JP2012182208A - Led package and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To maintain excellent light-emitting properties by reducing damage to an inner wall of white resin caused by light emission of an LED chip.SOLUTION: An LED package has a pad part 7 and a lead part 8 on a lead frame body 3 on which an LED chip 10 for emitting blue light is mounted. The LED package also has a reflector part 6 made of white resin which has a recessed cavity 5 provided with an inner wall 5a formed on the lead frame body 3 to surround the pad part 7 and the lead part 8. Yellow phosphors 13 are adhered in a relatively high density to the inner wall 5a defining the cavity 5. The cavity 5 is filled with transparent sealing resin 12 in which the yellow phosphors 13 are dispersed in a relatively low density. Part of the blue light which advances toward the inner wall 5a collides against the yellow phosphors 13 to be excited by yellow light, thereby suppressing damage to the inner wall 5a of the white resin.

Description

  The present invention relates to an LED package including a lead frame for an LED light emitting element on which an LED chip (Light Emitting Diode) is mounted, and a method for manufacturing the same.

  In general, a lead frame for mounting an electronic element such as a semiconductor integrated circuit or an LED light emitting element is for a lead frame made of a plate-like alloy thin plate such as iron-nickel or an alloy thin plate such as copper-nickel-tin. A metal material is manufactured by etching from one or both sides using an etchant such as ferric chloride. The lead frame manufactured in this way has a pad portion (island portion) for mounting a semiconductor integrated circuit and an LED element, and a lead that is insulated from the pad portion and electrically connected to an electronic element. Part (island part).

  A mounting portion (mounting surface) for mounting an electronic element is provided on the surface side of the pad portion of the lead frame. On the back surface side, a heat radiating portion (heat radiating surface) is provided to dissipate driving heat generated from an electronic element body such as an LED light emitting element and heat due to environmental conditions around the electronic element. The heat radiating portion radiates heat so that heat is not accumulated on the electronic element side.

The LED package is manufactured using the lead frame or the like designed as described above. This LED package is a light-emitting device using a light-emitting diode as a light source, and the most common one is an integrated heat sink, lead frame, and case.
The heat sink is required for heat diffusion, the lead frame is required for electrical conduction, and the case is required for insulation and heat dissipation. An LED chip is mounted on a substrate formed of these, and resin-molded with a sealing resin such as epoxy resin or silicone resin, and packaged is called an LED package.

In recent years, this LED package has been widely used for various electronic components including lighting. Therefore, it is required to efficiently extract the light emitted from the LED chip, and not only the light emitted directly from the light emitting element but also the reflection by providing a reflector so that more light is emitted to the outside. A package with high brightness is required.
As an LED package in which high-energy short-wavelength light emitted from an LED chip is emitted to the outside and the brightness of the LED is improved, for example, those described in Patent Documents 1 to 3 have been proposed.

  In the LED package described in Patent Document 1, an LED chip is mounted on a substrate made of an insulating material, one electrode of the LED chip is connected to one external electrode, and the other electrode of the LED chip is connected to the other external electrode. Is connected. Then, the LED chip is covered with a dome-shaped non-woven fabric, and a pigmented phosphor having a red pigment adhered to the surface of the yellow phosphor is carried on the surface of the non-woven fabric.

Moreover, in the LED package described in Patent Document 2, an LED chip that emits ultraviolet light is mounted on the pad portion, and the wavelength of ultraviolet light is converted into visible light in a coating layer that covers and seals the LED chip in the concave portion of the reflector. The phosphor is mixed in a dispersed state. Thereby, the ultraviolet light emitted from the LED chip is wavelength-converted into visible light by the phosphor.
In another example, a coating layer for covering and sealing the LED chip and a phosphor layer mixed with the phosphor in a dispersed state are laminated in two layers in the concave portion of the reflector. In this case, since the ultraviolet light emitted from the LED chip passes through the coating layer and is converted into visible light by the phosphor layer and immediately enters the exterior body, the extraction efficiency of visible light is improved.
Furthermore, in the LED light-emitting device described in Patent Document 3, a resin layer containing a light-reflective filler is coated on the inner wall of a reflector that surrounds the LED chip, and a concave member of the reflector is filled with a sealing member.

As another example, in the LED package 50 shown in FIG. 5, the LED chip 52 is mounted on the pad part 51 a of the metal part 51 constituting the lead frame, and the LED chip 52 and the lead part 52 are connected by the wire W. Yes. Further, a reflector portion 53 made of an insulating white resin is formed so as to surround the LED chip 52 and the lead portion 56 thereof. The concave portion of the reflector portion 53 is filled with, for example, a transparent sealing resin 55 in which a yellow phosphor 54 is dispersed and mixed with a uniform density.
Therefore, for example, blue light having a short wavelength and high energy emitted from the LED chip 52 becomes yellow light with a probability that a part of the blue light is excited by the yellow phosphor 54, and pseudo white light is generated by the blue light and the yellow light. It is supposed to let you.

Utility Model Registration No. 3117306 JP 2003-197978 A JP 2007-42668 A

Incidentally, in the LED package 50 shown in FIG. 5, as shown in FIG. 6, part of the blue light emitted from the LED chip 52 collides with the yellow phosphor 54 near the inner wall 53 a of the reflector portion 53 of the sealing resin 55. However, since yellow light has lower energy than blue light, even if it collides with the white resin on the inner wall 53a, the damage received by the white resin is small.
However, when blue light directly collides with the white resin on the inner wall 53a, the energy is high at a short wavelength, so the white resin turns yellow and damages the inner wall 53a. As a result, the color balance between the blue light emitted from the LED chip 3 and the yellow light that is the excitation light of the yellow phosphor is lost, and the color of the light emitted from the LED package 50 deviates from white as a whole. .

  The present invention has been made in view of the above problems, and an LED package that can maintain good light emission characteristics by reducing damage received by a white resin that forms an inner wall by light emitted from an LED chip. And it aims at providing the manufacturing method.

An LED package according to the present invention includes a pad portion on which an LED chip is mounted, a lead portion that is electrically connected to the LED chip, and a cavity having a concave shape in which an inner wall is formed so as to surround the pad portion and the lead portion. In an LED package equipped with a reflector made of white resin, phosphor is attached to the inner wall forming the cavity at a relatively high density, and the cavity is filled with sealing resin in which the phosphor is dispersed at a relatively small density It is characterized by being made.
According to the LED package of the present invention, part of the light emitted from the LED chip collides with a relatively low-density phosphor dispersed in the sealing resin and is excited by other colors such as yellow light. However, some of the light travels in the direction of colliding with the inner wall of the reflector made of white resin, most of which collides with the relatively high-density phosphor attached to the inner wall, and other colors such as yellow light. Since it is converted into light and becomes light with low energy and collides with the inner wall, the damage of the white resin is small and yellowing of the inner wall is suppressed. Therefore, the color balance between the light emitted from the LED chip and the light that changes color by colliding with the phosphor and the light that collides with the inner wall and reflected is good, and the total light color is set as pseudo-white to the outside. Emits light.
Therefore, the inner wall made of white resin in the cavity can be protected from discoloration by the phosphor adhered with high density. In particular, since the phosphor adhering to the inner wall has a relatively high density and the phosphor in the sealing resin is dispersed at a relatively low density, the yellowing of the white resin is suppressed. The light emitted to the outside can be maintained as white light while maintaining a good color balance with the light.

The inner wall is preferably roughened by forming fine irregularities.
By roughening the inner wall made of white resin by, for example, a wet blasting method or the like, fine irregularities are formed on the inner wall, and the adhesion of the phosphor is improved.

The phosphor is preferably a yellow phosphor. In this case, the LED chip is preferably blue light with high energy.
When the high energy blue light emitted from the LED chip hits the inner wall, the white resin turns yellow, but the yellow phosphor is attached to the inner wall at a relatively high density so that the blue light is reduced in energy by the yellow phosphor. Since it is converted into yellow light, yellowing of the inner wall of the white resin can be suppressed, while the yellow phosphor in the sealing resin has a relatively low density, and therefore, the yellow phosphor has a high proportion of emission as blue light. The ratio of collision to yellow light is small, and pseudo white light can be emitted to the outside while maintaining a balance between blue light and yellow light.

The phosphor is preferably a red phosphor, a green phosphor and a blue phosphor. In this case, the LED chip is preferably a high energy near ultraviolet light.
When the high energy near ultraviolet light emitted from the LED chip hits the inner wall, the white resin turns yellow, but the red phosphor R, the green phosphor G, and the blue phosphor B are attached to the inner wall at a relatively high density. Thus, yellowing of the inner wall of the white resin due to near-ultraviolet light can be suppressed, while the red phosphor R, the green phosphor G, and the blue phosphor B in the sealing resin have relatively low density, It is possible to emit pseudo white light to the outside while maintaining the balance of the three primary colors consisting of red light and green light.

An LED package manufacturing method according to the present invention includes a pad portion on which an LED chip is mounted, a lead portion that is electrically connected to the LED chip, and a concave shape in which an inner wall is formed so as to surround the pad portion and the lead portion. After forming a lead frame for an LED light emitting device with a reflector made of white resin with a cavity, and attaching the phosphor to the inner wall forming the cavity with a relatively large density, compare the phosphor in the cavity. It is characterized in that it is filled with a sealing resin dispersed at a relatively small density.
According to the method for manufacturing an LED package according to the present invention, the phosphor is first attached to the inner wall of the reflector portion made of the white resin in the concave cavity, and then the phosphor is attached to the relatively low density. Since the dispersed sealing resin is filled, after the sealing resin is cured, the inner wall to which the phosphor is attached at a relatively high density, and the cavity including the inner wall includes the phosphor at a relatively low density. The sealing resin can be formed integrally.

The inner wall may be roughened by forming fine irregularities in advance.
By roughening the inner wall of the cavity made of white resin by various surface roughening methods such as a wet blasting method, fine irregularities are formed on the inner wall, and the adhesion is improved when the phosphor is attached.
When the inner wall is roughened, the resin burrs are removed by deburring after embedding and curing the resin around and between the metal pad and lead in the lead frame forming process. Alternatively, the inner wall of the white resin may be roughened.

Moreover, you may make it apply | coat the coating liquid containing a fluorescent substance to the inner wall of a cavity, and a fluorescent substance can be made to adhere to an inner wall by apply | coating a coating liquid to the inner wall of white resin.
Moreover, you may make it spray the coating liquid containing a fluorescent substance on the inner wall of a cavity, and a fluorescent substance can be made to adhere to an inner wall by spraying a coating liquid on the inner wall of white resin.

The light emitted from the LED chip is preferably blue light, and the phosphor is preferably a yellow phosphor.
With this configuration, yellow light emitted from the blue LED chip collides with the yellow phosphor attached to the inner wall made of white resin, resulting in yellow light, so that yellowing and damage of the inner wall can be suppressed, and The other part collides with the yellow phosphor dispersed in the sealing resin and is excited by the yellow light, so the pseudo white light is externalized by the color balance of the blue and yellow light that does not collide with the yellow phosphor. Can emit light.

The light emitted from the LED chip may be near ultraviolet light, and the phosphor may be a red phosphor, a green phosphor, or a blue phosphor.
With this configuration, the near-ultraviolet light collides with the red, green, and blue phosphors that are attached to the inner wall made of white resin, and is excited and converted into light with low energy. And other parts of the blue light collide with the red phosphor, green phosphor and blue phosphor dispersed in the sealing resin and are excited by each color light. Pseudo white light can be emitted to the outside by the color balance of red light and green light.

  According to the LED package according to the present invention, the density of the phosphor attached to the inner wall made of the white resin of the pad portion on which the LED chip is mounted and the reflector portion surrounding the lead portion is dispersed in the sealing resin. Since it is set to a density higher than the density of the body, the inner wall of the white resin can be reduced by the light emitted from the LED chip, and the density of the phosphor in the sealing resin is relatively sparse, so the LED chip The color balance between the light emitted from the light and the light excited by the phosphor is maintained well, and the total light shift can be suppressed.

  According to the LED package manufacturing method of the present invention, a relatively high density phosphor is adhered to the inner wall made of white resin forming the cavity, and then a relatively low density phosphor is dispersed in the cavity. Since the sealing resin is filled, the phosphor can be easily manufactured even if the density of the phosphor differs between the inner wall of the cavity made of white resin and the sealing resin filled in the cavity. Thereby, damage to the inner wall of the white resin due to light emission from the LED chip can be suppressed, and light emitted to the outside of the LED package can be prevented from deviating from white, so that good light can be emitted.

It is a top view of the LED package by embodiment of this invention. It is AA sectional view taken on the line of the LED package shown in FIG. It is a principal part enlarged view which shows the state which blue light collides with the yellow fluorescent substance of the inner wall of the reflector part shown in FIG. It is a figure which shows the manufacturing process of the LED package by embodiment, (a) is sectional drawing of the lead frame before application | coating of a yellow fluorescent substance containing coating material, (b) is the lead frame of the state which mounted the LED package in the pad part. Sectional drawing (c) is a sectional view of a lead frame in a state where a yellow phosphor-containing paint is applied to the inner wall. It is principal part sectional drawing of the LED package by a prior art. It is an enlarged view of the inner wall part of the reflector part shown in FIG.

Hereinafter, an LED package according to an embodiment of the present invention will be described in detail with reference to the drawings.
In the LED package 1 shown in FIGS. 1 and 2, an LED light-emitting element lead frame (hereinafter simply referred to as a lead frame) 2 is formed on a plate-like lead frame main body 3 made of a metal portion and an upper surface of the lead frame main body 3. And a resin-molded insulating white resin 4.
The white resin 4 is a reflector portion 6 in which a concave portion for accommodating the LED chip 10 is integrally formed, and this concave portion constitutes a cavity 5. The LED chip 10 is, for example, a blue light emitting LED chip. In addition, the exterior body is abbreviate | omitted.

The metal part of the lead frame body 3 is made of, for example, a plate-like alloy thin plate such as iron-nickel or an alloy thin plate such as copper-nickel-tin. The lead frame body 3 is a member formed by etching this metal alloy plate-like base material, and includes a pad portion 7 on which the LED chip 10 is mounted and a lead portion 8 that supplies power to the LED chip 10. Are separated by a slit 9, and an insulating resin is filled in the slit 9 to insulate the pad portion 7 from the lead portion 8.
As shown in FIG. 2, the pad portion 7 has a front surface (upper surface) as a mounting surface A for mounting the LED chip 10, and a back surface (lower surface) opposite to the mounting surface A has a pad heat dissipation surface B. Has been. The pad heat radiating surface B functions as a heat radiating part that dissipates heat from driving heat generated from the LED chip 10 and ambient environmental conditions of the LED chip 10.

    The lead portion 8 is arranged at a position spaced apart from the pad portion 7 in the horizontal direction by a slit 9. In addition, the structure which the lead part 8 isolate | separated and provided in the both sides of the pad part 7, for example may be sufficient. The lead portion 8 has the same thickness as the pad portion 7, and the surface (upper surface) of the lead portion 8 is a connection surface C that is electrically connected to the LED chip 10, and is opposite to the connection surface C. The back surface (lower surface) of the lead is a lead heat radiating surface D that functions as a heat radiating portion that radiates heat generated in the lead portion 8.

For example, since the mounting surface A of the pad portion 7 and the connection surface C of the lead portion 8 are formed from the same plate-like base material, they are the same plane unless special processing is performed. Similarly, the pad heat radiating surface B of the pad portion 7 and the lead heat radiating surface D of the lead portion 8 are also flush.
Further, the connection surface C of the lead portion 8 is connected to the LED chip 10 mounted on the pad portion 7 by wire bonding or chip bonding. In the present embodiment, for example, via a wire W made of a gold wire or the like. Electrically connected.
Note that the plating on the connection surface C can be freely selected from silver plating, gold plating, palladium plating, and the like according to the intended use. Further, prior to plating the connection surface C in this manner, the connection surface C may be subjected to base plating such as nickel plating having excellent thermal diffusivity.

The cavity 5 formed on the upper surface of the lead frame main body 3 is formed as a concave portion having a substantially inverted truncated cone shape in which an inner wall 5a is molded around with a white resin 4, and the inner wall 5a includes a pad portion 7 and a lead 8 portion. A substantially inverted frustoconical LED chip storage space is formed together with the surface of the main body 3.
Then, a transparent sealing resin 12 is filled in the substantially inverted truncated cone-shaped recess of the cavity 5. The transparent sealing resin 12 is a resin having a high light transmittance (transmittance of 90 to 95% or more), and in this embodiment, the yellow phosphor 13 is dispersedly contained in the transparent sealing resin 12.
Moreover, as shown in FIGS. 2 and 3, the yellow phosphor 13 is dispersed in the transparent sealing resin 12 other than the inner wall 5 a in the proportion of the yellow phosphor 13 that adheres almost uniformly to the inner wall 5 a of the cavity 5. The density is higher than that of the yellow phosphor 13.

Here, the LED chip 10 emits blue light having a short wavelength of 410 nm, for example, with high energy, and a part of the blue light collides with the yellow phosphor 13 so that it is excited from the blue light and more than the blue light. It becomes yellow light with low energy. And it becomes pseudo white light by the balance of the color of the emitted blue light and the excited yellow light, and it light-emits outside.
In the present embodiment, there is a high ratio that a part of blue light colliding with the inner wall 5a of the cavity portion 5 formed of the white resin 4 becomes yellow light due to the yellow phosphor 13 attached to the inner wall 5a with high density. Moreover, since yellow light has lower energy than blue light, even if it collides with the inner wall 5a of the white resin 4, the damage received by the white resin 4 is small, and therefore the possibility that the white resin 4 will turn yellow is small.

In addition, if the ratio of the yellow phosphor 13 contained in the transparent sealing resin 12 is about the same as the conventional one, the ratio of the yellow phosphor 13 adhering to the inner wall 5a is relatively increased, so that the seals other than the inner wall 5a are sealed. The ratio of the yellow phosphor 13 dispersed in the stop resin 12 is relatively small. If the dispersion ratio of the yellow phosphor 13 in the transparent sealing resin 12 as well as the yellow phosphor 13 adhering to the inner wall 5a is increased, the proportion of blue light excited by yellow light increases. There is a risk that the color of the light emitted from the light will deviate from white, which may cause problems. On the other hand, if the dispersion ratio of the yellow phosphor 13 in the transparent sealing resin 12 is too small, there is a problem that the color of the light emitted to the outside shifts from white.
Therefore, the yellow phosphor 13 dispersed in the cavity portion 5 is balanced by adjusting the density between the ratio of being dispersed and contained in the transparent sealing resin 12 and the ratio of adhering to the inner wall 5a. It is assumed that the light emitted to the outside as a total is balanced with the yellow light that is the excitation light of the blue light so that the light emitted to the outside becomes pseudo white. Moreover, the yellow phosphor 13 attached to the inner wall 5a is set to a high density to suppress yellowing of the white resin 4 and reduce damage.

As the white resin 4, for example, a polyamide-based resin (including an aromatic polyamide-based resin), a liquid crystal polymer, polyphthalamide, nylon 6T, or the like can be used.
As the transparent sealing resin 12, for example, an epoxy resin, a modified epoxy resin, a silicone resin, an acrylic resin, a polycarbonate resin, a polyphthalamide, or the like can be used, and a mixed system of two or more of these can be used. Also good.
Further, as the yellow phosphor 13, for example, an yttrium, aluminum, and garnet phosphor can be used. With this phosphor, blue light can be efficiently converted into yellow or yellow-green light. Note that a material in which part or all of yttrium is replaced with La or Lu can be used, and one in which part or all of aluminum is replaced with In or Sc can also be used.

Next, the manufacturing method of the LED package 1 according to the embodiment will be described with reference to FIG.
First, the process of manufacturing the lead frame 2 will be described with reference to FIG. That is, a metal material for a lead frame having a plate shape made of an alloy thin film such as Fe—Ni or a metal alloy such as Cu—Ni—Sn is prepared. Photoresist (photosensitive resin) is applied to the top and back surfaces of this metal material to form a resist layer, the pattern is exposed to the photoresist layer using a predetermined pattern exposure photomask, and then developed and necessary. The dura is processed accordingly.
As a result, a resist pattern in which the photoresist is developed and removed is formed on the upper surface of the metal material, leaving portions for forming the chip mounting upper surface A of the pad portion 7 and the electrical connection area C of the lead portion 8.

  Next, an etching process (half-etching process) is performed on the upper surface of the metal material on which the resist pattern is formed using an etchant such as ferric chloride. Thus, an etching portion having a relatively small depth is formed by arranging a resist pattern having a narrow range between the portions to be the pad portion 7 and the lead portion 8. Thereby, an uneven shape is formed on the upper surface of the metal material. An uneven shape is similarly formed on the back surface.

    Next, the pad portion 7 and the lead portion 8 are held by the insulating resin of the slit 9 by transfer molding or injection molding, and the reflector portion 6 and the cavity 5 are formed of the insulating white resin 4. As a result, the reflector portion 6 is formed with a cavity 5 having a reflection surface of the inner wall 5a that is enlarged in the shape of a substantially inverted truncated cone by the white resin 4 around the upper surface of the pad portion 7 and the lead portion 8.

Then, base plating such as Ni plating having excellent heat diffusion is performed on the mounting surface A of the pad portion 7 of the lead frame body 3 and the connection surface C of the lead portion 8 in the region surrounded by the inner wall 5a. Silver plating, gold plating, palladium plating, etc. are performed. Here, in order to mount and connect the LED package 1 to an external substrate, silver plating, gold plating, palladium plating, or the like may be performed on the heat radiation back surface B of the pad portion 7 and the heat radiation back surface D of the lead portion 8. .
In this way, the inner wall 5a of the concave portion is formed as a cavity 5 that is inclined outward and expands outward, and the mounting surface A of the pad portion 7 and the connection surface C of the lead portion 8 are exposed at the bottom of the cavity 5. The lead frame 2 is molded.

Next, a method for manufacturing the LED package 1 from the above-described lead frame 2 will be described.
First, in FIG. 4B, the LED chip 10 is mounted on the mounting surface A of the pad portion 7 in the manufactured lead frame 2, and the LED chip 10 and the connection surface C of the lead portion 8 are wire bonded using the wire W. To do.
Next, as shown in FIG. 4C, a coating material containing yellow phosphors 13 at a relatively high density is applied to the inner wall 5 a of the cavity 5 formed of the white resin 4 on the lead frame body 3. As the coating material, for example, a dispersion liquid in which yttrium aluminum garnet phosphor or YAG phosphor is dispersed in a solvent such as hexane or xylene can be used. As a result, the high-density yellow phosphor 13 adheres to the inner wall 5a and is unevenly distributed.

In addition, when apply | coating the coating material containing the high-density yellow fluorescent substance 13 to the inner wall 5a of the cavity 5, the surface of the lead frame main body 3 which consists of a metal part with the white resin 4 of the cavity 5 formed previously is also coat | covered. There is a case. In this case, a coating material containing the yellow phosphor 13 may be applied to the white resin 4 on the surface of the lead frame body 3.
Thereafter, the transparent sealing resin 6 dispersed so that the density of the yellow phosphor 13 on the inner wall 5a is relatively smaller than the density of the yellow phosphor 13 is filled and filled in the cavity 5, and the surface of the lead frame body 3 is filled. The mounting surface A, the connection surface C, and the LED chip 10 are sealed.
In this way, the LED package 1 shown in FIG. 1 is completed.

As described above, according to the LED package 1 according to the present embodiment, when blue light is emitted from the LED chip 10, a part of the blue light traveling in the transparent sealing resin 12 other than the inner wall 5a is yellow. Although it collides with the phosphor 13 and is excited to become yellow light, since the content ratio of the yellow phosphor 13 in this region is lower than the inner wall 5a, there is a large ratio of transmitting as blue light without coming into contact with the yellow phosphor 13.
On the other hand, part of the blue light travels in the direction of the inner wall 5a of the cavity 5, and most of the blue light collides with the yellow phosphor 13 attached to the inner wall 5a at a relatively high density and is excited to become yellow light. Therefore, even if this yellow light collides with the inner wall 5a made of the white resin 4, since the energy is lower than that of the blue light, the damage received by the white resin 4 constituting the inner wall 5a is reduced, and the degree of yellowing of the white resin 4 is reduced. Is suppressed.
Therefore, the blue light emitted from the LED chip 10, the yellow light excited by the yellow phosphor 13, and the yellow light reflected by the inner wall 5a are emitted to the outside as pseudo white light due to balance. Moreover, since the inner wall 5a as the reflector portion 6 formed in the cavity 5 of the white resin 4 can be prevented from being yellowed by the blue light, the color of the light emitted from the LED package 1 to the outside is maintained to be pseudo white. The

  Moreover, according to the method for manufacturing the LED package 1 according to the present embodiment, after the paint including the high-density yellow phosphor 13 is applied to the inner wall 5a of the cavity 5 made of the white resin 4 in advance, the yellow phosphor 13 is relatively Since the transparent sealing resin 12 dispersed at a low density is filled in the cavity 5 and solidified, the density of the yellow phosphor 13 can be divided into a dense and integrated manner between the inside and the peripheral side of the transparent sealing resin 12. .

The present invention is not limited to the LED package 1 and the manufacturing method thereof according to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.
For example, in the above-described embodiment, the blue light LED chip 10 that emits blue light is used as the LED light emitting element, but a near ultraviolet light LED that emits near ultraviolet light may be used instead. In this case, since near ultraviolet light is high energy, when it collides with the inner wall 5a of the white resin 4, it turns yellow and the white resin 4 deteriorates.
Therefore, in this modification, the red phosphor R, the green phosphor G, and the blue phosphor B, which are the three primary colors, are dispersed in the transparent sealing resin 12 instead of the yellow phosphor 13. In this case, the red phosphor R, the green phosphor G, and the blue phosphor B are denser on the inner wall 5a of the cavity 5 formed of the white resin 4 on the lead frame body 3 than in the transparent sealing resin 12. By applying the coating material contained in, the high-density yellow phosphor 13 adheres to the inner wall 5a and is unevenly distributed.

Thereafter, the cavity 5 is filled and filled with a transparent sealing resin 12 in which the density of the phosphor composed of the red phosphor R, the green phosphor G, and the blue phosphor B is made smaller than the inner wall 5a. The mounting surface A, the connection surface C, the LED chip 10 and the wire W on the surface of the frame body 3 may be sealed.
Even in the LED package 1 adopting such a configuration, pseudo-white light can be emitted to the outside by suppressing yellowing of the inner wall 5a of the white resin 4 by near-ultraviolet light emitted from the LED chip 10.

  In the above-described embodiments and modifications, the paint containing the phosphor is applied to the inner wall 5a. However, instead of application, the paint may be sprayed to the inner wall 5a using a spray or the like. .

The inner wall 5a made of the white resin 4 may be roughened by forming fine irregularities in advance. Since the inner wall 5a of the cavity 5 made of the white resin 4 is roughened in advance by various roughening methods such as a wet blasting method, fine irregularities are formed on the inner wall 5a, so that the phosphor is attached. When it is made to adhere, its adhesion improves.
When the inner wall 5a is roughened, in the process of manufacturing the lead frame 2, an insulating resin is embedded between the metal pad portion 7 and the lead portion 8 and the reflector portion 6 made of the white resin 4 is formed and cured. Then, the inner wall 5a of the white resin 4 may be roughened when the burrs of the insulating resin and the white resin 5 are removed by deburring. Alternatively, the surface roughening treatment may be performed independently in the step before attaching the phosphor to the inner wall 5a separately from the deburring step of the insulating resin and the white resin 4 in the step of manufacturing the lead frame 2.

DESCRIPTION OF SYMBOLS 1 LED package 2 Lead frame 3 Lead frame main body 4 White resin 5 Cavity 5a Inner wall 6 Reflector part 7 Pad part 8 Lead part 10 LED chip 12 Transparent sealing resin 13 Yellow fluorescent substance

Claims (10)

A reflector portion made of a white resin having a pad portion on which an LED chip is mounted, a lead portion that is electrically connected to the LED chip, and a concave cavity in which an inner wall is formed so as to surround the pad portion and the lead portion. In an LED package comprising:
An LED package, wherein phosphors are attached to an inner wall forming the cavity at a relatively large density, and a sealing resin in which the phosphor is dispersed at a relatively small density is filled in the cavity.   The LED package according to claim 1, wherein the inner wall is roughened by forming fine irregularities.   The LED package according to claim 1, wherein the phosphor is a yellow phosphor.   The LED package according to claim 1, wherein the phosphor is a red phosphor, a green phosphor, or a blue phosphor. A reflector portion made of a white resin having a pad portion on which an LED chip is mounted, a lead portion that is electrically connected to the LED chip, and a concave cavity in which an inner wall is formed so as to surround the pad portion and the lead portion. Forming a lead frame for an LED light emitting device comprising:
After attaching the phosphor with a relatively large density to the inner wall forming the cavity,
An LED package manufacturing method, wherein a sealing resin in which the phosphor is dispersed at a relatively small density is filled in the cavity.   6. The method of manufacturing an LED package according to claim 5, wherein the inner wall is roughened by forming fine irregularities in advance.   The LED package manufacturing method according to claim 5 or 6, wherein a coating liquid containing the phosphor is applied to an inner wall of the cavity.   The method for manufacturing an LED package according to claim 5 or 6, wherein a coating liquid containing the phosphor is sprayed on an inner wall of the cavity.   9. The method of manufacturing an LED package according to claim 5, wherein light emitted from the LED chip is blue light, and the phosphor is a yellow phosphor. 10.   9. The method of manufacturing an LED package according to claim 5, wherein light emitted from the LED chip is near-ultraviolet light, and the phosphor is a red phosphor, a green phosphor, or a blue phosphor. .

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