TW201342673A - Method for manufacturing light emitting diode - Google Patents

Abstract

A method for manufacturing a light emitting diode (LED) includes: providing a substrate; forming a pin structure and a reflector on the substrate, the pin structure including a first electrode and a second electrode spaced from each other, the reflector, the pin structure and the substrate cooperatively forming a recess therebetween; arranging an LED on the pin structure, and electrically connecting the LED to the first electrode and the second electrode; forming an encapsulation layer in the recess to cover the LED; and processing upper surfaces of the encapsulation layer and the reflector by sandblasting.

Description

Light emitting diode packaging method

The present invention relates to a semiconductor packaging method, and more particularly to a light emitting diode packaging method.

Light Emitting Diode (LED) is a semiconductor component that converts current into light of a specific wavelength range. It has been widely used in current applications due to its high luminous efficiency, small size, light weight, and environmental protection. Among the various fields.

The LED package structure generally includes a susceptor, two electrodes coupled to the pedestal, a luminescent diode chip fixed in the reflective cup of the pedestal and connected to the two electrodes, and an encapsulation layer encapsulating the illuminating diode chip. An encapsulation layer of the light emitting diode is formed in the reflective cup and is flush with the upper surface of the reflective cup. The encapsulation layer is usually formed by injection or casting, and is easy to overflow or flow out from the reflective cup during the encapsulation process to form a burr structure, which affects the process yield of the LED.

The present invention is directed to a light emitting diode packaging method for removing a burr structure of an encapsulation layer.

A light emitting diode packaging method includes the steps of: providing a substrate, forming a pin structure and a reflective cup on the substrate, the pin structure comprising first and second electrodes spaced apart from each other, the reflective cup and the reflective cup a pin structure and a substrate are collectively formed to form a recess; a light emitting element is disposed on the pin structure in the recess, and the light emitting element is electrically connected to the first electrode and the second electrode; and an encapsulation layer is formed in the recess Covering the light-emitting element; and treating the encapsulation layer and the upper surface of the reflective cup with a sand blasting technique.

Compared with the prior art, the above-mentioned method for packaging a light-emitting diode utilizes a sand blasting technique to treat the surface of the package layer, and by the impact and cutting action of the spray, the surface of the package layer is processed into a fine protrusion while removing the burr structure. The rough concave and convex surface not only effectively improves the process yield of the light-emitting diode, but also enhances the scattering of the emitted light and reduces the probability of occurrence of total reflection, thereby improving the light-emitting efficiency of the light-emitting diode while ensuring uniform light emission.

The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings.

The method of encapsulating the LED assembly 100 of the present invention will be further described in detail below with reference to the accompanying drawings.

First Step: Referring first to FIG. 1, a substrate 10 is provided. The substrate 10 includes a first surface 11 and a second surface 12 disposed opposite the first surface 11. The first surface 11 of the substrate 10 forms a lead structure 20, and the lead structure 20 includes a first electrode 21 and a second electrode 22 separated from each other. The first electrode 21 and 22 are first from the substrate 10. Surface 11 extends to the second surface 12.

A reflective cup 30 is further formed on the first surface 11 of the substrate 10. The reflective cup 30 includes an upper surface 31 and a lower surface 32. The surface of the reflective cup 30 can be formed with a highly reflective material, and the reflective cup 30 and the lead The foot structure 20, and the first surface 11 of the substrate not covered by the lead structure 20, are collectively encased to form a recess 33 having a top dimension greater than its bottom dimension. In this embodiment, the reflective cup 30 is integrally molded with the substrate 10 by insert molding technology.

Second step: Referring to FIG. 2, a light-emitting element 40 is disposed on a surface of the first electrode 21 near an end of the second electrode 22, and the light-emitting element 40 is located in the recess 33. The light emitting element 40 is electrically connected to the first electrode 21 and the second electrode 22 respectively by wires. In the embodiment, the light emitting element 40 is a light emitting diode die. It can be understood that, in this step, the light-emitting element 40 can also be fixed on the lead structure 20 in the form of wafer flip-chip, and the two electrodes of the light-emitting element 40 and the first electrode are respectively separated by conductive solid glue. 21. The second electrode 22 is electrically connected.

The third step: Referring to FIG. 3, an encapsulation layer 50 is formed on the light-emitting element 40. The encapsulation layer 50 is filled in the recess 33. The encapsulation layer 50 usually inevitably overflows from the recess 33 to form a burr structure 51 partially covering the upper surface of the reflective cup 30. The encapsulating layer 50 may be a transparent colloid doped with phosphor powder, and the phosphor powder may be garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based phosphor powder, sulfide-based phosphoric acid. One or more of a light powder, a thiogallate-based phosphor, an oxynitride-based phosphor, and a nitride-based phosphor.

Fourth Step: Referring to FIG. 4 and FIG. 5, the upper surface of the encapsulation layer 50 and the reflective cup 30 is treated by a sand blasting technique, that is, the burr structure 51 extending from the recess 33 is processed. Specifically, a high-speed jet beam is formed by using compressed air as a power, and the spray material is sprayed onto the surface of the encapsulation layer 50 at a high speed. The burr structure 51 is removed due to the impact and cutting action of the spray material, and the surface of the encapsulation layer 50 is The upper surface 31 of the reflector cup 30 is flush. At the same time, the surface of the encapsulation layer 50 and the upper surface of the reflective cup 30 are processed to form a rough uneven surface 52 uniformly distributed with fine protrusions, so that the light-emitting surface of the light-emitting diode 100 becomes rough, thereby ensuring the light-emitting diode. The light output of 100 is uniform, and the probability of total reflection of the emitted light is reduced, thereby improving the light-emitting efficiency of the light-emitting diode 100.

Compared with the prior art, the above-described method of packaging the light-emitting diode 100 utilizes a sand blasting technique to treat the surface of the package layer 50, and by the impact and cutting action of the spray, the surface of the package layer 50 is processed to have the burr structure 51 removed. The fine convex rough surface 52 not only effectively improves the process yield of the light-emitting diode 100, but also enhances the scattering of the emitted light and reduces the probability of occurrence of total reflection, thereby improving the light-emitting diode while ensuring uniform light emission. The light extraction efficiency of the body 100. Furthermore, the blasting technique is used to remove the burr structure 51 and form a rough illuminating surface, which simplifies the packaging process of the illuminating diode 100 and facilitates mass production.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100. . . Light-emitting diode

10. . . Substrate

11. . . First surface

12. . . Second surface

20. . . Pin structure

twenty one. . . First electrode

twenty two. . . Second electrode

30. . . Reflective cup

31. . . Upper surface

32. . . lower surface

33. . . Depression

40. . . Light-emitting element

50. . . Encapsulation layer

51. . . Burr structure

52. . . Concave surface

1 to FIG. 5 are schematic diagrams showing steps of a method for packaging a light emitting diode according to an embodiment of the present invention.

10. . . Substrate

20. . . Pin structure

twenty one. . . First electrode

twenty two. . . Second electrode

30. . . Reflective cup

40. . . Light-emitting element

50. . . Encapsulation layer

52. . . Concave surface

Claims (7)

A light emitting diode packaging method includes the following steps:
Providing a substrate, a pin structure and a reflective cup are formed on the substrate, the pin structure includes a first electrode and a second electrode spaced apart from each other, and the reflective cup and the lead structure and the substrate are disposed together to form a recess;
Providing a light emitting element on the pin structure in the recess, and electrically connecting the light emitting element to the first electrode and the second electrode;
Forming an encapsulation layer in the recess to cover the light emitting element; and treating the encapsulation layer and the upper surface of the reflective cup by a sand blasting technique. The method of claim 2, wherein the step of forming a lead structure and a reflective cup on the substrate is performed by insert molding the reflective cup and the substrate. The method of claim 2, wherein in the step of treating the encapsulation layer and the upper surface of the reflective cup by the blasting technique, the blasting technique applies the surface of the encapsulation layer and the reflective cup. The surface is processed into a rough uneven surface uniformly distributed with fine projections. The light emitting diode packaging method of claim 1, wherein the substrate comprises a first surface and a second surface disposed opposite to each other, the pin structure extending from the first surface to the second surface of the substrate . The method of claim 2, wherein in the step of disposing a light-emitting element on the lead structure, the light-emitting element is disposed on the first electrode adjacent to the second electrode On the surface of one end. The LED package method of claim 5, wherein in the step of disposing the light-emitting element on the lead structure, the light-emitting element is respectively connected to the first electrode and the second electrode by wire bonding Form an electrical connection. The method of claim 2, wherein in the step of disposing the light-emitting element on the lead structure, the light-emitting element is respectively separated from the first electrode by the flip-chip method. The two electrodes form an electrical connection.