TW201418177A - Touch-sensitive device, touch-sensitive display device and organic light-emitting display device - Google Patents

Touch-sensitive device, touch-sensitive display device and organic light-emitting display device Download PDF

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Publication number
TW201418177A
TW201418177A TW103101015A TW103101015A TW201418177A TW 201418177 A TW201418177 A TW 201418177A TW 103101015 A TW103101015 A TW 103101015A TW 103101015 A TW103101015 A TW 103101015A TW 201418177 A TW201418177 A TW 201418177A
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Taiwan
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substrate
touch
chemical strengthening
layer
tempered glass
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TW103101015A
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Chinese (zh)
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Jeng-Jye Hung
Hen-Ta Kang
Chien-Chung Chen
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Wintek Corp
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Abstract

The invention provides a strengthened glass block cut from a mother glass substrate having been subject to a chemically strengthened treatment. The strengthened glass block has a preliminary reinforced surface area and a newly-born surface area, and the newly-born surface area is formed as a result of machining or material removing treatments. A chemically strengthened layer formed by a secondary chemically strengthened treatment is formed on at least the newly-born surface area.

Description

觸控裝置、觸控顯示裝置及有機發光二極體顯示裝置 Touch device, touch display device and organic light emitting diode display device

本發明關於一種觸控裝置、觸控顯示裝置及有機發光二極體顯示裝置。 The present invention relates to a touch device, a touch display device, and an organic light emitting diode display device.

習知的玻璃強化方式主要有兩種,一種是物理強化方式,另一種是化學強化方式。化學強化方式的機制主要為在玻璃的表層進行離子交換以產生一化學強化層,此化學強化層會衍生出一對應的壓應力分佈層,因此壓應力層可約束玻璃表層的裂縫成長而提高玻璃的破壞強度。目前使用化學強化玻璃來製作產品的方式,通常的流程為先將一母玻璃(mother glass)進行切割,產生具有成品尺寸與外型的半成品,再對半成品進行化學離子強化後進行薄膜沉積、黃光等必須的製程。換言之,該製作方式需於切割後再對每個切割單元逐一進行離子強化及產品製程,如此不僅耗費工序、工時且提高製造成本。 There are two main methods of glass reinforcement, one is physical strengthening and the other is chemical strengthening. The mechanism of the chemical strengthening method is mainly to perform ion exchange on the surface layer of the glass to produce a chemical strengthening layer, and the chemical strengthening layer will derive a corresponding compressive stress distribution layer, so that the compressive stress layer can restrain the crack growth of the glass surface layer and increase the glass. The strength of the damage. At present, the method of using chemically strengthened glass to make a product is usually a process of cutting a mother glass to produce a semi-finished product having a finished size and shape, and then performing chemical ion strengthening on the semi-finished product to perform film deposition and yellow. Light and other necessary processes. In other words, the production method requires ion strengthening and product processing for each cutting unit after cutting, which not only consumes processes, labor hours, but also increases manufacturing costs.

因此,若能先對一母玻璃進行離子強化及必須的產品製程後再進行切割,即可於切割後直接形成一個個具膜層堆疊結構的產品單元。此一製程即為可節省工序及工時的「母片玻璃製程」。然而,於母片玻璃製程中,若是對已完成化學強化後的母玻璃進行機械加工或材料移除處理,該些處理可能會使玻璃衍生出不存在強化層的新表面而降低玻璃本身的強度。 Therefore, if the mother glass can be ion-strengthened and the necessary product process is followed by cutting, a product unit having a film layer stack structure can be directly formed after the cutting. This process is a "master glass process" that saves on process and man-hours. However, in the master glass process, if the mother glass after chemical strengthening has been machined or material removed, the treatment may cause the glass to be derivatized without a new surface of the strengthening layer and reduce the strength of the glass itself. .

本發明提供一種具有全表面覆蓋的強化層以提供良好強度的強化玻璃切割件,以及一種可有效節省工序、工時及製造成本的強化玻璃薄膜製程。 The present invention provides a tempered glass cutting member having a full surface covering reinforcing layer to provide good strength, and a tempered glass film process which can effectively save process, man-hour and manufacturing cost.

本發明一實施例提供一種強化玻璃切割件,其係由 經初次化學強化處理之一母玻璃基板切割而成。強化玻璃切割件包含初始強化表面區域及經由機械加工或材料移除處理產生的至少一新生成表面區域,且經由二次化學強化處理形成的一化學強化層至少形成於新生成表面區域。 An embodiment of the invention provides a reinforced glass cutting member, which is It is cut by one of the primary chemical strengthening treatments of the mother glass substrate. The tempered glass cut comprises an initial strengthened surface area and at least one newly formed surface area resulting from a machining or material removal process, and a chemical strengthening layer formed via a secondary chemical strengthening treatment is formed at least on the newly formed surface area.

本發明另一實施例提供一種強化玻璃切割件,其係由經初次化學強化處理之一母玻璃基板,於經由機械加工或材料移除處理後再進行二次化學強化處理所形成。強化玻璃切割件包含一初始強化表面區域及經由機械加工或材料移除處理所產生的至少一新生成表面區域,且該強化玻璃切割件符合如下關係式:(d/T)≦70%;其中d為存在於該新生成表面區域的一化學強化層的平均深度,且T為存在於該初始強化表面區域的一化學強化層的平均深度 Another embodiment of the present invention provides a tempered glass cutting member formed by a primary chemical strengthening treatment of a mother glass substrate, followed by a secondary chemical strengthening treatment after mechanical processing or material removal treatment. The tempered glass cutting member comprises an initial strengthened surface area and at least one newly formed surface area produced by machining or material removal processing, and the tempered glass cutting member conforms to the following relationship: (d/T) ≦ 70%; d is the average depth of a chemical strengthening layer present in the newly formed surface region, and T is the average depth of a chemical strengthening layer present in the initial strengthening surface region

依本發明另一實施例之設計,一種玻璃強化方法包含如下步驟。首先對一母片玻璃基材進行初次化學強化處理後,再於母片玻璃基材上進行一母片製程。母片製程例如可包含薄膜沉積、黃光、蝕刻、網印、噴印製程的至少其中之一,以於母片玻璃基材形成一觸控感測結構以及一顯示單元的至少其中之一。接著,切割已進行母片製程後的母片玻璃基材以形成複數個強化玻璃切割件,再對各個強化玻璃切割件進行機械加工或材料移除處理後進行二次化學強化處理。機械加工或材料移除處理可包含磨邊、鑿孔、導角、蝕刻以及拋光工序的至少其中之一,且可包含利用一蝕刻媒介蝕刻各個強化玻璃切割件的邊緣,以消除機械加工過程產生的邊緣裂痕。 According to another embodiment of the invention, a glass strengthening method comprises the following steps. First, a master glass substrate is subjected to a primary chemical strengthening treatment, and then a master process is performed on the mother glass substrate. The master process may include, for example, at least one of a thin film deposition, a yellow light, an etch, a screen printing, and a printing process to form at least one of a touch sensing structure and a display unit on the mother glass substrate. Next, the master glass substrate after the master process has been cut to form a plurality of tempered glass cutters, and each of the tempered glass cutters is subjected to secondary chemical strengthening treatment after mechanical processing or material removal treatment. The machining or material removal process can include at least one of edging, puncturing, guiding, etching, and polishing processes, and can include etching the edges of the respective tempered glass cutting members with an etchant to eliminate machining processes The edge of the crack.

本發明另一實施例提供一種具有強化玻璃保護的觸控顯示裝置,包含一覆蓋板以及一具有觸控功能的顯示器。覆蓋板係由經初次化學強化處理之一母玻璃基板切割而成,強化玻璃切割件包含初始強化表面區域及經由機械加工或材料移除處理產生的至少一新生成表面區域,且經由二次化學強化處理形成的一化學強化層至少形成於新生成表面區域。具有觸控功能的顯示器設 置於覆蓋板上。 Another embodiment of the present invention provides a touch display device with reinforced glass protection, including a cover plate and a display having a touch function. The cover sheet is cut from a mother glass substrate that has been subjected to primary chemical strengthening treatment, and the strengthened glass cut member includes an initial strengthened surface area and at least a newly generated surface area generated by machining or material removal treatment, and is subjected to secondary chemistry. A chemical strengthening layer formed by the strengthening treatment is formed at least on the newly formed surface region. Display with touch function Place on the cover plate.

本發明另一實施例提供一種有機發光二極體顯示裝置,包含一覆蓋板、一觸控感測結構以及一基板。覆蓋板係由經初次化學強化處理之一母玻璃基板切割而成,強化玻璃切割件包含初始強化表面區域及經由機械加工或材料移除處理產生的至少一新生成表面區域,且經由二次化學強化處理形成的一化學強化層至少形成於新生成表面區域。觸控感測結構設於覆蓋板上,基板設置於鄰近覆蓋板位置處且具有一有機發光二極體顯示單元。 Another embodiment of the present invention provides an organic light emitting diode display device including a cover plate, a touch sensing structure, and a substrate. The cover sheet is cut from a mother glass substrate that has been subjected to primary chemical strengthening treatment, and the strengthened glass cut member includes an initial strengthened surface area and at least a newly generated surface area generated by machining or material removal treatment, and is subjected to secondary chemistry. A chemical strengthening layer formed by the strengthening treatment is formed at least on the newly formed surface region. The touch sensing structure is disposed on the cover plate, and the substrate is disposed adjacent to the cover plate and has an organic light emitting diode display unit.

藉由上述各個實施例之設計,利用二次化學強化處理形成的強化層可覆蓋新生成表面區域、或補強因機械加工或材料移除處理等原因而被削弱或局部移除的原先的強化層,如此強化玻璃切割件的整體表面均具有化學強化層及對應產生的壓應力層,故可提高強化玻璃切割件整體的強度並可採用母片玻璃製程製造產品,有效節省工序、工時及製造成本。 With the design of each of the above embodiments, the strengthening layer formed by the secondary chemical strengthening treatment may cover the newly formed surface region, or reinforce the original strengthening layer which is weakened or partially removed due to mechanical processing or material removal treatment, and the like. Therefore, the entire surface of the reinforced glass cutting member has a chemical strengthening layer and a corresponding compressive stress layer, so that the overall strength of the tempered glass cutting member can be improved and the product can be manufactured by using a master glass process, thereby effectively saving processes, working hours and manufacturing. cost.

本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉實施例並配合所附圖式,作詳細說明如下。 Other objects and advantages of the present invention will become apparent from the technical features disclosed herein. The above and other objects, features, and advantages of the invention will be apparent from

10‧‧‧母玻璃基板 10‧‧‧ mother glass substrate

20‧‧‧強化母玻璃基板 20‧‧‧ Strengthening mother glass substrate

20a‧‧‧強化玻璃切割件 20a‧‧‧Strengthened glass cutting parts

24、45、54、64、742、744、842、844、942、944‧‧‧觸控感測結構 24, 45, 54, 64, 742, 744, 842, 844, 942, 944‧‧‧ touch sensing structures

22、28、34、36‧‧‧化學強化層 22, 28, 34, 36‧ ‧ chemical strengthening layer

32、46、48‧‧‧屏蔽層 32, 46, 48‧‧‧ Shield

42‧‧‧凹槽 42‧‧‧ Groove

43‧‧‧蝕刻結構 43‧‧‧etched structure

44、53‧‧‧孔洞 44, 53‧‧‧ holes

41、51、61、71、81、91、1001‧‧‧覆蓋板 41, 51, 61, 71, 81, 91, 1001‧‧

511‧‧‧覆蓋板側邊表面 511‧‧‧ Covering side surfaces

47、52、62、72、82、1002‧‧‧裝飾層 47, 52, 62, 72, 82, 1002‧‧‧ decorative layers

542、544‧‧‧電極串列 542, 544‧‧‧electrode series

545、549‧‧‧導電走線 545, 549‧‧‧ conductive traces

546‧‧‧按鍵形單層電極 546‧‧‧Key-shaped single-layer electrode

548‧‧‧三角形單層電極 548‧‧‧Triangular single layer electrode

55、75、95、1005‧‧‧顯示單元 55, 75, 95, 1005‧‧‧ display units

56、964、1008‧‧‧下基板 56, 964, 1008‧‧‧ lower substrate

57、962‧‧‧封裝蓋 57, 962‧‧‧ package cover

58、68、88‧‧‧顯示器 58,68, 88‧‧‧ display

411、611‧‧‧曲面 411, 611‧‧‧ surface

60、70、80、90‧‧‧觸控顯示裝置 60, 70, 80, 90‧‧‧ touch display devices

63‧‧‧光學薄膜 63‧‧‧Optical film

65‧‧‧觸控面板 65‧‧‧ touch panel

66、86‧‧‧基板 66, 86‧‧‧ substrate

76‧‧‧液晶顯示器 76‧‧‧LCD display

762‧‧‧彩色濾光基板 762‧‧‧Color filter substrate

96、100‧‧‧有機發光二極體顯示器 96,100‧‧‧Organic LED display

M1、M2、N‧‧‧表面區域 M1, M2, N‧‧‧ surface area

d、T、T1、T2‧‧‧強化層深度 d, T, T1, T2‧‧‧ reinforcement depth

NS‧‧‧新生成表面 NS‧‧‧Newly generated surface

DOL‧‧‧壓應力層 DOL‧‧‧ compressive stress layer

TS‧‧‧張應力 TS‧‧‧ tensile stress

圖1為本發明一實施例的化學強化母玻璃基板的示意圖。 1 is a schematic view of a chemically strengthened mother glass substrate according to an embodiment of the present invention.

圖2為依本發明一實施例,說明於玻璃基板上進行機械加工或材料移除處理及二次化學強化處理過程的示意圖。 2 is a schematic view showing a process of machining, material removal treatment, and secondary chemical strengthening treatment on a glass substrate according to an embodiment of the present invention.

圖3為依本發明另一實施例,說明於玻璃基板上進行機械加工或材料移除處理及二次化學強化處理過程的示意圖。 3 is a schematic view showing a process of machining or material removal treatment and secondary chemical strengthening treatment on a glass substrate according to another embodiment of the present invention.

圖4為依本發明另一實施例,說明於玻璃基板上進行機械加工或材料移除處理及二次化學強化處理過程的示意圖。 4 is a schematic view showing a process of machining or material removal treatment and secondary chemical strengthening treatment on a glass substrate according to another embodiment of the present invention.

圖5為依本發明另一實施例,說明於玻璃基板上進行 機械加工或材料移除處理及二次化學強化處理過程的示意圖。 FIG. 5 is a view showing a glass substrate according to another embodiment of the present invention; Schematic diagram of machining or material removal treatment and secondary chemical strengthening treatment process.

圖6A及圖6B為說明化學強化層深度變化的示意圖。 6A and 6B are schematic views illustrating changes in depth of a chemical strengthening layer.

圖6C為一覆蓋板實施例的局部剖面示意圖,說明化學強化層的深度變化。 Figure 6C is a partial cross-sectional view of an embodiment of a cover sheet illustrating the depth variation of the chemically strengthened layer.

圖7為切削後的玻璃經由蝕刻後的部分斷面放大示意圖。 Fig. 7 is an enlarged schematic cross-sectional view showing a portion of the cut glass after etching.

圖8為本發明一實施例的剖面示意圖,顯示覆蓋板上設置有裝飾層與觸控感測結構並結合一顯示器。 FIG. 8 is a cross-sectional view showing an embodiment of the present invention, showing a decorative layer and a touch sensing structure on a cover plate combined with a display.

圖9為圖8的覆蓋板與觸控感測結構的一實施例之俯視示意圖。 9 is a top plan view of an embodiment of the cover plate and the touch sensing structure of FIG. 8.

圖10為圖8的覆蓋板與觸控感測結構的另一實施例之俯視示意圖。 10 is a top plan view of another embodiment of the cover plate and touch sensing structure of FIG. 8.

圖11為本發明一實施例的剖面示意圖,顯示覆蓋板的側邊為曲面,並結合觸控面板與顯示器。 FIG. 11 is a cross-sectional view showing an embodiment of the present invention, showing a side surface of the cover plate as a curved surface, and combining the touch panel and the display.

圖12為本發明一實施例的剖面示意圖,顯示一顯示器的上基板或封裝蓋上設置有觸控感測結構。 FIG. 12 is a cross-sectional view showing an embodiment of the present invention, in which a touch sensing structure is disposed on an upper substrate or a package cover of a display.

圖13為本發明一實施例的剖面示意圖,顯示觸控感測結構設置在覆蓋板與一基板上。 FIG. 13 is a cross-sectional view showing a touch sensing structure disposed on a cover plate and a substrate according to an embodiment of the invention.

圖14為本發明一實施例的剖面示意圖,顯示OLED的封裝蓋具有觸控感測結構,並結合覆蓋板。 FIG. 14 is a cross-sectional view showing an embodiment of the present invention, showing that the package cover of the OLED has a touch sensing structure and is combined with the cover plate.

圖15為本發明一實施例的剖面示意圖,顯示覆蓋板作為OLED的封裝蓋且具有觸控感測結構於覆蓋板上。 FIG. 15 is a cross-sectional view of the embodiment of the present invention, showing a cover plate as a package cover of an OLED and having a touch sensing structure on the cover plate.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本發明。 The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

如圖1所示,依本發明一實施例的設計,一母玻璃 基板(mother glass substrate)10先經過初次化學強化處理後成為一強化母玻璃基板(strenghened mother glass substrate)20。舉例而言,該化學強化處理可為一化學離子強化處理,於化學離子強化處理過程中,可將待強化的母玻璃基板10置入熔融的鉀鹽中,使鉀離子與母玻璃基板10表層的鈉離子進行離子交換而產生一化學強化層,如此可使母玻璃基板10表層形成一壓應力層DOL,並使母玻璃基板10內部衍生出適當的張應力TS以使整體達到力平衡。當壓應力層DOL越厚,約束玻璃表層裂縫成長的能力越強,使強化母玻璃基板20的強度越高,可以提高玻璃表面抵抗外物撞擊(impact)的能力。在這個例子中,化學強化層是指鉀離子從玻璃表面擴散進入玻璃內的平均深度,較佳的定義是指最大擴散深度的平均值。擴散深度一般可以藉由儀器偵測鉀離子是否存在而得知。由於即使在同一道製程下,擴散深度仍會有深淺不一的情形存在,因此取擴散深度的平均值作為判定標準。化學強化層與壓應力層DOL的關係,舉例而言在Varshneya(1975)的文獻中指出,離子交換層深度會略大於壓應力層DOL的深度。於一母片玻璃製程中,若是對已完成初次化學強化後的強化母玻璃基板20進行機械加工或材料移除處理,該些處理可能會使強化母玻璃基板20衍生出不存在強化層的新生成表面,未被強化層覆蓋的新生成表面裂縫較易成長而可能降低強化母玻璃基板20的強度。因此,可再利用二次化學強化處理形成的強化層覆蓋新生成表面區域、或補強因機械加工或材料移除處理等原因而被削弱或局部移除的原先的強化層,以提供良好的強化玻璃強度。 As shown in FIG. 1, a mother glass is designed according to an embodiment of the present invention. The mother glass substrate 10 is first subjected to a chemical strengthening treatment to become a strenghened mother glass substrate 20. For example, the chemical strengthening treatment may be a chemical ion strengthening treatment. During the chemical ion strengthening treatment, the mother glass substrate 10 to be strengthened may be placed in a molten potassium salt to make the potassium ions and the surface of the mother glass substrate 10 The sodium ions are ion-exchanged to produce a chemical strengthening layer, so that the surface layer of the mother glass substrate 10 forms a compressive stress layer DOL, and an appropriate tensile stress TS is derived inside the mother glass substrate 10 to achieve a force balance. The thicker the compressive stress layer DOL, the stronger the ability to restrain the crack growth of the glass surface layer, and the higher the strength of the strengthened mother glass substrate 20, the higher the ability of the glass surface to resist the impact of foreign objects. In this example, the chemical strengthening layer refers to the average depth at which potassium ions diffuse from the surface of the glass into the glass, and is preferably defined as the average of the maximum diffusion depth. The depth of diffusion can generally be known by the instrument detecting the presence of potassium ions. Since the diffusion depth still has different depths even under the same process, the average value of the diffusion depth is taken as the criterion. The relationship between the chemically strengthened layer and the compressive stress layer DOL, for example, is pointed out in the literature by Varshneya (1975), the depth of the ion exchange layer is slightly greater than the depth of the compressive stress layer DOL. In a master glass process, if the strengthened mother glass substrate 20 after the initial chemical strengthening has been machined or material removed, the treatment may cause the strengthened mother glass substrate 20 to be derivatized without a strengthening layer. The newly formed surface cracks which are formed on the surface and are not covered by the reinforcing layer are relatively easy to grow and may lower the strength of the strengthened mother glass substrate 20. Therefore, the reinforcing layer formed by the secondary chemical strengthening treatment can be reused to cover the newly formed surface region, or the original strengthening layer which is weakened or partially removed due to mechanical processing or material removal treatment, etc., to provide good reinforcement. Glass strength.

如下以不同實施例說明經初次化學強化處理形成的強化母玻璃基板,於進行機械加工或材料移除處理後再進行二次化學強化處理的過程。 The process of performing the secondary chemical strengthening treatment after the mechanical processing or the material removal treatment is performed in a different embodiment by the following description of the strengthened mother glass substrate formed by the primary chemical strengthening treatment.

如圖2所示,一母片製程係於已經過初次化學強化處理的強化母玻璃基板(strenghened mother glass substrate)20上進行。於此母片製程係指強化玻璃於切割前的母片尺寸下進行產品所 需的製程。舉例而言,若強化玻璃係用於一觸控面板作為基板或覆蓋板(cover glass)之用,則母片製程例如可包含利用一第一黃光(photolithography)製程形成導電走線,利用一第二黃光製程定義絕緣層,利用一第三黃光製程形成第一電極串列及第二電極串列,及利用一黃光、網印或噴印製程形成裝飾層而於強化母玻璃基板20上構成多個待分離的觸控感測結構24。裝飾層例如可由陶瓷、類鑽碳、顏色油墨、光阻或樹脂材料的至少其中之一所構成,且可形成於觸控面板、顯示面板或其它電子產品的一覆蓋板或一玻璃基板上。或者,若強化玻璃係作為一顯示面板的透明基板之用,母片製程例如可包含於強化母玻璃基板20上進行的金屬及絕緣材料的薄膜沉積及黃光蝕刻等薄膜製程以形成一顯示單元,顯示單元例如可為液晶顯示單元或有機發光二極體顯示單元等而不限定。於母片製程完成後再對強化母玻璃基板20進行切割處理,即可形成一個個具膜層堆疊結構的強化玻璃切割件20a,因此採用上述母片玻璃製程製造產品,可有效節省工序、工時及製造成本。再者,因上述的切割處理會使每個強化玻璃切割件20a產生四個新生成表面NS(即四個切削側面),且新生成表面NS上不具化學強化層22,故接著對強化玻璃切割件20a進行二次化學強化處理,使新生成表面NS形成一化學強化層28亦並對應產生一壓應力層,如此強化玻璃切割件20a的整體表面均具有化學強化層及對應產生的壓應力層,而可提高強化玻璃切割件20a整體的強度。如圖3所示,強化玻璃切割件20a於磨邊(grinding)後產生一實質上不具化學強化層的新生成表面NS或是產生一殘留一部分化學強化層的新生成表面NS,當進行二次化學強化處理後同樣可於新生成表面NS形成一化學強化層。因此,本發明各個實施例可提供一種強化玻璃切割件20a,其係由經初次化學強化處理之母玻璃基板20切割而成,強化玻璃切割件20a包含初始強化表面區域M及經由機械加工或材料移除處理產生的至少一新生成表面區域N,且經由二次化學強化處理形成的化學強化層28至少形成於新生成表面區域N。此外,除了新 生成表面區域N,化學強化層28也可以選擇性地形成於部分的初始強化表面區域M,例如靠近新生成表面區域N的區域,以更強化該選定區域的玻璃強度。若有必要的話,也可以對於初始強化表面區域M進行全面的二次化學強化處理。當然,機械加工或材料移除處理的過程並不限定,僅需產生新生成表面區域N即適用本發明的實施例,例如強化玻璃切割件20a亦可於進行蝕刻(如圖4所示於強化玻璃切割件20a上蝕刻出凹槽42)、鑿孔(如圖5所示於強化玻璃切割件20a上鑽出貫穿或未貫穿的孔洞44)、拋光、導圓角等等工序產生新生成表面NS,再將經由二次化學強化處理形成的化學強化層28至少形成於新生成表面區域N上,使強化玻璃切割件20a整體表面均具有化學強化層及對應產生的壓應力層,而可提高強化玻璃切割件20a整體的強度。另外,強化玻璃切割件20a可進行多個不同的機械加工或材料移除處理,再對最終形成的新生成表面進行二次化學強化。舉例而言,強化玻璃切割件20a可先進行切割、磨邊、導角等切削工序,再利用例如氫氟酸(HF)的蝕刻媒介將切割、磨邊、導角等機械加工過程造成的邊緣裂痕(crack)蝕刻去除,如此例如可先行提升切削後的玻璃的抗彎曲(bending)強度,使玻璃被彎曲時可避免或減少裂痕(裂壞玻璃的源頭)的產生,接著再進行二次化學強化使強化玻璃切割件20a整體表面均具有化學強化層。 As shown in FIG. 2, a master process is performed on a strenghened mother glass substrate 20 which has undergone initial chemical strengthening treatment. The master wafer process refers to the product of the tempered glass under the master size before cutting. Required process. For example, if the tempered glass is used for a touch panel as a substrate or a cover glass, the master process may include, for example, forming a conductive trace using a first photolithography process, using a The second yellow light process defines an insulating layer, and the first electrode series and the second electrode series are formed by a third yellow light process, and the decorative layer is formed by using a yellow light, screen printing or a printing process to strengthen the mother glass substrate A plurality of touch sensing structures 24 to be separated are formed on the 20 . The decorative layer may be composed of, for example, at least one of ceramic, diamond-like carbon, color ink, photoresist or resin material, and may be formed on a cover plate or a glass substrate of a touch panel, a display panel or other electronic product. Alternatively, if the tempered glass is used as a transparent substrate of a display panel, the master process may include, for example, thin film deposition of a metal and an insulating material on the strengthened mother glass substrate 20, and a thin film process such as yellow etching to form a display unit. The display unit may be, for example, a liquid crystal display unit or an organic light emitting diode display unit, and the like. After the master wafer process is completed, the strengthened mother glass substrate 20 is subjected to a cutting process to form a tempered glass cutting member 20a having a film layer stack structure. Therefore, the above-mentioned mother glass process can be used to manufacture products, which can effectively save processes and work. Time and manufacturing costs. Furthermore, since the above-described cutting process causes each of the tempered glass cutting members 20a to produce four newly formed surfaces NS (ie, four cutting sides), and the newly formed surface NS does not have the chemical strengthening layer 22, the tempered glass is then cut. The member 20a is subjected to a secondary chemical strengthening treatment to form a chemical strengthening layer 28 on the newly formed surface NS and correspondingly to generate a compressive stress layer, so that the entire surface of the strengthened glass cutting member 20a has a chemical strengthening layer and a corresponding compressive stress layer. The strength of the tempered glass cutting member 20a as a whole can be improved. As shown in FIG. 3, the tempered glass cutting member 20a generates a newly formed surface NS having substantially no chemical strengthening layer after grinding, or generates a newly formed surface NS which remains a part of the chemical strengthening layer. After the chemical strengthening treatment, a chemical strengthening layer can also be formed on the newly formed surface NS. Accordingly, various embodiments of the present invention may provide a tempered glass cutting member 20a that is cut from a primary chemically strengthened mother glass substrate 20 that includes an initial strengthened surface area M and is machined or materialized. At least one newly generated surface region N resulting from the treatment is removed, and a chemical strengthening layer 28 formed via a secondary chemical strengthening treatment is formed at least on the newly formed surface region N. In addition to new The surface region N is formed, and the chemical strengthening layer 28 may also be selectively formed on a portion of the initial strengthened surface region M, such as a region near the newly formed surface region N, to further strengthen the glass strength of the selected region. If necessary, a comprehensive secondary chemical strengthening treatment can be performed on the initial strengthened surface region M. Of course, the process of machining or material removal processing is not limited, and only a new generated surface area N is required to be applied to the embodiment of the present invention. For example, the tempered glass cutting member 20a can also be etched (as shown in FIG. 4 for strengthening). The glass cutting member 20a is etched with a groove 42), punctured (drilled through or without a hole 44 in the tempered glass cutting member 20a as shown in Fig. 5), polished, rounded, etc. to produce a newly formed surface. NS, the chemical strengthening layer 28 formed by the secondary chemical strengthening treatment is formed on at least the newly formed surface region N, so that the entire surface of the tempered glass cutting member 20a has a chemical strengthening layer and a corresponding compressive stress layer, which can be improved. The strength of the entire glass cutting member 20a is strengthened. In addition, the tempered glass cutting member 20a can perform a plurality of different machining or material removal processes, and then perform secondary chemical strengthening on the newly formed newly formed surface. For example, the tempered glass cutting member 20a may first perform a cutting process such as cutting, edging, and lead angle, and then use an etching medium such as hydrofluoric acid (HF) to cut the edges caused by machining processes such as cutting, edging, and lead angle. The crack is removed by etching, so that, for example, the bending strength of the cut glass can be improved first, so that the crack can be avoided or reduced when the glass is bent (the source of the cracked glass), and then the secondary chemistry is performed. The strengthening causes the tempered glass cutting member 20a to have a chemical strengthening layer on the entire surface.

如下以圖6A及圖6B說明進行強化處理的化學強化層深度變化。圖6A顯示經初次化學強化處理之母玻璃基板切割而成的強化玻璃切割件20a,且強化玻璃切割件20a經導圓角處理而產生一新生成表面NS,圖6B顯示再進行二次強化處理後的強化玻璃切割件20a。如圖6A所示,因母玻璃基板已進行初次化學強化處理,故強化玻璃切割件20a具有一深度為T1的化學強化層,且經導圓角處理而產生一不具化學強化層或削弱的化學強化層的新生成表面NS。於進行二次化學強化處理時,已具有深度T1的化學強化層的區域M1、M2可視需要利用一屏蔽層32遮蔽或不使用屏蔽層32遮蔽。屏蔽層32可以是貼附一基材或是直接鍍上一層薄膜,該基材與 薄膜是可以選擇性地在蝕刻處理之後或是二次化學強化處理之後被移除。相反地,若是屏蔽層32是被保留下來,則屏蔽層32可以依照材質與厚度的不同設計直接當作抗反射層(AR)、抗炫光層(AG)或是抗刮層(AS)的至少其中一種光學膜層。再者,於進行二次化學強化處理時,鉀離子會擴散進入屏蔽層32(以鍍膜為例)中並且改變薄膜的折射率,因此可以藉此種方式使薄膜的折射率改變達到預設的較佳值。此種具特定折射率與功能性的光學薄膜搭配強化後的玻璃例如可以提升玻璃的光穿透率並降低環境光的反射率。當進行二次化學強化處理後,新生成表面區域N可形成一深度為d的化學強化層,利用屏蔽層32遮蔽的初始強化表面區域M1仍維持T1的深度,且未被屏蔽層32遮蔽的區域的初始強化表面區域M2的化學強化層深度會加深成為T2(T2>T1)。因此,若初始強化表面區域M2原先的強化層因機械加工或材料移除處理等原因而被削弱或局部移除,亦可利用二次化學強化處理補強。因此,於一實施例中,初始強化表面區域M1、M2可大於新生成表面區域N,經初次化學強化處理所形成的化學強化層可僅存在於初始強化表面區域M1、M2,且經由二次化學強化處理形成的強化層可選擇性地形成於初始強化表面區域M2或不形成於初始強化表面區域M1,也就是可以選擇性地針對需要再補強的初始強化表面區域進行二次強化。此外,經由二次化學強化處理形成的強化層也可以形成於初始強化表面區域M1的部分區域,例如靠近導圓角(新生成表面NS)的區域M1沒有設置屏蔽層32,使該區域M1再次進行二次強化。 The depth change of the chemical strengthening layer subjected to the strengthening treatment will be described with reference to FIGS. 6A and 6B as follows. 6A shows a tempered glass cutting member 20a cut by a primary chemical strengthening treatment of a mother glass substrate, and the tempered glass cutting member 20a is subjected to rounding processing to produce a newly formed surface NS, and FIG. 6B shows a second strengthening treatment. The rear tempered glass cutting member 20a. As shown in FIG. 6A, since the mother glass substrate has undergone the initial chemical strengthening treatment, the strengthened glass cutting member 20a has a chemical strengthening layer having a depth of T1, and is subjected to rounding treatment to produce a chemical having no chemical strengthening layer or weakening. The newly created surface NS of the enhancement layer. When the secondary chemical strengthening treatment is performed, the regions M1 and M2 of the chemical strengthening layer having the depth T1 may be shielded by a shielding layer 32 or shielded by the shielding layer 32 as needed. The shielding layer 32 may be attached to a substrate or directly coated with a film, the substrate and The film can be selectively removed after the etching process or after the secondary chemical strengthening process. Conversely, if the shielding layer 32 is retained, the shielding layer 32 can be directly used as an anti-reflection layer (AR), an anti-glare layer (AG) or a scratch-resistant layer (AS) depending on the material and thickness. At least one of the optical film layers. Furthermore, in the secondary chemical strengthening treatment, potassium ions diffuse into the shielding layer 32 (for example, a coating film) and change the refractive index of the film, so that the refractive index of the film can be changed to a preset manner by this method. Preferred value. Such an optical film having a specific refractive index and functionality combined with the strengthened glass can, for example, increase the light transmittance of the glass and reduce the reflectance of the ambient light. After the secondary chemical strengthening treatment, the newly formed surface region N can form a chemical strengthening layer having a depth d, and the initial strengthening surface region M1 shielded by the shielding layer 32 still maintains the depth of T1 and is not shielded by the shielding layer 32. The depth of the chemical strengthening layer of the initial strengthened surface region M2 of the region is deepened to become T2 (T2>T1). Therefore, if the original strengthening layer of the initial strengthening surface region M2 is weakened or partially removed due to mechanical processing or material removal treatment, etc., it may be reinforced by secondary chemical strengthening treatment. Therefore, in an embodiment, the initial strengthened surface regions M1, M2 may be larger than the newly formed surface region N, and the chemical strengthening layer formed by the primary chemical strengthening treatment may exist only in the initial strengthened surface regions M1, M2, and The strengthening layer formed by the chemical strengthening treatment may be selectively formed on the initial strengthening surface region M2 or not in the initial strengthening surface region M1, that is, the secondary strengthening may be selectively performed on the initial strengthening surface region that needs to be re-reinforced. Further, the strengthening layer formed by the secondary chemical strengthening treatment may be formed in a partial region of the initial strengthening surface region M1, for example, the region M1 close to the rounded corner (newly generated surface NS) is not provided with the shielding layer 32, so that the region M1 is again Perform secondary reinforcement.

舉另一實施例說明,請參考圖6C,強化玻璃切割件20a例如可作為一覆蓋板41且初始強化表面區域M2上已經藉由黃光、網印等製程形成觸控感測結構45與裝飾層47,之後才進行二次化學強化處理時,初始強化表面區域M1、M2均分別設置屏蔽層46、48作為屏蔽用途,可以讓初始強化表面區域M1、M2的化學強化層維持固定深度,不會再有離子交換或擴散的行為,使強化玻璃切割件20a不致於形變。在此實施例中,強化玻璃切割件20a的切削側面可 以先機械加工製成曲面411,之後再進行蝕刻製程移除裂痕、拋光處理、或是二次強化處理等後續處理作業。最後屏蔽層46、48可以選擇性移除。舉例來說,屏蔽層46(例如是鍍上的一層薄膜)保留下來作為功能性的光學膜,而屏蔽層48(例如是貼附上去的一片保護基材)則被移除。當然屏蔽層46也可以被移除,在此並不予以限制。 For another embodiment, please refer to FIG. 6C, the tempered glass cutting member 20a can be used as a cover plate 41, and the touch-sensing structure 45 and the decoration have been formed by a process such as yellow light or screen printing on the initial reinforcing surface area M2. When the layer 47 is subjected to the secondary chemical strengthening treatment, the initial strengthening surface regions M1 and M2 are respectively provided with the shielding layers 46 and 48 as shielding purposes, and the chemical strengthening layer of the initial strengthening surface regions M1 and M2 can be maintained at a fixed depth. There will be further ion exchange or diffusion behavior so that the tempered glass cutting member 20a is not deformed. In this embodiment, the cutting side of the tempered glass cutting member 20a can be The curved surface 411 is machined first, and then an etching process is performed to remove cracks, polishing treatment, or secondary strengthening treatment. Finally, the shielding layers 46, 48 can be selectively removed. For example, the shielding layer 46 (eg, a plated film) remains as a functional optical film, and the shielding layer 48 (eg, a piece of protective substrate attached) is removed. Of course, the shielding layer 46 can also be removed, which is not limited herein.

換言之,藉由上述實施例的設計,強化玻璃切割件的表層可分佈有至少一第一強化層34及一第二強化層36,且第一強化層34(存在於初始強化表面區域M1、M2)例如可經由初次化學強化處理及二次化學強化處理的作用後形成,且第二強化層36(存在於新生成表面區域N)可僅經由二次化學強化處理的作用形成,第一強化層34的深度為T(T=T1或T=T2),且第二強化層36的深度為d。舉例來說,當在二次化學強化處理前已經在玻璃基板上製作有薄膜結構,例如觸控感測結構或是顯示單元,此時二次化學強化製程溫度或是製程時間通常低於初次化學強化製程溫度或是製程時間,以避免傷到原有的薄膜結構,所以藉由二次化學強化製程產生的強化層深度會小於初次化學強化製程產生的強化層深度,故於一實施例中,經過初次化學強化處理、機械加工或材料移除處理及二次化學強化處理的強化玻璃切割件20a可具有如下特性:(d/T)≦70%;其中d為存在於新生成表面區域N的化學強化層的平均深度,且T為存在於初始強化表面區域M1、M2的化學強化層的平均深度。 In other words, with the design of the above embodiment, the surface layer of the reinforced glass cutting member may be distributed with at least one first strengthening layer 34 and one second strengthening layer 36, and the first strengthening layer 34 (present in the initial strengthening surface area M1, M2) For example, it can be formed by the action of the primary chemical strengthening treatment and the secondary chemical strengthening treatment, and the second strengthening layer 36 (present in the newly formed surface region N) can be formed only by the action of the secondary chemical strengthening treatment, the first strengthening layer The depth of 34 is T (T=T1 or T=T2), and the depth of the second strengthening layer 36 is d. For example, when a thin film structure, such as a touch sensing structure or a display unit, has been fabricated on a glass substrate before the secondary chemical strengthening treatment, the secondary chemical strengthening process temperature or process time is generally lower than the initial chemical. The process temperature or the process time is strengthened to avoid damage to the original film structure, so the depth of the strengthening layer generated by the secondary chemical strengthening process is smaller than the depth of the strengthening layer generated by the initial chemical strengthening process, so in one embodiment, The tempered glass cutting member 20a subjected to the primary chemical strengthening treatment, the mechanical processing or the material removal treatment, and the secondary chemical strengthening treatment may have the following characteristics: (d/T) ≦ 70%; wherein d is present in the newly generated surface region N The average depth of the chemical strengthening layer, and T is the average depth of the chemical strengthening layer present in the initial strengthening surface regions M1, M2.

於一實施例中,強化層34、36的深度可定義為多個量測點下鉀離子(K+)由玻璃表面朝內部分佈的深度的平均值,通常鉀離子分布情形為表層部位最高,然後漸次向玻璃內部遞減至零或是背景值,故每一量測點量測的深度實質上為玻璃表面到鉀離子分布遞減至零或是背景值的位置兩者的距離,其中背景值係指玻璃製造時所含有的原料部份,例如玻璃原本就含有的鉀離子分佈。換句話說,由於化學強化層是交換離子(例如鉀離子)交換或擴散進入玻璃的深度所界定而來的,而交換離子的濃度分佈會由玻璃基板表面往中心慢慢降 低至零或是背景值,因此化學強化層是否存在可以藉由儀器偵測交換離子的存在而得知。這裡所謂的平均深度可以是強化層深度的平均值。較佳地,是交換離子在玻璃內的最大擴散深度的平均值所定義。實務上,即使是同一道化學強化製程,相鄰兩點的化學強化層深度也會有些許的不同,因此可以藉由偵測幾個不同位置的化學強化層深度,再取其平均值。例如取強化後的玻璃基板上5點不同位置,用儀器偵測鉀離子的擴散深度,再加以平均得其值,並以此數值代表整面化學強化層的平均深度T或d。另外,前述鉀離子置換鈉離子的離子交換行為僅為例示而不限定,其它的離子交換行為僅需能產生提高強度的效果,均能應用於本發明的各個實施例。再者,上述個個實施例的玻璃材質並不限定,例如鈉鈣矽酸鹽玻璃、鋁矽酸鹽玻璃等材質均可。 In one embodiment, the depth of the strengthening layers 34, 36 can be defined as the average of the depths of the potassium ions (K + ) distributed from the glass surface toward the inside under a plurality of measuring points, and the potassium ion distribution is usually the highest in the surface layer. Then gradually decreasing to the interior of the glass to zero or the background value, so the depth measured by each measuring point is substantially the distance between the glass surface and the position where the potassium ion distribution is decremented to zero or the background value, wherein the background value is Refers to the portion of the raw material contained in the manufacture of the glass, such as the potassium ion distribution originally contained in the glass. In other words, since the chemical strengthening layer is defined by the depth at which exchange ions (such as potassium ions) are exchanged or diffused into the glass, the concentration distribution of the exchanged ions is slowly reduced from the surface of the glass substrate to the center to zero or the background. The value, therefore, whether the chemical strengthening layer is present can be known by the instrument detecting the presence of exchange ions. The average depth referred to herein may be an average value of the depth of the strengthening layer. Preferably, it is defined as the average of the maximum diffusion depth of the exchange ions within the glass. In practice, even in the same chemical strengthening process, the depth of the chemical strengthening layer between the two adjacent points will be slightly different. Therefore, the depth of the chemical strengthening layer at several different positions can be detected and the average value can be taken. For example, taking 5 points of different positions on the strengthened glass substrate, the diffusion depth of the potassium ions is detected by an instrument, and the average value is obtained, and the value represents the average depth T or d of the chemical strengthening layer. Further, the ion exchange behavior of the potassium ion-substituted sodium ion is merely illustrative and not limited, and other ion exchange behaviors need only produce an effect of improving strength, and can be applied to various embodiments of the present invention. Further, the glass material of each of the above embodiments is not limited, and may be any material such as soda lime silicate glass or aluminosilicate glass.

藉由上述各個實施例的設計,依發明一實施例的玻璃強化方法包含如下步驟。首先對一母片玻璃基材進行初次化學強化處理後,再於母片玻璃基材上進行一母片製程。母片製程例如可包含薄膜沉積、黃光、蝕刻、網印、噴印製程的至少其中之一,以於母片玻璃基材形成一觸控感測結構以及一顯示單元的至少其中之一。接著,切割已進行母片製程後的母片玻璃基材以形成複數個強化玻璃切割件,再對各個強化玻璃切割件進行機械加工或材料移除處理後進行二次化學強化處理。機械加工或材料移除處理可包含磨邊、鑿孔、導角、蝕刻以及拋光工序的至少其中之一,且可包含利用一蝕刻媒介蝕刻各個強化玻璃切割件的邊緣,以消除機械加工過程產生的邊緣裂痕。 With the design of each of the above embodiments, the glass strengthening method according to an embodiment of the invention comprises the following steps. First, a master glass substrate is subjected to a primary chemical strengthening treatment, and then a master process is performed on the mother glass substrate. The master process may include, for example, at least one of a thin film deposition, a yellow light, an etch, a screen printing, and a printing process to form at least one of a touch sensing structure and a display unit on the mother glass substrate. Next, the master glass substrate after the master process has been cut to form a plurality of tempered glass cutters, and each of the tempered glass cutters is subjected to secondary chemical strengthening treatment after mechanical processing or material removal treatment. The machining or material removal process can include at least one of edging, puncturing, guiding, etching, and polishing processes, and can include etching the edges of the respective tempered glass cutting members with an etchant to eliminate machining processes The edge of the crack.

如前述,在初次化學強化處理與二次化學強化處理的過程中間,可以選擇性地再利用例如氫氟酸(HF)的蝕刻媒介將切割、鑿孔、磨邊、導角等機械加工過程造成的邊緣裂痕先予以蝕刻去除或減小裂痕,以降低當玻璃遇到外力而從這些裂痕破裂的機率。如此,新生成表面區域的表面上會形成有複數個圓弧狀或齒狀的凹槽蝕刻結構43,如圖7所示。蝕刻媒介可以是乾蝕刻媒介或濕蝕 刻媒介,並不予以限制,乾蝕刻媒介例如為含氟氣體或電漿,而濕蝕刻媒介可以例如為至少含氫氟酸或含氟之溶劑。 As described above, in the middle of the chemical strengthening treatment and the secondary chemical strengthening treatment, an etching medium such as hydrofluoric acid (HF) can be selectively used to cause cutting, boring, edging, and lead angle machining. The edge cracks are first etched to remove or reduce cracks to reduce the chance of the glass breaking from these cracks when it encounters an external force. Thus, a plurality of arc-shaped or tooth-shaped groove etching structures 43 are formed on the surface of the newly formed surface region, as shown in FIG. The etching medium can be a dry etching medium or a wet etching The medium is not limited, and the dry etching medium is, for example, a fluorine-containing gas or a plasma, and the wet etching medium may be, for example, a solvent containing at least hydrofluoric acid or fluorine.

請參考圖8,本發明的強化玻璃切割件20a藉由未切割前的母片製程,例如薄膜沉積、黃光、蝕刻、網印或噴印等製程預先製作裝飾層52與觸控感測結構54於母片玻璃基材上,接著再切割成小片的覆蓋板51。切割後對覆蓋板側邊表面511進行選擇性蝕刻以及二次化學強化處理,即可獲得有效強化的覆蓋板51。同樣地,強化玻璃切割件20a也可以藉由前述的母片製程預先製作顯示單元55於母片玻璃基材上,接著再切割成小片的陣列基板(array substrate)作為液晶顯示器(LCD)或是有機發光二極體顯示器(OLED)的下基板56,再與另一個彩色濾光片基板或是封裝蓋57組合成顯示器58。 Referring to FIG. 8 , the tempered glass cutting member 20 a of the present invention pre-fabricates the decorative layer 52 and the touch sensing structure by a mastering process before uncutting, such as thin film deposition, yellow light, etching, screen printing or printing. 54 is placed on the mother glass substrate and then cut into small pieces of the cover sheet 51. After the cutting, the cover plate side surface 511 is selectively etched and subjected to secondary chemical strengthening treatment to obtain an effectively strengthened cover sheet 51. Similarly, the tempered glass cutting member 20a can also pre-form the display unit 55 on the mother glass substrate by the above-mentioned master process, and then cut into small pieces of an array substrate as a liquid crystal display (LCD) or The lower substrate 56 of the organic light emitting diode display (OLED) is combined with another color filter substrate or package cover 57 to form a display 58.

一般而言,觸控感測結構是由圖案化的電極層所構成的,例如圖9所示的觸控感測結構54主要是由縱向的第一電極串列542以及橫向的第二電極串列544所構成。導電走線545形成於裝飾層52上或是作為電極串列內的橋接線,導電走線545可以是金屬走線或是透明的導電走線。在圖9中僅示意部分的導電走線545,其餘的省略不予繪出。 In general, the touch sensing structure is formed by a patterned electrode layer. For example, the touch sensing structure 54 shown in FIG. 9 is mainly composed of a longitudinal first electrode string 542 and a lateral second electrode string. Column 544 is constructed. The conductive traces 545 are formed on the decorative layer 52 or as a bridge within the electrode string. The conductive traces 545 can be metal traces or transparent conductive traces. Only a portion of the conductive traces 545 are shown in FIG. 9, and the rest are omitted.

另外,觸控感測結構54也可以是由圖案化的單層電極層所構成的,例如圖10所示的觸控感測結構54主要是由按鍵形單層電極(button type single layer electrode)546以及三角形單層電極(triangle type single layer electrode)548所組成。這裡所謂的按鍵形單層電極或是三角形單層電極也可以是整面的透明電極圖案或是像圖式中所示的網狀細金屬線所構成的圖案。導電走線549形成於裝飾層52上,導電走線545可以是金屬走線或是透明的導電走線。在圖10中僅示意部分的導電走線549,其餘的省略不予繪出。孔洞53形成於覆蓋板51的上方裝飾層52的區域內,經過蝕刻製程以及二次化學強化處理後,孔洞53的玻璃強度可以有效提升。 In addition, the touch sensing structure 54 may also be formed by a patterned single layer electrode layer. For example, the touch sensing structure 54 shown in FIG. 10 is mainly composed of a button type single layer electrode. 546 and a triangle type single layer electrode 548. Here, the button-shaped single-layer electrode or the triangular single-layer electrode may be a full-surface transparent electrode pattern or a pattern formed by a mesh-like thin metal wire as shown in the drawing. Conductive traces 549 are formed on the decorative layer 52. The conductive traces 545 can be metal traces or transparent conductive traces. Only a portion of the conductive traces 549 are illustrated in FIG. 10, and the rest are omitted. The hole 53 is formed in the region of the upper decorative layer 52 of the cover sheet 51. After the etching process and the secondary chemical strengthening treatment, the glass strength of the hole 53 can be effectively improved.

請參考圖6A、圖6B與圖11,當本發明的強化玻璃切割件20a作為覆蓋板時,可以如前述對各個強化玻璃切割件進行機械加工處理後進行二次化學強化處理。在此實施例中,採用機械加工例如磨邊與導角,先將覆蓋板61的側邊製作成曲面611,之後再針對曲面611進行二次化學強化處理。在進行二次化學強化處理前,覆蓋板61上預先設置一屏蔽層例如是鍍上一層光學膜63,二次化學強化處理後光學膜63被保留下來當作具功能性的光學膜。可以依照材質與厚度的不同設計直接當作抗反射層(AR)、抗炫光層(AG)或是抗刮層(AS)的至少其中一種。覆蓋板61的另一表面上設置有裝飾層62,在進行二次化學強化處理前,具有裝飾層的表面預先貼附有屏蔽層例如是可移除的保護膜,二次化學強化處理後此保護膜即可被撕除。在本實施例中,製作完成的覆蓋板61與一觸控面板65、顯示器68一起組成觸控顯示裝置60的產品。其中,觸控面板65是由基板66與觸控感測結構64所組成。圖11中所示的觸控感測結構64是位於基板66的兩邊,但不以此為限,也可以是在基板66單邊的觸控感測結構64。 Referring to FIG. 6A, FIG. 6B and FIG. 11, when the tempered glass cutting member 20a of the present invention is used as a cover sheet, the tempered glass cutting members may be subjected to a secondary chemical strengthening treatment after being mechanically processed as described above. In this embodiment, the side edges of the cover sheet 61 are first formed into a curved surface 611 by mechanical processing such as edging and lead angle, and then the secondary chemical strengthening treatment is performed on the curved surface 611. Before the secondary chemical strengthening treatment, a shielding layer is provided on the cover sheet 61, for example, by plating an optical film 63, and the optical film 63 is retained as a functional optical film after the secondary chemical strengthening treatment. It can be directly used as at least one of an anti-reflection layer (AR), an anti-glare layer (AG) or a scratch-resistant layer (AS) depending on the material and thickness. The other surface of the cover plate 61 is provided with a decorative layer 62. Before the secondary chemical strengthening treatment, the surface of the decorative layer is pre-attached with a shielding layer, for example, a removable protective film, after the secondary chemical strengthening treatment. The protective film can be removed. In this embodiment, the completed cover plate 61 together with a touch panel 65 and a display 68 constitute a product of the touch display device 60. The touch panel 65 is composed of a substrate 66 and a touch sensing structure 64 . The touch sensing structure 64 shown in FIG. 11 is located on both sides of the substrate 66, but not limited thereto, and may be a touch sensing structure 64 on one side of the substrate 66.

請參考圖12,在一實施例中,觸控顯示裝置70的強化玻璃切割件20a藉由未切割前的母片製程,例如薄膜沉積、黃光、蝕刻、網印或噴印等製程預先製作一裝飾層72與一觸控感測結構742於母片玻璃基材上,接著再切割成小片的覆蓋板71。與先前實施例不同之處在於另一觸控感測結構744直接設置在液晶顯示器76的彩色濾光基板762表面上,藉此方式使觸控感測結構742與744共同整合成一觸控感測元件。觸控感測結構742與744可以是圖案化的電極層。液晶顯示器76還包括下基板764以及設置在其上的顯示單元75,並與彩色濾光基板762組成液晶面板76。 Referring to FIG. 12, in an embodiment, the tempered glass cutting member 20a of the touch display device 70 is prefabricated by a process such as thin film deposition, yellow light, etching, screen printing or jet printing. A decorative layer 72 and a touch sensing structure 742 are on the mother glass substrate, and then cut into small pieces of the cover plate 71. The difference from the previous embodiment is that the other touch sensing structure 744 is directly disposed on the surface of the color filter substrate 762 of the liquid crystal display 76, thereby integrating the touch sensing structures 742 and 744 into a touch sensing manner. element. Touch sensing structures 742 and 744 can be patterned electrode layers. The liquid crystal display 76 further includes a lower substrate 764 and a display unit 75 disposed thereon, and constitutes a liquid crystal panel 76 with the color filter substrate 762.

在另一實施方式中,觸控感測結構744也可以被省略,而僅以觸控感測結構742進行感測動作,此時觸控感測結構742可以例如是單層的電極或是多層的電極,並不予以限制。 如此,即可形成一具有觸控功能的顯示器76。再者,在本實施例中,與前一個實施例不同之處在於彩色濾光基板762可以置換成有機發光二極體(OLED)的封裝蓋。覆蓋板71結合具觸控功能的顯示器76組合成一個具有強化玻璃保護的觸控顯示裝置70。其餘相同之處不再予以贅述。 In another embodiment, the touch sensing structure 744 can also be omitted, and only the touch sensing structure 742 can perform the sensing action. In this case, the touch sensing structure 742 can be, for example, a single layer electrode or multiple layers. The electrodes are not limited. In this way, a display 76 with touch function can be formed. Furthermore, in the present embodiment, the difference from the previous embodiment is that the color filter substrate 762 can be replaced with a package cover of an organic light emitting diode (OLED). The cover panel 71 is combined with the touch-enabled display 76 to form a touch display device 70 with tempered glass protection. The rest of the similarities will not be repeated.

請參考圖13,在本實施例中,與前一個實施例不同之處在觸控感測結構842與844分別設置在觸控顯示裝置80的覆蓋板81與一透明基板86上,使覆蓋板81結合基板86、顯示器88形成一個具有強化玻璃保護的觸控顯示裝置80。 Referring to FIG. 13 , in the embodiment, the touch sensing structures 842 and 844 are respectively disposed on the cover plate 81 of the touch display device 80 and a transparent substrate 86 to make the cover plate different from the previous embodiment. The 81 combined substrate 86 and display 88 form a touch display device 80 with tempered glass protection.

請參考圖14,在本實施例的觸控顯示裝置90的剖面示意圖中,顯示一發光二極體顯示器96的封裝蓋962兩表面設置有觸控感測結構942、944。一顯示單元95設置在一下基板964上。封裝蓋962、下基板964或覆蓋板91都可以使用本發明的強化方式強化玻璃結構。其餘與前述實施例相同之處不再予以贅述。 Referring to FIG. 14 , in the cross-sectional view of the touch display device 90 of the present embodiment, the touch sensing structures 942 and 944 are disposed on both surfaces of the package cover 962 of the LED display 96 . A display unit 95 is disposed on the lower substrate 964. The encapsulating cover 962, the lower substrate 964, or the cover plate 91 can be reinforced with the reinforcing method of the present invention. The rest of the same points as the foregoing embodiments will not be described again.

請參考圖15,在本實施例的剖面示意圖中,顯示依照本發明方式強化後的覆蓋板1001直接當作一發光二極體顯示器(OLED)100的封裝蓋且具有觸控感測結構1004於覆蓋板1001上。一有機發光二極體顯示單元1005設置在一下基板1008上並且與覆蓋板1001組合成一個具有強化玻璃保護的觸控顯示裝置。圖式中的裝飾層1002設置在覆蓋板1001的上表面,但也可以設置在覆蓋板1001的下表面,並不予以限制。另外,覆蓋板1001的側邊1006可為平面或如前述實施例所示的曲面,並且裝飾層1002可設置在曲面的表面上。 Referring to FIG. 15 , in the cross-sectional view of the present embodiment, the cover plate 1001 that is reinforced according to the present invention is directly used as a package cover of a light-emitting diode display (OLED) 100 and has a touch sensing structure 1004. Covering the board 1001. An organic light emitting diode display unit 1005 is disposed on the lower substrate 1008 and combined with the cover sheet 1001 to form a touch display device with tempered glass protection. The decorative layer 1002 in the drawing is disposed on the upper surface of the cover sheet 1001, but may be disposed on the lower surface of the cover sheet 1001, and is not limited. Additionally, the side 1006 of the cover panel 1001 can be planar or curved as shown in the previous embodiments, and the decorative layer 1002 can be disposed on the surface of the curved surface.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。另外本發明的任一實施例或申請專利範圍不須達成本發明所揭露之全部目的或優點或特點。此外,摘要部分和標題僅是用來輔助專利文件搜尋之用,並非用來限制本發明之權利範圍。 The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.

20‧‧‧強化母玻璃基板 20‧‧‧ Strengthening mother glass substrate

20a‧‧‧強化玻璃切割件 20a‧‧‧Strengthened glass cutting parts

24‧‧‧觸控感測結構 24‧‧‧Touch sensing structure

22、28‧‧‧化學強化層 22, 28‧‧‧ chemical strengthening layer

NS‧‧‧新生成表面 NS‧‧‧Newly generated surface

Claims (36)

一種觸控裝置,包括:一基板,其係為一強化玻璃切割件;以及一觸控感測結構,設置於該強化玻璃切割件上,其中該觸控感測結構包含至少一圖案化電極層,且該圖案化電極層包含至少一由網狀細金屬線所構成的電極圖案。 A touch device includes: a substrate, which is a tempered glass cutting member; and a touch sensing structure disposed on the tempered glass cutting member, wherein the touch sensing structure includes at least one patterned electrode layer And the patterned electrode layer comprises at least one electrode pattern composed of a mesh-shaped thin metal wire. 如請求項1所述之觸控裝置,其中該基板為一覆蓋板。 The touch device of claim 1, wherein the substrate is a cover plate. 如請求項1所述之觸控裝置,更包含:經由二次化學強化處理形成的一化學強化層,其中該強化玻璃切割件係由經初次化學強化處理的一母玻璃基板切割而成,該強化玻璃切割件包含初始強化表面區域及經由機械加工或材料移除處理產生的至少一新生成表面區域,且該化學強化層至少形成於部分該新生成表面區域。 The touch device of claim 1, further comprising: a chemical strengthening layer formed by a secondary chemical strengthening treatment, wherein the strengthened glass cutting member is cut from a mother glass substrate subjected to primary chemical strengthening treatment, The strengthened glass cut comprises an initial strengthened surface area and at least one newly formed surface area resulting from a machining or material removal process, and the chemical strengthening layer is formed at least partially in the newly formed surface area. 如請求項1或3所述之觸控裝置,更包含:一裝飾層,形成於該初始強化表面區域上,且該裝飾層係由陶瓷、類鑽碳、油墨、光阻或樹脂材料的至少其中之一所構成。 The touch device of claim 1 or 3, further comprising: a decorative layer formed on the initial reinforcing surface region, and the decorative layer is made of at least ceramic, diamond-like carbon, ink, photoresist or resin material One of them is composed. 如請求項1所述之觸控裝置,其中該強化玻璃切割件包含初始強化表面區域及經由機械加工或材料移除處理產生的至少一新生成表面區域,且該機械加工或材料移除處理包含切割、磨邊、鑿孔、導角、蝕刻以及拋光工序的至少其中之一。 The touch device of claim 1, wherein the tempered glass cutting member comprises an initial strengthened surface region and at least one newly generated surface region generated via a machining or material removal process, and the machining or material removal process comprises At least one of cutting, edging, boring, guiding, etching, and polishing. 如請求項3或5所述之觸控裝置,其中該新生成表面 區域的表面上更形成有複數個圓弧狀或齒狀的凹槽蝕刻結構。 The touch device of claim 3 or 5, wherein the newly generated surface A plurality of arc-shaped or tooth-shaped groove etching structures are formed on the surface of the region. 如請求項3所述之觸控裝置,其中該初始強化表面區域大於該新生成表面區域。 The touch device of claim 3, wherein the initial enhanced surface area is larger than the newly generated surface area. 如請求項3所述之觸控裝置,更包含:一屏蔽層,形成於至少部分該初始強化表面區域上。 The touch device of claim 3, further comprising: a shielding layer formed on at least a portion of the initial strengthening surface area. 如請求項8所述之觸控裝置,其中該屏蔽層為一光學膜且具有抗刮、抗炫以及抗反射的至少其中一種功能。 The touch device of claim 8, wherein the shielding layer is an optical film and has at least one of functions of scratch resistance, anti-glare, and anti-reflection. 如請求項1所述之觸控裝置,更包含:一顯示單元,形成於該強化玻璃切割件的表面上。 The touch device of claim 1, further comprising: a display unit formed on a surface of the tempered glass cutting member. 如請求項1所述之觸控裝置,其中該強化玻璃切割件係由經初次化學強化處理之一母玻璃基板,於經由機械加工或材料移除處理後再進行二次化學強化處理所形成,該強化玻璃切割件包含一初始強化表面區域及經由該機械加工或材料移除處理所產生的至少一新生成表面區域,且該強化玻璃切割件符合如下關係式:(d/T)≦70%;其中d為存在於該新生成表面區域的一化學強化層的平均深度,且T為存在於該初始強化表面區域的一化學強化層的平均深度。 The touch device of claim 1, wherein the tempered glass cutting member is formed by one of the primary glass substrates subjected to primary chemical strengthening treatment, and then subjected to secondary chemical strengthening treatment after mechanical processing or material removal treatment. The tempered glass cutting member includes an initial strengthened surface area and at least one newly generated surface area produced by the machining or material removal process, and the tempered glass cutting member conforms to the following relationship: (d/T) ≦ 70% Where d is the average depth of a chemical strengthening layer present in the newly formed surface region, and T is the average depth of a chemical strengthening layer present in the initial strengthening surface region. 如請求項11所述之觸控裝置,其中存在於該初始強化表面區域之至少部分區域的該化學強化層係經由該初次化學強化處理以及該二次化學強化處理過程所形成,且存在於該新生成表面區域的該化學強化層僅由該二次化學強化處理過程所形成。 The touch device of claim 11, wherein the chemical strengthening layer present in at least a portion of the initial strengthened surface region is formed by the primary chemical strengthening treatment and the secondary chemical strengthening treatment process, and is present in the The chemical strengthening layer of the newly formed surface region is formed only by the secondary chemical strengthening treatment process. 如請求項1所述之觸控裝置,其中該強化玻璃切割件具有複數個切削側面,且該些切削側面的至少其中之一係為曲面。 The touch device of claim 1, wherein the tempered glass cutting member has a plurality of cutting sides, and at least one of the cutting sides is a curved surface. 一種觸控裝置,包含:一第一基板,其係為一強化玻璃切割件,其中該強化玻璃切割件係由經初次化學強化處理的一母玻璃基板切割而成;一第一觸控感測結構,設置於該第一基板上;一第二基板,平行該第一基板設置;以及一第二觸控感測結構,設置於該第二基板上,其中該第一觸控感測結構由一第一圖案化電極層構成,該第二觸控感測結構由一第二圖案化電極層構成,且該第一圖案化電極層及該第二圖案化電極層的至少其中之一包含至少一由網狀細金屬線所構成的電極圖案。 A touch device includes: a first substrate, which is a tempered glass cutting member, wherein the tempered glass cutting member is cut from a mother glass substrate that has been subjected to initial chemical strengthening treatment; and a first touch sensing The first substrate is disposed on the first substrate; a second substrate is disposed parallel to the first substrate; and a second touch sensing structure is disposed on the second substrate, wherein the first touch sensing structure is a first patterned electrode layer, the second touch sensing structure is formed by a second patterned electrode layer, and at least one of the first patterned electrode layer and the second patterned electrode layer includes at least one of An electrode pattern composed of a network of thin metal wires. 如請求項14所述之觸控裝置,該強化玻璃切割件包含初始強化表面區域及經由機械加工或材料移除處理產生的至少一新生成表面區域,且該機械加工或材料移除處理包含切割、磨邊、鑿孔、導角、蝕刻以及拋光工序的至少其中之一。 The touch device of claim 14, the tempered glass cutting member comprising an initial strengthened surface region and at least one newly generated surface region produced via a machining or material removal process, and the machining or material removal process comprises cutting At least one of edging, boring, guiding, etching, and polishing. 如請求項15所述之觸控裝置,更包含:經由二次化學強化處理形成的一化學強化層,至少形成於部分該新生成表面區域。 The touch device of claim 15, further comprising: a chemical strengthening layer formed by a secondary chemical strengthening treatment, formed at least in a portion of the newly formed surface region. 如請求項14所述之觸控裝置,更包含:一裝飾層,形成於該第一基板上,且該裝飾層係由陶瓷、類鑽碳、油墨、光阻或樹脂材料的至少其中之一所構成。 The touch device of claim 14, further comprising: a decorative layer formed on the first substrate, wherein the decorative layer is made of at least one of ceramic, diamond-like carbon, ink, photoresist or resin material Composition. 一種觸控顯示裝置,包含:一覆蓋板,其係為一強化玻璃切割件;以及一具有觸控功能的顯示器,設置於該覆蓋板上,且包含:一平面顯示器;以及一觸控面板,位於該覆蓋板與該平面顯示器之間,該觸控面板具有至少一圖案化電極層,且該圖案化電極層包含至少一由網狀細金屬線所構成的電極圖案。 A touch display device includes: a cover plate, which is a tempered glass cutting member; and a display function with a touch function, is disposed on the cover plate, and includes: a flat display; and a touch panel, Located between the cover plate and the flat display, the touch panel has at least one patterned electrode layer, and the patterned electrode layer includes at least one electrode pattern composed of a mesh thin metal wire. 如請求項18所述之觸控顯示裝置,更包含:至少一圖案化電極層,設置於該覆蓋板上,且該圖案化電極層包含至少一由網狀細金屬線所構成的電極圖案。 The touch display device of claim 18, further comprising: at least one patterned electrode layer disposed on the cover plate, wherein the patterned electrode layer comprises at least one electrode pattern composed of a mesh thin metal wire. 如請求項18所述之觸控顯示裝置,更包含:一裝飾層,形成於該覆蓋板上,且該裝飾層係由陶瓷、類鑽碳、油墨、光阻或樹脂材料的至少其中之一所構成。 The touch display device of claim 18, further comprising: a decorative layer formed on the cover plate, wherein the decorative layer is made of at least one of ceramic, diamond-like carbon, ink, photoresist or resin material Composition. 如請求項18所述之觸控顯示裝置,該強化玻璃切割件包含初始強化表面區域及經由機械加工或材料移除處理產生的至少一新生成表面區域,且該機械加工或材料移除處理包含切割、磨邊、鑿孔、導角、蝕刻以及拋光工序的至少其中之一。 The touch display device of claim 18, the tempered glass cutting member comprising an initial strengthened surface region and at least one newly generated surface region generated via a machining or material removal process, and the machining or material removal process comprises At least one of cutting, edging, boring, guiding, etching, and polishing. 如請求項18所述之觸控顯示裝置,其中該具有觸控功能的顯示器更包含:一第一基板,設有一薄膜電晶體陣列;以及一第二基板,位於該第一基板與該覆蓋板之間,且該第二基板上設有至少一圖案化電極層。 The touch display device of claim 18, wherein the touch-enabled display further comprises: a first substrate provided with a thin film transistor array; and a second substrate disposed on the first substrate and the cover plate And at least one patterned electrode layer is disposed on the second substrate. 一種有機發光二極體顯示裝置,包含:一覆蓋板,其係為一強化玻璃切割件; 一觸控感測結構,形成於該強化玻璃切割件上,其中該觸控感測結構包含至少一圖案化電極層,且該圖案化電極層包含至少一由網狀細金屬線所構成的電極圖案;一基板,設置於鄰近該覆蓋板位置處;以及一有機發光二極體顯示單元,設置於該基板上。 An organic light emitting diode display device comprising: a cover plate, which is a tempered glass cutting member; A touch sensing structure is formed on the tempered glass cutting member, wherein the touch sensing structure comprises at least one patterned electrode layer, and the patterned electrode layer comprises at least one electrode composed of a mesh thin metal wire a substrate; disposed adjacent to the cover plate; and an organic light emitting diode display unit disposed on the substrate. 如請求項23所述之觸控裝置,更包含:一裝飾層,形成於該覆蓋板上,且該裝飾層係由陶瓷、類鑽碳、油墨、光阻或樹脂材料的至少其中之一所構成。 The touch device of claim 23, further comprising: a decorative layer formed on the cover plate, wherein the decorative layer is made of at least one of ceramic, diamond-like carbon, ink, photoresist or resin material Composition. 如請求項23所述之觸控裝置,該強化玻璃切割件包含初始強化表面區域及經由機械加工或材料移除處理產生的至少一新生成表面區域,且該機械加工或材料移除處理包含切割、磨邊、鑿孔、導角、蝕刻以及拋光工序的至少其中之一。 The touch device of claim 23, the tempered glass cutting member comprising an initial strengthened surface region and at least one newly generated surface region produced via a machining or material removal process, and the machining or material removal process comprises cutting At least one of edging, boring, guiding, etching, and polishing. 一種觸控裝置,包含:一第一基板,其係為一強化玻璃切割件,其中該強化玻璃切割件係由經初次化學強化處理的一母玻璃基板切割而成;一第二基板,平行該第一基板設置;以及一第一觸控感測結構及一第二觸控感測結構,分別設置於該第二基板上的兩側,其中該第一觸控感測結構由一第一圖案化電極層構成,該第二觸控感測結構由一第二圖案化電極層構成,且該第一圖案化電極層及該第二圖案化電極層的至少其中之一包含至少一由網狀細金屬線所構成的電極圖案。 A touch device comprising: a first substrate, which is a tempered glass cutting member, wherein the tempered glass cutting member is cut from a mother glass substrate which is subjected to primary chemical strengthening treatment; and a second substrate is parallel a first substrate is disposed, and a first touch sensing structure and a second touch sensing structure are respectively disposed on two sides of the second substrate, wherein the first touch sensing structure is formed by a first pattern The second touch sensing structure is composed of a second patterned electrode layer, and at least one of the first patterned electrode layer and the second patterned electrode layer comprises at least one mesh An electrode pattern composed of thin metal wires. 如請求項26所述之觸控裝置,該強化玻璃切割件包 含初始強化表面區域及經由機械加工或材料移除處理產生的至少一新生成表面區域,且該機械加工或材料移除處理包含切割、磨邊、鑿孔、導角、蝕刻以及拋光工序的至少其中之一。 The touch device of claim 26, the tempered glass cutting package Having an initial strengthened surface area and at least one newly formed surface area resulting from a machining or material removal process, and the machining or material removal process comprises at least cutting, edging, boring, guiding, etching, and polishing processes one of them. 如請求項27所述之觸控裝置,更包含:經由二次化學強化處理形成的一化學強化層,至少形成於部分該新生成表面區域。 The touch device of claim 27, further comprising: a chemical strengthening layer formed by a secondary chemical strengthening treatment, formed at least in a portion of the newly formed surface region. 如請求項26、27或28所述之觸控裝置,更包含:一裝飾層,形成於該第一基板上,且該裝飾層係由陶瓷、類鑽碳、油墨、光阻或樹脂材料的至少其中之一所構成。 The touch device of claim 26, 27 or 28, further comprising: a decorative layer formed on the first substrate, and the decorative layer is made of ceramic, diamond-like carbon, ink, photoresist or resin material At least one of them is composed. 一種觸控裝置,包含:一第一基板,其係為一強化玻璃切割件,其中該強化玻璃切割件係由經初次化學強化處理的一母玻璃基板切割而成;一第二基板,平行該第一基板設置;一第三基板,平行該第二基板設置,且該第二基板位於該第一基板與該第三基板之間;以及一第一觸控感測結構及一第二觸控感測結構,分別設置於該第二基板與該第三基板,其中該第一觸控感測結構由一第一圖案化電極層構成,該第二觸控感測結構由一第二圖案化電極層構成,且該第一圖案化電極層及該第二圖案化電極層的至少其中之一包含至少一由網狀細金屬線所構成的電極圖案。 A touch device comprising: a first substrate, which is a tempered glass cutting member, wherein the tempered glass cutting member is cut from a mother glass substrate which is subjected to primary chemical strengthening treatment; and a second substrate is parallel a first substrate is disposed; a third substrate is disposed parallel to the second substrate, and the second substrate is located between the first substrate and the third substrate; and a first touch sensing structure and a second touch The sensing structure is respectively disposed on the second substrate and the third substrate, wherein the first touch sensing structure is formed by a first patterned electrode layer, and the second touch sensing structure is formed by a second patterning The electrode layer is configured, and at least one of the first patterned electrode layer and the second patterned electrode layer comprises at least one electrode pattern composed of a mesh-shaped thin metal wire. 如請求項30所述之觸控裝置,該強化玻璃切割件包含初始強化表面區域及經由機械加工或材料移除處理產生 的至少一新生成表面區域,且該機械加工或材料移除處理包含切割、磨邊、鑿孔、導角、蝕刻以及拋光工序的至少其中之一。 The touch device of claim 30, the tempered glass cutting member comprising an initial strengthened surface area and produced via machining or material removal processing At least one newly created surface area, and the machining or material removal process includes at least one of cutting, edging, boring, guiding, etching, and polishing processes. 如請求項31所述之觸控裝置,更包含:經由二次化學強化處理形成的一化學強化層,至少形成於部分該新生成表面區域。 The touch device of claim 31, further comprising: a chemical strengthening layer formed by a secondary chemical strengthening treatment, formed at least in a portion of the newly formed surface region. 如請求項30、31或32所述之觸控裝置,更包含:一裝飾層,形成於該第一基板上,且該裝飾層係由陶瓷、類鑽碳、油墨、光阻或樹脂材料的至少其中之一所構成。 The touch device of claim 30, 31 or 32, further comprising: a decorative layer formed on the first substrate, and the decorative layer is made of ceramic, diamond-like carbon, ink, photoresist or resin material At least one of them is composed. 一種觸控顯示裝置,包含:一覆蓋板,其係為一強化玻璃切割件;以及一顯示器,設置於該覆蓋板的一側且包含:一第一基板;一第二基板,位於該第一基板與該覆蓋板之間;以及一觸控感測結構,設置於該第二基板上且包含至少一由網狀細金屬線所構成的電極圖案。 A touch display device includes: a cover plate which is a tempered glass cutting member; and a display disposed on one side of the cover plate and comprising: a first substrate; a second substrate located at the first Between the substrate and the cover plate; and a touch sensing structure disposed on the second substrate and including at least one electrode pattern formed by the mesh thin metal wires. 如請求項34所述之觸控顯示裝置,其中該第一基板為陣列基板且該第二基板為一彩色濾光基板。 The touch display device of claim 34, wherein the first substrate is an array substrate and the second substrate is a color filter substrate. 如請求項34所述之觸控顯示裝置,其中該觸控感測結構設置於該第二基板的面向該覆蓋板的一側。 The touch display device of claim 34, wherein the touch sensing structure is disposed on a side of the second substrate facing the cover sheet.
TW103101015A 2012-01-04 2012-01-04 Touch-sensitive device, touch-sensitive display device and organic light-emitting display device TW201418177A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106066747A (en) * 2015-04-22 2016-11-02 财团法人工业技术研究院 Optical film with touch control function
TWI574189B (en) * 2015-04-22 2017-03-11 財團法人工業技術研究院 Optical film with touch function
US9710120B2 (en) 2015-04-22 2017-07-18 Industrial Technology Research Insitute Sensing apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106066747A (en) * 2015-04-22 2016-11-02 财团法人工业技术研究院 Optical film with touch control function
TWI574189B (en) * 2015-04-22 2017-03-11 財團法人工業技術研究院 Optical film with touch function
US9710120B2 (en) 2015-04-22 2017-07-18 Industrial Technology Research Insitute Sensing apparatus
US9946406B2 (en) 2015-04-22 2018-04-17 Industrial Technology Research Institute Optical film with touch function

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