TW201349331A - 圖案化導電基材的製造方法、使用該方法的圖案化導電基材及觸控面板 - Google Patents

圖案化導電基材的製造方法、使用該方法的圖案化導電基材及觸控面板 Download PDF

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Publication number
TW201349331A
TW201349331A TW102118142A TW102118142A TW201349331A TW 201349331 A TW201349331 A TW 201349331A TW 102118142 A TW102118142 A TW 102118142A TW 102118142 A TW102118142 A TW 102118142A TW 201349331 A TW201349331 A TW 201349331A
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TW
Taiwan
Prior art keywords
conductive
layer
pattern
inorganic oxide
conductive layer
Prior art date
Application number
TW102118142A
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English (en)
Chinese (zh)
Inventor
Junji Mata
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of TW201349331A publication Critical patent/TW201349331A/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/158—Carbon nanotubes
    • C01B32/16—Preparation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Nanotechnology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Insulated Conductors (AREA)
  • Position Input By Displaying (AREA)
TW102118142A 2012-05-24 2013-05-23 圖案化導電基材的製造方法、使用該方法的圖案化導電基材及觸控面板 TW201349331A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012118210 2012-05-24

Publications (1)

Publication Number Publication Date
TW201349331A true TW201349331A (zh) 2013-12-01

Family

ID=49623841

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102118142A TW201349331A (zh) 2012-05-24 2013-05-23 圖案化導電基材的製造方法、使用該方法的圖案化導電基材及觸控面板

Country Status (5)

Country Link
JP (1) JPWO2013176155A1 (fr)
KR (1) KR20150016934A (fr)
CN (1) CN104321836A (fr)
TW (1) TW201349331A (fr)
WO (1) WO2013176155A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI553879B (zh) * 2014-02-24 2016-10-11 鴻海精密工業股份有限公司 薄膜電晶體陣列的製備方法
US9577105B2 (en) 2014-02-24 2017-02-21 Tsinghua University Thin film transistor and thin film transistor array with semiconductor fragments
TWI659430B (zh) * 2014-05-14 2019-05-11 日商三菱化學股份有限公司 導電性組成物、帶電防止膜、積層體及其製造方法、以及光罩的製造方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015083610A1 (ja) * 2013-12-04 2017-03-16 東レ株式会社 透明導電積層体、およびそれを用いたタッチパネル
KR102239446B1 (ko) * 2014-03-14 2021-04-14 주식회사 아모센스 터치 스크린 패널용 커버 필름 및 이를 포함하는 터치 스크린 패널
KR102239445B1 (ko) * 2014-03-14 2021-04-14 주식회사 아모센스 터치 스크린 패널용 센서의 제조 방법 및 터치 스크린 패널용 센서
JP6444118B2 (ja) * 2014-09-29 2018-12-26 東洋アルミニウム株式会社 回路基板の製造方法
CN105887086A (zh) * 2016-06-07 2016-08-24 共青城超群科技协同创新股份有限公司 锚型三维立体蚀刻方法
CN107093500B (zh) * 2017-03-30 2019-04-09 华南理工大学 一种银纳米线柔性透明导电薄膜的图形化方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4635421B2 (ja) * 2003-09-02 2011-02-23 Ｔｄｋ株式会社 転写用導電性フィルム、及びそれを用いた透明導電膜の形成方法
GB2426826B (en) * 2004-02-23 2008-06-25 Joel S Douglas Strip electrode with conductive nano tube printing
KR100798805B1 (ko) * 2006-01-09 2008-01-29 주식회사 하이닉스반도체 반도체 소자의 캐패시터 제조 방법
JP4667471B2 (ja) * 2007-01-18 2011-04-13 日東電工株式会社 透明導電性フィルム、その製造方法及びそれを備えたタッチパネル
US8171628B2 (en) * 2008-08-22 2012-05-08 Hitachi Chemical Company, Ltd. Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate
JP5617276B2 (ja) * 2010-02-25 2014-11-05 凸版印刷株式会社 透明導電性積層体及びその製造方法
KR20130125285A (ko) * 2010-10-29 2013-11-18 도레이 카부시키가이샤 투명 도전 적층체 및 그의 제조 방법

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI553879B (zh) * 2014-02-24 2016-10-11 鴻海精密工業股份有限公司 薄膜電晶體陣列的製備方法
US9508760B2 (en) 2014-02-24 2016-11-29 Tsinghua University Method for making thin film transistor array
US9577105B2 (en) 2014-02-24 2017-02-21 Tsinghua University Thin film transistor and thin film transistor array with semiconductor fragments
TWI659430B (zh) * 2014-05-14 2019-05-11 日商三菱化學股份有限公司 導電性組成物、帶電防止膜、積層體及其製造方法、以及光罩的製造方法
US10488757B2 (en) 2014-05-14 2019-11-26 Mitsubishi Chemical Corporation Conductive composition, antistatic film, laminate and production therefor, and production method for photomask

Also Published As

Publication number Publication date
WO2013176155A1 (fr) 2013-11-28
JPWO2013176155A1 (ja) 2016-01-14
KR20150016934A (ko) 2015-02-13
CN104321836A (zh) 2015-01-28

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