TWI478396B - Light emitting diode and method for manufacturing the same - Google Patents

Description

Light-emitting diode and packaging method thereof

The invention relates to a semiconductor and a packaging method thereof, in particular to a light emitting diode and a packaging method thereof.

Light Emitting Diode (LED) is a semiconductor component that converts current into light of a specific wavelength range. It has been widely used in current applications due to its high luminous efficiency, small size, light weight, and environmental protection. Among the various fields. Before applying the light-emitting diode to the above various fields, it is necessary to package the light-emitting diode wafer to protect the light-emitting diode wafer.

When the package is packaged in the industry, the pin structure is electrically connected to the LED. The lead structure includes a first electrode and a second electrode. The first electrode and the second electrode are generally arranged in a regular rectangular parallelepiped shape and spaced apart from each other to form a gap, when a part of the light emitted by the light is reflected to the gap of the lead structure. The light exits from the light emitting diode in the light-emitting direction of the light-emitting diode, causing light leakage of the light-emitting diode and affecting the light-emitting amount of the light-emitting diode. Therefore, further improvement is needed.

The present invention aims to provide a light-emitting diode having high light-emitting efficiency and a packaging method thereof.

A light emitting diode comprising a lead structure and a light emitting element, and an encapsulation layer overlying the light emitting element, the pin structure comprising a first electrode and a second electrode spaced apart from each other The light-emitting element is electrically connected to the first electrode and the second electrode, respectively, the end faces of the first and second electrodes adjacent to each other are inclined end faces, and the inclined end faces of the first electrodes are disposed on the second electrode The first electrode includes a body portion and a protruding portion. The protruding portion protrudes from the one end of the body portion toward the second electrode, and the second electrode includes a wedge portion, and the protruding portion Located above the wedge portion and spaced apart to form a gap, the bottom surface of the protruding portion and the top surface of the wedge portion are respectively disposed opposite to each other as inclined end faces of the first and second electrodes, and the cross section of the protruding portion is trapezoidal The width is slightly smaller than the width of the body portion and gradually decreases from the body portion.

A method for packaging a light-emitting diode, comprising the steps of: providing a first electrode and a second electrode each having an inclined end surface, wherein the inclined end surface of the first electrode is disposed on an inclined end surface side of the second electrode, so that the first electrode The inclined end faces are spaced apart from the inclined end faces of the second electrodes and face each other, and the inclined end faces of the first electrodes are located above the inclined end faces of the second electrodes to constitute a pin structure, and the first electrode includes a body portion And a protruding portion protruding from one end of the body portion toward the second electrode, the second electrode includes a wedge portion, the protruding portion is located above the wedge portion and spaced apart to form a gap, the protruding portion The bottom surface of the portion and the top surface of the wedge portion are respectively disposed opposite to each other as inclined end faces of the first and second electrodes, and the protruding portion has a trapezoidal cross section, and the width thereof is slightly smaller than the width of the body portion, and is from the body The portion is gradually reduced; a light-emitting element is electrically connected to the two electrodes; and an encapsulation layer covers the light-emitting element.

Compared with the prior art, in the present invention, the first electrode includes a protruding portion, and the second electrode includes a wedge portion, and the protruding portion is located on the wedge portion and is spaced apart to form a gap. The extending direction of the gap forms a non-zero angle with the light emitting direction of the light emitting element. That is, the end faces of the first electrode adjacent to the second electrode are inclined end faces, and the inclined end faces of the first electrodes are disposed above the inclined end faces of the second electrodes, so that the inclined end faces and the light emitting elements emit light. When the light-emitting diode is in operation, light rays partially reflected to the lead structure are hard to pass through the gap to cause light leakage, thereby improving the light-emitting efficiency of the light-emitting diode.

The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings.

100‧‧‧Lighting diode

10‧‧‧ pin structure

20‧‧‧Reflection Cup

30‧‧‧Lighting elements

40‧‧‧Encapsulation layer

11‧‧‧First electrode

12‧‧‧Second electrode

13‧‧‧ first surface

14‧‧‧ second surface

111‧‧‧ Body Department

112‧‧‧Stretching

113, 122‧‧‧ end face

121‧‧‧Wedge

15‧‧‧ gap

50‧‧‧Substrate

21‧‧‧ upper surface

22‧‧‧ Lower surface

23‧‧‧ dent

60‧‧‧Mold

61‧‧‧Top mold

62‧‧‧Bottom mode

63‧‧‧ cavity

611‧‧‧ top board

612‧‧‧Resistance

613‧‧‧ Positioning Department

614‧‧‧ flow path

1 is a schematic cross-sectional view of a light emitting diode according to an embodiment of the present invention.

2 is a top plan view of the light emitting diode of FIG. 1.

FIG. 3 to FIG. 6 are schematic diagrams showing steps of a method for packaging a light emitting diode according to an embodiment of the invention.

Hereinafter, the light-emitting diode 100 of the present invention will be further described in detail with reference to the accompanying drawings.

Referring to FIG. 1 and FIG. 2, a light-emitting diode 100 of a preferred embodiment of the present invention includes a lead structure 10, a reflective cup 20 disposed on the lead structure 10, and a light-emitting element 30, and covering the same The encapsulation layer 40 of the light emitting element 30.

Specifically, referring to FIG. 3 , the lead structure 10 includes a first electrode 11 and a second electrode 12 spaced apart from each other, and each of the electrodes 11 , 12 includes a first surface 13 and a second surface opposite to the first surface 13 . Surface 14. The first electrode 11 includes a body portion 111 and a protruding portion 112 extending from the first body portion 111 toward the second electrode 12, and the body portion 111 has a regular rectangular parallelepiped shape. The protruding portion 112 has a trapezoidal cross section. The width of the main portion 111 is slightly smaller than the width of the main body portion 111 and gradually decreases from the main body portion 111. The longitudinal section of the protruding portion 112 has an inverted right-angled triangular shape, that is, the first electrode 11 is on the first surface 13. The length is greater than the length on the second surface 14, and the end surface 113 of the protruding portion 112 on the side close to the second electrode 12 is a slope. The second electrode 12 has a trapezoidal shape in a cross section, and a side of the second electrode 12 adjacent to the first electrode 11 includes a wedge portion 121. The longitudinal portion of the wedge portion 121 has a right-angled triangular shape, that is, the second electrode. The length on the second surface 14 is greater than the length on the first surface 13. The end surface 122 of the wedge portion 121 adjacent to the side of the first electrode 11 is also a slope.

The protruding portion 112 is located above the wedge portion 121. The end surface of the protruding portion 112 and the end surface of the wedge portion 121 are opposite each other with a gap 15 therebetween. The gap 15 is filled with a fluid material. The substrate 50 is formed. In this embodiment, the end surface of the protruding portion 112 adjacent to the second electrode 12 and the end surface of the wedge portion 121 adjacent to the first electrode 11 are parallel to each other. It can be understood that the end surface of the protruding portion 112 adjacent to the second electrode 12 and the end surface of the wedge portion 121 adjacent to the first electrode 11 may not be parallel to each other, and only the two electrodes 11 and 12 are spaced apart from each other.

The reflective cup 20 is formed on the lead structure 10. The reflective cup 20 includes an upper surface 21 and a lower surface 22. The inner surface of the reflective cup 20 can be formed with a highly reflective material, and the reflective cup 20 and the lead The structure 10 and the substrate 50 between the two electrodes 11, 12 are collectively formed to define a recess 23 having a top size larger than the bottom dimension thereof.

The light-emitting element 30 is disposed on the first electrode 11 and located on the protruding portion 112 of the first electrode 11. The two electrodes of the light-emitting element 30 are electrically connected to the first electrode 11 and the second electrode 12, respectively. In this embodiment, the light-emitting element 30 is a light-emitting diode die, and the electrodes on both sides are electrically connected by wire bonding. Since the light-emitting element 30 is located on the protrusion 112 extending in the direction of the second electrode 12, the light-emitting element is caused The member 30 is closer to the second electrode 12, thereby reducing the wire-traveling distance and reducing the lateral dimension of the entire light-emitting diode 100. In addition, the protrusion 112 extending in the direction of the second electrode 12 can increase the area of the first electrode 11 on the first surface 13 so that the first electrode 11 can carry the large-sized light-emitting element 30, which satisfies high-power illumination. demand.

The encapsulation layer 40 is disposed on the light emitting element 30 and filled in the recess 23, and an end surface of the top of the encapsulation layer 40 is flush with the upper surface 21 of the reflective cup 20. The encapsulation layer 40 may be a transparent colloid doped with phosphor powder, and the phosphor powder may be garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based phosphor powder, sulfide-based phosphoric acid. One or more of a light powder, a thiogallate-based phosphor, an oxynitride-based phosphor, and a nitride-based phosphor.

Hereinafter, the light-emitting diode of the embodiment of the present invention is taken as an example, and the manufacturing process of the light-emitting diode 100 is described with reference to FIG. 1. The light-emitting diode 100 of the present invention is formed by injection molding.

The first step: providing a lead structure 10 comprising a first electrode 11 and a second electrode 12 spaced apart from each other, each electrode 11, 12 comprising a first surface 13 and opposite the first surface 13 The second surface 14.

Specifically, the first electrode 11 includes a body portion 111 and a protruding portion 112 extending from the first body portion 111 toward the second electrode 12, and the body portion 111 has a regular rectangular parallelepiped shape. The width of the protruding portion 112 is slightly smaller than the width of the main body portion 111. The cross-section of the protruding portion 112 has an inverted right-angled triangular shape, that is, the length of the first electrode 11 on the first surface 13 is greater than The length of the two surfaces 14 is such that the end surface 113 of the protruding portion 112 on the side close to the second electrode 12 is a slope. The cross section of the second electrode 12 is a trapezoidal shape, and the side of the second electrode 12 adjacent to the first electrode 11 includes a wedge portion 121 having a right-angled triangular cross section. The length of the second electrode 12 on the second surface 14 is greater than the length on the first surface 13. The end surface 122 of the wedge portion 121 adjacent to the first electrode 11 is also a slope.

The protruding portion 112 is located above the wedge portion 121. The end surface 113 between the end surface 113 of the protruding portion 112 and the end portion 122 between the wedge portions 121 are opposite to each other with a gap 15 therebetween. In this embodiment, the end surface of the protruding portion 112 adjacent to the second electrode 12 and the end surface of the wedge portion 121 adjacent to the first electrode 11 are parallel to each other. It can be understood that the end surface 113 of the protruding portion 112 adjacent to the second electrode 12 and the end surface 122 of the wedge portion 121 adjacent to the first electrode 11 may not be parallel to each other, and only the two electrodes 11 and 12 are spaced apart from each other.

Second step: Referring to FIG. 3, a mold 60 is provided to form a cavity 63 between the mold 60 and the lead structure 10. The mold 60 includes a bottom mold 62 and a top mold 61. The top of the bottom mold 62 is a flat surface for abutting the second surface 14 of the lead structure 10 to carry the lead structure 10. The top mold 61 abuts the first surface 13 of the lead structure 10 and forms a cavity 63 with the upper surface of the lead structure 10 for subsequent injection molding to form the reflective cup 20.

The top mold 61 includes a top plate 611, a resisting portion 612 protruding from the periphery of the top plate 611 toward the bottom mold 62, and a positioning portion 613 protruding from the center of the top plate 611 toward the bottom mold 62. Specifically, the outer surface of the top plate 611 is a smooth plane. The abutting portion 612 defines an annular side wall at the periphery of the top plate 611, and is integrally formed with the top plate 611 and protrudes from the lower surface edge of the top plate 611 toward the bottom mold 62. The middle portion of the resisting portion 612 is perforated to form a flow path. 614, for subsequent injection molding fluid material, in the embodiment, the number of the flow channels 614 is two. The positioning portion 613 extends from the middle of the lower surface of the top plate 611 toward the bottom mold 62, and is spaced apart from the resist portion 612. The peripheral dimension of the positioning portion 613 gradually decreases from the top plate 611 toward the bottom mold 62, and the lower surface of the positioning portion 613 is flush with the lower surface of the resist portion 612.

Third Step: Referring to Figure 4, a fluid material is injected into the cavity 63 and the fluid material is solidified to form a reflector cup 20 structure. Specifically, the bottom mold 62 and the top mold 61 are disposed between the lead structures 10, that is, the top of the bottom mold 62 is attached to the second surface 14 of the lead structure 10, and the positioning portion of the top mold 61 is disposed. 613 is attached to the first surface 13 of the lead structure 10 and covers the gap 15 . The resisting portion 612 surrounds the positioning portion 613 and is attached to the first surface 13 of the lead structure 10 , that is, the The positioning portion 613, the resisting portion 612 and the lead structure 10 enclose an annular cavity 63 for subsequently filling the plastic fluid material. The fluid material fills the cavity 63 and solidifies to form the reflective cup 20. Fluid material is injected into the cavity 63 along the flow path, and at the same time, the fluid material can flow through the first surface 13 of the lead structure 10 into the gap 15 between the first electrode 11 and the second electrode 12, and the cavity is located in the cavity The fluid material within 63 subsequently forms a reflective cup 20, and the fluid material located in the gap 15 subsequently forms the substrate 50. The fluid material can be an epoxy resin, a enamel resin or other polymeric material.

Fourth step: Referring to FIG. 5, the mold 60 is removed, a light-emitting element 30 is disposed on the lead structure 10, and the light-emitting element 30 is electrically connected to the two electrodes 11, 12; the pin structure 10 is disposed on the lead structure 10. A light-emitting element 30 is disposed on the protruding portion 112 of the first electrode 11. Specifically, the residual burrs on the surfaces of the first electrode 11 and the second electrode 12 are removed first to ensure the conductivity of the surface of the lead structure 10, and then the light-emitting element 30 and the first electrode 11 and the first electrode are connected by wire bonding. The two electrodes 12 form an electrical connection.

Fifth Step: Referring to FIG. 6, an encapsulation layer 40 is formed over the reflective cup 20 to cover the light emitting element 30. Specifically, an encapsulation layer 40 is covered on the light emitting element 30. The encapsulation layer 40 fills the reflective cup 20 and is flush with the upper surface 21 of the reflective cup 20. The encapsulation layer 40 is made of a transparent material, which may be made of tantalum resin or other resin, or other mixed materials. The encapsulation layer 40 may further contain phosphor powder according to the light-emitting element 30 and the light-emitting requirements. The phosphor powder comprises garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based phosphor powder, sulfide-based phosphor powder, thiogallate-based phosphor powder, and oxynitride group. One or more of phosphor powder and nitride-based phosphor powder.

Compared with the prior art, the first electrode 11 of the present invention includes a protruding portion 112, and the second electrode 12 includes a wedge portion 121. The protruding portion 112 is located on the wedge portion 121 and spaced apart to form a gap 15, that is, The end faces 113 and 122 adjacent to the first electrode 11 and the second electrode 12 are inclined end faces, and the inclined end faces 113 of the first electrodes 11 are disposed above the inclined end faces 122 of the second electrodes 12, thereby The inclined end faces 113, 122 are offset from the light-emitting direction of the light-emitting element 30. When the light-emitting diode 100 is in operation, the light that is directed toward the second surface 14 of the lead structure 10 via the gap 15 is tilted by the second electrode 12. The end face is blocked, so that the light cannot be smoothly emitted from the side of the second surface 14 to avoid the occurrence of light leakage, thereby improving the light-emitting efficiency of the light-emitting diode 100.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧Lighting diode

10‧‧‧ pin structure

20‧‧‧Reflection Cup

40‧‧‧Encapsulation layer

11‧‧‧First electrode

12‧‧‧Second electrode

13‧‧‧ first surface

14‧‧‧ second surface

111‧‧‧ Body Department

112‧‧‧Stretching

113, 122‧‧‧ end face

121‧‧‧Wedge

15‧‧‧ gap

50‧‧‧Substrate

21‧‧‧ upper surface

22‧‧‧ Lower surface

23‧‧‧ dent

Claims (8)

A light emitting diode comprising a lead structure and a light emitting element, and an encapsulation layer covering the light emitting element, the pin structure comprising first and second electrodes spaced apart from each other, the light emitting element and the first electrode And the second electrode is respectively electrically connected, and the improvement is that the end faces of the first and second electrodes adjacent to each other are inclined end faces, and the inclined end faces of the first electrodes are disposed above the inclined end faces of the second electrodes. The first electrode includes a body portion and a protrusion protruding from one end of the body portion toward the second electrode, and the second electrode includes a wedge portion, the protrusion portion is located above the wedge portion Forming a gap, the bottom surface of the protruding portion and the top surface of the wedge portion are respectively disposed opposite to each other as inclined end faces of the first and second electrodes, and the protruding portion has a trapezoidal cross section, and the width thereof is slightly smaller than the The width of the body portion gradually decreases from the body portion. The light-emitting diode according to claim 1, wherein the inclined end faces of the first and second electrodes are parallel to each other. The light-emitting diode according to claim 1, wherein the light-emitting element is provided on a protruding portion of the first electrode. The light emitting diode of claim 1, wherein the lead structure comprises a first surface and a second surface opposite to the first surface, the first electrode being on the first surface The length is greater than its length on the second surface, the length of the second electrode on the first surface being less than the length of the second electrode on the second surface. A method for packaging a light-emitting diode, comprising the steps of: providing a first electrode and a second electrode each having an inclined end surface, wherein the inclined end surface of the first electrode is disposed on an inclined end surface side of the second electrode, so that the first electrode The inclined end faces are spaced apart from the inclined end faces of the second electrodes and face each other, and the inclined end faces of the first electrodes are located at the second electric The first electrode includes a body portion and a protruding portion, and the protruding portion protrudes from the one end of the body portion toward the second electrode, the second electrode includes a wedge portion, the protrusion portion is located above the wedge portion and spaced apart to form a gap, and a bottom surface of the protrusion portion and a top surface of the wedge portion are disposed opposite to each other as inclined end faces of the first and second electrodes, respectively The protruding portion has a trapezoidal cross section with a width slightly smaller than the width of the body portion and gradually decreases from the body portion; a light emitting element is electrically connected to the two electrodes; and an encapsulation layer covers the light emitting element. The light emitting diode packaging method according to claim 5, wherein an end surface of the second electrode is disposed in parallel with an inclined end surface of the first electrode. The method of claim 2, further comprising providing a mold to form a cavity between the mold and the lead structure, injecting a fluid material into the cavity and curing the fluid material. Reflective cup structure. The method of claim 2, wherein the step of injecting a fluid material into the cavity and curing the fluid material to form a reflective cup structure is performed to the first and second electrodes The fluid material is injected at intervals between the inclined end faces to form a substrate between the first and second electrodes.