TW201344098A - Illuminant device - Google Patents

Abstract

An illuminant device includes a housing, an electrical traces layer, at least a light emitting device (LED) die, a driving circuit element, a plurality of electrical elements and an electrical connector. The housing has a supporting part and a platform-part connected to a side of the supporting part. The electrical traces layer is positioned on the platform-part. The LED die is positioned on the platform-part and electrically connected to the electrical traces layer. The driving circuit element is positioned on the platform-part and electrically connected to the electrical traces layer. The electrically elements are positioned on the platform-part and electrically connected to the electrical traces layer. The electrical connector is connected to another side of the supporting part.

Description

Illuminating device

The present invention relates to a light-emitting device, and more particularly to a light-emitting device using a light-emitting diode as a light-emitting source.

Light-emitting diode (LED) has the advantages of small size, long service life, not easy to break, mercury-free and power-saving. Therefore, it gradually replaces the status of fluorescent tubes and incandescent bulbs, and is widely used in illumination sources. And decorative light source.

However, compared with other light sources, the higher the power of the light-emitting diode, the more likely the heat-emitting diode is to be dissipated. The main reason is that the light-emitting diode cannot transmit infrared radiation to dissipate heat. Secondly, the multi-layer package of the light-emitting diodes causes junction thermal resistance between different junctions, so that the photodiode cannot be effectively reduced. In general, an excessively high operating temperature causes the light-emitting diode to reduce the light output (light decay) and color shift, and accelerate the aging of the light-emitting diode to shorten its service life.

Secondly, in order to increase the heat dissipation effect, the conventional light-emitting diode bulb uses a metal having a high thermal conductivity, such as aluminum, as a lamp holder to accelerate the heat energy generated when the light-emitting diode bulb is turned on; however, the metal It also has high electrical conductivity, so when the user replaces or touches the light-emitting diode bulb, there is a danger of electric shock.

In view of the foregoing, it is an object of the present invention to provide a light-emitting device in which the lamp holder is sintered using ceramics and has good thermal conductivity and insulation properties.

In order to achieve the above object, the present invention provides a light emitting device comprising a lamp holder, a circuit layer, at least one photodiode die, a driving circuit component, a plurality of electronic components, and a conductive connector, the lamp socket having a lamp holder a support portion and a platform portion connected to one side of the support portion, wherein the circuit layer is disposed on the platform portion, and the light emitting diode die is disposed on the platform portion and electrically connected to the circuit layer, the driving circuit The component is disposed on the platform portion and electrically connected to the circuit layer. The electronic component is disposed on the platform portion and electrically connected to the circuit layer. The conductive connector is disposed on the other side of the support portion.

In summary, the lamp holder of the present invention is formed by ceramic sintering, which has good thermal conductivity and can be quickly guided away from the LED die, driving circuit components and electronic components disposed thereon. Thermal energy; Secondly, the ceramic lamp holder has high insulation, which can avoid electric shock during installation and increase the safety of use.

The above and other objects, features and advantages of the present invention will become more apparent from the <RTIgt;

Referring to the first and second figures, respectively, a perspective view and a cross-sectional view of a light-emitting device according to a first embodiment of the present invention. The light emitting device 10 includes a lamp holder 110, a circuit layer 120, at least one LED die 130, a driving circuit component 140, a plurality of electronic components 150, a conductive connector 160, and a transparent cover 170.

The lamp holder 110 is sintered by using ceramic powder, and has the advantages of high stability, high insulation, and good heat conduction effect. The socket 110 has a support portion 112 and a platform portion 114. The support portion 112 has a first side 1120 and a second side 1122 opposite to the first side 1120. The diameter of the support portion 112 gradually narrows from the first side 1120 toward the second side 1122, so that the support portion 112 is substantially cup-shaped. The outer wall surface of the support portion 112 includes a plurality of radially arranged heat dissipation fins 1124 for quickly guiding the thermal energy generated when the light emitting diode die 130 is lit. The heat sink 1124 and the support portion 112 are preferably used. The ground is formed in one piece.

The platform portion 114 is coupled to the first side 1120 of the support portion 112 , and the platform portion 114 has at least one through hole 1140 . In this embodiment, the support portion 112 and the platform portion 114 are made of the same ceramic powder, such as alumina (Al ₂ O ₃ ), sintered, and preferably, the support portion 112 and the platform portion. 114 is integrally formed, so that not only can the production process be simplified, but also the physical strength of the socket 110 can be enhanced.

The circuit layer 120 is located on the platform portion 114. The circuit layer 120 is made of copper, silver or other conductive material, and can be formed on the platform portion 114 by high temperature sintering in a thick or thin film manner.

The LED die 130 is disposed on the platform portion 114 and electrically connected to the circuit layer 120. The number of the light emitting diode dies 130 may be one or more. In this embodiment, one is exemplified. The LED die 130 may be a flip-chip LED chip for electrically connecting to the circuit layer 120. Alternatively, the LED die 130 may be a horizontal electrode or The vertical electrode illuminates the diode dies and is electrically connected to the circuit layer 120 by wire bonding.

The driving circuit component 140 and the electronic components 150 are respectively disposed on the platform portion 114 and electrically connected to the circuit layer 120. The driving circuit components 140 and the electronic components 150 cooperate to drive the LED body. The granules 130 emit light, wherein the electronic components 150 can be resistors, capacitors or other passive electronic components, and cooperate with the driving circuit component 140 to form an electronic circuit such as rectification, filtering, dimming, and the like. By directly arranging the LED die 130, the driving circuit component 140 and the electronic component 150 on the platform portion 114, it is not necessary to separately provide a driving circuit inside the supporting portion 112, and the lamp can be effectively reduced. The volume of the seat 110.

The conductive connector 160 is connected to the second side 1122 of the support portion 112. The conductive connector 160 is screwed into a common bulb socket (not shown) for electrically connecting to an AC power source. The conductive joint 160 may be an E26 or E27 conductive joint, which is not limited in practice. The plurality of wires 180 are connected to the conductive connector 160 and the conductive layer 120 for transferring power drawn by the conductive connector 160 from the lamp socket to the conductive layer 120 to turn on the driving circuit components 140 and the electrons. Element 150 and the LED die 130. In the present embodiment, the wires 180 are located inside the support base 112, one end of which is connected to the conductive joint 160, and the other end is connected to the circuit layer 120 through the through hole 1140 to electrically connect the conductive joint 160 and the circuit layer 120. .

The transparent cover 170 is disposed on the first side 1120 of the support portion 112 and cooperates with the support portion 112 to seal the LED die 130 , the driving circuit component 140 and the electronic components 150 . The transparent cover 170 is made of a light-transmitting material such as resin, plastic or glass, and can be transparent, translucent or matte depending on the light transmittance; in this embodiment, the transparent cover The mask body 170 is substantially hemispherical. In actual implementation, the light-transmitting cover 170 can be other special lamp-shaped covers depending on the application.

3 and 4 are a perspective view and a partial cross-sectional view of a light-emitting device according to a second embodiment of the present invention. The light-emitting device 10a of the present embodiment is similar to the light-emitting device 10 of the first embodiment, and the same elements are denoted by the same reference numerals. It is worth noting that the difference between the two is: the platform portion 114a of the socket 110a as shown in the third and fourth figures.

The platform portion 114a has a recess 1142a which is fitted by a suitable mold so that the socket 110a has the recess 1142a when it is formed, without using other subsequent processing methods on the platform portion 114a. The groove 1142a is made, which simplifies the production process and improves the yield.

The circuit layer 120 is located in the platform portion 114a and extends from the platform portion 114a into the recess 1142a and forms two separate contacts at the bottom of the recess 1142a. The light-emitting element 130 is disposed in the recess 1142a and electrically connected to the same contact.

The light-emitting device 10a of the present embodiment further includes a light-transmitting colloid 190a disposed in the recess 1142a. The light-transmitting colloid 190a covers the light-emitting diode die 130 and is substantially hemispherical. Light extraction efficiency. The inside of the transparent colloid 190a further includes a wavelength converting substance 192a, which is excited by a part of the light emitted by the LED die 130 to generate a wavelength-converted light. In this embodiment, the light emitted by the LED body 130 is exemplified by blue light. The wavelength conversion light generated by the wavelength conversion substance 192a is exemplified by yellow light, which converts light and other portions of blue light. After the light is mixed, white light can be formed. In actual implementation, the light color of the light emitting diode die 130 and the light color of the wavelength converting material 192a after excitation can be adjusted according to actual needs and limitations.

The functions and related descriptions of other elements of the light-emitting device 10a are substantially the same as those of the light-emitting device 10 of the first embodiment, and will not be described herein. The light emitting device 10a can achieve the same function as the light emitting device 10.

5 and 6 are a perspective view and a cross-sectional view of a light-emitting device according to a third embodiment of the present invention. The light-emitting device 10b of the present embodiment is similar to the light-emitting device 10 of the first embodiment, and the same elements are denoted by the same reference numerals. It is worth noting that the difference between the two is that the lamp holder 110b as shown in the fifth and sixth figures is sintered using at least two kinds of ceramic powders.

In the present embodiment, the support portion 112b is sintered by tantalum carbide (SiC), and the land portion 114b is sintered by alumina. Preferably, the support portion 112b and the land portion 114b are integrally formed. The combination of two ceramic materials of different materials can not only make the lamp holder 110b have different colors, but also achieve an aesthetic effect. Secondly, the platform portion 114b formed by using white-toned alumina can reflect the light-emitting diode. The light emitted by the die 130 allows most of the light to exit toward the transparent cover 170. The support portion 112b formed by the high hardness of the carbonized crucible can reduce the probability of collision damage and can avoid The black-toned tantalum carbide absorbs light from the light-emitting diode die 130.

In addition, the platform portion 114b has a through hole 1140b at the center thereof, whereby the plurality of wires 180 can electrically connect the circuit layer 120 and the conductive joint 160 through the through hole 1140b. The driving circuit component 140 and the electronic components 150 are respectively disposed on the platform portion 114b and surround the through hole 1140b.

The illuminating device 10b of the embodiment further includes a plurality of illuminating diode dies 130 disposed at equal intervals on the platform portion 114b and surrounding the driving circuit component 140 and the electronic components 150. In order to reduce the probability of light being shielded by the driving circuit component 140 and the electronic components 150.

The functions and related descriptions of other components of the illuminating device 10b are substantially the same as those of the illuminating device 10 of the first embodiment, and will not be described herein. The light emitting device 10b can achieve the same function as the light emitting device 10.

In summary, the lamp holder of the present invention is formed by ceramic sintering, which has good thermal conductivity and can be quickly guided away from the LED die, driving circuit components and electronic components disposed thereon. Thermal energy; Secondly, the ceramic lamp holder has high insulation, which can avoid electric shock during installation and increase the safety of use.

However, the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the equivalent changes and modifications made by the scope of the present invention should still be covered by the patent of the present invention. The scope of the scope is intended to protect.

10, 10a, 10b. . . Illuminating device

110, 110a. . . Lamp holder

112, 112b. . . Support

114, 114a, 114b. . . Platform department

1120. . . First side

1122. . . Second side

1124. . . heat sink

114. . . Platform department

1140, 1140b. . . perforation

1142a. . . Groove

120. . . Circuit layer

130. . . Light-emitting diode grain

140. . . Drive circuit component

150. . . Electronic component

160. . . Conductive joint

170. . . Light-transmitting cover

180. . . wire

190a. . . Light-transmitting colloid

192a. . . Wavelength converting substance

The first figure is a perspective view of a light-emitting device according to a first embodiment of the present invention.

The second figure is a cross-sectional view of a light-emitting device according to a first embodiment of the present invention.

The third figure is a perspective view of a light-emitting device according to a second embodiment of the present invention.

Figure 4 is a partial cross-sectional view showing a light-emitting device according to a second embodiment of the present invention.

Fig. 5 is a perspective view of a light-emitting device according to a third embodiment of the present invention.

Figure 6 is a cross-sectional view showing a light-emitting device of a third embodiment of the present invention.

10. . . Illuminating device

110. . . Lamp holder

112. . . Support

1120. . . First side

1122. . . Second side

1124. . . heat sink

114. . . Platform department

1140. . . perforation

120. . . Circuit layer

130. . . Light-emitting diode grain

140. . . Drive circuit component

150. . . Electronic component

160. . . Conductive joint

Claims (13)

A light emitting device comprising:
a lamp holder having a support portion and a platform portion connected to one side of the support portion;
a circuit layer disposed on the platform portion;
At least one light emitting diode die is disposed on the platform portion and electrically connected to the circuit layer;
a driving circuit component disposed on the platform portion and electrically connected to the circuit layer;
a plurality of electronic components disposed on the platform portion and electrically connected to the circuit layer; and a conductive joint disposed on the other side of the support portion. The light-emitting device of claim 1, wherein the support portion and the platform portion are integrally formed. The light-emitting device of claim 2, wherein the support portion and the platform portion are formed by sintering using the same ceramic powder. The light-emitting device of claim 2, wherein the support portion and the platform portion are formed by sintering using different ceramic powders. The illuminating device of claim 1, wherein the circuit layer is formed on the platform portion by co-firing. The illuminating device of claim 1, wherein the platform portion has a recess. The illuminating device of claim 6, wherein the circuit layer extends from the platform portion into the recess. The light-emitting device of claim 6, further comprising a light-transmitting colloid disposed in the groove. The light-emitting device of claim 8, wherein the light-transmitting colloid comprises a wavelength converting substance. The illuminating device of claim 1, further comprising a transparent cover body, and the light emitting diode module is combined with the lamp holder. The illuminating device of claim 1, further comprising a plurality of wires, one end of the wires being connected to the conductive connector and the other end being connected to the circuit layer. The illuminating device of claim 11, wherein the platform portion further comprises a through hole, and one end of the wires is connected to the circuit layer through the through hole. The illuminating device according to claim 1, wherein the outer wall surface of the supporting portion comprises a plurality of radially arranged heat radiating fins, and the heat radiating fins are integrally formed with the supporting portion.