TW201350210A - Substrate gluing apparatus - Google Patents
Substrate gluing apparatus Download PDFInfo
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- TW201350210A TW201350210A TW101126032A TW101126032A TW201350210A TW 201350210 A TW201350210 A TW 201350210A TW 101126032 A TW101126032 A TW 101126032A TW 101126032 A TW101126032 A TW 101126032A TW 201350210 A TW201350210 A TW 201350210A
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Abstract
Description
本發明是有關一種基板塗膠設備,且特別是有關一種具有清潔元件的基板塗膠設備。 The present invention relates to a substrate coating apparatus, and more particularly to a substrate coating apparatus having a cleaning element.
一般而言,在液晶面板製程中,液晶面板周圍的連接(bonding)區線路及軟性電路板的接點需藉由塗膠設備覆蓋保護膠,其中保護膠可以例如Tuffy膠。保護膠通常具有絕緣、防潮、防腐蝕與固定等功能,可避免液晶面板周圍的線路與軟性電路板連接於液晶面板的接點受到自然環境或外力的損壞。 Generally, in the process of the liquid crystal panel, the bonding area line around the liquid crystal panel and the contact point of the flexible circuit board need to be covered by the glue coating device, wherein the protective glue can be, for example, Tuffy glue. The protective glue usually has the functions of insulation, moisture proof, anti-corrosion and fixing, and can prevent the connection between the circuit around the liquid crystal panel and the flexible circuit board connected to the liquid crystal panel from being damaged by the natural environment or external force.
由於製作保護膠的材料日新月異,且面板製造商為了提升液晶面板的產能,通常會選用塗佈於液晶面板後可快速硬化的保護膠,以節省製程的時間。然而,硬化快的保護膠會產生許多缺點,舉例來說,硬化快的保護膠容易造成塗膠針頭堵塞,且會隨塗佈的液晶面板數量而累積越來越多的殘膠在塗膠針頭的開口。若未能定時清潔塗膠針頭的殘膠,嚴重的話可能會使塗膠針頭在塗佈液晶面板保護膠時發生路徑偏移、膠量過少與殘膠掉落等狀況,使液晶面板的品質不易控制。 Since the materials for making protective adhesives are changing with each passing day, and in order to increase the productivity of liquid crystal panels, panel manufacturers usually use a protective adhesive that can be quickly hardened after being applied to a liquid crystal panel to save processing time. However, the fast-curing protective glue has many disadvantages. For example, the hard-curing protective glue is liable to cause the glue-coated needle to become clogged, and more and more residual glue accumulates with the number of coated liquid crystal panels in the glue-coated needle. The opening. If the residual glue of the glued needle is not cleaned regularly, serious problems may occur when the glue needle is coated with the liquid crystal panel protective glue, the amount of glue is too small, and the residual glue is dropped, so that the quality of the liquid crystal panel is not easy. control.
為了預防上述情況,操作人員需於每段時間間隔停止塗膠設備,並使用無塵布清潔塗膠針頭的殘膠。如此一來,液晶面板的產能便會降低。另一方面,每一位操作人員清潔塗膠針頭的標準並不相同,使塗膠針頭的品質不易維 持。此外,在塗膠設備重新運轉後,液晶面板可能會被操作人員忘記帶走的異物(例如用來清潔殘膠的無塵布)所損傷。 In order to prevent this, the operator needs to stop the glue application at each interval and use a clean cloth to clean the glue residue of the glue needle. As a result, the productivity of the LCD panel will decrease. On the other hand, the standard for cleaning the glued needles is not the same for every operator, making the quality of the glued needles difficult to maintain. hold. In addition, after the gumming equipment is re-operated, the liquid crystal panel may be damaged by the operator forgetting to take away foreign objects (such as a clean cloth used to clean the residual glue).
本發明之一技術態樣為一種基板塗膠設備。 One aspect of the present invention is a substrate coating apparatus.
根據本發明一實施方式,一種基板塗膠設備包含基板承載座、塗膠元件與清潔元件。基板承載座用以承載一基板。塗膠元件可移動地往返於基板與一閒置區。清潔元件可移動地位於基板與閒置區之間。清潔元件包含毛刷。毛刷位於塗膠元件往返於基板與閒置區的路徑上,用以接觸塗膠元件。 According to an embodiment of the present invention, a substrate coating apparatus includes a substrate carrier, a glue component, and a cleaning component. The substrate carrier is used to carry a substrate. The glue component moves movably to and from the substrate and an idle area. The cleaning element is movably located between the substrate and the free area. The cleaning element contains a brush. The brush is located on the path of the glue component to and from the substrate and the idle area for contacting the glue component.
在本發明一實施方式中,其中上述清潔元件更包含毛刷固定座承載毛刷,且毛刷固定座與毛刷分別具有相互耦合的固定元件,使毛刷可拆卸地固定於毛刷固定座上。 In an embodiment of the invention, the cleaning element further comprises a brush holder bearing brush, and the brush holder and the brush respectively have fastening elements coupled to each other, so that the brush is detachably fixed to the brush. On the seat.
在本發明一實施方式中,其中上述基板塗膠設備更包含軌道平行於基板承載座的邊緣且耦合於毛刷固定座。 In an embodiment of the invention, the substrate coating device further includes a track parallel to an edge of the substrate carrier and coupled to the brush holder.
在本發明一實施方式中,其中上述基板塗膠設備更包含馬達電性連接於毛刷固定座。 In an embodiment of the invention, the substrate coating device further includes a motor electrically connected to the brush holder.
在本發明一實施方式中,其中上述基板塗膠設備更包含控制器電性連接於馬達,使毛刷固定座每經過一時間間隔於軌道上移動一距離。 In an embodiment of the invention, the substrate coating device further includes a controller electrically connected to the motor, so that the brush holder moves a distance on the track every time interval.
在本發明一實施方式中,其中上述軌道實質垂直於塗膠元件往返於基板與閒置區的路徑。 In an embodiment of the invention, the track is substantially perpendicular to a path of the glue element to and from the substrate and the idle area.
在本發明一實施方式中,其中上述塗膠元件包含本體 與入膠管。本體具有一容置空間。入膠管連接於本體且連通於容置空間,以提供一膠體。 In an embodiment of the invention, wherein the glue component comprises a body With the hose. The body has an accommodation space. The rubber tube is connected to the body and communicates with the accommodating space to provide a gel.
在本發明一實施方式中,其中上述本體具有一開口連通於容置空間,且塗膠元件更包含加壓管連接於本體且連通於容置空間,用以加壓於位在容置空間中的膠體,使膠體從該開口流出。 In an embodiment of the present invention, the body has an opening communicating with the accommodating space, and the squeegee member further includes a pressing tube connected to the body and communicating with the accommodating space for pressurizing in the accommodating space. The colloid causes the colloid to flow out of the opening.
在本發明一實施方式中,其中上述加壓管連接於本體的位置與開口之間的距離大於入膠管接於本體的位置與開口之間的距離。 In an embodiment of the invention, the distance between the position where the pressing tube is connected to the body and the opening is greater than the distance between the position where the rubber tube is connected to the body and the opening.
在本發明一實施方式中,其中上述基板承載座更包含複數個吸盤。 In an embodiment of the invention, the substrate carrier further includes a plurality of suction cups.
在本發明上述實施方式中,由於清潔元件的毛刷位於塗膠元件往返於基板與閒置區的路徑上,因此當塗膠元件往返於基板與閒置區時,清潔元件的毛刷可接觸塗膠元件,使位於塗膠元件上的殘膠可被毛刷清除。此外,由於清潔元件可移動地位於基板與閒置區之間,當一部分的毛刷因清潔塗膠元件而附著有殘膠時,毛刷固定座可於軌道上移動一距離,使清潔元件再次往返於基板與閒置區的路徑上時,會接觸乾淨的部分毛刷,而不會接觸附著有殘膠的部分毛刷。 In the above embodiment of the present invention, since the brush of the cleaning component is located in the path of the adhesive component to and from the substrate and the idle area, when the glue component is to and from the substrate and the idle area, the brush of the cleaning component can contact the glue. The component allows the residual glue on the adhesive component to be removed by the brush. In addition, since the cleaning component is movably located between the substrate and the idle area, when a part of the brush is attached with the residual glue due to the cleaning of the adhesive component, the brush holder can be moved a distance on the track to make the cleaning component re-trip When the substrate and the idle area are in the path, a clean part of the brush is touched without touching the part of the brush to which the residual glue is attached.
也就是說,塗膠元件不會因塗佈膠體於基板後而累積殘膠,因此不需定時停止基板塗膠設備來清潔塗膠元件,可提升基板的產能。此外,塗膠元件於往返於基板與閒置區時會接觸毛刷,因此不易在塗部基板時,受殘膠的影響而發生路徑偏移、膠量過少與殘膠掉落的狀況,使基板的 品質可被控制。 That is to say, the glue-coated component does not accumulate residual glue after coating the glue on the substrate, so it is not necessary to stop the substrate coating device to clean the glue-coated component at a time, thereby improving the productivity of the substrate. In addition, the glue-coated component contacts the brush when going back and forth between the substrate and the idle area, so that it is difficult to cause a path shift, a small amount of glue, and a residual glue to fall under the influence of the residual glue when the substrate is coated, so that the substrate of Quality can be controlled.
以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
第1圖繪示根據本發明一實施方式之基板塗膠設備100與一基板200的立體圖。如圖所示,基板塗膠設備100包含基板承載座110、塗膠元件120與清潔元件130。基板承載座110用以承載基板200。塗膠元件120可移動地往返於基板200與閒置(Idle)區300。在本文中,閒置區300意指塗膠元件120將其內的膠體塗佈於基板200後所回到的區域,以等待下一個基板200的塗膠製程。此外,清潔元件130可移動地位於基板200與閒置區300之間。清潔元件130包含毛刷132,且毛刷132位於塗膠元件120往返於基板200與閒置區300的路徑上,當塗膠元件120往返於基板200與閒置區300時,毛刷132可接觸塗膠元件120。 1 is a perspective view of a substrate coating apparatus 100 and a substrate 200 according to an embodiment of the present invention. As shown, the substrate gluing device 100 includes a substrate carrier 110, a gumming component 120, and a cleaning component 130. The substrate carrier 110 is used to carry the substrate 200. The gumming element 120 is movably reciprocated to and from the substrate 200 and the Idle zone 300. Herein, the idle area 300 means the area returned by the glue component 120 after the glue inside thereof is applied to the substrate 200 to wait for the glue coating process of the next substrate 200. Further, the cleaning element 130 is movably located between the substrate 200 and the free area 300. The cleaning element 130 includes a brush 132, and the brush 132 is located on the path of the adhesive element 120 to and from the substrate 200 and the idle area 300. When the glue element 120 is reciprocated to and from the substrate 200 and the idle area 300, the brush 132 can be contact coated. Glue element 120.
在本實施方式中,清潔元件130的移動方向大致平行於基板200的邊緣212與基板承載座110的邊緣112,但並不以限制本發明。此外,基板200可以為液晶面板,塗膠元件120可從閒置區300移至基板200上並將膠體塗佈於 基板200周圍的連接(bonding)區線路及軟性電路板210的接點。 In the present embodiment, the moving direction of the cleaning element 130 is substantially parallel to the edge 212 of the substrate 200 and the edge 112 of the substrate carrier 110, but is not intended to limit the invention. In addition, the substrate 200 may be a liquid crystal panel, and the glue component 120 may be moved from the idle area 300 to the substrate 200 and coated with the colloid. A bonding area line around the substrate 200 and a contact of the flexible circuit board 210.
第2圖繪示第1圖之塗膠元件120的前視圖,同時參閱第1圖與第2圖,塗膠元件120包含本體122、入膠管124與加壓管128。本體122具有一容置空間123。入膠管124連接於本體122且連通於容置空間123,可以提供膠體125。本體122具有一開口126連通於容置空間123。加壓管128連接於本體122且連通於容置空間123,可加壓於位在容置空間123中的膠體125,使膠體125從開口126流出。 2 is a front view of the glue component 120 of FIG. 1 . Referring to FIGS. 1 and 2 , the glue component 120 includes a body 122 , a rubber tube 124 and a pressure tube 128 . The body 122 has an accommodating space 123. The rubber tube 124 is connected to the body 122 and communicates with the accommodating space 123, and a colloid 125 can be provided. The body 122 has an opening 126 communicating with the accommodating space 123. The pressing tube 128 is connected to the body 122 and communicates with the accommodating space 123 and can be pressurized to the colloid 125 located in the accommodating space 123 to cause the colloid 125 to flow out from the opening 126.
此外,本體122可連接至傳動裝置(未繪示於圖)以往返於基板200與閒置區300之間。入膠管124可連接至膠體儲存槽(未繪示於圖)。加壓管128可連接至進氣幫浦(未繪示於圖)。加壓管128連接於本體122的位置與開口126之間的距離D1大於入膠管124接於本體122的位置與開口126之間的距離D2,因此當加壓管128加壓時,可迫使膠體125從開口126流出。 In addition, the body 122 can be coupled to a transmission (not shown) to travel between the substrate 200 and the free area 300. The hose 124 can be connected to a colloid storage tank (not shown). The pressurized tube 128 can be connected to an air intake pump (not shown). The distance D1 between the position where the pressing tube 128 is connected to the body 122 and the opening 126 is greater than the distance D2 between the position where the inlet tube 124 is connected to the body 122 and the opening 126, so that when the pressing tube 128 is pressurized, the colloid can be forced. 125 flows out of the opening 126.
在本實施方式中,膠體125可以為例如Tuffy膠的保護膠,具有絕緣、防潮、防腐蝕與固定的功能,可避免基板200周圍的線路與軟性電路板210連接於基板200的接點受到自然環境或外力的損壞。開口126的孔徑R可以介於0.3至0.7mm之間,塗膠元件120的材質可以包含聚四氟乙烯(鐵氟龍),但並不以此為限。 In the present embodiment, the colloid 125 may be a protective glue such as Tuffy glue, which has the functions of insulation, moisture proof, anti-corrosion and fixation, and can avoid the natural connection between the circuit around the substrate 200 and the flexible circuit board 210 connected to the substrate 200. Damage to the environment or external forces. The diameter R of the opening 126 may be between 0.3 and 0.7 mm, and the material of the rubberizing component 120 may include polytetrafluoroethylene (Teflon), but is not limited thereto.
第3圖繪示第1圖之清潔元件130的側視圖,同時參閱第1圖與第3圖,清潔元件130包含毛刷固定座134承 載毛刷132,且毛刷固定座134與毛刷132分別具有相互耦合的固定元件136,使毛刷132可拆卸地固定於毛刷固定座134上。其中,固定元件136可以為相互耦合的鈕扣、卡合元件或魔鬼氈,但不限於此。 3 is a side view of the cleaning element 130 of FIG. 1 , and referring to FIGS. 1 and 3 , the cleaning element 130 includes a brush holder 134 The brush holder 132 and the brush holder 134 and the brush 132 respectively have fastening members 136 coupled to each other, so that the brush 132 is detachably fixed to the brush holder 134. The fixing member 136 may be a button, a snap member or a devil felt that are coupled to each other, but is not limited thereto.
在本實施方式中,基板塗膠設備100還可包含軌道142、馬達144與控制器146。其中,軌道142可平行於基板承載座110的邊緣112,但不以此為限。此外,軌道142耦合於毛刷固定座134。在此實施例中,軌道142可實質垂直於塗膠元件120往返於基板200與閒置區300的路徑,亦不以此為限。馬達144電性連接於毛刷固定座134。控制器146電性連接於馬達144,使毛刷固定座134可藉由控制器146與馬達144每經過一時間間隔於軌道142上移動一距離。 In the present embodiment, the substrate coating apparatus 100 may further include a rail 142, a motor 144, and a controller 146. The track 142 can be parallel to the edge 112 of the substrate carrier 110, but is not limited thereto. Additionally, track 142 is coupled to brush mount 134. In this embodiment, the track 142 can be substantially perpendicular to the path of the adhesive element 120 to and from the substrate 200 and the idle area 300, and is not limited thereto. The motor 144 is electrically connected to the brush holder 134. The controller 146 is electrically connected to the motor 144 such that the brush holder 134 can be moved by a distance on the track 142 every time interval between the controller 146 and the motor 144.
第4圖繪示第1圖之基板塗膠設備100的側視圖。基板承載座110可包含複數個吸盤114連接於抽氣設備(未繪示於圖),當基板200被放置於吸盤114上時,抽氣設備使吸盤114吸氣而固定基板200。 4 is a side view of the substrate coating apparatus 100 of FIG. 1. The substrate carrier 110 may include a plurality of suction cups 114 connected to an air extraction device (not shown). When the substrate 200 is placed on the suction cup 114, the air suction device inhales the suction cup 114 to fix the substrate 200.
應瞭解到,已經在上述實施方式中敘述過的元件與元件間的連接關係將不再重複贅述。在以下敘述中,將詳細說明此基板塗膠設備100之塗膠元件120與清潔元件130運轉時的狀態,合先敘明。 It is to be understood that the connection between the elements and elements that have been described in the above embodiments will not be repeated. In the following description, the state of the rubber-coated element 120 and the cleaning element 130 of the substrate-coating apparatus 100 will be described in detail, which will be described in the following.
第5圖繪示第1圖之塗膠元件120塗膠於基板200後的立體圖。第6圖繪示根據本發明一實施方式之基板塗膠設備100運轉時的俯視圖。同時參閱第5圖與第6圖,當塗膠元件120將膠體125塗佈於基板200後,會離開基板 200並以方向D3往閒置區300移動。 FIG. 5 is a perspective view of the glue component 120 of FIG. 1 after being glued to the substrate 200. FIG. 6 is a plan view showing the operation of the substrate coating apparatus 100 according to an embodiment of the present invention. Referring to FIG. 5 and FIG. 6 simultaneously, when the glue component 120 applies the colloid 125 to the substrate 200, it will leave the substrate. 200 moves in the direction D3 to the idle area 300.
第7圖繪示根據本發明一實施方式之基板塗膠設備100運轉時的俯視圖。同時參閱第6圖與第7圖,清潔元件130的毛刷132位於塗膠元件120往返於基板200與閒置區300的路徑上。當塗膠元件120以方向D3往閒置區300移動時,清潔元件130的毛刷132可接觸塗膠元件120,因此位於塗膠元件120之開口126(見第2圖)附近的殘膠可被毛刷132清除,使膠體125附著於部分毛刷132上。 FIG. 7 is a plan view showing the operation of the substrate coating apparatus 100 according to an embodiment of the present invention. Referring to FIGS. 6 and 7, the brush 132 of the cleaning member 130 is located on the path of the adhesive member 120 to and from the substrate 200 and the free area 300. When the glue component 120 moves in the direction D3 to the idle zone 300, the brush 132 of the cleaning component 130 can contact the glue component 120, so that the residual glue located near the opening 126 (see FIG. 2) of the glue component 120 can be The brush 132 is removed to cause the colloid 125 to adhere to the portion of the brush 132.
塗膠元件120可於基板承載座110上方塗佈膠體125於多片基板200後才以方向D3返回閒置區300,也可每塗佈一片基板200便以方向D3返回閒置區300,依照設計者需求而定。如此一來,塗膠元件120不會因塗佈膠體125於基板200後而累積殘膠,因此不需定時停止基板塗膠設備100來清潔塗膠元件120,可提升基板200的產能。此外,塗膠元件120於往返於基板200與閒置區300時會接觸毛刷132,因此不易在塗部基板200時,受殘膠的影響而發生路徑偏移、膠量過少與殘膠掉落的狀況,使每片基板200的品質可被控制。 The glue component 120 can be applied to the idle area 300 in the direction D3 after the glue 125 is applied to the substrate carrier 110 on the substrate carrier 110, or can be returned to the idle zone 300 in the direction D3 every time the substrate 200 is coated, according to the designer. Depending on the needs. In this way, the glue component 120 does not accumulate residual glue after the coating of the glue 125 on the substrate 200. Therefore, it is not necessary to stop the substrate coating device 100 to clean the glue component 120, and the productivity of the substrate 200 can be improved. In addition, the glue-coated component 120 contacts the brush 132 when going back and forth between the substrate 200 and the idle area 300. Therefore, when the substrate 200 is coated, the path is not affected by the residual glue, and the path is offset, the amount of glue is too small, and the residual glue is dropped. The condition allows the quality of each substrate 200 to be controlled.
第8圖繪示根據本發明一實施方式之基板塗膠設備100運轉時的俯視圖。當部分毛刷132因清潔塗膠元件120而附著有膠體125時,由於清潔元件130可移動地位於基板200與閒置區300之間,毛刷固定座134可藉由馬達144與控制器146於軌道142上以方向D4移動一距離D5,使塗膠元件120再次往返於基板200與閒置區300的路徑上 時,會接觸乾淨的部分毛刷132,而不會接觸附著有膠體125的部分毛刷132。 FIG. 8 is a plan view showing the operation of the substrate coating apparatus 100 according to an embodiment of the present invention. When the partial brush 132 is attached with the colloid 125 due to the cleaning of the adhesive component 120, since the cleaning component 130 is movably located between the substrate 200 and the idle area 300, the brush holder 134 can be used by the motor 144 and the controller 146. The track 142 is moved by a distance D5 in the direction D4 to cause the glue component 120 to re-route to and from the substrate 200 and the idle area 300. At this time, a clean portion of the brush 132 is touched without touching the portion of the brush 132 to which the colloid 125 is attached.
第9圖繪示根據本發明一實施方式之基板塗膠設備100運轉時的俯視圖。同時參閱第8圖與第9圖,清潔元件130的毛刷固定座134可藉由控制器146設定成每經過一段時間間隔就於軌道142上移動距離D5。如此一來,當塗膠元件120與清潔元件130重複上述步驟時,便可避免累積過多的膠體125的毛刷132接觸到塗膠元件120,而降低清潔的效果。 FIG. 9 is a plan view showing the operation of the substrate coating apparatus 100 according to an embodiment of the present invention. Referring also to Figures 8 and 9, the brush holder 134 of the cleaning member 130 can be set by the controller 146 to move a distance D5 over the track 142 every time interval. In this way, when the glue component 120 and the cleaning component 130 are repeated in the above steps, it is possible to prevent the brush 132 of the excessively colloidal body 125 from contacting the glue component 120, thereby reducing the cleaning effect.
舉例來說,當塗膠元件120在連續塗佈多片(例如10片以上)的基板200後可能會累積多過的殘膠而影響基板200的品質時,可將塗膠元件120設定在連續塗佈10片基板200後藉由毛刷132清潔並回到閒置區300,於清潔塗膠元件120後,將清潔元件130設定於軌道142上移動距離D5。如此一來,當塗膠元件120再次塗佈10片基板200後(即塗佈第20片基板200後)並以方向D3回到閒置區300時,則可接觸乾淨的毛刷132,而不會接觸已附著有膠體125的毛刷132,因此可增加清潔效果。 For example, when the glue component 120 may accumulate more residual glue after continuously coating a plurality of (for example, 10 or more) substrates 200 to affect the quality of the substrate 200, the glue component 120 may be set to be continuous. After the 10 substrates 200 are coated, they are cleaned by the brush 132 and returned to the idle area 300. After the adhesive element 120 is cleaned, the cleaning element 130 is set on the track 142 by a moving distance D5. In this way, when the glue component 120 is coated again 10 substrates 200 (ie, after coating the 20th substrate 200) and returns to the idle zone 300 in the direction D3, the clean brush 132 can be contacted without The brush 132 to which the colloid 125 has been attached is contacted, so that the cleaning effect can be increased.
此外,由於毛刷132為可拆卸地固定於毛刷固定座134上,因此操作人員可將多次使用的毛刷132整個更換,之後基板塗膠設備100便可繼續運轉。也就是說,藉由此基板塗膠設備100可將降低需停機更換毛刷132的頻率,可節省停機時間、清潔塗膠元件120的人力與增加基板200的產能。 Further, since the brush 132 is detachably fixed to the brush holder 134, the operator can replace the brush 132 for multiple use, and then the substrate coating device 100 can continue to operate. That is to say, by using the substrate coating device 100, the frequency of replacing the brush 132 can be reduced, which can save downtime, clean the manpower of the adhesive component 120, and increase the productivity of the substrate 200.
本發明上述實施方式與先前技術相較,具有以下優點: Compared with the prior art, the above embodiment of the present invention has the following advantages:
(1)清潔元件的毛刷位於塗膠元件往返於基板與閒置區的路徑上。當塗膠元件往返於基板與閒置區時,清潔元件的毛刷可接觸塗膠元件,使位於塗膠元件上的殘膠可被毛刷清除。 (1) The brush of the cleaning element is located on the path of the glue element to and from the substrate and the idle area. When the glue component is moved to and from the substrate and the idle area, the brush of the cleaning component can contact the glue component, so that the residual glue on the glue component can be removed by the brush.
(2)清潔元件可移動地位於基板與閒置區之間,當一部分的毛刷因清潔塗膠元件而沾有殘膠時,毛刷固定座可於軌道上移動一距離,使清潔元件下次往返於基板與閒置區的路徑上時,會接觸乾淨的部分毛刷而不會接觸沾有殘膠的部分毛刷。 (2) The cleaning element is movably located between the substrate and the idle area. When a part of the brush is stained with the residual glue due to the cleaning of the glue component, the brush holder can be moved a distance on the track to make the cleaning element next time. When going to and from the path between the substrate and the free area, a clean part of the brush is touched without touching the part of the brush with the residual glue.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100‧‧‧基板塗膠設備 100‧‧‧Substrate coating equipment
110‧‧‧基板承載座 110‧‧‧Substrate carrier
112‧‧‧邊緣 112‧‧‧ edge
114‧‧‧吸盤 114‧‧‧Sucker
120‧‧‧塗膠元件 120‧‧‧Glue components
122‧‧‧本體 122‧‧‧ body
123‧‧‧容置空間 123‧‧‧ accommodating space
124‧‧‧入膠管 124‧‧‧Into the hose
125‧‧‧膠體 125‧‧‧colloid
126‧‧‧開口 126‧‧‧ openings
128‧‧‧加壓管 128‧‧‧ Pressurized tube
130‧‧‧清潔元件 130‧‧‧ Cleaning components
132‧‧‧毛刷 132‧‧‧ brush
134‧‧‧毛刷固定座 134‧‧‧Brush holder
136‧‧‧固定元件 136‧‧‧Fixed components
142‧‧‧軌道 142‧‧‧ Track
144‧‧‧馬達 144‧‧‧Motor
146‧‧‧控制器 146‧‧‧ Controller
200‧‧‧基板 200‧‧‧Substrate
210‧‧‧軟性電路板 210‧‧‧Soft circuit board
212‧‧‧邊緣 212‧‧‧ edge
300‧‧‧閒置區 300‧‧‧ idling area
D1‧‧‧距離 D1‧‧‧ distance
D2‧‧‧距離 D2‧‧‧ distance
D3‧‧‧方向 D3‧‧ Direction
D4‧‧‧方向 D4‧‧ Direction
D5‧‧‧距離 D5‧‧‧ distance
R‧‧‧孔徑 R‧‧‧ aperture
第1圖繪示根據本發明一實施方式之基板塗膠設備與一基板的立體圖。 1 is a perspective view of a substrate coating apparatus and a substrate according to an embodiment of the present invention.
第2圖繪示第1圖之塗膠元件的前視圖。 Figure 2 is a front elevational view of the glue element of Figure 1.
第3圖繪示第1圖之清潔元件的側視圖。 Figure 3 is a side elevational view of the cleaning element of Figure 1.
第4圖繪示第1圖之基板塗膠設備的側視圖。 Figure 4 is a side elevational view of the substrate coating apparatus of Figure 1.
第5圖繪示第1圖之塗膠元件塗膠於基板後的立體圖。 Fig. 5 is a perspective view showing the glue component of Fig. 1 after being glued to a substrate.
第6圖繪示根據本發明一實施方式之基板塗膠設備運轉時的俯視圖。 FIG. 6 is a plan view showing the operation of the substrate coating apparatus according to an embodiment of the present invention.
第7圖繪示根據本發明一實施方式之基板塗膠設備運轉時的俯視圖。 FIG. 7 is a plan view showing the operation of the substrate coating apparatus according to an embodiment of the present invention.
第8圖繪示根據本發明一實施方式之基板塗膠設備運轉時的俯視圖。 FIG. 8 is a plan view showing the operation of the substrate coating apparatus according to an embodiment of the present invention.
第9圖繪示根據本發明一實施方式之基板塗膠設備運轉時的俯視圖。 FIG. 9 is a plan view showing the operation of the substrate coating apparatus according to an embodiment of the present invention.
100‧‧‧基板塗膠設備 100‧‧‧Substrate coating equipment
110‧‧‧基板承載座 110‧‧‧Substrate carrier
120‧‧‧塗膠元件 120‧‧‧Glue components
125‧‧‧膠體 125‧‧‧colloid
130‧‧‧清潔元件 130‧‧‧ Cleaning components
132‧‧‧毛刷 132‧‧‧ brush
134‧‧‧毛刷固定座 134‧‧‧Brush holder
136‧‧‧固定元件 136‧‧‧Fixed components
142‧‧‧軌道 142‧‧‧ Track
144‧‧‧馬達 144‧‧‧Motor
146‧‧‧控制器 146‧‧‧ Controller
200‧‧‧基板 200‧‧‧Substrate
210‧‧‧軟性電路板 210‧‧‧Soft circuit board
300‧‧‧閒置區 300‧‧‧ idling area
Claims (10)
Applications Claiming Priority (1)
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CN201210189702.XA CN102688833B (en) | 2012-06-05 | 2012-06-05 | Glue coating equipment for base plate |
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Publication Number | Publication Date |
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TW201350210A true TW201350210A (en) | 2013-12-16 |
TWI524946B TWI524946B (en) | 2016-03-11 |
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TW101126032A TWI524946B (en) | 2012-06-05 | 2012-07-19 | Substrate gluing apparatus |
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TW (1) | TWI524946B (en) |
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CN104649006A (en) * | 2015-01-07 | 2015-05-27 | 池州睿成微电子有限公司 | Numerically-controlled conveying device for IC (Integrated Circuit) chip |
CN114104744B (en) * | 2021-11-17 | 2024-02-09 | 威斯德(厦门)自动化有限公司 | Automatic Tray feeding and discharging production line and automatic Tray feeding and discharging method |
CN115123317B (en) * | 2022-07-19 | 2024-03-08 | 南京轨道交通产业发展有限公司 | Control circuit of driver with electromagnetic valve mechanical interlocking structure |
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JP3819270B2 (en) * | 2001-09-03 | 2006-09-06 | 大日本スクリーン製造株式会社 | Coating liquid supply apparatus and coating apparatus using the apparatus |
JP4188043B2 (en) * | 2002-09-18 | 2008-11-26 | 中外炉工業株式会社 | Coating die cleaning device and coating device |
CN100490989C (en) * | 2007-10-22 | 2009-05-27 | 友达光电股份有限公司 | Nozzle device and nozzle cleaning device thereof |
CN101318169B (en) * | 2008-07-16 | 2010-06-23 | 友达光电(厦门)有限公司 | Glue spreading apparatus, using and maintaining method for the glue spreading apparatus |
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CN102688833B (en) | 2014-10-08 |
CN102688833A (en) | 2012-09-26 |
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