirror 34. The gas flowing through the pipe 38 is, for example, air or an inert gas.
另外,在圖3的配管38的構造中,將對空間39供給氣體的氣體供給部、從空間39排出氣體的氣體排出部的數量設為一個,但不限於該數量,也可以把氣體供給部、氣體排出部的數量設為多個。另外,氣體的流動為水平方向,但關於這一點,即使為配置在水平方向以外的方向的情況下,當然也能夠得到一定的效果。 In the structure of the pipe 38 of FIG. 3, the number of the gas supply unit that supplies the gas to the space 39 and the gas discharge unit that discharges the gas from the space 39 is one. However, the gas supply unit may be provided without being limited to this number. The number of gas discharge portions is set to be plural. Further, the flow of the gas is in the horizontal direction, but in this case, even when it is disposed in a direction other than the horizontal direction, a certain effect can be obtained.
接著,針對本發明的其中一實施方式的設備(半導體 設備、液晶顯示設備等)的製造方法做說明。在這裏以半導體設備的製造方法為例進行說明。 Next, a device (semiconductor) for one of the embodiments of the present invention The manufacturing method of the device, the liquid crystal display device, etc.) will be explained. Here, a method of manufacturing a semiconductor device will be described as an example.
半導體設備,是藉由經過在基板上製作積體電路的前工程、以得在前工程所製作的基板上的積體電路晶片作為產品而完成的後工程來製造。前工程包括:使用前述的曝光裝置來掃描曝光塗佈感光劑的基板的工程、和使基板顯影的工程。後工程包括:組裝工程(切割、接合)、和封裝工程(密封)。另外,液晶顯示設備,是藉由經過形成透明電極的工程來製造。形成透明電極的工程包括:在蒸鍍透明導電膜的玻璃基板上塗佈感光劑的工程、使用前述的曝光裝置來掃描曝光塗佈感光劑的玻璃基板的工程、和使玻璃基板顯影的工程。若藉由本實施形態的設備製造方法,有關設備的生產性以及品質的至少一方,會比習知技術有利。 The semiconductor device is manufactured by a post-engineering process in which a built-in circuit on a substrate is fabricated on a substrate and an integrated circuit wafer on a substrate produced in the prior art is used as a product. The pre-engineering includes the process of scanning and exposing the substrate on which the sensitizer is applied, and the process of developing the substrate, using the aforementioned exposure apparatus. Post-engineering includes: assembly engineering (cutting, joining), and packaging engineering (sealing). Further, the liquid crystal display device is manufactured by a process of forming a transparent electrode. The process of forming a transparent electrode includes a process of applying a photosensitive agent on a glass substrate on which a transparent conductive film is vapor-deposited, a process of scanning and exposing a glass substrate on which a photosensitive agent is applied by exposure, and a process of developing a glass substrate. According to the apparatus manufacturing method of the present embodiment, at least one of the productivity and quality of the equipment is advantageous over the conventional technology.
本發明雖是與舉例所示的實施方式相關做說明,但應可理解本發明並未被限定於所揭示的例示的實施方式。在接下來的申請專利範圍中,像是構成及機能的所有變形例及等效設計,應獲得最廣泛的解釋。 The present invention has been described with respect to the embodiments shown in the drawings, but it should be understood that the invention is not limited to the illustrated embodiments. In the scope of the following patent application, all variations and equivalent designs, such as composition and function, should be interpreted the broadest.
1‧‧‧照明光學系統 1‧‧‧Lighting optical system
2‧‧‧光罩 2‧‧‧Photomask
3‧‧‧投影光學系 3‧‧‧Projection Optics
4‧‧‧基板(板) 4‧‧‧Substrate (board)
31‧‧‧平面反射鏡(第1光學元件) 31‧‧‧ Planar mirror (first optical element)
32‧‧‧凹面反射鏡(第2光學元件) 32‧‧‧ concave mirror (2nd optical element)
33‧‧‧凹凸透鏡(第3光學元件) 33‧‧‧ lenticular lens (third optical element)
34‧‧‧凸面反射鏡(第4光學元件) 34‧‧‧ convex mirror (fourth optical element)
35‧‧‧鏡筒 35‧‧‧Mirror tube
36‧‧‧光吸收構件 36‧‧‧Light absorbing members
39‧‧‧空間 39‧‧‧ Space
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