TW201348165A - Manufacturing method for glass substrate of touch display device - Google Patents

Abstract

The present invention discloses a manufacturing method for a glass substrate of a touch display device, which is applied to using a glass plate to make a plurality of glass substrates. The manufacturing method includes: taking a glass plate of forming a patterned electrical control circuit layer to carry out a fully tempered procedure, forming a plurality of protection layers, carrying out a chemical cutting procedure for said glass substrates, carrying out a side modification tempered procedure for each glass substrate, and finally removing the protection layer. Thereby, carrying out a chemical cutting process for a special tempered substrate that is unable to or is difficult to be carried out with a physical cutting process can not only greatly reduce the tempered time of the glass substrate, but also greatly reduce the time required for cutting and tempering the glass substrate by removing the formed protection layer after it is continuously used till the end of the side modification tempered procedure so as to make the steps of the whole process smooth.

Description

Glass substrate for touch display device

The present invention relates to a method for fabricating a glass substrate, and more particularly to a method for fabricating a glass substrate in a touch display device.

With the evolution of touch technology, touch-based human-machine interfaces, such as touch panels, have been widely used in a wide variety of electronic products to replace traditional input devices (such as: Keyboard and mouse, etc., convenient for users to manipulate and browse data.

At present, in order to increase the texture of the hand when the user touches the touch display device and to avoid scratching the surface or accidentally dropping the touch panel, the touch panel of the existing touch display device is manufactured. A reinforced glass substrate is often used.

However, the conventional method for fabricating a glass substrate is to perform a strengthening process on each glass substrate after the original large glass plate is cut into a plurality of glass substrates, so that not only the image on the glass substrate is prone to high temperature (for example: After immersing the glass substrate in the KNO ₃ solution, the glass substrate is heated by heating at about 400 ° C to 450 ° C for about 5 hours to 8 hours to carry out a strengthening process to cause disintegration, and the film is strengthened step by piece. The steps will also slow down the overall production speed.

An object of the present invention is to increase the speed of fabrication of a glass substrate.

Another object of the present invention is to solve the phenomenon that the pattern layer on the glass substrate is also peeled off by the high temperature of the strengthening process.

To achieve the above and other objects, the method for fabricating a glass substrate of the touch display device of the present invention is applied to fabricating a glass plate into a plurality of glass substrates, the method comprising: performing a comprehensive strengthening process on the glass plate; Forming a plurality of protective layers on the front and back sides of the plate according to the area of the glass substrate; performing a chemical cutting process of the glass plate to form the glass substrates; performing a side modification strengthening process for each glass substrate; and removing each glass substrate The protective layer.

In an embodiment, before the forming of the protective layers, the method further comprises: forming a patterned electronic circuit layer on the glass plate.

In one embodiment, in the step of forming the protective layers, the printing is performed by an anti-etching ink layer, an anti-etching tape, and an anti-etching peelable printing. These protective layers are formed.

In one embodiment, the chemical cutting process is a bidirectional etching process on the front and back sides of the glass sheet.

In one embodiment, the side edge modification enhancement process (enhancement process) includes: performing edge trimming polishing of each glass substrate; and performing a chemical strengthening reduction process on the polishing edge of the previous step.

Therefore, the step of strengthening the process is performed before the large glass plate is cut into small pieces of the glass substrate. In addition to greatly reducing the strengthening time of the glass substrate, the formed protective layer can also be used to the side modification strengthening program (the program) Used to make up the chemical cutting process, the strength of the loss of the side of the glass substrate is removed, and then removed, so the overall process steps will be due to the process The time required for the cutting and strengthening process of the glass substrate is smoothly reduced.

In order to fully understand the objects, features and effects of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings, which are illustrated as follows: First, refer to FIG. A flowchart of a method of fabricating a glass substrate in an embodiment of the invention is applied to a glass plate as a plurality of glass substrates.

First step S100: the glass plate is subjected to a comprehensive strengthening process. There are two main types of strengthening processes, one is thermal strengthening and the other is chemical ion strengthening. For example, in a chemical ion strengthening process, the glass plate to be strengthened, for example, can be placed in a molten potassium salt to ion exchange potassium ions with the sodium ions of the glass surface layer, thereby forming a thin layer on the surface of the glass plate. The compressive stress layer (about 20 to 30 microns thick, the present invention can also be applied to a thickness of 60 microns or more), the compressive stress layer will extend in the direction of the inner surface of the glass plate on the lower two flat surfaces of the glass plate The glass plate was modified.

Next, in step S300, a plurality of protective layers are formed on the front and back surfaces of the glass plate according to the area of the glass substrate. The step is set according to the size of the finished touch panel product, so that the glass plate can be fabricated in the subsequent chemical cutting process by the protective layer, and the protective layer will be The patterned electronic control circuit layer is shielded to prevent erosion of the electronic control circuit in the chemical cutting process. In the implementation, the formation of the protective layer The protective layers can be formed by one of printing, etching of an anti-etching tape, and printing of an anti-etching paste.

Next, in step S400, a chemical cutting process of the glass plate is performed to form the glass substrates. In a preferred embodiment, the chemical cutting process is a bidirectional etching process on the front and back sides of the glass plate, and the glass plate is cut by the blocking and chemical etching of the protective layers. Laser cutting or tool cutting will reduce the time required for this step. The etching solution and the step method used for the chemical etching of the glass plate are conventional glass etching techniques, and will not be described herein. As for the cutting of the strengthened glass plate, if the cutting is performed by the conventional tool, it is easy to cause chipping (for example, when the glass plate is flat or the end point is unevenly stressed, it is easy to be broken), so the case By chemical cutting (etching), the above two sides are gradually removed from the strengthening surface and further glass plate etching, which will avoid the problem of chipping.

Next, in step S500, a side modification strengthening process for each glass substrate is performed. This step performs a further grinding and trimming step on the sides of each of the glass substrates. In the implementation, the step may first perform the edge trimming polishing of each of the glass substrates (for example, positioning and fixing the glass substrate by an implement for performing side grinding), and then performing a chemical strengthening reduction process on the grinding edge. Among them, since the glass has a slight collapse and collapse angle after polishing to break the strength of the glass substrate, chemically removes the uneven surface of the surface layer (including the modification of the hole edge) to be modified into a smooth surface and reduced. The degree of strengthening of the glass substrate.

Next, step S600: removing the protective layer of each glass substrate, and further Complete each piece of glass substrate.

Next, please refer to FIG. 2, which is a flow chart of a method for fabricating a glass substrate according to another embodiment of the present invention. The difference from the embodiment of FIG. 1 is that the step S200 is further included before the protective layer forming step (S300): forming a patterned electronic circuit layer on the glass plate. This step is performed on a glass plate by a patterning process (for example, an exposure/development/etching process) to form a transparent conductive layer formed on the glass plate into an indium tin oxide electronic control circuit, and the electronic circuit layer is fabricated. The following figures and examples are taken as an example with step S200. It should be understood by those skilled in the art that this step S200 is an alternative.

Next, please refer to FIG. 3, which is a flow chart of a method for fabricating a glass substrate in a preferred embodiment of the present invention. In the process step S300, it can be achieved by at least three ways, which is: step S301: printing of the anti-etching ink layer.

Step S303: coating of the anti-etching tape.

Step S305: Printing of the anti-etching peelable glue.

The three modes are optional and are preferred embodiments of the present invention.

Next, please refer to FIG. 4A, which is a cross-sectional view of a glass substrate 810 according to an embodiment of the present invention. The transparent conductive layer 703 is formed on the glass plate 701 (which is a product of the glass plate 800 after the chemical cutting process), wherein the material of the transparent conductive layer 703 can be, for example, indium tin oxide, indium oxide, zinc oxide, or oxidation. One of indium zinc, zinc oxide doped with aluminum, and tin oxide doped with antimony or a mixture thereof. Forming a metal layer 705 on the transparent conductive layer 703, wherein the metal layer 705 can be at least one layer of conductive metal A layer, or a plurality of layers of conductive metal. The material of the conductive metal layer may be a conductive metal or a conductive alloy such as a copper alloy, an aluminum alloy, gold, silver, aluminum, copper or molybdenum. The structure of the multi-layer conductive metal layer may be, for example, a stacked structure of a molybdenum layer/aluminum layer/molybdenum layer, or may be a conductive metal or a conductive alloy selected from the group consisting of copper alloy, aluminum alloy, gold, silver, aluminum, copper, molybdenum, and the like. A multi-layer conductive metal layer structure stacked with a plurality of materials. The transparent conductive layer 703 and the metal layer 705 are then defined as an electrically controlled circuit layer on each of the glass substrates through a patterning process.

Next, please refer to FIG. 4B , which is a schematic cross-sectional view of the glass substrate 810 in FIG. 4A covering the protective layer. 4B shows the position of the protective layer 802. The protective layer 802 covers the front and back sides of the glass substrate 810 for etching and under etching on the chemical cutting process, thereby etching through a predetermined area and enabling the The glass plate 800 forms the glass substrates 810.

Next, referring to Fig. 5, a schematic view of a glass plate cut into a glass substrate in an embodiment of the present invention. The glass plate 800 subjected to ion exchange strengthening treatment or other strengthening treatment defines a plurality of regions by using the protective layer 802, each region is a size of a glass substrate, and etching or removing the region without the protective film by etching or the like (using A plurality of glass substrates 810 are formed by the non-uniform etching to achieve a direct etching effect. The upper and lower sides of the glass plate 800 are covered with a protective layer 802, and only one of the protective layers 802 is shown in the figure.

Next, referring to Fig. 6, a schematic view of a glass plate cut into a glass substrate in another embodiment of the present invention. In this embodiment, it is shown that the specific opening 900 on the glass substrate 810 can be defined by the design of the protective layer 802 to conform to the design of the glass substrate.

Next, please refer to Fig. 7, which is a cross-sectional view of the glass substrate at the specific opening of Fig. 6. The relationship between the specific opening 900 and the glass sheet 701 and other layers is shown graphically.

In summary, the embodiment of the present invention can greatly reduce the time required for the cutting and strengthening process of the glass substrate due to the smooth flow and the shortening of the strengthening process in the overall process step, and further, because the strengthening process is in the patterning process Previously, it did not occur as a conventional technique, and the pattern layer was detached due to the high temperature of the strengthening process.

The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.

S100~S600‧‧‧Steps

S301~S305‧‧‧Steps

701‧‧‧glass plate

703‧‧‧Transparent conductive layer

705‧‧‧metal layer

800‧‧‧ glass plate

802‧‧‧protection layer

810‧‧‧ glass substrate

900‧‧‧ openings

FIG. 1 is a flow chart showing a method of fabricating a glass substrate according to an embodiment of the present invention.

2 is a flow chart showing a method of fabricating a glass substrate according to another embodiment of the present invention.

Figure 3 is a flow chart showing a method of fabricating a glass substrate in accordance with a preferred embodiment of the present invention.

4A is a schematic cross-sectional view showing a glass substrate according to an embodiment of the present invention.

4B is a schematic cross-sectional view of the glass substrate 810 in FIG. 4A covering the protective layer.

Fig. 5 is a schematic view showing the glass plate cut into a glass substrate in an embodiment of the invention.

Figure 6 is a schematic view showing the glass plate cut into a glass substrate in another embodiment of the present invention.

Figure 7 is a cross-sectional view of the glass substrate at the specific opening of Figure 6.

S100~S600‧‧‧Steps

Claims (5)

A method for manufacturing a glass substrate of a touch display device is applied to a glass plate into a plurality of glass substrates, the method comprising: performing a comprehensive strengthening process on the glass plate; and the glass substrate is on the front and back surfaces of the glass plate The area forms a plurality of protective layers; a chemical cutting process of the glass plate is performed to form the glass substrates; a side modification strengthening process for each glass substrate is performed; and a protective layer of each glass substrate is removed. The manufacturing method of claim 1, wherein before the forming of the protective layer, the method further comprises: forming a patterned electronic circuit layer on the glass plate. The manufacturing method according to claim 1, wherein in the step of forming the protective layer, the printing is performed by an anti-etching ink layer, an anti-etching tape, and an anti-etching strippable printing. One of the three forms the protective layers. The manufacturing method of claim 1, wherein the chemical cutting process is a bidirectional etching process on the front and back sides of the glass plate. The manufacturing method according to claim 1, wherein the side modification strengthening process comprises: performing edge trimming polishing of each glass substrate; and performing a chemical strengthening reduction process on the grinding edge of the previous step.